WO2017221728A1 - 蓄熱積層体 - Google Patents
蓄熱積層体 Download PDFInfo
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- WO2017221728A1 WO2017221728A1 PCT/JP2017/021285 JP2017021285W WO2017221728A1 WO 2017221728 A1 WO2017221728 A1 WO 2017221728A1 JP 2017021285 W JP2017021285 W JP 2017021285W WO 2017221728 A1 WO2017221728 A1 WO 2017221728A1
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- Prior art keywords
- heat storage
- mass
- plasticizer
- heat
- resin
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B13/00—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material
- B32B13/04—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such water setting substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B13/08—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such water setting substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B13/00—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material
- B32B13/04—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such water setting substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B13/12—Layered products comprising a a layer of water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such water setting substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D2020/0004—Particular heat storage apparatus
- F28D2020/0008—Particular heat storage apparatus the heat storage material being enclosed in plate-like or laminated elements, e.g. in plates having internal compartments
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Definitions
- the present invention relates to a heat storage laminate capable of maintaining an appropriate temperature and saving energy according to various usage modes.
- the present invention relates to a heat storage laminate excellent in combustion resistance that is useful for maintaining a suitable temperature in a living space such as a house or a room such as an automobile.
- a material obtained by mixing a gypsum board encapsulating a latent heat storage material is disclosed (see Patent Document 1). Further, as a material using a flexible material, a heat storage thermoplastic resin sheet (see Patent Document 2) containing a heat storage material in a thermoplastic resin is disclosed.
- JP 2003-284939 A Japanese Patent Laid-Open No. 2009-5016
- the material in which the latent heat storage material is mixed in the above-mentioned gypsum board is used for the wall surface or the like, thereby increasing the heat capacity of the wall surface or the like to save energy.
- the material is poor in flexibility and handleability and has limited usage.
- the material obtained by mixing the latent heat storage material in the gypsum board has poor combustion resistance because the latent heat storage material leaks at high temperatures and generates combustible gas.
- thermoplastic resin has flexibility by using the thermoplastic resin, but it is difficult to realize the combustion resistance under flame contact.
- the problem to be solved by the present invention is to provide a heat storage laminate having a heat storage property that can contribute to maintaining an appropriate temperature according to the use mode and having an excellent combustion resistance.
- the present invention is a heat storage laminate in which an inorganic base material and an organic heat storage layer are laminated, and the mass reduction rate when the inorganic base material is a constant weight at a thickness of 8 mm or more and a temperature of 105 ° C.
- the above-mentioned problem is solved by a heat storage laminate that is 4% by mass or more of an inorganic base material.
- the heat storage laminate of the present invention uses an inorganic base material having a moisture content of a certain amount or more as the inorganic base material to be laminated with the heat storage layer, thereby using a heat storage layer mainly composed of an organic material as the heat storage layer.
- excellent combustion resistance can be achieved.
- Such a heat storage molded body of the present invention can be used for various applications, such as walls and wallpaper of living spaces such as houses, interiors of automobiles, trains, aircraft, agricultural houses, etc., and refrigerators for refrigerator cars and refrigerators.
- it can contribute to energy saving suitably in various applications such as materials applied to closed spaces such as the interiors of aircraft, electric parts that generate heat such as personal computer CPUs and storage batteries.
- the heat storage laminate of the present invention is a heat storage laminate in which an inorganic base material and an organic heat storage layer are stacked, the inorganic base material has a thickness of 8 mm or more, and the inorganic base material has a temperature of It is a heat storage laminate having a mass reduction rate of 4% by mass or more when set to a constant weight at 105 ° C.
- the inorganic base material used for the heat storage laminate of the present invention is an inorganic base material having a mass reduction rate of 4% by mass or more when a constant weight is obtained at a temperature of 105 ° C.
- the mass reduction rate is an index corresponding to the moisture content (including crystal water) of the inorganic base material.
- the mass reduction rate is more preferably 8% by mass or more, further preferably 10% by mass or more, and particularly preferably 15% by mass or more.
- the upper limit of the mass reduction rate is not particularly limited as long as the strength and rigidity of the inorganic base material can be secured, but is preferably about 30% by mass or less.
- the inorganic base material to be used is water-containing, and it can be suitably water-containing by setting a constant amount in an environment of a temperature of 23 ° C. and a humidity of 50%.
- the mass reduction rate can be measured according to the drying loss method of JIS K-0068.
- the weight of the sample before drying is w 1
- the weight of the sample when heated to a constant weight at 105 ° C. is w 2.
- suitable combustion resistance can be realized by setting the thickness of the inorganic base material to 8 mm or more.
- the thickness is more preferably 9.5 mm or more, and particularly preferably 12 mm or more.
- the upper limit of the thickness is not particularly limited, but is preferably 30 mm or less, more preferably 25 mm or less, and particularly preferably 20 mm or less from the viewpoint of handling properties such as weight and processing.
- the moisture permeability (moisture permeability coefficient per unit thickness) of the inorganic base material is preferably 100 ng / m ⁇ s ⁇ Pa or less, more preferably 60 ng / m ⁇ s ⁇ Pa or less, and 50 ng / More preferably, it is m ⁇ s ⁇ Pa or less.
- the moisture permeability ( ⁇ ) can be measured according to the JIS A1324 cup method, and the moisture permeation amount of the sample is determined by the increase / decrease per unit time in a 23 ° C. 50% environment of a moisture permeable cup with a hygroscopic agent and a sample attached.
- (G) can be obtained from the following equation.
- Wp moisture permeability coefficient
- Zp moisture permeability resistance
- A moisture permeability area
- P1 water vapor pressure of air in the constant temperature and humidity device
- P2 water vapor pressure of air in the moisture permeable cup
- ⁇ moisture permeability
- d Sample thickness
- the thermal conductivity of the inorganic base material is preferably 3 W / m ⁇ K or less, more preferably 1 W / m ⁇ K or less, and further preferably 0.3 W / m ⁇ K or less. By setting the thermal conductivity in this range, it is easy to suppress thermal conduction during flame contact, and it is easy to realize suitable combustion resistance.
- the thermal conductivity ( ⁇ ) can be measured in accordance with JIS A1412-2, and can be obtained from the following equation when a specimen and a heat flow meter, a heating plate and a cooling hot plate are stacked and given a predetermined temperature difference. it can.
- ⁇ [(f ⁇ e) ⁇ d / ⁇ T]
- f thermal conductivity
- f sensitivity coefficient of heat flow meter
- e output of heat flow meter
- d thickness of specimen
- ⁇ T temperature difference of specimen
- the kind of the inorganic base material is not particularly limited as long as it has the above water content, and examples thereof include a gypsum board, a calcium silicate board, a flexible board, a cement board, and fiber reinforced plates thereof.
- a gypsum board can be particularly preferably used because it can be preferably used that contains water of crystallization having a decomposition temperature of 200 ° C. or less, and the water content in the above range is easily retained as water of crystallization.
- the gypsum board is preferably dihydrate gypsum board.
- the gypsum board has a moisture permeability of 40 ng / m ⁇ s ⁇ Pa, a thermal conductivity of about 0.22 W / m ⁇ K, and the calcium silicate plate has a moisture permeability of 52 ng. / m ⁇ s ⁇ Pa and thermal conductivity of about 0.18 W / m ⁇ K.
- the moisture permeability is 3.4 ng / m ⁇ s ⁇ Pa and the thermal conductivity is about 0.18 W / m ⁇ K.
- the organic heat storage layer used in the present invention is a heat storage layer mainly composed of an organic material.
- a heat storage layer in which a heat storage material is dispersed in a resin matrix can be preferably used.
- the organic heat storage layer is preferable because desired characteristics can be easily obtained by adjusting the blending, and the formation of the layer and lamination with other materials are relatively easy. Tend.
- the inorganic base material by using the inorganic base material, it is possible to realize suitable combustion resistance together with excellent characteristics of such an organic heat storage layer.
- thermoplastic resin As the resin used for the resin matrix, various resins such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin can be used. Among these, a thermoplastic resin can be preferably used because it is easy to form a coating film.
- the thermoplastic resin include vinyl chloride resin, acrylic resin, urethane resin, olefin resin, ethylene vinyl acetate copolymer, styrene / butadiene resin, polystyrene resin, polybutadiene resin, polyester resin, and polyamide.
- resins include polyimide resins, polyimide resins, polycarbonate resins, 1,2-polybutadiene resins, polycarbonate resins, and polyimide resins. Among these, it is preferable to use a vinyl chloride resin because it is easy to obtain moldability at low temperatures and dispersibility of the heat storage material.
