WO2017188216A1 - 保護膜形成用フィルムおよび保護膜形成用複合シート - Google Patents
保護膜形成用フィルムおよび保護膜形成用複合シート Download PDFInfo
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- WO2017188216A1 WO2017188216A1 PCT/JP2017/016285 JP2017016285W WO2017188216A1 WO 2017188216 A1 WO2017188216 A1 WO 2017188216A1 JP 2017016285 W JP2017016285 W JP 2017016285W WO 2017188216 A1 WO2017188216 A1 WO 2017188216A1
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- protective film
- forming
- film
- meth
- sensitive adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/017—Additives being an antistatic agent
Definitions
- the present invention relates to a protective film-forming film and a protective film-forming composite sheet.
- This application claims priority based on Japanese Patent Application No. 2016-092101 for which it applied to Japan on April 28, 2016, and uses the content here.
- a semiconductor device using a mounting method called a so-called face-down method has been manufactured.
- a semiconductor chip having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. For this reason, the back surface opposite to the circuit surface of the semiconductor chip may be exposed.
- a resin film containing an organic material is formed as a protective film on the exposed back surface of the semiconductor chip and may be taken into the semiconductor device as a semiconductor chip with a protective film.
- the protective film is used to prevent cracks from occurring in the semiconductor chip after the dicing process or packaging.
- a protective film-forming composite sheet comprising a protective film-forming film for forming a protective film on a support sheet is used.
- the protective film-forming film can form a protective film by curing.
- the support sheet can be used as a dicing sheet, and the protective film-forming film and the dicing sheet can be integrated.
- a composite sheet for forming a protective film for example, a sheet provided with a thermosetting protective film forming film that forms a protective film by being cured by heating has been mainly used so far.
- the protective film-forming composite sheet is attached to the back surface (the surface opposite to the electrode-forming surface) of the semiconductor wafer with a thermosetting protective film-forming film. Thereafter, the protective film-forming film is cured by heating to form a protective film, and the semiconductor wafer is divided together with the protective film by dicing to form semiconductor chips (see Patent Documents 1 and 2).
- FIG. 7 is a schematic cross-sectional view showing a state where a conventional semiconductor chip is reel-packed in an embossed carrier tape.
- Semiconductor chips 101 with protective films obtained by dicing a semiconductor wafer (not shown) are picked up one by one. And it accommodated in the pocket 102a of the packaging film (embossed carrier tape 102) in which the several hollow part (pocket 102a) was provided continuously, and the cover tape 103 was stuck on the said embossed carrier tape 102 (reel packing).
- the pocket 102a of the packaging film embmbossed carrier tape 102
- the cover tape 103 was stuck on the said embossed carrier tape 102 (reel packing).
- the cover tape 103 of the embossed carrier tape 102 in which the semiconductor chip 101 with the protective film is accommodated is peeled off, and the semiconductor chip 101 with the protective film accommodated in the pocket 102a is taken out and further used in the subsequent steps.
- the protective film may generate static electricity due to friction or the like when being divided together with the semiconductor wafer in the dicing process, and the semiconductor chip 101 with the protective film housed in the embossed carrier tape 102 may be charged.
- the semiconductor chip 101 with the protective film is charged, when the cover tape 103 of the embossed carrier tape 102 is removed in order to take out the semiconductor chip 101 with the protective film accommodated in the pocket 102a of the embossed carrier tape 102, the peeled cover tape 103 is applied.
- a semiconductor chip 101 with a protective film adheres. Therefore, the semiconductor chip 101 with the protective film is removed from the embossed carrier tape 102 together with the peeled cover tape 103.
- problems such as failure to smoothly transport to the next process and problems such as foreign matters such as dust adhering to the semiconductor chip due to static electricity.
- the present invention has been made to solve the above problems. That is, for protective film formation that can prevent the semiconductor chip with protective film housed therein from being charged even if the semiconductor chip with protective film picked up by dicing is housed in an embossed carrier tape and packaged (reel-packed) It aims at providing the composite sheet for film and protective film formation.
- the inventors of the present invention have made extensive studies to solve the above problems. As a result, the inventors found that the above problems can be solved by setting the surface resistivity of the protective film-forming film or the protective film-forming composite sheet to 10 12 ⁇ ⁇ cm or less, thereby completing the present invention. It was.
- the present invention is an energy ray-curable film for forming a protective film, and the film for forming a protective film has a surface resistivity of 10 12 ⁇ ⁇ cm or less when cured by irradiation with energy rays.
- the protective film-forming film preferably contains an antistatic agent.
- the antistatic agent may be an anionic surfactant antistatic agent, a cationic surfactant antistatic agent, a nonionic surfactant antistatic agent, It is preferably at least one selected from the group consisting of an ionic surfactant antistatic agent and a nonionic surfactant antistatic agent.
- the antistatic agent is preferably an alkali metal salt type.
- the content of the antistatic agent is preferably 6 to 20% by mass with respect to the mass of the resin component contained in the protective film-forming film.
- the protective film-forming film preferably further contains an energy beam curable component (a) and a polymer (b) having no energy beam curable group.
- the antistatic agent is contained in an amount of 6 to 20% by mass based on the total mass of the energy ray-curable component (a) and the polymer (b) having no energy ray-curable group. It is preferable.
- the present invention may also be a protective film-forming composite sheet comprising the protective film-forming film described above on a support sheet.
- a protective film-forming film and a protective film-forming composite sheet that can prevent the semiconductor chip with a protective film from being charged even when housed in an embossed carrier tape.
- the protective film-forming film of the present invention is an energy ray-curable protective film-forming film having a surface resistivity of 10 12 ⁇ ⁇ cm or less.
- the protective film-forming film of the present invention preferably contains an antistatic agent.
- the antistatic agent is an anionic surfactant antistatic agent, a cationic surfactant antistatic agent, a nonionic surfactant antistatic agent, or a zwitterionic type. It is preferably at least one selected from the group consisting of a surfactant-based antistatic agent and a nonionic surfactant-based antistatic agent.
- the antistatic agent is preferably an alkali metal salt type.
- the protective film-forming film preferably further contains an energy beam curable component (a) and a polymer (b) having no energy beam curable group.
- the antistatic agent is contained in an amount of 6 to 20% by mass based on the total mass of the energy ray-curable component (a) and the polymer (b) having no energy ray-curable group. It is preferable.
- the protective film-forming film of the present invention may have a first release film on at least one surface, and may further have a second release film on the other surface.
- the film for forming a protective film of the present invention can be provided as a long film wound in a roll shape.
- FIG. 6 is a cross-sectional view schematically showing one embodiment of the protective film-forming film of the present invention.
- the protective film-forming composite sheet of the present invention comprises an energy ray-curable protective film-forming film on a support sheet, and the protective film-forming film has a surface resistivity of 10 12 ⁇ ⁇ cm or less.
- the “film for forming a protective film having a surface resistivity of 10 12 ⁇ ⁇ cm or less” refers to the surface of the protective film when the protective film-forming film is irradiated with an energy ray to form a protective film.
- the “protective film-forming film” means a film before curing
- the “protective film” means a film obtained by curing the protective film-forming film.
- the surface resistivity increases after curing with respect to that before the protective film-forming film is cured, and the antistatic property decreases. Therefore, in order for the surface resistivity of the protective film after curing to be 10 12 ⁇ ⁇ cm or less, the surface resistivity of the protective film-forming film before curing needs to be 10 11 ⁇ ⁇ cm or less. There is.
- the surface resistivity of the protective film-forming film is preferably 10 11 ⁇ ⁇ cm or less, more preferably 10 10 ⁇ ⁇ cm or less, and even more preferably 10 9 ⁇ ⁇ cm or less.
- the lower limit value of the surface resistivity of the protective film-forming film is not particularly limited. For example, it can be 10 8 ⁇ ⁇ cm.
- the surface resistivity of the protective film is preferably 10 12 ⁇ ⁇ cm or less, more preferably 10 11 ⁇ ⁇ cm or less, and further preferably 10 10 ⁇ ⁇ cm or less.
- the lower limit value of the surface resistivity of the protective film is not particularly limited. For example, it can be 10 9 ⁇ ⁇ cm.
- the protective film-forming film is cured by irradiation with energy rays and becomes a protective film.
- This protective film is for protecting the back surface (surface opposite to the electrode forming surface) of the semiconductor wafer or semiconductor chip.
- the protective film-forming film is soft and can be easily attached to an object to be attached.
- the composite sheet for protective film formation of this invention makes antistatic property by making the surface resistivity of the film for protective film formation into 10 ⁇ 12 > ohm * cm or less when it hardens
- the semiconductor chip is prevented from adhering to the cover tape. Further, since the semiconductor chip itself is prevented from being charged, it is possible to prevent dust or dirt from adhering to the semiconductor chip due to static electricity.
- “energy beam” means an electromagnetic wave or charged particle beam having energy quanta. Examples thereof include ultraviolet rays, radiation, and electron beams. Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, a black light, an LED lamp or the like as an ultraviolet ray source. The electron beam can be emitted by an electron beam accelerator or the like.
- “energy ray curable” means the property of being cured by irradiation with energy rays
- “non-energy ray curable” means the property of not being cured even when irradiated with energy rays. .
- the thickness of the semiconductor wafer or the semiconductor chip that is the target of use of the composite sheet for forming a protective film of the present invention is not particularly limited. However, in order to obtain the effect of the present invention more remarkably, it is preferably 30 to 1000 ⁇ m, more preferably 100 to 300 ⁇ m.
- the configuration of the present invention will be described in detail.
- the support sheet may be composed of one layer (single layer) or may be composed of two or more layers.
- the constituent materials and thicknesses of the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.
- “a plurality of layers may be the same as or different from each other” means “all layers may be the same. It may be different, and only some of the layers may be the same.
- “a plurality of layers are different from each other” means “at least one of the constituent material and thickness of each layer is different from each other”.
- Preferred support sheets include, for example, those in which the pressure-sensitive adhesive layer is directly contacted and laminated on the substrate, those in which the pressure-sensitive adhesive layer is laminated on the substrate via an intermediate layer, and only the substrate. And the like.
- FIG. 1 is a cross-sectional view schematically showing one embodiment of a composite sheet for forming a protective film of the present invention.
- the protective film-forming composite sheet 1 ⁇ / b> A shown here comprises a pressure-sensitive adhesive layer 12 on a base material 11, and a protective film-forming film 13 on the pressure-sensitive adhesive layer 12.
- the support sheet 10 is a laminate of the base material 11 and the pressure-sensitive adhesive layer 12.
- the protective film forming composite sheet 1 ⁇ / b> A has a configuration in which the protective film forming film 13 is laminated on one surface 10 a of the support sheet 10.
- the protective film-forming composite sheet 1 ⁇ / b> A further includes a release film 15 on the protective film-forming film 13.
- the pressure-sensitive adhesive layer 12 is laminated on one surface 11 a of the substrate 11.
- a protective film-forming film 13 is laminated on the entire surface 12a of the pressure-sensitive adhesive layer 12, and a jig adhesive layer 16 is laminated on a part of the surface 13a of the protective film-forming film 13, that is, in the vicinity of the peripheral edge. Is done.
- the release film 15 is laminated on the surface on which the jig adhesive layer 16 is not laminated and on the surface 16a (upper surface and side face) of the jig adhesive layer 16. ing.
- the adhesive force between the cured protective film-forming film 13 (that is, the protective film) and the support sheet 10 is 50 to 1500 mN / 25 mm is preferable.
- the adhesive layer 16 for jigs may have a single layer structure containing an adhesive component, for example. Moreover, the thing of the multiple layer structure by which the layer containing an adhesive component was laminated
- the back surface of a semiconductor wafer (not shown) is attached to the front surface 13a of the film 13 for forming a protective film with the release film 15 removed.
- the upper surface of the surface 16a of the jig adhesive layer 16 is used by being attached to a jig such as a ring frame.
- FIG. 2 is a sectional view schematically showing another embodiment of the composite sheet for forming a protective film of the present invention.
- the same components as those shown in the already explained figures are given the same reference numerals as those in the already explained figures, and their detailed explanations are omitted.
- the protective film-forming composite sheet 1B shown here is the same as the protective film-forming composite sheet 1A shown in FIG. 1 except that it does not include the jig adhesive layer 16. That is, in the protective film-forming composite sheet 1 ⁇ / b> B, the pressure-sensitive adhesive layer 12 is laminated on one surface 11 a of the substrate 11. A protective film-forming film 13 is laminated on the entire surface 12 a of the pressure-sensitive adhesive layer 12, and a release film 15 is laminated on the entire surface 13 a of the protective film-forming film 13.
- the composite sheet 1B for forming a protective film shown in FIG. 2 has a semiconductor wafer (not shown) formed in a partial region on the center side of the surface 13a of the protective film-forming film 13 with the release film 15 removed.
- the back side is affixed.
- region of the peripheral part vicinity of the film 13 for protective film formation is affixed and used for jigs, such as a ring frame.
- FIG. 3 is a cross-sectional view schematically showing still another embodiment of the protective sheet-forming composite sheet of the present invention.
- the protective sheet-forming composite sheet 1 ⁇ / b> C shown here is the same as the protective film-forming composite sheet 1 ⁇ / b> A shown in FIG. 1, except that the adhesive layer 12 is not provided. That is, in the protective film-forming composite sheet 1 ⁇ / b> C, the support sheet 10 is made of only the base material 11. Then, the protective film-forming film 13 is laminated on one surface 11a of the substrate 11 (one surface 10a of the support sheet 10).
- a jig adhesive layer 16 is laminated on a part of the surface 13 a of the protective film forming film 13, that is, in the vicinity of the peripheral portion, and the jig adhesive layer of the surface 13 a of the protective film forming film 13 is laminated.
- a release film 15 is laminated on the surface where 16 is not laminated and the surface 16 a (upper surface and side surface) of the adhesive layer 16 for jigs.
- the adhesive force between the protective film-forming film 13 after curing (ie, the protective film) and the support sheet 10 is: It is preferably 50 to 1500 mN / 25 mm.
- the protective film forming composite sheet 1C is formed on the surface 13a of the protective film forming film 13 with the release film 15 removed.
- the back side of (not shown) is attached.
- the upper surface of the surface 16a of the jig adhesive layer 16 is used by being attached to a jig such as a ring frame.
- FIG. 4 is a sectional view schematically showing still another embodiment of the composite sheet for forming a protective film of the present invention.
- the protective sheet-forming composite sheet 1D shown here is the same as the protective film-forming composite sheet 1C shown in FIG. 3 except that it does not include the jig adhesive layer 16. That is, in the protective film forming composite sheet 1 ⁇ / b> D, the protective film forming film 13 is laminated on one surface 11 a of the substrate 11. A release film 15 is laminated on the entire surface 13 a of the protective film forming film 13.
- the protective film-forming composite sheet 1D shown in FIG. 4 is the same as the protective film-forming composite sheet 1B shown in FIG. 2, with the release film 15 removed, of the surface 13a of the protective film-forming film 13,
- the back surface of a semiconductor wafer (not shown) is attached to a partial area on the center side. Furthermore, the area
- FIG. 5 is a cross-sectional view schematically showing still another embodiment of the composite sheet for forming a protective film of the present invention.
- the protective film-forming composite sheet 1E shown here is the same as the protective film-forming composite sheet 1A shown in FIG. 1 except that the shape of the protective film-forming film is different. That is, the protective film-forming composite sheet 1 ⁇ / b> E includes the pressure-sensitive adhesive layer 12 on the base material 11 and the protective film-forming film 23 on the pressure-sensitive adhesive layer 12.
- the support sheet 10 is a laminate of the base material 11 and the pressure-sensitive adhesive layer 12.
- the protective film-forming composite sheet 1 ⁇ / b> E has a configuration in which the protective film-forming film 23 is laminated on one surface 10 a of the support sheet 10.
- the protective film-forming composite sheet 1 ⁇ / b> E further includes a release film 15 on the protective film-forming film 23.
- the pressure-sensitive adhesive layer 12 is laminated on one surface 11 a of the substrate 11.
- a protective film-forming film 23 is laminated on a part of the surface 12 a of the pressure-sensitive adhesive layer 12, that is, a central region.
- the peeling film 15 is laminated
- the protective film-forming film 23 has a smaller surface area than the pressure-sensitive adhesive layer 12 when the protective film-forming composite sheet 1E is viewed from above and viewed in plan. For example, it has a circular shape or the like.
- the adhesive force between the cured protective film-forming film 23 (that is, the protective film) and the support sheet 10 is 50 to 1500 mN / 25 mm is preferable.
- the back surface of the semiconductor wafer (not shown) is attached to the front surface 23a of the protective film-forming film 23 with the release film 15 removed. Further, the surface of the pressure-sensitive adhesive layer 12 on which the protective film forming film 23 is not laminated is attached to a jig such as a ring frame and used.
- the surface 12a of the pressure-sensitive adhesive layer 12 is the same as that shown in FIGS. 1 and 3 on the surface on which the protective film-forming film 13 is not laminated.
- An adhesive layer for jigs may be laminated (not shown).
- the protective film forming composite sheet 1E provided with such a jig adhesive layer has a jig frame having a ring frame or the like, similar to the protective film forming composite sheet shown in FIGS. Affixed to the jig and used.
- the protective sheet-forming composite sheet of the present invention may have any form of the support sheet and the protective film-forming film, or may be provided with an adhesive layer for jigs.
- the protective film-forming composite sheet of the present invention having a jig adhesive layer has a jig adhesive layer on the protective film-forming film. Are preferred.
- the composite sheet for forming a protective film of the present invention is not limited to the one shown in FIGS. That is, as long as the effects of the present invention are not impaired, a part of the structure shown in FIGS. 1 to 5 is changed or deleted, or another structure is added to what has been described so far. There may be.
- an intermediate layer may be provided between the base material 11 and the protective film-forming film 13. Any intermediate layer can be selected according to the purpose.
- an intermediate layer may be provided between the base material 11 and the pressure-sensitive adhesive layer 12. That is, in the composite sheet for forming a protective film of the present invention, the support sheet may be formed by laminating a base material, an intermediate layer, and an adhesive layer in this order.
- the intermediate layer is the same as the intermediate layer that may be provided in the protective film-forming composite sheet shown in FIGS. Further, in the composite sheet for forming a protective film shown in FIGS.
- layers other than the intermediate layer may be provided at an arbitrary location.
- a gap may be partially formed between the release film and the layer that is in direct contact with the release film.
- the size and shape of each layer can be arbitrarily adjusted according to the purpose.
- a layer such as an adhesive layer that is in direct contact with the protective film-forming film of the support sheet is preferably non-energy ray curable.
- Such a composite sheet for forming a protective film can more easily pick up a semiconductor chip having a protective film on the back surface.
- the support sheet may be transparent, opaque, or colored depending on the purpose. Among them, in the present invention in which the protective film-forming film has energy ray curability, the support sheet is preferably capable of transmitting energy rays.
- permeability of the light of wavelength 375nm is 30% or more. It is more preferably 50% or more, and particularly preferably 70% or more.
- the light transmittance is within such a range, when the protective film-forming film is irradiated with energy rays (ultraviolet rays) via the support sheet, the degree of curing of the protective film-forming film is further improved.
- the upper limit value of the transmittance of light having a wavelength of 375 nm is not particularly limited. For example, it can be 95%.
- permeability of the light of wavelength 532nm is 30% or more in a support sheet. It is more preferably 50% or more, and particularly preferably 70% or more.
- the light transmittance is within such a range, when the protective film-forming film or the protective film is irradiated with laser light through the support sheet and printed on these, printing can be performed more clearly.
- the upper limit value of the transmittance of light having a wavelength of 532 nm is not particularly limited. For example, it can be 95%.
- the transmittance of light having a wavelength of 1064 nm is preferably 30% or more. It is more preferably 50% or more, and particularly preferably 70% or more. When the light transmittance is within such a range, when the protective film-forming film or the protective film is irradiated with laser light through the support sheet and printed on these, printing can be performed more clearly.
- the upper limit value of the transmittance of light having a wavelength of 1064 nm is not particularly limited. For example, it can be 95%.
- the base material is in the form of a sheet or film, and examples of the constituent material include various resins.
- the resin include the following.
