WO2018000798A1 - Poudre de résine époxy magnétique thermodurcissable et procédé d'encapsulation d'un inducteur utilisant celle-ci - Google Patents

Poudre de résine époxy magnétique thermodurcissable et procédé d'encapsulation d'un inducteur utilisant celle-ci Download PDF

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Publication number
WO2018000798A1
WO2018000798A1 PCT/CN2017/000391 CN2017000391W WO2018000798A1 WO 2018000798 A1 WO2018000798 A1 WO 2018000798A1 CN 2017000391 W CN2017000391 W CN 2017000391W WO 2018000798 A1 WO2018000798 A1 WO 2018000798A1
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WO
WIPO (PCT)
Prior art keywords
powder
magnetic
epoxy resin
thermosetting
epoxy
Prior art date
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PCT/CN2017/000391
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English (en)
Chinese (zh)
Inventor
王强
Original Assignee
王强
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Filing date
Publication date
Application filed by 王强 filed Critical 王强
Publication of WO2018000798A1 publication Critical patent/WO2018000798A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • C09D5/033—Powdery paints characterised by the additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005—Impregnating or encapsulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Definitions

  • the invention relates to a method for preparing a thermosetting magnetic epoxy resin powder and encapsulating the same.
  • the traditional production method is to use a single-component black rubber for such high-inductance-type I-inductors, and the solder joints are wrapped and dried to form a hard solder joint coating, so that during the 90-degree bending process There will be no problem of broken wires.
  • these type of inductors use a PE heat-shrinkable sleeve to encapsulate the core body. The function is single and the process is complicated, especially the epoxy glue used in the production process. If it is accidentally caught, it should be cleaned with a chemical solvent. .
  • I-shaped inductors there are two different encapsulating coatings in the field of I-shaped inductors.
  • One is solvent-based epoxy powder coating. These epoxy resin powder coatings require inductors to encapsulate epoxy resin powder before encapsulation. Mix and dissolve before encapsulation.
  • the other is a vertical I-shaped inductor that is packaged with a color ring inductor paint on behalf of a domestic manufacturer. Although the paint has high hardness after drying, the fluidity before drying is poor. If the paint is thin, the core cannot be enclosed, and copper leakage and magnetic leakage may occur. If the paint concentration is large, there are pores and uneven coating.
  • the Chinese patent with the patent number 201310289451.7 introduces a magnetic epoxy resin powder solvent. After baking with the magnetic epoxy resin powder solvent, the coating has electromagnetic shielding function and the cost is relatively high. Low, but this epoxy resin powder requires a solvent to dissolve the curing agent in the epoxy resin powder, and then it can be packaged after being left for more than 12 hours until the curing agent is sufficiently dissolved.
  • the solvent prepared therein, if not used for a long time, the organic chemical solvent will volatilize and it is easy to dry and solidify and waste. And The hardness of the coating after drying is relatively low. In the case where the copper wire diameter is less than 0.15 mm in the high inductance value, the wire breakage problem cannot be avoided when the inductor is bent at 90 degrees 'L'.
  • the problem to be solved by the invention is that the high inductance value of the thin copper wire of the I-shaped inductor is encapsulated by the magnetic epoxy resin, and the inductor pin and the magnetic core are 90 degree 'L'-shaped folding legs, because the packaging material is The hardness after drying is insufficient, and the problem of disconnection is still unavoidable.
  • the purpose is to provide a low-cost magnetic epoxy resin powder encapsulating material with electromagnetic shielding function and a method for packaging the same, thereby improving production. Efficiency, reduced material costs, reduced paint waste, and electromagnetic shielding after the coating is dried.
  • thermosetting magnetic epoxy resin powder coating characterized by comprising the following weight percentage materials: epoxy resin 30%-50%, soft ferrite magnetic powder 20%-50%, Composite curing agent 10%-20%, filler 5%-8%, additive 3%-8%;
  • thermosetting magnetic epoxy powder coating mixing epoxy resin, soft ferrite magnetic powder, composite curing agent, filler and auxiliary agent in a ratio, stirring uniformly with a stirring device, and then extruding Forming, forming a sheet of dry material, and then passing through the pulverization, and then sieving and grading to obtain a thermosetting epoxy resin powder coating;
  • thermosetting magnetic epoxy powder coating includes the following steps:
  • thermosetting magnetic epoxy resin powder (1) pour the prepared thermosetting magnetic epoxy resin powder into the fluidization tank, and adjust the pressure of the gas flow to a suitable size.
