WO2017185969A1 - 终端的壳体和移动终端 - Google Patents

终端的壳体和移动终端 Download PDF

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Publication number
WO2017185969A1
WO2017185969A1 PCT/CN2017/079958 CN2017079958W WO2017185969A1 WO 2017185969 A1 WO2017185969 A1 WO 2017185969A1 CN 2017079958 W CN2017079958 W CN 2017079958W WO 2017185969 A1 WO2017185969 A1 WO 2017185969A1
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WIPO (PCT)
Prior art keywords
heat storage
housing
storage material
heat
terminal according
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Ceased
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PCT/CN2017/079958
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English (en)
French (fr)
Inventor
吴寿宽
曾武春
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Publication of WO2017185969A1 publication Critical patent/WO2017185969A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of electronic devices, and in particular, to a housing and a mobile terminal of a terminal.
  • the heat is not controlled or transferred, it will bring The impact of two aspects: 1, the temperature of the mobile terminal chip is too high, resulting in slow operation of the mobile terminal, and even stuck, affecting the use of the mobile terminal; 2, the temperature of the mobile terminal chip is transmitted to the outer casing of the mobile phone, resulting in a higher temperature of the outer casing, using There will be problems such as hot hands and hot ears.
  • the prior art In order to solve the problem of heat generation of the mobile terminal, the prior art generally disposes the heat dissipating graphite sheet on the inner surface of the housing of the terminal to indirectly dissipate the chip, but since the setting of the heat dissipating graphite sheet is limited by the position, The heat-generating position cannot be directly dissipated, resulting in poor heat dissipation.
  • the embodiment of the present application provides a housing for connecting a front cover to form an accommodating space for accommodating the packaged electronic device, the housing including the body and the heat absorbing heat storage material, and the heat absorbing heat storage.
  • the endothermic heat storage material is a material having an endothermic and heat storage function, the endothermic heat storage material is for absorbing and storing the The heat of the electronic device.
  • the embodiment of the present application further provides a mobile terminal, including a shell of the foregoing terminal.
  • FIG. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a housing of a terminal according to an embodiment of the present application.
  • FIG. 3 is a schematic perspective structural view of a housing of a terminal according to an embodiment of the present application.
  • the mobile terminal involved in the embodiment of the present application may be any device having communication and storage functions, such as a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), a notebook computer, an in-vehicle device, and a network television.
  • a smart device with network capabilities such as wearable devices.
  • FIG. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
  • the mobile terminal may include a housing 1 of the terminal, and the housing 1 is preferably a battery cover.
  • the housing 1 may be a metal or plastic material having a certain thickness.
  • the housing 1 is connected to the front cover of the mobile terminal to form an accommodating space, and the electronic components such as the main board, the CPU, the battery, the display screen, and the camera of the mobile terminal are accommodated in the accommodating space.
  • the housing 1 may include a body 11 and an endothermic heat storage material 12.
  • the heat absorbing heat storage material 12 is disposed on an inner surface of the body 11. It is understood that the inner surface of the body 11 is a surface of an electronic device near the mobile terminal, and the body 11 is preferably a battery cover.
  • the body 11 may be made of a metal material, a plastic material or the like.
  • the endothermic heat storage material 12 may be a material having an endothermic and heat storage function for absorbing heat of the electronic device and storing the absorbed heat when absorbed. When the heat is saturated, the heat absorbing heat storage material 12 stops absorbing heat, and when the temperature of the body 11 drops to a preset temperature threshold, the heat absorbing heat storage material 12 starts to slowly dissipate heat.
  • the endothermic heat storage material 12 may include silica and polyethylene glycol, and the ratio between the silica and the polyethylene glycol is 1:1 to 1:9 (the specific value is specific to the mass ratio) The specific ratio may be determined according to the actual heat absorption and heat storage requirements.
  • the heat absorbing heat storage material 12 may be composed of a plurality of silica gels after gelation, and emulsified polyethylene glycol. It is composed of microcapsules of the capsule core.
  • the polyethylene glycol absorbs heat from a solid to a liquid, and is surrounded by silica. After the heat is lowered, the polyethylene glycol slowly dissipates heat from a liquid to a solid, and absorbs heat. Heat storage and slow heat dissipation.
  • the heat absorbing heat storage material 12 may be specifically prepared by adding polyethylene glycol to a certain concentration of silica sol, and after completely dissolving, adding a CaCl 2 accelerator solution, under strong stirring, The gelation reaction occurs, and a three-dimensional network structure gel is formed after standing; the gel is air-dried in an oven at 80 ° C for 24 to 48 hours, and cooled to room temperature to obtain a plurality of organosilicon oxide compounds under alkaline conditions.
  • the microcapsules in which the silica after gelation is a capsule wall and the emulsified polyethylene glycol is a capsule core.
