WO2017206220A1 - 柔性电路板的制作方法 - Google Patents

柔性电路板的制作方法 Download PDF

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Publication number
WO2017206220A1
WO2017206220A1 PCT/CN2016/086850 CN2016086850W WO2017206220A1 WO 2017206220 A1 WO2017206220 A1 WO 2017206220A1 CN 2016086850 W CN2016086850 W CN 2016086850W WO 2017206220 A1 WO2017206220 A1 WO 2017206220A1
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WIPO (PCT)
Prior art keywords
flexible
layer
printed circuit
circuit board
electromagnetic interference
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Ceased
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PCT/CN2016/086850
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English (en)
French (fr)
Inventor
陈娟
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/128,105 priority Critical patent/US10356910B2/en
Publication of WO2017206220A1 publication Critical patent/WO2017206220A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method of fabricating a flexible circuit board.
  • LCDs liquid crystal displays
  • Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become mainstream in display devices.
  • liquid crystal display devices which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is to place liquid crystal molecules in two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates, and the liquid crystal molecules are controlled to change direction by energizing or not, and the light of the backlight module is changed. Refracted to produce a picture.
  • FIG. 1 is a schematic structural diagram of an existing electronic product with a liquid crystal display, comprising: a liquid crystal display 1 and a flexible printed circuit 3 (FPC) electrically connected to the liquid crystal display. And a system main board (not shown) electrically connected to the flexible circuit board 3, wherein the liquid crystal display 1 and the flexible circuit board 3 are electrically connected by a gold finger 2, and the flexible circuit board 3 and the system main board They are electrically connected through the connector 4.
  • FPC flexible printed circuit 3
  • FIG. 2 is a schematic structural diagram of an existing FPC with anti-electromagnetic interference structure, including: The first EMI layer 10, the first polyimide (PI) layer 20, the first adhesive layer 30, the first copper metal layer 40, the substrate 50, and the second copper metal layer 60 are sequentially stacked.
  • EMI Electromagnetic Interference
  • a second adhesive layer 70, a second PI layer 80, and a second EMI layer 90 wherein the first EMI layer 10 and the second EMI layer 90 are both conductive layers, the first PI layer 20 and the second PI layer 80 is an insulating layer, which is fabricated by solid-state bonding, since the solid first EMI layer 10, the second EMI layer 90, the first PI layer 20, and the second PI layer 80 are attached before being attached.
  • the thickness is fixed and immutable, and it is also necessary to add a first adhesive layer 30 and a second 70 knot glue bonding, resulting in high overall thickness of the FPC can not meet the demand for high-limit overall high demand of customers, electronic products do not meet today The trend of thinning products.
  • the present invention provides a method of fabricating a flexible circuit board, comprising the following steps:
  • Step 1 providing a flexible substrate, forming a printed circuit on at least one side surface of the flexible substrate;
  • Step 2 coating a liquefied flexible insulating material on the printed circuit, curing the liquefied flexible insulating material to form a flexible insulating layer covering the printed circuit;
  • Step 3 coating a liquefied metal material on the flexible insulating layer, and curing the liquefied metal material to form an anti-electromagnetic interference layer;
  • the thickness of the anti-electromagnetic interference layer is controlled by coating to be less than 18 microns.
  • a printed circuit is formed on both sides of the flexible substrate, each printed circuit includes a conductive layer, and in the step 2, a flexible insulating layer is formed on the conductive layers in the two printed circuits. In step 3, an anti-electromagnetic interference layer is formed on both flexible insulating layers.
  • a printed circuit is formed on both sides of the flexible substrate, each printed circuit includes a plurality of layers of conductive layers, and an insulating protective layer is disposed between the adjacent two conductive layers, and each insulating protection is provided.
  • a layer of adhesive layer is disposed on a side of the layer adjacent to the flexible substrate, and a flexible insulating layer is formed on the conductive layer farthest from the flexible substrate in the two printed circuits in the step 2, in the step 3
  • An electromagnetic interference prevention layer is formed on both flexible insulating layers.
  • a printed circuit is formed on one side surface of the flexible substrate, the printed circuit includes a conductive layer, and a flexible insulating layer is formed on the conductive layer in the printed circuit in the step 2, the step 3 An anti-electromagnetic interference layer is formed on the flexible insulating layer.
