WO2017202134A1 - 掩膜版管理系统以及掩膜版使用方法 - Google Patents

掩膜版管理系统以及掩膜版使用方法 Download PDF

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Publication number
WO2017202134A1
WO2017202134A1 PCT/CN2017/078428 CN2017078428W WO2017202134A1 WO 2017202134 A1 WO2017202134 A1 WO 2017202134A1 CN 2017078428 W CN2017078428 W CN 2017078428W WO 2017202134 A1 WO2017202134 A1 WO 2017202134A1
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WO
WIPO (PCT)
Prior art keywords
mask
masks
management system
detected
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/078428
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English (en)
French (fr)
Inventor
张小华
刘少华
刘振宇
闫冬
崔富毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/561,845 priority Critical patent/US20180196344A1/en
Publication of WO2017202134A1 publication Critical patent/WO2017202134A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/045—Storage devices mechanical in a circular arrangement, e.g. towers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries

Definitions

  • At least one embodiment of the present disclosure is directed to a mask management system and a method of using a mask.
  • OLED organic light-emitting diode
  • At least one embodiment of the present disclosure is directed to a mask management system and a mask use method for performing fine control, which is advantageous for improving production efficiency.
  • At least one embodiment of the present disclosure provides a mask management system, including:
  • a mask input module configured to provide at least one mask set, each of the mask sets including a cassette and a plurality of masks placed in the cassette;
  • a mask detection and processing module configured to detect a plurality of masks in the mask set, and perform corresponding mask processing on the masks to be processed according to the detection results
  • a mask classification module configured to re-adjust the processed and qualified mask to the cassette of the mask set to which the mask belongs.
  • At least one embodiment of the present disclosure provides a method for using a mask, comprising:
  • each of the mask sets comprising a cassette and a plurality of masks placed in the cassette;
  • the mask processed and passed through the mask processing step is readjusted to the mask set to which the mask is applied.
  • FIG. 1 is a schematic diagram of a mask management system according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a mask set according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a mask detection and processing module in a mask management system according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of another mask detection and processing module in a mask management system according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of a mask version in a mask management system according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of another mask detection and processing module in a mask management system according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of management of a mask version in a mask management system according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a mask and a mask plate being bound into a mask set in a mask management system according to an embodiment of the present disclosure
  • FIG. 9 is a schematic diagram of a mask management system applied to an OLED display panel according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a mask management method according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of determining NG in a defect detecting unit in a mask management method according to an embodiment of the present disclosure
  • FIG. 12 is a schematic diagram of determining NG in a graphics detection unit in a mask management method according to an embodiment of the present disclosure
  • FIG. 13 is a schematic diagram of a mask detection and processing in a mask management method according to an embodiment of the present disclosure
  • FIG. 14 is a schematic diagram of a mask management method including a temporary storage mask set according to an embodiment of the present disclosure
  • FIG. 15 is a schematic diagram of a mask version classification in a method for using a mask according to an embodiment of the present disclosure
  • FIG. 16 is a schematic diagram of a method for using a mask according to an embodiment of the present disclosure.
  • the method of monolithic mask control is cumbersome, and there is a risk that the mask is misused, which is not conducive to the improvement of production efficiency.
  • an embodiment of the present disclosure provides a mask management system 1 including a mask input module 11 , a mask detection and processing module 12 , and a mask classification module 13 .
  • the reticle input module 11 is configured to provide at least one reticle set. As shown in FIG. 2, each reticle set 100 includes a cassette 101 and a plurality of masks 102 placed within the cassette 101. It should be noted that the six masks 102 are shown in the cassette 101 of FIG. 2, but the number of the masks 102 in the cassette 101 of the embodiment of the present disclosure is not limited thereto, and may be other numbers. .
  • the mask detection and processing module 12 is configured to detect a plurality of masks in the mask set and perform corresponding mask processing on the masks to be processed according to the detection results.
  • the mask classification module 13 is configured to re (re)adjust the processed and qualified mask into the cassette of the mask set to which the mask belongs.
  • the use of mask management mode can facilitate the efficient production, and also facilitate the complete unification of the mask information before and after use. It not only facilitates the accuracy of the mask input, but also reduces the replacement time of the mask, and avoids the cumbersome and risk of monolithic mask control.
  • NG no good
  • Management can be re-formed into a complete mask set for the mask set to be put into use. That is, before the mask (group) is put into use, a plurality of masks and a cassette are bound to form a mask group for subsequent use.
  • the mask set 100 can be used in the fabrication of an organic light emitting diode (OLED) display panel.
  • OLED organic light emitting diode
  • the following is an example in which the mask set 100 is used for an organic light emitting diode (OLED) display panel as an example.
  • An organic light emitting diode (OLED) display panel is typically subjected to evaporation of a desired film layer in an evaporation apparatus.
  • an organic light emitting diode (OLED) display panel includes a gate layer (gate and gate line), a gate insulating layer, an active layer, a data layer (data line and source and drain), a pixel electrode layer, a hole transport layer, A hole injection layer, a light-emitting layer, an electron injection layer, an electron transport layer, and a common electrode layer.
  • the luminescent layer includes, for example, a pattern that emits three colors of red, green, and blue, thereby allowing the display panel to display color.
  • the illuminating layer can also emit light of other colors, which is not limited by the embodiment of the present disclosure.
  • the hole transport layer, the hole injection layer, the light-emitting layer, the electron injection layer, the electron transport layer, and the common electrode layer can be formed by vapor deposition in a vapor deposition apparatus.
  • a mask may be used in the vapor deposition of each film layer, but is not limited thereto.
  • the patterns of the red sub-pixel, the green sub-pixel, and the blue sub-pixel may be formed using three masks to emit three colors of red, green, and blue, but are not limited thereto.
  • the layer structure of the organic light emitting diode (OLED) display panel is not limited to the above exemplified case.
  • the mask detection and processing module 12 includes:
  • a defect detecting unit 121 configured to detect whether a foreign matter is present on the detected mask
  • a mask cleaning unit 122 configured to clean a mask or a used mask that has been detected to be defective
  • a mask fabrication/repair unit 123 is configured to repair or redo the mask that is detected to be defective.
