WO2017183879A1 - Module de balayage d'images et dispositif electronique comportant ledit module de balayage d'images - Google Patents

Module de balayage d'images et dispositif electronique comportant ledit module de balayage d'images Download PDF

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Publication number
WO2017183879A1
WO2017183879A1 PCT/KR2017/004121 KR2017004121W WO2017183879A1 WO 2017183879 A1 WO2017183879 A1 WO 2017183879A1 KR 2017004121 W KR2017004121 W KR 2017004121W WO 2017183879 A1 WO2017183879 A1 WO 2017183879A1
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WO
WIPO (PCT)
Prior art keywords
electrode
image scanning
scanning module
substrate
layer
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Application number
PCT/KR2017/004121
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English (en)
Korean (ko)
Inventor
김종욱
김현민
전호식
최우영
이준석
윤주안
Original Assignee
크루셜텍(주)
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Priority to CN201790000731.3U priority Critical patent/CN208940092U/zh
Publication of WO2017183879A1 publication Critical patent/WO2017183879A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Definitions

  • the present invention relates to an image scanning module and an electronic device including the same, and more particularly, to an image scanning module and an electronic device including the same, which perform an ultrasonic fingerprint recognition and may be disposed below the display panel without degrading performance.
  • fingerprint authentication technique the most commonly used technique is fingerprint authentication technique.
  • Products such as fingerprint recognition and authentication technology have been introduced to smartphones and tablet PCs.
  • the fingerprint recognition sensor may be implemented in various ways such as an optical method, a thermal sensing method, a capacitive method, and an ultrasonic method.
  • an ultrasonic fingerprint recognition sensor is a method of oscillating ultrasonic waves toward a subject and scanning a fingerprint image by detecting a waveform reflected by the subject.
  • the material of the cover glass is various and the thickness thereof is thick, the case where impedance matching between the cover glass and the finger is not easily generated. In this case, even though the ridge of the fingerprint touches the upper portion of the cover glass, ultrasonic waves cannot be transmitted at the corresponding point, thereby making it impossible to obtain an accurate fingerprint image.
  • the present invention has been made to solve the above-mentioned problems, and an object thereof is to provide an image scanning module including an ultrasonic fingerprint sensor in a lower portion of a cover glass without degrading performance.
  • a sensor driving layer disposed on an upper surface of the first substrate, for generating an electrical signal; And an ultrasonic wave formed on at least a portion of an upper surface of the sensor driving layer and oscillating an ultrasonic wave for sensing a subject by receiving the electrical signal, receiving an ultrasonic wave reflected by the subject, and converting the ultrasonic wave into an electrical signal.
  • An image scanning module is provided, comprising an ultrasonic transceiving layer for transferring to a layer.
  • the image scanning module may include: a first electrode disposed on a portion of an upper surface of the first substrate; And a second electrode disposed on a portion of an upper surface of the sensor driving layer and electrically connected to the first electrode.
  • the image scanning module may further include a molding part formed from an upper surface of the first substrate to an upper surface of the ultrasonic transceiving layer.
  • the molding part may be formed to cover an upper surface of the ultrasonic transceiving layer, and the molding part may be formed of a material that achieves acoustic impedance matching with the body.
  • the sensor driving layer may have a plurality of via holes extending in parallel from a lower surface to a predetermined position in the sensor driving layer and forming an electrical connection between the first substrate and the sensor driving layer.
  • the image scanning module may further include a protective layer formed on the ultrasonic transceiving layer.
  • the image scanning module may include a first electrode and a second electrode formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer; A third electrode and a fourth electrode formed on the first electrode and the second electrode and formed at the same height from an upper surface of the first substrate; A fifth electrode electrically connecting the third electrode and a fourth electrode; And a first via hole extending from the first electrode to the third electrode, and a second via hole extending from the second electrode to the fourth electrode, covering the upper surface of the first substrate and the upper surface of the sensor driving layer.
  • the molded part may further include.
  • the image scanning module may include a first electrode and a second electrode formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer; A third electrode formed on the first electrode and formed at the same height as the second electrode; A fifth electrode electrically connecting the second electrode and a third electrode; And a molding part formed to cover an upper surface of the first substrate and having a via hole extending from the first electrode to a third electrode.
  • the image scanning module A display panel formed on the image scanning module; And a second substrate formed under the image scanning module.
  • the image scanning module may be formed on a lower front surface or a lower surface of a portion of the display panel.
  • a circuit element may be formed in a portion of the second substrate upper region where the image scanning module is not disposed.