  • a printed circuit is formed on one side surface of the flexible substrate, the printed circuit includes a plurality of layers of conductive layers, and an insulating protective layer is disposed between the adjacent two conductive layers, and each insulating protective layer is adjacent to each other.
  • One side of the flexible substrate is provided with a layer of adhesive layer, and in step 2, a flexible insulating layer is formed on the conductive layer farthest from the flexible substrate in the printed circuit, and the flexibility is performed in the step 3
  • An anti-electromagnetic interference layer is formed on the insulating layer.
  • the flexible insulating material liquefied in the step 2 is a liquid PI or a liquid PET.
  • the metal material liquefied in the step 3 is liquid aluminum or liquid silver.
  • the thickness of the flexible insulating layer in the step 2 is 4 to 6 micrometers.
  • the thickness of the anti-electromagnetic interference layer in the step 3 is 8 to 12 micrometers.
  • the liquefied flexible insulating material is coated by a doctor blade, and the liquefied metal material is coated by a doctor blade in the step 3.
  • the invention also provides a method for manufacturing a flexible circuit board, comprising the following steps:
  • Step 1 providing a flexible substrate, forming a printed circuit on at least one side surface of the flexible substrate;
  • Step 2 coating a liquefied flexible insulating material on the printed circuit, curing the liquefied flexible insulating material to form a flexible insulating layer covering the printed circuit;
  • Step 3 coating a liquefied metal material on the flexible insulating layer, and curing the liquefied metal material to form an anti-electromagnetic interference layer;
  • Controlling the thickness of the anti-electromagnetic interference layer by coating to be less than 18 microns
  • the flexible insulating material liquefied in the step 2 is a liquid PI or a liquid PET;
  • the metal material liquefied in the step 3 is liquid aluminum or liquid silver
  • the thickness of the flexible insulating layer in the step 2 is 4 to 6 microns
  • the thickness of the anti-electromagnetic interference layer in the step 3 is 8 to 12 micrometers.
  • the present invention provides a method for fabricating a flexible circuit board, which is formed by liquefying a flexible insulating material and a metal material, and respectively forming a flexible insulating layer resistant to electromagnetic interference structures by liquid coating and then curing.
  • the anti-electromagnetic interference layer can reduce the thickness of the adhesive layer and realize the controllable thickness of the flexible insulating layer and the anti-electromagnetic interference layer, reduce the thickness and material consumption of the flexible insulating layer and the anti-electromagnetic interference layer, reduce the production cost, and reduce the The thickness of the flexible circuit board with anti-electromagnetic interference structure improves product quality.
  • FIG. 1 is a schematic structural view of an existing electronic product with a liquid crystal display
  • FIG. 2 is a schematic structural view of a conventional flexible circuit board with an anti-electromagnetic interference structure
  • FIG. 3 is a schematic view showing a first embodiment of a method of fabricating a flexible circuit board of the present invention
  • FIG. 4 is a schematic view showing a second embodiment of a method of fabricating a flexible circuit board according to the present invention.
  • FIG. 5 is a schematic view showing a third embodiment of a method of fabricating a flexible circuit board according to the present invention.
  • FIG. 6 is a schematic view showing a fourth embodiment of a method of fabricating a flexible circuit board of the present invention.
  • FIG. 7 is a flow chart of a method of fabricating a flexible circuit board of the present invention.
  • the present invention provides a method for fabricating a flexible circuit board, including the following steps:
  • Step 1 A flexible substrate 101 is provided, and a printed circuit is formed on at least one side surface of the flexible substrate 101.
  • Step 2 coating a liquefied flexible insulating material on the printed circuit, curing the liquefied flexible insulating material to form a flexible insulating layer 103 covering the printed circuit, and controlling thickness of the flexible insulating layer 103 by coating Less than 10 microns.
  • the liquefied flexible insulating material is liquid polyimide (Polyimide, PI), or liquid polyethylene terephthalate (PET).