- polyethylene such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and high density polyethylene (HDPE)
- polyolefins other than polyethylene such as polypropylene, polybutene, polybutadiene, polymethylpentene, norbornene resin
- ethylene-acetic acid Ethylene copolymers such as vinyl copolymers, ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid ester copolymers, ethylene-norbornene copolymers (obtained using ethylene as a monomer) Copolymers
- vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers (resins obtained using vinyl chloride as a monomer); polystyrene; polycycloolefin; polyethylene terephthalate, poly
- polymer alloys such as a mixture of the said polyester and other resin
- the polymer alloy of the polyester and the other resin is preferably one in which the amount of the resin other than the polyester is relatively small.
- the resin include a crosslinked resin in which one or more of the resins exemplified so far are crosslinked; modification of an ionomer or the like using one or more of the resins exemplified so far. Resins can also be mentioned.
- (meth) acrylic acid is a concept including both “acrylic acid” and “methacrylic acid”. The same applies to terms similar to (meth) acrylic acid.
- the resin constituting the substrate may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the substrate may be composed of one layer (single layer) or may be composed of two or more layers. In the case of a plurality of layers, these layers may be the same as or different from each other, and the combination of these layers is not particularly limited.
- the thickness of the substrate is preferably 50 to 300 ⁇ m, more preferably 60 to 100 ⁇ m.
- the thickness of the substrate means the thickness of the entire substrate.
- the thickness of a base material composed of a plurality of layers means the total thickness of all the layers constituting the base material.
- the base material is preferably one having high thickness accuracy, that is, one in which variation in thickness is suppressed regardless of the part.
- the following materials can be used as materials that can be used to construct a base material having such a high thickness accuracy. Examples thereof include polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer, and the like.
- the base material contains various known additives such as a filler, a colorant, an antistatic agent, an antioxidant, an organic lubricant, a catalyst, and a softener (plasticizer) in addition to the main constituent material such as the resin. May be.
- the substrate may be transparent or opaque. It may be colored according to the purpose, or other layers may be deposited. And in this invention in which the film for protective film formation has energy-beam sclerosis
- the substrate is subjected to a roughening treatment such as sandblast treatment, solvent treatment, corona discharge treatment, electron beam irradiation treatment, plasma treatment.
- the surface may be subjected to oxidation treatment such as ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment.
- the base material may have a surface subjected to primer treatment.
- the base material prevents the base material from adhering to other sheets or the base material from adhering to the adsorption table when the antistatic coating layer and the protective film-forming composite sheet are stored in an overlapping manner. It may have a layer or the like.
- the substrate preferably has a surface subjected to electron beam irradiation treatment from the viewpoint that generation of fragments of the substrate due to blade friction during dicing is suppressed.
- the base material can be manufactured by a known method.
- a base material containing a resin can be produced by molding a resin composition containing the resin.
- the said adhesive layer is a sheet form or a film form, and contains an adhesive.
- the adhesive include adhesive resins such as acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, ester resins, and acrylic resins are preferable. .
- the “adhesive resin” is a concept including both an adhesive resin and an adhesive resin.
- the resin itself has adhesiveness, but also includes a resin that exhibits adhesiveness in combination with other components such as additives, and a resin that exhibits adhesiveness due to the presence of a trigger such as heat or water.
- the pressure-sensitive adhesive layer may be composed of one layer (single layer) or may be composed of two or more layers. In the case of a plurality of layers, these layers may be the same as or different from each other, and the combination of these layers is not particularly limited.
- the thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 ⁇ m.
- the thickness is more preferably 1 to 60 ⁇ m, and particularly preferably 1 to 30 ⁇ m.
- the “thickness of the pressure-sensitive adhesive layer” means the thickness of the entire pressure-sensitive adhesive layer.
- the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers means the total thickness of all the layers constituting the pressure-sensitive adhesive layer.
- the optical properties of the pressure-sensitive adhesive layer only need to satisfy the optical properties of the support sheet described above. That is, the pressure-sensitive adhesive layer may be transparent or opaque. It may be colored according to the purpose. In the present invention in which the protective film-forming film has energy ray curability, the pressure-sensitive adhesive layer is preferably capable of transmitting energy rays.
- the pressure-sensitive adhesive layer may be formed using an energy ray-curable pressure-sensitive adhesive, or may be formed using a non-energy ray-curable pressure-sensitive adhesive.
- the pressure-sensitive adhesive layer formed using the energy ray-curable pressure-sensitive adhesive can easily adjust the physical properties before and after curing.
- the pressure-sensitive adhesive layer can be formed using a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive.
- an adhesive layer can be formed in the target site
- a more specific method for forming the pressure-sensitive adhesive layer will be described later in detail, along with methods for forming other layers.
- the ratio of the content of components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the ratio of the content of the components of the pressure-sensitive adhesive layer.
- “normal temperature” means a temperature at which cooling or heating is not performed, that is, a normal temperature. For example, a temperature of 15 to 25 ° C. can be mentioned.
- Application of the pressure-sensitive adhesive composition may be performed by a known method.
- Examples thereof include methods using various coaters such as an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Meyer bar coater, and kiss coater.
- the drying conditions for the pressure-sensitive adhesive composition are not particularly limited.
- the pressure-sensitive adhesive composition is preferably heat-dried when it contains a solvent described later. In this case, for example, drying is preferably performed at 70 to 130 ° C. for 10 seconds to 5 minutes.
- examples of the pressure sensitive adhesive composition containing the energy ray curable pressure sensitive adhesive include the following.
- a pressure-sensitive adhesive containing a non-energy ray-curable pressure-sensitive adhesive resin (I-1a) (hereinafter sometimes abbreviated as “pressure-sensitive resin (I-1a)”) and an energy beam-curable compound Composition (I-1); energy ray curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of non-energy ray curable adhesive resin (I-1a) (hereinafter referred to as “ A pressure-sensitive adhesive composition (I-2) containing a pressure-sensitive adhesive resin (I-2a); and the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound.
- Examples thereof include a pressure-sensitive adhesive composition (I-3).
- the pressure-sensitive adhesive composition (I-1) contains a non-energy ray-curable pressure-sensitive adhesive resin (I-1a) and an energy ray-curable compound.
- the adhesive resin (I-1a) is preferably an acrylic resin.
- the acrylic resin the acrylic polymer which has a structural unit derived from the (meth) acrylic-acid alkylester at least is mentioned, for example.
- the acrylic resin may have only one type of structural unit, or two or more types of structural units. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- Examples of the (meth) acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms.
- the alkyl group is preferably linear or branched.
- Specific examples of the (meth) acrylic acid alkyl ester include the following.
- the acrylic polymer preferably has a structural unit derived from a (meth) acrylic acid alkyl ester in which the alkyl group has 4 or more carbon atoms.
- the alkyl group preferably has 4 to 12 carbon atoms, more preferably 4 to 8 carbon atoms.
- the (meth) acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group is preferably an acrylic acid alkyl ester.
- the acrylic polymer preferably has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from an alkyl (meth) acrylate.
- the functional group-containing monomer for example, the functional group reacts with a cross-linking agent described later to become a starting point of cross-linking, or the functional group reacts with an unsaturated group in the unsaturated group-containing compound described later. And those that allow introduction of an unsaturated group into the side chain of the acrylic polymer.
- Examples of the functional group in the functional group-containing monomer include a hydroxyl group, a carboxy group, an amino group, and an epoxy group. That is, examples of the functional group-containing monomer include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer.
- hydroxyl group-containing monomer examples include the following. For example, hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, Hydroxyalkyl (meth) acrylates such as 3-hydroxybutyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate; non- (meth) acrylic unsaturated alcohols such as vinyl alcohol and allyl alcohol ((meth) acryloyl) And unsaturated alcohol having no skeleton).
- carboxy group-containing monomer examples include the following.
- ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid (monocarboxylic acids having an ethylenically unsaturated bond); ethylenically unsaturated dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid
- acids dicarboxylic acids having an ethylenically unsaturated bond
- anhydrides of the ethylenically unsaturated dicarboxylic acids (meth) acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate and the like.
- the functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxy group-containing monomer, more preferably a hydroxyl group-containing monomer.
- the functional group-containing monomer constituting the acrylic polymer may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the structural unit derived from the functional group-containing monomer is preferably 1 to 35% by mass with respect to the total amount of the structural unit. It is more preferably 2 to 32% by mass, and particularly preferably 3 to 30% by mass.
- the acrylic polymer may further have a structural unit derived from another monomer.
- the other monomer is not particularly limited as long as it is copolymerizable with (meth) acrylic acid alkyl ester or the like.
- Examples of the other monomer include styrene, ⁇ -methylstyrene, vinyl toluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide and the like.
- the other monomer constituting the acrylic polymer may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the acrylic polymer can be used as the above-mentioned non-energy ray curable adhesive resin (I-1a).
- the functional group in the acrylic polymer is reacted with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group). It can be used as the resin (I-2a).
- the pressure-sensitive adhesive composition (I-1) contained in the pressure-sensitive adhesive composition (I-1) may be one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the adhesive resin (I-1a) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
- Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) include monomers or oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays.
- Examples of the energy ray curable compounds include the following.
- trimethylolpropane tri (meth) acrylate pentaerythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6 -Polyvalent (meth) acrylates such as hexanediol (meth) acrylate; urethane (meth) acrylate; polyester (meth) acrylate; polyether (meth) acrylate; epoxy (meth) acrylate and the like.
- examples of the oligomer include an oligomer formed by polymerizing the monomers exemplified above.
- the energy ray-curable compound is preferably a urethane (meth) acrylate or a urethane (meth) acrylate oligomer from the viewpoint that the molecular weight is relatively large and the storage elastic modulus of the pressure-sensitive adhesive layer is hardly lowered.
- the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the energy ray-curable compound is preferably 1 to 95% by mass. It is more preferably 5 to 90% by mass, and particularly preferably 10 to 85% by mass.
- the adhesive resin (I-1a) in addition to the structural unit derived from (meth) acrylic acid alkyl ester, the acrylic polymer having a structural unit derived from a functional group-containing monomer may be used.
- the pressure-sensitive adhesive composition (I-1) preferably further contains a crosslinking agent.
- the cross-linking agent reacts with the functional group to cross-link the adhesive resins (I-1a).
- the following are mentioned as a crosslinking agent.
- tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, isocyanate-based cross-linking agents such as adducts of these diisocyanates (cross-linking agents having an isocyanate group); epoxy-based cross-linking agents such as ethylene glycol glycidyl ether (cross-linking having a glycidyl group) Agent); aziridine-based crosslinking agent (cross-linking agent having an aziridinyl group) such as hexa [1- (2-methyl) -aziridinyl] triphosphatriazine; metal chelate-based crosslinking agent such as aluminum chelate (cross-linking having a metal chelate structure) Agent); isocyanurate-based crosslinking agent (crosslinking agent
- the crosslinking agent contained in the pressure-sensitive adhesive composition (I-1) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the crosslinking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive resin (I-1a).
- the amount is more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
- the pressure-sensitive adhesive composition (I-1) may further contain a photopolymerization initiator.
- the pressure-sensitive adhesive composition (I-1) containing a photopolymerization initiator sufficiently proceeds with a curing reaction even when irradiated with a relatively low energy beam such as ultraviolet rays.
- photopolymerization initiator examples include the following.
- benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal; acetophenone, 2-hydroxy-2-methyl-1-phenyl Acetophenone compounds such as propan-1-one and 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6- Acylphosphine oxide compounds such as trimethylbenzoyldiphenylphosphine oxide; Sulfide compounds such as benzylphenyl sulfide and tetramethylthiuram monosulfide; 1-hydroxycyclo ⁇ -ketol compounds such as xylphenyl ketone;
- the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-1) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the energy ray curable compound.
- the amount is more preferably 0.03 to 10 parts by weight, and particularly preferably 0.05 to 5 parts by weight.
- the pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-mentioned components within a range not impairing the effects of the present invention.
- the other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers.
- known additives such as reaction retarders and crosslinking accelerators (catalysts).
- the reaction retarding agent means, for example, an undesired crosslinking reaction in the pressure-sensitive adhesive composition (I-1) during storage by the action of the catalyst mixed in the pressure-sensitive adhesive composition (I-1). It suppresses progress.
- the reaction retarder include those that form a chelate complex by chelation against a catalyst. More specifically, one having two or more carbonyl groups (—C ( ⁇ O) —) in one molecule can be mentioned.
- the other additive contained in the pressure-sensitive adhesive composition (I-1) may be one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of other additives is not particularly limited, and may be appropriately selected according to the type.
- the pressure-sensitive adhesive composition (I-1) may contain a solvent. Since the pressure-sensitive adhesive composition (I-1) contains a solvent, the suitability for coating on the surface to be coated is improved.
- the solvent is preferably an organic solvent.
- organic solvent include ketones such as methyl ethyl ketone and acetone; esters such as ethyl acetate (carboxylic acid esters); ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; toluene and xylene. Aromatic hydrocarbons; alcohols such as 1-propanol and 2-propanol.
- the solvent used in the production of the adhesive resin (I-1a) may be used as it is in the adhesive composition (I-1) without being removed from the adhesive resin (I-1a).
- a solvent of the same or different type used in the production of the adhesive resin (I-1a) may be added separately during the production of the adhesive composition (I-1).
- the solvent contained in the pressure-sensitive adhesive composition (I-1) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the solvent is not particularly limited, and may be adjusted as appropriate.
- the pressure-sensitive adhesive composition (I-2) is an energy-ray-curable pressure-sensitive adhesive resin in which an unsaturated group is introduced into the side chain of the non-energy-ray-curable pressure-sensitive adhesive resin (I-1a). (I-2a) is contained.
- the adhesive resin (I-2a) can be obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray polymerizable unsaturated group.
- the unsaturated group-containing compound can be bonded to the adhesive resin (I-1a) by reacting with the functional group in the adhesive resin (I-1a) in addition to the energy ray polymerizable unsaturated group.
- a compound having a group examples include (meth) acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like.
- a (meth) acryloyl group is preferred.
- Examples of the group capable of binding to the functional group in the adhesive resin (I-1a) include, for example, an isocyanate group and a glycidyl group that can be bonded to a hydroxyl group or an amino group, and a hydroxyl group and an amino group that can be bonded to a carboxy group or an epoxy group. Etc.
- Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, glycidyl (meth) acrylate, and the like.
- the pressure-sensitive adhesive composition (I-2) contained in the pressure-sensitive adhesive composition (I-2) may be one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the pressure-sensitive resin (I-2a) is preferably 5 to 99% by mass.
- the content is more preferably 10 to 95% by mass, and particularly preferably 10 to 90% by mass.
- an adhesive composition ( I-2) may further contain a crosslinking agent.
- Examples of the crosslinking agent in the pressure-sensitive adhesive composition (I-2) include the same crosslinking agents as in the pressure-sensitive adhesive composition (I-1).
- the crosslinking agent contained in the pressure-sensitive adhesive composition (I-2) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the crosslinking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive resin (I-2a).
- the amount is more preferably 0.1 to 20 parts by weight, and particularly preferably 0.3 to 15 parts by weight.
- the pressure-sensitive adhesive composition (I-2) may further contain a photopolymerization initiator.
- the pressure-sensitive adhesive composition (I-2) containing the photopolymerization initiator sufficiently proceeds with the curing reaction even when irradiated with a relatively low energy beam such as ultraviolet rays.
- Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiator as in the pressure-sensitive adhesive composition (I-1).
- the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-2) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the photopolymerization initiator is preferably 0.01 to 20 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive resin (I-2a). .
- the amount is more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
- the pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components within a range not impairing the effects of the present invention.
- Examples of the other additive in the pressure-sensitive adhesive composition (I-2) include the same additives as those in the pressure-sensitive adhesive composition (I-1).
- the other additive contained in the pressure-sensitive adhesive composition (I-2) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of other additives is not particularly limited, and may be appropriately selected according to the type.
- the pressure-sensitive adhesive composition (I-2) may contain a solvent for the same purpose as that of the pressure-sensitive adhesive composition (I-1).
- Examples of the solvent in the pressure-sensitive adhesive composition (I-2) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
- the solvent contained in the pressure-sensitive adhesive composition (I-2) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the solvent is not particularly limited, and may be adjusted as appropriate.
- the pressure-sensitive adhesive composition (I-3) contains the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound.
- the content of the pressure-sensitive resin (I-2a) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
- Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) include monomers and oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays. That is, the same energy ray-curable compound as the pressure-sensitive adhesive composition (I-1) contains.
- the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the energy ray-curable compound is 0.01 to 300 parts by mass with respect to 100 parts by mass of the adhesive resin (I-2a). It is preferable.
- the amount is more preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass.
- the pressure-sensitive adhesive composition (I-3) may further contain a photopolymerization initiator.
- the pressure-sensitive adhesive composition (I-3) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with energy rays of relatively low energy such as ultraviolet rays.
- Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiator as in the pressure-sensitive adhesive composition (I-1).
- the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-3) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the photopolymerization initiator is 0.01 to about 100 parts by mass of the total content of the pressure-sensitive adhesive resin (I-2a) and the energy ray curable compound. It is preferably 20 parts by mass. The amount is more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
- the pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components within a range not impairing the effects of the present invention.
- Examples of the other additive include the same additives as those in the pressure-sensitive adhesive composition (I-1).
- the other additive contained in the pressure-sensitive adhesive composition (I-3) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of other additives is not particularly limited, and may be appropriately selected according to the type.
- the pressure-sensitive adhesive composition (I-3) may contain a solvent for the same purpose as that of the pressure-sensitive adhesive composition (I-1).
- Examples of the solvent in the pressure-sensitive adhesive composition (I-3) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
- the solvent contained in the pressure-sensitive adhesive composition (I-3) may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the solvent is not particularly limited, and may be adjusted as appropriate.
- Examples of the pressure-sensitive adhesive composition other than the pressure-sensitive adhesive compositions (I-1) to (I-3) include non-energy ray-curable pressure-sensitive adhesive compositions in addition to the energy ray-curable pressure-sensitive adhesive composition.
- Examples of the non-energy ray curable pressure-sensitive adhesive composition include the following. For example, it contains non-energy ray-curable adhesive resin (I-1a) such as acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polyvinyl ether, polycarbonate, ester resin, etc. Examples thereof include an adhesive composition (I-4), and those containing an acrylic resin are preferred.
- the pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) preferably contain one or more kinds of crosslinking agents.
- the content can be the same as in the case of the above-mentioned pressure-sensitive adhesive composition (I-1) and the like.
- Adhesive resin (I-1a) examples of the adhesive resin (I-1a) in the pressure-sensitive adhesive composition (I-4) include the same as the pressure-sensitive adhesive resin (I-1a) in the pressure-sensitive adhesive composition (I-1).
- the adhesive resin (I-1a) contained in the adhesive composition (I-4) may be one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the pressure-sensitive resin (I-1a) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
- the adhesive resin (I-1a) in addition to the structural unit derived from (meth) acrylic acid alkyl ester, the acrylic polymer having a structural unit derived from a functional group-containing monomer may be used.
- the pressure-sensitive adhesive composition (I-4) preferably further contains a crosslinking agent.
- Examples of the crosslinking agent in the pressure-sensitive adhesive composition (I-4) include the same crosslinking agents as those in the pressure-sensitive adhesive composition (I-1).
- the crosslinking agent contained in the pressure-sensitive adhesive composition (I-4) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the crosslinking agent is preferably 0.01 to 50 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive resin (I-1a).
- the amount is more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
- the pressure-sensitive adhesive composition (I-4) may contain other additives that do not fall under any of the above-mentioned components within a range not impairing the effects of the present invention.
- Examples of the other additive include the same additives as those in the pressure-sensitive adhesive composition (I-1).
- the other additive contained in the pressure-sensitive adhesive composition (I-4) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of other additives is not particularly limited, and may be appropriately selected according to the type.
- the pressure-sensitive adhesive composition (I-4) may contain a solvent for the same purpose as that of the pressure-sensitive adhesive composition (I-1).
- Examples of the solvent in the pressure-sensitive adhesive composition (I-4) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
- the solvent contained in the pressure-sensitive adhesive composition (I-4) may be one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the solvent is not particularly limited and may be appropriately adjusted.
