WO2017203795A1 - 気密パッケージ及び気密パッケージの製造方法 - Google Patents

気密パッケージ及び気密パッケージの製造方法 Download PDF

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Publication number
WO2017203795A1
WO2017203795A1 PCT/JP2017/009641 JP2017009641W WO2017203795A1 WO 2017203795 A1 WO2017203795 A1 WO 2017203795A1 JP 2017009641 W JP2017009641 W JP 2017009641W WO 2017203795 A1 WO2017203795 A1 WO 2017203795A1
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WO
WIPO (PCT)
Prior art keywords
container
sealing material
side wall
airtight package
oxide layer
Prior art date
Application number
PCT/JP2017/009641
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English (en)
French (fr)
Japanese (ja)
Inventor
岡　卓司
徹 白神
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2018519107A priority Critical patent/JPWO2017203795A1/ja
Publication of WO2017203795A1 publication Critical patent/WO2017203795A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Definitions

  • the present invention relates to an airtight package for mounting and sealing an element and a method for manufacturing the airtight package.
  • an airtight package is used for mounting and sealing an element such as an LED.
  • Such an airtight package is configured by joining a container in which an element can be mounted and a cover member for sealing the inside of the container.
  • Patent Document 1 discloses an airtight package in which a glass ceramic substrate and a cover glass are bonded via a sealing material.
  • a low-melting-point sealing glass is used as the sealing material.
  • the hermetic package in Patent Document 1 is manufactured by irradiating the sealing material with a laser to soften it and bonding a glass ceramic substrate and a cover glass.
  • Patent Document 2 discloses an airtight package in which a ceramic substrate made of aluminum nitride and a ceramic cap are joined by a sealing glass.
  • an oxide layer is formed so as to cover the entire surface of the ceramic substrate in order to improve the wettability between the ceramic substrate and the sealing glass.
  • the oxide layer is formed by subjecting a ceramic substrate to a heat treatment.
  • JP 2014-236202 A Japanese Patent Laid-Open No. 10-154770
  • Patent Document 1 when a glass ceramic substrate is used as a container, it is difficult to efficiently dissipate the heat generated from the element to the outside.
  • An object of the present invention is to provide an airtight package that is excellent in airtightness and heat dissipation.
  • An airtight package is an airtight package for mounting and sealing an element, and includes a bottom portion on which the element is mounted and a frame-like side wall portion disposed on the bottom portion, and is nitrided
  • the container which is made of aluminum, is arranged on the upper part of the side wall of the container, and is disposed between the glass lid for sealing the inside of the container, the side wall of the container, and the glass lid.
  • a sealing material layer, and an oxide layer of a component contained in the container is provided in at least a part of a region where the sealing material layer is disposed in a side wall portion of the container. In the bottom of the container, the oxide layer is not provided in a region where the element is mounted.
  • the oxide layer includes aluminum oxide.
  • the sealing material layer preferably contains bismuth glass.
  • a method for manufacturing an airtight package according to the present invention is a method for manufacturing an airtight package according to the present invention, wherein at least a part of a region where the sealing material layer is disposed is provided on the side wall portion of the container.
  • the step of irradiating with plasma to form the oxide layer, and in the side wall portion of the container, the glass lid is disposed via a sealing material on the portion where the oxide layer is formed, Irradiating a laser to soften the sealing material, and joining the side wall of the container and the glass lid.
  • the element may be mounted on the bottom of the container before the step of forming the oxide layer.
  • the wavelength of the laser may be 600 nm to 1600 nm.
  • the sealing material preferably contains bismuth-based glass powder.
  • an airtight package having excellent airtightness and heat dissipation can be provided.
  • FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
  • FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a schematic cross-sectional view for explaining a
  • FIG. 7 is a schematic plan view for explaining a laser irradiation method in the method for manufacturing an airtight package according to the embodiment of the present invention.
  • FIG. 8 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Example 1.
  • FIG. 9 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Comparative Example 1.
  • FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
  • the airtight package 1 includes a container 2, a glass lid 3, and a sealing material layer 4.
  • An element 6 is mounted in the hermetic package 1 and sealed.
  • the element 6 deep ultraviolet LED, MEMS, etc. can be mounted.
  • the container 2 is made of aluminum nitride.
  • the container 2 has a bottom 2a and a side wall 2b.
  • the bottom portion 2a is a portion on which the element 6 is mounted in the container 2.
  • a frame-like side wall 2b is disposed on the bottom 2a.
  • a glass lid 3 is disposed on the upper surface 2b1 of the side wall 2b.
  • the glass lid 3 is a member for sealing the inside of the container 2.
  • a sealing material layer 4 is provided between the side wall 2b and the glass lid 3.
  • the side wall 2b and the glass lid 3 are joined by the sealing material layer 4.
  • the sealing material layer 4 includes bismuth glass. But in this invention, the sealing material layer 4 may contain other glass, and is not specifically limited.
  • the oxide layer 5 of the component contained in the container 2 is provided in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2, while the bottom 2a of the container 2 is The oxide layer 5 is not provided in the region where the element 6 is mounted.
  • the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed on the side wall 2b of the container 2, so that the hermeticity is enhanced. Further, since the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 is excellent in airtightness and heat dissipation.
  • the wettability between the aluminum nitride and the glass is not sufficient, so that the bonding strength between the container 2 and the glass lid 3 is not sufficient, and the airtightness is reduced. It is difficult to raise enough.
  • Bismuth-based glass softens at a very low temperature and is preferable in the case of sealing using laser irradiation.
  • the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed, so that the wettability between the container 2 and the sealing glass is improved.
  • the oxide layer 5 since the oxide layer 5 is provided, the bismuth-based glass is less likely to come into direct contact with aluminum nitride, so that generation of nitrogen gas can be suppressed. Therefore, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease. Therefore, the airtight package 1 is excellent in airtightness.
  • the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed, but the oxide layer 5 is formed in at least a part of the region where the sealing material layer 4 is disposed. Should just be provided. However, from the viewpoint of further improving the airtightness, it is preferable that the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed as in the present embodiment.
  • the oxide layer 5 may be provided on the surface of the container 2 in a portion other than the region where the element 6 is mounted. However, from the viewpoint of further improving heat dissipation, it is preferable that the oxide layer 5 is provided only in the region where the sealing material layer 4 is disposed.
  • Method for manufacturing airtight package 3 to 6 are schematic cross-sectional views for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
  • a container 2 having a bottom 2a and a side wall 2b is prepared.
