WO2017185960A1 - 一种终端设备以及相关方法 - Google Patents

一种终端设备以及相关方法 Download PDF

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Publication number
WO2017185960A1
WO2017185960A1 PCT/CN2017/079591 CN2017079591W WO2017185960A1 WO 2017185960 A1 WO2017185960 A1 WO 2017185960A1 CN 2017079591 W CN2017079591 W CN 2017079591W WO 2017185960 A1 WO2017185960 A1 WO 2017185960A1
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WO
WIPO (PCT)
Prior art keywords
heat
dissipating
absorbing
area
terminal device
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PCT/CN2017/079591
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English (en)
French (fr)
Inventor
吴寿宽
曾武春
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广东欧珀移动通信有限公司
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Publication of WO2017185960A1 publication Critical patent/WO2017185960A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02Making microcapsules or microballoons
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02Materials undergoing a change of physical state when used
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of electronic devices, and in particular, to a terminal device and related methods.
  • the configuration of mobile phones is getting higher and higher, and the CPU (Central Processing Unit) is getting higher and higher, which makes the mobile phone more and more complex, but it also leads to the mobile phone.
  • the power consumption is getting bigger and bigger, which in turn causes the heat generated by the mobile phone to increase accordingly. If the heat is not controlled or transferred, the heat-emitting device in a high temperature state will cause the mobile phone operation to be slow, even stuck, and the heat will be The temperature of the phone case is too high, causing problems such as hot hands and hot ears.
  • Embodiments of the present invention provide a terminal device and related methods, which can effectively reduce the temperature of a heat generating device in a mobile phone, and can prevent the temperature of the mobile phone case from being too high.
  • An embodiment of the present invention provides a terminal device, including: a heat-dissipating area and a heat-absorbing heat sink, wherein the heat-absorbing heat sink is disposed on the heat-dissipating area;
  • the heat absorbing heat sink comprises a mixed material having material properties of heat absorbing, heat storage and heat absorbing, the mixed material is composed of a heat absorbing heat storage material and a heat conductive heat dissipating material;
  • the heat on the heat dissipating region is transferred to the heat absorbing heat storage material, and the heat absorbing heat storage material is configured to absorb and store heat on the heat dissipating region while storing heat transferred by the heat dissipating heat dissipating material;
  • the area to be dissipated includes at least one of a region near a heat generating device in the terminal device and a region of an outer surface of the heat generating device.
  • the embodiment of the present invention further provides a method for dissipating heat of a terminal device, including:
  • the heat absorbing heat dissipating member comprises a mixed material having material properties of heat absorbing, heat storage and heat dissipating, the mixed material being composed of endothermic heat storage material And a heat-dissipating heat-dissipating material for transferring heat on the heat-dissipating region to the heat-absorbing heat storage material, wherein the heat-absorbing heat storage material is used for absorbing and storing the heat-dissipating region The heat while storing the heat conducted by the heat-conducting heat-dissipating material;
  • the area to be dissipated includes at least one of a region near a heat generating device in the terminal device and a region of an outer surface of the heat generating device.
  • an embodiment of the present invention further provides a method for manufacturing a mixed material, including:
  • the gel-like endothermic heat storage material was pulverized and stirred into a powder, and mixed with a powdery heat-conductive heat-dissipating material at a mass ratio of 1:1 to form the mixed material.
  • the heat absorbing heat sink is disposed on the area to be dissipated in the terminal device, and the heat absorbing heat sink comprises a mixed material having material properties of heat absorption, heat storage and heat dissipation, and the heat conductive heat dissipation material in the mixed material It can be used to transfer the heat on the area to be dissipated to the heat absorbing heat storage material, and the heat absorbing heat storage material can be used for absorbing and storing the heat on the heat dissipating area, and storing the heat conducted by the heat dissipating heat dissipating material, thereby reducing the area to be dissipated.
  • the temperature is to ensure the normal operation of the mobile phone, and at the same time, the heat in the area to be dissipated can be directly transmitted to the outer casing of the mobile phone, thereby preventing the temperature of the mobile phone case from being too high.
  • FIG. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a terminal device according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a terminal device according to another embodiment of the present invention.
  • the embodiment of the present invention provides a terminal device, where the terminal device may include a heat dissipating area and a heat absorbing heat dissipating component, and the heat absorbing heat dissipating component is disposed on the heat dissipating area;
  • the heat absorbing heat sink comprises a mixed material having material properties of heat absorbing, heat storage and heat absorbing, the mixed material is composed of a heat absorbing heat storage material and a heat conductive heat dissipating material;
  • the heat on the heat dissipating region is transferred to the heat absorbing heat storage material, and the heat absorbing heat storage material is configured to absorb and store heat on the heat dissipating region while storing heat transferred by the heat dissipating heat dissipating material;
  • the heat dissipation region includes at least one of a region close to the heat generating device in the terminal device, and a region of an outer surface of the heat generating device.
  • the endothermic heat storage material is a material having a material property of an endothermic and heat storage function; the mixed material is for absorbing heat on the area to be dissipated, and the mixed material stores the absorbed heat, The mixed material further dissipates the stored heat; the heat of the area to be dissipated is from the corresponding heat generating device.
  • the setting method may include coating setting, bonding setting, etc.
  • the heat absorbing heat sink may be coated on the heat dissipation area; if the heat absorbing heat sink is in a sheet form, the heat absorbing heat sink may be adhered to the heat sink On the heat dissipation area.
  • the heat absorption and heat storage of the heat absorbing heat storage material contained in the mixed material in the heat absorbing heat sink can absorb heat stored in the heat dissipation area and be stored in the heat absorbing heat storage.
  • the temperature of the area to be dissipated is lowered, thereby lowering the temperature of the corresponding heat-generating device, and the heat of the area to be dissipated can be prevented from being directly transmitted to the outer casing of the mobile phone by storing heat;
  • the heat-dissipating heat-dissipating material contained in the mixed material dissipates heat, which can accelerate heat dissipation of the heat-absorbing heat sink, and further enhances the cooling effect on the heat-dissipating area to be cooled.
  • the heat absorbing heat storage material included in the mixed material in the heat absorbing heat sink may be a phase change material, for example, the heat absorbing heat storage material gradually absorbs heat, and the heat absorbing heat storage
  • the texture of the material can be softened from hard to achieve the function of heat storage, that is, the texture of the heat absorbing heat sink is softened by hardening according to an increase in absorbed heat.
  • the heat absorbing heat sink is disposed on the area to be dissipated in the terminal device, and the heat absorbing heat sink comprises a mixed material having the material properties of heat absorption, heat storage and heat dissipation, so that the heat in the heat dissipation region can be treated.
  • Absorbing and storing and dissipating the absorbed heat thereby reducing the temperature of the area to be dissipated, thereby reducing the temperature of the heating device, so as to ensure the normal operation of the mobile phone, and at the same time avoiding heat dissipation by the function of heat storage and heat dissipation.
