WO2018216834A1 - Boîtier de capteur optique et son procédé de fabrication - Google Patents

Boîtier de capteur optique et son procédé de fabrication Download PDF

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Publication number
WO2018216834A1
WO2018216834A1 PCT/KR2017/005492 KR2017005492W WO2018216834A1 WO 2018216834 A1 WO2018216834 A1 WO 2018216834A1 KR 2017005492 W KR2017005492 W KR 2017005492W WO 2018216834 A1 WO2018216834 A1 WO 2018216834A1
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WO
WIPO (PCT)
Prior art keywords
sensor chip
light receiving
base substrate
receiving surface
sensor package
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PCT/KR2017/005492
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English (en)
Korean (ko)
Inventor
전문수
이현진
이재정
Original Assignee
주식회사 파트론
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Publication of WO2018216834A1 publication Critical patent/WO2018216834A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an optical sensor package, and more particularly to a light receiving sensor package for detecting the light reflected from the surface of the sensing object.
  • Modern electronic devices such as smart phones, tablet computers, and wearable devices include various kinds of sensor devices.
  • recent electronic devices include proximity sensors, illuminance sensors, temperature sensors, heart rate sensors, gyro sensors, fingerprint sensors, and the like.
  • Many of the sensors correspond to optical sensors that sense and sense light.
  • a fingerprint sensor a method of sensing capacitance between a sensor and a fingerprint is mainly used in the past, but an optical method has recently been studied.
  • optical sensors are becoming increasingly slim.
  • the slim form factor is widely used because it is not only convenient for the user to use or carry, but also has excellent aesthetics. Therefore, the optical sensor accommodated in the electronic device is also required to be formed in a slim and miniaturized package.
  • the slim and compact optical sensor package not only has a difficult structural design but also requires a very precise process in assembling each component. Therefore, in the case of a slim and compact optical sensor package, there is a problem that the defect rate can be increased, thereby increasing the cost.
  • An object of the present invention is to provide an optical sensor package and a method of manufacturing the same, which can contribute to the slimming of a mounted electronic device because the package is slim and compact.
  • Another object of the present invention is to provide an optical sensor package and a method of manufacturing the same, which can minimize tolerances according to the manufacturing process of the light receiving surface of the optical sensor.
  • Another object of the present invention is to provide an optical sensor package and a method for manufacturing the same, which are easy to assemble because the package is slim, compact and simple in structure.
  • the optical sensor package of the present invention for solving the above problems, the base substrate, a sensor chip coupled to the upper surface of the base substrate, including a light receiving surface, covering a portion of the sensor chip on the upper surface of the base substrate, the light receiving
  • the surface may include a molding part formed so as not to cover, an optical filter covering the light receiving surface, and a flexible circuit board coupled to the bottom surface of the base substrate.
  • the lower surface of the base substrate and the flexible circuit board may be coupled by a surface mount method.
  • the flexible circuit board includes a conductive pattern, the conductive pattern may transmit a signal generated by the sensor chip.
  • the sensor chip and the base substrate may be electrically connected by a wire.
  • the upper surface of the sensor chip includes a top surface and a bottom surface formed stepped with each other, the bottom surface may be formed with a bonding pad to which the wire is coupled.
  • the light receiving surface is formed on the top surface, the bottom surface may be covered by the molding.
  • the wire may be sealed by the molding portion.
  • the sensor chip may include a plurality of surfaces that are divided by bending, and one surface on which the light receiving surface is formed may not be covered by the molding part.
  • the light receiving surface may be formed on the upper surface of the sensor chip.
  • the upper surface of the sensor chip includes a top surface and a bottom surface formed stepped with each other, the light receiving surface may be formed on the top surface.
  • the top surface may not be covered by the molding.
  • the bottom surface may be covered by the molding.
  • the top surface and the upper surface of the molding portion may be located on the same plane.
  • the light receiving surface and the molding portion adjacent to the light receiving surface may be located on the same plane.
  • the light receiving surface is formed on the upper surface of the sensor chip, the upper surface of the sensor chip and the upper surface of the molding portion may be located on the same plane.
  • the base substrate may be a rigid printed circuit board.
  • the manufacturing method of the optical sensor package of the present invention for solving the above problems, providing a base substrate, the step of coupling a sensor chip including a light receiving surface on the upper surface of the base substrate, a part of the sensor chip And forming a molding part to expose the light receiving surface, bonding a flexible circuit board to a lower surface of the base substrate, and coupling an optical filter to cover the light receiving surface.
  • the step of coupling the flexible circuit board may be to combine the lower surface of the base substrate and the flexible circuit board by a surface mount method.
  • the coupling of the optical filter may be performed after the coupling of the flexible circuit board.
  • the coupling of the sensor chip may include mounting the sensor chip on an upper surface of the base substrate, and electrically connecting the sensor chip and the base substrate through a wire. can do.
  • the optical sensor package according to an embodiment of the present invention may contribute to slimming of the electronic device mounted since the package is slim and compact.
  • optical sensor package according to an embodiment of the present invention can minimize the tolerance according to the manufacturing process of the light receiving surface of the optical sensor.