- the pressure-sensitive adhesive layer is preferably non-energy ray curable. This is because when the pressure-sensitive adhesive layer is energy ray curable, it is sometimes impossible to suppress the pressure-sensitive adhesive layer from being simultaneously cured when the protective film-forming film is cured by irradiation with energy rays. If the pressure-sensitive adhesive layer is cured at the same time as the protective film-forming film, the cured protective film-forming film and the pressure-sensitive adhesive layer may stick to the interface so as not to be peeled off.
- a cured protective film-forming film that is, a semiconductor chip provided with a protective film on the back surface (in this specification, sometimes referred to as “semiconductor chip with protective film”) is cured adhesive layer. It becomes difficult to peel off from the support sheet provided with, and the semiconductor chip with a protective film cannot be picked up normally.
- the pressure-sensitive adhesive layer non-energy ray curable with the support sheet in the present invention, such a problem can be avoided reliably. That is, the semiconductor chip with a protective film can be picked up more easily.
- the effect when the pressure-sensitive adhesive layer is non-energy ray curable has been described.
- the layer in direct contact with the protective film-forming film of the support sheet is a layer other than the pressure-sensitive adhesive layer, the same effect can be obtained as long as this layer is non-energy ray curable.
- the pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) such as the pressure-sensitive adhesive compositions (I-1) to (I-3) and the pressure-sensitive adhesive composition (I-4) It is obtained by blending each component for constituting the pressure-sensitive adhesive composition, such as the pressure-sensitive adhesive and components other than the pressure-sensitive adhesive, if necessary.
- the order of addition at the time of blending each component is not particularly limited, and two or more components may be added simultaneously.
- it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance.
- the method of mixing each component at the time of mixing is not particularly limited. What is necessary is just to select suitably from well-known methods, such as the method of rotating and stirring a stirring bar or a stirring blade, the method of mixing using a mixer, and the method of mixing by adding an ultrasonic wave.
- the temperature and time during addition and mixing of each component are not particularly limited as long as each compounding component does not deteriorate, and may be adjusted as appropriate. However, the temperature is preferably 15 to 30 ° C.
- the adhesive force between the protective film obtained by curing the protective film-forming film and the support sheet is preferably 50 to 1500 mN / 25 mm. More preferably, it is 52 to 1450 mN / 25 mm, and further preferably 53 to 1430 mN / 25 mm.
- the adhesive force is greater than or equal to the lower limit, pickup of a semiconductor chip with a protective film that is not the purpose is suppressed during pickup of the semiconductor chip with a protective film. As a result, the target semiconductor chip with a protective film can be picked up with high selectivity.
- the adhesive force is equal to or less than the upper limit value, cracking and chipping of the semiconductor chip are suppressed when the semiconductor chip with a protective film is picked up.
- the adhesive force is within a specific range, the composite sheet for forming a protective film has good pickup suitability.
- the laminated structure of the cured product of the support sheet and the protective film-forming film (in other words, the support sheet and the protective film) is maintained.
- this laminate structure is referred to as a “composite sheet for forming a protective film”.
- the adhesive force between the protective film and the support sheet can be measured by the following method. That is, a protective film-forming composite sheet having a width of 25 mm and an arbitrary length is attached to an adherend by the protective film-forming film. Next, the protective film-forming film is cured by irradiating energy rays to form a protective film. Thereafter, the support sheet is peeled off at a peeling speed of 300 mm / min from this protective film adhered to the adherend. At this time, the support sheet is peeled in the length direction (the length direction of the composite sheet for forming the protective film) so that the surfaces of the protective film and the support sheet that are in contact with each other form an angle of 180 °. The so-called 180 ° peeling is performed. And the load (peeling force) at the time of this 180 degree
- the length of the protective film-forming composite sheet used for measurement is not particularly limited as long as the adhesive force can be stably detected. However, it is preferably 100 to 300 mm. In the measurement, it is preferable that the protective sheet-forming composite sheet is stuck on the adherend and the sticking state of the protective film-forming composite sheet is stabilized.
- the adhesive force between the protective film-forming film and the support sheet is not particularly limited.
- it may be 80 mN / 25 mm or more, but is preferably 100 mN / 25 mm or more. It is more preferably 150 mN / 25 mm or more, and particularly preferably 200 mN / 25 mm or more.
- peeling between the protective film-forming film and the support sheet is suppressed during dicing.
- the scattering from the support sheet of the semiconductor chip provided with the protective film forming film on the back surface is suppressed.
- the upper limit of the adhesive force between the protective film-forming film and the support sheet is not particularly limited.
- it can be any of 4000 mN / 25 mm, 3500 mN / 25 mm, 3000 mN / 25 mm, and the like. However, these are examples.
- the adhesive force between the protective film-forming film and the support sheet is between the protective film and the support sheet, except that the protective film-forming film used for measurement is not cured by irradiation with energy rays. It can be measured by the same method as adhesive strength.
- the above-mentioned adhesive force between the protective film and the support sheet and the adhesive force between the protective film-forming film and the support sheet can be appropriately adjusted.
- it can be adjusted by adjusting the type and amount of the components contained in the protective film-forming film, the constituent material of the layer on the support sheet where the protective film-forming film is provided, the surface state of this layer, and the like.
- the type and amount of the component contained in the protective film-forming film can be adjusted by the type and amount of the component contained in the protective film-forming composition described below. And among the components of the composition for forming a protective film, for example, the type and content of the polymer (b) having no energy ray curable group, the content of the filler (d), or the crosslinking agent (f) By adjusting the content of, the adhesive force between the protective film or the protective film-forming film and the support sheet can be adjusted more easily.
- the constituent material can be adjusted as appropriate by adjusting the type and amount of components contained in the adhesive layer. .
- the kind and quantity of the component of an adhesive layer can be adjusted with the kind and quantity of the component of an above-mentioned adhesive composition.
- the adhesive force between the protective film or the protective film-forming film and the support sheet is not limited to the constituent material of the base material.
- the surface condition of the substrate can also be adjusted.
- the surface state of a base material can be adjusted by performing the surface treatment previously mentioned as what improves the adhesiveness with the other layer of a base material, for example.
- roughening treatment by sandblast treatment, solvent treatment, etc .; corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet radiation treatment, oxidation treatment such as flame treatment, chromic acid treatment, hot air treatment, etc .; primer treatment, etc. Can be adjusted by applying
- the protective film-forming film has energy ray curability.
- an energy-beam curable component (a) is mentioned,
- the energy-beam curable component (a), the polymer (b) which does not have an energy-beam curable group, and an antistatic agent (j) are contained. Those are preferred.
- the energy ray curable component (a) is preferably uncured. It is preferable to have adhesiveness, and more preferably uncured and adhesive.
- the protective film-forming film may be a single layer (single layer) or a plurality of layers of two or more layers. In the case of a plurality of layers, these layers may be the same as or different from each other, and the combination of these layers is not particularly limited.
- the thickness of the protective film-forming film is preferably 1 to 100 ⁇ m. It is more preferably 5 to 75 ⁇ m, and particularly preferably 5 to 50 ⁇ m. When the thickness of the protective film-forming film is equal to or more than the lower limit value, a protective film having higher protective ability can be formed. Moreover, when the thickness of the protective film-forming film is equal to or less than the upper limit, an excessive thickness is suppressed.
- the “thickness of the protective film-forming film” means the thickness of the entire protective film-forming film.
- the thickness of the protective film-forming film composed of a plurality of layers means the total thickness of all layers constituting the protective film-forming film.
- the curing conditions for forming the protective film by curing the protective film-forming film are not particularly limited as long as the degree of curing is such that the protective film sufficiently exhibits its function. What is necessary is just to select suitably according to the kind of film for protective film formation.
- the illuminance of the energy rays when the protective film-forming film is cured is preferably 4 to 280 mW / cm 2 .
- the amount of energy rays during the curing is preferably 3 to 1000 mJ / cm 2 .
- the protective film-forming film can be formed using a protective film-forming composition containing the constituent materials.
- the protective film-forming film can be formed at the target site by applying the protective film-forming composition to the surface on which the protective film-forming film is to be formed and drying it as necessary.
- the content ratio of components that do not vaporize at room temperature is usually the same as the content ratio of the components of the film for forming a protective film.
- “normal temperature” is as described above.
- Coating of the protective film forming composition may be performed by a known method.
- examples thereof include methods using various coaters such as an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Meyer bar coater, and kiss coater.
- the drying conditions of the protective film forming composition are not particularly limited.
- the protective film-forming composition is preferably heat-dried when it contains a solvent to be described later. In this case, for example, drying is preferably performed at 70 to 130 ° C. for 10 seconds to 5 minutes.
- composition for forming protective film (IV-1) examples include a protective film forming composition (IV-1) containing the energy ray curable component (a).
- the energy ray-curable component (a) is a component that is cured by irradiation with energy rays, and is also a component for imparting film-forming property, flexibility, and the like to the protective film-forming film.
- Examples of the energy ray-curable component (a) include a polymer (a1) having an energy ray-curable group and a weight average molecular weight of 80000 to 2000000, and an energy ray-curable group and a molecular weight of 100 to 80000.
- a compound (a2) is mentioned.
- the polymer (a1) may be at least partially crosslinked by a crosslinking agent (f) described later, or may not be crosslinked.
- the weight average molecular weight means a polystyrene equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.
- Polymer (a1) having an energy ray curable group and having a weight average molecular weight of 80,000 to 2,000,000 examples include an acrylic polymer (a11) having a functional group capable of reacting with a group of another compound, An acrylic resin (a1-1) obtained by polymerizing a group that reacts with a functional group and an energy ray curable compound (a12) having an energy ray curable group such as an energy ray curable double bond. .
- Examples of the functional group capable of reacting with a group possessed by another compound include a hydroxyl group, a carboxy group, an amino group, and a substituted amino group (one or two hydrogen atoms of the amino group are substituted with a group other than a hydrogen atom). Group), an epoxy group, and the like.
- the functional group is preferably a group other than a carboxy group from the viewpoint of preventing corrosion of a circuit such as a semiconductor wafer or a semiconductor chip.
- the functional group is preferably a hydroxyl group.
- the acrylic polymer (a11) having a functional group examples include those obtained by copolymerization of an acrylic monomer having the functional group and an acrylic monomer having no functional group. In addition to these monomers, monomers other than acrylic monomers (non-acrylic monomers) may be copolymerized.
- the acrylic polymer (a11) may be a random copolymer or a block copolymer.
- acrylic monomer having a functional group examples include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, a substituted amino group-containing monomer, and an epoxy group-containing monomer.
- hydroxyl group-containing monomer examples include the following. For example, hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, Hydroxyalkyl (meth) acrylates such as 3-hydroxybutyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate; non- (meth) acrylic unsaturated alcohols such as vinyl alcohol and allyl alcohol ((meth) acryloyl) And unsaturated alcohol having no skeleton).
- carboxy group-containing monomer examples include the following.
- ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid (monocarboxylic acids having an ethylenically unsaturated bond); ethylenically unsaturated dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid
- acids dicarboxylic acids having an ethylenically unsaturated bond
- anhydrides of the ethylenically unsaturated dicarboxylic acids (meth) acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate and the like.
- the acrylic monomer having a functional group is preferably a hydroxyl group-containing monomer or a carboxy group-containing monomer, more preferably a hydroxyl group-containing monomer.
- the acrylic monomer having the functional group constituting the acrylic polymer (a11) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- acrylic monomer having no functional group examples include the following. For example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, (meth ) Sec-butyl acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic Isooctyl acid, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth
- (meth) acrylic acid ester containing alkoxyalkyl groups such as methoxymethyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxymethyl (meth) acrylate, ethoxyethyl (meth) acrylate;
- (meth) acrylic acid N, N-dimethylamino Examples also include (meth) acrylic acid esters having a non-crosslinkable tertiary amino group such as ethyl and N, N-dimethylaminopropyl (meth) acrylate.
- the acrylic monomer which does not have the functional group constituting the acrylic polymer (a11) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- non-acrylic monomer examples include olefins such as ethylene and norbornene; vinyl acetate; styrene.
- the said non-acrylic monomer which comprises the said acrylic polymer (a11) may be only 1 type, and 2 or more types may be sufficient as it. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the ratio (content) of the amount of the structural unit derived from the acrylic monomer having the functional group to the total amount of the structural unit constituting the polymer is 0.1 to 50 mass. % Is preferred.
- the content is more preferably 1 to 40% by mass, and particularly preferably 3 to 30% by mass.
- the acrylic resin (a1-1) obtained by copolymerization of the acrylic polymer (a11) and the energy ray-curable compound (a12) The content of the linear curable group can easily adjust the degree of curing of the first protective film within a preferable range.
- the acrylic polymer (a11) constituting the acrylic resin (a1-1) may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the acrylic resin (a1-1) is preferably 1 to 40% by mass.
- the content is more preferably 2 to 30% by mass, and particularly preferably 3 to 20% by mass.
- the energy ray curable compound (a12) is one or two selected from the group consisting of an isocyanate group, an epoxy group and a carboxy group as a group capable of reacting with the functional group of the acrylic polymer (a11). Those having the above are preferred, and those having an isocyanate group as the group are more preferred. For example, when the energy beam curable compound (a12) has an isocyanate group as the group, the isocyanate group easily reacts with the hydroxyl group of the acrylic polymer (a11) having a hydroxyl group as the functional group.
- the energy ray curable compound (a12) preferably has 1 to 5 energy ray curable groups in one molecule, and more preferably 1 to 3 energy ray curable groups.
- Examples of the energy ray curable compound (a12) include the following.
- Examples thereof include an acryloyl monoisocyanate compound obtained by a reaction of a diisocyanate compound or polyisocyanate compound, a polyol compound, and hydroxyethyl (meth) acrylate.
- the energy beam curable compound (a12) is preferably 2-methacryloyloxyethyl isocyanate.
- the energy ray-curable compound (a12) constituting the acrylic resin (a1-1) may be only one type or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the ratio is preferably 20 to 120 mol%. More preferably, it is 35 to 100 mol%, and particularly preferably 50 to 100 mol%. When the ratio of the content is within such a range, the adhesive force of the protective film formed by curing is further increased.
- the said energy-beam curable compound (a12) is a monofunctional (it has 1 said group in 1 molecule) compound, the upper limit of the ratio of the said content will be 100 mol%.
- the energy ray curable compound (a12) is a polyfunctional compound (having two or more of the groups in one molecule), the upper limit of the content ratio may exceed 100 mol%. is there.
- the weight average molecular weight (Mw) of the polymer (a1) is preferably 100,000 to 2,000,000, and more preferably 300,000 to 1500,000.
- the polymer (a1) is at least partly crosslinked by the crosslinking agent (f)
- the polymer (a1) is described as constituting the acrylic polymer (a11).
- a monomer that does not correspond to any of the above-described monomers and has a group that reacts with the crosslinking agent (f) is polymerized to be crosslinked at the group that reacts with the crosslinking agent (f). .
- the group which reacts with the said functional group derived from the said energy-beam curable compound (a12) what was bridge
- the polymer (a1) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- Compound (a2) having an energy ray curable group and a molecular weight of 100 to 80,000 examples include groups containing an energy beam curable double bond. Preferable examples include (meth) acryloyl group, vinyl group and the like.
- the compound (a2) is not particularly limited as long as it satisfies the above conditions.
- a low molecular weight compound having an energy ray curable group, an epoxy resin having an energy ray curable group, a phenol resin having an energy ray curable group, and the like can be mentioned.
- examples of the low molecular weight compound having an energy ray curable group include polyfunctional monomers or oligomers.
- An acrylate compound having a (meth) acryloyl group is preferred.
- examples of the acrylate compound include the following.
- the epoxy resin having an energy ray curable group and the phenol resin having an energy ray curable group are described in, for example, paragraph 0043 of “JP 2013-194102 A”. Things can be used.
- Such a resin corresponds to a resin constituting the thermosetting component (h) described later, but is treated as the compound (a2) in the present invention.
- the compound (a2) preferably has a weight average molecular weight of 100 to 30,000, more preferably 300 to 10,000.
- the compound (a2) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- Polymer (b) having no energy ray curable group When the protective film forming composition (IV-1) and the protective film forming film contain the compound (a2) as the energy ray curable component (a), the polymer further does not have an energy ray curable group. It is also preferable to contain (b).
- the polymer (b) may be at least partially crosslinked by the crosslinking agent (f) or may not be crosslinked.
- polymer (b) having no energy ray curable group examples include acrylic polymers, phenoxy resins, urethane resins, polyesters, rubber resins, acrylic urethane resins, polyvinyl alcohol (PVA), butyral resins, and polyester urethanes. Examples thereof include resins.
- the polymer (b) is preferably an acrylic polymer (hereinafter sometimes abbreviated as “acrylic polymer (b-1)”).
- the acrylic polymer (b-1) may be a known one.
- a homopolymer of one kind of acrylic monomer may be used, a copolymer of two or more kinds of acrylic monomers may be used, one kind or two or more kinds of acrylic monomers, and 1 It may be a copolymer with a monomer (non-acrylic monomer) other than seeds or two or more acrylic monomers.
- acrylic monomer constituting the acrylic polymer (b-1) examples include the following.
- the “substituted amino group” is as described above.
- Examples of the (meth) acrylic acid alkyl ester include the following. For example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, (meth ) Sec-butyl acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic Isooctyl acid, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, unde
- Examples of the (meth) acrylic acid ester having a cyclic skeleton include the following.
- (meth) acrylic acid cycloalkyl esters such as isobornyl (meth) acrylate and dicyclopentanyl (meth) acrylate
- (Meth) acrylic acid aralkyl esters such as (meth) acrylic acid benzyl
- (Meth) acrylic acid cycloalkenyl esters such as (meth) acrylic acid dicyclopentenyl ester
- Examples of the glycidyl group-containing (meth) acrylic ester include glycidyl (meth) acrylate.
- Examples of the hydroxyl group-containing (meth) acrylic acid ester include the following. For example, hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, Examples include 3-hydroxybutyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.
- Examples of the substituted amino group-containing (meth) acrylic acid ester include N-methylaminoethyl (meth) acrylate.
- non-acrylic monomer constituting the acrylic polymer (b-1) examples include olefins such as ethylene and norbornene; vinyl acetate; styrene.
- the reactive functional group in the polymer (b) is a crosslinking agent (f ).
- the reactive functional group may be appropriately selected according to the type of the crosslinking agent (f) and the like, and is not particularly limited.
- the crosslinking agent (f) is a polyisocyanate compound
- examples of the reactive functional group include a hydroxyl group, a carboxy group, and an amino group. Among these, a hydroxyl group having high reactivity with an isocyanate group. Is preferred.
- the crosslinking agent (f) is an epoxy compound
- examples of the reactive functional group include a carboxy group, an amino group, and an amide group.
- a carboxy group having high reactivity with an epoxy group is preferable.
- the reactive functional group is preferably a group other than a carboxy group in terms of preventing corrosion of a circuit of a semiconductor wafer or a semiconductor chip.
- Examples of the polymer (b) having the reactive functional group and not having the energy ray-curable group include those obtained by polymerizing at least the monomer having the reactive functional group.
- examples of the polymer (b) having a hydroxyl group as a reactive functional group include those obtained by polymerizing a hydroxyl group-containing (meth) acrylic acid ester.
- the acrylic monomer or non-acrylic monomer mentioned above is obtained by polymerizing a monomer in which one or two or more hydrogen atoms are substituted with the reactive functional group. Can be mentioned.
- the ratio (content) of the amount of the structural unit derived from the monomer having the reactive functional group to the total amount of the structural unit constituting the polymer (b) is 1 to 25.
- the mass is preferably 2, and more preferably 2 to 20 mass%. When the ratio is within such a range, the degree of cross-linking becomes a more preferable range in the polymer (b).
- the weight average molecular weight (Mw) of the polymer (b) having no energy ray-curable group is 10,000 to 2,000,000 from the viewpoint that the film-forming property of the protective film-forming composition (IV-1) becomes better. It is preferably 100000 to 1500,000.
- the polymer (b) having no energy ray-curable group contained in the protective film-forming composition (IV-1) and the protective film-forming film may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- Examples of the protective film-forming composition (IV-1) include those containing one or both of the polymer (a1) and the compound (a2).
