WO2017206609A1 - 电路板拼板 - Google Patents
电路板拼板 Download PDFInfo
- Publication number
- WO2017206609A1 WO2017206609A1 PCT/CN2017/080930 CN2017080930W WO2017206609A1 WO 2017206609 A1 WO2017206609 A1 WO 2017206609A1 CN 2017080930 W CN2017080930 W CN 2017080930W WO 2017206609 A1 WO2017206609 A1 WO 2017206609A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- edge
- connecting rib
- rib
- assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
Definitions
- the present invention relates to the field of electronic devices, and in particular, to a circuit board assembly.
- the circuit board in the mobile phone is getting smaller and smaller, and in order to improve the efficiency of the circuit board mounting process, a plurality of small circuit boards are usually put together for patching, and a plurality of circuit boards are fixed on the outer frame formed by the process side.
- a circuit board composed of a plurality of circuit boards and process edges is used for patching, a plurality of the circuit board arrays are arranged on the patch device to improve the patch efficiency.
- the process side occupies a large part of the use area of the chip device, thereby causing the use of the circuit board. The area is reduced. That is to say, under the limited use area of the chip device, the number of layouts of the circuit board is not high, which leads to a decrease in chip placement efficiency, resulting in low utilization of the circuit board.
- the present invention provides a circuit board assembly that improves circuit board utilization.
- the present invention provides a circuit board assembly, wherein the circuit board assembly includes a circuit board assembly and a process side assembly; the circuit board assembly includes a first circuit board and a second circuit board side by side, the first circuit The board includes a first side and a second side disposed opposite the first side, the second circuit board including a third side that is flush with the first side; the craft side assembly includes a first process side and a second process side disposed opposite to the first process side, the first process side fixedly connecting the first side edge and the third side edge, and covering the first side edge and The third side; the second side is fixedly connected to the second side and covers only the second side. .
- FIG. 1 is a schematic view of a circuit board panel of a first embodiment provided by the present invention
- FIG. 2 is a schematic view of a circuit board panel according to a second embodiment of the present invention.
- FIG 3 is a schematic view of a circuit board panel of a third embodiment provided by the present invention.
- the circuit board assembly 100 includes a circuit board assembly 10, a process side assembly 20, and a connecting rib assembly 30.
- the circuit board assembly 10 includes a first circuit board 11 and a second circuit board 12 side by side, the first circuit board 11 including a first side 111 and a second side 112 disposed opposite the first side 111
- the second circuit board 12 includes a third side 121 that is flush with the first side 111.
- the process side assembly 20 includes a first process edge 21 and a second process edge 22 opposite the first process edge 21, the first process edge 21 and the first side edge 111 and the third side edge 121 is oppositely disposed and fixedly coupled to the first side 111 and the third side 121.
- the second process edge 22 is only opposite the second side 112 and is fixedly coupled to the second side 112.
- the connecting rib assembly 30 includes a first connecting rib 31, a second connecting rib 32 and a third connecting rib 33, and the first connecting rib 31 is fixedly connected to the first side 111 and the first side 21, the second connecting rib 32 is fixedly connected to the second side 112 and the second side 22, and the third connecting rib 33 is fixedly connected to the third side 121 and the first Process side 21.
- SMT Surface Mount Technology
- the first side edge 111 of the first circuit board 11 and the third side edge 121 of the second circuit board 12 are fixedly connected by the first process edge 21, and the second process side 22 is fixedly connected to the
- the second side 112 of the first circuit board 11 further ensures the stable structure of the board panel 100; while the second side 22 is covered by the second process edge 22, so that the length of the second process side 22 cut back, That is, the use area of the process side in the board jig 100 is effectively reduced.
- the two adjacent circuit board panels 100 can be brought closer together, thereby increasing the use area of the circuit board on the patch device, that is, Increased board utilization.
- the first circuit board 11 is a printed circuit board.
- the first circuit board 11 is a rigid rectangular plate.
- the first circuit board 11 is composed of a substrate, a copper foil layer, and a cover film which are sequentially laminated.
- the first side 111 may be a side located in the width direction of the first circuit board 11. In other embodiments, the first side 111 may also be a side of the first circuit board 11 in the longitudinal direction; the first circuit board 11 may also be a flexible circuit board.