- the vinyl sol coating liquid is a paste-like coating liquid in which a heat storage material is dispersed and suspended in a resin composition containing vinyl chloride resin particles and a plasticizer.
- the average particle diameter of the vinyl chloride resin particles is preferably 0.01 to 10 ⁇ m, and preferably 0.1 to 5 ⁇ m.
- the particles may be dispersed directly or may be dispersed in a state of being aggregated into spherical secondary particles as the primary particles. Further, particles having different particle diameters may be mixed to have two or more particle size distribution peaks.
- the particle diameter can be measured by a laser method or the like.
- the shape of the vinyl chloride resin particles used in the vinyl sol coating solution is preferably a substantially spherical shape because it is easy to obtain suitable fluidity and the change in aging viscosity is small.
- the vinyl chloride resin particles those produced by emulsion polymerization or suspension polymerization are preferable because they can easily obtain a spherical shape and can easily control the particle size distribution.
- the polymerization degree of the vinyl chloride resin used is preferably 500 to 4000, more preferably 600 to 2000.
- vinyl chloride resin particles used in the present invention commercially available vinyl chloride resin particles can be used as appropriate.
- ZEST PQ83, PWLT, PQ92, P24Z manufactured by Shin-Daiichi PVC Co., Ltd. PSL- manufactured by Kaneka Corporation 675, 685 and the like.
- the content of the thermoplastic resin is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, More preferably, it is ⁇ 60% by mass. By setting it as the said range, it becomes easy to form a flexible sheet.
- thermoplastic resin When a thermoplastic resin is used as the resin used for the organic heat storage layer, it is preferable to use a plasticizer in combination because it is easy to ensure good coatability and film formability.
- the plasticizer include epoxy plasticizer, methacrylate plasticizer, polyester plasticizer, polyetherester plasticizer, aliphatic diester plasticizer, trimellitic acid plasticizer, adipic acid plasticizer, and benzoic acid.
- Plasticizers, phthalic acid plasticizers, etc. can be used as appropriate. Two or more kinds of plasticizers may be appropriately mixed and used.
- a non-phthalic plasticizer other than the phthalic plasticizer which may cause adverse effects on the human body.
- plasticizers various commercially available plasticizers can be used as appropriate.
- an epoxy plasticizer DIC Monosizer W-150; Shin Nippon Rika Co., Ltd. Sansosizer E-PS, E-PO E-4030, E-6000, E-2000H, E-9000H; ADEKA Adekasizer O-130P, O-180A, D-32, D-55, Kao Kapox S-6, etc.
- polyester plastic As the agent, DIC's Polycizer W-2050, W-2310, W-230H; ADEKA Adekasizer PN-7160, PN-160, PN-9302, PN-150, PN-170, PN-230, PN -7230, PN-1010, Mitsubishi Chemical D620, D621, D623, D643, D64 D620N; Kao Corporation HA-5, etc.
- Trimellitic acid plasticizers include DIC Monosizer W-705, ADEKA Adeka Sizer C-9N, Mitsubishi Chemical Corporation TOTM, TOTM-NB, Benzo, etc.
- acid plasticizer include Monosizer PB-3A manufactured by DIC, JP120 manufactured by Mitsubishi Chemical Corporation, and the like.
- the gelation end temperature is preferably 150 ° C. or lower, more preferably 140 ° C. or lower, further preferably 130 ° C. or lower, further preferably 120 ° C. or lower, It is particularly preferably 110 ° C. or lower.
- the gelation completion temperature can be defined as a temperature at which the light transmittance of the gelled film becomes constant.
- an epoxy plasticizer, a polyester plasticizer, and a benzoic acid plasticizer can be preferably used. From the viewpoint of the heat resistance and low temperature moldability, the epoxy plasticizer and the polyester are used.
- a plasticizer can be particularly preferably used.
- the gelation end point temperature is obtained by mixing a vinyl chloride resin for paste (polymerization degree 1700), the above plasticizer and a heat stabilizer (Ca—Zn) at a mass ratio of 100/80 / 1.5.
- a temperature at which the light transmittance is constant by sandwiching between a glass plate and a slide and raising the temperature at a heating rate of 5 ° C./min and observing a change in light transmittance using a hot stage for microscopic observation (Meter 800). Is the gelation end point temperature.
- the plasticizer used in the present invention preferably has a viscosity at 25 ° C. of 1500 mPa ⁇ s or less, more preferably 1000 mPa ⁇ s or less, still more preferably 500 mPa ⁇ s or less, and 300 mPa ⁇ s or less. It is particularly preferred that By setting it as the said range, since the viscosity of a vinyl sol coating liquid can be restrained low, the filling rate of a thermal storage material can be raised. In addition, the conditions of a plasticizer viscosity measurement can be measured in the conditions in the below-mentioned Example.
- the plasticizer used in the present invention preferably has a weight average molecular weight of 200 to 3,000, more preferably 300 to 1,000. By setting it as the said range, since the plasticizer itself is hard to bleed out and the viscosity of the vinyl sol coating liquid can be kept low, the filling rate of the heat storage material can be increased.
- the weight average molecular weight (Mw) is a value in terms of polystyrene based on gel permeation chromatography (hereinafter abbreviated as “GPC”) measurement. The GPC measurement can be performed under the following conditions.
- ⁇ Standard sample monodisperse polystyrene> “A-300” manufactured by Tosoh Corporation “A-500” manufactured by Tosoh Corporation “A-1000” manufactured by Tosoh Corporation “A-2500” manufactured by Tosoh Corporation "A-5000” manufactured by Tosoh Corporation “F-1” manufactured by Tosoh Corporation “F-2” manufactured by Tosoh Corporation “F-4” manufactured by Tosoh Corporation “F-10” manufactured by Tosoh Corporation “F-20” manufactured by Tosoh Corporation “F-40” manufactured by Tosoh Corporation “F-80” manufactured by Tosoh Corporation “F-128” manufactured by Tosoh Corporation “F-288” manufactured by Tosoh Corporation
- the heat storage material used in the present invention is a microcapsule heat storage material containing a heat storage material in the resin outer shell
- the HSP distance to the heat storage material to be used is 6 or more.
- a plasticizer By using the plasticizer, it is possible to suppress desorption of desorbed components from the heat storage molded body at a high temperature, and it becomes easy to realize suitable heat resistance that hardly causes volume shrinkage even at a high temperature. In a molded article made of a resin composition containing a general thermoplastic resin and a plasticizer that does not contain a heat storage material, large volume shrinkage hardly occurs even at high temperatures.
- the HSP distance between the heat storage material and the plasticizer within the above range, it is possible to suppress the incorporation of the plasticizer that causes a large amount of desorption components at high temperatures into the heat storage material. It becomes easy to suppress the volume shrinkage of the resin, and it becomes easy to realize suitable heat resistance.
- the HSP distance is preferably 7 or more, more preferably 8 or more, because it is easy to obtain suitable heat resistance.
- the upper limit is not particularly limited as long as it is generally used as a plasticizer, but it is preferably 40 or less, more preferably 30 or less because it is easy to obtain suitable compatibility and moldability. More preferably, it is 25 or less.
- the HSP distance is an index representing the solubility between substances using the Hansen solubility parameter (HSP).
- the Hansen solubility parameter represents solubility as a multi-dimensional (typically three-dimensional) vector, and the vector can be represented by a dispersion term, a polar term, and a hydrogen bond term. And the similarity of the said vector is represented as the distance (HSP distance) of a Hansen solubility parameter.
- Hansen solubility parameter numerical values that are helpful in various literatures are presented, and examples include Hansen Solubility Parameters: A User's Handbook (Charles Hansen et al., 2007, 2nd edition).
- Hansen solubility parameters can be calculated based on the chemical structure of a substance using commercially available software such as Hansen Solubility Parameter in Practice (HSPiP). The calculation is performed at a solvent temperature of 25 ° C.
- a plasticizer and a heat storage material for example, when using a heat storage material having an acrylic outer shell, an epoxy plasticizer, a polyester plasticizer, a trimellitic acid plasticizer, or the like can be preferably used. Moreover, when using the thermal storage material which has a melamine type outer shell, an epoxy plasticizer, a polyester plasticizer, a trimellitic acid plasticizer, a benzoic acid plasticizer, etc. can be used preferably. In particular, an epoxy plasticizer is preferable because various properties such as heat resistance are easily obtained.