  • the heat in the area is transferred directly to the phone case, which in turn prevents the phone case from being overheated.
  • FIG. 1 is a schematic structural diagram of a terminal device 1 according to an embodiment of the present invention; the interior of the terminal device 1 includes a heat-dissipating area 101 and a heat-absorbing heat sink 102, and the heat-absorbing heat sink 102 is disposed on
  • the heat sinking heat sink 102 includes a mixed material having material properties of heat absorption, heat storage, and heat dissipation functions; the mixed material is used to absorb heat on the heat dissipation area 101, and The mixed material stores the absorbed heat, and the mixed material further dissipates the stored heat;
  • the area to be dissipated 101 includes at least one of a region close to the heat generating device in the terminal device 1 and a region of the outer surface of the heat generating device.
  • the area close to the heat generating device in the terminal device 1 does not limit the specific pitch value of the heat-dissipating region 101 to be close to the heat-generating device.
  • “near” can be understood as the heat-generating device transmits heat.
  • the area where the heat is concentrated, such as the heat generating device is a chip, and the heat of the chip is concentratedly transmitted to the shield for shielding the cover chip, therefore, the metal surface of the shield can be used as the heat-dissipating area 101;
  • the heat generating device is a battery, and the heat of the battery is concentratedly transmitted to the back cover of the mobile phone disposed opposite to the battery.
  • the inner surface of the back cover of the mobile phone can be disposed (the inner surface is facing the battery)
  • One side is used as the area 101 to be cooled.
  • the area to be dissipated 101 includes at least one of a shield cover area, a display screen area, a display hardware support area, a touch screen area, a battery back cover outer surface area, a chip outer surface area, and an earpiece area.
  • the heat absorbing heat sink 102 can be arranged in different regions to cool a plurality of heat sources in the mobile phone, so as to achieve a full-scale cooling of the mobile phone.
  • the area to be dissipated 101 can also be a counterpart The front side and/or the back side of the shielding cover, and the front and/or back side of the shielding cover in the shielding cover, for example, when the area to be dissipated 101 is the shielding cover area, One side of the shielded heat-generating device is referred to as a front side, and the other side of the opposite side is a reverse side, and the shield cover is disposed on the shield bracket.
  • the selection of the area to be dissipated 101 may be a flexible selection of devices that dissipate heat according to specific needs and the effect of heat dissipation, and details are not described herein again.
  • the mixed material is formed by mixing a heat-dissipating heat-dissipating material and an endothermic heat-storing material, the mass ratio between the heat-radiating heat-dissipating material and the heat-absorbing heat storage material is 1:1, and the heat absorbing heat storage
  • the material is a material having material properties of heat absorbing and heat storage functions, and the heat conductive heat dissipating material may be other heat conductive heat dissipating materials such as graphite and metal.
  • the endothermic heat storage material in the mixed material is a phase change energy storage material composed of polyethylene glycol and silicon dioxide, and the mass ratio between the polyethylene glycol and the silicon dioxide is 1:1-9:1, which quality ratio can be selected according to demand.
  • the specific process for preparing the endothermic heat storage material may be: adding polyethylene glycol to a certain concentration of silica sol (concentration refers to the content of silica in the silica sol), and after all the dissolution, dripping Add CaCl 2 coagulant solution, gelatinize it under strong stirring, and form a three-dimensional network structure gel after standing; the gel is dried in an oven at 80 ° C for 24-28 hours, then cooled to At room temperature, the endothermic heat storage material composed of a plurality of microcapsules having silica as a capsule wall and emulsified polyethylene glycol as a capsule core can be obtained.
  • the polyethylene glycol in the capsule core of the microcapsule is a phase change energy storage material, that is, the microcapsule can gradually convert the polyethylene glycol in the capsule core from a solid state to a liquid state by gradually absorbing heat.
  • the polyethylene glycol in the capsule core is gradually converted from a liquid state to a solid state to dissipate the stored heat, wherein
  • the temperature of the polyethylene glycol which is liquid is not high, that is, the absorbed heat is used for phase change, and the process of changing the polyethylene glycol from a liquid state to a solid state is a slow heat dissipation process.
  • the heat absorbing heat sink 102 including a plurality of the microcapsules can prevent the absorbed heat from being directly transmitted to the outer casing of the mobile phone in a short time, resulting in an excessive temperature of the outer casing of the mobile phone.
  • the wall of the silica since the wall of the silica is present, it can be ensured that the liquid polyethylene glycol does not flow out of the microcapsule, and therefore, the polyethylene glycol in the core is gradually converted from solid state. In the process of being in a liquid state, the microcapsules gradually become soft and soft, and the texture of the endothermic heat storage material is also hardened and softened.
  • the mixing process refers to a process of mixing the thermally conductive heat dissipating material of the powder and the endothermic heat storage material which is a powder; wherein, since the microcapsules in the endothermic heat storage material are much smaller than those of the powder
  • the size of the heat absorbing heat storage material so that the heat absorbing heat storage material obtained as a powder after strong stirring still contains a plurality of the microcapsules intact, and therefore, the heat absorbing heat storage of the powder
  • the material still has an endothermic and heat storage function, so that the mixed material formed after mixing still has the functions of heat absorption, heat storage and heat dissipation.
  • the heat absorbing heat sink 102 further includes a dilution solvent and a binding solution (such as methanol xylene, acrylic resin, etc.); the mixed material of the powder is mixed with the diluent solvent bonding solution to form an endothermic
  • the heat-dissipating heat-dissipating coating material is coated on the heat-dissipating heat-dissipating material 101, that is, the heat-absorbing heat-dissipating material 102 is applied to the heat-dissipating heat-dissipating coating material.
  • the heat absorbing heat-dissipating coating material having a certain thickness is disposed on the area to be heat-dissipated 101.
  • the polyethylene glycol in the heat-absorbing heat-dissipating coating material gradually changes from a solid state to a liquid state, and the The heat absorbing heat-dissipating coating material is also gradually softened by hard to achieve storage of heat; when the polyethylene glycol is completely changed to a liquid state, the heat absorbing heat-dissipating coating material stops absorbing heat, and After the temperature of the heat dissipating region 101 is gradually lowered to a preset temperature, the polyethylene glycol is further changed from a liquid state to a solid state to dissipate the absorbed heat, and the heat dissipating heat dissipating material in the heat absorbing heat dissipating coating material
  • the composition can accelerate the emission of heat, and the heat-absorbing heat-dissipating coating material at this time is gradually softened and hardened.
  • the heat sink heat dissipating member 102 further includes a protective film; the protective film is adhesively disposed on the heat absorbing heat dissipating coating material and away from the heat dissipating region 101. That is, after the heat absorbing heat-dissipating coating material is coated on the heat-dissipating heat-dissipating region 101, the protective film is adhered to the bare portion of the heat-absorbing heat-dissipating coating material.