- the second circuit board 12 is identical in structure to the first circuit board 11. The difference is that the internal stress of the second circuit board 12 can be greater than the internal stress of the first circuit board 11.
- the first circuit board 11 and the second process side 22 can be used to stress-compensate the first circuit board 11 such that the first circuit board 11 is less susceptible to deformation.
- the second circuit board 12 further includes a fourth side 122 disposed opposite to the third side 121. The fourth side 122 is flush with the second side 112 , and the fourth side 122 is longer than the second side 112 .
- the second process edges 22 of two adjacent circuit board panels 100 may be flush, so that two adjacent The circuit board assembly 100 is closer, so that the use area of the first circuit board 11 and the second circuit board 12 arranged on the chip device is increased, and the circuit board utilization rate is improved.
- the second circuit board 12 may also be a flexible circuit board.
- a second embodiment is provided, which is substantially identical to the first embodiment, except that the fourth side 122 projects relative to the second process edge 22.
- the length of the fourth side 122 is less than or equal to the length of the second side 112, so that when two adjacent circuit board panels 100 are arranged on the patch device, two adjacent circuit boards are assembled.
- the fourth side edges 122 of the 100 may be flush with one another, again bringing the two of the circuit board panels 100 closer together.
- the first process side 21 is made of the same material as the first circuit board 11.
- the first process edge 21 is a strip-shaped plate.
- the longitudinal direction of the first process edge 21 is parallel to the length direction of the first side edge 111.
- the first process edge 21 simultaneously fixes the first circuit board 11 and the second circuit board 12 through the first connecting rib 31 and the third connecting rib 33, thereby implementing the first circuit board 11 And splicing with the second circuit board 12.
- the first process side 21 forms protection for the first circuit board 11 and the second circuit board 12 to facilitate the first side 111 of the first circuit board 11 and the second circuit board 12
- the three sides 121 are damaged.
- the first process side 21 may also adopt a plate member having a hardness higher than that of the first circuit board 11 .
- the second process edge 22 is the same as the first process edge 21, except that the second process edge 22 is smaller in length than the first process edge 21, and the second process edge 22 is Only the second side 112 of the first circuit board 11 is protected.
- the second process edge 22 is fixed to the first circuit board 11 by the second connecting rib 32, so that the structure of the first circuit board 11 is more stable.
- the first connecting ribs 31 are strip-shaped.
- the first connecting rib 31 may be made of the same material as the first process edge 21. Specifically, one end of the first connecting rib 31 is connected to the first process side 21, and the other end is connected to the first side edge 111 of the first circuit board 11.
- the first connecting rib 31 may be integrally formed with the first process edge 21 and the first circuit board 11.
- the first circuit board 11, the first process side 21 and the first connecting rib 31 are integrally formed by punching a single piece of the silicone board. Therefore, the first connecting rib 31 is stabilized between the first process edge 21 and the first circuit board 11, so that the overall structure of the circuit board panel 100 is stabilized, and the safety performance of the panel is improved. Small defects and improve the efficiency of the puzzle.
- the second connecting rib 32 and the third connecting rib 33 are configured in the same manner as the first connecting rib 31. It can be understood that, after the circuit board assembly 100 completes the patching process, the first connecting rib 31, the second connecting rib 32, and the third connecting rib 33 are interrupted, so that the first process is performed. The side 21 and the second process side 22 are separated from the first circuit board 11 and separated from the second circuit board 12 such that the first circuit board 11 and the second circuit board 12 can be separated Applied to the terminal.
- a third embodiment is provided. Different from the first embodiment, the number of the first circuit boards 11 is plural, the number of the first connecting ribs 31 and the second connecting ribs 32. The number is all multiple.
- a plurality of the first connecting ribs 31 are fixedly connected to the first process side 21 at the same time, and correspondingly connected to the first side edges 11 of the plurality of first circuit boards 11 respectively.
- a plurality of the second connecting ribs 32 are fixedly connected to the second process side 22 at the same time, and correspondingly connected to the second side edges 112 of the plurality of first circuit boards 11 respectively.
- the number of the second circuit boards 12 is plural, and the number of the third connecting ribs 33 is plural.
