WO2017183879A1

WO2017183879A1 - Image scanning module and electronic device having same

Info

Publication number: WO2017183879A1
Application number: PCT/KR2017/004121
Authority: WO
Inventors: 김종욱; 김현민; 전호식; 최우영; 이준석; 윤주안
Original assignee: 크루셜텍(주)
Priority date: 2016-04-19
Filing date: 2017-04-17
Publication date: 2017-10-26
Also published as: CN208940092U; KR20180075456A; KR20170119635A; KR101938739B1

Abstract

According to an embodiment, an image scanning module is provided, the module comprising: a sensor driving layer that is disposed on a top surface of a first substrate and that generates an electrical signal; and an ultrasonic wave transmission/reception layer that is formed in one or more regions of the top surface of the sensor driving layer, that receives the electrical signal and generates ultrasonic waves for sensing a target object, and that receives ultrasonic waves reflected by the target object, converts the same to an electrical signal, and transmits the same to the sensor driving layer.

Description

Image scanning module and electronic device including same

The present invention relates to an image scanning module and an electronic device including the same, and more particularly, to an image scanning module and an electronic device including the same, which perform an ultrasonic fingerprint recognition and may be disposed below the display panel without degrading performance.

As security-related issues are recently emerging, security is becoming a hot topic for personal mobile devices such as smartphones and tablet PCs. Recently, as the frequency of users conducting e-commerce or financial business through mobile devices increases, the security problem has increased.

Efforts have been made to solve security problems through personal authentication in response to such demands. Representatively, authentication methods using biometric information such as fingerprint, iris, face, voice, and blood vessels have been introduced.

Among the biometric information authentication techniques, the most commonly used technique is fingerprint authentication technique. Products such as fingerprint recognition and authentication technology have been introduced to smartphones and tablet PCs.

Recently, there is an increasing demand for a technique of placing a fingerprint sensor at the bottom of a glass or incorporating a display area for the purpose of expanding the display area of a device or for aesthetic purposes.

The fingerprint recognition sensor may be implemented in various ways such as an optical method, a thermal sensing method, a capacitive method, and an ultrasonic method.

Among these, an ultrasonic fingerprint recognition sensor is a method of oscillating ultrasonic waves toward a subject and scanning a fingerprint image by detecting a waveform reflected by the subject.

When the cover glass is disposed on the fingerprint sensor of the ultrasonic method, when a human finger contacts the upper surface of the fingerprint sensor, ultrasonic waves are transmitted in an area in contact with the ridge of the fingerprint, and ultrasonic waves are reflected in an area in contact with the valley of the fingerprint.

However, since the material of the cover glass is various and the thickness thereof is thick, the case where impedance matching between the cover glass and the finger is not easily generated. In this case, even though the ridge of the fingerprint touches the upper portion of the cover glass, ultrasonic waves cannot be transmitted at the corresponding point, thereby making it impossible to obtain an accurate fingerprint image.

That is, in the ultrasonic fingerprint recognition sensor, there is a problem that performance may be deteriorated depending on the type of modular material that ultrasonic waves communicate in a modular structure.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide an image scanning module including an ultrasonic fingerprint sensor in a lower portion of a cover glass without degrading performance.

According to an embodiment of the present invention for achieving the above object, a sensor driving layer disposed on an upper surface of the first substrate, for generating an electrical signal; And an ultrasonic wave formed on at least a portion of an upper surface of the sensor driving layer and oscillating an ultrasonic wave for sensing a subject by receiving the electrical signal, receiving an ultrasonic wave reflected by the subject, and converting the ultrasonic wave into an electrical signal. An image scanning module is provided, comprising an ultrasonic transceiving layer for transferring to a layer.

The image scanning module may include: a first electrode disposed on a portion of an upper surface of the first substrate; And a second electrode disposed on a portion of an upper surface of the sensor driving layer and electrically connected to the first electrode.

The image scanning module may further include a molding part formed from an upper surface of the first substrate to an upper surface of the ultrasonic transceiving layer.

The molding part may be formed to cover an upper surface of the ultrasonic transceiving layer, and the molding part may be formed of a material that achieves acoustic impedance matching with the body.