  • the protective film may protect and dust the heat absorbing heat-dissipating coating material, and the protective film may be a heat-dissipating heat-dissipating material such as graphite to further improve the heat-dissipating speed of the heat-absorbing heat-dissipating coating material.
  • the heat absorbing heat sink 102 is disposed on the area to be heat dissipated 101 in the terminal device 1, and the heat absorbing heat sink 102 includes a mixture of material properties having heat absorbing, heat storing and heat dissipating functions.
  • the material can absorb the heat in the heat-dissipating area 101, and store and dissipate the absorbed heat, thereby reducing the temperature of the heat-dissipating area 101, thereby reducing the temperature of the heat-generating device, so as to ensure the normal operation of the mobile phone.
  • the heat of the heat-dissipating area 101 can be directly transmitted to the outer casing of the mobile phone, thereby preventing the temperature of the mobile phone case from being too high.
  • FIG. 2 is a schematic structural diagram of a terminal device 1 according to another embodiment of the present invention.
  • the terminal device 1 includes: a heat dissipation area 101 and a heat sink heat sink 103.
  • the heat sink heat sink 103 is disposed. On the area to be cooled 101;
  • the heat sink heat dissipating member 103 includes a mixed material having material properties of heat absorption, heat storage and heat dissipation, the mixed material is composed of an endothermic heat storage material and a heat conductive heat dissipating material;
  • the heat on the heat-dissipating area 101 is transferred to the heat-absorbing heat storage material, and the heat-absorbing heat storage material is used for absorbing and storing heat on the heat-dissipating area 101 while storing heat transferred by the heat-radiating heat-dissipating material;
  • the area to be dissipated 101 includes at least one of a region close to the heat generating device in the terminal device 1 and a region of the outer surface of the heat generating device.
  • the mixed material is formed by mixing a heat conductive heat dissipating material and an endothermic heat storage material.
  • the composition of the heat dissipating heat dissipating material, the composition of the heat absorbing heat storage material, and the manufacturing process can be referred to the corresponding embodiment of FIG. 1 above. , no more details here.
  • the heat absorbing heat sink 103 further includes a dilution solvent, a binding solution (such as methanol xylene, acrylic resin, etc.), a protective film, and a glue layer; the mixed material of the powder is adhered to the dilution solvent
  • the junction solution is mixed to form an endothermic heat-dissipating coating material, so that the heat-absorbing heat-dissipating coating material directly has adhesion, and the heat-absorbing heat-dissipating coating material is coated on one side of the protective film, and one of the rubber layers
  • the side is bonded to one side of the protective film coated with the heat absorbing heat-dissipating coating material, and the other side of the adhesive layer is bonded to the heat-dissipating area 101.
  • the polyethylene glycol in the heat-absorbing heat-dissipating coating material gradually changes from a solid state to a liquid state when the heat-absorbing heat-dissipating coating material starts to absorb heat transferred by the heat-generating device in the heat-dissipating region 101 to be cooled.
  • the heat absorbing heat-dissipating coating material at this time is also gradually softened to harden to store heat; when the polyethylene glycol is completely changed to a liquid state, the heat absorbing heat-dissipating coating material stops absorbing heat.
  • the polyethylene glycol is further changed from a liquid state to a solid state to dissipate the absorbed heat, and the heat conduction in the heat absorbing heat dissipating coating material
  • the composition of the heat dissipating material accelerates the dissipation of heat, and the heat absorbing and heat dissipating coating material is gradually softened and hardened.
  • the protective film can enter the heat absorbing heat dissipation coating material
  • the protective film may be a heat-dissipating heat-dissipating material such as graphite to further improve the heat-dissipating speed of the heat-absorbing heat-dissipating coating material.
  • the heat absorbing heat-dissipating coating material is coated on both sides of the protective film, and one side of the protective film is bonded to one side of the adhesive layer, and the rubber layer is The other side is bonded to the area to be cooled 101.
  • the heat absorbing heat dissipating member 103 is disposed on the area to be dissipated 101 in the terminal device 1, and the heat absorbing heat dissipating member 103 includes a mixed material having material properties of heat absorbing, heat absorbing, and heat dissipating functions, so that heat can be treated.
  • the heat in the area 101 is absorbed, and the heat absorbed and heat is dissipated, so that the temperature of the area 101 to be cooled can be lowered, thereby lowering the temperature of the heat generating device, so as to ensure the normal operation of the mobile phone, and at the same time, through heat storage and heat dissipation.
  • the function can prevent the heat of the heat-dissipating area 101 from being directly transmitted to the outer casing of the mobile phone, thereby preventing the temperature of the mobile phone case from being too high.
  • FIG. 3 is a schematic structural diagram of a terminal device 1 according to another embodiment of the present invention.
  • the terminal device 1 includes: a heat dissipation area 101 and a heat sink heat sink 104, and the heat sink heat sink 104 is disposed. On the area to be cooled 101;
  • the heat absorbing heat sink 104 includes a mixed material having material properties of heat absorbing, heat absorbing, and heat dissipating, the mixed material being composed of a heat absorbing heat storage material and a heat conductive heat dissipating material;
  • the heat on the heat-dissipating area 101 is transferred to the heat-absorbing heat storage material, and the heat-absorbing heat storage material is used for absorbing and storing heat on the heat-dissipating area 101 while storing heat transferred by the heat-radiating heat-dissipating material;
  • the area to be dissipated 101 includes at least one of a region close to the heat generating device in the terminal device 1 and a region of the outer surface of the heat generating device.
  • the mixed material is formed by mixing a heat conductive heat dissipating material and an endothermic heat storage material.
  • the composition of the heat dissipating heat dissipating material, the composition of the heat absorbing heat storage material, and the manufacturing process can be referred to the corresponding embodiment of FIG. 1 above. , no more details here.
  • the heat absorbing heat sink 104 further includes a titanate coupling agent and a glue layer; the mixed material is mixed with the titanate coupling agent to form a heat absorbing heat sink sheet material, and one side of the glue layer The heat absorbing fin-like material is bonded, and the other side of the adhesive layer is bonded to the heat-dissipating region 101.
  • the adhesive layer can be a backing, a double-sided adhesive or a release film.
  • the specific process for preparing the heat absorbing heat sink sheet material may be: adding the titanate coupling agent to the mixed material of the powder to obtain an organic composite shaped phase change material, and the tablet press The tablet is formed into a sheet shape, and is cut to form a shape of the heat absorbing heat sink sheet material.
  • the heat absorbing fin-like material begins to absorb the area to be dissipated 101
  • the polyethylene glycol in the heat absorbing heat sink sheet material gradually changes from a solid state to a liquid state, and at this time, the heat absorbing heat sink sheet material gradually becomes hard and soft.
  • the heat absorbing heat sink sheet material stops absorbing heat, and after the temperature of the heat generating device gradually decreases to a preset temperature, The polyethylene glycol is further changed from a liquid state to a solid state to dissipate the absorbed heat, and the component of the heat-radiating heat-dissipating material in the heat-absorbing heat-dissipating sheet material can accelerate the emission of heat, and the suction at this time
  • the heat-dissipating sheet-like material also gradually softens from soft to soft.