- a plurality of the second circuit boards 12 are arranged side by side with each other, and the plurality of the third connecting ribs 33 At the same time, the first process edges 21 are fixedly connected, and the third side edges 121 of the plurality of second circuit boards 12 are respectively fixedly connected.
- a plurality of the first circuit board 11 and a plurality of the second circuit boards 12 are sequentially arranged, a plurality of the first circuit boards 11 are close to each other, and a plurality of the second circuit boards 12 are close to each other.
- a plurality of the first circuit boards 11 are arranged in one area, and a plurality of the second circuit boards 12 are arranged in another area.
- a first splicing rib 113 is fixedly connected between two adjacent first circuit boards 11
- a second splicing rib 123 is fixedly connected between two adjacent second circuit boards 12 .
- the first process side 21 simultaneously protects the plurality of the first circuit board 11 and the plurality of the second circuit boards 12, and the second process side 22 only faces the plurality of the first circuit boards 11 Protection is performed to further improve the stability of the plurality of the first circuit boards 11.
- the circuit board panel 100 can simultaneously patch a plurality of the first circuit boards 11 and the plurality of the second circuit boards 12.
- the length of the second process edge 22 to be less than or equal to half the length of the first process edge 21, the circuit board assembly 100 can be spliced to each other, and the two adjacent circuit boards are adjacent to each other.
- the second process edge 22 of the panel 100 can be flush so that adjacent two of the board panels 100 are closer together, increasing board utilization.
- the first splicing rib 113 and the second splicing rib 123 are disconnected. a plurality of the first circuit board 11 and the plurality of the second circuit boards 12 are separated from each other such that each of the first circuit boards 11 and each of the second circuit boards 12 can be separately applied. In the terminal. In other embodiments, the plurality of the first circuit boards 11 and the plurality of the second circuit boards 12 may also be staggered with each other.
- the process side assembly 20 may further include a plurality of the second process edges 22, and the plurality of the second process edges 22 are opposite to the second side edges 112 of the plurality of the first circuit boards 11 and are isolated from each other. Therefore, when the two adjacent circuit board panels 100 are spliced, the second process edges 22 of the two circuit board panels 100 can be flush with each other.
- the process edge assembly 20 further includes a third process edge 23 fixedly coupled to the first process edge 21 and the second process edge 22, The third process side 23 is disposed relative to the first circuit board 11.
- the connecting rib assembly 30 further includes a fourth connecting rib 34 separated from the first connecting rib 31, the second connecting rib 32 and the third connecting rib 33, and the fourth connecting rib 34 is fixedly connected to the first circuit Plate 11 and said third process edge 23.
- the third process edge 23 and the first process edge 21 are made of the same material, and the third process edge 23 and the first process edge 21 and the second process edge 22 may be integrally formed.
- the third process side 23 together with the first process side 21 and the second process side 22 form an outer frame that protects a peripheral side of the first circuit 11 .
- the fourth connecting ribs 34 are identical in structure to the first connecting ribs 31, and are not described herein again. Similarly, after the first circuit board 11 completes the patch, the fourth connecting rib 34 needs to be disconnected to separate the first circuit board 11 from the third process side 23.
- the process side assembly 20 further includes a fourth process edge 24, the fourth process edge 24 being fixedly coupled to the end of the first process edge 21 away from the third process edge 23. And disposed opposite to the second circuit board 12.
- the connecting rib assembly 30 further includes a fifth connecting rib 35 disposed opposite to the fourth connecting rib 34, the fifth connecting rib 35 being fixedly coupled to the second circuit board 12 and the fourth process side 24 .
- the fourth process edge 24 and the first process edge 21 are made of the same material, and the fourth process edge 24 and the first process edge 21 may be integrally formed.
- the fourth process side 24 and the first process side 21 together form an outer frame that protects a peripheral side of the second circuit 12.
- the fifth connecting rib 35 is configured in the same manner as the first connecting rib 31, and details are not described herein again. Similarly, after the second circuit board 12 completes the patch, the fifth connecting rib 35 needs to be disconnected to separate the second circuit board 12 from the fourth process side 24.
- the circuit board assembly 100 further includes a fixing rib 40 fixedly coupled to the first circuit board 11 and the second circuit board 12.