- the protective film-forming composition (IV-1) contains the compound (a2), it preferably further contains a polymer (b) having no energy ray-curable group. In this case, it is also preferable to further contain (a1).
- the protective film-forming composition (IV-1) does not contain the compound (a2) and contains both the polymer (a1) and the polymer (b) having no energy ray-curable group. It may be.
- the protective film-forming composition (IV-1) contains the polymer (a1), the compound (a2) and the polymer (b) having no energy ray-curable group
- the protective film-forming composition In (IV-1) the content of the compound (a2) is 10 to 10 parts per 100 parts by mass of the total content of the polymer (a1) and the polymer (b) having no energy ray-curable group.
- the amount is preferably 400 parts by mass, and more preferably 30 to 350 parts by mass.
- the total content of the energy beam curable component (a) and the polymer (b) having no energy beam curable group with respect to the total content of components other than the solvent is 5 to 90% by mass.
- the total content of the energy ray-curable component (a) and the polymer (b) having no energy ray-curable group in the protective film-forming film is 5 to 90% by mass.
- It is more preferably 10 to 80% by mass, and particularly preferably 15 to 70% by mass.
- the protective film forming composition (IV-1) contains the energy beam curable component (a) and the polymer (b) having no energy beam curable group
- the protective film forming composition (IV-1) ) And the protective film-forming film the content of the polymer (b) is preferably 3 to 160 parts by mass with respect to 100 parts by mass of the energy ray-curable component (a). More preferably, it is ⁇ 130 parts by mass.
- the content of the polymer (b) is in such a range, the energy ray curability of the protective film-forming film becomes better.
- the protective film-forming composition (IV-1) may contain the following in addition to the energy ray-curable component (a) and the polymer (b) having no energy ray-curable group. That is, depending on the purpose, photopolymerization initiator (c), filler (d), coupling agent (e), crosslinking agent (f), colorant (g), thermosetting component (h), and general purpose You may contain 1 type, or 2 or more types selected from the group which consists of an additive (z). For example, by using the protective film-forming composition (IV-1) containing the energy ray-curable component (a) and the thermosetting component (h), the protective film-forming film formed is heated. Adhesive strength to the adherend is improved. Furthermore, the strength of the protective film formed from this protective film-forming film is also improved.
- Photoinitiator (c) The following are mentioned as a photoinitiator (c).
- benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal; acetophenone, 2-hydroxy-2-methyl-1-phenyl Acetophenone compounds such as propan-1-one and 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6- Acylphosphine oxide compounds such as trimethylbenzoyldiphenylphosphine oxide; Sulfide compounds such as benzylphenyl sulfide and tetramethylthiuram monosulfide; 1-hydroxycyclo ⁇ -ketol compounds such as
- the photopolymerization initiator (c) contained in the protective film-forming composition (IV-1) may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the photopolymerization initiator (c) is 100 parts by mass of the energy ray-curable compound (a).
- the amount is preferably 0.01 to 20 parts by mass.
- the amount is more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
- the protective film-forming film contains the filler (d)
- the protective film obtained by curing the protective film-forming film can easily adjust the thermal expansion coefficient.
- the reliability of the package obtained using the composite sheet for forming a protective film is further improved by optimizing this thermal expansion coefficient with respect to the object for forming the protective film.
- the moisture absorption rate of a protective film can be reduced or heat dissipation can be improved because the film for protective film formation contains a filler (d).
- the filler (d) include those made of a heat conductive material.
- the filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
- Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, bengara, silicon carbide, boron nitride, and the like; beads formed by spheroidizing these inorganic fillers; surface modification of these inorganic fillers Products; single crystal fibers of these inorganic fillers; glass fibers and the like.
- the inorganic filler is preferably silica or alumina.
- the average particle diameter of the filler (d) is not particularly limited. However, it is preferably 0.01 to 15 ⁇ m. It is more preferably 0.03 to 10 ⁇ m, and particularly preferably 0.05 to 8 ⁇ m. When the average particle diameter of the filler (d) is in such a range, it is possible to suppress a decrease in the light transmittance of the protective film while maintaining the adhesion to the object to be formed of the protective film.
- “average particle size” means the value of the particle size (D 50 ) at an integrated value of 50% in the particle size distribution curve obtained by the laser diffraction scattering method, unless otherwise specified. .
- the filler (d) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the ratio of the content of the filler (d) to the total content of all components other than the solvent (that is, for forming the protective film) is preferably 5 to 83% by mass, more preferably 7 to 78% by mass.
- Coupleling agent (e) By using a coupling agent (e) having a functional group capable of reacting with an inorganic compound or an organic compound, the adhesion and adhesion of the protective film-forming film to the adherend can be improved. Further, by using the coupling agent (e), the protective film obtained by curing the protective film-forming film has improved water resistance without impairing the heat resistance.
- the coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional group of the energy beam curable component (a), the polymer (b) having no energy beam curable group, and the like. More preferably, it is a silane coupling agent. Preferred examples of the silane coupling agent include the following.
- the coupling agent (e) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the coupling agent (e) in the composition for forming a protective film (IV-1) and the film for forming a protective film includes the energy ray curable component (a) and the energy.
- the amount is preferably 0.03 to 20 parts by mass with respect to 100 parts by mass of the total content of the polymer (b) having no linear curable group.
- the amount is more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass.
- Crosslinking agent (f) By using the crosslinking agent (F) and crosslinking the polymer (b) having no energy beam curable component (a) or energy beam curable group, the initial adhesive force and cohesive force of the protective film-forming film. Can be adjusted.
- crosslinking agent (f) examples include organic polyvalent isocyanate compounds, organic polyvalent imine compounds, metal chelate crosslinking agents (crosslinking agents having a metal chelate structure), aziridine crosslinking agents (crosslinking agents having an aziridinyl group), and the like. Is mentioned.
- organic polyvalent isocyanate compound examples include the following.
- aromatic polyvalent isocyanate compound examples include trimers such as aromatic polyisocyanate compounds, isocyanurates and adducts; and terminal isocyanate urethane prepolymers obtained by reacting the aromatic polyvalent isocyanate compounds and the like with polyol compounds.
- the “adduct body” includes the aromatic polyvalent isocyanate compound, the aliphatic polyvalent isocyanate compound, or the alicyclic polyvalent isocyanate compound, and a low amount of ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, or the like. It means a reaction product with a molecularly active hydrogen-containing compound, and examples thereof include an xylylene diisocyanate adduct of trimethylolpropane as described later.
- the “terminal isocyanate urethane prepolymer” means a prepolymer having a urethane bond and an isocyanate group at the end of the molecule.
- examples of the organic polyvalent isocyanate compound include the following.
- organic polyvalent imine compound examples include the following.
- N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylolmethane-tri- ⁇ -aziridinylpro Pionate, N, N′-toluene-2,4-bis (1-aziridinecarboxyamide) triethylenemelamine and the like can be mentioned.
- the crosslinking agent (f) When an organic polyvalent isocyanate compound is used as the crosslinking agent (f), it is preferable to use a hydroxyl group-containing polymer as the energy ray curable component (a) or the polymer (b) having no energy ray curable group.
- the crosslinking agent (f) has an isocyanate group, and the energy ray-curable component (a) or the polymer (b) having no energy ray-curable group has a hydroxyl group, the crosslinking agent (f) and the energy ray-curable property.
- a cross-linked structure can be easily introduced into the protective film-forming film by reaction with the component (a) or the polymer (b) having no energy ray-curable group.
- the protective film forming composition (IV-1) and the protective film forming film may contain only one type of crosslinking agent (f), or two or more types. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the crosslinking agent (f) in the protective film-forming composition (IV-1) is such that the energy ray-curable component (a) and the energy ray-curable group having no energy ray-curable group are contained.
- the amount is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass as the total content of the combined (b).
- the amount is more preferably 0.1 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass.
- Colorant (g) examples include known pigments such as inorganic pigments, organic pigments, and organic dyes.
- organic pigment and organic dye examples include the following.
- the inorganic pigment examples include carbon black, cobalt dye, iron dye, chromium dye, titanium dye, vanadium dye, zirconium dye, molybdenum dye, ruthenium dye, platinum dye, ITO ( Indium tin oxide) dyes, ATO (antimony tin oxide) dyes, and the like.
- the colorant (g) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the colorant (g) in the protective film-forming film may be appropriately adjusted according to the purpose.
- the protective film may be printed by laser irradiation, and by adjusting the content of the colorant (g) in the protective film-forming film and adjusting the light transmittance of the protective film, the print visibility is improved. Can be adjusted.
- the ratio of the content of the colorant (g) to the total content of all components other than the solvent (that is, the colorant (g )) Is preferably 0.1 to 10% by mass.
- the content is more preferably 0.4 to 7.5% by mass, and particularly preferably 0.8 to 5% by mass.
- the effect by using a colorant (g) is acquired more notably because the content of the colorant (g) is not less than the lower limit. Moreover, the excessive use of a coloring agent (g) is suppressed because the said content of a coloring agent (g) is below the said upper limit.
- thermosetting component (h) The thermosetting component (h) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- thermosetting component (h) examples include epoxy thermosetting resins, thermosetting polyimides, polyurethanes, unsaturated polyesters, and silicone resins, and epoxy thermosetting resins are preferable.
- the epoxy thermosetting resin includes an epoxy resin (h1) and a thermosetting agent (h2).
- the epoxy thermosetting resin contained in the protective film-forming composition (IV-1) and the protective film-forming film may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- Epoxy resin (h1) As an epoxy resin (h1), a well-known thing is mentioned. For example, polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy Bifunctional or higher functional epoxy compounds such as resins and phenylene skeleton type epoxy resins are exemplified.
- an epoxy resin having an unsaturated hydrocarbon group may be used as the epoxy resin (h1).
- An epoxy resin having an unsaturated hydrocarbon group is more compatible with an acrylic resin than an epoxy resin having no unsaturated hydrocarbon group. Therefore, the reliability of the package obtained using the composite sheet for forming a protective film is improved by using an epoxy resin having an unsaturated hydrocarbon group.
- Examples of the epoxy resin having an unsaturated hydrocarbon group include compounds obtained by converting a part of the epoxy group of a polyfunctional epoxy resin into a group having an unsaturated hydrocarbon group. Such a compound can be obtained, for example, by addition reaction of (meth) acrylic acid or a derivative thereof to an epoxy group. Moreover, as an epoxy resin which has an unsaturated hydrocarbon group, the compound etc. which the group which has an unsaturated hydrocarbon group directly couple
- the unsaturated hydrocarbon group is a polymerizable unsaturated group, and specific examples thereof include ethenyl group (vinyl group), 2-propenyl group (allyl group), (meth) acryloyl group, (meth) An acrylamide group etc. are mentioned, An acryloyl group is preferable.
- the number average molecular weight of the epoxy resin (h1) is not particularly limited. However, from the viewpoint of the curability of the protective film-forming film and the strength and heat resistance of the protective film, it is preferably 300 to 30000. It is more preferably 400 to 10,000, and particularly preferably 500 to 3000.
- the epoxy equivalent of the epoxy resin (h1) is preferably 100 to 1000 g / eq, and more preferably 150 to 800 g / eq.
- the epoxy resin (h1) may be used alone or in combination of two or more. When using 2 or more types together, those combinations and ratios can be arbitrarily selected.
- thermosetting agent (h2) functions as a curing agent for the epoxy resin (h1).
- a thermosetting agent (h2) the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is mentioned, for example.
- the functional group include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxy groups, and groups in which acid groups have been anhydrideized.
- a phenolic hydroxyl group, amino group, or acid group is preferably an anhydride group, and more preferably a phenolic hydroxyl group or amino group.
- thermosetting agents (h2) examples of the phenol-based curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolac-type phenol resins, dicyclopentadiene-based phenol resins, and aralkyl phenol resins.
- examples of the amine-based curing agent having an amino group include dicyandiamide (hereinafter sometimes abbreviated as “DICY”).
- the thermosetting agent (h2) may have an unsaturated hydrocarbon group.
- the thermosetting agent (h2) having an unsaturated hydrocarbon group for example, a compound in which a part of the hydroxyl group of the phenol resin is substituted with a group having an unsaturated hydrocarbon group, an aromatic ring of the phenol resin, Examples thereof include compounds in which a group having a saturated hydrocarbon group is directly bonded.
- the unsaturated hydrocarbon group in the thermosetting agent (h2) is the same as the unsaturated hydrocarbon group in the epoxy resin having an unsaturated hydrocarbon group described above.
- thermosetting agent (h2) In the case where a phenolic curing agent is used as the thermosetting agent (h2), it is preferable that the thermosetting agent (h2) has a high softening point or glass transition temperature from the viewpoint of improving the peelability of the protective film from the support sheet. .
- thermosetting agent (h2) for example, the number average molecular weight of resin components such as polyfunctional phenolic resin, novolac-type phenolic resin, dicyclopentadiene-based phenolic resin, and aralkylphenolic resin is preferably 300 to 30,000. It is more preferably 400 to 10,000, and particularly preferably 500 to 3000.
- the molecular weight of non-resin components such as biphenol and dicyandiamide is not particularly limited, but is preferably 60 to 500, for example.
- thermosetting agent (h2) may be used individually by 1 type, and may use 2 or more types together. When using 2 or more types together, those combinations and ratios can be arbitrarily selected.
- the content of the thermosetting agent (h2) is 100% of the epoxy resin (h1).
- the amount is preferably 0.01 to 20 parts by mass with respect to parts by mass.
- thermosetting component (h) when used, the content of the thermosetting component (h) (for example, the epoxy resin (h1) and the heat in the protective film-forming composition (IV-1) and the protective film-forming film)
- the total content of the curing agent (h2) is preferably 1 to 500 parts by mass with respect to 100 parts by mass of the polymer (b) having no energy ray curable group.
- the antistatic agent (j) used in the present invention is not particularly limited as long as it can adjust the surface resistivity of the protective film-forming film to a desired value.
- anionic surfactant antistatic agent cationic surfactant antistatic agent, nonionic surfactant antistatic agent, amphoteric surfactant antistatic agent, and nonionic surfactant And at least one selected from the group consisting of agent-based antistatic agents.
- a polymer type antistatic agent can be used.
- polyether ester amide-based, ethylene oxide-epichlorohydrin-based, polyether ester-based nonionic polymer-type antistatic agent, polystyrene sulfone-based anionic polymer-type antistatic agent, quaternary ammonium base-containing acrylate A cationic polymer antistatic agent such as a polymer system can be used.
- monolaurate antistatic agents such as sorbitan monolaurate and polyoxyethylene sorbitan monolaurate; Glycerin fatty acid ester monoglyceride, glycerin fatty acid ester acetylated monoglyceride, glycerin fatty acid ester organic acid monoglyceride, glycerin fatty acid ester medium chain fatty acid triglyceride and other glyceride antistatic agents; Ester-type antistatic agents such as polyglycerin fatty acid esters, sorbitan fatty acid esters, propylene glycol fatty acid esters, special fatty acid esters, and higher alcohol fatty acid esters can also be used.
- the content of the antistatic agent (j) is preferably 1 to 20% by mass, more preferably 3 to 10% by mass, based on the mass of the resin component contained in the protective film-forming film. More preferably it is. That is, in the case where the protective film-forming film further contains an energy ray-curable component (a) and a polymer (b) having no energy ray-curable group, The inhibitor is preferably contained in an amount of 1 to 20% by mass, more preferably 3 to 10% by mass, based on the total mass of the energy beam curable component (a) and the polymer (b) having no energy beam curable group. More preferably.
- the content of the antistatic agent (j) is lower than the lower limit, there is a problem that sufficient conductivity cannot be obtained and the antistatic property is not improved. On the other hand, if the content of the antistatic agent exceeds the above upper limit value, there is a problem that bleed out at the interface between the protective layer and Si and the reliability is lowered.
- the method for applying the antistatic agent (j) is not particularly limited.
- the antistatic agent (j) may be added and mixed in the protective film forming composition, and the antistatic agent (j) may be applied to the surface of the protective film forming composition or the protective film forming film. May be.
- a layer containing an antistatic agent (j) may be coated in the form of a film on the surface of the protective film-forming composition or the protective film-forming film.
- the antistatic agent (j) can be applied to the release layer (surface) of the release sheet to be adhered to the surface of the protective film forming film, thereby preventing the protective film forming film from being antistatic.
- the general-purpose additive (z) may be a known one, can be arbitrarily selected according to the purpose, and is not particularly limited. However, preferable examples include a plasticizer, an antistatic agent, an antioxidant, and a gettering agent.
- the general-purpose additive (z) contained in the protective film-forming composition (IV-1) and the protective film-forming film may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the content of the general-purpose additive (z) in the protective film-forming composition (IV-1) and the protective film-forming film may be appropriately selected according to the purpose not particularly limited. Good.
- the protective film-forming composition (IV-1) preferably further contains a solvent.
- the protective film-forming composition (IV-1) containing a solvent has good handleability.
- the solvent is not particularly limited. However, preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol; esters such as ethyl acetate. Ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone.
- the solvent contained in the protective film-forming composition (IV-1) may be only one kind or two or more kinds. In the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
- the solvent contained in the protective film-forming composition (IV-1) is methyl ethyl ketone, toluene, ethyl acetate, or the like from the viewpoint that the components contained in the protective film-forming composition (IV-1) can be mixed more uniformly. It is preferable.
- the composition for forming a protective film such as the composition for forming a protective film (IV-1) can be obtained by blending each component for constituting the composition.
- the order of addition at the time of blending each component is not particularly limited, and two or more components may be added simultaneously.
- a solvent it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance.
- the method of mixing each component at the time of mixing is not particularly limited.
- each component is not particularly limited as long as each compounding component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30 ° C.
- the protective film-forming composite sheet of the present invention is affixed to the back surface opposite to the circuit surface of the semiconductor wafer or semiconductor chip, and as a composite sheet provided with a layer showing adhesion on the support sheet.
- a dicing die bonding sheet There is a dicing die bonding sheet.
- the adhesive layer provided in the dicing die bonding sheet functions as an adhesive when the semiconductor chip is picked up from the support sheet together with the semiconductor chip and then attached to the substrate, the lead frame, or another semiconductor chip.
- the protective film-forming film in the protective film-forming composite sheet of the present invention is the same as the adhesive layer in that it is picked up from the support sheet together with the semiconductor chip, but eventually becomes a protective film by curing, It has a function of protecting the back surface of the semiconductor chip that is affixed.
- the protective film-forming film in the present invention has a different use from the adhesive layer in the dicing die bonding sheet, and naturally the required performance is also different. Reflecting this difference in use, the protective film-forming film is usually harder and more difficult to pick up than the adhesive layer in the dicing die bonding sheet.
- the composite sheet for forming a protective film according to the present invention is extremely excellent as compared with the conventional one with regard to the suitability for picking up a semiconductor chip with a protective film, provided with an energy ray curable protective film-forming film.
- the protective film-forming composite sheet of the present invention can be produced by sequentially laminating the above-mentioned layers so as to have a corresponding positional relationship.
- the method for forming each layer is as described above.
- the above-described pressure-sensitive adhesive composition may be applied on the substrate and dried as necessary.
- the protective film-forming composition is applied on the adhesive layer, It is possible to form the forming film directly.
- Layers other than the protective film-forming film can also be laminated on the pressure-sensitive adhesive layer in the same manner using the composition for forming this layer.
- the composition is further applied onto the layer formed from the composition to newly form a layer. Can be formed.
- the layer laminated after these two layers is formed in advance using the composition on another release film, and the side of the formed layer that is in contact with the release film is It is preferable to form a continuous two-layer laminated structure by bonding the opposite exposed surface to the exposed surfaces of the remaining layers already formed.
- the composition is preferably applied to the release-treated surface of the release film.
- the release film may be removed as necessary after forming the laminated structure.
- a protective film-forming composite sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a protective film-forming film is laminated on the pressure-sensitive adhesive layer (the support sheet is a laminate of a base material and a pressure-sensitive adhesive layer
- the support sheet is a laminate of a base material and a pressure-sensitive adhesive layer
- the pressure-sensitive adhesive composition is coated on the base material and dried as necessary, so that the pressure-sensitive adhesive layer is laminated on the base material, and separately for forming a protective film on the release film.