  • the second substrate may have a step formed on at least a portion thereof, and the circuit element may be formed on an upper surface of one region based on the step, and an upper surface of the other region may be higher than an upper surface of the one region.
  • the electronic device may further include a reinforcing material formed under the second substrate.
  • the image scanning module ; And a cover glass disposed above the image scanning module.
  • the electronic device may further include a display panel disposed so as not to overlap with the image scanning module, and disposed below the cover glass.
  • an image scanning module including an ultrasonic fingerprint sensor may be disposed under the display panel and the cover glass without degrading performance.
  • FIG. 1 is a view showing the configuration of an image scanning module according to an embodiment of the present invention.
  • FIGS. 2 to 4 are diagrams showing an example in which a flexible substrate is mounted on an image scanning module according to an embodiment of the present invention.
  • FIG. 5 and 6 are diagrams illustrating an example in which a second substrate is formed under the image scanning module according to an embodiment of the present invention.
  • FIG. 7 and 8 are views illustrating a configuration of an image scanning module according to another embodiment of the present invention.
  • FIG. 9 is a diagram illustrating a configuration of an image scanning module according to another embodiment of the present invention.
  • FIG. 10 is a view showing an image scanning module according to another embodiment of the present invention.
  • 11 and 12 illustrate a structure for mounting an image scanning module to an electronic device according to an embodiment of the present invention.
  • FIG. 13 illustrates an embodiment in which a display panel is formed on an image scanning module according to an embodiment of the present invention.
  • FIG. 14 illustrates an embodiment in which a cover glass is formed on an image scanning module according to an embodiment of the present invention.
  • FIG. 1 is a view showing the configuration of an image scanning module according to an embodiment of the present invention.
  • the image scanning module 100 may include a first substrate 110, a sensor driving layer 120, and an ultrasonic transmitting / receiving layer 130 sequentially disposed.
  • the first substrate 110 enables electrical connection of components included in the image scanning module 100, and may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB). Can be implemented.
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • the sensor driving layer 120 is formed on at least a portion of the first substrate 110 and is disposed so as not to cover all the upper surfaces of the first substrate 110.
  • the sensor driving layer 120 applies an electrical signal to the ultrasonic transceiver layer 130 to function to radiate ultrasonic waves from the ultrasonic transceiver layer 130.
  • the sensor driving layer 120 detects the received signal.
  • the sensor driving layer 120 may be a CMOS device and include a CMOS substrate and a CMOS circuit.
  • Electrodes 111 and 121 may be formed on an upper surface of the first substrate 110 and an upper surface of the sensor driving layer 120, respectively.
  • the electrodes 111 and 121 may be connected by wire bonding to electrically connect the first substrate 110 and the sensor driving layer 120 to each other.
  • the ultrasonic transceiving layer 130 is formed on at least a portion of the sensor driving layer 120, and is disposed so as not to cover all of the sensor driving layers 120.
  • the above-described electrode 121 is formed in an exposed area of the upper surface of the sensor driving layer 120.
  • the ultrasonic transceiving layer 130 is driven according to an electrical signal received from the sensor driving layer 120.
  • the ultrasound transmission / reception layer 130 may include a piezoelectric material that generates a physical deformation according to an applied electrical signal to oscillate an ultrasound toward a subject.
  • the ultrasonic waves reflected by the subject or other components after the oscillation are received by the ultrasonic transmitting and receiving layer 130 again to cause physical deformation of the piezoelectric material.
  • the piezoelectric material included in the ultrasonic transceiver layer 130 may be made of PZT, PST, Quartz, (Pb, Sm) TiO 3 , PVDF, or PVDF-TrFe. Meanwhile, the ultrasound transmission / reception layer 130 may be implemented as a MEMS device.
  • the image scanning module 100 may further include a molding unit 140 formed to surround all of the upper surface of the first substrate 110, the sensor driving layer 120, and the ultrasonic transceiving layer 130. have.
  • the molding part 140 protects the image scanning module 100 from external physical and chemical shocks, and may be made of a resin such as epoxy.
  • Ultrasonic waves emitted from the ultrasonic transceiving layer 130 travel toward a subject, that is, a human finger. Most of the ultrasonic waves are transmitted to the human skin when they are directed toward the ridge of the fingerprint. However, when facing the valley of the fingerprint (Valley), because there is an outside air between the image scanning module 100 and the valley of the fingerprint, ultrasonic waves are reflected due to the acoustic impedance difference. If the acoustic impedance is not matched with the human finger, the ultrasonic waves that are directed toward the ridge of the fingerprint are also reflected, and the reflection characteristics of the ultrasonic waves that are directed toward the ridge and the valley of the fingerprint are not significantly different from each other. Therefore, in order to accurately detect the fingerprint, the molding unit 140 is preferably formed of a material capable of achieving acoustic impedance matching with the human body.