- the fixing rib 40 and the first connecting rib 31 may have the same structure.
- the fixing rib 40 and the first circuit board 11 and the second circuit board 12 may be integrally formed. Thereby, the stable structure of the circuit board panel 100 is increased. It can be understood that, after the board assembly 100 completes the patching process, the fixing rib 40 is broken, so that the first circuit board 11 and the second circuit board 12 are separated from each other, so that The first circuit board 11 and the second circuit board 12 can be separately applied to the terminal.
- a plurality of the fixing ribs 40 may be connected between the first circuit board 11 and the second circuit board 12.
- the circuit board assembly of the present invention is fixedly connected to the first side of the first circuit board and the third side of the second circuit board by the first process side, and the second process side is fixedly connected
- the second side of the first circuit board further ensures a stable structure of the circuit board.
- the second side is covered by the second process edge, so that the length of the second process side is reduced, that is, the use area of the process side in the circuit board jig is effectively reduced.
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Abstract
一种电路板拼板（100），所述电路板拼板（100）包括电路板组件（10）、工艺边组件（20）和连接筋组件（30）；所述电路板组件（10）包括并排的第一电路板（11）和第二电路板（12），所述第一电路板（11）包括第一侧边（111）和相对所述第一侧边（111）设置的第二侧边（112），所述第二电路板（12）包括与所述第一侧边（111）相平齐的第三侧边（121）；所述工艺边组件（20）包括第一工艺边（21）和相对所述第一工艺边（21）设置的第二工艺边（22），所述第一工艺边（21）与所述第一侧边（111）和所述第三侧边（121）相对设置，所述第二工艺边（22）仅相对所述第二侧边（112）。利用所述第二工艺边（22）仅覆盖所述第二侧边（112），从而使得第二工艺边（22）的长度减少，即有效减少了电路板拼板（100）中工艺边的使用面积，使得电路板在贴片设备上的使用面积增加，即提高了电路板利用率。
Description
本发明要求2016年05月31日递交的发明名称为“电路板拼板”的申请号201610380580.0的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
本发明涉及电子设备领域，尤其涉及一种电路板拼板。
目前手机内的电路板越来越小，而为了提高电路板贴片工艺的效率，通常将多个小的电路板拼在一起进行贴片，多个电路板固定在由工艺边构成的外框内。通常情况下，由多个电路板和工艺边构成的电路板拼板在进行贴片时，需要将多个该电路板拼板阵列排布于贴片设备上，以提高贴片效率。然而由于每一电路板拼板的外侧均存在工艺边，因此多个电路板拼板阵列排布于贴片设备时，工艺边占用贴片设备的很大一部分使用面积，从而导致电路板的使用面积降低。即在贴片设备的有限使用面积下，电路板的排布数量不高，进而导致电路板贴片效率降低，导致电路板利用率不高。