  • the liquefied flexible insulating material is coated in a stepwise manner in the step 2, so as to better control the thickness of the coated liquefied flexible insulating material and the thickness of the formed flexible insulating layer 103, specifically including First stirring and mating the liquefied flexible insulating material, then extracting the flexible substrate 101 formed with the printed circuit from the flexible circuit board roll, and coating the liquefied flexible insulating material on the printed circuit, and then The flexible substrate 101 coated with the liquefied flexible insulating material is dried and solidified to form a flexible insulating layer 103, and then the flexible substrate 101 on which the flexible insulating layer 103 is formed is re-rolled, and transferred to the next process station, that is, the roll is used.
  • the way to roll Roll to Roll
  • the thickness of the flexible insulating layer 103 is usually greater than 1 micrometer.
  • the thickness of the flexible insulating layer 103 in the step 2 is 4 to 6 micrometers.
  • Step 3 Applying a liquefied metal material on the flexible insulating layer 103, curing the liquefied metal material to form an anti-electromagnetic interference layer 104, and controlling the thickness of the anti-electromagnetic interference layer 104 to less than 18 micrometers by coating.
  • the metal material liquefied in the step 3 is liquid aluminum or liquid silver.
  • the liquefied metal material is coated in a stepwise manner in the step 3, so as to better control the thickness of the coated liquefied metal material and the thickness of the anti-electromagnetic interference layer 104 formed, including: First stirring and mating the liquefied metal material, and then extracting the flexible substrate 101 formed with the flexible insulating layer 103 from the flexible circuit board roll (the flexible circuit board roll is the flexible circuit board roll after the rewinding in step 2), And coating the liquefied metal material on the flexible insulating layer 103 on the flexible substrate 101, and then drying and curing the flexible circuit board coated with the liquefied metal material to form an anti-electromagnetic interference layer 104, and then The roll is formed with the anti-electromagnetic interference layer 104 Flexible substrate 101.
  • the thickness of the anti-electromagnetic interference layer 104 is generally greater than 2 micrometers.
  • the manufacturing method of the flexible circuit board is applicable to the fabrication of a double-sided single-layer flexible circuit board, a double-sided multilayer flexible circuit board, a single-sided single-layer flexible circuit board, or a single-sided multilayer flexible circuit board.
  • the flexible circuit board is a double-sided single-layer flexible circuit board, that is, a printed circuit is formed on both sides of the flexible substrate 101.
  • Each of the printed circuits includes a conductive layer 1021.
  • a flexible insulating layer 103 is formed on the conductive layer 1021 in the two printed circuits in the step 2, and the step 3 is performed on the two flexible insulating layers 103.
  • An anti-electromagnetic interference layer 104 is formed.
  • the material of the conductive layer 1021 is copper, or gold, specifically copper foil or gold foil, so that the conductive layer 1021 has flexibility.
  • the flexible circuit board is a double-sided multilayer flexible circuit board, that is, a printed circuit is formed on both sides of the flexible substrate 101.
  • Each of the printed circuits includes a plurality of layers of conductive layers 1021, and an insulating protective layer 1022 is disposed between adjacent conductive layers 1021.
  • Each insulating protective layer 1022 is provided with a layer adjacent to one side of the flexible substrate 101.
  • the adhesive layer 1023, in the step 2, a flexible insulating layer 103 is formed on the conductive layer 1021 farthest from the flexible substrate 101 in the two printed circuits, and the step 3 is formed on both flexible insulating layers 103.
  • Anti-electromagnetic interference layer 104 Preferably, the material of the conductive layer 1021 is copper, or gold, specifically copper foil or gold foil, so that the conductive layer 1021 has flexibility.
  • the material of the insulating protective layer 1022 is preferably PI.
  • the flexible circuit board is a single-sided single-layer flexible circuit board, that is, a printed circuit is formed only on one side surface of the flexible substrate 101.
  • the printed circuit also includes only one conductive layer 1021.
  • a flexible insulating layer 103 is formed on the conductive layer 1021 in the printed circuit.
  • anti-electromagnetic interference is formed on the flexible insulating layer 103.
  • Layer 104 Preferably, the material of the conductive layer 1021 is copper, or gold, specifically copper foil or gold foil, so that the conductive layer 1021 has flexibility.
  • the flexible circuit board is a single-sided multilayer flexible circuit board, that is, a printed circuit is formed only on one side surface of the flexible substrate 101.