The sensor driving layer may have a plurality of via holes extending in parallel from a lower surface to a predetermined position in the sensor driving layer and forming an electrical connection between the first substrate and the sensor driving layer.

The image scanning module may further include a protective layer formed on the ultrasonic transceiving layer.

The image scanning module may include a first electrode and a second electrode formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer; A third electrode and a fourth electrode formed on the first electrode and the second electrode and formed at the same height from an upper surface of the first substrate; A fifth electrode electrically connecting the third electrode and a fourth electrode; And a first via hole extending from the first electrode to the third electrode, and a second via hole extending from the second electrode to the fourth electrode, covering the upper surface of the first substrate and the upper surface of the sensor driving layer. The molded part may further include.

The image scanning module may include a first electrode and a second electrode formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer; A third electrode formed on the first electrode and formed at the same height as the second electrode; A fifth electrode electrically connecting the second electrode and a third electrode; And a molding part formed to cover an upper surface of the first substrate and having a via hole extending from the first electrode to a third electrode.

On the other hand, according to another embodiment of the present invention, the image scanning module; A display panel formed on the image scanning module; And a second substrate formed under the image scanning module.

The image scanning module may be formed on a lower front surface or a lower surface of a portion of the display panel.

A circuit element may be formed in a portion of the second substrate upper region where the image scanning module is not disposed.

The second substrate may have a step formed on at least a portion thereof, and the circuit element may be formed on an upper surface of one region based on the step, and an upper surface of the other region may be higher than an upper surface of the one region.

The electronic device may further include a reinforcing material formed under the second substrate.

According to another embodiment of the present invention, the image scanning module; And a cover glass disposed above the image scanning module.

The electronic device may further include a display panel disposed so as not to overlap with the image scanning module, and disposed below the cover glass.

According to an embodiment, an image scanning module including an ultrasonic fingerprint sensor may be disposed under the display panel and the cover glass without degrading performance.

1 is a view showing the configuration of an image scanning module according to an embodiment of the present invention.

2 to 4 are diagrams showing an example in which a flexible substrate is mounted on an image scanning module according to an embodiment of the present invention.

5 and 6 are diagrams illustrating an example in which a second substrate is formed under the image scanning module according to an embodiment of the present invention.

7 and 8 are views illustrating a configuration of an image scanning module according to another embodiment of the present invention.

9 is a diagram illustrating a configuration of an image scanning module according to another embodiment of the present invention.

10 is a view showing an image scanning module according to another embodiment of the present invention.

11 and 12 illustrate a structure for mounting an image scanning module to an electronic device according to an embodiment of the present invention.

13 illustrates an embodiment in which a display panel is formed on an image scanning module according to an embodiment of the present invention.

14 illustrates an embodiment in which a cover glass is formed on an image scanning module according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification. In addition, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated.

In the present invention, "on" means to be located above or below the target member, and does not necessarily mean to be located above the gravity direction. In addition, throughout the specification, when a part is said to "include" a certain component, it means that it may further include other components, without excluding the other components unless otherwise stated.

In addition, throughout the specification, when a part is "connected" to another part, it is not only "directly connected", but also "indirectly connected" with another member in between. Include.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, the image scanning module 100 may include a first substrate 110, a sensor driving layer 120, and an ultrasonic transmitting / receiving layer 130 sequentially disposed.

The first substrate 110 enables electrical connection of components included in the image scanning module 100, and may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB). Can be implemented.

The sensor driving layer 120 is formed on at least a portion of the first substrate 110 and is disposed so as not to cover all the upper surfaces of the first substrate 110. The sensor driving layer 120 applies an electrical signal to the ultrasonic transceiver layer 130 to function to radiate ultrasonic waves from the ultrasonic transceiver layer 130. In addition, when the emitted ultrasound is reflected by the subject and received by the ultrasound transmission / reception layer 130, the sensor driving layer 120 detects the received signal. The sensor driving layer 120 may be a CMOS device and include a CMOS substrate and a CMOS circuit.

Electrodes

111 and 121 may be formed on an upper surface of the first substrate 110 and an upper surface of the sensor driving layer 120, respectively. The

electrodes

111 and 121 may be connected by wire bonding to electrically connect the first substrate 110 and the sensor driving layer 120 to each other.