  • the upper surface 2b1 of the side wall 2b of the container 2 is irradiated with atmospheric pressure plasma, which is plasma generated under atmospheric pressure, to form the oxide layer 5 shown in FIG.
  • the atmospheric pressure plasma treatment is performed such that the oxide layer 5 is formed in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2.
  • the oxide layer 5 is not formed in the region where the element 6 is mounted on the bottom 2a of the container 2.
  • an oxide layer can be formed only in a desired region by masking in advance a region where an oxide layer is not desired to be formed (a region where an element is mounted or the like). Note that the atmospheric pressure plasma irradiation may be performed after the element 6 is mounted.
  • a sealing material is printed on the oxide layer 5 in the side wall 2 b of the container 2. Further, after printing the sealing material, the sealing material is sintered by drying and heat treatment to form the sealing material layer 4.
  • the sealing material layer 4 may be formed on the glass lid 3 side, or may be formed on both the container 2 and the glass lid 3.
  • the element 6 is mounted on the bottom 2 a of the container 2.
  • the glass lid 3 is disposed on the portion where the sealing material layer 4 is provided on the upper surface 2 b 1 of the side wall 2 b.
  • the glass lid 3 may be arranged so that at least a part thereof overlaps the portion where the sealing material layer 4 is provided in plan view. But it is preferable to arrange
  • the laser light is irradiated from the laser light source to soften the sealing material layer 4 and the side wall of the container 2 2b and the glass lid 3 are joined.
  • the inside of the container 2 is hermetically sealed, and the hermetic package 1 shown in FIGS. 1 and 2 is obtained.
  • the laser for example, a laser having a wavelength of 600 nm to 1600 nm can be used.
  • the laser irradiation method will be described in more detail with reference to FIG.
  • FIG. 7 is a schematic plan view for explaining a laser irradiation method in the method for manufacturing an airtight package according to the embodiment of the present invention.
  • the laser 9 is irradiated with the laser 8 from the laser light source 7. Subsequently, the laser is scanned along the direction of the arrow B and is rotated. The circulated laser irradiates to a position exceeding the starting point 9. Thereby, the container 2 is sealed.
  • the end point of the laser may be a position beyond the start point 9 after the laser is circulated, or may be the same position as the start point 9.
  • the region where the sealing material layer 4 is disposed is treated with the atmospheric pressure plasma in the side wall portion 2b of the container 2, and thereby the oxide layer 5 is formed.
  • the bonding strength between the container 2 and the glass lid 3 is enhanced.
  • the oxide layer 5 is provided, the aluminum nitride contained in the container 2 and the sealing material do not easily react with each other, so that generation of nitrogen gas can be suppressed. For this reason, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease.
  • the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 obtained by the manufacturing method of this embodiment is excellent in airtightness and heat dissipation.
  • the container is made of aluminum nitride.
  • the container may contain an yttrium compound, a tungsten compound, or the like as a sintering aid when sintering aluminum nitride.
  • the container has a bottom part and a side wall part.
  • the container may be one in which the bottom and the side wall are integrally molded, or may be one in which the bottom and the side wall are separately molded and bonded together with an adhesive or the like.
  • Glass lid examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ is Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na or Ka) glass, SnO—P 2 O 5 glass, TeO 2 glass or Bi 2 O 3 glass or the like can be used.
  • SiO 2 —B 2 O 3 —RO R is Mg, Ca, Sr or Ba
  • Sealing material layer As a sealing material for forming the sealing material layer, low melting point sealing such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, V 2 O 5 —TeO 2 glass powder, etc. It preferably contains glass. In particular, when sealing is performed by irradiating a laser, bismuth-based glass powder with a very low softening point is used for sealing glass because of the necessity of softening the sealing material by heating for a shorter time and the strength of bonding. It is more preferable to use Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like.
  • Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, ⁇ -quartz solid solution, ⁇ -eucryptite, and spodumene.
  • Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
  • An oxide layer examples of the oxide constituting the oxide layer include aluminum oxide and the oxide of the sintering aid described above. Examples of the oxide of the sintering aid include yttrium oxide and tungsten oxide.
  • the method of forming the oxide layer is not limited to the above-described method of irradiating the atmospheric pressure plasma.
  • another method for forming the oxide layer for example, there is a method in which an upper portion of a side wall portion in an aluminum nitride container is irradiated with a laser and heated.
  • the wavelength of the laser beam at this time is preferably 3000 nm or more, and more preferably in the range of 5000 to 11000 nm. By setting it within such a wavelength range, the upper part of the side wall portion of the aluminum nitride container can be efficiently heated.
  • a light source for emitting laser light a carbon dioxide laser is preferably used.
  • an oxide layer can be formed by heating the upper part of the side wall portion of the container with a laser beam having a wavelength of 1600 nm or less.
  • a laser beam having a wavelength of 600 nm to 1600 nm for heating the sealing material layer can be used, it can be produced efficiently.
  • Example 1 a container having a bottom part and a side wall part and made of aluminum nitride was prepared. Subsequently, the side wall portion of the container was irradiated with atmospheric pressure plasma in a nitrogen gas atmosphere for 24 hours to form an oxide layer. The output of atmospheric pressure plasma was 45 W, and the irradiation range was a range of 0.5 mm in diameter. Moreover, atmospheric pressure plasma was irradiated only to the area
  • EDS energy dispersive X-ray spectrometer
  • a sealing material was printed on the oxide layer on the side wall of the container. After printing, the sealing material was sintered by drying and heat treatment to form a sealing material layer.
  • a sealing material a mixed powder of glass powder, low expansion refractory filler powder and laser absorber was used. The specific composition of the mixed powder is shown in Table 1 below.
  • a glass lid was placed on the side wall of the container where the sealing material was provided. Then, in the state which has arrange
  • Example 1 An airtight package was obtained in the same manner as in Example 1 except that the atmospheric pressure plasma was not irradiated and the oxide layer was not formed.
  • FIG. 8 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Example 1.
  • FIG. 9 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Comparative Example 1.
  • the portion shown in white is the region where the sealing material layer is provided. 8 and 9, it can be seen that in the region where the sealing material layer is provided, many bubbles were observed in Comparative Example 1, whereas in Example 1, the generation of bubbles was suppressed. Therefore, the hermetic package of Example 1 has high hermeticity without reducing the bonding strength between the container and the glass lid. On the other hand, in the airtight package of Comparative Example 1, the bonding strength between the side wall portion of the container and the glass lid was lowered, and sufficient airtightness was not obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
PCT/JP2017/009641 2016-05-25 2017-03-10 気密パッケージ及び気密パッケージの製造方法 WO2017203795A1 (ja)