发明内容
有鉴于此，本发明提供一种提高电路板利用率的电路板拼板。
本发明提供一种电路板拼板，其中，所述电路板拼板包括电路板组件和工艺边组件；所述电路板组件包括并排的第一电路板和第二电路板，所述第一电路板包括第一侧边和相对所述第一侧边设置的第二侧边，所述第二电路板包括与所述第一侧边相平齐的第三侧边；所述工艺边组件包括第一工艺边和相对所述第一工艺边设置的第二工艺边，所述第一工艺边固定连接所述第一侧边和所述第三侧边，并覆盖所述第一侧边和所述第三侧边；所述第二工艺边固定连接所述第二侧边，并仅覆盖所述第二侧边。。
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施
方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明提供的第一实施例的电路板拼板的示意图；
图2是本发明提供的第二实施例的电路板拼板的示意图；
图3是本发明提供的第三实施例的电路板拼板的示意图。
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
请参阅图1，本发明提供的一种电路板拼板100，所述电路板拼板100包括电路板组件10、工艺边组件20和连接筋组件30。所述电路板组件10包括并排的第一电路板11和第二电路板12，所述第一电路板11包括第一侧边111和相对所述第一侧边111设置的第二侧边112，所述第二电路板12包括与所述第一侧边111相平齐的第三侧边121。所述工艺边组件20包括第一工艺边21和相对所述第一工艺边21的第二工艺边22，所述第一工艺边21与所述第一侧边111和所述第三侧边121相对设置，并固定连接所述第一侧边111和所述第三侧边121。所述第二工艺边22仅相对所述第二侧边112，且固定连接所述第二侧边112。所述连接筋组件30包括第一连接筋31、第二连接筋32和第三连接筋33，所述第一连接筋连31固定接于所述第一侧边111和所述第一工艺边21，所述第二连接筋32固定连接于所述第二侧边112和所述第二工艺边22，所述第三连接筋33固定连接于所述第三侧边121和所述第一工艺边21。可以理解的是，通过将多个所述电路板拼板100阵列排布于SMT(Surface Mount Technology，表面贴片组装)设备上进行快速贴片，进而实现对多个电路板拼板100同时贴片。所述第一电路板11和第二电路板12均可以单独应用于终端中，该终端可以是手机、平板电脑或者笔记本电脑等。
通过所述第一工艺边21固定连接所述第一电路板11的第一侧边111和所述第二电路板12的第三侧边121，而所述第二工艺边22固定连接所述第一电路板11的第二侧边112，进而保证了电路板拼板100的稳固结构；同时利用所述第二工艺边22仅覆盖第二侧边112，从而使得第二工艺边22的长度减少，
即有效减少了电路板拼板100中工艺边的使用面积。在多个电路板拼板100阵列排布于贴片设备时，可以使得相邻两个所述电路板拼板100靠得更近，从而使得电路板在贴片设备上的使用面积增加，即提高了电路板利用率。
本实施方式中，所述第一电路板11为印刷电路板。所述第一电路板11为硬质矩形板件。所述第一电路板11由依次层叠的基板、铜箔层和覆盖膜构成。所述第一侧边111可以是位于所述第一电路板11宽度方向的侧边。在其他实施方式中，所述第一侧边111也可以是位于所述第一电路板11长度方向的侧边；所述第一电路板11还可以是柔性电路板。
提供一实施例，所述第二电路板12与所述第一电路板11结构相同设置。不同的是，所述第二电路板12的内应力可以大于所述第一电路板11的内应力。从而可以利用所述第一工艺边21和所述第二工艺边22共同对所述第一电路板11进行应力补偿，使得所述第一电路板11不易产生形变。具体的，所述第二电路板12还包括相对所述第三侧边121设置的第四侧边122。所述第四侧边122与所述第二侧边112相平齐，且所述第四侧边122长度大于所述第二侧边112长度。进而在相邻两个所述电路板拼板100排布于贴片设备时，相邻两个所述电路板拼板100的第二工艺边22可以相平齐，使得相邻两个所述电路板拼板100靠得更近，使得所述第一电路板11和所述第二电路板12排布于贴片设备上的使用面积增加，提高了电路板利用率。所述在其他实施方式中，所述第二电路板12也可以是柔性电路板。
请参阅图2，提供第二实施例，与第一实施例大致相同，不同的是所述第四侧边122相对所述第二工艺边22凸出。所述第四侧边122长度小于或等于所述第二侧边112长度，从而相邻两个所述电路板拼板100排布于贴片设备时，相邻两个所述电路板拼板100的第四侧边122可以相互平齐，同样使得两个所述电路板拼板100靠得更近。