  • the printed circuit includes a plurality of layers of conductive layers 1021, and an insulating protective layer 1022 is disposed between adjacent conductive layers 1021.
  • Each insulating protective layer 1022 is provided with a layer of adhesive on a side of the flexible substrate 101.
  • a flexible insulating layer 103 is formed on the conductive layer 1021 farthest from the flexible substrate 101 in the printed circuit, and in the step 3, anti-electromagnetic interference is formed on the flexible insulating layer 103.
  • Layer 104 Preferably, the material of the conductive layer 1021 is copper, or gold, specifically copper foil or gold foil, so that the conductive layer 1021 has flexibility.
  • the material of the insulating protective layer 1022 is preferably PI.
  • the present invention provides a method for fabricating a flexible circuit board, which comprises forming a flexible insulating layer and an anti-electromagnetic interference structure by liquefying a flexible insulating material and a metal material, and adopting a liquid coating and re-solidification method.
  • the electromagnetic interference layer can reduce a layer of adhesive layer and realize the controllable thickness of the flexible insulating layer and the anti-electromagnetic interference layer, reduce the thickness and material consumption of the flexible insulating layer and the anti-electromagnetic interference layer, reduce the production cost, and reduce the resistance
  • the thickness of the flexible circuit board of the electromagnetic interference structure improves product quality.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种柔性电路板的制作方法，通过将柔性绝缘材料和金属材料液化，并采用先液态涂布再固化的方法分别形成抗电磁干扰结构的柔性绝缘层（103）和防电磁干扰层（104），能够减少一层粘结胶层并实现柔性绝缘层（103）和防电磁干扰层（104）的厚度可控，减少柔性绝缘层（103）和防电磁干扰层（104）的厚度和材料消耗，减少生产成本，降低带有抗电磁干扰结构的柔性电路板的厚度，提升产品品质。

Description

柔性电路板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性电路板的制作方法。
背景技术
随着显示技术的发展，液晶显示器(Liquid Crystal Display，LCD)等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
现有市场上的液晶显示装置大部分为背光型液晶显示器，其包括液晶显示面板及背光模组(backlight module)。液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，两片玻璃基板中间有许多垂直和水平的细小电线，通过通电与否来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。