- the composition is applied and dried if necessary.
- a protective film-forming film is formed on the release film.
- the exposed surface of the protective film-forming film is bonded to the exposed surface of the adhesive layer laminated on the substrate, and the protective film-forming film is laminated on the adhesive layer, thereby forming a protective film.
- a composite sheet is obtained.
- the pressure-sensitive adhesive composition is applied on the release film.
- the pressure-sensitive adhesive layer is formed on the release film by drying as necessary, and the exposed surface of this layer is bonded to one surface of the base material so that the pressure-sensitive adhesive layer is placed on the base material. You may laminate. In any method, the release film may be removed at an arbitrary timing after the target laminated structure is formed.
- any layer other than the base material constituting the composite sheet for forming a protective film can be laminated by a method in which the layer is formed in advance on the release film and bonded to the surface of the target layer. Therefore, a protective film-forming composite sheet may be produced by appropriately selecting a layer that employs such a process as necessary.
- the composite sheet for forming a protective film is usually stored in a state in which a release film is bonded to the surface of the outermost layer (for example, a film for forming a protective film) opposite to the support sheet. Therefore, a composition for forming a layer constituting the outermost layer, such as a protective film-forming composition, is applied on this release film (preferably its release-treated surface) and dried as necessary. Then, a layer constituting the outermost layer is formed on the release film, and the remaining layers are laminated on the exposed surface of the layer opposite to the side in contact with the release film by any of the methods described above. And the composite sheet for protective film formation is obtained also by leaving it in the state bonded together, without removing a peeling film.
- a composition for forming a layer constituting the outermost layer such as a protective film-forming composition
- the protective film-forming composite sheet of the present invention can be used, for example, by the method described below. That is, the protective film-forming composite sheet is attached to the back surface (surface opposite to the electrode forming surface) of the semiconductor wafer with the protective film-forming film. Next, the protective film-forming film is irradiated with energy rays, and the protective film-forming film is cured to form a protective film. Next, the semiconductor wafer is divided together with the protective film by dicing to form semiconductor chips. Then, the semiconductor chip is picked up while being separated from the support sheet while the protective film is attached (that is, as a semiconductor chip with a protective film).
- the semiconductor chip of the obtained semiconductor chip with a protective film is flip-chip connected to the circuit surface of the substrate by the same method as the conventional method, the whole is sealed with a resin to obtain a semiconductor package. Then, a target semiconductor device may be manufactured using this semiconductor package.
- the order of performing these steps is as follows: The reverse may be possible. That is, after a protective film-forming composite sheet is attached to the back surface of the semiconductor wafer, the semiconductor wafer is divided together with the protective film-forming film by dicing to form semiconductor chips. Next, the divided protective film-forming film is irradiated with energy rays, and the protective film-forming film is cured to form a protective film. Thereafter, in the same manner as described above, the semiconductor chip with the protective film may be pulled away from the support sheet and picked up to produce the target semiconductor device.
- FIG. 6 is a cross-sectional view schematically showing a protective film forming film according to still another embodiment of the present invention.
- the protective film-forming film 1 ⁇ / b> F according to this embodiment is called a “roll type”.
- This is a protective film-forming composition between the release film 15a (hereinafter sometimes referred to as “first release film”) and the release film 15b (hereinafter sometimes referred to as “second release film”). 13 is applied in a layered manner.
- the protective film-forming composition 13 used for the protective film-forming film 1F conforms to the above-described protective film-forming composition.
- the protective film forming composition 13 is applied to the release surface of the first release film 15a, and the second release film 15b is further applied to the release surface side of the protective film. It can form by applying toward the composition 13 side for formation, and pressing.
- the method for applying the protective film forming composition is in accordance with the method for applying the protective film forming composition.
- the protective film-forming film of the present invention can be used, for example, by the method described below. That is, a protective film-forming film is attached to the back surface of the semiconductor wafer (the surface opposite to the electrode forming surface). Next, the protective film-forming film is irradiated with energy rays, and the protective film-forming film is cured to form a protective film. Next, the semiconductor wafer is divided together with the protective film by dicing to form semiconductor chips. Then, the semiconductor chip is picked up while being separated from the support sheet while the protective film is attached (that is, as a semiconductor chip with a protective film).
- the picked-up semiconductor chip 101 with protective film is accommodated in a pocket 102a of an embossed carrier tape 102 as shown in FIG. 7, and a cover tape 103 is attached to the opening of the pocket 102a. By doing so, the opening is closed and packed. Then, the embossed carrier tape 102 is stored, transported, or traded in a state of being wound on a reel, and used in the next step of flip chip connecting the semiconductor chip of the semiconductor chip 101 with protective film to the circuit surface of the substrate. .
- the “embossed carrier tape” refers to a plurality of recesses (sometimes referred to as pockets) arranged at regular intervals on a long sheet made of resin such as polystyrene, polyethylene terephthalate, or polypropylene.
- each of the plurality of pockets can accommodate, for example, a semiconductor chip with a protective film according to the present invention.
- Each of the plurality of pockets is normally closed when a cover tape having a long shape is pasted in a state where an object to be stored such as a semiconductor chip with a protective film according to the present invention is stored.
- An embossed carrier tape in which a semiconductor chip with a protective film is packed can be used in a state of being wound around a reel.
- the reel can be set on a mounter, and a semiconductor chip with a protective film can be mounted on the substrate.
- the pocket of the embossed carrier tape can be designed and processed according to the size of the object to be stored. Examples of each pocket of the embossed carrier tape in the present specification include those having a vertical dimension of 0.5 mm to 30 mm, a horizontal dimension of 0.5 mm to 30 mm, and a depth of 0.1 mm to 10 mm.
- the long cover tape has a thickness of 10 to 100 ⁇ m and is made of a material such as PET or polyethylene.
- the semiconductor chip of the obtained semiconductor chip with a protective film is flip-chip connected to the circuit surface of the substrate by the same method as the conventional method, the whole is sealed with a resin to obtain a semiconductor package. Then, a target semiconductor device may be manufactured using this semiconductor package.
- the order of performing these steps is reversed. It may be. That is, after a protective film-forming film is attached to the back surface of the semiconductor wafer, the semiconductor wafer is divided together with the protective film-forming film by dicing to form semiconductor chips. Next, the divided protective film-forming film is irradiated with energy rays, and the protective film-forming film is cured to form a protective film. Thereafter, in the same manner as described above, the semiconductor chip with the protective film may be pulled away from the support sheet and picked up to produce the target semiconductor device.
- Energy ray curable component (a2) -1 Tricyclodecane dimethylol diacrylate (“KAYARAD R-684”, bifunctional ultraviolet curable compound, molecular weight 304, manufactured by Nippon Kayaku Co., Ltd.)
- Acrylic resin weight average molecular weight 300000, glass transition temperature ⁇ 1 ° C.
- Photopolymerization initiator (c) -1 2- (dimethylamino) -1- (4-morpholinophenyl) -2-benzyl-1-butanone (“Irgacure (registered trademark) 369” manufactured by BASF)
- C) -2 Ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) (Irgacure (registered by BASF)) Trademark) OXE02 ")
- (Production of pressure-sensitive adhesive composition (I-4)) Contains an acrylic polymer (100 parts by mass, solid content) and a trifunctional xylylene diisocyanate-based crosslinking agent (“Takenate D110N” manufactured by Takeda Chemical Co., Ltd.) (10.7 parts by mass, solid content), and further as a solvent
- a non-energy ray-curable pressure-sensitive adhesive composition (I-4) containing methyl ethyl ketone and having a solid content concentration of 30% by mass was prepared.
- the acrylic polymer is obtained by copolymerizing 2-ethylhexyl acrylate (hereinafter abbreviated as “2EHA”) (36 parts by mass), BA (59 parts by mass), and HEA (5 parts by mass).
- the weight average molecular weight is 600,000.
- a polypropylene film polypropylene film (Young's modulus 400 MPa, thickness 80 ⁇ m, hereinafter may be referred to as “S1”) as a base material is bonded to the exposed surface of the pressure-sensitive adhesive layer, thereby forming the base material.
- a support sheet (10) -1 having the pressure-sensitive adhesive layer on one surface was obtained.
- a protective film-forming composition obtained as described above is formed on the release-treated surface of a release film (“SP-PET 381031” manufactured by Lintec Corporation, thickness 38 ⁇ m, P1) obtained by releasing one side of a polyethylene terephthalate film by silicone treatment.
- (IV-1) was applied with a knife coater and dried at 100 ° C. for 2 minutes to prepare an energy ray-curable protective film-forming film (13) -1 having a thickness of 25 ⁇ m.
- the release film is removed from the pressure-sensitive adhesive layer of the support sheet (10) -1 obtained above, and the protective film-forming film (13) -1 obtained above is exposed on the exposed surface of the pressure-sensitive adhesive layer.
- the surfaces were bonded together to prepare a composite sheet for forming a protective film, in which a base material, an adhesive layer, a protective film-forming film (13) -1 and a release film were laminated in this order in the thickness direction.
- Table 2 shows the structure of the obtained protective sheet-forming composite sheet.
- Antistatic agent [mass%] in Table 2 is based on the total mass of the energy ray-curable component (a) and the polymer (b) having no energy ray-curable group in the protective film-forming film. Means the content of the antistatic agent.
- the protective film-forming composite sheet obtained above is attached to the # 2000 polished surface of a 6-inch silicon wafer (thickness: 100 ⁇ m) with the protective film-forming film (13) -1 and this sheet is further attached to the ring frame. Fixed and allowed to stand for 30 minutes.
- the protective sheet-forming composite sheet is formed from the support sheet (10) -1 side under the conditions of an illuminance of 195 mW / cm 2 and a light amount of 170 mJ / cm 2.
- the protective film-forming film (13) -1 was cured to form a protective film.
- the silicon wafer was diced together with the protective film using a dicing blade, and a silicon chip having a length of 3 mm ⁇ width of 3 mm, a protective layer thickness of 25 ⁇ m, and a Si layer thickness of 350 ⁇ m was obtained.
- 20 silicon chips with a protective film were picked up using a die bonder (“BESTEM-D02” manufactured by Canon Machinery Co., Ltd.). Square grid-like positions of 4 x 4 x silicon chips with a protective film obtained on a 12 mm long x 12 cm wide, 5 mm thick iron chip so that the distance between them is uniform.
- a cover tape (CSL-Z7302 made by Sumitomo Bakelite Co., Ltd.) with a length of 12 cm and a width of 3.8 cm is placed thereon, placed on a hot plate heated to 40 ° C., and a metal plate is placed thereon. It was set so that the pressure applied to the silicon chip with the protective film applied was 350 gf and heated for one minute. Thereafter, the metal plate was removed, the cover tape was peeled off, and it was tested whether or not the silicon chip with a protective film adhered to the cover tape. The results are shown in Table 2.
- Example 2 A protective film-forming film (13) -2 was produced in the same manner as in Example 1 except that the content of the antistatic agent (h) -1 was changed to 6 parts by mass. Furthermore, the composite sheet for protective film formation was manufactured using this, and the characteristic of the film for protective film formation was evaluated. The results are shown in Table 2.
- the protective film-forming film obtained above was attached to a # 2000 polished surface of a 6-inch silicon wafer (thickness: 100 ⁇ m) and allowed to stand for 30 minutes.
- a UV irradiation device (“RAD2000m / 8” manufactured by Lintec Corporation)
- the protective film is irradiated with UV light from the protective film forming film side under the conditions of an illuminance of 195 mW / cm 2 and a light amount of 170 mJ / cm 2.
- the forming film (14) -1 was cured to form a protective film.
- the silicon wafer was diced together with the protective film using a dicing blade, and a silicon chip having a length of 3 mm ⁇ width of 3 mm, a protective layer thickness of 25 ⁇ m, and a Si layer thickness of 350 ⁇ m was obtained.
- 20 silicon chips with a protective film were picked up using a die bonder (“BESTEM-D02” manufactured by Canon Machinery Co., Ltd.).
- 16 silicon chips with protective film obtained on a 12 cm long x 12 cm wide, 5 mm thick steel plate, each having 4 x 4 pieces in a square grid shape so that the distance between them is uniform. Is placed on a hot platen heated to 40 ° C.
- Example 4 [Roll type] ⁇ Manufacture of composite sheet for forming protective film> (Production of protective film-forming composition (IV-1))
- the protective film-forming composition (IV-) was prepared in the same manner as in Example 3 except that the content (blending amount) of the antistatic agent was changed to 6 parts by mass instead of 3 parts by mass. 1) was prepared, a protective film-forming film was prepared, and the characteristics were evaluated. The results are shown in Table 2.
- [Comparative Example 1] [Integrated type] A composite sheet for forming a protective film was prepared in the same manner as in Example 1 except that the blending amount of the antistatic agent was changed to 0 part by weight, and the characteristics of the protective film-forming film were evaluated. The results are shown in Table 2.
- [Comparative Example 2] [Roll type] A protective film-forming film was prepared in the same manner as in Example 3 except that the blending amount of the antistatic agent was 0 part by weight, and the characteristics thereof were evaluated. The results are shown in Table 2. ⁇ Manufacture of composite sheet for protective film formation and evaluation of film for protective film formation> The protective film-forming film obtained above was evaluated in the same manner as in Example 1. The results are shown in Table 2.
- the surface resistivity of the protective film-forming film was 1.0. ⁇ become less 10 12 ⁇ ⁇ cm, even in the cover tape adhered test peeling off the cover tape after reel filling, overcoated silicon chip which is accommodated in the embossed carrier tape did not adhere to the cover tape.
- the protective film forming a composite sheet of Comparative Example 1 not added antistatic agent in the case of using the protective film of Comparative Example 2, the surface resistivity of 1.0 ⁇ 10 12 ⁇ ⁇ protective film Also in the cover tape adhesion test, which was larger than cm and peeled after reel packing, the silicon chip with protective film housed in the embossed carrier tape adhered to the cover tape.
- the present invention can be used for manufacturing semiconductor devices.
- 1F Film sheet for forming a protective film, 10 ... support sheet, 10a ... the surface of the support sheet, 11 ... base material, 11a ... surface of the substrate, 12 ... adhesive layer, 12a: the surface of the pressure-sensitive adhesive layer, 13, 23 ... protective film-forming film, 13a, 23a ... surface of the protective film-forming film, 15 ... release film, 16 ...