- the HSP distance between the thermoplastic resin to be used and the plasticizer is preferably 15 or less, and more preferably 12 or less, because the resin matrix of the molded article can be suitably configured.
- the lower limit is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and further preferably 3 or more.
- a plasticizer having a plasticizer absorption of 150 parts by mass or less with respect to 100 parts by mass of the heat storage material to be used can be preferably used.
- the absorption amount is preferably 140 parts by mass or less, more preferably 135 parts by mass or less, and still more preferably 130 parts by mass or less because it is easy to obtain suitable heat resistance.
- the lower limit is not particularly limited as long as it is generally used as a plasticizer, but it is preferably 5 or more, and more preferably 10 or more, because it is easy to obtain suitable compatibility and moldability. .
- the absorption amount of the plasticizer is measured according to the oil absorption measurement method of JIS K5101-13-1. Specifically, a heat storage material weighing 1 to 20 g according to the expected absorption amount is placed on a glass plate as a sample, and 4 to 5 drops of plasticizer are gradually added from a burette at a time. Each time, it is kneaded into the sample with a steel pallet knife. This is repeated and dripping is continued until a plasticizer and a sample lump are formed. Thereafter, the solution is repeatedly dripped drop by drop and completely kneaded, and the point at which the paste becomes smooth is set as the end point, and the absorption amount is defined as the absorption amount of the plasticizer. Note that the paste can be spread without cracking or ragging, and can be lightly attached to the measurement plate.
- the content of the plasticizer in the organic heat storage layer is preferably 5 to 75% by mass, more preferably 10 to 70% by mass, and further preferably 20 to 60% by mass. By setting it as the said range, it becomes easy to obtain favorable coating suitability and moldability. Further, the content ratio of the plasticizer to the thermoplastic resin is preferably 30 to 150 parts by mass, more preferably 30 to 120 parts by mass, and more preferably 40 to 40 parts by mass with respect to 100 parts by mass of the thermoplastic resin. More preferably, it is 100 parts by mass.
- the heat storage material is not particularly limited as long as it has heat storage properties, and is a latent heat type heat storage material, a sensible heat type heat storage material, a chemical reaction type heat storage material utilizing heat absorption or heat generation associated with a chemical reaction. Can be used. Among these, a latent heat type heat storage material is preferable because it is easy to secure a large amount of energy in a small volume and easily adjust the heat absorption / release temperature.
- latent heat storage material As a latent heat storage material (latent heat storage material), in consideration of problems such as leaching during melting due to phase change and dispersibility when mixed, latent heat such as paraffin in the outer shell made of organic materials etc.
- Encapsulated heat storage particles containing a heat storage material are preferred.
- the HSP distance is calculated based on the HSP of the material used for the outer shell of the heat storage particles.
- the outer shell is not easily embrittled by the plasticizer, and the heat storage material is not damaged. Hard to occur.
- heat storage particles for example, those using an outer shell made of melamine resin, Thermo Memory FP-16, FP-25, FP-27, FP-31, FP-39 manufactured by Mitsubishi Paper Industries, Ltd., Miki RIKEN Examples include Riken Resin PMCD-15SP, 25SP, and 32SP manufactured by Kogyo Co., Ltd.
- Riken Resin PMCD-15SP 25SP, and 32SP manufactured by Kogyo Co., Ltd.
- silica such as Riken Resins LA-15, LA-25, LA-32 manufactured by Miki Riken Kogyo Co., Ltd.
- MicroDS5001X manufactured by BASF , 5040X and the like.
- the particle size of the heat storage particles is not particularly limited, but is preferably about 10 to 1000 ⁇ m, and more preferably 50 to 500 ⁇ m.
- the particle size of the heat storage particles is preferably such that the particle size of the primary particles is within the above range, but the particles with a primary particle size of 1 to 50 ⁇ m, preferably 2 to 10 ⁇ m aggregate to form secondary particles. It is also preferable that the heat storage particles have a secondary particle size in the above range.
- Such heat storage particles are easily damaged by pressure and shear. However, according to the configuration of the present invention, the heat storage particles can be suitably prevented from being damaged, and the heat storage material is less likely to leak or leak.
- the heat storage molded body of the present invention can also exude or leak heat storage material even when such a latent heat storage material is used. Is easily suppressed.
- the particle diameter of all the heat storage particles used in the heat storage molded body may not be in the above range, and 80% by mass or more of the heat storage particles in the heat storage molded body is preferably the heat storage particles in the above range, and 90% by mass. More preferably, it is more preferably 95% by mass or more.
- the latent heat storage material undergoes a phase change at a specific melting point. That is, when the room temperature exceeds the melting point, the phase changes from a solid to a liquid, and when the room temperature falls below the melting point, the phase changes from a liquid to a solid.
- the melting point of the latent heat storage material may be adjusted according to the use mode, and a material exhibiting a solid / liquid phase transition in a temperature range of about ⁇ 20 ° C. to 120 ° C. can be used as appropriate.
- the melting point is set to a temperature suitable for daily life, specifically 10
- a latent heat storage material designed to 35 to 35 ° C, preferably 15 to 30 ° C
- a latent heat storage material having a melting point of about 18 to 28 ° C. for the purpose of maintaining the heating effect in winter.
- the temperature is preferably about 18 to 23 ° C.
- two or more types of latent heat storage materials having different melting point designs may be mixed.
- a latent heat storage material having a melting point of about ⁇ 10 ° C. to 5 ° C. may be used.
- the content of the heat storage material in the organic heat storage layer is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and further preferably 30 to 60% by mass. By setting it as the said range, it is easy to obtain a favorable heat storage effect and it becomes easy to obtain favorable moldability.
- thermoplastic resin a method of forming a heat storage layer by sol casting using a vinyl sol coating liquid using vinyl chloride resin particles is preferable.
- molding becomes possible, without passing through kneading
- the method can be particularly preferably used because it is easy to suppress destruction of the heat storage material due to heat.
- the content of the vinyl chloride resin is 10 to 80% by mass in the solid content (components other than the solvent) contained in the coating solution. It is preferably 20 to 70% by mass, more preferably 30 to 60% by mass.
- the content of the plasticizer is preferably 30 to 150 parts by mass, more preferably 30 to 120 parts by mass with respect to 100 parts by mass of the thermoplastic resin contained in the resin composition. More preferably, it is ⁇ 100 parts by mass.
- the content of the heat storage material to be mixed in the coating liquid is preferably 10 to 80% by mass, more preferably 20 to 70% by mass in the solid content contained in the coating liquid, More preferably, it is 30 to 60% by mass.
- a solvent can be appropriately used in the vinyl sol coating solution.
- a solvent used in a sol-cast method of vinyl chloride resin can be used as appropriate, and among them, ketones such as diisobutyl ketone and methyl isobutyl ketone, esters such as butyl acetate, glycol ethers and the like are preferable. It can be illustrated. These solvents are preferable because they slightly swell the resin at room temperature to facilitate dispersion, and also facilitate melting gelation in the heating step. These solvents may be used alone or in combination of two or more.
- a diluting solvent may be used together with the above solvent.
- a solvent that does not dissolve the resin and suppresses the swelling property of the dispersion solvent can be preferably used.
- a diluting solvent for example, paraffinic hydrocarbons, naphthenic hydrocarbons, aromatic hydrocarbons, terpene hydrocarbons and the like can be used.
- the vinyl sol coating liquid it is also preferable to use a heat stabilizer in order to suppress degradation and coloration mainly due to dehydrochlorination reaction of vinyl chloride resin.
- a heat stabilizer for example, a calcium / zinc stabilizer, an octyl tin stabilizer, a barium / zinc stabilizer, or the like can be used.
- the content of the heat stabilizer is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
- additives such as a thinning agent, a dispersing agent, and an antifoaming agent may be appropriately contained as necessary in addition to the above components.
- the content of these additives is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
- the viscosity at the time of coating of the vinyl sol coating solution may be appropriately adjusted depending on the desired thickness of the sheet, coating conditions, etc., but is preferably 1000 mPa ⁇ s or more because it is easy to obtain good coating suitability. -More than s is more preferable and 5000 mPa * s or more is still more preferable. Further, the upper limit of the viscosity is preferably 70000 mPa ⁇ s or less, more preferably 50000 mPa ⁇ s or less, further preferably 30000 mPa ⁇ s or less, and particularly preferably 25000 mPa ⁇ s or less.
- the coating solution viscosity can be measured with a B-type viscometer.