请参阅图1，图1为一种现有的带有液晶显示器的电子产品的结构示意图，包括：液晶显示器1、与所述液晶显示器电性连接的柔性电路板3(Flexible Printed Circuit，FPC)、以及与所述柔性电路板3电性连接的系统主板(未图示)，其中所述液晶显示器1与柔性电路板3之间通过金手指2电性连接，柔性电路板3与系统主板之间通过连接器4电性连接。
随着智能科技的发展，信号的传输速率和频率越来越高，信号相互间的干扰也越来越大，为防止相互干扰，现在大部分电子产品都会在FPC表面再贴覆一层抗电磁干扰(Electromagnetic Interference，EMI)膜，从而保证了高速高频信号的质量，具体地，请参阅图2，图2为一种现有的具有抗电磁干扰结构的FPC的结构示意图，包括：自下而上依次层叠设置的第一EMI层10、第一聚酰亚胺(Polyimide，PI)层20、第一粘结胶层30、第一铜金属层40、基板50、第二铜金属层60、第二粘结胶层70、第二PI层80、以及第二EMI层90，其中，第一EMI层10和第二EMI层90均为导电层，第一PI层20与第二PI层80均为绝缘层，在制作时均采用固态贴附的方式制作，由于固态的第一EMI层10、第二EMI层90、第一PI层20、及第二PI层80在贴附之前就已经成形，厚度为固定不可变的，且还需要增设第一粘结胶层30和第二粘结胶层70进行粘结，最终导致整个FPC的厚度的过高，无法满足对整体限高要求比较高的客户的需求，也不适应如今电子产 品薄型化的趋势。
发明内容
本发明的目的在于提供一种柔性电路板的制作方法，能够减小具有抗电磁干扰结构的FPC厚度，降低生产成本。
为实现上述目的，本发明提供了一种柔性电路板的制作方法，包括如下步骤：
步骤1、提供一柔性基板，在所述柔性基板至少一侧表面上形成印刷电路；
步骤2、在所述印刷电路上涂布液化的柔性绝缘材料，将所述液化的柔性绝缘材料固化形成覆盖所述印刷电路的柔性绝缘层；
通过涂布控制所述柔性绝缘层的厚度小于10微米；
步骤3、在所述柔性绝缘层上涂布液化的金属材料，将所述液化的金属材料固化形成防电磁干扰层；
通过涂布控制所述防电磁干扰层的厚度小于18微米。
所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括一层导电层，所述步骤2中在两印刷电路中的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在两印刷电路中距离所述柔性基板最远的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括一层导电层，所述步骤2中在该印刷电路中的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在该印刷电路中距离所述柔性基板最远的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
所述步骤2中液化的柔性绝缘材料为液态PI、或液态PET。
所述步骤3中液化的金属材料为液态铝、或液态银。
所述步骤2中柔性绝缘层的厚度为4至6微米。
所述步骤3中防电磁干扰层的厚度为8至12微米。
所述步骤2中采用刮涂的方式涂布所述液化的柔性绝缘材料，所述步骤3中采用刮涂的方式涂布所述液化的金属材料。
本发明还提供一种柔性电路板的制作方法，包括如下步骤：
步骤1、提供一柔性基板，在所述柔性基板至少一侧表面上形成印刷电路；
步骤2、在所述印刷电路上涂布液化的柔性绝缘材料，将所述液化的柔性绝缘材料固化形成覆盖所述印刷电路的柔性绝缘层；
通过涂布控制所述柔性绝缘层的厚度小于10微米；
步骤3、在所述柔性绝缘层上涂布液化的金属材料，将所述液化的金属材料固化形成防电磁干扰层；
通过涂布控制所述防电磁干扰层的厚度小于18微米；
其中，所述步骤2中液化的柔性绝缘材料为液态PI、或液态PET；
其中，所述步骤3中液化的金属材料为液态铝、或液态银；
其中，所述步骤2中柔性绝缘层的厚度为4至6微米；
其中，所述步骤3中防电磁干扰层的厚度为8至12微米。
本发明的有益效果：本发明提供了一种柔性电路板的制作方法，通过将柔性绝缘材料和金属材料液化，并采用先液态涂布再固化的方法分别形成抗电磁干扰结构的柔性绝缘层和防电磁干扰层，能够减少一层粘结胶层并实现柔性绝缘层和防电磁干扰层的厚度可控，减少柔性绝缘层和防电磁干扰层的厚度和材料消耗，减少生产成本，降低带有抗电磁干扰结构的柔性电路板的厚度，提升产品品质。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的一种带有液晶显示器的电子产品的结构示意图；
图2为现有的一种带有抗电磁干扰结构的柔性电路板的结构示意图；
图3为本发明的柔性电路板的制作方法的第一实施例的示意图；
图4为本发明的柔性电路板的制作方法的第二实施例的示意图；
图5为本发明的柔性电路板的制作方法的第三实施例的示意图；
图6为本发明的柔性电路板的制作方法的第四实施例的示意图；
图7为本发明的柔性电路板的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图7，本发明提供一种柔性电路板的制作方法，包括如下步骤：
步骤1、提供一柔性基板101，在所述柔性基板101至少一侧表面上形成印刷电路。