Abstract
Description
本願は、2016年4月28日に、日本に出願された特願2016-092101号に基づき優先権を主張し、その内容をここに援用する。
本発明の保護膜形成用フィルムにおいては、前記保護膜形成用フィルムが、帯電防止剤を含むことが好ましい。
また、本発明の保護膜形成用フィルムにおいては、前記帯電防止剤が、アニオン系界面活性剤系帯電防止剤、カチオン系界面活性剤系帯電防止剤、ノニオン系界面活性剤系帯電防止剤、両イオン系界面活性剤系帯電防止剤、および、非イオン系界面活性剤系帯電防止剤からなる群から選択される少なくとも1種であることが好ましい。
さらに、前記帯電防止剤は、アルカリ金属塩系であることが好ましい。
前記帯電防止剤の含有量は、前記保護膜形成用フィルムに含まれる樹脂成分の質量に対して6~20質量%であることが好ましい。
前記保護膜形成用フィルムは、さらにエネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)を含有することが好ましい。
前記保護膜形成用フィルムにおいて、前記帯電防止剤が、前記エネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)の合計質量に対して6~20質量%含まれることが好ましい。
また本発明は上記記載の保護膜形成用フィルムを支持シート上に備えてなる、保護膜形成用複合シートであってもよい。
本発明の保護膜形成用フィルムは、エネルギー線硬化性の保護膜形成用フィルムであって、表面抵抗率が1012Ω・cm以下である。
本発明の保護膜形成用フィルムは、帯電防止剤を含むことが好ましい。
本発明の保護膜形成用フィルムにおいては、前記帯電防止剤が、アニオン系界面活性剤系帯電防止剤、カチオン系界面活性剤系帯電防止剤、ノニオン系界面活性剤系帯電防止剤、両イオン系界面活性剤系帯電防止剤、および、非イオン系界面活性剤系帯電防止剤からなる群から選択される少なくとも1種であることが好ましい。
前記帯電防止剤は、アルカリ金属塩系であることが好ましい。
前記保護膜形成用フィルムは、さらにエネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)を含有することが好ましい。
前記保護膜形成用フィルムにおいて、前記帯電防止剤が、前記エネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)の合計質量に対して6~20質量%含まれることが好ましい。
本発明の保護膜形成用フィルムは、少なくとも一方の表面に第1の剥離フィルムを有していてもよく、他方の表面に第2の剥離フィルムを更に有していてもよい。本発明の保護膜形成用フィルムは、ロール状に巻回した長尺状フィルムとして提供することができる。 図6は、本発明の保護膜形成用フィルムの一実施形態を模式的に示す断面図である。図6では、第1の剥離フィルム15b、保護膜形成用フィルム13(23)及び第2の剥離フィルム15aが、この順で積層されている。
◇保護膜形成用複合シート
本発明の保護膜形成用複合シートは、支持シート上に、エネルギー線硬化性の保護膜形成用フィルムを備えてなり、前記保護膜形成用フィルムの表面抵抗率が1012Ω・cm以下となるものである。
ここで、「表面抵抗率が1012Ω・cm以下となる保護膜形成用フィルム」とは、前記保護膜形成用フィルムにエネルギー線を照射して保護膜としたときに、前記保護膜の表面抵抗率が1012Ω・cm以下となるような保護膜形成用フィルムを意味する。
なお、本明細書において、「保護膜形成用フィルム」とは硬化前のものを意味し、「保護膜」とは、保護膜形成用フィルムを硬化させたものを意味する。
また、表面抵抗率は、保護膜形成用フィルムの硬化前に対して硬化後増大し、帯電防止性が低下するものである。したがって、硬化後の保護膜の表面抵抗率が1012Ω・cm以下となるようにするためには、硬化前の保護膜形成用フィルムの表面抵抗率を1011Ω・cm以下にしておく必要がある。
保護膜形成用フィルムの表面抵抗率は、1011Ω・cm以下であることが好ましく、1010Ω・cm以下であることがより好ましく、109Ω・cm以下であることがさらに好ましい。保護膜形成用フィルムの表面抵抗率の下限値は、特に限定されない。例えば108Ω・cmとすることができる。
また、保護膜の表面抵抗率は、1012Ω・cm以下であることが好ましく、1011Ω・cm以下であることがより好ましく、1010Ω・cm以下であることがさらに好ましい。保護膜の表面抵抗率の下限値は、特に限定されない。例えば109Ω・cmとすることができる。
そして、保護膜形成用フィルムの、エネルギー線を照射して硬化させたときの表面抵抗率を1012Ω・cm以下とすることにより、本発明の保護膜形成用複合シートは、帯電防止性を有する。例えば、ダイシング工程を経ても、半導体チップが帯電すること防止することができる。また、更に、リール詰めして出荷し、次工程でカバーテープを剥離する際に、カバーテープに半導体チップが付着することが防止される。
また、半導体チップ自体が帯電することが防止されるので、静電気により半導体チップに塵や埃などが付着することが防止される。
紫外線は、例えば、紫外線源として高圧水銀ランプ、ヒュージョンHランプ、キセノンランプ、ブラックライト又はLEDランプ等を用いることで照射できる。電子線は、電子線加速器等によって発生させたものを照射できる。
本発明において、「エネルギー線硬化性」とは、エネルギー線を照射することにより硬化する性質を意味し、「非エネルギー線硬化性」とは、エネルギー線を照射しても硬化しない性質を意味する。
以下、本発明の構成について、詳細に説明する。
前記支持シートは、1層(単層)からなるものでもよいし、2層以上の複数層からなるものでもよい。支持シートが複数層からなる場合、これら複数層の構成材料及び厚さは、互いに同一でも異なっていてもよく、これら複数層の組み合わせは、本発明の効果を損なわない限り、特に限定されない。
なお、本明細書においては、支持シートの場合に限らず、「複数層が互いに同一でも異なっていてもよい」とは、「すべての層が同一であってもよい。さらに、すべての層が異なっていてもよく、一部の層のみが同一であってもよい」ことを意味する。さらに「複数層が互いに異なる」とは、「各層の構成材料及び厚さの少なくとも一方が互いに異なる」ことを意味する。
ここに示す保護膜形成用複合シート1Cは、粘着剤層12を備えていない点以外は、図1に示す保護膜形成用複合シート1Aと同じものである。すなわち、保護膜形成用複合シート1Cにおいては、支持シート10が基材11のみからなる。そして、基材11の一方の表面11a(支持シート10の一方の表面10a)に保護膜形成用フィルム13が積層される。保護膜形成用フィルム13の表面13aの一部、すなわち、周縁部近傍の領域に治具用接着剤層16が積層され、保護膜形成用フィルム13の表面13aのうち、治具用接着剤層16が積層されていない面と、治具用接着剤層16の表面16a(上面及び側面)に、剥離フィルム15が積層されている。
ここに示す保護膜形成用複合シート1Dは、治具用接着剤層16を備えていない点以外は、図3に示す保護膜形成用複合シート1Cと同じものである。すなわち、保護膜形成用複合シート1Dにおいては、基材11の一方の表面11aに保護膜形成用フィルム13が積層される。保護膜形成用フィルム13の表面13aの全面に剥離フィルム15が積層されている。
ここに示す保護膜形成用複合シート1Eは、保護膜形成用フィルムの形状が異なる点以外は、図1に示す保護膜形成用複合シート1Aと同じものである。すなわち、保護膜形成用複合シート1Eは、基材11上に粘着剤層12を備え、粘着剤層12上に保護膜形成用フィルム23を備えてなるものである。支持シート10は、基材11及び粘着剤層12の積層体である。保護膜形成用複合シート1Eは、換言すると、支持シート10の一方の表面10a上に保護膜形成用フィルム23が積層された構成を有する。また、保護膜形成用複合シート1Eは、さらに保護膜形成用フィルム23上に剥離フィルム15を備えている。
また、図1、2及び5に示す保護膜形成用複合シートにおいては、基材11と粘着剤層12との間に中間層が設けられていてもよい。すなわち、本発明の保護膜形成用複合シートにおいて、支持シートは、基材、中間層及び粘着剤層がこの順に積層されてなるものでもよい。ここで中間層とは、図3及び4に示す保護膜形成用複合シートにおいて設けられていてもよい中間層と同じものである。
また、図1~5に示す保護膜形成用複合シートは、前記中間層以外の層が、任意の箇所に設けられていてもよい。
また、本発明の保護膜形成用複合シートにおいては、剥離フィルムと、この剥離フィルムと直接接触している層との間に、一部隙間が生じていてもよい。
また、本発明の保護膜形成用複合シートにおいては、各層の大きさや形状は、目的に応じて任意に調節できる。
なかでも、保護膜形成用フィルムがエネルギー線硬化性を有する本発明においては、支持シートはエネルギー線を透過させるものが好ましい。
一方、支持シートにおいて、波長375nmの光の透過率の上限値は特に限定されない。例えば、95%とすることが可能である。
一方、支持シートにおいて、波長532nmの光の透過率の上限値は特に限定されない。例えば、95%とすることが可能である。
一方、支持シートにおいて、波長1064nmの光の透過率の上限値は特に限定されない。例えば、95%とすることが可能である。
次に、支持シートを構成する各層について、さらに詳細に説明する。
前記基材は、シート状又はフィルム状であり、その構成材料としては、例えば、各種樹脂が挙げられる。
前記樹脂としては、以下のものが挙げられる。例えば、低密度ポリエチレン(LDPE)、直鎖低密度ポリエチレン(LLDPE)、高密度ポリエチレン(HDPE)等のポリエチレン;ポリプロピレン、ポリブテン、ポリブタジエン、ポリメチルペンテン、ノルボルネン樹脂等のポリエチレン以外のポリオレフィン;エチレン-酢酸ビニル共重合体、エチレン-(メタ)アクリル酸共重合体、エチレン-(メタ)アクリル酸エステル共重合体、エチレン-ノルボルネン共重合体等のエチレン系共重合体(モノマーとしてエチレンを用いて得られた共重合体);ポリ塩化ビニル、塩化ビニル共重合体等の塩化ビニル系樹脂(モノマーとして塩化ビニルを用いて得られた樹脂);ポリスチレン;ポリシクロオレフィン;ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンテレフタレート、ポリエチレンイソフタレート、ポリエチレン-2,6-ナフタレンジカルボキシレート、すべての構成単位が芳香族環式基を有する全芳香族ポリエステル等のポリエステル;2種以上の前記ポリエステルの共重合体;ポリ(メタ)アクリル酸エステル;ポリウレタン;ポリウレタンアクリレート;ポリイミド;ポリアミド;ポリカーボネート;フッ素樹脂;ポリアセタール;変性ポリフェニレンオキシド;ポリフェニレンスルフィド;ポリスルホン;ポリエーテルケトン等が挙げられる。
また、前記樹脂としては、例えば、前記ポリエステルとそれ以外の樹脂との混合物等のポリマーアロイも挙げられる。前記ポリエステルとそれ以外の樹脂とのポリマーアロイは、ポリエステル以外の樹脂の量が比較的少量であるものが好ましい。
また、前記樹脂としては、例えば、ここまでに例示した前記樹脂の1種又は2種以上が架橋した架橋樹脂;ここまでに例示した前記樹脂の1種又は2種以上を用いたアイオノマー等の変性樹脂も挙げられる。
ここで、「基材の厚さ」とは、基材全体の厚さを意味する。例えば、複数層からなる基材の厚さとは、基材を構成するすべての層の合計の厚さを意味する。
そして、保護膜形成用フィルムがエネルギー線硬化性を有する本発明においては、基材はエネルギー線を透過させるものが好ましい。
また、基材は、表面がプライマー処理を施されたものであってもよい。
また、基材は、帯電防止コート層、保護膜形成用複合シートを重ね合わせて保存する際に、基材が他のシートに接着することや、基材が吸着テーブルに接着することを防止する層等を有するものであってもよい。
これらの中でも基材は、ダイシング時のブレードの摩擦による基材の断片の発生が抑制される点から、特に表面が電子線照射処理を施されたものが好ましい。
前記粘着剤層は、シート状又はフィルム状であり、粘着剤を含有する。
前記粘着剤としては、例えば、アクリル系樹脂、ウレタン系樹脂、ゴム系樹脂、シリコーン系樹脂、エポキシ系樹脂、ポリビニルエーテル、ポリカーボネート、エステル系樹脂等の粘着性樹脂が挙げられ、アクリル系樹脂が好ましい。
ここで、「粘着剤層の厚さ」とは、粘着剤層全体の厚さを意味する。例えば、複数層からなる粘着剤層の厚さとは、粘着剤層を構成するすべての層の合計の厚さを意味する。
そして、保護膜形成用フィルムがエネルギー線硬化性を有する本発明においては、粘着剤層はエネルギー線を透過させるものが好ましい。
粘着剤層は、粘着剤を含有する粘着剤組成物を用いて形成できる。例えば、粘着剤層の形成対象面に粘着剤組成物を塗工し、必要に応じて乾燥させることで、目的とする部位に粘着剤層を形成できる。粘着剤層のより具体的な形成方法は、他の層の形成方法とともに、後ほど詳細に説明する。粘着剤組成物中の、常温で気化しない成分同士の含有量の比率は、通常、粘着剤層の前記成分同士の含有量の比率と同じとなる。なお、本明細書において、「常温」とは、特に冷やしたり、熱したりしない温度、すなわち平常の温度を意味する。例えば、15~25℃の温度等が挙げられる。
前記粘着剤組成物(I-1)は、上述の様に、非エネルギー線硬化性の粘着性樹脂(I-1a)と、エネルギー線硬化性化合物と、を含有する。
前記粘着性樹脂(I-1a)は、アクリル系樹脂であることが好ましい。
前記アクリル系樹脂としては、例えば、少なくとも(メタ)アクリル酸アルキルエステル由来の構成単位を有するアクリル系重合体が挙げられる。
前記アクリル系樹脂が有する構成単位は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
(メタ)アクリル酸アルキルエステルとして、より具体的には、以下のものが挙げられる。例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸イソプロピル、(メタ)アクリル酸n-ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸sec-ブチル、(メタ)アクリル酸tert-ブチル、(メタ)アクリル酸ペンチル、(メタ)アクリル酸ヘキシル、(メタ)アクリル酸ヘプチル、(メタ)アクリル酸2-エチルヘキシル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸n-ノニル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸デシル、(メタ)アクリル酸ウンデシル、(メタ)アクリル酸ドデシル((メタ)アクリル酸ラウリル)、(メタ)アクリル酸トリデシル、(メタ)アクリル酸テトラデシル((メタ)アクリル酸ミリスチル)、(メタ)アクリル酸ペンタデシル、(メタ)アクリル酸ヘキサデシル((メタ)アクリル酸パルミチル)、(メタ)アクリル酸ヘプタデシル、(メタ)アクリル酸オクタデシル((メタ)アクリル酸ステアリル)、(メタ)アクリル酸ノナデシル、(メタ)アクリル酸イコシル等が挙げられる。
前記官能基含有モノマーとしては、例えば、前記官能基が後述する架橋剤と反応することで架橋の起点となったり、前記官能基が後述する不飽和基含有化合物中の不飽和基と反応することで、アクリル系重合体の側鎖に不飽和基の導入を可能とするものが挙げられる。
すなわち、官能基含有モノマーとしては、例えば、水酸基含有モノマー、カルボキシ基含有モノマー、アミノ基含有モノマー、エポキシ基含有モノマー等が挙げられる。
前記他のモノマーは、(メタ)アクリル酸アルキルエステル等と共重合可能なものであれば特に限定されない。
前記他のモノマーとしては、例えば、スチレン、α-メチルスチレン、ビニルトルエン、ギ酸ビニル、酢酸ビニル、アクリロニトリル、アクリルアミド等が挙げられる。
一方、前記アクリル系重合体中の官能基に、エネルギー線重合性不飽和基(エネルギー線重合性基)を有する不飽和基含有化合物を反応させたものは、上述のエネルギー線硬化性の粘着性樹脂(I-2a)として使用できる。
粘着剤組成物(I-1)が含有する前記エネルギー線硬化性化合物としては、エネルギー線重合性不飽和基を有し、エネルギー線の照射により硬化可能なモノマー又はオリゴマーが挙げられる。
エネルギー線硬化性化合物のうち、モノマーとしては、以下のものが挙げられる。例えば、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトール(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、1,4-ブチレングリコールジ(メタ)アクリレート、1,6-へキサンジオール(メタ)アクリレート等の多価(メタ)アクリレート;ウレタン(メタ)アクリレート;ポリエステル(メタ)アクリレート;ポリエーテル(メタ)アクリレート;エポキシ(メタ)アクリレート等が挙げられる。
エネルギー線硬化性化合物のうち、オリゴマーとしては、例えば、上記で例示したモノマーが重合してなるオリゴマー等が挙げられる。
エネルギー線硬化性化合物は、分子量が比較的大きく、粘着剤層の貯蔵弾性率を低下させにくいという点では、ウレタン(メタ)アクリレート、ウレタン(メタ)アクリレートオリゴマーが好ましい。
粘着性樹脂(I-1a)として、(メタ)アクリル酸アルキルエステル由来の構成単位以外に、さらに、官能基含有モノマー由来の構成単位を有する前記アクリル系重合体を用いる場合がある。その場合、粘着剤組成物(I-1)は、さらに架橋剤を含有することが好ましい。
架橋剤としては、以下のものが挙げられる。例えば、トリレンジイソシアネート、ヘキサメチレンジイソシアネート、キシリレンジイソシアネート、これらジイソシアネートのアダクト体等のイソシアネート系架橋剤(イソシアネート基を有する架橋剤);エチレングリコールグリシジルエーテル等のエポキシ系架橋剤(グリシジル基を有する架橋剤);ヘキサ[1-(2-メチル)-アジリジニル]トリフオスファトリアジン等のアジリジン系架橋剤(アジリジニル基を有する架橋剤);アルミニウムキレート等の金属キレート系架橋剤(金属キレート構造を有する架橋剤);イソシアヌレート系架橋剤(イソシアヌル酸骨格を有する架橋剤)等が挙げられる。
粘着剤の凝集力を向上させて粘着剤層の粘着力を向上させる点、及び入手が容易である等の点から、架橋剤はイソシアネート系架橋剤であることが好ましい。
粘着剤組成物(I-1)は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物(I-1)は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。
また、前記光重合開始剤としては、例えば、1-クロロアントラキノン等のキノン化合物;アミン等の光増感剤等を用いることもできる。
粘着剤組成物(I-1)は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
前記その他の添加剤としては、例えば、帯電防止剤、酸化防止剤、軟化剤(可塑剤)、充填材(フィラー)、防錆剤、着色剤(顔料、染料)、増感剤、粘着付与剤、反応遅延剤、架橋促進剤(触媒)等の公知の添加剤が挙げられる。
なお、反応遅延剤とは、例えば、粘着剤組成物(I-1)中に混入している触媒の作用によって、保存中の粘着剤組成物(I-1)において、目的としない架橋反応が進行するのを抑制するものである。反応遅延剤としては、例えば、触媒に対するキレートによってキレート錯体を形成するものが挙げられる。より具体的には、1分子中にカルボニル基(-C(=O)-)を2個以上有するものが挙げられる。
粘着剤組成物(I-1)は、溶媒を含有していてもよい。粘着剤組成物(I-1)は、溶媒を含有していることで、塗工対象面への塗工適性が向上する。
前記粘着剤組成物(I-2)は、上述の様に、非エネルギー線硬化性の粘着性樹脂(I-1a)の側鎖に不飽和基が導入されたエネルギー線硬化性の粘着性樹脂(I-2a)を含有する。
前記粘着性樹脂(I-2a)は、例えば、粘着性樹脂(I-1a)中の官能基に、エネルギー線重合性不飽和基を有する不飽和基含有化合物を反応させることで得られる。
前記エネルギー線重合性不飽和基としては、例えば、(メタ)アクリロイル基、ビニル基(エテニル基)、アリル基(2-プロペニル基)等が挙げられる。(メタ)アクリロイル基が好ましい。
粘着性樹脂(I-1a)中の官能基と結合可能な基としては、例えば、水酸基又はアミノ基と結合可能なイソシアネート基及びグリシジル基、並びにカルボキシ基又はエポキシ基と結合可能な水酸基及びアミノ基等が挙げられる。
粘着性樹脂(I-2a)として、例えば、粘着性樹脂(I-1a)におけるものと同様の、官能基含有モノマー由来の構成単位を有する前記アクリル系重合体を用いる場合、粘着剤組成物(I-2)は、さらに架橋剤を含有していてもよい。
粘着剤組成物(I-2)が含有する架橋剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-2)は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物(I-2)は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。
粘着剤組成物(I-2)が含有する光重合開始剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-2)は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
粘着剤組成物(I-2)における前記その他の添加剤としては、粘着剤組成物(I-1)におけるその他の添加剤と同じものが挙げられる。
粘着剤組成物(I-2)が含有するその他の添加剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-2)は、粘着剤組成物(I-1)の場合と同様の目的で、溶媒を含有していてもよい。
粘着剤組成物(I-2)における前記溶媒としては、粘着剤組成物(I-1)における溶媒と同じものが挙げられる。
粘着剤組成物(I-2)が含有する溶媒は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-2)において、溶媒の含有量は特に限定されず、適宜調節すればよい。
前記粘着剤組成物(I-3)は、上述の様に、前記粘着性樹脂(I-2a)と、エネルギー線硬化性化合物と、を含有する。
粘着剤組成物(I-3)が含有する前記エネルギー線硬化性化合物としては、エネルギー線重合性不飽和基を有し、エネルギー線の照射により硬化可能なモノマー及びオリゴマーが挙げられる。すなわち、粘着剤組成物(I-1)が含有するエネルギー線硬化性化合物と同じものが挙げられる。
粘着剤組成物(I-3)が含有する前記エネルギー線硬化性化合物は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-3)は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物(I-3)は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。