请继续参阅图1在第一实施例中，所述第一工艺边21采用与所述第一电路板11相同材质。所述第一工艺边21为条形板件。所述第一工艺边21长度方向平行于所述第一侧边111的长度方向。所述第一工艺边21通过所述第一连接筋31和所述第三连接筋33同时固定住所述第一电路板11和所述第二电路板12，从而实现所述第一电路板11和所述第二电路板12相拼接。同时，
所述第一工艺边21对所述第一电路板11和所述第二电路板12形成保护，方便所述第一电路板11的第一侧边111和所述第二电路板12的第三侧边121损坏。当然，在其他实施方式中，所述第一工艺边21也可以采用硬度比所述第一电路板11硬度大的板件。
本实施例中，所述第二工艺边22与所述第一工艺边21相同，不同的是，所述第二工艺边22长度小于所述第一工艺边21，所述第二工艺边22仅对所述第一电路板11的第二侧边112进行保护。且所述第二工艺边22通过所述第二连接筋32固定住所述第一电路板11，从而使得所述第一电路板11结构更稳固。
本实施方式中，所述第一连接筋31呈条状。所述第一连接筋31可以采用与所述第一工艺边21相同材质。具体的，所述第一连接筋31一端连接于所述第一工艺边21，另一端连接所述第一电路板11的第一侧边111。所述第一连接筋31可以与所述第一工艺边21和所述第一电路板11一体成型。通过对一整块的硅树脂板进行冲裁，从而制成所述第一电路板11、第一工艺边21和第一连接筋31一体设置的拼接板。从而利用所述第一连接筋31稳固于所述第一工艺边21和所述第一电路板11之间，使得所述电路板拼板100的整体结构稳固，提高拼板的安全性能，减小缺陷，并且提高拼板效率。所述第二连接筋32和所述第三连接筋33与所述第一连接筋31结构相同设置。可以理解的是，在所述电路板拼板100完成贴片工艺后，通过打断所述第一连接筋31、第二连接筋32和所述第三连接筋33，使得所述第一工艺边21和所述第二工艺边22与所述第一电路板11分离，以及与所述第二电路板12分离，从而使得所述第一电路板11和所述第二电路板12可以单独应用于终端中。
请参阅图3，提供第三实施例，与第一实施例不同的是，所述第一电路板11的数目为多个，所述第一连接筋31的数目和所述第二连接筋32的数目均为多个。多个所述第一连接筋31同时固定连接所述第一工艺边21，并分别对应固定连接多个所述第一电路板11的第一侧边11。多个所述第二连接筋32同时固定连接所述第二工艺边22，并分别对应固定连接多个所述第一电路板11的第二侧边112。所述第二电路板12的数目为多个，所述第三连接筋33的数目为多个。多个所述第二电路板12相互并排设置，多个所述第三连接筋33
同时固定连接所述第一工艺边21，并分别对应固定连接多个所述第二电路板12的第三侧边121。
具体的，多个所述第一电路板11和多个所述第二电路板12依次排列，多个所述第一电路板11相互靠拢，多个所述第二电路板12相互靠拢。从而多个所述第一电路板11排列于一个区域，多个所述第二电路板12排列于另一区域。相邻两个所述第一电路板11之间固定连接有第一拼接筋113，相邻两个所述第二电路板12之间固定连接有第二拼接筋123。从而多个所述第一电路板11之间结构稳固，多个所述第二电路板12之间结构稳固。所述第一工艺边21同时对多个所述第一电路板11和多个所述第二电路板12进行保护，而所述第二工艺边22仅对多个所述第一电路板11进行保护，以进一步提高多个所述第一电路板11的稳固性。从而使得所述电路板拼板100可以同时对多个所述第一电路板11和多个所述第二电路板12进行贴片。并且，通过设置所述第二工艺边22的长度小于或等于所述第一工艺边21长度的一半，即可以使得所述电路板拼板100在相互拼接时，相邻两个所述电路板拼板100的第二工艺边22可以相平齐，以使得相邻两个所述电路板拼板100靠得更近，增加电路板利用率。可以理解的是，在多个所述第一电路板11和多个所述第二电路板12均完成贴片后，将所述第一拼接筋113和所述第二拼接筋123均断开，以使多个所述第一电路板11和多个所述第二电路板12相互分离，从而使得每一所述第一电路板11和每一所述第二电路板12均可以单独应用于终端中。在其他实施方式中，多个所述第一电路板11和多个所述第二电路板12还可以是相互交错排列。所述工艺边组件20还可以设置多个所述第二工艺边22，多个所述第二工艺边22与多个所述第一电路板11的第二侧边112相对，且相互隔离，从而方便相邻两个所述电路板拼板100拼接时，两个所述电路板拼板100的第二工艺边22可以相互平齐。