- the heat storage molded body made of a sol cast film of a vinyl sol coating liquid containing the vinyl chloride resin particles and the heat storage material is not subject to shear or pressure on the heat storage material at the time of manufacture. Even though the material is used, it is difficult for the heat storage material to ooze out. Also, lamination with other layers and processing can be easily performed.
- the heat storage laminate of the present invention is a heat storage laminate in which the inorganic base material and the organic heat storage layer are laminated. With this configuration, a heat storage layer mainly composed of an organic material is used as the heat storage layer. Excellent combustion resistance can be realized.
- Heat storage laminate of the present invention is preferably calorific value as measured by JIS A5430 annex JA pyrogenic test (cone calorimeter method) is 8 MJ / m 2 or less in 10 minutes, 8 MJ / m 2 at 20 minutes The following is more preferable.
- the heat storage laminate of the present invention is suitable for the above-mentioned preferred heat resistance layer even when using an organic heat storage layer that exceeds 8 MJ / m 2 in less than 5 minutes when the exothermic test is performed on the organic heat storage layer alone. Combustibility can be realized.
- an organic type thermal storage layer suitably according to a use aspect.
- 100 ⁇ m or more is preferable, 500 ⁇ m or more is more preferable, 1 mm or more is more preferable, and 3 mm or more is particularly preferable because a suitable heat storage effect is easily obtained.
- the upper limit of the thickness is not particularly limited, but it is suitable when the organic heat storage layer is handled alone, such as when the sheet-like organic heat storage layer is formed and then bonded to the inorganic base material. Since it is easy to obtain flexibility and handleability, the molding is preferably performed at 20 mm or less, more preferably 10 mm or less, and further preferably 6 mm or less.
- the heat storage laminate of the present invention is obtained by directly applying a coating solution for forming an organic heat storage layer on an inorganic base material, or by applying a coating solution for forming an organic heat storage layer on a support. After the sheet-like organic heat storage layer is formed, the organic heat storage layer can be manufactured by a method of attaching the inorganic heat storage layer to an inorganic base material.
- a coating machine such as a roll knife coater, a reverse roll coater, or a comma coater can be used.
- a vinyl sol coating liquid the method of sending out a coating liquid and forming a coating film of fixed thickness with a doctor knife etc. can be used preferably.
- the coating film obtained by applying the coating liquid or putting it into a mold having an arbitrary shape can form an organic heat storage layer by gelation or curing by heating or drying.
- the heating temperature when heating the coating film is preferably a temperature at which the coating film temperature is 150 ° C. or less, more preferably 140 ° C. or less, and 130 ° C. It is more preferable to set it as the temperature which becomes below, and it is further more preferable to set it as the temperature which becomes 120 degrees C or less.
- the heating time may be appropriately adjusted according to the gelation rate or the like, but may be adjusted in the range of about 10 seconds to 10 minutes. Moreover, you may use together drying, such as air drying suitably with the said heating.
- the solvent may be removed at the same time in the heating step, but it is also preferable to perform preliminary drying before the heating.
- resin films used as various process films can be preferably used.
- the resin film include polyester resin films such as a polyethylene terephthalate resin film and a polybutylene terephthalate resin film.
- the thickness of the resin film is not particularly limited, but a resin film having a thickness of about 25 to 100 ⁇ m is easy to handle and obtain.
- the resin film used as the support one having a surface that has been peeled off can be preferably used.
- the release treatment agent used for the release treatment include alkyd resins, urethane resins, olefin resins, and silicone resins.
- the support may be peeled off and bonded to the inorganic base material, or may be peeled off after being bonded. In performing various processes before the lamination, it can be processed in a state of being laminated on the support.
- the heat storage laminate of the present invention is preferably provided with various functional layers in addition to the inorganic base material and the organic heat storage layer, and the various functional layers may be used as a support.
- flame retardancy can be improved by laminating with a non-combustible layer such as a non-combustible paper or a metal film, and is particularly suitable for application to living spaces. is there. Further, for example, heat storage can be more effectively expressed by laminating with a heat diffusion layer or a heat insulating layer. Moreover, in order to apply to the inner wall etc. of living space, a decorative layer and a decoration layer can also be provided.
- non-combustible paper examples include a configuration in which non-combustible paper is laminated on one side or both sides of an organic heat storage layer.
- the non-flammable paper is not particularly limited as long as it has non-flammability.
- a paper in which a flame retardant is applied, impregnated, or internally added to paper can be used.
- the flame retardant include metal hydroxides such as magnesium hydroxide and aluminum hydroxide, basic compounds such as phosphates, borates, and stephamates, glass fibers, and the like.
- the heat diffusion layer When it is applied to a closed space such as a room as a laminated structure of heat diffusion layers, the heat diffusion layer has the effect of uniformizing the heat in the room, and indoors (residential spaces such as houses, cars, trains, Heat from indoors such as airplanes, refrigerators of refrigerated vehicles, closed spaces such as aircraft storage, etc.) can be dispersed and transferred to the heat storage layer with low thermal resistance.
- indoors residential spaces such as houses, cars, trains, Heat from indoors such as airplanes, refrigerators of refrigerated vehicles, closed spaces such as aircraft storage, etc.
- the heat storage particles absorb indoor heat and release the heat into the room, and the indoor temperature environment can be controlled to an appropriate temperature.
- thermal diffusion layer a layer having a high thermal conductivity of 5 to 400 W / m ⁇ K can be preferably used. Due to the high thermal conductivity, locally concentrated heat can be diffused and transmitted to the heat storage layer to improve thermal efficiency and make room temperature uniform.
- Examples of the material for the heat diffusion layer include aluminum, copper, iron, and graphite.
- aluminum can be particularly preferably used.
- the reason why aluminum is preferable is that a heat insulating effect due to reflection of radiant heat is also exhibited.
- the heating efficiency can be improved by a heat insulating effect.
- Examples of the heating appliance mainly using radiant heat include electric floor heating, hot water type floor heating, and an infrared heater.
- flame retardancy can be improved from the viewpoint of disaster prevention.
- an appropriate form such as a layer made of a sheet of the above material or a vapor deposition layer of the above material can be used.
- a vapor deposition layer of the above material for example, an aluminum foil, an aluminum vapor deposition layer, or the like having flexibility is preferably used.
- the layer thickness of the thermal diffusion layer is not particularly limited, but is preferably about 3 to 500 ⁇ m because it is easy to ensure suitable thermal diffusion and handling properties.
- the heat storage layer when the heat storage layer is laminated on the heat storage layer, heat absorption and heat release of the heat storage layer are effectively performed on the indoor side, and the effect of maintaining an appropriate temperature in the room can be particularly suitably exhibited. It is also effective in preventing the outflow of heat in the room or reducing the influence of heat from the outside air.
- the heat storage laminate of the present invention can keep the room at an appropriate temperature by suppressing the temperature change in the room by these combined actions. Further, when an air conditioner such as an air conditioner or refrigeration equipment is used, the energy consumption can be reduced. Thereby, it can contribute to the energy-saving indoors suitably.
- the heat insulating layer a layer having a thermal conductivity of less than 0.1 W / m ⁇ K can be preferably used.
- the said heat insulation layer exhibits the effect which prevents the outflow of the heat
- the heat insulating layer is not particularly limited as long as it can form a layer having a thermal conductivity of less than 0.1 W / m ⁇ K.
- a heat insulating sheet such as a foamed resin sheet or a resin sheet containing a heat insulating material, or extruded Insulating boards such as polystyrene, bead polystyrene, polyethylene foam, urethane foam, and phenol foam can be used as appropriate.
- a heat insulating sheet is easy to ensure workability, it is preferable and it is more preferable that it is a resin sheet containing a heat insulating material since heat conductivity can be reduced.
- a foam sheet is preferable because it is easily available and inexpensive.
- the measured value by a cylindrical mandrel bending tester JIS K 5600 is a mandrel diameter of 2 to 32 mm.
- the heat insulating material used for the heat insulating layer enhances the heat insulating property of the heat storage laminate, and examples thereof include porous silica, porous acrylic, hollow glass beads, vacuum beads, and hollow fibers.
- porous silica porous acrylic
- hollow glass beads hollow glass beads
- vacuum beads hollow fibers.
- porous acrylic can be preferably used as the heat insulating material 5.
- the particle size of the heat insulating material is not limited, but is preferably about 1 to 300 ⁇ m.
- the heat insulating material is mixed into the base resin material to form a sheet.