  • Defect detection is required after the mask is used.
  • the defect detection mainly detects the foreign matter such as the number of particles on the mask, and if the detection result is NG, it needs to be cleaned again.
  • the mask manufacturing/maintenance unit 123 creates/maintains the mask, it enters the mask cleaning unit 122 for cleaning, and after cleaning, it enters the defect detecting unit 121 to perform defect detection.
  • the detected mask when the detected mask is rejected by the defect detecting unit 121 for the first time, it is sent to the mask cleaning unit 122 for cleaning, and when the mask is detected, it is determined twice consecutively. If it is qualified, it is sent to the mask making/maintenance unit 123 for repair or redo.
  • the upper system After the mask that has been cleaned is first judged to be NG in the defect detection, it needs to be cleaned again, and the upper system records the number of NGs of the mask as 1. After the cleaning is completed again, the mask version needs to be tested for defects again. If the detection result is still NG, the upper system will record the number of NGs as 2, and the corresponding mask will be returned to the mask making/maintenance unit for inspection and maintenance. . Excessive cleaning times can result in damage to the mask and waste of cleaning materials. When the defect detection result is OK, the upper system will clear the number of NGs corresponding to the mask version.
  • the mask detection and processing module 12 further includes a graphics detection unit 124 configured to detect whether the mask of the detected mask is intact. For example, when the detected mask is judged to be unacceptable by the pattern detecting unit 124, it is sent to the mask making/maintenance unit 123 for repair or redo.
  • a graphics detection unit 124 configured to detect whether the mask of the detected mask is intact. For example, when the detected mask is judged to be unacceptable by the pattern detecting unit 124, it is sent to the mask making/maintenance unit 123 for repair or redo.
  • the wires 1021 are vertically and horizontally staggered to form a pattern of the mask 102.
  • the pattern detection of the mask can detect whether the wire 1021 is intact.
  • the mesh-shaped wires can be fixed to the metal frame by a tensioning process.
  • three mesh wires can be attached to the metal frame on the tensioning device to form the mask shown in FIG.
  • FIG. 5 is only a schematic example of a mask, and the mask in the embodiment of the present disclosure is not limited to the one shown in the drawing.
  • the pattern detection mainly detects whether the mask wire (electroplated wire) 1021 is intact, and if the detection result is NG, a maintenance process is required.
  • the first time the mask is in the pattern detection if the detection value is NG, the mask will be returned to the mask making/repair unit for inspection and repair processing, and the upper system will also record the corresponding mask version.
  • the number of NGs is 1.
  • the graphic detection result is OK, the upper system will clear the number of NGs corresponding to the mask version.
  • the mask detection and processing module For example, in a mask that has been processed by the mask detection and processing module, if it is judged to be unacceptable in defect detection and pattern detection, it will be dispensed in different cassettes.
  • the mask detection and processing module 12 further includes a scrapping unit 125 configured to reject the unserviceable mask. For example, after scrapping, it can be redone in the mask making/repair unit. The mask of the redo is then put into use by subsequent steps such as cleaning, defect detection and pattern detection.
  • a scrapping unit 125 configured to reject the unserviceable mask. For example, after scrapping, it can be redone in the mask making/repair unit. The mask of the redo is then put into use by subsequent steps such as cleaning, defect detection and pattern detection.
  • the management system provided by some examples further includes a reticle storage module 14 configured to temporarily store the mask set 100 after passing the test. If the mask set 100 is a complete mask set, it can be temporarily stored in the mask storage module 14 for use.
  • the cleaning unit is first cleaned before use, and the cleaning unit can control the number of times the mask is cleaned to prevent the service life of the mask from exceeding the limit value.
  • the defect detection is performed, and if the amount of the particles is within a limited range, the pattern detection is performed.
  • the mask group is temporarily stored in the mask storage module.
  • the mask set is transferred from the mask memory module and put into use. The used mask set needs to be returned to the cleaning unit for cleaning of the mask and cassette. Cycle back and forth.
  • the mask set 100 can be used in the fabrication of an organic light emitting diode (OLED) display panel.
  • the mask set 100 can be used in the evaporation apparatus 20.
  • the vapor deposition device 20 is, for example, a vapor deposition machine.
  • the plurality of masks 102 included in the mask set 100 belong to the same type, or the plurality of masks 102 included in the mask set 100 may include at least two different types of masks for Different evaporation chambers of the evaporation equipment.
  • the mask mode management mode can facilitate the efficient production of the OLED display panel, and can also facilitate the complete unification of the mask information before and after evaporation.
  • Each evaporation unit (evaporation cluster) of the vapor deposition apparatus has a plurality of chambers, and different masks require different types of masks. When the mask is put into the mask, a mask version is required.
  • Type management it is most appropriate to manage the mask in groups. This not only facilitates the accuracy of the mask input, but also reduces the replacement time of the mask, and avoids the cumbersome and risk of monolithic mask control.
  • the cassette input module 128 is configured to provide a cassette, the cassette is cleaned by the cassette cleaning unit 129, and then combined with the mask to form a mask set, and the resulting mask set can be placed in the mask. Stored in the stencil storage module 14.
  • the vapor deposition apparatus 20 has a plurality of vapor deposition units, each of which has a plurality of chambers. 200.
  • one film layer is evaporated in each of the evaporation chambers.
  • the first to third three vapor deposition units 201-203 are shown in FIG. 9, but are not limited thereto.
  • the first evaporation unit 201 includes four evaporation chambers 2011-2014, for example, the evaporation chamber 2011 and the evaporation chamber 2012 can be used for vapor deposition of the first film layer, the evaporation chamber 2013 and the evaporation chamber 2014
  • the second film layer can be used for vapor deposition, and each of the first film layer and the second film layer uses one type of mask plate, and the first mask plate group 1001 can be bound to two types of mask plates, for example, the first In the mask set 1001, three masks of the first type for vapor-depositing the first film layer and three masks of the second type for vapor-depositing the second film layer may be placed, but are not limited thereto. .
  • the first vapor deposition unit 201 can be used for vapor deposition of the hole injection layer and the hole transport layer, but is not limited thereto.