步骤2、在所述印刷电路上涂布液化的柔性绝缘材料，将所述液化的柔性绝缘材料固化形成覆盖所述印刷电路的柔性绝缘层103，通过涂布控制所述柔性绝缘层103的厚度小于10微米。
优选地，所述液化的柔性绝缘材料为液态聚酰亚胺(Polyimide，PI)、或液态聚对苯二甲酸乙二醇酯(Polyethylene terephthalate，PET)。具体地，所述步骤2中采用刮涂的方式涂布所述液化的柔性绝缘材料，从而更好的控制涂布的液化的柔性绝缘材料的厚度和形成的柔性绝缘层103的厚度，具体包括：首先搅拌和配合所述液化的柔性绝缘材料，接着从柔性电路板卷上抽出形成有印刷电路的柔性基板101，并在所述印刷电路上刮涂所述液化的柔性绝缘材料，接着对所述涂布有液化的柔性绝缘材料的柔性基板101进行干燥固化形成柔性绝缘层103，接着复卷形成有所述柔性绝缘层103的柔性基板101，并移送下一制程当站，也即采用卷对卷(Roll to Roll)的方式进行制作。
进一步地，所述柔性绝缘层103的厚度通常大于1微米，优选地，所述步骤2中柔性绝缘层103的厚度为4至6微米。
步骤3、在所述柔性绝缘层103上涂布液化的金属材料，将所述液化的金属材料固化形成防电磁干扰层104，通过涂布控制所述防电磁干扰层104的厚度小于18微米。
优选地，所述步骤3中液化的金属材料为液态铝、或液态银。具体地，所述步骤3中采用刮涂的方式涂布所述液化的金属材料，从而更好的控制涂布的液化的金属材料的厚度和形成的防电磁干扰层104的厚度，具体包括：首先搅拌和配合所述液化的金属材料，接着从柔性电路板卷(该柔性电路板卷即为步骤2中复卷后的柔性电路板卷)上抽出形成有柔性绝缘层103的柔性基板101，并在所述柔性基板101上的柔性绝缘层103上刮涂所述液化的金属材料，接着对所述涂布有液化的金属材料的柔性电路板进行干燥固化形成防电磁干扰层104，接着复卷形成有所述防电磁干扰层104的 柔性基板101。进一步地，所述防电磁干扰层104的厚度通常大于2微米，优选地，所述防电磁干扰层104的厚度为8至12微米。
具体地，所述柔性电路板的制作方法适用于双面单层柔性电路板、双面多层柔性电路板、单面单层柔性电路板、或单面多层柔性电路板的制作。
具体地，请参阅图3，在本发明的第一实施例中，所述柔性电路板为双面单层柔性电路板，也即在所述柔性基板101的两侧表面上均形成印刷电路，每一印刷电路均包括一层导电层1021，相应地，所述步骤2中在两印刷电路中的导电层1021上均形成柔性绝缘层103，所述步骤3中在两柔性绝缘层103上均形成防电磁干扰层104。优选地，所述导电层1021的材料为铜、或金，具体为铜箔或金箔，从而使得导电层1021具有柔性。
具体地，请参阅图4，在本发明的第二实施例中，所述柔性电路板为双面多层柔性电路板，也即在所述柔性基板101的两侧表面上均形成印刷电路，每一印刷电路均包括多层层叠设置的导电层1021，相邻的两导电层1021之间设有绝缘保护层1022，每一绝缘保护层1022靠近所述柔性基板101的一侧均设有一层粘结胶层1023，所述步骤2中在两印刷电路中距离所述柔性基板101最远的导电层1021上均形成柔性绝缘层103，所述步骤3中在两柔性绝缘层103上均形成防电磁干扰层104。优选地，所述导电层1021的材料为铜、或金，具体为铜箔或金箔，从而使得导电层1021具有柔性。所述绝缘保护层1022的材料优选PI。
具体地，请参阅图5，在本发明的第三实施例中，所述柔性电路板为单面单层柔性电路板，也即仅在所述柔性基板101的一侧表面上形成印刷电路，所述印刷电路也只包括一层导电层1021，所述步骤2中在该印刷电路中的导电层1021上形成柔性绝缘层103，所述步骤3中在该柔性绝缘层103上形成防电磁干扰层104。优选地，所述导电层1021的材料为铜、或金，具体为铜箔或金箔，从而使得导电层1021具有柔性。
具体地，请参阅图6，在本发明的第四实施例中，所述柔性电路板为单面多层柔性电路板，也即仅在所述柔性基板101的一侧表面上形成印刷电路，所述印刷电路包括多层层叠设置的导电层1021，相邻的两导电层1021之间设有绝缘保护层1022，每一绝缘保护层1022靠近所述柔性基板101的一侧均设有一层粘结胶层1023，所述步骤2中在该印刷电路中距离所述柔性基板101最远的导电层1021上形成柔性绝缘层103，所述步骤3中在该柔性绝缘层103上形成防电磁干扰层104。优选地，所述导电层1021的材料为铜、或金，具体为铜箔或金箔，从而使得导电层1021具有柔性。所述绝缘保护层1022的材料优选PI。
综上所述，本发明提供了一种柔性电路板的制作方法，通过将柔性绝缘材料和金属材料液化，并采用先液态涂布再固化的方法分别形成抗电磁干扰结构的柔性绝缘层和防电磁干扰层，能够减少一层粘结胶层并实现柔性绝缘层和防电磁干扰层的厚度可控，减少柔性绝缘层和防电磁干扰层的厚度和材料消耗，减少生产成本，降低带有抗电磁干扰结构的柔性电路板的厚度，提升产品品质。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (16)

  1. 一种柔性电路板的制作方法，包括如下步骤：
    步骤1、提供一柔性基板，在所述柔性基板至少一侧表面上形成印刷电路；
    步骤2、在所述印刷电路上涂布液化的柔性绝缘材料，将所述液化的柔性绝缘材料固化形成覆盖所述印刷电路的柔性绝缘层；