The ultrasonic transceiving layer 130 is formed on at least a portion of the sensor driving layer 120, and is disposed so as not to cover all of the sensor driving layers 120. The above-described electrode 121 is formed in an exposed area of the upper surface of the sensor driving layer 120. The ultrasonic transceiving layer 130 is driven according to an electrical signal received from the sensor driving layer 120. In detail, the ultrasound transmission / reception layer 130 may include a piezoelectric material that generates a physical deformation according to an applied electrical signal to oscillate an ultrasound toward a subject. In addition, the ultrasonic waves reflected by the subject or other components after the oscillation are received by the ultrasonic transmitting and receiving layer 130 again to cause physical deformation of the piezoelectric material. Physical deformations are converted into electrical signals and transmitted to the sensor drive layer 120. The piezoelectric material included in the ultrasonic transceiver layer 130 may be made of PZT, PST, Quartz, (Pb, Sm) TiO ₃ , PVDF, or PVDF-TrFe. Meanwhile, the ultrasound transmission / reception layer 130 may be implemented as a MEMS device.

The image scanning module 100 according to an embodiment may further include a molding unit 140 formed to surround all of the upper surface of the first substrate 110, the sensor driving layer 120, and the ultrasonic transceiving layer 130. have. The molding part 140 protects the image scanning module 100 from external physical and chemical shocks, and may be made of a resin such as epoxy.

Ultrasonic waves emitted from the ultrasonic transceiving layer 130 travel toward a subject, that is, a human finger. Most of the ultrasonic waves are transmitted to the human skin when they are directed toward the ridge of the fingerprint. However, when facing the valley of the fingerprint (Valley), because there is an outside air between the image scanning module 100 and the valley of the fingerprint, ultrasonic waves are reflected due to the acoustic impedance difference. If the acoustic impedance is not matched with the human finger, the ultrasonic waves that are directed toward the ridge of the fingerprint are also reflected, and the reflection characteristics of the ultrasonic waves that are directed toward the ridge and the valley of the fingerprint are not significantly different from each other. Therefore, in order to accurately detect the fingerprint, the molding unit 140 is preferably formed of a material capable of achieving acoustic impedance matching with the human body.

Referring to FIG. 2, a flexible substrate 150 may be formed on at least a portion of an upper surface of the first substrate 110 of the image scanning module 100.

The flexible substrate 150 is bonded to the first substrate 110 to allow the image scanning module 100 to be electrically connected to other electronic components (not shown).

In this case, the molding part 140 may be formed to cover an area of the upper surface of the first substrate 110 where the flexible substrate 150 is not formed.

Next, referring to FIGS. 3 and 4, the flexible substrate 150 may be formed on at least a portion of the lower surface of the first substrate 110 of the image scanning module 100.

Specifically, the flexible substrate 150 may be formed in an area adjacent to the electrode 111 formed on the first substrate 110 of the lower surface of the first substrate 110, as shown in FIG. As shown in the drawing, the first substrate 110 may be formed in a region not adjacent to the electrode 111.

In this case, as shown in FIG. 3, the molding part 140 may be formed such that an area of the upper surface of the first substrate 110 that faces the lower surface of the flexible substrate 150 is exposed. Likewise, the region on the opposite side of the upper surface of the first substrate 110 on which the flexible substrate 150 is formed may be exposed.

2 to 4, the molding part 140 may include at least a portion of an upper surface of the first substrate 110, an upper surface of the sensor driving layer 120, an upper surface of the first substrate 110 and the sensor driving layer 120. The

electrodes

111 and 121 may wrap side portions of the ultrasonic transceiving layer 130, and the upper surface of the ultrasonic transceiving layer 130 may be exposed.

As described above, when the molding unit 140 is formed to surround the upper portion of the ultrasound transmission / reception layer 130, the molding unit 140 has an acoustic impedance in relation to the human body in order to prevent the fingerprint recognition accuracy from deteriorating. It must be formed of a material to be matched.

