KR101681903B1 - Microphone package - Google Patents

Microphone package Download PDF

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Publication number
KR101681903B1
KR101681903B1 KR1020150094761A KR20150094761A KR101681903B1 KR 101681903 B1 KR101681903 B1 KR 101681903B1 KR 1020150094761 A KR1020150094761 A KR 1020150094761A KR 20150094761 A KR20150094761 A KR 20150094761A KR 101681903 B1 KR101681903 B1 KR 101681903B1
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KR
South Korea
Prior art keywords
base substrate
coupling member
acoustic
transducer
present
Prior art date
Application number
KR1020150094761A
Other languages
Korean (ko)
Inventor
김재명
박두영
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Priority to KR1020150094761A priority Critical patent/KR101681903B1/en
Priority to PCT/KR2015/006906 priority patent/WO2017002997A1/en
Application granted granted Critical
Publication of KR101681903B1 publication Critical patent/KR101681903B1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

Disclosed is a microphone package. According to the present invention, the microphone package includes: a base substrate having a sound hole formed therein; a transducer located to cover at least a portion of the sound hole on the upper surface of the base substrate; a cover coupled to the base substrate to form an internal space in which the transducer is accommodated; and a coupled member coupled at the edge of the lower surface of the base substrate.

Description

Microphone package {MICROPHONE PACKAGE}

The present invention relates to a microphone package, and more particularly, to a microphone package for converting an acoustic signal into an electrical signal.

Microphone packages are installed in various electronic devices such as smart phones and tablet computers. In recent years, such electronic devices are becoming smaller and thinner. As a result, various components mounted on the microphone and the like are also becoming smaller.

The microphone package is a structure in which a housing has an internal space and a transducer is accommodated in the internal space for converting an acoustic signal into an electric signal. The acoustic signal is introduced into the space inside the housing through the acoustic hole of the housing. The incoming acoustic signal causes the diaphragm of the transducer to vibrate, and the transducer senses such vibration and generates an electrical signal.

In order for the diaphragm of the transducer to vibrate smoothly, a back-chamber space of a certain size needs to be provided. The back-chamber space means a space in which a sound signal flows in the transducer and a space in the opposite direction separated by the diaphragm. Some conventional microphone packages employ a structure in which the transducer covers the acoustic hole to maximize the back-chamber space. U.S. Patent No. 8,358,004 (registered Jan. 22, 2013) discloses a microphone package of this structure.

A problem to be solved by the present invention is to provide a microphone package capable of improving acoustic characteristics of a microphone.

Another object to be solved by the present invention is to provide a microphone package of a configuration that can facilitate mounting of a microphone on an electronic device.

Another object of the present invention is to provide a microphone package that can minimize the damage of a transducer when mounting a microphone on an electronic device.

According to an aspect of the present invention, there is provided a microphone package including: a base substrate having acoustic holes; a transducer positioned to cover at least a part of the acoustic holes in the upper surface of the base substrate; And an engaging member coupled to an edge of the lower surface of the base substrate.

In an embodiment of the present invention, the engaging member may form a closed curve on a lower surface of the base substrate.

In one embodiment of the present invention, at least one input / output terminal may be formed in the closed curve of the lower surface of the base substrate.

In an embodiment of the present invention, the coupling member may be formed of a solder.

In one embodiment of the present invention, the acoustic holes may be formed of a plurality of micro holes.

In one embodiment of the present invention, the fine holes may have a diameter of 25 mu m to 100 mu m.

In one embodiment of the present invention, the portion of the base substrate where the fine holes are formed may be formed to be thinner than other portions of the peripheral portion.

In one embodiment of the present invention, the mounting substrate may further include a mounting substrate coupled to the base substrate by the coupling member and having an inlet hole at a position facing the acoustic hole.

In an embodiment of the present invention, a space between the base substrate and the mounting substrate may be sealed by the coupling member.

In an embodiment of the present invention, the coupling member may transmit an electric signal or electric power between the base substrate and the mounting substrate.

In an embodiment of the present invention, the coupling member may be electrically connected to a ground terminal formed on the mounting substrate.

In one embodiment of the present invention, the inflow hole may be formed of a plurality of fine holes.

The microphone package according to one embodiment of the present invention can improve the acoustic characteristics of the microphone.

In addition, the microphone package according to an embodiment of the present invention can facilitate mounting of a microphone to an electronic device.

In addition, the microphone package according to the embodiment of the present invention can minimize the damage of the transducer when the microphone is mounted on the electronic device.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.
2 is a bottom view of a bottom surface of a base substrate in a state where a coupling member of a microphone package according to an embodiment of the present invention is coupled.
3 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
4 is a cross-sectional view of a microphone package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that adding a detailed description of a technique or a configuration already known in the field can make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a microphone package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.