  • the heat absorbing heat sink 104 further includes a protective film; the protective film is adhesively disposed on the heat absorbing heat sink material and away from the heat dissipation area 101. That is, after the heat absorbing heat sink sheet material is adhered to the heat sinking region 101, the protective film is adhered to the exposed portion of the heat absorbing heat sink sheet material.
  • the protective film may protect and dust the heat absorbing heat sink sheet material, and the protective film may be a heat conductive heat dissipating material such as graphite to further improve the heat dissipation speed of the heat absorbing heat sink sheet material.
  • the heat absorbing heat dissipating member 104 is disposed on the area to be dissipated 101 in the terminal device 1, and the heat absorbing heat dissipating member 104 includes a mixed material having material properties of heat absorbing, heat absorbing, and heat dissipating functions, so that heat can be treated.
  • the heat in the area 101 is absorbed, and the heat absorbed and heat is dissipated, so that the temperature of the area 101 to be cooled can be lowered, thereby lowering the temperature of the heat generating device, so as to ensure the normal operation of the mobile phone, and at the same time, through heat storage and heat dissipation.
  • the function can prevent the heat of the heat-dissipating area 101 from being directly transmitted to the outer casing of the mobile phone, thereby preventing the temperature of the mobile phone case from being too high.
  • An embodiment of the present invention provides a method for dissipating heat of a terminal device, where the method includes the following steps:
  • the heat absorbing heat dissipating member comprises a mixed material having material properties of heat absorbing, heat storage and heat dissipating, the mixed material being composed of endothermic heat storage material And a heat-dissipating heat-dissipating material for transferring heat on the heat-dissipating region to the heat-absorbing heat storage material, wherein the heat-absorbing heat storage material is used for absorbing and storing the heat-dissipating region The heat of the heat-dissipating heat-dissipating material is simultaneously stored; the heat-dissipating area includes at least one of a region near the heat-generating device in the terminal device and a region of the outer surface of the heat-generating device.
  • the heat sink heat sink further includes a diluent solvent and a binding solution.
  • the step of providing a heat sinking heat dissipating member on the area to be dissipated in the terminal device specifically comprising: mixing the mixed material with the diluting solvent bonding solution to form an endothermic heat dissipating coating material; The heat absorbing heat dissipation coating material is coated on the area to be cooled.
  • the heat absorbing heat sink further includes a protective film, and after the step of applying the heat absorbing heat dissipating coating material to the heat absorbing heat dissipating region, the method further comprises: bonding the protective film And disposed on the heat absorbing heat dissipation coating material; the protective film is away from the heat dissipation area.
  • the heat absorbing heat sink further includes a dilution solvent, a bonding solution, a protective film, and a glue layer, and the heat absorbing heat sink is disposed on the area to be dissipated in the terminal device.
  • the heat absorbing heat sink further includes a titanate coupling agent and a glue layer
  • the step of providing a heat absorbing heat sink on the area to be dissipated in the terminal device comprises: mixing the mixed material with the titanate coupling agent to form a heat absorbing heat sink sheet material; bonding one side of the rubber layer to the heat absorbing heat sink sheet material, and The other side of the adhesive layer is bonded to the area to be heat-dissipated.
  • the heat absorbing heat sink further includes a protective film, and the one side of the adhesive layer is bonded to the heat absorbing heat sink sheet material, and the other side of the glue layer is After the step of bonding the heat-dissipating regions, the method further includes: bonding the protective film to the heat-absorbing heat-dissipating sheet-like material; and the protective film is away from the heat-dissipating region.
  • the heat absorbing heat dissipating material is formed by mixing a heat dissipating material and a heat absorbing heat storage material, and a mass ratio between the heat dissipating material and the heat absorbing heat storage material is 1:1, and the heat absorbing heat storage Materials are materials that have the properties of materials that absorb and store heat.
  • the endothermic heat storage material in the heat absorbing heat dissipating material is a phase change endothermic heat storage material composed of polyethylene glycol and silicon dioxide, and a mass ratio between the polyethylene glycol and the silica It is 1:1 to 9:1; the heat dissipating material is graphite or metal.
  • the endothermic heat storage material is composed of a plurality of microcapsules which are silica gel as a capsule wall and emulsified polyethylene glycol as a capsule core.
  • the heat absorbing heat sink is disposed on the area to be heat dissipated in the terminal device, and the heat absorbing heat sink comprises a mixed material having the material properties of heat absorption, heat storage and heat dissipation, thereby being
  • the heat in the heat-dissipating area is absorbed, and the absorbed heat is stored and dissipated, thereby reducing the temperature of the area to be dissipated, thereby reducing the temperature of the heat-generating device, so as to ensure the normal operation of the mobile phone, and at the same time, through heat storage and heat dissipation.
  • the function can prevent the heat of the heat-dissipating area from being directly transmitted to the outer casing of the mobile phone, thereby preventing the temperature of the mobile phone case from being too high.
  • An embodiment of the present invention provides a method for producing a mixed material, comprising: adding polyethylene glycol to a silica sol, and after completely dissolving, adding a CaCl 2 coagulant solution, causing gelation by stirring The reaction, after standing, forms a gel of three-dimensional network structure, and then the gel is air-dried in an oven at 80 ° C for 24-28 hours, and then cooled to room temperature to form a plurality of walls made of silica.
  • Polyethylene glycol is a gel-like endothermic heat storage material composed of microcapsules of a capsule core; the gel-like endothermic heat storage material is chopped and stirred into a powder, and is thermally dispersed with powder. The materials were mixed at a mass ratio of 1:1 to form the mixed material.
  • a dilution solvent and a special binding solution may be added to the mixed material for mixing to form a mixed material usable for coating;
  • the special binding solution is methanol xylene or acrylic resin.
  • a titanate coupling agent may be added to the mixed material to form a shaped mixed material, and the shaped mixed material is tableted by a tableting machine to obtain a flaky mixed material. Further, the flaky mixed material is bonded to the adhesive layer, and the flaky mixed material having the adhesive layer is cut to form a mixed material which can be used for bonding and is in the form of a sheet.
  • the mass ratio between the polyethylene glycol and the silica in the silica sol is 1:1 to 9:1.
  • the heat conductive heat dissipating material and the heat absorbing heat storage material are mixed to form a mixed material, so that the mixed material has the material property of heat absorption, heat storage and heat dissipation function. Therefore, if the mixed material is applied to the mobile phone, the invention can be reduced.
  • the temperature of the heating device is to ensure the normal operation of the mobile phone, and at the same time, the heat inside the mobile phone can be directly transmitted to the outer casing of the mobile phone through the function of heat storage and heat dissipation, thereby preventing the temperature of the mobile phone casing from being too high.