However, as in the embodiment illustrated in FIGS. 2 to 4, when the molding unit 140 does not surround the upper surface of the ultrasonic transmission / reception layer 130, the ultrasonic wave oscillated from the ultrasonic transmission / reception layer 130 may be molded. Since it is directed to a subject, that is, a human finger without going through 140, the acoustic impedance matching between the molding unit 140 and the human body does not need to be performed. Therefore, in this case, the molding part 140 may be formed of a general molding material.

3 and 4, the molding part 140 may be formed to cover all of the top surfaces of the ultrasonic transceiving layer 130.

5 and 6, a second substrate 160 may be formed under the image scanning module 100 shown in FIG. 1. The second substrate 160 serves to electrically connect the image scanning module 100 to other electronic components (not shown).

Meanwhile, referring to FIG. 6, the image scanning module 100 and the second substrate 160 may be bonded through a plurality of solder balls 161.

7 and 8, the image scanning module 200 may include a first substrate 210, a sensor driving layer 220, and an ultrasonic transmission / reception layer 230 that are sequentially stacked.

Detailed descriptions related to the role of the first substrate 210, the sensor driving layer 220, and the ultrasonic transceiving layer 230 are the same as those described with reference to FIGS. 1 to 6, and thus description thereof will be omitted.

In the image scanning module 200 according to another embodiment of the present invention, a plurality of via holes 221 may be formed in the sensor driving layer 220 in parallel with each other in the longitudinal direction.

The plurality of via holes 221 may be formed to extend from the first surface of the sensor driving layer 220 toward the second surface. Here, the first surface is a surface where the sensor drive layer 220 is in contact with the first substrate 210, and the second surface is an opposite surface of the first surface.

The length of each via hole 221 may be smaller than the length of the first and second surfaces of the sensor driving layer 220. That is, each via hole 221 extends from the first surface of the sensor drive layer 220 to a predetermined position therein.

The CMOS device included in the sensor driving layer 220 may be electrically connected to the first substrate 210 through the plurality of via holes 221 to receive an electrical signal.

Meanwhile, referring to FIG. 8, in the image scanning module 200 illustrated in FIG. 7, a protective layer 240 may be further formed on the ultrasonic transceiving layer 230.

The protective layer 240 serves to protect the sensor driving layer 220 and the ultrasonic transceiving layer 230 from external shocks.

As described above, if the acoustic impedance matching between the material disposed on the ultrasonic transceiving layer 230 and the human body is not performed, the accuracy of fingerprint recognition may be lowered. Thus, the protective layer 240 may prevent the human body from the acoustic impedance. It must be formed of a material capable of matching.

In addition, it may be desirable to minimize the thickness of the protective layer 240 to improve fingerprint recognition accuracy.

Referring to FIG. 9, the image scanning module 900 may include a flexible substrate 910, a sensor driving layer 920, and an ultrasonic transmission / reception layer 930.

The flexible substrate 910 serves to supply an electrical signal to the sensor driving layer 920 and the ultrasonic transceiving layer 930, and may be formed of a flexible material.

The molding part 940 may be formed to cover the top surface of the flexible substrate 910, the top surface of the sensor driving layer 920, and the side surface of the ultrasonic transceiving layer 930.

The first electrode 911a may be formed on at least a portion of the upper surface of the flexible substrate 910 where the sensor driving layer 920 is not disposed, and the ultrasonic transmission / reception layer 930 is disposed on the upper surface of the sensor driving layer 920. The second electrode 921a may be formed on at least a portion not provided.

The third electrode 911b and the fourth electrode 911b are electrically connected to the first electrode 911a and the second electrode 922a, respectively, on the first electrode 911a and the second electrode 922a. 921b is disposed. For example, the third electrode 911b and the fourth electrode 921b may be formed at the same height from the upper surface of the flexible substrate 910. When the third electrode 911b and the fourth electrode 921b are formed at a position lower than the upper surface of the ultrasonic transceiving layer 930, the molding part 940 may also be formed of the third electrode 911b and the fourth electrode 921b. It may be formed up to the same height as the height. In other words, the third electrode 911b and the fourth electrode 921b may be formed to be exposed on the upper surface of the molding part 940.

The first electrode hole 941a and the first electrode hole 941a are formed in the molding part 940 for electrical connection between the first electrode 911a and the third electrode 911b and electrical connection between the second electrode 921a and the fourth electrode 921b. Two electrode holes 941b may be formed.