Referring to FIG. 1, a microphone package of the present invention includes a base substrate 100, a transducer 200, and a cover 300.

The base substrate 100 is formed in a flat plate shape. The base substrate 100 may have a rectangular shape in top and bottom. Terminals 101 and 102 may be formed on the upper surface and the lower surface of the base substrate 100, respectively. The terminal 101 on the upper surface of the base substrate 100 is connected to the transducer 200 and / or the ASIC 250 mounted on the upper surface of the base substrate 100 to transmit electric signals or supply power. The terminal 102 on the lower surface of the base substrate 100 may be an input / output terminal connected to the mounting substrate 400 to transmit an electric signal or supply power. The terminals 101 on the upper surface of the base substrate 100 and the terminals 102 on the lower surface may be electrically connected to each other by via holes (not shown) passing through the base substrate 100. In the base substrate 100, the base substrate 100 may be formed of a printed circuit board (PCB).

An acoustic hole 110 is formed in the base substrate 100. The acoustic holes 110 are formed to penetrate the upper surface and the lower surface of the base substrate 100. An external acoustic signal can be introduced into the interior of the microphone package through the acoustic hole 110.

A transducer (200) is an element that receives an acoustic signal and converts it into an electrical signal. The transducer 200 may be, but is not limited to, an electret transducer, a MEMS transducer, or a piezoelectric transducer. The transducer 200 is mounted on the terminal 101 on the upper surface of the base substrate 100 and is electrically connected.

A transducer (200) is formed around the acoustic hole (110) of the base substrate (100). Specifically, the transducer 200 is positioned above the acoustic hole 110 of the base substrate 100 and is positioned to cover at least a part of the acoustic hole 110. The upper surface terminal 101 of the base substrate 100 connected to the lower terminal of the transducer 200 may be formed around the acoustic hole 110. [

The transducer 200 may cover the acoustic hole 110 completely. The inner space S surrounded by the base substrate 100 and the cover 300 may be formed as a space separated from the outside of the acoustic hole 110 as the transducer 200 completely covers the acoustic hole 110 have. The divided space S is divided by the external space and the transducer 200. The separated space S may be referred to as a back chamber.

Other elements such as the ASICs 250 and 250 may be mounted on the inner space S in addition to the transducer 200.

The cover 300 is coupled with the base substrate 100 to form an inner space S. The cover 300 may include a top surface portion and a side surface portion. The upper surface portion is disposed so as to face the upper surface of the base substrate 100 in a spaced apart relationship, and the side surface portion extends downward from the outer surface of the upper surface portion to connect the upper surface portion to the base substrate 100. A flange portion that abuts and engages with the base substrate 100 may be formed at the lower end of the side portion. The upper surface portion and the side surface portion may be integrally formed, or may be separately formed and then joined.

The cover 300 may be formed of a metal material. The cover 300 may be formed of, for example, one or a combination of two or more materials selected from brass, bronze or phosphor bronze.

The microphone package including the base substrate 100, the transducer 200, and the cover 300 is mounted on the mounting substrate 400. The mounting substrate 400 is coupled to the base substrate 100 and the lower surface. The mounting substrate 400 may be a substrate of an electronic device on which the microphone package is mounted. The mounting substrate 400 may be formed to have a size larger than that of the base substrate 100. The mounting substrate 400 is formed in a flat plate shape like the base substrate 100.

The mounting substrate 400 has an inlet hole 410 formed therein. The inlet hole 410 is formed at a position opposite to the acoustic hole 110 when the microphone package is mounted on the mounting substrate 400. The inlet hole 410 is preferably formed to be the same or similar in shape and size to the acoustic hole 110. When the acoustic holes 110 and the inlet holes 410 are opposed to each other, an acoustic signal passes through the inlet hole 410 and the acoustic hole 110 and flows into the internal space below the mounting substrate 400.

The base substrate 100 and the mounting substrate 400 are coupled by the coupling member 500. The joining member 500 is positioned between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 to couple the two.

Referring to FIG. 2, the coupling member 500 is coupled to the lower surface of the base substrate 100. FIG. 2 is a bottom view of a bottom surface of a base substrate 100 in a state where a coupling member 500 of a microphone package according to an embodiment of the present invention is engaged. Referring to FIG. 2, the engaging member 500 is engaged with a rim portion of the lower surface of the base substrate 100. The coupling member 500 and the acoustic hole 110 may be spaced apart by a predetermined distance as the coupling member 500 is coupled to the bottom of the bottom surface of the base substrate 100. A gap G corresponding to the thickness of the coupling member 500 may be formed between the acoustic hole 110 of the base substrate 100 and the inlet hole 410 of the mounting substrate 400.