  • FIGS. 2 to 4 are diagrams showing an example in which a flexible substrate is mounted on an image scanning module according to an embodiment of the present invention.
  • a flexible substrate 150 may be formed on at least a portion of an upper surface of the first substrate 110 of the image scanning module 100.
  • the flexible substrate 150 is bonded to the first substrate 110 to allow the image scanning module 100 to be electrically connected to other electronic components (not shown).
  • the molding part 140 may be formed to cover an area of the upper surface of the first substrate 110 where the flexible substrate 150 is not formed.
  • the flexible substrate 150 may be formed on at least a portion of the lower surface of the first substrate 110 of the image scanning module 100.
  • the flexible substrate 150 may be formed in an area adjacent to the electrode 111 formed on the first substrate 110 of the lower surface of the first substrate 110, as shown in FIG. As shown in the drawing, the first substrate 110 may be formed in a region not adjacent to the electrode 111.
  • the molding part 140 may be formed such that an area of the upper surface of the first substrate 110 that faces the lower surface of the flexible substrate 150 is exposed. Likewise, the region on the opposite side of the upper surface of the first substrate 110 on which the flexible substrate 150 is formed may be exposed.
  • the molding part 140 may include at least a portion of an upper surface of the first substrate 110, an upper surface of the sensor driving layer 120, an upper surface of the first substrate 110 and the sensor driving layer 120.
  • the electrodes 111 and 121 may wrap side portions of the ultrasonic transceiving layer 130, and the upper surface of the ultrasonic transceiving layer 130 may be exposed.
  • the molding unit 140 when the molding unit 140 is formed to surround the upper portion of the ultrasound transmission / reception layer 130, the molding unit 140 has an acoustic impedance in relation to the human body in order to prevent the fingerprint recognition accuracy from deteriorating. It must be formed of a material to be matched.
  • the molding unit 140 when the molding unit 140 does not surround the upper surface of the ultrasonic transmission / reception layer 130, the ultrasonic wave oscillated from the ultrasonic transmission / reception layer 130 may be molded. Since it is directed to a subject, that is, a human finger without going through 140, the acoustic impedance matching between the molding unit 140 and the human body does not need to be performed. Therefore, in this case, the molding part 140 may be formed of a general molding material.
  • the molding part 140 may be formed to cover all of the top surfaces of the ultrasonic transceiving layer 130.
  • FIG. 5 and 6 are diagrams illustrating an example in which a second substrate is formed under the image scanning module according to an embodiment of the present invention.
  • a second substrate 160 may be formed under the image scanning module 100 shown in FIG. 1.
  • the second substrate 160 serves to electrically connect the image scanning module 100 to other electronic components (not shown).
  • the image scanning module 100 and the second substrate 160 may be bonded through a plurality of solder balls 161.
  • FIG. 7 and 8 are views illustrating a configuration of an image scanning module according to another embodiment of the present invention.
  • the image scanning module 200 may include a first substrate 210, a sensor driving layer 220, and an ultrasonic transmission / reception layer 230 that are sequentially stacked.
  • a plurality of via holes 221 may be formed in the sensor driving layer 220 in parallel with each other in the longitudinal direction.
  • the plurality of via holes 221 may be formed to extend from the first surface of the sensor driving layer 220 toward the second surface.
  • the first surface is a surface where the sensor drive layer 220 is in contact with the first substrate 210
  • the second surface is an opposite surface of the first surface.
  • each via hole 221 may be smaller than the length of the first and second surfaces of the sensor driving layer 220. That is, each via hole 221 extends from the first surface of the sensor drive layer 220 to a predetermined position therein.
  • the CMOS device included in the sensor driving layer 220 may be electrically connected to the first substrate 210 through the plurality of via holes 221 to receive an electrical signal.
  • a protective layer 240 may be further formed on the ultrasonic transceiving layer 230.
  • the protective layer 240 serves to protect the sensor driving layer 220 and the ultrasonic transceiving layer 230 from external shocks.
  • the protective layer 240 may prevent the human body from the acoustic impedance. It must be formed of a material capable of matching.
  • the thickness of the protective layer 240 may be desirable to minimize the thickness of the protective layer 240 to improve fingerprint recognition accuracy.