The first electrode hole 941a is formed to electrically connect the first electrode 911a and the third electrode 911b, and the second electrode hole 941b is the second electrode 921a and the fourth electrode 921b. ) Is formed to electrically connect. The first and

second electrode holes

941a and 941b may be formed by forming a hole in the molding part 940 and then filling a conductive material, for example, a metal material in the hole, but is not limited thereto. no.

A fifth electrode 950 may be formed on the third electrode 911b and the fourth electrode 921b to electrically connect them. The fifth electrode 950 may be formed on the upper surface of the molding part 940.

Electrical signals from the flexible substrate 910 may be sequentially provided with the first electrode 911a, the first electrode hole 941a, the third electrode 911b, the fifth electrode 950, the fourth electrode 921b, and the second electrode. It may be applied to the sensor driving layer 920 through the electrode 921b.

Referring to FIG. 10, in the same image scanning module as in FIG. 9, the molding part 940 is formed to cover only the upper portion of the flexible substrate 910, and the fourth electrode 921b and the second electrode hole 941b are formed. It can be seen that it was omitted.

The first electrode 911a on the flexible substrate 910, the second electrode 921a on the sensor driving layer 920, and the third electrode 911b formed to be spaced apart from each other are formed on the flexible substrate 910. Since the same as in the embodiment shown in Figure 9 will be omitted here.

The third electrode 911b is formed to be exposed through the upper surface of the molding part 940, and may be formed at the same height as the second electrode 921a on the sensor driving layer 920, and the fifth electrode 950 may be formed. It serves to electrically connect the second electrode 921a and the third electrode 911b.

In this case, the electrical signals from the flexible substrate 910 are sequentially transmitted to the first electrode 911a, the first electrode hole 941a, the third electrode 911b, the fifth electrode 950, and the second electrode 921a. It may be applied to the sensor driving layer 920 through.

The image scanning module M illustrated in FIGS. 11 and 12 may be implemented by any one of the

image scanning modules

100, 200, and 900 described with reference to FIGS. 1 to 10.

11 and 12, the image scanning module M may be disposed on at least a portion of an upper surface of the flexible substrate 1100.

Meanwhile, on the upper surface of the flexible substrate 1100, circuit elements for driving the image scanning module M or other electronic components may be formed in at least a portion of the region A in which the image scanning module M is not disposed. have.

The flexible substrate 1100 may be formed in a plane as shown in FIGS. 11A and 12B, but the image as shown in FIGS. 11A and 12B. A step may be formed in a portion of the area A in which the scanning module M is not disposed. In this case, an area in which the image scanning module M is not disposed in the flexible substrate 1100 may be divided into a first area A1 and a second area A2 based on the step difference.

The second area A may be formed as high as a predetermined height h based on the height of the top surface of the first area A1.

The circuit element described above may be formed in the first region A1. In this case, the second region A2 formed due to the step may protect the circuit element formed in the first region A1.

Meanwhile, a reinforcing material 1110 may be formed on the bottom surface of the flexible substrate 1100 to maintain strength.

Referring to FIG. 13, a display panel D may be formed on an image scanning module M according to an embodiment of the present invention.

In detail, the image scanning module M may be formed on the lower front surface of the display panel D. FIG. When formed as described above, ultrasound transmission and reception is possible in the entire display display area, and thus fingerprint image scanning is possible at any position on the display panel D. FIG.

In addition, the image scanning module M may be formed in a portion of the lower surface of the display panel D. FIG. For example, as illustrated in FIG. 13, an image scanning module M may be formed on a lower surface of one end area of the display panel D. FIG. In this case, ultrasound transmission and reception is possible only in a partial region overlapping with the image scanning module M in the display display area, so that only the fingerprint image can be scanned in the corresponding area. Here, the partial region may be a partial region on the left side, the right side, or the center of the display panel D on FIG. 13.

According to an embodiment, the display panel D may include a liquid crystal display (LCD) panel, an organic light emitting diode (OLED) display panel, a light emitting diode (LED) display panel, The display panel may be implemented as a plasma display panel (PDP) or the like, and preferably, an organic light emitting diode display panel.