- the resin material include polyvinyl chloride, polyphenylene sulfide, polypropylene, polyethylene, polyester, or acrylonitrile-butadiene-styrene resin, as described above.
- polyester A-PET, PET-G and the like can be used.
- a self-digestible vinyl chloride resin can be suitably used.
- the sheet is formed by using a molding machine such as extrusion molding or calender molding using a vinyl chloride resin, a plasticizer, and a heat insulating material.
- a molding machine such as extrusion molding or calender molding using a vinyl chloride resin, a plasticizer, and a heat insulating material.
- the content of the heat insulating material in the heat insulating layer is preferably 20% by mass or more in the heat insulating layer, more preferably 20 to 80% by mass, still more preferably 30 to 80% by mass, It is particularly preferably 80 to 80% by mass.
- additives such as a plasticizer and a flame retardant may be blended as necessary.
- the layer thickness of the heat insulating layer is not particularly limited, but as the thickness increases, the heat retaining property in the room increases. In order to maintain the bendability and workability of the sheet, the thickness is preferably about 50 to 3000 ⁇ m.
- the heat storage laminate of the present invention is preferably used mainly as an interior material application for an inner wall, ceiling, floor, etc. of a building, but can also be applied as a clothing material for a window sash frame or an interior material for a vehicle or the like. . Moreover, it can be used not only in the walls, floors, and ceilings of buildings but also in rooms such as automobiles, trains, and airplanes. It can also be used as a low temperature holding material for refrigeration equipment.
- Preparation Example 1 100 parts by weight of polyvinyl chloride resin particles having a polymerization degree of 900 (ZEST PQ92, manufactured by Shin-Daiichi PVC Co., Ltd.), epoxy plasticizer (Monicizer W-150, manufactured by DIC: viscosity 85 mPa ⁇ s, gelation end point temperature 121 ° C.) 3 parts by mass, 3 parts by mass of a heat stabilizer (Greek ML-538, Showa Varnish), 6 parts by mass of a viscosity reducing agent (BYK, Viscobyk-5125, manufactured by BYK) and a dispersant (Disperplast-, manufactured by BYK) 1150) 3 parts by mass and 60 parts by mass of a latent heat storage material (Micro DS5001X manufactured by BASF, particle size: 100 to 300 ⁇ m, melting point: 26 ° C.) obtained by microencapsulating paraffin with an outer shell made of polymethyl methacrylate (PMMA) resin
- the calculated value of the HSP distance between the plasticizer used and the latent heat storage material is 8.88
- the calculated value of the HSP distance between the plasticizer and the vinyl chloride resin is 4.6
- the coating liquid immediately after being mixed and homogeneously mixed The viscosity of was 7000 mPa ⁇ s.
- the absorption amount of the plasticizer with respect to 100 mass parts of latent heat storage materials was 129 mass parts. This was coated on a PET film with a 5 mm applicator and then heated for 8 minutes at a dryer temperature of 150 ° C. for gelation to form an organic heat storage sheet (A) having a thickness of 3 mm.
- Preparation Example 2 Similar to Preparation Example 1 except that a polyester plasticizer (DICizer Polycizer W-230H: viscosity 220 mPa ⁇ s, gelation end point temperature 136 ° C.) was used instead of the epoxy plasticizer used in Preparation Example 1. Thus, an organic heat storage sheet (B) was formed.
- the calculated value of the HSP distance between the used plasticizer and the latent heat storage material is 11.04
- the calculated value of the HSP distance between the plasticizer and the vinyl chloride resin is 6.4
- the plasticity with respect to 100 parts by mass of the used latent heat storage material The absorption amount of the agent was 117 parts by mass
- the viscosity of the coating liquid was 8500 mPa ⁇ s.
- Preparation Example 3 A preparation example except that instead of the epoxy plasticizer used in Preparation Example 1, a trimellitic acid plasticizer (Monicizer W-705 manufactured by DIC: viscosity 220 mPa ⁇ s, gelation end point temperature 143 ° C.) was used. In the same manner as in Example 1, an organic heat storage sheet (C) was formed.
- the calculated value of the HSP distance between the used plasticizer and the latent heat storage material is 9.07
- the calculated value of the HSP distance between the plasticizer and the vinyl chloride resin is 4.1
- the plasticizer with respect to 100 parts by mass of the latent heat storage material The absorption amount was 137 parts by mass
- the viscosity of the coating solution was 8500 mPa ⁇ s.
- Preparation Example 4 Instead of 60 parts by mass of the latent heat storage material used in Preparation Example 1, a latent heat storage material in which paraffin is microencapsulated using an outer shell made of melamine resin (Thermo Memory FP-25, manufactured by Mitsubishi Paper Industries Co., Ltd .: average particle size 50 ⁇ m) An organic heat storage sheet (D) was formed in the same manner as Preparation Example 1 except that 80 parts by mass of a melting point of 25 ° C. was used.
- melamine resin Thermo Memory FP-25, manufactured by Mitsubishi Paper Industries Co., Ltd .: average particle size 50 ⁇ m
- the calculated value of the HSP distance between the used plasticizer and the latent heat storage material is 22.30, the absorption amount of the plasticizer with respect to 100 parts by weight of the used latent heat storage material is 81 parts by mass, and the viscosity of the coating liquid is 8000 mPa ⁇ s. Met.
- Preparation Example 5 Similar to Preparation Example 4, except that a polyester plasticizer (DICizer Polycizer W-230H: viscosity 220 mPa ⁇ s, gelation end point temperature 136 ° C.) was used instead of the epoxy plasticizer used in Preparation Example 4. Thus, an organic heat storage sheet (E) was formed.
- the calculated value of the HSP distance between the used plasticizer and the latent heat storage material is 23.20
- the absorption amount of the plasticizer with respect to 100 parts by weight of the used latent heat storage material is 72 parts by mass
- the viscosity of the coating liquid is 12000 mPa ⁇ s. Met.
- Preparation Example 6 Preparation example except that benzoic acid plasticizer (manufactured by DIC, monosizer PB-10: viscosity 80 mPa ⁇ s, gelation end point temperature 100 ° C. or lower) was used in place of the epoxy plasticizer used in Preparation Example 4.
- an organic heat storage sheet (F) was formed.
- the calculated value of the HSP distance between the used plasticizer and the latent heat storage material is 17.10
- the calculated value of the HSP distance between the plasticizer and the vinyl chloride resin is 1.4
- the plasticity for 100 parts by mass of the used latent heat storage material The absorption amount of the agent was 96 parts by mass
- the viscosity of the coating solution was 8500 mPa ⁇ s.
- Measuring device B-type viscometer ("BM type” manufactured by Tokimec Co., Ltd.) Measurement conditions: temperature 25 ° C. 4 rotors, 12 rpm
- HSP distance [4 (dDA ⁇ dDB) 2 + (dPA ⁇ dPB) 2 + (dHA ⁇ dHB) 2 ] 0.5
- ⁇ Plasticizer absorption> The amount of plasticizer absorbed in the heat storage material was measured by the following method according to JIS K5101-13-1. A sample weighed 1 g of the heat storage material was placed on a glass plate, and 4 to 5 drops of plasticizer were gradually added from the burette at a time, and kneaded into the sample with a steel pallet knife. This was repeated until the plasticizer and the sample lump were formed. Thereafter, the solution was repeatedly dripped drop by drop and completely kneaded. The point at which the paste became a smooth hardness was taken as the end point, and the amount absorbed was taken as the amount absorbed by the plasticizer. The numerical value in the table
- surface was shown as an absorption amount with respect to 100 mass parts of heat storage materials.
- ⁇ Heat storage evaluation test> Two test specimens each having a size of 50 mm in width and 50 mm in length were stacked on the sheets prepared in Examples and Comparative Examples, and a thermocouple was sandwiched between the sheets. After keeping the outside air temperature at 35 ° C. for 2 hours in the environmental test machine, the temperature was lowered to 5 ° C. in 50 minutes, and further kept at 5 ° C. for 1 hour. At this time, the time during which the temperature in the sheet was maintained at 28 ° C. to 20 ° C. was measured, and the amount of time for maintaining the appropriate temperature was calculated from the 28 ° C. to 20 ° C. holding time (800 seconds) of the outside air temperature. Appropriate temperature maintenance was evaluated. The evaluation criteria are as follows. ⁇ : Retention time +200 seconds or more ⁇ : Retention time +50 seconds or more and less than 200 seconds ⁇ : Retention time less than +50 seconds
- Example 1 The organic heat storage sheet (A) prepared in Preparation Example 1 as the organic heat storage layer, the gypsum board (1) as the inorganic base material (thickness 9.5 mm, mass reduction rate at 105 ° C. constant weight 17.5% by mass) ), 100 g / m 2 of urethane-based adhesive (Cemedine UM-700 manufactured by Cemedine Co., Ltd.) is applied on the gypsum board (1), and the organic heat storage sheet (A) is laminated to 0.1 kgf / After applying the pressure of m 2 and allowing to stand for 24 hours, the PET film was peeled off to obtain a heat storage laminate.