粘着剤組成物(I-3)が含有する光重合開始剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-3)は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
前記その他の添加剤としては、粘着剤組成物(I-1)におけるその他の添加剤と同じものが挙げられる。
粘着剤組成物(I-3)が含有するその他の添加剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-3)は、粘着剤組成物(I-1)の場合と同様の目的で、溶媒を含有していてもよい。
粘着剤組成物(I-3)における前記溶媒としては、粘着剤組成物(I-1)における溶媒と同じものが挙げられる。
粘着剤組成物(I-3)が含有する溶媒は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-3)において、溶媒の含有量は特に限定されず、適宜調節すればよい。
ここまでは、粘着剤組成物(I-1)、粘着剤組成物(I-2)及び粘着剤組成物(I-3)について主に説明した。これらの含有成分として説明したものは、これら3種の粘着剤組成物以外の全般的な粘着剤組成物(本明細書においては、「粘着剤組成物(I-1)~(I-3)以外の粘着剤組成物」と称する)でも、同様に用いることができる。
非エネルギー線硬化性の粘着剤組成物としては、以下のものが挙げられる。例えば、アクリル系樹脂、ウレタン系樹脂、ゴム系樹脂、シリコーン系樹脂、エポキシ系樹脂、ポリビニルエーテル、ポリカーボネート、エステル系樹脂等の、非エネルギー線硬化性の粘着性樹脂(I-1a)を含有する粘着剤組成物(I-4)が挙げられ、アクリル系樹脂を含有するものが好ましい。
粘着剤組成物(I-4)で好ましいものとしては、例えば、前記粘着性樹脂(I-1a)と、架橋剤と、を含有するものが挙げられる。
粘着剤組成物(I-4)における粘着性樹脂(I-1a)としては、粘着剤組成物(I-1)における粘着性樹脂(I-1a)と同じものが挙げられる。
粘着剤組成物(I-4)が含有する粘着性樹脂(I-1a)は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着性樹脂(I-1a)として、(メタ)アクリル酸アルキルエステル由来の構成単位以外に、さらに、官能基含有モノマー由来の構成単位を有する前記アクリル系重合体を用いる場合がある。その場合、粘着剤組成物(I-4)は、さらに架橋剤を含有することが好ましい。
粘着剤組成物(I-4)が含有する架橋剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-4)は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
前記その他の添加剤としては、粘着剤組成物(I-1)におけるその他の添加剤と同じものが挙げられる。
粘着剤組成物(I-4)が含有するその他の添加剤は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-4)は、粘着剤組成物(I-1)の場合と同様の目的で、溶媒を含有していてもよい。
粘着剤組成物(I-4)における前記溶媒としては、粘着剤組成物(I-1)における溶媒と同じものが挙げられる。
粘着剤組成物(I-4)が含有する溶媒は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
粘着剤組成物(I-4)において、溶媒の含有量は特に限定されず、適宜調節すればよい。
粘着剤組成物(I-1)~(I-3)や、粘着剤組成物(I-4)等の粘着剤組成物(I-1)~(I-3)以外の粘着剤組成物は、前記粘着剤と、必要に応じて前記粘着剤以外の成分等の、粘着剤組成物を構成するための各成分を配合することで得られる。
各成分の配合時における添加順序は特に限定されず、2種以上の成分を同時に添加してもよい。
溶媒を用いる場合には、溶媒を溶媒以外のいずれかの配合成分と混合してこの配合成分を予め希釈しておくことで用いてもよい。さらに、溶媒以外のいずれかの配合成分を予め希釈しておくことなく、溶媒をこれら配合成分と混合することで用いてもよい。
配合時に各成分を混合する方法は特に限定されない。撹拌子又は撹拌翼等を回転させて混合する方法;ミキサーを用いて混合する方法;超音波を加えて混合する方法等、公知の方法から適宜選択すればよい。
各成分の添加及び混合時の温度並びに時間は、各配合成分が劣化しない限り特に限定されず、適宜調節すればよい。但し、温度は15~30℃であることが好ましい。
本発明において、保護膜形成用フィルムを硬化して得られた保護膜と、支持シートとの間の粘着力は、50~1500mN/25mmであることが好ましい。52~1450mN/25mmであることがより好ましく、53~1430mN/25mmであることがさらに好ましい。前記粘着力が前記下限値以上であることで、保護膜付き半導体チップのピックアップ時に、目的外の保護膜付き半導体チップのピックアップが抑制される。その結果、目的とする保護膜付き半導体チップを高選択的にピックアップできる。また、前記粘着力が前記上限値以下であることで、保護膜付き半導体チップのピックアップ時に、半導体チップの割れ及び欠けが抑制される。このように、前記粘着力が特定の範囲内であることで、保護膜形成用複合シートは、良好なピックアップ適性を有する。
すなわち、幅が25mmで長さが任意の保護膜形成用複合シートをその保護膜形成用フィルムにより被着体へ貼付する。
次いで、エネルギー線を照射して保護膜形成用フィルムを硬化させて、保護膜を形成する。しかる後、被着体へ貼付されているこの保護膜から、支持シートを剥離速度300mm/minで剥離させる。このときの剥離は、保護膜及び支持シートの互いに接触していた面同士が180°の角度を為すように、支持シートをその長さ方向(保護膜形成用複合シートの長さ方向)へ剥離させる、いわゆる180°剥離とする。そして、この180°剥離のときの荷重(剥離力)を測定し、その測定値を前記粘着力(mN/25mm)とする。
一方、保護膜形成用フィルムと前記支持シートとの間の粘着力の上限値は、特に限定されない。例えば、4000mN/25mm、3500mN/25mm、3000mN/25mm等のいずれかとすることができる。ただし、これらは一例である。
一方、支持シートにおける保護膜形成用フィルムを設ける層が、基材である場合には、保護膜又は保護膜形成用フィルムと支持シートとの間の粘着力は、基材の構成材料以外に、基材の表面状態でも調節できる。そして、基材の表面状態は、例えば、基材の他の層との密着性を向上させるものとして先に挙げた表面処理を施すことで、調節できる。すなわち、サンドブラスト処理、溶剤処理等による凹凸化処理;コロナ放電処理、電子線照射処理、プラズマ処理、オゾン・紫外線照射処理、火炎処理、クロム酸処理、熱風処理等の酸化処理;プライマー処理等のいずれかを施すことで、調節できる。
エネルギー線硬化性成分(a)は、未硬化であることが好ましい。粘着性を有することが好ましく、未硬化でかつ粘着性を有することがより好ましい。
ここで、「保護膜形成用フィルムの厚さ」とは、保護膜形成用フィルム全体の厚さを意味する。例えば、複数層からなる保護膜形成用フィルムの厚さとは、保護膜形成用フィルムを構成するすべての層の合計の厚さを意味する。
例えば、保護膜形成用フィルムの硬化時における、エネルギー線の照度は、4~280mW/cm2であることが好ましい。そして、前記硬化時における、エネルギー線の光量は、3~1000mJ/cm2であることが好ましい。
保護膜形成用フィルムは、その構成材料を含有する保護膜形成用組成物を用いて形成できる。例えば、保護膜形成用フィルムの形成対象面に保護膜形成用組成物を塗工し、必要に応じて乾燥させることで、目的とする部位に保護膜形成用フィルムを形成できる。保護膜形成用組成物中の、常温で気化しない成分同士の含有量の比率は、通常、保護膜形成用フィルムの前記成分同士の含有量の比率と同じとなる。ここで、「常温」とは、先に説明したとおりである。
保護膜形成用組成物としては、例えば、前記エネルギー線硬化性成分(a)を含有する保護膜形成用組成物(IV-1)等が挙げられる。
エネルギー線硬化性成分(a)は、エネルギー線の照射によって硬化する成分であり、保護膜形成用フィルムに造膜性や、可撓性等を付与するための成分でもある。
エネルギー線硬化性成分(a)としては、例えば、エネルギー線硬化性基を有する、重量平均分子量が80000~2000000の重合体(a1)、及びエネルギー線硬化性基を有する、分子量が100~80000の化合物(a2)が挙げられる。前記重合体(a1)は、その少なくとも一部が、後述する架橋剤(f)によって架橋されたものであってもよいし、架橋されていないものであってもよい。
なお、本明細書において、重量平均分子量とは、特に断りのない限り、ゲル・パーミエーション・クロマトグラフィー(GPC)法により測定されるポリスチレン換算値を意味する。
エネルギー線硬化性基を有する、重量平均分子量が80000~2000000の重合体(a1)としては、例えば、他の化合物が有する基と反応可能な官能基を有するアクリル系重合体(a11)と、前記官能基と反応する基、及びエネルギー線硬化性二重結合等のエネルギー線硬化性基を有するエネルギー線硬化性化合物(a12)と、が重合してなるアクリル系樹脂(a1-1)が挙げられる。
これらの中でも、前記官能基は、水酸基であることが好ましい。
前記官能基を有するアクリル系重合体(a11)としては、例えば、前記官能基を有するアクリル系モノマーと、前記官能基を有しないアクリル系モノマーと、が共重合してなるものが挙げられる。これらモノマー以外に、さらにアクリル系モノマー以外のモノマー(非アクリル系モノマー)が共重合したものであってもよい。
また、前記アクリル系重合体(a11)は、ランダム共重合体であってもよいし、ブロック共重合体であってもよい。
前記アクリル系重合体(a11)を構成する前記非アクリル系モノマーは、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
前記エネルギー線硬化性化合物(a12)は、前記アクリル系重合体(a11)が有する官能基と反応可能な基として、イソシアネート基、エポキシ基及びカルボキシ基からなる群より選択される1種又は2種以上を有するものが好ましく、前記基としてイソシアネート基を有するものがより好ましい。前記エネルギー線硬化性化合物(a12)は、例えば、前記基としてイソシアネート基を有する場合、このイソシアネート基が、前記官能基として水酸基を有するアクリル系重合体(a11)のこの水酸基と容易に反応する。
ジイソシアネート化合物又はポリイソシアネート化合物と、ヒドロキシエチル(メタ)アクリレートとの反応により得られるアクリロイルモノイソシアネート化合物;
ジイソシアネート化合物又はポリイソシアネート化合物と、ポリオール化合物と、ヒドロキシエチル(メタ)アクリレートとの反応により得られるアクリロイルモノイソシアネート化合物等が挙げられる。
これらの中でも、前記エネルギー線硬化性化合物(a12)は、2-メタクリロイルオキシエチルイソシアネートであることが好ましい。
エネルギー線硬化性基を有する、分子量が100~80000の化合物(a2)が有するエネルギー線硬化性基としては、エネルギー線硬化性二重結合を含む基が挙げられる。好ましいものとしては、(メタ)アクリロイル基、ビニル基等が挙げられる。
前記アクリレート系化合物としては、以下のものが挙げられる。例えば、2-ヒドロキシ-3-(メタ)アクリロイルオキシプロピルメタクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロポキシ化エトキシ化ビスフェノールAジ(メタ)アクリレート、2,2-ビス[4-((メタ)アクリロキシポリエトキシ)フェニル]プロパン、エトキシ化ビスフェノールAジ(メタ)アクリレート、2,2-ビス[4-((メタ)アクリロキシジエトキシ)フェニル]プロパン、9,9-ビス[4-(2-(メタ)アクリロイルオキシエトキシ)フェニル]フルオレン、2,2-ビス[4-((メタ)アクリロキシポリプロポキシ)フェニル]プロパン、トリシクロデカンジメタノールジ(メタ)アクリレート(トリシクロデカンジメチロールジ(メタ)アクリレート)、1,10-デカンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、1,9-ノナンジオールジ(メタ)アクリレート、ジプロピレングリコールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、ポリテトラメチレングリコールジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、2,2-ビス[4-((メタ)アクリロキシエトキシ)フェニル]プロパン、ネオペンチルグリコールジ(メタ)アクリレート、エトキシ化ポリプロピレングリコールジ(メタ)アクリレート、2-ヒドロキシ-1,3-ジ(メタ)アクリロキシプロパン等の2官能(メタ)アクリレート;
トリス(2-(メタ)アクリロキシエチル)イソシアヌレート、ε-カプロラクトン変性トリス-(2-(メタ)アクリロキシエチル)イソシアヌレート、エトキシ化グリセリントリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、エトキシ化ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールポリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート等の多官能(メタ)アクリレート;
ウレタン(メタ)アクリレートオリゴマー等の多官能(メタ)アクリレートオリゴマー等が挙げられる。
保護膜形成用組成物(IV-1)及び保護膜形成用フィルムは、前記エネルギー線硬化性成分(a)として前記化合物(a2)を含有する場合、さらにエネルギー線硬化性基を有しない重合体(b)も含有することが好ましい。
前記重合体(b)は、その少なくとも一部が架橋剤(f)によって架橋されたものであってもよいし、架橋されていないものであってもよい。
これらの中でも、前記重合体(b)は、アクリル系重合体(以下、「アクリル系重合体(b-1)」と略記することがある)であることが好ましい。
(メタ)アクリル酸ベンジル等の(メタ)アクリル酸アラルキルエステル;
(メタ)アクリル酸ジシクロペンテニルエステル等の(メタ)アクリル酸シクロアルケニルエステル;
(メタ)アクリル酸ジシクロペンテニルオキシエチルエステル等の(メタ)アクリル酸シクロアルケニルオキシアルキルエステル等が挙げられる。
前記水酸基含有(メタ)アクリル酸エステルとしては、以下のものが挙げられる。例えば、(メタ)アクリル酸ヒドロキシメチル、(メタ)アクリル酸2-ヒドロキシエチル、(メタ)アクリル酸2-ヒドロキシプロピル、(メタ)アクリル酸3-ヒドロキシプロピル、(メタ)アクリル酸2-ヒドロキシブチル、(メタ)アクリル酸3-ヒドロキシブチル、(メタ)アクリル酸4-ヒドロキシブチル等が挙げられる。
前記置換アミノ基含有(メタ)アクリル酸エステルとしては、例えば、(メタ)アクリル酸N-メチルアミノエチル等が挙げられる。
前記反応性官能基は、架橋剤(f)の種類等に応じて適宜選択すればよく、特に限定されない。例えば、架橋剤(f)がポリイソシアネート化合物である場合には、前記反応性官能基としては、水酸基、カルボキシ基、アミノ基等が挙げられ、これらの中でも、イソシアネート基との反応性が高い水酸基が好ましい。また、架橋剤(f)がエポキシ系化合物である場合には、前記反応性官能基としては、カルボキシ基、アミノ基、アミド基等が挙げられる。これらの中でもエポキシ基との反応性が高いカルボキシ基が好ましい。ただし、半導体ウエハや半導体チップの回路の腐食を防止するという点では、前記反応性官能基はカルボキシ基以外の基であることが好ましい。
光重合開始剤(c)としては、以下のものが挙げられる。例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル、ベンゾイン安息香酸、ベンゾイン安息香酸メチル、ベンゾインジメチルケタール等のベンゾイン化合物;アセトフェノン、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン等のアセトフェノン化合物;ビス(2,4,6-トリメチルベンゾイル)フェニルフォスフィンオキサイド、2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド等のアシルフォスフィンオキサイド化合物;ベンジルフェニルスルフィド、テトラメチルチウラムモノスルフィド等のスルフィド化合物;1-ヒドロキシシクロヘキシルフェニルケトン等のα-ケトール化合物;アゾビスイソブチロニトリル等のアゾ化合物;チタノセン等のチタノセン化合物;チオキサントン等のチオキサントン化合物;ベンゾフェノン、2-(ジメチルアミノ)-1-(4-モルホリノフェニル)-2-ベンジル-1-ブタノン、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)等のベンゾフェノン化合物;パーオキサイド化合物;ジアセチル等のジケトン化合物;ベンジル;ジベンジル;2,4-ジエチルチオキサントン;1,2-ジフェニルメタン;2-ヒドロキシ-2-メチル-1-[4-(1-メチルビニル)フェニル]プロパノン;2-クロロアントラキノン等が挙げられる。
また、光重合開始剤(c)としては、例えば、1-クロロアントラキノン等のキノン化合物;アミン等の光増感剤等を用いることもできる。
保護膜形成用フィルムが充填材(d)を含有することにより、保護膜形成用フィルムを硬化して得られた保護膜は、熱膨張係数の調整が容易となる。その結果、この熱膨張係数を保護膜の形成対象物に対して最適化することで、保護膜形成用複合シートを用いて得られたパッケージの信頼性がより向上する。また、保護膜形成用フィルムが充填材(d)を含有することにより、保護膜の吸湿率を低減したり、放熱性を向上させたりすることもできる。
充填材(d)としては、例えば、熱伝導性材料からなるものが挙げられる。
好ましい無機充填材としては、例えば、シリカ、アルミナ、タルク、炭酸カルシウム、チタンホワイト、ベンガラ、炭化ケイ素、窒化ホウ素等の粉末;これら無機充填材を球形化したビーズ;これら無機充填材の表面改質品;これら無機充填材の単結晶繊維;ガラス繊維等が挙げられる。
これらの中でも、無機充填材は、シリカ又はアルミナであることが好ましい。
充填材(d)の平均粒子径がこのような範囲であることで、保護膜の形成対象物に対する接着性を維持しつつ、保護膜の光の透過率の低下を抑制できる。
なお、本明細書において「平均粒子径」とは、特に断りのない限り、レーザー回折散乱法によって求められた粒度分布曲線における、積算値50%での粒子径(D50)の値を意味する。
カップリング剤(e)として、無機化合物又は有機化合物と反応可能な官能基を有するものを用いることにより、保護膜形成用フィルムの被着体に対する接着性及び密着性を向上させることができる。また、カップリング剤(e)を用いることで、保護膜形成用フィルムを硬化して得られた保護膜は、耐熱性を損なうことなく、耐水性が向上する。
好ましい前記シランカップリング剤としては、以下のものが挙げられる。例えば、3-グリシジルオキシプロピルトリメトキシシラン、3-グリシジルオキシプロピルメチルジエトキシシラン、3-グリシジルオキシプロピルトリエトキシシラン、3-グリシジルオキシメチルジエトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-メタクリロイルオキシプロピルトリメトキシシラン、3-アミノプロピルトリメトキシシラン、3-(2-アミノエチルアミノ)プロピルトリメトキシシラン、3-(2-アミノエチルアミノ)プロピルメチルジエトキシシラン、3-(フェニルアミノ)プロピルトリメトキシシラン、3-アニリノプロピルトリメトキシシラン、3-ウレイドプロピルトリエトキシシラン、3-メルカプトプロピルトリメトキシシラン、3-メルカプトプロピルメチルジメトキシシラン、ビス(3-トリエトキシシリルプロピル)テトラスルファン、メチルトリメトキシシラン、メチルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリアセトキシシラン、イミダゾールシラン等が挙げられる。
架橋剤(F)を用いて、上述のエネルギー線硬化性成分(a)やエネルギー線硬化性基を有しない重合体(b)架橋することにより、保護膜形成用フィルムの初期接着力及び凝集力を調節できる。
着色剤(g)としては、例えば、無機系顔料、有機系顔料、有機系染料等、公知のものが挙げられる。
保護膜形成用組成物(IV-1)及び保護膜形成用フィルムが含有する熱硬化性成分(h)は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
エポキシ系熱硬化性樹脂は、エポキシ樹脂(h1)及び熱硬化剤(h2)からなる。 保護膜形成用組成物(IV-1)及び保護膜形成用フィルムが含有するエポキシ系熱硬化性樹脂は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
エポキシ樹脂(h1)としては、公知のものが挙げられる。例えば、多官能系エポキシ樹脂、ビフェニル化合物、ビスフェノールAジグリシジルエーテル及びその水添物、オルソクレゾールノボラックエポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェニレン骨格型エポキシ樹脂等、2官能以上のエポキシ化合物が挙げられる。
また、不飽和炭化水素基を有するエポキシ樹脂としては、例えば、エポキシ樹脂を構成する芳香環等に、不飽和炭化水素基を有する基が直接結合した化合物等が挙げられる。 不飽和炭化水素基は、重合性を有する不飽和基であり、その具体的な例としては、エテニル基(ビニル基)、2-プロペニル基(アリル基)、(メタ)アクリロイル基、(メタ)アクリルアミド基等が挙げられ、アクリロイル基が好ましい。
エポキシ樹脂(h1)のエポキシ当量は、100~1000g/eqであることが好ましく、150~800g/eqであることがより好ましい。
熱硬化剤(h2)は、エポキシ樹脂(h1)に対する硬化剤として機能する。
熱硬化剤(h2)としては、例えば、1分子中にエポキシ基と反応し得る官能基を2個以上有する化合物が挙げられる。前記官能基としては、例えば、フェノール性水酸基、アルコール性水酸基、アミノ基、カルボキシ基、酸基が無水物化された基等が挙げられる。フェノール性水酸基、アミノ基、又は酸基が無水物化された基であることが好ましく、フェノール性水酸基又はアミノ基であることがより好ましい。
熱硬化剤(h2)のうち、アミノ基を有するアミン系硬化剤としては、例えば、ジシアンジアミド(以下、「DICY」と略記することがある)等が挙げられる。
不飽和炭化水素基を有する熱硬化剤(h2)としては、例えば、フェノール樹脂の水酸基の一部が、不飽和炭化水素基を有する基で置換されてなる化合物、フェノール樹脂の芳香環に、不飽和炭化水素基を有する基が直接結合してなる化合物等が挙げられる。