进一步地，请继续参阅图1，在第一实施例中，所述工艺边组件20还包括固定连接于所述第一工艺边21和所述第二工艺边22的第三工艺边23，所述第三工艺边23相对所述第一电路板11设置。所述连接筋组件30还包括与第一连接筋31、第二连接筋32和第三连接筋33相分离的第四连接筋34，所述第四连接筋34固定连接于所述第一电路板11和所述第三工艺边23。具体
的，所述第三工艺边23与所述第一工艺边21采用相同材质，所述第三工艺边23与所述第一工艺边21和所述第二工艺边22可以一体成型。所述第三工艺边23与所述第一工艺边21和所述第二工艺边22共同构成保护所述第一电路11部分周侧的外框。从而使得所述第一电路板11的安全性更高，并且保证了所述电路板拼板100的稳固结构。所述第四连接筋34与所述第一连接筋31结构相同设置，在此不再赘述。同样，在所述第一电路板11完成贴片后，需要将所述第四连接筋34断开，以使所述第一电路板11与所述第三工艺边23相分离。
进一步地，在第一实施例中，所述工艺边组件20还包括第四工艺边24，所述第四工艺边24固定连接所述第一工艺边21远离所述第三工艺边23的一端，并相对所述第二电路板12设置。所述连接筋组件30还包括与所述第四连接筋34相对设置的第五连接筋35，所述第五连接筋35固定连接于所述第二电路板12和所述第四工艺边24。具体的，所述第四工艺边24与所述第一工艺边21采用相同材质，所述第四工艺边24与所述第一工艺边21可以一体成型。所述第四工艺边24和所述第一工艺边21共同构成保护所述第二电路12部分周侧的外框。从而使得所述第二电路板12的安全性更高，并且保证了所述电路板拼板100的稳固结构。所述第五连接筋35与所述第一连接筋31结构相同设置，在此不再赘述。同样，在所述第二电路板12完成贴片后，需要将所述第五连接筋35断开，以使所述第二电路板12与所述第四工艺边24相分离。
进一步地，在第一实施例中，所述电路板拼板100还包括固定筋40，所述固定筋40固定连接于所述第一电路板11和所述第二电路板12。所述固定筋40与所述第一连接筋31可以采用相同结构。所述固定筋40与所述第一电路板11和所述第二电路板12可以一体成型。从而增加所述电路板拼板100的稳固结构。可以理解的是，在所述电路板拼板100完成贴片工艺后，对所述固定筋40打断，从而使得所述第一电路板11与所述第二电路板12相互分离，使得所述第一电路板11和所述第二电路板12可以单独应用于终端中。在其他实施方式中，所述第一电路板11和所述第二电路板12之间还可以连接多个所述固定筋40。
本发明的电路板拼板，通过所述第一工艺边固定连接所述第一电路板的第一侧边和所述第二电路板的第三侧边，而所述第二工艺边固定连接所述第一电路板的第二侧边，进而保证了电路板拼板的稳固结构。同时利用所述第二工艺边仅覆盖所述第二侧边，从而使得第二工艺边的长度减少，即有效减少了电路板拼板中工艺边的使用面积。在多个电路板拼板阵列排布于贴片设备时，可以使得相邻两个所述电路板拼板靠得更近，从而使得电路板在贴片设备上的使用面积增加，即提高了电路板利用率。
以上是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。
Claims (20)
- 一种电路板拼板，其特征在于，所述电路板拼板包括电路板组件和工艺边组件；所述电路板组件包括并排的第一电路板和第二电路板，所述第一电路板包括第一侧边和相对所述第一侧边设置的第二侧边，所述第二电路板包括与所述第一侧边相平齐的第三侧边；所述工艺边组件包括第一工艺边和相对所述第一工艺边设置的第二工艺边，所述第一工艺边固定连接所述第一侧边和所述第三侧边，并覆盖所述第一侧边和所述第三侧边；所述第二工艺边固定连接所述第二侧边，并仅覆盖所述第二侧边。
- 根据权利要求1所述的电路板拼板，其特征在于，所述电路板拼板还包括连接筋组件，所述连接筋组件包括第一连接筋，所述第一连接筋连固定接于所述第一侧边和所述第一工艺边。
- 根据权利要求2所述的电路板拼板，其特征在于，所述第一电路板的数目为多个，所述第一连接筋的数目为多个，多个所述第一连接筋同时固定连接所述第一工艺边，并分别对应固定连接多个所述第一电路板的第一侧边。
- 根据权利要求3所述的电路板拼板，其特征在于，多个所述第一电路板相互并排设置。
- 根据权利要求4所述的电路板拼板，其特征在于，相邻两个所述第一电路板之间固定连接有第一拼接筋。
- 根据权利要求1所述的电路板拼板，其特征在于，所述连接筋组件还包括第二连接筋，所述第二连接筋固定连接于所述第二侧边和所述第二工艺边。
- 根据权利要求5所述的电路板拼板，其特征在于，所述第一电路板的数目为多个，所述第二连接筋的数目为多个，多个所述第一电路板相互并排设置，多个所述第二连接筋同时固定连接所述第二工艺边，并分别对应固定连接多个所述第一电路板的第二侧边。