- urethane-based adhesive Cosmetic UM-700 manufactured by Cemedine Co., Ltd.
- Example 2 A heat storage laminate was obtained in the same manner as in Example 1 except that gypsum board (2) (thickness 12.5 mm, mass reduction rate at 105 ° C. constant weight 17.9 mass%) was used as the inorganic base material.
- Example 3 A heat storage laminate is obtained in the same manner as in Example 1 except that the calcium silicate plate (1) (thickness 12.0 mm, mass reduction rate at 105 ° C. constant weight 4.4 mass%) is used as the inorganic base material. It was.
- Example 4 The heat storage laminate was obtained in the same manner as in Example 1 except that the fiber reinforced cement board (1) (thickness 9.0 mm, mass reduction rate at 105 ° C. constant weight 4.7 mass%) was used as the inorganic base material. Obtained.
- Example 5 A heat storage laminate was obtained in the same manner as in Example 1 except that the organic heat storage sheet (B) prepared in Preparation Example 2 was used as the organic heat storage layer.
- Example 6 A heat storage laminate was obtained in the same manner as in Example 1 except that the organic heat storage sheet (C) prepared in Preparation Example 3 was used as the organic heat storage layer.
- Example 7 A heat storage laminate was obtained in the same manner as in Example 1 except that the organic heat storage sheet (D) prepared in Preparation Example 4 was used as the organic heat storage layer.
- Example 8 A heat storage laminate was obtained in the same manner as in Example 1 except that the organic heat storage sheet (E) prepared in Preparation Example 5 was used as the organic heat storage layer.
- Example 9 A heat storage laminate was obtained in the same manner as in Example 1 except that the organic heat storage sheet (F) prepared in Preparation Example 6 was used as the organic heat storage layer.
- Example 1 A laminate was obtained in the same manner as in Example 1 except that gypsum board (3) (thickness 9.5 mm, mass reduction rate at 105 ° C. constant weight 0 mass%) was used as the inorganic base material.
- Example 2 A laminate was obtained in the same manner as in Example 1 except that the calcium silicate plate (2) (thickness 6.0 mm, mass decrease rate at 105 ° C. constant weight 2.9 mass%) was used as the inorganic base material. .
- the inorganic base material is adjusted to a size of 99 mm x 99 mm, and dried in accordance with JIS K-0068 dry weight loss method, mass before drying the inorganic base material (w 1 ) at a temperature of 105 ° C.
- the mass (w 2 ) of the sample at the time of constant weight was measured, and the mass reduction rate was calculated from the following formula.
- the inorganic base materials other than the gypsum board (3) had a constant weight in an environment of a temperature of 23 ° C. and a humidity of 50% before drying, and the mass was regarded as a mass before drying.
- Mass reduction rate (mass%) [(w 1 ⁇ w 2 ) / w 1 ] ⁇ 100
- Example calorific value The total calorific value for 20 minutes does not exceed 8.0 MJ / m 2 .
- ⁇ to ⁇ The time during which the total calorific value does not exceed 8.0 MJ / m 2 exceeds 15 minutes and is 20 minutes or less.
- the heat storage laminates of the present invention of Examples 1 to 9 were able to achieve suitable combustion resistance while using an organic heat storage layer having good heat storage performance.
- the laminates of Comparative Examples 1 to 3 had poor combustion resistance.
- the sample of the reference example 1 which did not laminate stack an inorganic type base material ignited in 14 seconds.
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Abstract
Description
本発明の蓄熱積層体に使用する無機系基材は、温度105℃下で恒量とした際の質量減少率が4質量%以上の無機系基材である。当該質量減少率は、無機系基材の含水率(結晶水含む)に相当する指標である。当該質量減少率は、8質量%以上であることがより好ましく、10質量%以上であることがさらに好ましく、15質量%以上であることが特に好ましい。当該質量減少率を上記範囲とすることで、接炎時に高い即応性で水分が解離し、積層体の温度上昇を抑制して好適な耐燃焼性を実現できる。当該質量減少率の上限は無機系基材の強度や剛性を担保できる範囲であれば特に制限されるものではないが、30質量%以下程度であることが好ましい。なお、使用する無機系基材は、含水させて使用することも好ましく、温度23℃、湿度50%の環境下で恒量とすることで好適に含水させることができる。
Zp=[(P1-P2)×A]/G
Wp=1/Zp
μ=Wp×d
Wp:透湿係数、Zp:透湿抵抗、A:透湿面積、P1:恒温恒湿装置内の空気の水蒸気圧、P2:透湿カップ内の空気の水蒸気圧、μ:透湿率、d:試料の厚さ
λ=[(f×e)×d/ΔT]
λ:熱伝導率、f:熱流計の感度係数、e:熱流計の出力、d:試験体の厚さ、ΔT:試験体の温度差
本発明に使用する有機系蓄熱層は、有機材料を主成分とする蓄熱層である。当該蓄熱層としては、蓄熱材が樹脂マトリクス中に分散した蓄熱層を好ましく使用できる。当該有機系蓄熱層は、配合調整により所望の特性を得やすく、層の形成や他の材料との積層も比較的容易であるため好ましいが、有機材料を主成分とするため耐燃焼性に乏しい傾向がある。本発明においては、上記無機系基材を使用することで、このような有機系蓄熱層の優れた特性と共に、好適な耐燃焼性を実現できる。