  • the second evaporation unit 202 includes four evaporation chambers 2021-2024, for example, can be used to vaporize a certain color sub-pixel and an electron transport layer in the light-emitting layer, and the second mask group 1002 can be used for binding.
  • a plurality of masks of the second evaporation unit 202 for example, three masks for vapor-depositing a color sub-pixel and three masks for vapor-depositing the electron transport layer may be placed, but are not limited thereto. .
  • the number of masks bound in the cassette of the mask group corresponding to each chamber can be determined according to the evaporation time of the two layers, and the mask corresponding to the film with a long evaporation time.
  • the number of plates is small, and the number of masks corresponding to the film having a short evaporation time is large, and the same amount of mask plates can be placed when the vapor deposition time is similar.
  • the third evaporation unit 203 includes one evaporation chamber 2031, and a plurality of masks may be placed in the third mask group 1003 for vapor deposition of the film layer in the evaporation chamber.
  • the evaporation chamber 2031 can be used for vapor deposition of the cathode, but is not limited thereto. It should be noted that the present example is merely illustrative and is not limited thereto.
  • the type and number of masks in the cassette of the mask set remain unchanged until the mask set is put into service.
  • the cassette of a mask set and the mask bound to the cassette can be recycled.
  • the position of each mask that is bound to the cassette is fixed, thus avoiding the misuse of the mask.
  • the mask making/repair unit 123 is configured to make or repair a mask that is detected to be defective
  • the mask cleaning unit 122 is The mask is configured to clean the mask after use or the mask that is detected to be defective
  • the defect detecting unit 121 is configured to perform defect detection of the mask, and the mask is judged once after the NG in the defect detecting unit.
  • the process returns to the mask making/maintenance unit 123 for re-inspection, and the pattern detecting unit 124 is configured to detect whether the pattern of the detected mask is intact, and the mask is in the pattern detecting unit.
  • the reticle storage module 14 is configured to store the tested mask set, and the reticle sorting module 13 is configured to perform the mask. Classification, the incomplete mask set is adjusted to a complete mask set, the complete mask set can be used in the evaporation apparatus, and the mask is returned to the mask cleaning unit for cleaning after use. Cycle back and forth.
  • the mask cleaning unit or the cassette cleaning unit is, for example, a cleaning machine
  • the defect detecting unit is, for example, a defect detector (particle detector)
  • the pattern detecting unit is, for example, a pattern detector, a mask.
  • the version storage module is, for example, a storage bin, but is not limited thereto.
  • An embodiment of the present disclosure provides a method for using a mask, as shown in FIG. 10, including:
  • each mask set comprising a cassette and a plurality of masks placed in the cassette;
  • the mask that has been processed and passed through the mask process is re-adjusted to the mask set to which the mask belongs.
  • the detection of the mask includes defect detection to detect the presence of foreign matter on the mask (eg, particulate matter detection), and then the mask that is detected to be defective is performed. Clean, or repair or redo.
  • the cleaning is performed again, and when the mask is detected, it is determined twice consecutively. If it is qualified, it will be repaired or redone.
  • the detection of the reticle further includes pattern detection to detect whether the reticle pattern detected is intact. For example, when the detected mask is judged to be unqualified, repair or redo is performed.
  • the mask process further includes disposing the unserviceable mask.
  • the mask use method provided by some examples further includes: temporarily storing the mask set after passing the test.
  • a mask set When a mask set is required, it can be taken out from a temporary storage location (such as a mask storage module) for use.
  • the mask set 100 can be transferred from the mask storage (eg, the mask storage module 14) to the defect detection location (eg, the defect detection unit) and / or graphics detection (such as graphics detection unit) for classification management, the incomplete mask version is adjusted to a complete mask version.
  • the mask storage eg, the mask storage module 14
  • the defect detection location eg, the defect detection unit
  • graphics detection such as graphics detection unit
  • the incomplete mask version is adjusted to a complete mask version.
  • the defragmentation group of the classification can be stored for use (for example, placed in the storage module for temporary storage to be used).
  • the classification management of the mask version facilitates the accuracy of the mask group, preventing the wrong mask from being put into the chamber of the vapor deposition device, and also reducing damage caused by contact with the mask.
  • a mask set is used for the fabrication of an organic light emitting diode display panel.
  • the mask version used in the mask set belongs to the same type, or the mask set includes at least two different types of masks for the evaporation apparatus. Different in the evaporation chamber.
  • Some examples of reticle use methods also include maintaining the type and number of masks within the cassette of each mask set.
  • the mask in the mask management method for OLED display panel production, can be cleaned after the mask is produced/repaired, and the defect is performed after the cleaning, and the mask is in the defect detection.
  • the NG is judged once in the process, it is returned to the mask cleaning process and re-cleaned.
  • the mask is returned to the mask production/maintenance process for re-inspection, and the defect inspection is performed.
  • the mask version is judged to be NG, and then returned to the mask production/maintenance process for re-repair.
  • the mask version can be stored, and the incomplete mask version can be used to classify the mask.
  • the complete mask set can be used in the evaporation equipment, and the mask can be placed in another cassette after use (to avoid contamination)
  • the unused mask in the mask set is returned to the mask cleaning process for cleaning. Cycle back and forth.
  • the plurality of masks 102 placed in the cassette 101 are returned to their original positions after passing through different units or processes. That is, one cassette 101 is bound to a plurality of masks 102, The positions of the plurality of masks 102 in the cassette are fixed, and in the case where the mask is scrapped, the masks that have been discarded can be replaced after being redone.
  • the effect of the mask management method provided by the embodiment of the present disclosure may be corresponding to the mask management system provided by the embodiment of the present disclosure, and details are not described herein again. Other places can also be seen from each other.
  • embodiments of the present disclosure may be provided as a method, apparatus (device), or computer program product.
  • embodiments of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment, or a combination of software and hardware aspects.
  • embodiments of the present disclosure may take the form of a computer program product embodied on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) in which computer usable program code is embodied. .
  • Embodiments of the present disclosure are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus, and computer program products according to embodiments of the present disclosure. It will be understood that each flow and/or block of the flowchart illustrations and/or FIG.
  • These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing device to produce a machine for the execution of instructions for execution by a processor of a computer or other programmable data processing device.
  • the computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture comprising the instruction device.