The coupling member 500 forms a closed curve on the lower surface of the base substrate 100 to form a closed region surrounded by the coupling member 500. And the input / output terminal 102 is located in the closed space on the lower surface of the base substrate 100. Therefore, damage of the input / output terminal 102 due to penetration of foreign objects or the like after the microphone package is mounted on the mounting board 400 can be suppressed to the utmost.

Referring again to FIG. 1, the coupling member 500 seals the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400. Specifically, a gap between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 is sealed by the engaging member 500 and air can not flow thereinto. Accordingly, the space between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 is communicated to other portions only by the inlet holes 410 and the acoustic holes 110, and the remaining portions are formed as sealed spaces. The acoustic signal flowing through the inlet hole 410 at the lower side of the mounting substrate 400 may pass through the sealed space before proceeding to the acoustic hole 110 of the base substrate 100. [ The frequency characteristics of the acoustic signal can be changed by changing the shape and volume of the sealed space. Thus, the characteristic of the acoustic signal received by the transducer 200 can be changed. By controlling such changes, the reception sensitivity and acoustic characteristics of the microphone can be adjusted.

The joining member 500 may be formed of a solder. The coupling member 500 may be formed as the microphone package is mounted on the mounting substrate 400 by Surface Mount Technology (SMT). The joining member 500 can be melted in the process of forming and flux may be generated. By this, the coupling member 500 can damage the periphery. The lower surface of the base substrate 100 around the joining member 500 and the upper surface of the mounting substrate 400 are less likely to be damaged by heat or the like. However, in the case of the transducer 200, such heat may be damaged. For example, the flux generated while forming the coupling member 500 may flow through the acoustic hole 110 to damage the transducer 200. In the present invention, the coupling member 500 is formed at the edge of the lower surface of the base substrate 100 and is spaced from the acoustic hole 110 as much as possible. Therefore, damage to the transducer 200 due to flux or the like can be suppressed.

The joining member 500 may be formed of a metal such as tin, copper, or aluminum as well as lead. In some cases, the coupling member 500 may be formed of a curable resin material.

The coupling member 500 may electrically connect the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400, as the case may be. The electrodes 510 and 520 may be formed on the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 to which the coupling member 500 is coupled. The coupling member 500 may be formed of a conductive material and may be coupled to the electrodes 510 and 520 to electrically connect the electrodes 510 and 520. In some cases, the coupling member 500 can transfer electrical signals or electric power between the base substrate 100 and the mounting substrate 400. The coupling member 500 may be electrically connected to the ground terminal formed on the mounting substrate 400 and connected to the base substrate 100.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIG.

In describing the present embodiment, description will be made mainly on the points different from the above-described embodiment with reference to Figs. 1 and 2. Fig.

3 is a cross-sectional view of a microphone package according to another embodiment of the present invention.

Referring to FIG. 3, the acoustic holes 110 of the base substrate 100 are formed of a plurality of fine holes 111. It is preferable that the fine holes 111 are densely formed in one portion of the base substrate 100. The fine holes 111 may have a diameter of 25 mu m to 100 mu m.

The portion of the base substrate 100 in which the fine holes 111 are densely formed may be formed as a thin portion 120 having a thickness thinner than other portions of the peripheral portion. A step may be formed at a boundary portion between the thin portion 120 and other peripheral portions. The stepped portion may be formed on at least one of the upper surface and the lower surface of the base substrate 100. The fine holes 111 may be formed by laser drilling or punching. If the fine holes 111 are formed in the thin portion 120, it may be relatively easy to form the fine holes 111.

The frequency characteristic of the acoustic signal passing through the acoustic hole 110 by the fine holes 111 can be changed. Specifically, the frequency characteristics of the acoustic signal can be changed by the diameter, shape or number of the fine holes 111 and the like. Therefore, the designer can adjust the characteristics of the fine holes 111 to tune the acoustic characteristics of the microphone.

In addition, the inside of the microphone can be protected by the fine holes 111. In particular, the acoustic holes 110 in which the plurality of microholes 111 are formed may be less likely to infiltrate foreign matter, dust, moisture, etc. from the outside than a structure in which one relatively large opening is formed. Accordingly, the inner space of the microphone package can be protected.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIG.

In describing the present embodiment, description will be made mainly on the points different from the above-described embodiment with reference to Figs. 1 and 2. Fig.