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JP2018519107A JPWO2017203795A1 (ja) 2016-05-25 2017-03-10 気密パッケージ及び気密パッケージの製造方法

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JP2016-103885 2016-05-25
JP2016103885 2016-05-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240907A1 (ja) * 2019-05-30 2020-12-03 株式会社村田製作所 電子デバイス及びその製造方法
WO2021121608A1 (de) * 2019-12-19 2021-06-24 Ev Group E. Thallner Gmbh Vereinzeltes verkapseltes bauelement und verfahren zu dessen herstellung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521627A (ja) * 1991-07-16 1993-01-29 Sumitomo Electric Ind Ltd 半導体装置
JP2014038970A (ja) * 2012-08-18 2014-02-27 Seiko Epson Corp 電子デバイスの製造方法および電子デバイス
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521627A (ja) * 1991-07-16 1993-01-29 Sumitomo Electric Ind Ltd 半導体装置
JP2014038970A (ja) * 2012-08-18 2014-02-27 Seiko Epson Corp 電子デバイスの製造方法および電子デバイス
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240907A1 (ja) * 2019-05-30 2020-12-03 株式会社村田製作所 電子デバイス及びその製造方法
WO2021121608A1 (de) * 2019-12-19 2021-06-24 Ev Group E. Thallner Gmbh Vereinzeltes verkapseltes bauelement und verfahren zu dessen herstellung

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JPWO2017203795A1 (ja) 2019-03-22

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