  • the apparatus implements the functions specified in one or more blocks of a flow or a flow and/or block diagram of the flowchart.
  • These computer program instructions can also be loaded onto a computer or other programmable data processing device such that a series of operational steps are performed on a computer or other programmable device to produce computer-implemented processing for execution on a computer or other programmable device.
  • the instructions provide steps for implementing the functions specified in one or more of the flow or in a block or blocks of a flow diagram.
  • the mask management system may include a processor, a memory, and computer program instructions stored in the memory; when the computer program instructions are executed by the processor, for example, the mask input module 11 may be implemented, At least one of the functions specified in the stencil detection and processing module 12 and the reticle classification module 13 may further implement, for example, the above-described reticle input module 11, a mask version
  • the detection and processing module 12 and the mask classification module 13, the mask storage module 14, the defect detection unit 121, the mask cleaning unit 122, the mask making/maintenance unit 123, the pattern detecting unit 124, the scrapping unit 125, At least one of the specified functions of the cassette input module 128 and the cassette cleaning unit 129 is all or part of the function.
  • an embodiment of the present disclosure provides a mask management system including: a processor, a memory, and computer program instructions stored in the memory, the computer step executing the processor performing the following steps: providing at least one mask a stencil group, each of the mask sets includes a cassette and a plurality of masks placed in the cassette; detecting a plurality of masks in the mask set, and based on the detection results Corresponding mask processing is performed on the mask to be processed; the processed and qualified mask is readjusted into the cassette of the mask set to which the mask belongs.

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Abstract

掩膜版管理系统(1)以及掩膜版使用方法。该掩膜版管理系统(1)包括：掩膜版投入模块(11)，其被配置来提供至少一个掩膜版组(100)，每个掩膜版组(100)包括一个卡匣(101)和放置在卡匣(101)内的多个掩膜版(102)；掩膜版检测和处理模块(12)，其被配置来检测掩膜版组(100)中的多个掩膜版(102)，并根据检测结果对需要处理的掩膜版（102）进行对应的掩膜版处理；掩膜版分类模块(13)，其被配置来将经过处理并合格的掩膜版（102）重新调整到掩膜版（102）所属的掩膜版组(100)的卡匣(101)中。该掩膜版管理系统(1)以及掩膜版使用方法可进行精细化的管控，有利于提高生产效率。

Description

掩膜版管理系统以及掩膜版使用方法 技术领域
本公开至少一实施例涉及一种掩膜版管理系统以及掩膜版使用方法。
背景技术
在有机发光二极管(Organic light-emitting diode，OLED)显示面板的制作过程中，需要用到掩膜版。在通常的掩膜版使用过程中，采用单片掩膜版管控的方式。
发明内容
本公开的至少一实施例涉及一种掩膜版管理系统以及掩膜版使用方法，以进行精细化的管控，有利于提高生产效率。
本公开的至少一实施例提供一种掩膜版管理系统，包括：
掩膜版投入模块，其被配置来提供至少一个掩膜版组，每个所述掩膜版组包括一个卡匣和放置在所述卡匣内的多个掩膜版；
掩膜版检测和处理模块，其被配置来检测所述掩膜版组中的多个掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；
掩膜版分类模块，其被配置来将经过处理并合格的掩膜版重新调整到所述掩膜版所属的掩膜版组的卡匣中。
本公开的至少一实施例提供一种掩膜版使用方法，包括：
提供至少一个掩膜版组，每个所述掩膜版组包括一个卡匣和放置在所述卡匣内的多个掩膜版；