A bonding layer (not shown) may be formed between the image scanning module M and the display panel D. FIG. The bonding layer may be made of an epoxy resin or the like.

As described above, in order for accurate fingerprint detection, a material existing between the image scanning module M and the subject needs to achieve acoustic impedance matching with the body, and thus, the bonding layer is preferably formed of a material that achieves acoustic impedance matching with the body. Do.

Meanwhile, a cover glass (not shown) may be further disposed on the display panel D.

14 is a view showing an arrangement of the image scanning module according to another embodiment of the present invention.

Referring to FIG. 14, the image scanning module M may be disposed under the cover glass G.

In detail, the display panel D and the image scanning module M are formed under the cover glass G. The display panel D and the image scanning module M may be adjacent to each other so as not to be overlapped vertically. . In this case, the heights of the upper surfaces of the image scanning module M and the display panel D may be the same, and the cover glass G may be disposed to cover both the image scanning module M and the display panel D.

In this case, an area where the image scanning module M is formed on the cover glass G may be, for example, an area where a home key or the like is formed.

In this case, a bonding layer (not shown) for bonding may be formed between the image scanning module M and the cover glass G.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be.

Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

Claims

A sensor driving layer disposed on an upper surface of the first substrate to generate an electrical signal; And

Is formed on at least a portion of the upper surface of the sensor drive layer, the ultrasonic signal is applied to oscillate the ultrasonic wave for detecting the subject, and after receiving the ultrasonic wave reflected by the subject, the sensor drive layer is converted into an electrical signal And an ultrasonic transmitting and receiving layer for transmitting to the image scanning module.
The method of claim 1,

A first electrode disposed on a portion of an upper surface of the first substrate; And

And a second electrode disposed on a portion of an upper surface of the sensor driving layer and electrically connected to the first electrode.
The method of claim 1,

And a molding part formed from an upper surface of the first substrate to an upper surface of the ultrasonic transceiving layer.
The method of claim 3,

The molding part is formed to cover an upper surface of the ultrasonic transceiving layer,

The molding unit is formed of a material that achieves acoustic impedance matching with the body, the image scanning module.
The method of claim 1,

And a plurality of via holes extending in parallel from a lower surface to a predetermined position in the sensor driving layer and forming an electrical connection between the first substrate and the sensor driving layer.
The method of claim 5,

The image scanning module further comprises a protective layer formed on the ultrasonic transceiving layer.
The method of claim 1,

First and second electrodes formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer;

A third electrode and a fourth electrode formed on the first electrode and the second electrode and formed at the same height from an upper surface of the first substrate;

A fifth electrode electrically connecting the third electrode and a fourth electrode; And

A first via hole extending from the first electrode to a third electrode and a second via hole extending from the second electrode to the fourth electrode are formed to cover the top surface of the first substrate and the top surface of the sensor driving layer. The image scanning module further comprises a molding.
The method of claim 1,

First and second electrodes formed on a portion of an upper surface of the first substrate and a portion of an upper surface of the sensor driving layer;

A third electrode formed on the first electrode and formed at the same height as the second electrode;

A fifth electrode electrically connecting the second electrode and a third electrode; And

And a molding part formed to cover the top surface of the first substrate and having a via hole extending from the first electrode to a third electrode.
An image scanning module according to any one of claims 1 to 8;

A display panel formed on the image scanning module; And

And a second substrate formed under the image scanning module.
The method of claim 9,

And the image scanning module is formed on a lower front surface or a lower surface of a portion of the display panel.
The method of claim 9,

The electronic device of claim 2, wherein a circuit element is formed in a portion of the second substrate upper surface region where the image scanning module is not disposed.
The method of claim 11,

The second substrate has a step formed at least in part,

The circuit device is formed on an upper surface of one region based on the step, and the upper surface of the other region is formed higher than the upper surface of the one region.
The method of claim 9,

The electronic device further comprises a reinforcing material formed under the second substrate.
An image scanning module according to any one of claims 1 to 8; And

And a cover glass disposed above the image scanning module.
The method of claim 14,

And a display panel disposed to not overlap with the image scanning module, and disposed below the cover glass.