  • the material properties of the endothermic heat storage material 12 may be phase change material properties.
  • the heat absorbing heat storage material 12 may be placed on the inner surface of the body 11 in an arbitrary shape by coating or bonding. Specifically, the heat absorbing heat storage material 12 can be disposed on the inner surface of the body 11 in the following two ways:
  • the casing 1 may further include an adhesive 13 which may be a mixture of a dilution solvent and a special bonding solution, such as methanol xylene, acrylic resin or the like.
  • the adhesive is mixed into the endothermic heat storage material 12 in proportion and bonded to the inner surface of the body 11, preferably, the endothermic heat storage material 12 mixed with the adhesive 13 Being coated on the inner surface of the body 11;
  • the casing 1 may further comprise a glue layer 14, the glue layer 14 is preferably a double-sided backing, and the heat absorbing heat storage material 12 may be hydrophobically modified by adding an acid ester coupling agent.
  • An inorganic or organic composite shaped phase change material is obtained, which is formed into a sheet shape by a tableting machine, and one side of the endothermic heat storage material 12 is bonded to the adhesive layer, and is adhered to the inner surface of the body 11 through the adhesive layer 14. Pick up.
  • the housing 1 may further include a protective film 15 for protecting the heat absorbing heat storage material 12 from being damaged by an external force.
  • the protective film 15 An outer surface of the heat absorbing heat storage material 12 may be disposed on a side of the heat absorbing heat storage material 12 away from an inner surface of the body 11;
  • the endothermic heat storage material 12 may also be coated on the protective film, and the protective film 15 passes through the adhesive layer. 14 is bonded to the inner surface of the body 11.
  • the protective film may be graphite so that the endothermic heat storage material 12 can be dissipated more quickly.
  • the housing 1 may further include a heat conducting hole 16 .
  • the heat conducting hole 16 may be disposed at an edge portion of the body 11 by providing heat conduction at an edge portion of the housing 1 .
  • the hole 16 can enable the endothermic heat storage material 12 to quickly dissipate the stored heat and dissipate the heat of the heat generating device, thereby facilitating better heat absorption of the electronic device and lowering the temperature of the electronic device.
  • the present invention by providing an endothermic heat storage material on the inner surface of the casing of the terminal, it is possible to absorb heat of the electronic device that is heated in the mobile terminal, and store heat of the absorbed heat, thereby reducing the heat.