Abstract

一种终端设备以及相关方法,终端设备(1)包括:待散热区域(101)和吸热散热件(102),所述吸热散热件(102)设置于所述待散热区域(101)上;所述吸热散热件(102)包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;所述待散热区域(101)包括靠近所述终端设备(1)中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。可有效降低手机中的发热器件的温度,并可以避免手机外壳温度过高。

Description

一种终端设备以及相关方法
本发明要求2016年4月29日递交的发明名称为“一种终端设备以及相关方法”的申请号201610286961.2的在先申请优先权,上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及电子设备领域,尤其涉及一种终端设备以及相关方法。
背景技术
随着手机行业的发展,手机配置越来越高,CPU(Central Processing Unit,中央处理器)主频越来越高,使得手机可以实现更多、更复杂的功能,但是同时也会导致手机的功耗越来越大,进而导致手机发热量也相应变大,如果这些热量得不到控制或转移,那么处于高温状态的发热器件会导致手机运算变慢,甚至卡顿,而且这些热量也会使手机外壳温度过高,导致会有烫手,烫耳朵等问题发生。
发明内容
本发明实施例提供一种终端设备以及相关方法,可有效降低手机中的发热器件的温度,并可以避免手机外壳温度过高。
本发明实施例提供了一种终端设备,包括:待散热区域和吸热散热件,所述吸热散热件设置于所述待散热区域上;
所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;
所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
相应地,本发明实施例还提供了一种用于终端设备散热的方法,包括:
在所述终端设备中的待散热区域上设置吸热散热件;所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;
所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
相应地,本发明实施例还提供了一种混合材料的制造方法,包括:
将聚乙二醇加入到硅溶胶中,待全部溶解后,滴加CaCl2促凝剂溶液,通过搅拌使其发生凝胶化反应,静置后形成三维网络结构的凝胶,再将所述凝胶在80℃烘箱中鼓风干燥24-28小时,然后冷却至室温,以形成由若干以二氧化硅为囊壁、以聚乙二醇为囊芯的微胶囊所构成的凝胶状的吸热储热材料;
将所述凝胶状的吸热储热材料捣碎并搅拌成粉体,并与粉末状的导热散热材料以1∶1的质量比进行混合,以形成所述混合材料。
本发明实施例通过在终端设备中的待散热区域上设置吸热散热件,且吸热散热件包括具有吸热、储热以及散热功能的材料属性的混合材料,并且混合材料中的导热散热材料可用于将待散热区域上的热量传递给吸热储热材料,吸热储热材料可用于吸收并储存待散热区域上的热量,同时储存导热散热材料传导的热量,从而可以降低待散热区域的温度,以保证手机正常运行,同时还可以避免待散热区域的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明一实施例提供的一种终端设备的结构示意图;
图2是本发明另一实施例提供的一种终端设备的结构示意图;
图3是本发明又一实施例提供的一种终端设备的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例提供了一种终端设备,所述终端设备可以包括待散热区域和吸热散热件,所述吸热散热件设置于所述待散热区域上;
所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
其中,所述吸热储热材料为具有吸热和储热功能的材料属性的材料;所述混合材料用于吸收所述待散热区域上的热量,且所述混合材料存储所吸收的热量,所述混合材料再对所存储的热量进行散热;所述待散热区域的热量来自于对应的发热器件。其中,根据所述吸热散热件的不同形态,可以对应有不同的设置方法(该设置方法可以包括涂布设置、粘接设置等等),例如,若所述吸热散热件为可涂布形态时,则可以将所述吸热散热件涂布在所述待散热区域上;若所述吸热散热件为片状形态时,则可以将所述吸热散热件粘接于所述待散热区域上。其中,通过所述吸热散热件中的所述混合材料所包含的吸热储热材料进行吸热和储热,可以对所述待散热区域的热量进行吸收并存储于所述吸热储热材料中,以降低所述待散热区域的温度,进而降低对应的发热器件的温度,并且通过存储热量可以避免所述待散热区域的热量直接传递到手机外壳;通过所述吸热散热件中的所述混合材料所包含的导热散热材料进行散热,可以加速对所述吸热散热件进行散热,进一步加强了对所述待散热区域的降温效果。
可选的,所述吸热散热件中的所述混合材料所包含的吸热储热材料可以为相变材料,例如,所述吸热储热材料通过逐渐吸收热量,所述吸热储热材料的质地可以由硬变软,以实现储热的功能,即所述吸热散热件的质地也会根据吸收热量的增加而由硬变软。
本发明实施例通过在终端设备中的待散热区域上设置吸热散热件,且吸热散热件包括具有吸热、储热以及散热功能的材料属性的混合材料,从而可以对待散热区域中的热量进行吸收,并对所吸收的热量进行储热和散热,从而可以降低待散热区域的温度,进而降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免待散热区域的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
请参见图1,是本发明一实施例提供的一种终端设备1的结构示意图;所述终端设备1的内部包括待散热区域101和吸热散热件102,所述吸热散热件102设置于所述待散热区域101上;所述吸热散热件102包括具有吸热、储热以及散热功能的材料属性的混合材料;所述混合材料用于吸收所述待散热区域101上的热量,且所述混合材料存储所吸收的热量,所述混合材料再对所存储的热量进行散热;
所述待散热区域101包括靠近所述终端设备1中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
具体的,靠近所述终端设备1中的发热器件的区域并不限定所述待散热区域101靠近所述发热器件的具体间距值,这里的“靠近”可以理解为所述发热器件在传递热量时热量集中传递的区域,如所述发热器件为芯片,而芯片的热量是集中传递到用于屏蔽盖芯片的屏蔽罩,因此,可以将所述屏蔽罩的金属表面作为所述待散热区域101;又如所述发热器件为电池,而电池的热量是集中传递到与该电池相对设置的手机后盖,因此,可以将所述手机后盖的内表面(所述内表面即为面向该电池的一面)作为所述待散热区域101。进一步的,所述待散热区域101包括屏蔽罩区域、显示屏区域、显示屏五金支架区域、触摸屏区域、电池后盖外壳内表面区域、芯片外表面区域、听筒区域中的至少一个区域,通过在不同区域设置所述吸热散热件102可以对手机中的多处发热源进行降温,以实现对手机进行全方位的降温。所述待散热区域101还可以为对应器 件的正面和/或反面的区域,例如,所述待散热区域101为所述屏蔽罩区域时,具体可以为所述屏蔽罩中的屏蔽支架和屏蔽盖的正面和/或反面区域,可以将靠近所屏蔽的发热器件的一面称为正面,则相背设置的另一面为反面,所述屏蔽盖盖设于所述屏蔽支架上。对所述待散热区域101的选择可以是根据具体需要进行散热的器件以及散热的效果进行灵活选择,这里不再一一进行赘述。