樹脂マトリクスに使用する樹脂としては、熱可塑性樹脂、熱硬化性樹脂、紫外線硬化性樹脂等の各種樹脂を使用できる。なかでも、塗膜形成が容易であることから熱可塑性樹脂を好ましく使用できる。熱可塑性樹脂としては、例えば、塩化ビニル系樹脂、アクリル系樹脂、ウレタン系樹脂、オレフィン系樹脂、エチレン酢酸ビニル共重合、スチレン・ブタジエン系樹脂、ポリスチレン系樹脂、ポリブタジエン系樹脂、ポリエステル系樹脂、ポリアミド系樹脂、ポリイミド系樹脂、ポリカーボネート系樹脂、1,2-ポリブタジエン系樹脂、ポリカーボネート系樹脂、ポリイミド系樹脂等を例示できる。なかでも、低温下での成形性や蓄熱材の分散性を得やすいことから塩化ビニル系樹脂を使用することが好ましい。
有機系蓄熱層に使用する樹脂として熱可塑性樹脂を使用する場合には、良好な塗工性や成膜性を確保しやすいことから、可塑剤を併用することが好ましい。当該可塑剤としては、エポキシ系可塑剤、メタクリレート系可塑剤、ポリエステル系可塑剤、ポリエーテルエステル系可塑剤、脂肪族ジエステル系可塑剤、トリメリット酸系可塑剤、アジピン酸系可塑剤、安息香酸系可塑剤、フタル酸系可塑剤等を適宜使用できる。また、2種類以上の可塑剤を適宜混合して使用しても良い。住宅等の建築材料用途や自動車用途等へ使用する場合には、人体への悪影響が懸念されるフタル酸系可塑剤以外の非フタル酸系可塑剤を使用することが好ましい。
測定装置:東ソー株式会社製ガードカラム「HLC-8330」
カラム:東ソー株式会社製「TSK SuperH-H」
+東ソー株式会社製「TSK gel SuperHZM-M」
+東ソー株式会社製「TSK gel SuperHZM-M」
+東ソー株式会社製「TSK gel SuperHZ-2000」
+東ソー株式会社製「TSK gel SuperHZ-2000」
検出器:RI(示差屈折計)
データ処理:東ソー株式会社製「GPC-8020モデルIIバージョン4.10」
カラム温度:40℃
展開溶媒:テトラヒドロフラン(THF)
流速:0.35mL/分
試料:樹脂固形分換算で1.0質量%のテトラヒドロフラン溶液をマイクロフィルターでろ過したもの(100μl)
標準試料:前記「GPC-8020モデルIIバージョン4.10」の測定マニュアルに準拠して、分子量が既知の下記の単分散ポリスチレンを用いた。
東ソー株式会社製「A-300」
東ソー株式会社製「A-500」
東ソー株式会社製「A-1000」
東ソー株式会社製「A-2500」
東ソー株式会社製「A-5000」
東ソー株式会社製「F-1」
東ソー株式会社製「F-2」
東ソー株式会社製「F-4」
東ソー株式会社製「F-10」
東ソー株式会社製「F-20」
東ソー株式会社製「F-40」
東ソー株式会社製「F-80」
東ソー株式会社製「F-128」
東ソー株式会社製「F-288」
蓄熱材としては、蓄熱性を有するものであれば特に制限されず、潜熱型の蓄熱性材料、顕熱型の蓄熱性材料、化学反応にともなう吸熱や発熱を利用した化学反応型の蓄熱性材料を使用できる。なかでも、潜熱型の蓄熱性材料は、小さい体積で多くのエネルギーを確保しやすく、吸放熱温度を調整しやすいため好ましい。
有機系蓄熱層を形成する塗工液は、使用する樹脂成分及び蓄熱材に応じて適宜混合して調整すればよい。例えば、熱可塑性樹脂として塩化ビニル樹脂を使用する場合には、塩化ビニル樹脂粒子を使用したビニルゾル塗工液を用いて、ゾルキャストにより蓄熱層を形成する方法が好ましい。当該製造方法とすることで、ミキサー等による混練や押出成形等を経ることなく成形が可能となり、蓄熱材の破壊が生じにくく、得られる蓄熱成形体からの蓄熱材の染み出し等が生じにくい。また、当該方法によれば、低温下での成形が容易となることから、熱による蓄熱材の破壊を抑制しやすいため当該方法が特に好ましく使用できる。
本発明の蓄熱積層体は、上記無機系基材と有機系蓄熱層とが積層された蓄熱積層体であり、当該構成により、蓄熱層として有機系材料を主体とする蓄熱層を使用しながらも、優れた耐燃焼性を実現できる。
重合度900のポリ塩化ビニル樹脂粒子(新第一塩ビ社製 ZEST PQ92)100質量部、エポキシ系可塑剤(DIC社製 モノサイザーW-150:粘度85mPa・s、ゲル化終点温度121℃)60質量部、熱安定剤(昭和ワニス社製 グレックML-538)3質量部、その他添加剤として減粘剤(BYK社製 減粘剤VISCOBYK-5125)6質量部及び分散剤(BYK社製 Disperplast-1150)3質量部と、パラフィンをポリメチルメタクリレート(PMMA)樹脂からなる外殻を用いてマイクロカプセル化した潜熱蓄熱材(BASF社製 Micronal DS5001X:粒子径100~300μm、融点26℃)60質量部を配合し、プラスチゾル塗工液を作成した。使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は8.88、可塑剤と塩化ビニル樹脂とのHSP距離の計算値は4.6、配合して均質に混合した直後の塗工液の粘度は7000mPa・sであった。また、潜熱蓄熱材100質量部に対する可塑剤の吸収量は129質量部であった。これをPETフィルム上に5mmアプリケーターにて塗布した後、150℃のドライヤー温度で8分間加熱してゲル化させ、厚さ3mmの有機系蓄熱シート(A)を形成した。
調製例1にて使用したエポキシ系可塑剤に代えて、ポリエステル系可塑剤(DIC社製 ポリサイザーW-230H:粘度220mPa・s、ゲル化終点温度136℃)を使用した以外は調製例1と同様にして有機系蓄熱シート(B)を形成した。なお、使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は11.04、可塑剤と塩化ビニル樹脂とのHSP距離の計算値は6.4、使用した潜熱蓄熱材100質量部に対する可塑剤の吸収量は117質量部、塗工液の粘度は8500mPa・sであった。
調製例1にて使用したエポキシ系可塑剤に代えて、トリメリット酸系可塑剤(DIC社製 モノサイザーW-705:粘度220mPa・s、ゲル化終点温度143℃)を使用した以外は調製例1と同様にして有機系蓄熱シート(C)を形成した。なお、使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は9.07、可塑剤と塩化ビニル樹脂とのHSP距離の計算値は4.1、潜熱蓄熱材100質量部に対する可塑剤の吸収量は137質量部、塗工液の粘度は8500mPa・sであった。
調製例1にて使用した潜熱蓄熱材60質量部に代えて、パラフィンをメラミン樹脂からなる外殻を用いてマイクロカプセル化した潜熱蓄熱材(三菱製紙社製 サーモメモリー FP-25:平均粒子径50μm、融点25℃)を80質量部使用した以外は調製例1と同様にして、有機系蓄熱シート(D)を形成した。なお、使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は22.30、使用した潜熱蓄熱材100質量部に対する可塑剤の吸収量は81質量部、塗工液の粘度は8000mPa・sであった。
調製例4にて使用したエポキシ系可塑剤に代えて、ポリエステル系可塑剤(DIC社製 ポリサイザーW-230H:粘度220mPa・s、ゲル化終点温度136℃)を使用した以外は調製例4と同様にして有機系蓄熱シート(E)を形成した。なお、使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は23.20、使用した潜熱蓄熱材100質量部に対する可塑剤の吸収量は72質量部、塗工液の粘度は12000mPa・sであった。
調製例4にて使用したエポキシ系可塑剤に代えて、安息香酸系可塑剤(DIC社製 モノサイザーPB-10:粘度80mPa・s、ゲル化終点温度100℃以下)を使用した以外は調製例4と同様にして有機系蓄熱シート(F)を形成した。なお、使用した可塑剤と潜熱蓄熱材とのHSP距離の計算値は17.10、可塑剤と塩化ビニル樹脂とのHSP距離の計算値は1.4、使用した潜熱蓄熱材100質量部に対する可塑剤の吸収量は96質量部、塗工液の粘度は8500mPa・sであった。
測定装置:B型粘度計(東京計器株式会社製「DVM-B型」)
測定条件:温度25℃、No.2ロータ、30rpm
測定装置:B型粘度計(トキメック株式会社製「BM型」)
測定条件:温度25℃、No.4ロータ、12rpm
実施例及び比較例にて使用した可塑剤と潜熱蓄熱材とのHSP距離、可塑剤と塩化ビニルとのHSP距離を下記にて算出した。
HSPiPにより算出された溶解度パラメータの成分分散項dD、極性項dP、水素結合項dHを用いて、成分Aと成分BとのHSP距離を以下の式にて算出した。
HSP距離=[4(dDA-dDB)2+(dPA-dPB)2+(dHA-dHB)2]0.5
蓄熱材への可塑剤の吸収量を、JIS K5101-13-1に準じて以下の方法にて測定した。蓄熱材1gを秤量した試料をガラス板上に設置し、可塑剤をビュレットから一回に4~5滴ずつ徐々に加え、鋼製のパレットナイフで試料に練り込んだ。これを繰り返し、可塑剤及び試料の塊ができるまで滴下を続けた。以後、1滴ずつ滴下して完全に混練するようにして繰り返し、ペーストが滑らかな硬さになったところを終点とし、当該吸収量を可塑剤の吸収量とした。表中の数値は、蓄熱材100質量部に対する吸収量として示した。
実施例及び比較例にて作成したシートを幅50mm×長さ50mmのサイズにした試験体を2枚重ねに積層し、熱伝対をシート中央に挟んで設置した。環境試験機内で外気温を35℃で2時間保持した後、50分間で5℃まで下降させ、さらに1時間5℃を保持した。この際、シート内の温度が28℃~20℃の温度を保持した時間を測定し、外気温の28℃~20℃保持時間(800秒)からどのくらい適温維持時間が延びたかを計算して、適温維持性を評価した。評価基準は以下のとおりである。
◎:保持時間が+200秒以上
○:保持時間が+50秒以上200秒未満
×:保持時間が+50秒未満
実施例及び比較例にて作成したシートを幅50mm×長さ50mmのサイズにし、同サイズの油取り紙を挟んで積層した試験体を、荷重50g/cm2、40℃50%RH環境下で15時間圧着し、シートから染み出した蓄熱材成分について、油取り紙への染みで目視評価した。評価基準は以下の通りである。
○:染みなし
△:部分的に染みあり
×:全面に染みあり
実施例及び比較例にて作成したシートを幅50mm×長さ50mmのサイズにし、80℃環境下に1週間静置した際の質量変化を測定した。評価基準は以下の通りである。
◎:質量変化が10%未満
○:質量変化が10%以上15%未満