熱硬化剤(h2)における前記不飽和炭化水素基は、上述の不飽和炭化水素基を有するエポキシ樹脂における不飽和炭化水素基と同様のものである。
熱硬化剤(h2)のうち、例えば、ビフェノール、ジシアンジアミド等の非樹脂成分の分子量は、特に限定されないが、例えば、60~500であることが好ましい。
本発明で用いる帯電防止剤(j)は、保護膜形成フィルムの表面抵抗率を所望の値に調節することが出来るものであれば良く、特に限定されない。
例えば、アニオン系界面活性剤系帯電防止剤、カチオン系界面活性剤系帯電防止剤、ノニオン系界面活性剤系帯電防止剤、両イオン系界面活性剤系帯電防止剤、および、非イオン系界面活性剤系帯電防止剤からなる群から選択される少なくとも1種などが挙げられる。
また、高分子型帯電防止剤を使用することも出来る。例えば、ポリエーテルエステルアミド系、エチレンオキシド-エピクロルヒドリン系、およびポリエーテルエステル系等の非イオン系高分子型帯電防止剤、ポリスチレンスルホン系等のアニオン系高分子型帯電防止剤、四級アンモニウム塩基含有アクリレート重合体系等のカチオン系高分子型帯電防止剤を用いることができる。
更に、ソルビタンモノラウレート、ポリオキシエチレンソルビタンモノラウレート等のモノラウレート系帯電防止剤;
グリセリン脂肪酸エステルモノグリセライド、グリセリン脂肪酸エステルアセチル化モノグリセライド、グリセリン脂肪酸エステル有機酸モノグリセライド、及び、グリセリン脂肪酸エステル中鎖脂肪酸トリグリセライド等のグリセライド系帯電防止剤;
ポリグリセリン脂肪酸エステル、ソルビタン脂肪酸エステル、プロピレングリコール脂肪酸エステル、特殊脂肪酸エステル、及び、高級アルコール脂肪酸エステル等のエステル型帯電防止剤を使用することも出来る。
本発明において、前記帯電防止剤(j)の含有量は、前記保護膜形成用フィルムに含まれる樹脂成分の質量に対して1~20質量%含まれることが好ましく、更に3~10質量%であることが更に好ましい。即ち、前記保護膜形成用フィルムが、さらにエネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)を含有する場合には、前記保護膜形成用フィルムにおいて、前記帯電防止剤が、前記エネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)の合計質量に対して1~20質量%含まれることが好ましく、更に3~10質量%であることが更に好ましい。
帯電防止剤(j)の含有量が前記下限値を下回ると、十分な導電性を得る事ができず、帯電防止性が向上しないという問題がある。他方、帯電防止剤の含有量が前記上限値を上回ると、保護層とSiとの界面にブリードアウトし、信頼性が低下するという問題がある。
本発明において、帯電防止剤(j)を適用する方法としては、特に限定されない。保護膜形成用組成物中に帯電防止剤(j)を添加して混合することにより練り込んでもよく、保護膜形成用組成物又は保護膜形成用フィルムの表面に帯電防止剤(j)を塗布してもよい。さらに、保護膜形成用組成物又は保護膜形成用フィルムの表面に帯電防止剤(j)を含む層をフィルム状にコーティングしてもよい。更に、保護膜形成用フィルム表面に貼着する剥離シートの剥離層(表面)に帯電防止剤(j)を付与することにより保護膜形成用フィルムの帯電防止を図ることも可能である。
汎用添加剤(z)は、公知のものでよく、目的に応じて任意に選択でき、特に限定されない。但し、好ましいものとしては、例えば、可塑剤、帯電防止剤、酸化防止剤、ゲッタリング剤等が挙げられる。
汎用添加剤(z)を用いる場合、保護膜形成用組成物(IV-1)及び保護膜形成用フィルムの汎用添加剤(z)の含有量は、特に限定されない目的に応じて適宜選択すればよい。
保護膜形成用組成物(IV-1)は、さらに溶媒を含有することが好ましい。溶媒を含有する保護膜形成用組成物(IV-1)は、取り扱い性が良好となる。
前記溶媒は特に限定されない。但し、好ましいものとしては、例えば、トルエン、キシレン等の炭化水素;メタノール、エタノール、2-プロパノール、イソブチルアルコール(2-メチルプロパン-1-オール)、1-ブタノール等のアルコール;酢酸エチル等のエステル;アセトン、メチルエチルケトン等のケトン;テトラヒドロフラン等のエーテル;ジメチルホルムアミド、N-メチルピロリドン等のアミド(アミド結合を有する化合物)等が挙げられる。
保護膜形成用組成物(IV-1)が含有する溶媒は、1種のみでもよいし、2種以上でもよい。2種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
保護膜形成用組成物(IV-1)等の保護膜形成用組成物は、これを構成するための各成分を配合することで得られる。
各成分の配合時における添加順序は特に限定されず、2種以上の成分を同時に添加してもよい。
溶媒を用いる場合には、溶媒を溶媒以外のいずれかの配合成分と混合してこの配合成分を予め希釈しておくことで用いてもよい。また、溶媒以外のいずれかの配合成分を予め希釈しておくことなく、溶媒をこれら配合成分と混合することで用いてもよい。
配合時に各成分を混合する方法は特に限定されない。撹拌子又は撹拌翼等を回転させて混合する方法;ミキサーを用いて混合する方法;超音波を加えて混合する方法等、公知の方法から適宜選択すればよい。
各成分の添加及び混合時の温度並びに時間は、各配合成分が劣化しない限り特に限定されず、適宜調節すればよいが、温度は15~30℃であることが好ましい。
しかし、ダイシングダイボンディングシートが備える接着剤層は、半導体チップとともに支持シートからピックアップされた後、この半導体チップを基板、リードフレーム、又は他の半導体チップ等に取り付ける際の接着剤として機能する。一方、本発明の保護膜形成用複合シートにおける保護膜形成用フィルムは、半導体チップとともに支持シートからピックアップされる点では前記接着剤層と同じであるが、最終的には硬化によって保護膜となり、貼付されている半導体チップの裏面を保護するという機能を有する。このように、本発明における保護膜形成用フィルムは、ダイシングダイボンディングシートにおける接着剤層とは、用途が異なり、求められる性能も当然に異なる。そして、この用途の違いを反映して、保護膜形成用フィルムは、通常、ダイシングダイボンディングシートにおける接着剤層と比較すると、硬めで、ピックアップが難しい傾向にある。したがって、ダイシングダイボンディングシートにおける接着剤層を、そのまま保護膜形成用複合シートにおける保護膜形成用フィルムとして転用することは、通常、困難である。本発明の保護膜形成用複合シートは、エネルギー線硬化性の保護膜形成用フィルムを備えたものとしては、保護膜付き半導体チップのピックアップ適性に関して、従来になく極めて優れたものである。
本発明の保護膜形成用複合シートは、上述の各層を対応する位置関係となるように順次積層することで製造できる。各層の形成方法は、先に説明したとおりである。
例えば、支持シートを製造するときに、基材上に粘着剤層を積層する場合には、基材上に上述の粘着剤組成物を塗工し、必要に応じて乾燥させればよい。
いずれの方法においても、剥離フィルムは目的とする積層構造を形成後の任意のタイミングで取り除けばよい。
本発明の保護膜形成用複合シートは、例えば、以下に示す方法で使用できる。
すなわち、半導体ウエハの裏面(電極形成面とは反対側の面)に、保護膜形成用複合シートをその保護膜形成用フィルムによって貼付する。次いで、保護膜形成用フィルムにエネルギー線を照射して、保護膜形成用フィルムを硬化させて保護膜とする。次いで、ダイシングによって、半導体ウエハを保護膜ごと分割して半導体チップとする。そして、半導体チップを、この保護膜が貼付された状態のまま(すなわち、保護膜付き半導体チップとして)、支持シートから引き離してピックアップする。
以降は従来法と同様の方法で、得られた保護膜付き半導体チップの半導体チップを基板の回路面にフリップチップ接続した後、全体を樹脂により封止することで、半導体パッケージとする。そして、この半導体パッケージを用いて、目的とする半導体装置を作製すればよい。
図6は、本発明の更に他の一実施形態に係る保護膜形成用フィルムを模式的に示す断面図である。
図6に示したように、本実施形態に係る保護膜形成用フィルム1Fは、「ロール型」と呼ばれるものである。これは、剥離フィルム15a(以下、「第1の剥離フィルム」という場合がある。)と剥離フィルム15b(以下、「第2の剥離フィルム」という場合がある)の間に保護膜形成用組成物13を層状に適用した構造からなる。
この保護膜形成用フィルム1Fに用いられる保護膜形成用組成物13は既出の保護膜形成用組成物に準じる。
この保護膜形成用フィルム1Fは、例えば、第1の剥離フィルム15aの剥離面上に保護膜形成用組成物13を適用し、更にその上に第2の剥離フィルム15bを剥離面側を保護膜形成用組成物13側に向けて適用し、押圧することにより形成することができる。保護膜形成用組成物の適用方法は、上記の保護膜形成用組成物の適用方法に準じる。
本発明の保護膜形成用フィルムは、例えば、以下に示す方法で使用できる。
すなわち、半導体ウエハの裏面(電極形成面とは反対側の面)に、保護膜形成用フィルム貼付する。次いで、保護膜形成用フィルムにエネルギー線を照射して、保護膜形成用フィルムを硬化させて保護膜とする。次いで、ダイシングによって、半導体ウエハを保護膜ごと分割して半導体チップとする。そして、半導体チップを、この保護膜が貼付された状態のまま(すなわち、保護膜付き半導体チップとして)、支持シートから引き離してピックアップする。
本明細書において、「エンボスキャリアテープ」とは、ポリスチレン、ポリエチレンテレフタレート又はポリプロピレン等の樹脂製の長尺状シートに一定間隔で列設された複数の凹部(ポケットと称される場合がある)が形成された梱包資材であり、前記複数の各ポケットには、例えば本発明に係る保護膜付き半導体チップを収納することができる。前記複数の各ポケットは、通常、本発明に係る保護膜付き半導体チップ等の被収納物を収納した状態で、その開口部が長尺状のカバーテープが貼着されることにより閉蓋される。保護膜付き半導体チップを梱包したエンボスキャリアテープは、リールに巻回した状態で使用することができる。例えば、前記リールをマウンターにセットし、基板に保護膜付き半導体チップを実装することができる。エンボスキャリアテープのポケットは、被収納物の大きさに合わせて設計、加工することができる。本明細書におけるエンボスキャリアテープの各ポケットは、例えば、縦寸0.5mm~30mm、横寸0.5mm~30mm及び深さ0.1mm~10mmであるものが挙げられる。前記長尺状のカバーテープの厚さは10 ~100μmであり、PET、ポリエチレン等の素材で形成されている。
・エネルギー線硬化性成分
(a2)-1:トリシクロデカンジメチロールジアクリレート(日本化薬社製「KAYARAD R-684」、2官能紫外線硬化性化合物、分子量304)
・エネルギー線硬化性基を有しない重合体
(b)-1:アクリル酸ブチル(以下、「BA」と略記する)(10質量部)、アクリル酸メチル(以下、「MA」と略記する)(70質量部)、メタクリル酸グリシジル(以下、「GMA」と略記する)(5質量部)及びアクリル酸-2-ヒドロキシエチル(以下、「HEA」と略記する)(15質量部)を共重合してなるアクリル系樹脂(重量平均分子量300000、ガラス転移温度-1℃)。
・光重合開始剤
(c)-1:2-(ジメチルアミノ)-1-(4-モルホリノフェニル)-2-ベンジル-1-ブタノン(BASF社製「Irgacure(登録商標)369」)
(c)-2:エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)(BASF社製「Irgacure(登録商標)OXE02」)
・充填材
(d)-1:シリカフィラー(ビニル基表面修飾、平均粒子径50nm)
・カップリング剤
(e)-1:3-メタクリロキシプロピルトリメトキシシラン(信越化学工業社製「KBM-503」、シランカップリング剤)
・着色剤
(g)-1:フタロシアニン系青色色素(Pigment Blue 15:3)32質量部と、イソインドリノン系黄色色素(Pigment Yellow 139)18質量部と、アントラキノン系赤色色素(Pigment Red 177)50質量部とを混合し、前記3種の色素の合計量/スチレンアクリル樹脂量=1/3(質量比)となるように顔料化して得られた顔料。
・帯電防止剤:
(j)-1:テトラエチレングリコールジメチルエーテルを担体とするイミドリチウム型の帯電防止剤(三光化学工業製「サンコノールTGR」)
<保護膜形成用複合シートの製造>
(保護膜形成用組成物(IV-1)の製造)
エネルギー線硬化性成分(a2)-1、重合体(b)-1、光重合開始剤(c)-1、光重合開始剤(c)-2、充填材(d)-1、カップリング剤(e)-1、着色剤(g)-1及び帯電防止剤(j)-1を、これらの含有量(固形分量、質量部)が表1に示す値となるようにメチルエチルケトンに溶解又は分散させて、23℃で撹拌することで、固形分濃度が50質量%である保護膜形成用組成物(IV-1)を調製した。
アクリル系重合体(100質量部、固形分)、及び3官能キシリレンジイソシアネート系架橋剤(三井武田ケミカル社製「タケネートD110N」)(10.7質量部、固形分)を含有し、さらに溶媒としてメチルエチルケトンを含有する、固形分濃度が30質量%の非エネルギー線硬化性の粘着剤組成物(I-4)を調製した。前記アクリル系重合体は、アクリル酸-2-エチルヘキシル(以下、「2EHA」と略記する)(36質量部)、BA(59質量部)、及びHEA(5質量部)を共重合してなる、重量平均分子量が600000のものである。
ポリエチレンテレフタレート製フィルムの片面がシリコーン処理により剥離処理された剥離フィルム(リンテック社製「SP-PET381031」、厚さ38μm。以下、「P1」と表す場合がある。)の前記剥離処理面に、上記で得られた粘着剤組成物(I-4)を塗工し、120℃で2分加熱乾燥させることにより、厚さ10μmの非エネルギー線硬化性の粘着剤層を形成した。
次いで、この粘着剤層の露出面に、基材としてポリプロピレン系フィルムポリプロピレン系フィルム(ヤング率400MPa、厚さ80μm、以下「S1」と表す場合がある。)を貼り合せることにより、前記基材の一方の表面上に前記粘着剤層を備えた支持シート(10)-1を得た。
ポリエチレンテレフタレート製フィルムの片面がシリコーン処理により剥離処理された剥離フィルム(リンテック社製「SP-PET381031」、厚さ38μm、P1)の前記剥離処理面に、上記で得られた保護膜形成用組成物(IV-1)をナイフコーターにより塗工し、100℃で2分乾燥させることにより、厚さ25μmのエネルギー線硬化性の保護膜形成用フィルム(13)-1を作製した。
(保護膜形成用フィルムの表面抵抗率)
表面抵抗率測定装置ADVANTEST社製、DIGITAL ELECTRONMETER R8252を用いて、得られた保護膜形成用フィルムの、紫外線照射装置(リンテック社製「RAD2000m/8」)を用いて、照度195mW/cm2、光量170mJ/cm2の条件で、保護膜形成用複合シートに紫外線を照射して硬化させたときの表面抵抗率を測定した。
照射することで、保護膜形成用フィルムを硬化させたときの、保護膜とした。結果を表2に示す。
なお、表2中の「帯電防止剤[質量%]」は、保護膜形成用フィルムにおける、エネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)の合計質量に対する、帯電防止剤の含有量を意味する。
6インチシリコンウエハ(厚さ100μm)の#2000研磨面に、上記で得られた保護膜形成用複合シートをその保護膜形成用フィルム(13)-1によって貼付し、さらにこのシートをリングフレームに固定して、30分静置した。
次いで、紫外線照射装置(リンテック社製「RAD2000m/8」)を用いて、照度195mW/cm2、光量170mJ/cm2の条件で、支持シート(10)-1側から保護膜形成用複合シートに紫外線を照射することで、保護膜形成用フィルム(13)-1を硬化させ、保護膜とした。
次いで、ダイシングブレードを用いて、シリコンウエハを保護膜ごとダイシングして個片化し、縦3mm×横3mm、保護層厚さ25μm、Si層厚350μm、のシリコンチップを得た。
次いで、ダイボンダー(キャノンマシナリー社製「BESTEM-D02」)を用いて、20個の保護膜付きシリコンチップをピックアップした。
縦12cm×横12cm、厚さ5mmの鉄板の上に前記得られた保護膜付きシリコンチップ16個を互いの間隔が均等になるように縦4個×横4個ずつ正方形のマス目状の位置に載置し、その上に縦12cm×横3.8cmのカバーテープ(住友ベークライト社製、CSL-Z7302)を被せ、40℃に熱した熱盤上に載置し、その上に金属板を載置して保護膜付きシリコンチップに掛かる圧力が350gfとなるようにセットし、一分間過熱した。その後金属板を取り除き、前記カバーテープを剥がして、カバーテープに保護膜付きシリコンチップが付着するか否かをテストした。結果を表2に示す。
判定方法としては、16個の保護膜付きシリコンチップのうち、一つでもカバーテープに付着した場合には「有り」と判定し、16個の保護膜付きシリコンチップのうち、一つもカバーテープに付着しない場合には「無し」と判定することとした。
[実施例2]
帯電防止剤(h)-1の含有量を6質量部にした以外は、実施例1と同じ方法で、保護膜形成用フィルム(13)-2を作製した。更に、これを用いて保護膜形成用複合シートを製造し、保護膜形成用フィルムの特性を評価した。結果を表2に示す。
<保護膜形成用フィルムの製造>
剥離フィルム1(ポリエチレンテレフタレート製フィルムの片面がシリコーン処理により剥離処理された剥離フィルム(リンテック社製「SP-PET381031」、厚さ38μm。P1)の剥離面側の表面に上記で得られた保護膜形成用組成物(IV-1)をナイフコーターにより塗工し、乾燥させた後、その上に剥離フィルム2(ポリエチレンテレフタレート製フィルムの片面がシリコーン処理により剥離処理された剥離フィルム(リンテック社製「SP-PET382150」、厚さ38μm。以下「P2」と表す場合がある。))を貼合し、次いで、100℃で2分乾燥させることにより、厚さ25μmのエネルギー線硬化性の保護膜形成用フィルム(14)-1を作製した。
<保護膜形成用フィルムの評価>
表面抵抗率測定装置ADVANTEST社製、DIGITAL ELECTRONMETER R8252を用いて、得られた保護膜形成用フィルムの、紫外線照射装置(リンテック社製「RAD2000m/8」)を用いて、照度195mW/cm2、光量170mJ/cm2の条件で、保護膜形成用複合シートに紫外線を照射して硬化させたときの表面抵抗率を測定した。得られた保護膜形成用フィルムの表面抵抗率を測定した。結果を表2に示す。
6インチシリコンウエハ(厚さ100μm)の#2000研磨面に、上記で得られた保護膜形成用フィルムを貼付し、30分静置した。
次いで、紫外線照射装置(リンテック社製「RAD2000m/8」)を用いて、照度195mW/cm2、光量170mJ/cm2の条件で、保護膜形成用フィルム側から紫外線を照射することで、保護膜形成用フィルム(14)-1を硬化させ、保護膜とした。 次いで、ダイシングブレードを用いて、シリコンウエハを保護膜ごとダイシングして個片化し、縦3mm×横3mm、保護層厚さ25μm、Si層厚350μm、のシリコンチップを得た。
次いで、ダイボンダー(キャノンマシナリー社製「BESTEM-D02」)を用いて、20個の保護膜付きシリコンチップをピックアップした。
縦12cm×横12cm、厚さ5mmの鉄板の上に前記得られた保護膜付きシリコンチップ16個を互いの間隔が均等になるように4個×4個ずつ合計16個を正方形のマス目状の位置に載置し、その上に縦12cm×横3.8cmのカバーテープ(住友ベークライト社製、CSL-Z7302)を被せ、40℃に熱した熱盤上に載置し、その上に金属板を載置して保護膜付きシリコンチップに掛かる圧力が350gfとなるようにセットし、一分間過熱した。その後金属板を取り除き、前記カバーテープを剥がして、カバーテープに保護膜付きシリコンチップが付着するか否かをテストした。結果を表2に示す。
<保護膜形成用複合シートの製造>
(保護膜形成用組成物(IV-1)の製造)
表1に示すように、帯電防止剤の含有量(配合量)を3質量部に代えて6質量部とした点以外は、実施例3と同じ方法で、保護膜形成用組成物(IV-1)を調製し、保護膜形成用フィルムを作製し、特性を評価した。結果を表2に示す。
帯電防止剤の配合量を0重量部とした以外は、実施例1と同様にして保護膜形成用複合シートを作製し、保護膜形成用フィルムの特性を評価した。結果を表2に示す。
[比較例2][ロール型]
帯電防止剤の配合量を0重量部とした以外は、実施例3と同様にして保護膜形成用フィルムを作製し、その特性を評価した。結果を表2に示す。
<保護膜形成用複合シートの製造及び保護膜形成用フィルムの評価>
上記で得られた保護膜形成用フィルムについて、実施例1と同じ方法で評価した。結果を表2に示す。
1F・・・保護膜形成用フィルムシート、
10・・・支持シート、
10a・・・支持シートの表面、
11・・・基材、
11a・・・基材の表面、
12・・・粘着剤層、
12a・・・粘着剤層の表面、
13,23・・・保護膜形成用フィルム、
13a,23a・・・保護膜形成用フィルムの表面、
15・・・剥離フィルム、
16・・・治具用接着剤層、
16a・・・治具用接着剤層
Claims (6)
- エネルギー線硬化性の保護膜形成用フィルムであって、
前記保護膜形成用フィルムは、エネルギー線を照射して硬化させたとき、表面抵抗率が1012Ω・cm以下である、保護膜形成用フィルム。 - 前記保護膜形成用フィルムが、帯電防止剤を含む、請求項1に記載の保護膜形成用フィルム。
- 前記帯電防止剤が、アニオン系界面活性剤系帯電防止剤、カチオン系界面活性剤系帯電防止剤、ノニオン系界面活性剤系帯電防止剤、両イオン系界面活性剤系帯電防止剤、および、非イオン系界面活性剤系帯電防止剤からなる群から選択される少なくとも1種である、請求項2に記載の保護膜形成用フィルム。
- 前記帯電防止剤が、アルカリ金属塩系である、請求項2又は3に記載の保護膜形成用フィルム。
- 前記保護膜形成用フィルムが、さらにエネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)を含有し、
前記保護膜形成用フィルムにおいて、前記帯電防止剤が、前記エネルギー線硬化性成分(a)及びエネルギー線硬化性基を有しない重合体(b)の合計質量に対して6~20質量%含まれる、請求項2~4のいずれかに記載の保護膜形成用フィルム。 - 請求項1~5のいずれかに記載の保護膜形成用フィルムを支持シート上に備えてなる、保護膜形成用複合シート。
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TWI837233B (zh) | 2018-12-05 | 2024-04-01 | 日商琳得科股份有限公司 | 保護膜形成用複合片、以及半導體晶片之製造方法 |
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