  • FIG. 9 is a diagram illustrating a configuration of an image scanning module according to another embodiment of the present invention.
  • the image scanning module 900 may include a flexible substrate 910, a sensor driving layer 920, and an ultrasonic transmission / reception layer 930.
  • the flexible substrate 910 serves to supply an electrical signal to the sensor driving layer 920 and the ultrasonic transceiving layer 930, and may be formed of a flexible material.
  • the molding part 940 may be formed to cover the top surface of the flexible substrate 910, the top surface of the sensor driving layer 920, and the side surface of the ultrasonic transceiving layer 930.
  • the first electrode 911a may be formed on at least a portion of the upper surface of the flexible substrate 910 where the sensor driving layer 920 is not disposed, and the ultrasonic transmission / reception layer 930 is disposed on the upper surface of the sensor driving layer 920.
  • the second electrode 921a may be formed on at least a portion not provided.
  • the third electrode 911b and the fourth electrode 911b are electrically connected to the first electrode 911a and the second electrode 922a, respectively, on the first electrode 911a and the second electrode 922a.
  • 921b is disposed.
  • the third electrode 911b and the fourth electrode 921b may be formed at the same height from the upper surface of the flexible substrate 910.
  • the molding part 940 may also be formed of the third electrode 911b and the fourth electrode 921b. It may be formed up to the same height as the height. In other words, the third electrode 911b and the fourth electrode 921b may be formed to be exposed on the upper surface of the molding part 940.
  • the first electrode hole 941a and the first electrode hole 941a are formed in the molding part 940 for electrical connection between the first electrode 911a and the third electrode 911b and electrical connection between the second electrode 921a and the fourth electrode 921b.
  • Two electrode holes 941b may be formed.
  • the first electrode hole 941a is formed to electrically connect the first electrode 911a and the third electrode 911b
  • the second electrode hole 941b is the second electrode 921a and the fourth electrode 921b.
  • the first and second electrode holes 941a and 941b may be formed by forming a hole in the molding part 940 and then filling a conductive material, for example, a metal material in the hole, but is not limited thereto. no.
  • a fifth electrode 950 may be formed on the third electrode 911b and the fourth electrode 921b to electrically connect them.
  • the fifth electrode 950 may be formed on the upper surface of the molding part 940.
  • Electrical signals from the flexible substrate 910 may be sequentially provided with the first electrode 911a, the first electrode hole 941a, the third electrode 911b, the fifth electrode 950, the fourth electrode 921b, and the second electrode. It may be applied to the sensor driving layer 920 through the electrode 921b.
  • FIG. 10 is a view showing an image scanning module according to another embodiment of the present invention.
  • the molding part 940 is formed to cover only the upper portion of the flexible substrate 910, and the fourth electrode 921b and the second electrode hole 941b are formed. It can be seen that it was omitted.
  • the first electrode 911a on the flexible substrate 910, the second electrode 921a on the sensor driving layer 920, and the third electrode 911b formed to be spaced apart from each other are formed on the flexible substrate 910. Since the same as in the embodiment shown in Figure 9 will be omitted here.
  • the third electrode 911b is formed to be exposed through the upper surface of the molding part 940, and may be formed at the same height as the second electrode 921a on the sensor driving layer 920, and the fifth electrode 950 may be formed. It serves to electrically connect the second electrode 921a and the third electrode 911b.
  • the electrical signals from the flexible substrate 910 are sequentially transmitted to the first electrode 911a, the first electrode hole 941a, the third electrode 911b, the fifth electrode 950, and the second electrode 921a. It may be applied to the sensor driving layer 920 through.
  • 11 and 12 illustrate a structure for mounting an image scanning module to an electronic device according to an embodiment of the present invention.
  • the image scanning module M illustrated in FIGS. 11 and 12 may be implemented by any one of the image scanning modules 100, 200, and 900 described with reference to FIGS. 1 to 10.
  • the image scanning module M may be disposed on at least a portion of an upper surface of the flexible substrate 1100.
  • circuit elements for driving the image scanning module M or other electronic components may be formed in at least a portion of the region A in which the image scanning module M is not disposed. have.
  • the flexible substrate 1100 may be formed in a plane as shown in FIGS. 11A and 12B, but the image as shown in FIGS. 11A and 12B.
  • a step may be formed in a portion of the area A in which the scanning module M is not disposed.
  • an area in which the image scanning module M is not disposed in the flexible substrate 1100 may be divided into a first area A1 and a second area A2 based on the step difference.