- 根据权利要求1所述的电路板拼板，其特征在于，所述连接筋组件还包括第三连接筋，所述第三连接筋固定连接于所述第三侧边和所述第一工艺边。
- 根据权利要求8所述的电路板拼板，其特征在于，所述第二电路板的数目为多个，所述第三连接筋的数目为多个，多个所述第三连接筋同时固定连接所述第一工艺边，并分别对应固定连接多个所述第二电路板的第三侧边。
- 根据权利要求9所述的电路板拼板，其特征在于，多个所述第二电路板相互并排设置。
- 根据权利要求10所述的电路板拼板，其特征在于，相邻两个所述第二电路板之间固定连接有第二拼接筋。
- 根据权利要求1～11任意一项所述的电路板拼板，其特征在于，所述第一电路板的内应力小于所述第二电路板的内应力。
- 根据权利要求1～11任意一项所述的电路板拼板，其特征在于，所述工艺边组件还包括固定连接于所述第一工艺边和所述第二工艺边的第三工艺边，所述第三工艺边相对所述第一电路板设置。
- 根据权利要求13所述的电路板拼板，其特征在于，所述连接筋组件包括第四连接筋，所述第四连接筋固定连接于所述第一电路板和所述第三工艺边。
- 根据权利要求13所述的电路板拼板，其特征在于，所述工艺边组件还包括第四工艺边，所述第四工艺边固定连接所述第一工艺边远离所述第三工艺边的一端，并相对所述第二电路板设置。
- 根据权利要求15所述的电路板拼板，其特征在于，所述连接筋组件包括第五连接筋，所述第五连接筋固定连接于所述第二电路板和所述第四工艺边。
- 根据权利要求1～11任意一项所述的电路板拼板，其特征在于，所述电路板拼板还包括固定筋，所述固定筋固定连接于所述第一电路板和所述第二电路板。
- 根据权利要求17所述的电路板拼板，其特征在于，所述固定筋与所述第一电路板和所述第二电路板一体成型。
- 根据权利要求1～11任意一项所述的电路板拼板，其特征在于，所述第一工艺边长度方向平行于所述第一侧边的长度方向。
- 根据权利要求1～11任意一项所述的电路板拼板，其特征在于，所述第二工艺边长度方向平行于所述第二侧边的长度方向。
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| CN109095434B (zh) * | 2018-07-09 | 2021-02-02 | 无锡韦尔半导体有限公司 | 传感器结构件及其制造方法 |
| CN111356288A (zh) * | 2020-03-16 | 2020-06-30 | 苏州市吴通智能电子有限公司 | 一种pcb板的拼板结构 |
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| CN103068160A (zh) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | 一种拼合式电路板 |
| CN205051977U (zh) * | 2015-10-16 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | 一种防止板弯板翘的pcb拼板 |
| CN105960096A (zh) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | 电路板拼板 |
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| CN204906452U (zh) * | 2015-08-24 | 2015-12-23 | 深圳市世纪天元通讯技术有限公司 | 一种手机主板的连接结构 |
| CN105578756A (zh) * | 2016-02-26 | 2016-05-11 | 广东欧珀移动通信有限公司 | 印制板 |
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| US5864463A (en) * | 1992-11-13 | 1999-01-26 | Seiko Epson Corporation | Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| CN103068160A (zh) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | 一种拼合式电路板 |
| CN205051977U (zh) * | 2015-10-16 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | 一种防止板弯板翘的pcb拼板 |
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