  • the magnetic powder in the tank is tumbling up and down under the blowing of the airflow, and tumbling.
  • the powder reaches a critical point until the roll height is uniform;
  • the wound wire-shaped inductor to be encapsulated is pre-wrapped, and the magnetic core is placed in the powder fluidization tank with the core facing downwards upward, and the depth is slightly higher than the position of the solder joint, and the powder is repeatedly dipped 2- Dip powder packaging completed 3 times;
  • the oven temperature is set to 120-150 ° C, baking for 1-3 hours, after baking and curing.
  • the braided inductive device is taken out from the oven, and after the coating is cooled, it becomes hard and shiny, and an inductive device packaged with a thermosetting magnetic epoxy powder is obtained to complete the encapsulation process of the thermosetting magnetic epoxy powder.
  • the epoxy resin is a mixture of either or both of bisphenol A and modified bisphenol A epoxy resin or an epoxy novolac type resin.
  • the soft ferrite magnetic powder is any one or a mixture of magnesium zinc ferrite, nickel zinc ferrite, and manganese zinc ferrite.
  • the soft ferrite magnetic powder is a magnetic powder obtained by water-grinding or ball-milling of the finished magnetic core, and after the magnetic powder is dried, the magnetic powder is re-pulverized, and the particles are less than 60 mesh.
  • the soft ferrite magnetic powder is a dry bulk magnetic powder directly fired by the soft ferrite oxide powder, and after being pulverized, it is filtered by a metal mesh, and the particles are less than 60 mesh.
  • the filler is a mixture of either or both of silica and aluminum hydroxide;
  • the composite curing agent is an acid anhydride curing agent or a polyester and an anionic catalytic curing agent;
  • the auxiliary agent is petroleum Resin and paraffin, or a mixture of any one or more of quartz powder, mica powder, and light calcium carbonate, the quartz powder can improve the hardness of the epoxy resin, and the mica powder can improve the insulation of the epoxy resin.
  • the fluidization device is a fluidized bed encapsulation machine dedicated to a fluidization tank or a heat curing powder.
  • the present invention has the following advantages:
  • thermosetting epoxy resin powder Due to the use of thermosetting epoxy resin powder, the formulation contains bisphenol A and modified bisphenol A epoxy resin, and silica and aluminum hydroxide are used as fillers, and then soft ferrite magnetic powder is added.
  • the packaged inductive coating can achieve a hardness of 92HBa or more, which is far from being achieved after the solvent drying of the magnetic epoxy resin.
  • the material waste is less, and the powder coating prepared after mixing can be stored for 3-6 months, far exceeding the storage time of the magnetic epoxy resin solvent.
  • thermosetting magnetic epoxy powder coating of the present invention is a uniform powder particle, which avoids the problem of unevenness in the fluidization tank due to the difference in density of the respective components at the time of coating.
  • the coating has high hardness.
  • the surface is shiny, which can effectively avoid the problem of wire breakage caused by the 90 degree 'L' type of folding foot.
  • the traditional high-inductance solder after the point of black rubber drying and then wearing the PE bushing although can effectively avoid the open circuit problem caused by the thin copper wire inductance at 90 degrees.
  • there is magnetic leakage in the work of the inductor which is easy to generate interference of radiation on other electronic parts and ICs.
  • the use of the heat-solid magnetic epoxy powder coating can effectively solve this problem, and the hardness of the coating after drying and curing can ensure the disconnection problem of the high inductance value thin wire at 90 degree folding foot, and at the same time,
  • the coating has an electromagnetic shielding function, which reduces the electromagnetic interference of the modified component to other parts during the energization operation.
  • the vertical I-shaped inductor of the color-coded inductor paint package is dried, the hardness of the paint is high.
  • the coating is uneven, and the coating is dry and has no electromagnetic shielding function. If you want to reduce the porosity, you must wrap the coil with a PE sleeve before packaging.