  • the second area A may be formed as high as a predetermined height h based on the height of the top surface of the first area A1.
  • the circuit element described above may be formed in the first region A1.
  • the second region A2 formed due to the step may protect the circuit element formed in the first region A1.
  • a reinforcing material 1110 may be formed on the bottom surface of the flexible substrate 1100 to maintain strength.
  • FIG. 13 illustrates an embodiment in which a display panel is formed on an image scanning module according to an embodiment of the present invention.
  • a display panel D may be formed on an image scanning module M according to an embodiment of the present invention.
  • the image scanning module M may be formed on the lower front surface of the display panel D.
  • FIG. When formed as described above, ultrasound transmission and reception is possible in the entire display display area, and thus fingerprint image scanning is possible at any position on the display panel D.
  • FIG. 1 When formed as described above, ultrasound transmission and reception is possible in the entire display display area, and thus fingerprint image scanning is possible at any position on the display panel D.
  • the image scanning module M may be formed in a portion of the lower surface of the display panel D.
  • an image scanning module M may be formed on a lower surface of one end area of the display panel D.
  • ultrasound transmission and reception is possible only in a partial region overlapping with the image scanning module M in the display display area, so that only the fingerprint image can be scanned in the corresponding area.
  • the partial region may be a partial region on the left side, the right side, or the center of the display panel D on FIG. 13.
  • the display panel D may include a liquid crystal display (LCD) panel, an organic light emitting diode (OLED) display panel, a light emitting diode (LED) display panel,
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • LED light emitting diode
  • the display panel may be implemented as a plasma display panel (PDP) or the like, and preferably, an organic light emitting diode display panel.
  • a bonding layer (not shown) may be formed between the image scanning module M and the display panel D.
  • the bonding layer may be made of an epoxy resin or the like.
  • the bonding layer is preferably formed of a material that achieves acoustic impedance matching with the body.
  • a cover glass (not shown) may be further disposed on the display panel D.
  • FIG. 14 is a view showing an arrangement of the image scanning module according to another embodiment of the present invention.
  • the image scanning module M may be disposed under the cover glass G.
  • the display panel D and the image scanning module M are formed under the cover glass G.
  • the display panel D and the image scanning module M may be adjacent to each other so as not to be overlapped vertically.
  • the heights of the upper surfaces of the image scanning module M and the display panel D may be the same, and the cover glass G may be disposed to cover both the image scanning module M and the display panel D.
  • an area where the image scanning module M is formed on the cover glass G may be, for example, an area where a home key or the like is formed.
  • a bonding layer (not shown) for bonding may be formed between the image scanning module M and the cover glass G.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
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Abstract

Selon un mode de réalisation, la présente invention concerne un module de balayage d'image, le module comprenant : une couche d'excitation de capteur qui est placée sur une surface supérieure d'un premier substrat et qui génère un signal électrique ; et une couche de transmission/réception d'onde ultrasonore qui est formée dans une ou plusieurs régions de la surface supérieure de la couche de pilotage de capteur, qui reçoit le signal électrique et génère des ondes ultrasonores permettant de détecter un objet cible, et qui reçoit des ondes ultrasonores réfléchies par l'objet cible, convertit lesdites ondes ultrasonores en un signal électrique, et transmet lesdites ondes ultrasonores à la couche de pilotage du capteur.
PCT/KR2017/004121 2016-04-19 2017-04-17 Module de balayage d'images et dispositif electronique comportant ledit module de balayage d'images WO2017183879A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790000731.3U CN208940092U (zh) 2016-04-19 2017-04-17 图像扫描模块及包括其的电子机器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0047603 2016-04-19
KR20160047603 2016-04-19

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WO2017183879A1 true WO2017183879A1 (fr) 2017-10-26

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US10192094B2 (en) * 2016-09-05 2019-01-29 Nanchang O-Film Bio-Identification Technology Co., Ltd Ultrasonic fingerprint sensor package, ultrasonic fingerprint identification device and electronic device
US10192093B2 (en) * 2016-09-05 2019-01-29 Nanchang O-Film Bio-Identification Technology Co., Ltd. Ultrasonic fingerprint sensor package
US10262178B2 (en) * 2016-09-05 2019-04-16 Nanchang O-Film Bio-Identification Technology Co., Ltd Ultrasonic fingerprint sensor package
US10387706B2 (en) * 2016-09-05 2019-08-20 Nanchang O-Film Bio-Identification Technology Co., Ltd. Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof

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