检测所述掩膜版组中的掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；
将经过所述掩膜版处理工序处理并合格的掩膜版重新调整到所述掩膜版所属的掩膜版组。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为本公开一实施例提供的一种掩膜版管理系统示意图；
图2为本公开一实施例提供的掩膜版组示意图；
图3为本公开一实施例提供的一种掩膜版管理系统中的一种掩膜版检测和处理模块示意图；
图4为本公开一实施例提供的一种掩膜版管理系统中的另一种掩膜版检测和处理模块示意图；
图5为本公开一实施例提供的一种掩膜版管理系统中的掩膜版的示意图；
图6为本公开一实施例提供的一种掩膜版管理系统中的另一种掩膜版检测和处理模块示意图；
图7为本公开一实施例提供的一种掩膜版管理系统中的掩膜版使用管理示意图；
图8为本公开一实施例提供的一种掩膜版管理系统中卡匣与掩膜版绑定成掩膜版组的示意图；
图9为本公开一实施例提供的掩膜版管理系统应用于OLED显示面板制作的示意图；
图10为本公开一实施例提供的掩膜版管理方法的示意图；
图11为本公开一实施例提供一种掩膜版管理方法中的在缺陷检测单元中被判NG的示意图；
图12为本公开一实施例提供一种掩膜版管理方法中的在图形检测单元中被判NG的示意图；
图13为本公开一实施例提供一种掩膜版管理方法中的一种掩膜版检测和处理的示意图；
图14为本公开一实施例提供一种包括暂存掩膜版组的掩膜版管理方法中的示意图；
图15为本公开一实施例提供一种掩膜版使用方法中掩膜版分类示意图；
图16为本公开一实施例提供一种掩膜版使用方法示意图。
附图标记：
1：掩膜版管理系统；11：掩膜版投入模块；12：掩膜版检测和处理模块；13：掩膜版分类模块；14：掩膜版存储模块；20：蒸镀设备；200：蒸镀腔室；201：第一蒸镀单元；202：第二蒸镀单元；203：第三蒸镀单元；2011-2014：蒸镀腔室；2021-2024：蒸镀腔室；2031：蒸镀腔室；100：掩膜版组；1001：第一掩膜版组；1002：第二掩膜版组；1003：第三掩膜版组；101：卡匣；102：掩膜版；1021：金属丝；121：缺陷检测单元；122：掩膜版清洗单元；123：掩膜版制作/维修单元；124：图形检测单元；125：报废单元；001：绑定掩膜版组；128：卡匣投入模块；129：卡匣清洗单元。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。
单片掩膜版管控的方式比较繁琐，并存在掩膜版被错用的风险，不利于生产效率的提高。
如图1所示，本公开一实施例提供一种掩膜版管理系统1，包括：掩膜版投入模块11，掩膜版检测和处理模块12和掩膜版分类模块13。
掩膜版投入模块11被配置来提供至少一个掩膜版组，如图2所示，每个掩膜版组100包括一个卡匣101和放置在卡匣101内的多个掩膜版102。需要说明的是，图2的卡匣101中示出了6个掩膜版102，但本公开的实施例的卡匣101中掩膜版102的数量不以此为限，亦可为其他数量。
掩膜版检测和处理模块12被配置来检测掩膜版组中的多个掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理。
掩膜版分类模块13被配置来将经过处理并合格的掩膜版重新(再次)调整到掩膜版所属的掩膜版组的卡匣中。
采用掩膜版组管理方式即可以利于生产的高效进行，也利于使用前后掩膜版信息的完整统一。既利于掩膜版投入的准确性，同时减少了掩膜版的更换时间，也避免了单片掩膜版管控的繁琐和风险。
经过掩膜版检测和处理模块的掩膜版，存在判不合格(no good，NG)情况，会出现同一个组的掩膜版分装在不同卡匣里的情况，而掩膜版的分类管理可以使其再形成一个完整的掩膜版组，以便该掩膜版组投入使用。即在掩膜版(组)投入使用前，将多个掩膜版和一个卡匣绑定形成一个掩膜版组，以利后续投入使用。
例如，掩膜版组100可用于有机发光二极管(OLED)显示面板的制作。以下以掩膜版组100用于有机发光二极管(OLED)显示面板为例进行说明。有机发光二极管(OLED)显示面板通常在蒸镀设备中进行所需膜层的蒸镀。例如，有机发光二极管(OLED)显示面板包括gate层(栅极和栅线)、栅极绝缘层、有源层、data层(数据线和源漏极)、像素电极层、空穴传输层、空穴注入层、发光层、电子注入层、电子传输层、公共电极层。发光层例如包括可发出红、绿、蓝三种颜色的图形，从而可使得显示面板显示彩色。发光层亦可发出其他颜色的光，本公开的实施例对此不作限定。例如，空穴传输层、空穴注入层、发光层、电子注入层、电子传输层、公共电极层可在蒸镀设备中蒸镀形成。在蒸镀设备中，可在每一膜层的蒸镀中均利用一张掩膜版，但不限于此。例如，在发光层的蒸镀中，可以使用三张掩膜版分别形成红色子像素、绿色子像素、蓝色子像素的图形以发出红、绿、蓝三种颜色，但不限于此。需要说明的是，有机发光二极管(OLED)显示面板的层结构不限于上述例举的情形。
如图3所示，一些示例中，掩膜版检测和处理模块12包括：
缺陷检测单元121，其被配置来检测被检测的掩膜版上是否存在异物；
掩膜版清洗单元122，其被配置来对经检测存在缺陷的掩膜版或使用后的掩膜版进行清洗；
掩膜版制作/维修单元123，其被配置来对经检测存在缺陷的掩膜版进行维修或者重做。
掩膜版使用后需要进行缺陷检测。缺陷检测主要检测掩膜版上的异物例如颗粒物(Particle)数量，如检测结果为NG，需要再次进行清洗。
例如，掩膜版制作/维修单元123制作/维修掩膜版后，进入掩膜版清洗单元122进行清洗，清洗后进入缺陷检测单元121进行缺陷检测。
一些示例中，当被检测的掩膜版被缺陷检测单元121第1次判定不合格，则被送入掩膜版清洗单元122以进行清洗，当被检测的掩膜版连续2次被判定不合格，则被送入掩膜版制作/维修单元123以进行维修或重做。
一个示例中，清洗完成的掩膜版第一次在缺陷检测中被判NG后，需要再次进行清洗，上位系统会记录掩膜版的NG次数为1。再次清洗完毕后，掩膜版需要再次进行缺陷检测，如果检测结果仍为NG，上位系统会记录NG次数为2，对应的掩膜版会返回到掩膜版制作/维修单元进行检查和维修处理。清洗次数过多会导致掩膜版的损坏和清洗材料的浪费。当缺陷检测结果OK时，上位系统会将对应掩膜版的NG次数清零。
如图4所示，一些示例中，掩膜版检测和处理模块12还包括：图形检测单元124，其被配置来检测被检测的掩膜版的图形是否完好。例如，当被检测的掩膜版被图形检测单元124判定为不合格，则被送入掩膜版制作/维修单元123以进行维修或重做。
如图5所示，金属丝1021横纵交错构成掩膜版102的图形。掩膜版的图形检测时可检测金属丝1021是否完好。例如，掩膜版制作时，可将网状的金属丝一条一条的经张紧工序固定在金属框上。例如，可在张紧设备上将三条网状金属丝固定在金属框上构成图5所示的掩膜版。需要说明的是，图5只是示意性的例举一种掩膜版，本公开的实施例中的掩膜版不限于图中所示。