  • the vertical I-shaped inductor encapsulated by the thermosetting magnetic epoxy powder of the present invention has a hardness far exceeding the hardness of the color ring inductor paint after drying, and the packaging process is simple, the coating is uniform, and the powder has good fluidity. , can effectively avoid the problem of air holes caused by color ring inductance paint.
  • thermosetting magnetic epoxy resin powder can be reduced to 12-14 yuan/KG, and the coating cost is reduced by 40%-50%. If the thickness of the coating is increased to increase the inductance by 20-50%, the number of copper coils can be reduced, and the amount of copper wire for each inductor product can be reduced, which can reduce the cost.
  • the advantages of the present invention are obvious, and the problem of consistency in liquid coating is avoided.
  • the powder is driven by airflow, has good fluidity, is easy to be packaged, and does not stick; saving material cost, and the prepared paint is easy to store for a long time.
  • the production efficiency can be improved.
  • the epoxy powder of the inductor itself is directly melted and solidified, and does not flow; the uniformity of the coating can be maintained, the inductance value of the product is stabilized, and the error variation is small; the soft magnetic oxygen is added to the epoxy resin.
  • Body magnetic powder after the coating is dried, can increase the inductance value, so that the coating has electromagnetic shielding function, no magnetic leakage; increase current current anti-saturation.
  • the invention is primarily applicable to the improvement of packaging and packaging materials for vertical plug-in inductors.
  • thermosetting epoxy resin powder coating comprising the following materials: bisphenol A and bisphenol A modified epoxy resin 1 kg, nickel zinc ferrite magnetic powder 1 kg, composite curing agent 0.6 KG, filler 0.21 KG, auxiliary agent 0.2 KG, the weight percentage of each component is: 33.2%, 33.2%, 20%, 7%, 6.6%.
  • the nickel-zinc ferrite magnetic powder is prepared by directly pre-baking the nickel-zinc ferrite powder without firing, and the sintered nickel-zinc ferrite magnetic powder is in a loose shape. Powder, crushed according to actual conditions or Screening to obtain a nickel-zinc ferrite magnetic powder; the filler is a mixture of either or both of silica and aluminum hydroxide; the composite curing agent is an acid anhydride curing agent; Is a petroleum resin and paraffin;
  • thermosetting epoxy powder coating includes the following steps:
  • the wound wire-shaped inductor to be encapsulated is pre-wrapped, and the magnetic core is quickly placed into the powder fluidization tank with the downward facing pin facing upward, the immersion depth is slightly higher than the solder joint position, and the dip powder is repeatedly repeated.
  • - Dip powder package completed in 3 times.
  • thermosetting epoxy resin powder coating comprising the following materials: 1.2 kg of epoxy phenolic resin, 1 kg of manganese zinc ferrite magnetic powder, 0.6 kg of composite curing agent, 0.1 kg of filler, and 0.1 kg of auxiliary agent. The weight percentage of each component is: 40%, 33.3%, 20%, 3.3%, 3.3%.
  • the manganese-zinc ferrite magnetic powder is obtained by the following method: the magnetic powder containing the moisture of the magnetic core of the switching power supply transformer is dried in an oven, and is pulverized by a fine pulverizer to obtain a dried manganese-zinc ferrite magnetic powder.
  • the automatic sieve is filtered by a metal mesh machine with different meshes to filter the coarse particle components therein.
  • the magnetic powder particles are less than 100 mesh;
  • the filler is silica, aluminum hydroxide, quartz powder, a mixture of any one or more of mica powder;
  • the composite curing agent is a polyester and an anionic catalytic curing agent;
  • the auxiliary agent is a petroleum resin and a paraffin wax;
  • thermosetting epoxy resin powder coating prepared by the above method comprises the following steps:
  • the vertical winding inductor with the lead will be programmed, cut into segments according to the length of the aluminum frame of the preheating box of the powder coating machine, and the braided magnetic core package of the cut section will be placed downward.
  • the aluminum frame is placed in the preheating chamber of the powder coating machine, preheated at 100 degrees for 10-15 minutes, and the preheating time is long, and is adjusted according to the size of the packaged inductor product.
  • the aluminum frame with the braided inductor device placed in the impregnated powder package is placed in the oven to cure the coating.