其中,所述混合材料是由导热散热材料和吸热储热材料混合形成的,所述导热散热材料和所述吸热储热材料之间的质量比为1∶1,所述吸热储热材料是具有吸热和储热功能的材料属性的材料,所述导热散热材料可以为石墨、金属等其它导热散热材料。
进一步的,所述混合材料中的所述吸热储热材料是由聚乙二醇和二氧化硅组成的相变储能材料,所述聚乙二醇和所述二氧化硅之间的质量比为1∶1-9∶1,具体选用哪种质量比可以根据需求选定。其中,制作所述吸热储热材料的具体过程可以为:将聚乙二醇加入到一定浓度的硅溶胶(浓度即指硅溶胶中的二氧化硅的含量)中,待全部溶解后,滴加CaCl2促凝剂溶液,在强力搅拌下,使其发生凝胶化反应,静置后形成三维网络结构凝胶;将凝胶在80℃烘箱中鼓风干燥24-28小时,然后冷却至室温,即可得到由若干以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊所构成的所述吸热储热材料。其中,所述微胶囊的囊芯中的聚乙二醇为相变储能材料,即所述微胶囊通过逐渐吸收热量,可以将所述囊芯中的聚乙二醇逐渐由固态转化为液态,以实现对热量的存储,同样当所述微胶囊所吸收的热量逐渐减少时,所述囊芯中的聚乙二醇也逐渐由液态转化为固态,以对所存储的热量进行散热,其中,为液态的所述聚乙二醇的本身温度并不高,即所吸收的热量都用于进行相变,且所述聚乙二醇由液态变为固态的过程是一个缓慢的散热过程,所以包含若干所述微胶囊的所述吸热散热件102可以避免吸收到的热量在短时间内直接传递到手机外壳而导致手机外壳温度过高。进一步的,由于存在为所述二氧化硅的囊壁,所以可以保证为液态的聚乙二醇不会流出所述微胶囊,因此,在所述囊芯中的聚乙二醇逐渐由固态转化为液态的过程中,所述微胶囊是逐渐由硬变软,进而影响所述吸热储热材料的质地也由硬变软。以所述混合材料中的所述导热散热材料为石墨为例,由于石墨的导热性好,所以石墨可以更快的将热量传导至所述吸热 储热材料上进行热量存储,而且石墨在X、Y方向上的散热效果好,所以石墨可以提高所述混合材料的散热速度。其中,在混合形成所述混合材料之前,需要先将所述导热散热材料和为凝胶状的所述吸热储热材料进行强力搅拌,以分别得到对应的粉体,即混合过程是指对为粉体的所述导热散热材料和为粉体的所述吸热储热材料进行混合的过程;其中,由于所述吸热储热材料中的所述微胶囊是远小于为粉体的所述吸热储热材料的大小,所以在强力搅拌后得到的为粉体的所述吸热储热材料中依然包含若干完整的所述微胶囊,因此,为粉体的所述吸热储热材料依然具有吸热、储热功能,从而混合后所形成的所述混合材料依然具有吸热、储热以及散热功能。
进一步的,所述吸热散热件102还包括稀释溶剂和粘结溶液(比如:甲醇二甲苯,丙烯酸树脂等);为粉体的所述混合材料与所述稀释溶剂粘结溶液混合形成吸热散热涂布材料,使得所述吸热散热涂布材料直接具有附着力,所述吸热散热涂布材料可涂布于所述待散热区域101上,即所述吸热散热件102是指涂布在所述待散热区域101上的具有一定厚度的所述吸热散热涂布材料。当所述吸热散热涂布材料开始吸收所述待散热区域101中的热量时,所述吸热散热涂布材料中的所述聚乙二醇逐渐由固态变化为液态,此时的所述吸热散热涂布材料也逐渐由硬变软,以实现对热量的存储;当所述聚乙二醇完全变为液态时,所述吸热散热涂布材料停止吸收热量,并在所述待散热区域101的温度逐渐降低至预设温度后,所述聚乙二醇再由液态变化为固态,以将吸收的热量散发出来,所述吸热散热涂布材料中的所述导热散热材料的成分可以加速对热量进行散发,此时的所述吸热散热涂布材料也逐渐由软变硬。
可选的,所述吸热散热件102还包括保护膜;所述保护膜粘接设置于所述吸热散热涂布材料上,且远离所述待散热区域101。即所述吸热散热涂布材料涂布在所述待散热区域101上之后,在所述吸热散热涂布材料的裸露部分粘接设置所述保护膜。所述保护膜可以对所述吸热散热涂布材料进行保护、防尘,所述保护膜可以为石墨等导热散热材料,以进一步提高所述吸热散热涂布材料的散热速度。
本发明实施例通过在终端设备1中的待散热区域101上设置吸热散热件102,且吸热散热件102包括具有吸热、储热以及散热功能的材料属性的混合 材料,从而可以对待散热区域101中的热量进行吸收,并对所吸收的热量进行储热和散热,从而可以降低待散热区域101的温度,进而降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免待散热区域101的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
再请参见图2,是本发明另一实施例提供的一种终端设备1的结构示意图;所述终端设备1包括:待散热区域101和吸热散热件103,所述吸热散热件103设置于所述待散热区域101上;
所述吸热散热件103包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域101上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域101上的热量,同时储存所述导热散热材料传导的热量;所述待散热区域101包括靠近所述终端设备1中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
其中,所述混合材料是由导热散热材料和吸热储热材料混合形成的,所述导热散热材料的成分、所述吸热储热材料的成分和制作过程可以参见上述图1对应的实施例,这里不再进行赘述。
进一步的,所述吸热散热件103还包括稀释溶剂、粘结溶液(比如:甲醇二甲苯,丙烯酸树脂等)、保护膜以及胶层;为粉体的所述混合材料与所述稀释溶剂粘结溶液混合形成吸热散热涂布材料,使得所述吸热散热涂布材料直接具有附着力,所述吸热散热涂布材料涂布于所述保护膜的一侧,所述胶层的一侧与所述保护膜中涂布有所述吸热散热涂布材料的一侧粘接,所述胶层的另一侧与所述待散热区域101粘接。当所述吸热散热涂布材料开始吸收所述待散热区域101中的发热器件所传递的热量时,所述吸热散热涂布材料中的所述聚乙二醇逐渐由固态变化为液态,此时的所述吸热散热涂布材料也逐渐由硬变软,以实现对热量的存储;当所述聚乙二醇完全变为液态时,所述吸热散热涂布材料停止吸收热量,并在所述发热器件的温度逐渐降低至预设温度后,所述聚乙二醇再由液态变化为固态,以将吸收的热量散发出来,所述吸热散热涂布材料中的所述导热散热材料的成分可以加速对热量进行散发,此时的所述吸热散热涂布材料也逐渐由软变硬。其中,所述保护膜可以对所述吸热散热涂布材料进 行保护、防尘,所述保护膜可以为石墨等导热散热材料,以进一步提高所述吸热散热涂布材料的散热速度。可选的,在所述保护膜的两侧都涂布有所述吸热散热涂布材料,将所述保护膜的任意一侧与所述胶层的一侧粘接,所述胶层的另一侧与所述待散热区域101粘接。