图形(Pattern)检测主要检测掩膜版的金属丝(电镀丝)1021是否完好，如果检测结果为NG，需要进行维修工艺。
一个示例中，掩膜版第一次在图形检测时，如果检测值为NG，掩膜版会返回到掩膜版制作/维修单元进行检查和维修处理，上位系统也会记录对应掩膜版的NG次数为1。当图形检测结果OK时，上位系统会将对应掩膜版的NG次数清零。
例如，经过掩膜版检测和处理模块处理的掩膜版中，若在缺陷检测和图形检测中被判定为不合格，则会分装在不同卡匣里。
如图6所示，一些示例中，掩膜版检测和处理模块12还包括：报废单元125，其被配置来将不能维修的掩膜版进行报废处理。例如，报废处理后，可在掩膜版制作/维修单元进行重做。重做的掩膜版再经清洗、缺陷检测和图形检测等后续步骤并形成掩膜版组投入使用。
如图7所示，一些示例提供的管理系统还包括：掩膜版存储模块14，其被配置来暂存检测合格后的掩膜版组100。若掩膜版组100为一个完整的掩膜版组，则可以暂存在掩膜版存储模块14中备用。
一个示例中，掩膜版投入后，在使用前首先要到清洗单元进行清洗，清洗单元可对掩膜版的清洗次数进行管控，防止掩膜版的使用寿命超过限定值。清洗完毕后，进行缺陷检测，如果颗粒物数量在限定范围内，再进行图形检测。检测OK后，会将掩膜版组暂存到掩膜版存储模块内。当需要使用掩膜版时，从掩膜版存储模块内调出掩膜版组，投入使用设备进行使用。使用过的掩膜版组需要回到清洗单元进行掩膜版和卡匣的清洗。循环往复。
如图7所示，一些示例中，掩膜版组100可用于有机发光二极管(OLED)显示面板的制作。例如掩膜版组100可用于蒸镀设备20中。蒸镀设备20例如为蒸镀机。例如，掩膜版组100所包括的多个掩膜版102属于同一类型，或者，掩膜版组100所包括的多个掩膜版102可包括至少两个不同类型的掩膜版以用于蒸镀设备的不同蒸镀腔室。
掩膜版组管理方式即可以利于OLED显示面板生产的高效进行，也可利于蒸镀前后掩膜版信息的完整统一。蒸镀设备的每一个蒸镀单元(蒸镀群，evaporation cluster)中都有多个腔室，而不同的腔室所需的掩膜版类型不同，当掩膜版投入时需要对掩膜版类型进行管理，将掩膜版以组为单位进行管理最合适。这样既利于掩膜版投入的准确性，同时减少了掩膜版的更换时间，也避免了单片掩膜版管控的繁琐和风险。
如图8所示，卡匣投入模块128被配置来提供卡匣，卡匣经卡匣清洗单元129清洗，再与掩膜版绑定成掩膜版组，所得掩膜版组可置于掩膜版存储模块14中存储。
如图9所示，蒸镀设备20中有多个蒸镀单元，每个蒸镀单元有多个腔室 200，例如，每个蒸镀腔室中蒸镀一个膜层。同一个蒸镀单元中可有多个腔室用于蒸镀同一膜层。图9中示出了第一至第三共三个蒸镀单元201-203，但不以此为限。第一蒸镀单元201包括四个蒸镀腔室2011-2014，例如，蒸镀腔室2011和蒸镀腔室2012可用于蒸镀第一膜层，蒸镀腔室2013和蒸镀腔室2014可用于蒸镀第二膜层，第一膜层和第二膜层各使用一种类型的掩膜版，第一掩膜版组1001可绑定两种类型的掩膜版，例如，第一掩膜版组1001中可放置三张用于蒸镀第一膜层的第一类型的掩膜版以及三张用于蒸镀第二膜层的第二类型的掩膜版，但不限于此。例如，第一蒸镀单元201内可用于蒸镀空穴注入层和空穴传输层，但不限于此。第二蒸镀单元202包括四个蒸镀腔室2021-2024，例如，可用于蒸镀发光层中的某一颜色子像素和电子传输层，第二掩膜版组1002中绑定可用于第二蒸镀单元202的多个掩膜版，例如，可放置三张用于蒸镀某一颜色子像素的掩膜版和三张用于蒸镀电子传输层的掩膜版，但不限于此。需要说明的是，各腔室对应的掩膜版组的卡匣中绑定的掩膜版的数量可依据两种膜层的蒸镀时间来定，蒸镀时间长的膜层对应的掩膜版的数量少，蒸镀时间短的膜层对应的掩膜版的数量多，蒸镀时间相差不多则可放置同等数量的掩膜版。例如，第三蒸镀单元203包含一个蒸镀腔室2031，第三掩膜版组1003中可放置多个掩膜版用于该蒸镀腔室中膜层的蒸镀。例如，蒸镀腔室2031可用于蒸镀阴极，但不以此为限。需要说明的是，本示例仅为示意性的说明，并不限于此。
一些示例中，掩膜版组的卡匣内的多个掩膜版的类型和数量，在掩膜版组被投入使用前保持不变。从而，一个掩膜版组的卡匣和与该卡匣绑定的掩膜版可以循环利用。与卡匣绑定的每个掩膜版的位置固定，从而可避免掩膜版的错用。当蒸镀设备需要掩膜版进行OLED面板生产时，可从掩膜版存储模块内调出掩膜版组，投入蒸镀设备使用。蒸镀使用过的掩膜版组需要回到清洗单元进行掩膜版和卡匣的清洗。循环往复。
在一个示例中，在OLED显示面板生产用掩膜版管理系统中，掩膜版制作/维修单元123被配置来对经检测存在缺陷的掩膜版进行制作或维修，掩膜版清洗单元122被配置来对使用后的掩膜版或经检测存在缺陷的掩膜版进行清洗，缺陷检测单元121被配置来进行掩膜版的缺陷检测，掩膜版在缺陷检测单元中被判1次NG后，返回到掩膜版清洗单元122再次清洗，掩膜版在 缺陷检测工序被判2次NG后，返回到掩膜版制作/维修单元123重新检修，图形检测单元124被配置来检测被检测的掩膜版的图形是否完好，掩膜版在图形检测单元被判NG后，返回到掩膜版制作/维修单元123重新检修，掩膜版存储模块14被配置来存储经检测合格的掩膜版组，掩膜版分类模块13被配置来对掩膜版进行分类，将不完整的掩膜版组调整为完整的掩膜版组，完整的掩膜版组可投入蒸镀设备使用，掩膜版在使用完成后回到掩膜版清洗单元进行清洗。循环往复。
例如，上述掩膜版管理系统中，掩膜版清洗单元或卡匣清洗单元例如为清洗机，缺陷检测单元例如为缺陷检测器(颗粒物检测仪)，图形检测单元例如为图形检测仪，掩膜版存储模块例如为存储仓，但不限于此。
本公开一实施例提供一种掩膜版使用方法，如图10所示，包括：
提供至少一个掩膜版组，每个掩膜版组包括一个卡匣和放置在卡匣内的多个掩膜版；
检测掩膜版组中的掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；
将经过掩膜版处理工序处理并合格的掩膜版重新调整到掩膜版所属的掩膜版组。
一些示例提供的掩膜版使用方法中，对掩膜版的检测包括缺陷检测，以检测被检测的掩膜版上是否存在异物(例如颗粒物检测)，然后对经检测存在缺陷的掩膜版进行清洗，或进行维修或者重做。
通过对检测结果的管控，可以对检测结果不同的掩膜版进行区分，以确保掩膜版按照检测结果选择下一步工艺。
如图11所示，一些示例提供的掩膜版使用方法中，当被检测的掩膜版第1次被判定不合格，则重新进行清洗，当被检测的掩膜版连续2次被判定不合格，则进行维修或重做。
如图12所示，一些示例提供的掩膜版使用方法中，对掩膜版的检测还包括图形检测，以检测被检测的掩膜版的图形是否完好。例如，当被检测的掩膜版被判定为不合格，则进行维修或重做。
如图13所示，一些示例提供的掩膜版使用方法中，掩膜版处理还包括将不能维修的掩膜版进行报废处理。