  • the temperature of the electronic device is to ensure the normal operation of the mobile terminal, and at the same time, the heat dissipated by the electronic device is insulated by the function of heat storage, and the body surface temperature of the casing is lowered; by adding a protective film to the heat absorbing heat storage material, it can be avoided.
  • the heat absorbing heat storage material is damaged by the external force, which increases the service life of the heat absorbing heat storage material; by combining the heat conduction holes, the efficiency of heat absorption and heat dissipation is improved, and the temperature of the electronic device is further reduced.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请实施例公开了一种终端的壳体和移动终端，所述壳体用于与所述终端的前盖形成容置空间，以容置电子器件，所述壳体包括本体和吸热储热材料，所述吸热储热材料设置于所述本体的内表面上；所述吸热储热材料为具有吸热和储热功能的材料，所述吸热储热材料用于吸收所述电子器件的热量，并对所吸收的热量进行储存。采用本申请，可有效降低移动终端中发热的电子器件的温度，并隔绝电子器件散发的热量，降低壳体的体表温度。

Description

终端的壳体和移动终端 技术领域
本申请涉及电子设备领域，尤其涉及一种终端的壳体和移动终端。
背景技术
随着电子设备行业的发展，平板电脑、手机等移动终端的配置越来越高，可实现的功能也越来越丰富，满足了人们的日常生活需求，然而随着配置的提高，移动终端中的中央处理器(Central Processing Unit，CPU)主频也越来越高，功耗越来越大，导致移动终端发热量也相应变大，如果这些热量达不到控制或转移，将会带来两个方面的影响：1、移动终端芯片温度过高，导致移动终端运算变慢，甚至卡顿，影响移动终端的使用；2、移动终端芯片温度传递至手机外壳，导致外壳温度较高，使用时会出现烫手、烫耳朵等问题。
为了解决移动终端的发热问题，现有技术一般是将散热石墨片设置于终端的壳体的内表面上，来对芯片进行间接散热，但是由于散热石墨片的设置受位置的局限较大，对发热量较大的位置无法进行直接散热，从而导致其散热性能较差。
发明内容
本申请实施例提供了一种终端的壳体，用于与前盖连接形成容置空间，以容置封装电子器件，所述壳体包括本体和吸热储热材料，所述吸热储热材料设置于所述本体的内表面且靠近所述电子器件的表面；所述吸热储热材料为具有吸热和储热功能的材料，所述吸热储热材料用于吸收并存储所述电子器件的热量。
本申请实施例还提供了一种移动终端，包括上述终端的壳体。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述 中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种移动终端的结构示意图；
图2是本申请实施例提供的一种终端的壳体的架构示意图；
图3是本申请实施例提供的一种终端的壳体的立体结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例涉及的移动终端可以是任何具备通信和存储功能的设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
请参见图1，为本申请实施例提供了一种移动终端的架构示意图。如图1所示，所述移动终端可以包括终端的壳体1，所述壳体1优选为电池盖，所述壳体1可以为金属材质、塑料材质等具备一定厚度的壳体，可以理解的是，所述壳体1与所述移动终端的前盖连接形成一个容置空间，移动终端的主板、CPU、电池、显示屏、摄像头等电子器件容置于所述容置空间内。
请参见图2，为本申请实施例提供了一种终端的壳体的架构示意图。如图2所示，所述壳体1可以包括本体11和吸热储热材料12。
所述吸热储热材料12设置于所述本体11的内表面上，可以理解的是，所述本体11的内表面为靠近移动终端的电子器件的表面，所述本体11优选为电池盖，所述本体11可以为金属材质、塑料材质等。
所述吸热储热材料12可以为具有吸热和储热功能的材料，所述吸热储热材料12用于吸收所述电子器件的热量，并对所吸收的热量进行储存，当所吸收的热量饱和时，所述吸热储热材料12停止吸热，并在所述本体11的温度降到预设温度阈值时，所述吸热储热材料12开始缓慢散热。一种实施方式中， 所述吸热储热材料12可以包括二氧化硅和聚乙二醇，所述二氧化硅和聚乙二醇之间的配比值为1∶1～1∶9(配比值具体为质量比)，具体的配比值可以根据实际吸热和储热的需求而定，所述吸热储热材料12可以由多个以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。在热量达到预设阈值时，聚乙二醇吸收热量从固态变成液态，并被二氧化硅包裹住，在热量降下去后，聚乙二醇缓慢散发热量从液态变成固态，实现吸热储热和缓慢散热。
所述吸热储热材料12具体的制成步骤可以为：将聚乙二醇加入到一定浓度的硅溶胶中，待全部溶解后，滴加CaCl2促凝剂溶液，在强力搅拌下，使其发生凝胶化反应，静置后形成三维网络结构凝胶；将凝胶在80℃烘箱中鼓风干燥24～48h，冷却至室温，得到有机硅氧化合物在碱性条件下产生的多个以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊。所述吸热储热材料12的材料属性可以为相变的材料属性。