本发明实施例通过在终端设备1中的待散热区域101上设置吸热散热件103,且吸热散热件103包括具有吸热、储热以及散热功能的材料属性的混合材料,从而可以对待散热区域101中的热量进行吸收,并对所吸收的热量进行储热和散热,从而可以降低待散热区域101的温度,进而降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免待散热区域101的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
再请参见图3,是本发明又一实施例提供的一种终端设备1的结构示意图;所述终端设备1包括:待散热区域101和吸热散热件104,所述吸热散热件104设置于所述待散热区域101上;
所述吸热散热件104包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域101上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域101上的热量,同时储存所述导热散热材料传导的热量;所述待散热区域101包括靠近所述终端设备1中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
其中,所述混合材料是由导热散热材料和吸热储热材料混合形成的,所述导热散热材料的成分、所述吸热储热材料的成分和制作过程可以参见上述图1对应的实施例,这里不再进行赘述。
所述吸热散热件104还包括钛酸酯偶联剂和胶层;所述混合材料与所述钛酸酯偶联剂混合制成吸热散热片状材料,所述胶层的一侧与所述吸热散热片状材料粘接,所述胶层的另一侧与所述待散热区域101粘接。可以理解的,所述胶层可以为背胶、双面胶或离型膜等。其中,制作所述吸热散热片状材料的具体过程可以为:在为粉体的所述混合材料中添加所述钛酸酯偶联剂,以得到有机复合定形相变材料,经压片机压片制得薄片状,经裁剪后形成一定形状的所述吸热散热片状材料。当所述吸热散热片状材料开始吸收所述待散热区域101 中的发热器件所传递的热量时,所述吸热散热片状材料中的所述聚乙二醇逐渐由固态变化为液态,此时的所述吸热散热片状材料也逐渐由硬变软,以实现对热量的存储;当所述聚乙二醇完全变为液态时,所述吸热散热片状材料停止吸收热量,并在所述发热器件的温度逐渐降低至预设温度后,所述聚乙二醇再由液态变化为固态,以将吸收的热量散发出来,所述吸热散热片状材料中的所述导热散热材料的成分可以加速对热量进行散发,此时的所述吸热散热片状材料也逐渐由软变硬。
可选的,所述吸热散热件104还包括保护膜;所述保护膜粘接设置于所述吸热散热片状材料上,且远离所述待散热区域101。即所述吸热散热片状材料粘接在所述待散热区域101上之后,在所述吸热散热片状材料的裸露部分粘接设置所述保护膜。所述保护膜可以对所述吸热散热片状材料进行保护、防尘,所述保护膜可以为石墨等导热散热材料,以进一步提高所述吸热散热片状材料的散热速度。
本发明实施例通过在终端设备1中的待散热区域101上设置吸热散热件104,且吸热散热件104包括具有吸热、储热以及散热功能的材料属性的混合材料,从而可以对待散热区域101中的热量进行吸收,并对所吸收的热量进行储热和散热,从而可以降低待散热区域101的温度,进而降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免待散热区域101的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
本发明一实施例提供了一种用于终端设备散热的方法,所述方法包括步骤:
在所述终端设备中的待散热区域上设置吸热散热件;所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
可选的,在一个实施例中,所述吸热散热件还包括稀释溶剂和粘结溶液, 则所述在所述终端设备中的待散热区域上设置吸热散热件的步骤,具体包括:将所述混合材料与所述稀释溶剂粘结溶液混合,以形成吸热散热涂布材料;将所述吸热散热涂布材料涂布于所述待散热区域上。进一步的,所述吸热散热件还包括保护膜,则在所述将所述吸热散热涂布材料涂布于所述待散热区域上的步骤之后,还包括:将所述保护膜粘接设置于所述吸热散热涂布材料上;所述保护膜远离所述待散热区域。
可选的,在一个实施例中,所述吸热散热件还包括稀释溶剂、粘结溶液、保护膜以及胶层,则所述在所述终端设备中的待散热区域上设置吸热散热件的步骤,具体包括:将所述混合材料与所述稀释溶剂粘结溶液混合,以形成吸热散热涂布材料;将所述吸热散热涂布材料涂布于所述保护膜的一侧,并将所述胶层的一侧与所述保护膜中涂布有所述吸热散热涂布材料的一侧粘接,并将所述胶层的另一侧与所述待散热区域粘接。
可选的,在一个实施例中,所述吸热散热件还包括钛酸酯偶联剂和胶层,则所述在所述终端设备中的待散热区域上设置吸热散热件的步骤,具体包括:将所述混合材料与所述钛酸酯偶联剂混合,以制成吸热散热片状材料;将所述胶层的一侧与所述吸热散热片状材料粘接,并将所述胶层的另一侧与所述待散热区域粘接。进一步的,所述吸热散热件还包括保护膜,则在所述将所述胶层的一侧与所述吸热散热片状材料粘接,并将所述胶层的另一侧与所述待散热区域粘接的步骤之后,还包括:将所述保护膜粘接设置于所述吸热散热片状材料上;所述保护膜远离所述待散热区域。
其中,所述吸热散热材料是由散热材料和吸热储热材料混合形成的,所述散热材料和所述吸热储热材料之间的质量比为1∶1,所述吸热储热材料是具有吸热和储热功能的材料属性的材料。所述吸热散热材料中的所述吸热储热材料是由聚乙二醇和二氧化硅组成的相变吸热储热材料,所述聚乙二醇和所述二氧化硅之间的质量比为1∶1-9∶1;所述散热材料是石墨或金属。所述吸热储热材料由若干以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。
本发明实施例通过在终端设备中的待散热区域上设置吸热散热件,且吸热散热件包括具有吸热、储热以及散热功能的材料属性的混合材料,从而可以对 待散热区域中的热量进行吸收,并对所吸收的热量进行储热和散热,从而可以降低待散热区域的温度,进而降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免待散热区域的热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
本发明一实施例提供了一种混合材料的制造方法,包括:将聚乙二醇加入到硅溶胶中,待全部溶解后,滴加CaCl2促凝剂溶液,通过搅拌使其发生凝胶化反应,静置后形成三维网络结构的凝胶,再将所述凝胶在80℃烘箱中鼓风干燥24-28小时,然后冷却至室温,以形成由若干以二氧化硅为囊壁、以聚乙二醇为囊芯的微胶囊所构成的凝胶状的吸热储热材料;将所述凝胶状的吸热储热材料捣碎并搅拌成粉体,并与粉末状的导热散热材料以1∶1的质量比进行混合,以形成所述混合材料。