如图14所示，一些示例提供的掩膜版使用方法还包括：暂存检测合格后的掩膜版组。当需要使用掩膜版组时，可从暂存处(例如掩膜版存储模块)取出进行使用。
如图15所示，若掩膜版组100不是一个完整的掩膜版组，则可从掩膜版存储处(例如掩膜版存储模块14)调到缺陷检测处(例如缺陷检测单元)和/或者图形检测处(例如图形检测单元)进行分类管理，将不完整的掩膜版组调整为一个完整的掩膜版组。例如，分类时，曾经判NG的掩膜版经处理并合格后会重新回到其对应的掩膜版组内，从而形成完整的掩膜版组。分类完成的掩膜版组可存储待用(例如放到存储模块内暂存待使用)。掩膜版的分类管理，利于掩膜版组的准确性，可防止错误的掩膜版投入到蒸镀设备的腔室内，也可以减少因人员接触掩膜版造成的破损。
一些示例提供的掩膜版使用方法中，将掩膜版组用于有机发光二极管显示面版的制作。
一些示例提供的掩膜版使用方法中，掩膜版组所包括的多个掩膜版属于同一类型，或者，掩膜版组所包括至少两个不同类型的掩膜版以用于蒸镀设备的不同蒸镀腔室中。
一些示例提供的掩膜版使用方法还包括维持各掩膜版组的卡匣内的掩膜版的类型和数量不变。
如图16所示，在一个示例中，在OLED显示面板生产用掩膜版管理方法中，掩膜版制作/维修后可进行掩膜版的清洗，清洗后进行缺陷，掩膜版在缺陷检测工序中被判1次NG后，返回到掩膜版清洗工序重新清洗，掩膜版在缺陷检测工序被判2次NG后，返回到掩膜版制作/维修工序重新检修，缺陷检测合格后进行图形检测，掩膜版被判NG后，返回到掩膜版制作/维修工序重新检修，图形检测合格后可将掩膜版组进行存储，不完整的掩膜版可进行掩膜版的分类，将不完整的掩膜版组调整为完整的掩膜版组，完整的掩膜版组可投入蒸镀设备使用，掩膜版在使用完成后可放入另一卡匣内(避免污染其所在的掩膜版组中的未用的掩膜版)回到掩膜版清洗工序进行清洗。循环往复。
本公开的实施例中，放置在卡匣101内的多个掩膜版102经过不同单元或工序后还要回到原来的位置上。即，一个卡匣101绑定多个掩膜版102， 多个掩膜版102在卡匣内的位置固定不变，掩膜版被报废的情况下可重做后替换被报废的掩膜版。
本公开实施例提供的掩膜版管理方法的效果可对应参考本公开实施例提供的掩膜版管理系统，在此不再赘述。其他处亦可相互参见。
本领域技术人员应明白，本公开的实施例可提供为方法、装置(设备)、或计算机程序产品。因此，本公开的实施例可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且，本公开的实施例可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。
本公开的实施例是参照根据本公开实施例的方法、装置(设备)和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理设备的处理器以产生一个机器，使得通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理设备以特定方式工作的计算机可读存储器中，使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品，该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备上，使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机实现的处理，从而在计算机或其他可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
例如，本公开的实施例中，掩膜版管理系统可以包括处理器、存储器、和存储在存储器中的计算机程序指令；计算机程序指令被处理器运行时可实现例如掩膜版投入模块11，掩膜版检测和处理模块12和掩膜版分类模块13中至少一个指定的功能，进一步例如可实现上述掩膜版投入模块11，掩膜版 检测和处理模块12和掩膜版分类模块13、掩膜版存储模块14、缺陷检测单元121；掩膜版清洗单元122、掩膜版制作/维修单元123、图形检测单元124、报废单元125、卡匣投入模块128、卡匣清洗单元129中的至少一个指定的全部或部分功能。
例如，本公开的一个实施例提供一种掩膜版管理系统，包括：处理器、存储器和存储在存储器中的计算机程序指令，在计算机程序指令被处理器运行时执行以下步骤：提供至少一个掩膜版组，每个所述掩膜版组包括一个卡匣和放置在所述卡匣内的多个掩膜版；检测所述掩膜版组中的多个掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；将经过处理并合格的掩膜版重新调整到所述掩膜版所属的掩膜版组的卡匣中。
有以下几点需要说明：
(1)本公开实施例附图中，只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。
本专利申请要求于2016年5月25日递交的中国专利申请第201610354130.4号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (20)

  1. 一种掩膜版管理系统，包括：
    掩膜版投入模块，其被配置来提供至少一个掩膜版组，每个所述掩膜版组包括一个卡匣和放置在所述卡匣内的多个掩膜版；
    掩膜版检测和处理模块，其被配置来检测所述掩膜版组中的多个掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；
    掩膜版分类模块，其被配置来将经过处理并合格的掩膜版重新调整到所述掩膜版所属的掩膜版组的卡匣中。
  2. 根据权利要求1所述的管理系统，其中，所述掩膜版检测和处理模块包括：
    缺陷检测单元，其被配置来检测被检测的掩膜版上是否存在异物；
    掩膜版清洗单元，其被配置来对经检测存在缺陷的掩膜版或使用后的掩膜版进行清洗；
    掩膜版制作/维修单元，其被配置来对经检测存在缺陷的掩膜版进行维修或者重做。
  3. 根据权利要求2所述的管理系统，其中，当所述被检测的掩膜版被所述缺陷检测单元第1次判定不合格，则被送入所述掩膜版清洗单元以进行清洗，当所述被检测的掩膜版连续2次被判定不合格，则被送入所述掩膜版制作/维修单元以进行维修或重做。
  4. 根据权利要求2所述的管理系统，其中，所述掩膜版检测和处理模块还包括：
    图形检测单元，其被配置来检测所述被检测的掩膜版的图形是否完好。
  5. 根据权利要求4所述的管理系统，其中，当所述被检测的掩膜版被所述图形检测单元判定为不合格，则被送入所述掩膜版制作/维修单元以进行维修或重做。
  6. 根据权利要求2-5任一所述的管理系统，其中，所述掩膜版检测和处理模块还包括：
    报废单元，其被配置来将不能维修的掩膜版进行报废处理。
  7. 根据权利要求1-5任一所述的管理系统，还包括：
    存储模块，其被配置来暂存检测合格后的所述掩膜版组。