请一并参见图3，所述吸热储热材料12可以通过涂布或粘接的方式以任意形状置于所述本体11的内表面上。具体的，所述吸热储热材料12可以通过以下两种方式设置于所述本体11的内表面上：
1、涂布的方式：所述壳体1还可以包括粘剂13，所述粘剂13可以为稀释溶剂以及特殊粘结溶液混合而成，例如：甲醇二甲苯、丙烯酸树脂等。所述粘剂按比例混合至所述吸热储热材料12中，并与所述本体11的内表面相粘接，优选的，混合有所述粘剂13的所述吸热储热材料12被涂布于所述本体11的内表面上；
2、粘接的方式：所述壳体1还可以包括胶层14，所述胶层14优选为双面背胶，所述吸热储热材料12可以通过添加酸酯偶联剂疏水改性得到无机或有机复合定形相变材料，经过压片机制成片状，所述吸热储热材料12的一面与胶层粘接，通过所述胶层14与所述本体11的内表面相粘接。
可选的，所述壳体1还可以包括保护膜15，所述保护膜15用于保护所述吸热储热材料12不被外力所损坏，针对上述的两种方式，所述保护膜15可以设置于所述吸热储热材料12的外表面上，所述吸热储热材料12的外表面为所述吸热储热材料12远离所述本体11的内表面的一侧；当然，针对第一种方式，所述吸热储热材料12还可以涂布于所述保护膜上，所述保护膜15通过胶层 14与所述本体11的内表面相粘接。所述保护膜可以为石墨，从而可以更快地对所述吸热储热材料12进行散热。
可选的，所述壳体1还可以包括导热孔16，再请一并参见图3，所述导热孔16可以设于所述本体11的边缘部位，通过在壳体1的边缘部位设置导热孔16，可以使得吸热储热材料12快速将所储存的热量散出以及将发热器件的热量散出，利于更好的对电子器件进行吸热，降低电子器件的温度。
在本发明实施例中，通过在终端的壳体的内表面上设置吸热储热材料，从而可以对移动终端内发热的电子器件进行吸热，并对所吸收的热量进行储热，降低了电子器件的温度，以保证移动终端正常运行，同时通过储热的作用，隔绝了电子器件散发的热量，降低了壳体的体表温度；通过在吸热储热材料中加入保护膜，可以避免吸热储热材料被外力损坏，增加了吸热储热材料的使用寿命；通过结合导热孔，提升了吸热散热的效率，进一步降低电子器件的温度。
以上所揭露的仅为本申请较佳实施例而已，当然不能以此来限定本申请之权利范围，因此依本申请权利要求所作的等同变化，仍属本申请所涵盖的范围。

Claims (20)

  1. 一种终端的壳体，用于与前盖连接形成容置空间，以容置封装电子器件，其特征在于，所述终端的壳体包括本体和吸热储热材料，所述吸热储热材料设置于所述本体的内表面；
    所述吸热储热材料为具有吸热和储热功能的材料，所述吸热储热材料用于吸收所述电子器件的热量，并对所吸收的热量进行储存。
  2. 根据权利要求1所述的终端的壳体，其特征在于，所述吸热储热材料包括二氧化硅和聚乙二醇，所述二氧化硅和聚乙二醇之间的配比值为1∶1～1∶9。
  3. 根据权利要求1所述的终端的壳体，其特征在于，所述吸热储热材料由以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。
  4. 根据权利要求1所述的终端的壳体，其特征在于，所述吸热储热材料的材料属性为相变的材料属性。
  5. 根据权利要求1-4任意一项所述的终端的壳体，其特征在于，还包括粘剂，所述粘剂按比例混合至所述吸热储热材料中，混合有所述粘剂的所述吸热储热材料被涂布于所述本体的内表面。
  6. 根据权利要求1-4任意一项所述的终端的壳体，其特征在于，还包括胶层，所述吸热储热材料制成片状，所述吸热储热材料的一面与胶层粘接，所述吸热储热材料通过所述胶层与所述本体的内表面相粘接。
  7. 根据权利要求1-4任意一项所述的终端的壳体，其特征在于，还包括保护膜，所述保护膜设置于所述吸热储热材料的外表面上，所述吸热储热材料的外表面远离所述本体的内表面。
  8. 根据权利要求1-4任意一项所述的终端的壳体，其特征在于，还包括保护膜和胶层，所述吸热储热材料涂布于所述保护膜上，所述胶层粘接于吸热储热材料未接触保护膜的一侧，所述保护膜通过所述胶层与所述本体的内表面相粘接。
  9. 根据权利要求1所述的终端的壳体，其特征在于，还包括导热孔，所述导热孔设置于所述本体的边缘部位。
  10. 一种移动终端，其特征在于，包括如权利要求1至9任一项所述的终端的壳体。
  11. 一种终端的壳体，用于与前盖连接形成容置空间，以容置封装电子器件，其特征在于，所述壳体包括本体和吸热储热材料，所述吸热储热材料设置于所述本体的内表面且靠近所述电子器件的表面；
    所述吸热储热材料为具有吸热和储热功能的材料，所述吸热储热材料用于吸收并存储所述电子器件的热量。
  12. 根据权利要求11所述的终端的壳体，其特征在于，所述吸热储热材料包括二氧化硅和聚乙二醇，所述二氧化硅和聚乙二醇之间的配比值为1∶1～1∶9。
  13. 根据权利要求11所述的终端的壳体，其特征在于，所述吸热储热材料由以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。
  14. 根据权利要求11所述的终端的壳体，其特征在于，所述吸热储热材料的材料属性为相变的材料属性。
  15. 根据权利要求11-14任意一项所述的终端的壳体，其特征在于，还包括粘剂，所述粘剂按比例混合至所述吸热储热材料中，混合有所述粘剂的所述 吸热储热材料被涂布于所述本体的内表面。
  16. 根据权利要求11-14任意一项所述的终端的壳体，其特征在于，还包括胶层，所述吸热储热材料制成片状，所述吸热储热材料的一面与胶层粘接，所述吸热储热材料通过所述胶层与所述本体的内表面相粘接。
  17. 根据权利要求11-14任意一项所述的终端的壳体，其特征在于，还包括保护膜，所述保护膜设置于所述吸热储热材料的外表面上，所述吸热储热材料的外表面远离所述本体的内表面。
  18. 根据权利要求11-14任意一项所述的终端的壳体，其特征在于，还包括保护膜和胶层，所述吸热储热材料涂布于所述保护膜上，所述胶层粘接于吸热储热材料未接触保护膜的一侧，所述保护膜通过所述胶层与所述本体的内表面相粘接。
  19. 根据权利要求11-14任意一项所述的终端的壳体，其特征在于，所述本体为金属材质。
  20. 根据权利要求19所述的终端的壳体，其特征在于，还包括导热孔，所述导热孔设置于所述本体的边缘部位。
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