    通过涂布控制所述柔性绝缘层的厚度小于10微米；
    步骤3、在所述柔性绝缘层上涂布液化的金属材料，将所述液化的金属材料固化形成防电磁干扰层；
    通过涂布控制所述防电磁干扰层的厚度小于18微米。
  2. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括一层导电层，所述步骤2中在两印刷电路中的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
  3. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在两印刷电路中距离所述柔性基板最远的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
  4. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括一层导电层，所述步骤2中在该印刷电路中的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
  5. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在该印刷电路中距离所述柔性基板最远的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
  6. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤2中液化的柔性绝缘材料为液态PI、或液态PET。
  7. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤3中液化的金属材料为液态铝、或液态银。
  8. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤2中柔性绝缘层的厚度为4至6微米。
  9. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤3中防电磁干扰层的厚度为8至12微米。
  10. 如权利要求1所述的柔性电路板的制作方法，其中，所述步骤2中采用刮涂的方式涂布所述液化的柔性绝缘材料，所述步骤3中采用刮涂的方式涂布所述液化的金属材料。
  11. 一种柔性电路板的制作方法，包括如下步骤：
    步骤1、提供一柔性基板，在所述柔性基板至少一侧表面上形成印刷电路；
    步骤2、在所述印刷电路上涂布液化的柔性绝缘材料，将所述液化的柔性绝缘材料固化形成覆盖所述印刷电路的柔性绝缘层；
    通过涂布控制所述柔性绝缘层的厚度小于10微米；
    步骤3、在所述柔性绝缘层上涂布液化的金属材料，将所述液化的金属材料固化形成防电磁干扰层；
    通过涂布控制所述防电磁干扰层的厚度小于18微米；
    其中，所述步骤2中液化的柔性绝缘材料为液态PI、或液态PET；
    其中，所述步骤3中液化的金属材料为液态铝、或液态银；
    其中，所述步骤2中柔性绝缘层的厚度为4至6微米；
    其中，所述步骤3中防电磁干扰层的厚度为8至12微米。
  12. 如权利要求11所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括一层导电层，所述步骤2中在两印刷电路中的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
  13. 如权利要求11所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的两侧表面上均形成印刷电路，每一印刷电路均包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在两印刷电路中距离所述柔性基板最远的导电层上均形成柔性绝缘层，所述步骤3中在两柔性绝缘层上均形成防电磁干扰层。
  14. 如权利要求11所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括一层导电层， 所述步骤2中在该印刷电路中的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
  15. 如权利要求11所述的柔性电路板的制作方法，其中，所述步骤1中在柔性基板的一侧表面上形成印刷电路，所述印刷电路包括多层层叠设置的导电层，相邻的两导电层之间设有绝缘保护层，每一绝缘保护层靠近所述柔性基板的一侧均设有一层粘结胶层，所述步骤2中在该印刷电路中距离所述柔性基板最远的导电层上形成柔性绝缘层，所述步骤3中在该柔性绝缘层上形成防电磁干扰层。
  16. 如权利要求11所述的柔性电路板的制作方法，其中，所述步骤2中采用刮涂的方式涂布所述液化的柔性绝缘材料，所述步骤3中采用刮涂的方式涂布所述液化的金属材料。
PCT/CN2016/086850 2016-06-03 2016-06-23 柔性电路板的制作方法 Ceased WO2017206220A1 (zh)

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