  • the oven temperature is set to 120-150 degrees for 1-3 hours.
  • the baked aluminum frame of the braided inductor device is taken out of the oven until the coating is cooled.
  • the coating is hard and shiny, and an inductive device packaged with a thermosetting magnetic epoxy powder is obtained to complete the encapsulation process of the thermosetting magnetic epoxy powder.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Soft Magnetic Materials (AREA)
  • Paints Or Removers (AREA)
  • Insulating Of Coils (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un revêtement en poudre de résine époxy magnétique thermodurcissable, qui comprend les substances suivantes en pourcentages en poids: 30% à 50% d'une résine époxy, 20% à 50% d'une poudre magnétique de ferrite magnétique mou, 10% à 20% d'un agent de durcissement composite, 5% à 8% d'une matière de charge, et 3% à 8% d'un adjuvant. Un procédé d'encapsulation d'un inducteur au moyen du revêtement en poudre de résine époxy consiste: à mélanger, en proportion, la résine époxy, la poudre magnétique de ferrite magnétique mou, l'agent de durcissement composite, la matière de charge et l'adjuvant; puis à agiter le tout au moyen d'un dispositif d'agitation jusqu'à ce qu'il soit uniforme; puis à former le tout par extrusion pour obtenir un matériau sec floconneux; puis à broyer et à cribler le tout pour obtenir le revêtement en poudre de résine époxy; puis à imprégner le revêtement en poudre d'un inducteur préchauffé au moyen d'un dispositif de revêtement en lit fluidisé; puis à cuire et à refroidir le tout pour achever l'encapsulation.
PCT/CN2017/000391 2016-06-28 2017-06-21 Poudre de résine époxy magnétique thermodurcissable et procédé d'encapsulation d'un inducteur utilisant celle-ci WO2018000798A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610556447.6 2016-06-28
CN201610556447.6A CN106010124A (zh) 2016-06-28 2016-06-28 一种热固化型磁性环氧树脂粉末及其封装电感的方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111768966A (zh) * 2020-05-21 2020-10-13 天长市烁源磁电有限公司 一种软磁铁氧体生产用物料预处理装置及预处理方法
CN113793750A (zh) * 2021-08-30 2021-12-14 浙江工业大学 一种适用于低压成型的一体化电感材料及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106010124A (zh) * 2016-06-28 2016-10-12 王强 一种热固化型磁性环氧树脂粉末及其封装电感的方法
CN110125500A (zh) * 2018-02-02 2019-08-16 东莞碧克电子有限公司 包封剪脚新工艺
CN108395137B (zh) * 2018-03-27 2020-01-31 武汉理工大学 一种电磁诱导水泥混凝土裂缝自修复环氧树脂型微胶囊及其制备方法
CN112480607A (zh) * 2020-12-03 2021-03-12 慧迈材料科技(广东)有限公司 一种电感用新型磁性复合材料
CN115295299B (zh) * 2022-04-27 2023-09-22 广东泛瑞新材料有限公司 一体成型电感的制备方法及其应用

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JP2004027064A (ja) * 2002-06-26 2004-01-29 Nippon Steel Corp 放熱性と電磁波吸収性に優れた塗料及び塗装金属板
EP1541640A1 (fr) * 2003-12-05 2005-06-15 Rohm and Haas Company Revêtements en poudre réticulés par induction pour substrats thermosensible
CN1840589A (zh) * 2005-03-31 2006-10-04 株式会社神户制钢所 电磁波吸收性和导电性优异的涂料组成物，以及由该涂料组成物覆盖的涂装金属板
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CN106010124A (zh) * 2016-06-28 2016-10-12 王强 一种热固化型磁性环氧树脂粉末及其封装电感的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111768966A (zh) * 2020-05-21 2020-10-13 天长市烁源磁电有限公司 一种软磁铁氧体生产用物料预处理装置及预处理方法
CN113793750A (zh) * 2021-08-30 2021-12-14 浙江工业大学 一种适用于低压成型的一体化电感材料及其制备方法
CN113793750B (zh) * 2021-08-30 2024-07-05 浙江工业大学 一种适用于低压成型的一体化电感材料及其制备方法

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