可选的,还可以在所述混合材料中添加稀释溶剂以及特殊粘结溶液以进行混合,以形成可用于涂布的混合材料;所述特殊粘结溶液为甲醇二甲苯或丙烯酸树脂。
可选的,还可以在所述混合材料中添加钛酸酯偶联剂,以形成定形的混合材料,经压片机对所述定形的混合材料进行压片以制得薄片状的混合材料,再将所述薄片状的混合材料与胶层粘接,再对具有所述胶层的所述薄片状的混合材料进行裁剪,以形成可用于粘接的且为片状的混合材料。
其中,所述聚乙二醇与所述硅溶胶中的二氧化硅之间的质量比为1∶1-9∶1。
本发明实施例通过将导热散热材料和吸热储热材料混合形成混合材料,使得混合材料具有吸热、储热以及散热功能的材料属性,因此,若将混合材料应用在手机中,则可以降低发热器件的温度,以保证手机正常运行,同时通过储热和散热的作用,可以避免手机内部热量直接传递到手机外壳上,进而可以避免手机外壳温度过高。
以上所揭露的仅为本发明较佳实施例而已,当然不能以此来限定本发明之权利范围,因此依本发明权利要求所作的等同变化,仍属本发明所涵盖的范围。

Claims (20)

  1. 一种终端设备,其中,包括:待散热区域和吸热散热件,所述吸热散热件设置于所述待散热区域上;
    所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;
    所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器件的外表面的区域中的至少一种区域。
  2. 如权利要求1所述的终端设备,其中,所述待散热区域包括屏蔽罩区域、显示屏区域、显示屏五金支架区域、电池后盖外壳内表面区域、芯片外表面区域、听筒区域中的至少一个区域。
  3. 如权利要求1所述的终端设备,其中,所述吸热散热件还包括稀释溶剂和粘结溶液;
    所述混合材料与所述稀释溶剂粘结溶液混合形成吸热散热涂布材料,所述吸热散热涂布材料涂布于所述待散热区域上。
  4. 如权利要求3所述的终端设备,其中,所述吸热散热件还包括保护膜;
    所述保护膜粘接设置于所述吸热散热涂布材料上,且远离所述待散热区域。
  5. 如权利要求1所述的终端设备,其中,所述吸热散热件还包括稀释溶剂、粘结溶液、保护膜以及胶层;
    所述混合材料与所述稀释溶剂粘结溶液混合形成吸热散热涂布材料,所述吸热散热涂布材料涂布于所述保护膜的一侧,所述胶层的一侧与所述保护膜中涂布有所述吸热散热涂布材料的一侧粘接,所述胶层的另一侧与所述待散热区 域粘接。
  6. 如权利要求1所述的终端设备,其中,所述吸热散热件还包括钛酸酯偶联剂和胶层;
    所述混合材料与所述钛酸酯偶联剂混合制成吸热散热片状材料,所述胶层的一侧与所述吸热散热片状材料粘接,所述胶层的另一侧与所述待散热区域粘接。
  7. 如权利要求6所述的终端设备,其中,所述吸热散热件还包括保护膜;
    所述保护膜粘接设置于所述吸热散热片状材料上,且远离所述待散热区域。
  8. 如权利要求1至7任一项所述的终端设备,其中,所述导热散热材料和所述吸热储热材料之间的质量比为1∶1。
  9. 如权利要求8所述的终端设备,其中,所述混合材料中的所述吸热储热材料是由聚乙二醇和二氧化硅组成的相变吸热储热材料,所述聚乙二醇和所述二氧化硅之间的质量比为1∶1-9∶1;所述导热散热材料是石墨或金属。
  10. 如权利要求9所述的终端设备,其中,所述吸热储热材料由若干以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。
  11. 一种用于终端设备散热的方法,其中,包括:
    在所述终端设备中的待散热区域上设置吸热散热件;所述吸热散热件包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量;
    所述待散热区域包括靠近所述终端设备中的发热器件的区域、所述发热器 件的外表面的区域中的至少一种区域。
  12. 如权利要求11所述的方法,其中,所述吸热散热件还包括稀释溶剂和粘结溶液,
    则所述在所述终端设备中的待散热区域上设置吸热散热件,包括:
    将所述混合材料与所述稀释溶剂粘结溶液混合,以形成吸热散热涂布材料;
    将所述吸热散热涂布材料涂布于所述待散热区域上。
  13. 如权利要求11所述的方法,其中,所述吸热散热件还包括稀释溶剂、粘结溶液、保护膜以及胶层,
    则所述在所述终端设备中的待散热区域上设置吸热散热件,包括:
    将所述混合材料与所述稀释溶剂粘结溶液混合,以形成吸热散热涂布材料;
    将所述吸热散热涂布材料涂布于所述保护膜的一侧,并将所述胶层的一侧与所述保护膜中涂布有所述吸热散热涂布材料的一侧粘接,并将所述胶层的另一侧与所述待散热区域粘接。
  14. 如权利要求11所述的方法,其中,所述吸热散热件还包括钛酸酯偶联剂和胶层,
    则所述在所述终端设备中的待散热区域上设置吸热散热件,包括:
    将所述混合材料与所述钛酸酯偶联剂混合,以制成吸热散热片状材料;
    将所述胶层的一侧与所述吸热散热片状材料粘接,并将所述胶层的另一侧与所述待散热区域粘接。
  15. 如权利要求11所述的方法,其中,所述吸热储热材料由若干以凝胶后的二氧化硅为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊构成。
  16. 一种混合材料的制造方法,其中,包括:
    将聚乙二醇加入到硅溶胶中,待全部溶解后,滴加CaCl2促凝剂溶液,通过搅拌使其发生凝胶化反应,静置后形成三维网络结构的凝胶,再将所述凝胶在80℃烘箱中鼓风干燥24-28小时,然后冷却至室温,以形成由若干以二氧化硅为囊壁、以聚乙二醇为囊芯的微胶囊所构成的凝胶状的吸热储热材料;
    将所述凝胶状的吸热储热材料捣碎并搅拌成粉体,并与粉末状的导热散热材料以1∶1的质量比进行混合,以形成所述混合材料。
  17. 如权利要求16所述的制造方法,其中,还包括:
    在所述混合材料中添加稀释溶剂以及特殊粘结溶液以进行混合,以形成可用于涂布的混合材料;
    所述特殊粘结溶液为甲醇二甲苯或丙烯酸树脂。
  18. 如权利要求16所述的制造方法,其中,还包括:
    在所述混合材料中添加钛酸酯偶联剂,以形成定形的混合材料,经压片机对所述定形的混合材料进行压片以制得薄片状的混合材料,再将所述薄片状的混合材料与胶层粘接,再对具有所述胶层的所述薄片状的混合材料进行裁剪,以形成可用于粘接的且为片状的混合材料。
  19. 如权利要求16至18任一项所述的制造方法,其中,
    所述聚乙二醇与所述硅溶胶中的二氧化硅之间的质量比为1∶1-9∶1。
  20. 一种吸热散热件,其中,包括:包括具有吸热、储热和散热功能的材料属性的混合材料,所述混合材料由吸热储热材料和导热散热材料组成;所述导热散热材料用于将所述待散热区域上的热量传递给所述吸热储热材料,所述吸热储热材料用于吸收并储存所述待散热区域上的热量,同时储存所述导热散热材料传导的热量。
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