4 is a cross-sectional view of a microphone package according to another embodiment of the present invention.

Referring to FIG. 4, the inlet hole 410 of the mounting substrate 400 is formed of a plurality of fine holes 411. It is preferable that the fine holes 411 are densely formed in one portion of the mounting substrate 400. The fine holes may have a diameter of 25 mu m to 100 mu m.

The portion where the fine holes 411 are densely formed in the mounting substrate 400 may be formed as a thin portion 420 having a thickness thinner than other portions of the peripheral portion. A step may be formed at a boundary portion between the thin portion 420 and other peripheral portions. The stepped portion may be formed on at least one of the upper surface and the lower surface of the mounting substrate 400. The fine holes 411 may be formed by laser drilling or punching. If the fine holes 411 are formed in the thin portion 120, it may be relatively easy to form the fine holes 411.

The frequency characteristic of the acoustic signal passing through the acoustic hole 110 by the fine holes 411 can be changed. Specifically, the frequency characteristics of the acoustic signal can be changed by the diameter, the shape or the number of the fine holes 411, and the like. Accordingly, the designer can adjust the characteristics of the fine holes 411 to tune the acoustic characteristics of the microphone.

Further, the inside of the microphone can be protected by the fine holes 411. Specifically, the inflow hole 410 in which the plurality of fine holes 411 are formed may be less likely to infiltrate foreign matter, dust, moisture, etc. from the outside than a structure in which one relatively large opening is formed. Accordingly, the inner space of the microphone package can be protected.

The embodiments of the microphone package of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: base substrate 110: acoustic hole
200: Transducer 250: ASIC
300: cover 400: mounted substrate
410: inlet hole 500: coupling member

Claims (12)

A base substrate on which acoustic holes are formed;
A transducer positioned to cover at least a portion of the acoustic hole in an upper surface of the base substrate;
A cover coupled to the base substrate to define an inner space for receiving the transducer;
An engaging member coupled to an edge of a bottom surface of the base substrate; And
And a mounting board coupled to the base substrate by the coupling member and having an inlet hole formed at a position facing the acoustic hole, the inlet hole being formed by a plurality of microholes.
The method according to claim 1,
Wherein the coupling member forms a closed curve on a lower surface of the base substrate. 3. The method of claim 2,
And at least one input / output terminal is formed inside the closed curve of the lower surface of the base substrate. The method according to claim 1,
Wherein the coupling member is formed of a solder. The method according to claim 1,
Wherein the acoustic holes are formed by a plurality of micro holes. 6. The method of claim 5,
Wherein the microhole has a diameter of 25 mu m to 100 mu m. 6. The method of claim 5,
Wherein a portion of the base substrate where the microholes are formed is formed to be thinner than other portions of the base substrate. delete The method according to claim 1,
And between the base substrate and the mounting substrate is sealed by the coupling member. The method according to claim 1,
Wherein the coupling member transfers electrical signals or power between the base substrate and the mounting substrate. The method according to claim 1,
Wherein the coupling member is electrically connected to a ground terminal formed on the mounting board.

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KR1020150094761A 2015-07-02 2015-07-02 Microphone package KR101681903B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150094761A KR101681903B1 (en) 2015-07-02 2015-07-02 Microphone package
PCT/KR2015/006906 WO2017002997A1 (en) 2015-07-02 2015-07-06 Microphone package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150094761A KR101681903B1 (en) 2015-07-02 2015-07-02 Microphone package

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020160084186A Division KR101731041B1 (en) 2016-07-04 2016-07-04 Microphone package

Publications (1)

Publication Number Publication Date
KR101681903B1 true KR101681903B1 (en) 2016-12-02

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Family Applications (1)

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KR1020150094761A KR101681903B1 (en) 2015-07-02 2015-07-02 Microphone package

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WO (1) WO2017002997A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007060285A (en) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd Silicon microphone package
US20140008740A1 (en) * 2010-12-30 2014-01-09 Zhe Wang Mems microphone and method for packaging the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005086535A1 (en) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Electret capacitor microphone
EP2252077B1 (en) * 2009-05-11 2012-07-11 STMicroelectronics Srl Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
US8804982B2 (en) * 2011-04-02 2014-08-12 Harman International Industries, Inc. Dual cell MEMS assembly
US8625832B2 (en) * 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
US9521499B2 (en) * 2013-06-26 2016-12-13 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007060285A (en) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd Silicon microphone package
US20140008740A1 (en) * 2010-12-30 2014-01-09 Zhe Wang Mems microphone and method for packaging the same

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WO2017002997A1 (en) 2017-01-05

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