×:質量変化が15%以上
有機系蓄熱層として調製例1にて調製した有機系蓄熱シート(A)を、無機系基材として石膏ボード(1)(厚み9.5mm、105℃恒量時の質量減少率17.5質量%)を使用して、石膏ボード(1)上に、ウレタン系接着剤(セメダイン社製 セメダインUM-700)を100g/m2塗布し、有機系蓄熱シート(A)を積層して0.1kgf/m2の圧をかけて24時間静置した後、PETフィルムを剥離して蓄熱積層体を得た。
無機系基材として石膏ボード(2)(厚み12.5mm、105℃恒量時の質量減少率17.9質量%)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
無機系基材としてケイ酸カルシウム板(1)(厚み12.0mm、105℃恒量時の質量減少率4.4質量%)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
無機系基材として、繊維強化セメント板(1)(厚み9.0mm、105℃恒量時の質量減少率4.7質量%)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
有機系蓄熱層として調製例2にて調製した有機系蓄熱シート(B)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
有機系蓄熱層として調製例3にて調製した有機系蓄熱シート(C)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
有機系蓄熱層として調製例4にて調製した有機系蓄熱シート(D)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
有機系蓄熱層として調製例5にて調製した有機系蓄熱シート(E)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
有機系蓄熱層として調製例6にて調製した有機系蓄熱シート(F)を使用した以外は実施例1と同様にして、蓄熱積層体を得た。
無機系基材として石膏ボード(3)(厚み9.5mm、105℃恒量時の質量減少率0質量%)を使用した以外は実施例1と同様にして、積層体を得た。
無機系基材としてケイ酸カルシウム板(2)(厚み6.0mm、105℃恒量時の質量減少率2.9質量%)を使用した以外は実施例1と同様にして、積層体を得た。
無機系基材としてガラス繊維ネット入酸化マグネシウム板(1)(厚み6.0mm、105℃恒量時の質量減少率11.5質量%)を使用した以外は実施例1と同様にして、積層体を得た。
無機系基材を99mm×99mmのサイズに調整し、JIS K-0068の乾燥減量法の基準に準じて、無機系基材の乾燥前の質量(w1)、温度105℃下で加熱乾燥して恒量とした際の試料の質量(w2)を測定し、下式より質量減少率を算出した。なお、石膏ボード(3)以外の無機系基材は、乾燥前に温度23℃、湿度50%の環境下で恒量とし、当該質量を乾燥前の質量とした。
質量減少率(質量%)=[(w1-w2)/w1]×100
実施例及び比較例で得られた積層体を99mm×99mmのサイズに切断し、試料を調整した。当該試料を用いて、JIS A5430付属書JA発熱性試験(コーンカロリーメーター法)に準じて発熱性試験を行った。評価基準は以下のとおりである。
(総発熱量)
◎:20分間の総発熱量が8.0MJ/m2を超えない。
○~◎:総発熱量が8.0MJ/m2を超えない時間が、15分超過20分以下。
○:総発熱量が8.0MJ/m2を超えない時間が、10分超過15分以下。
×:10分以下で8.0MJ/m2を超える。
(外観評価)
○:裏面まで貫通する亀裂および穴がない。
×:裏面まで貫通する亀裂および穴が発生。
Claims (9)
- 無機系基材と有機系蓄熱層とが積層された蓄熱積層体であって、
前記無機系基材が、厚み8mm以上、温度105℃下で恒量とした際の質量減少率が4質量%以上の無機系基材であることを特徴とする蓄熱積層体。 - 前記無機系基材のJIS A1324カップ法に準じて測定される透湿率(単位厚さ当たりの透湿係数)が100ng/m・s・Pa以下である請求項1に記載の蓄熱積層体。
- 前記無機系基材のJIS A1412-2に準じて測定される熱伝導率が3W/m・K以下である請求項1又は2に記載の蓄熱積層体。
- 前記有機系蓄熱層が、樹脂マトリクス中に蓄熱材が分散した蓄熱シートである請求項1~3のいずれかに記載の蓄熱積層体。
- 前記樹脂マトリクスが、熱可塑性樹脂及び可塑剤を含有する樹脂組成物からなる樹脂マトリクスである請求項4に記載の蓄熱積層体。
- 前記蓄熱材と可塑剤を混合した際の蓄熱材100質量部に対する可塑剤の吸収量が150質量部以下である請求項5に記載の蓄熱積層体。
- 前記蓄熱材が、樹脂外殻中に潜熱蓄熱材料を含有するマイクロカプセル状の蓄熱材である請求項4又は5に記載の蓄熱積層体。
- 請求項1~7のいずれかに記載の蓄熱積層体に、不燃紙が積層された蓄熱積層体。
- 請求項1~8のいずれかに記載の蓄熱積層体に、熱拡散層及び断熱層の少なくとも一種が積層された蓄熱積層体。
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JP2018523853A JP6460435B2 (ja) | 2016-06-22 | 2017-06-08 | 蓄熱積層体 |
KR1020187031636A KR102363810B1 (ko) | 2016-06-22 | 2017-06-08 | 축열 적층체 |
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JP2019218518A (ja) * | 2018-06-22 | 2019-12-26 | イビデン株式会社 | 蓄熱材粒子含有樹脂ペレット、及び、蓄熱材粒子含有樹脂ペレットの製造方法 |
JPWO2020110662A1 (ja) * | 2018-11-26 | 2021-10-14 | 富士フイルム株式会社 | 蓄熱シート、蓄熱部材及び電子デバイス |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0357282U (ja) * | 1989-10-09 | 1991-05-31 | ||
JP2006063314A (ja) * | 2004-05-12 | 2006-03-09 | Sk Kaken Co Ltd | マイクロカプセル及びその製造方法 |
JP2006225986A (ja) * | 2005-02-17 | 2006-08-31 | Mitsubishi Paper Mills Ltd | 石膏ボード |
JP2007196465A (ja) * | 2006-01-25 | 2007-08-09 | Asahi Kasei Construction Materials Co Ltd | 不燃性蓄熱パネル |
JP2011208121A (ja) * | 2009-12-02 | 2011-10-20 | Bekku Kk | 蓄熱体及びその製造方法 |
WO2015098739A1 (ja) * | 2013-12-25 | 2015-07-02 | Dic株式会社 | 蓄熱シート、蓄熱積層体及び蓄熱シートの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10163162A1 (de) | 2001-12-20 | 2003-07-03 | Basf Ag | Mikrokapseln |
JP5192199B2 (ja) | 2007-08-23 | 2013-05-08 | アキレス株式会社 | 蓄熱性熱可塑性樹脂シート状成形体 |
CN104987077A (zh) * | 2015-06-27 | 2015-10-21 | 湖北神雾热能技术有限公司 | 一种新型蜂窝陶瓷蓄热体及制备工艺 |
-
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0357282U (ja) * | 1989-10-09 | 1991-05-31 | ||
JP2006063314A (ja) * | 2004-05-12 | 2006-03-09 | Sk Kaken Co Ltd | マイクロカプセル及びその製造方法 |
JP2006225986A (ja) * | 2005-02-17 | 2006-08-31 | Mitsubishi Paper Mills Ltd | 石膏ボード |
JP2007196465A (ja) * | 2006-01-25 | 2007-08-09 | Asahi Kasei Construction Materials Co Ltd | 不燃性蓄熱パネル |
JP2011208121A (ja) * | 2009-12-02 | 2011-10-20 | Bekku Kk | 蓄熱体及びその製造方法 |
WO2015098739A1 (ja) * | 2013-12-25 | 2015-07-02 | Dic株式会社 | 蓄熱シート、蓄熱積層体及び蓄熱シートの製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019218518A (ja) * | 2018-06-22 | 2019-12-26 | イビデン株式会社 | 蓄熱材粒子含有樹脂ペレット、及び、蓄熱材粒子含有樹脂ペレットの製造方法 |
JPWO2020110662A1 (ja) * | 2018-11-26 | 2021-10-14 | 富士フイルム株式会社 | 蓄熱シート、蓄熱部材及び電子デバイス |
JP7080343B2 (ja) | 2018-11-26 | 2022-06-03 | 富士フイルム株式会社 | 蓄熱シート、蓄熱部材及び電子デバイス |
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JP6460435B2 (ja) | 2019-01-30 |
JPWO2017221728A1 (ja) | 2018-12-20 |
KR102363810B1 (ko) | 2022-02-16 |
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