  8. 根据权利要求7所述的管理系统，其中，所述掩膜版组用于有机发光二极管显示面板的制作。
  9. 根据权利要求1所述的管理系统，其中，所述掩膜版组所包括的多个掩膜版属于同一类型，或者，所述掩膜版组所包括的多个掩膜版包括至少两个不同类型的掩膜版以用于蒸镀设备的不同蒸镀腔室。
  10. 根据权利要求9所述的管理系统，其中，所述掩膜版组的卡匣内的所述多个掩膜版的类型和数量，在所述掩膜版组被投入使用前保持不变。
  11. 一种掩膜版使用方法，包括：
    提供至少一个掩膜版组，每个所述掩膜版组包括一个卡匣和放置在所述卡匣内的多个掩膜版；
    检测所述掩膜版组中的掩膜版，并根据检测结果对需要处理的掩膜版进行对应的掩膜版处理；
    将经过所述掩膜版处理工序处理并合格的掩膜版重新调整到所述掩膜版所属的掩膜版组。
  12. 根据权利要求11所述的使用方法，其中，对所述掩膜版的检测包括缺陷检测，以检测被检测的掩膜版上是否存在异物，然后对经检测存在缺陷的掩膜版进行清洗，或进行维修或者重做。
  13. 根据权利要求12所述的使用方法，其中，当所述被检测的掩膜版第1次被判定不合格，则再次进行清洗，当所述被检测的掩膜版连续2次被判定不合格，则进行维修或重做。
  14. 根据权利要求12所述的使用方法，其中，对所述掩膜版的检测还包括图形检测，以检测所述被检测的掩膜版的图形是否完好。
  15. 根据权利要求14所述的使用方法，其中，当所述被检测的掩膜版被判定为不合格，则进行维修或重做。
  16. 根据权利要求11-15任一所述的使用方法，其中，所述掩膜版处理还包括将不能维修的掩膜版进行报废处理。
  17. 根据权利要求11-15任一所述的使用方法，还包括：暂存检测合格后的所述掩膜版组。
  18. 根据权利要求11-15任一所述的使用方法，其中，将所述掩膜版组 用于有机发光二极管显示面版的制作。
  19. 根据权利要求11-15任一所述的使用方法，其中，所述掩膜版组所包括的多个掩膜版属于同一类型，或者，所述掩膜版组所包括至少两个不同类型的掩膜版以用于蒸镀设备的不同蒸镀腔室中。
  20. 根据权利要求19所述的使用方法，还包括维持各所述掩膜版组的所述卡匣内的所述掩膜版的类型和数量不变。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105974729B (zh) * 2016-05-25 2020-02-18 京东方科技集团股份有限公司 掩膜版管理系统以及掩膜版使用方法
CN109239953B (zh) * 2018-11-07 2021-03-05 成都中电熊猫显示科技有限公司 掩膜版的处理系统
GB201906157D0 (en) * 2019-05-02 2019-06-19 Ocado Innovation Ltd An apparatus and method for imaging containers
CN110808206A (zh) * 2019-11-11 2020-02-18 合肥恒烁半导体有限公司 一种减少闪存流片中使用的光罩数量的方法及其应用
KR102836418B1 (ko) * 2020-09-18 2025-07-22 삼성디스플레이 주식회사 마스크 수리 장치 및 그것을 이용한 마스크 수리 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181550A (ja) * 1983-03-31 1984-10-16 Toshiba Corp フオトマスクの出納管理装置
JPH0951028A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd フォトマスク管理システム
US20020094257A1 (en) * 2001-01-12 2002-07-18 Babbs Daniel A. Workpiece sorter operating with modular bare workpiece stockers and/or closed container stockers
CN1770016A (zh) * 2004-11-03 2006-05-10 力晶半导体股份有限公司 光掩模管理方法及其条形码辨识装置
CN103176371A (zh) * 2013-03-14 2013-06-26 上海华力微电子有限公司 掩膜版的自动化管理系统及方法
CN105974729A (zh) * 2016-05-25 2016-09-28 京东方科技集团股份有限公司 掩膜版管理系统以及掩膜版使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6403905B1 (en) * 2000-02-02 2002-06-11 Advanced Micro Devices, Inc. Reticle stocking and sorting management system
US9671685B2 (en) * 2009-12-31 2017-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lithographic plane check for mask processing
CN105537194B (zh) * 2016-01-04 2019-03-15 京东方科技集团股份有限公司 一种掩膜版的清洗装置及清洗方法、蒸镀设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181550A (ja) * 1983-03-31 1984-10-16 Toshiba Corp フオトマスクの出納管理装置
JPH0951028A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd フォトマスク管理システム
US20020094257A1 (en) * 2001-01-12 2002-07-18 Babbs Daniel A. Workpiece sorter operating with modular bare workpiece stockers and/or closed container stockers
CN1770016A (zh) * 2004-11-03 2006-05-10 力晶半导体股份有限公司 光掩模管理方法及其条形码辨识装置
CN103176371A (zh) * 2013-03-14 2013-06-26 上海华力微电子有限公司 掩膜版的自动化管理系统及方法
CN105974729A (zh) * 2016-05-25 2016-09-28 京东方科技集团股份有限公司 掩膜版管理系统以及掩膜版使用方法

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