  • the optical sensor package according to an embodiment of the present invention has the advantage that the size of the package is slim and compact, and the structure is simple and easy to assemble.
  • FIG. 1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1.
  • FIG. 3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
  • FIG. 4 is a flowchart illustrating a method of manufacturing an optical sensor package according to an embodiment of the present invention.
  • 5 to 8 are cross-sectional views of a method of manufacturing an optical sensor package according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention.
  • 2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1.
  • 3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
  • the light emitting sensor package of the present invention includes a base substrate 100, a sensor chip 200, a molding part 300, an optical filter 400, and a flexible circuit board 500.
  • the base substrate 100 is formed of a substrate having a flat plate shape and includes an upper surface and a lower surface.
  • the upper surface of the base substrate 100 is a surface facing the upper side of the drawing
  • the lower surface of the base substrate 100 corresponds to the surface facing the lower side of the drawing.
  • the base substrate 100 may be a printed circuit board, a ceramic substrate, or a metal substrate having an anodization layer, but is not limited thereto.
  • the base substrate 100 may include an insulating layer, a conductor pattern, and a pad.
  • the base substrate 100 includes at least one pad 110 on an upper surface thereof.
  • the pad 110 is electrically connected to the sensor chip 200 through a wire 250 to be described later.
  • the base substrate 100 includes at least one pad 120 on the bottom surface.
  • the pad 120 is electrically connected to the pad 510 of the flexible circuit board 500 to be described later.
  • the pads 110 and 120 formed on the upper and lower surfaces of the base substrate 100 are electrically connected to each other through conductor patterns (not shown) or via holes (not shown) formed in the base substrate 100.
  • the signal generated by the sensor chip 200 may be transmitted to the flexible circuit board 500 through the pad 110 of the upper surface of the base substrate 100 and the pad 120 of the lower surface of the base substrate 100.
  • the power input through the flexible circuit board 500 may be transmitted to the sensor chip 200 through the pad 120 of the bottom surface of the base substrate 100 and the pad 110 of the top surface of the base substrate 100.
  • the mounting area is provided on the upper surface of the base substrate 100.
  • the sensor chip 200 to be described later is located in the mounting area.
  • the pad 110 on the top surface of the base substrate 100 may be positioned around the mounting area.
  • a portion to which the molding part 300 to be described later is coupled may be provided around the mounting area.
  • the sensor chip 200 is an electronic component including the light receiving surface 240.
  • the sensor chip 200 may convert light detected through the light receiving surface 240 into an electrical signal.
  • the sensor chip 200 is coupled to the top surface of the base substrate 100.
  • the sensor chip 200 includes a plurality of surfaces.
  • the plurality of surfaces of the sensor chip 200 may be divided by bending each other.
  • the sensor chip 200 includes an upper surface 210, a lower surface 220, and a side surface 230 connecting the upper surface 210 and the lower surface 220.
  • the lower surface 220 of the sensor chip 200 abuts on and contacts the upper surface of the base substrate 100.
  • the upper surface 210 of the sensor chip 200 corresponds to the surface opposite to the lower surface 220.
  • the upper surface 210 of the sensor chip 200 may include an upper surface 211 and a lower surface 212 formed to be stepped with each other. A stepped surface 213 extending in the vertical direction may be formed between the top surface 211 and the bottom surface 212.
  • the sensor chip 200 is coupled to the mounting area of the base substrate 100. Specifically, the lower surface 220 of the sensor chip 200 and the mounting area of the base substrate 100 face each other, and are bonded between the lower surface 220 of the sensor chip 200 and the mounting area of the base substrate 100.
  • the film 260 may be located.
  • the sensor chip 200 and the base substrate 100 may be coupled by the adhesive film 260.
  • the adhesive film 260 may be a die attach film.
  • the adhesive film 260 may have a deformable physical property under predetermined processing conditions, and may be cured in a form that is not deformed after curing.
  • predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
  • the adhesive film 260 may be an epoxy-based die attach film.
  • Such an adhesive film has a property of being heat cured by heating, and a portion of the adhesive film may be changed in the process of being cured by heating.
  • the adhesive film may be cured when treated at a temperature of 100 ° C. to 150 ° C. for a predetermined time.
  • the adhesive film may be partially changed in shape while being hot treated and completely cured.
  • the sensor chip 200 may be electrically connected to the base substrate 100 by a wire 250.
  • the wire 250 may be a conductive wire 250 formed of gold, silver, copper, or the like. Specifically, the wire 250 may be coupled to the bonding pad 251 of the sensor chip 200 and the pad 110 of the upper surface of the base substrate 100 to achieve electrical connection.
  • the bonding pad 251 of the sensor chip 200 may be formed on the bottom surface 212 of the upper surface 210 of the sensor chip 200.
  • the wire 250 partially protrudes upward from the bonding pad 251 of the sensor chip 200 and then bends downward to be connected to the pad 110 of the upper surface of the base substrate 100. Therefore, the wire 250 may protrude upward rather than the bottom surface 212 of the top surface of the sensor chip 200.
  • the uppermost portion of the wire 250 is preferably located below the upper surface 211 of the upper surface 210 of the sensor chip 200.
  • the molding part 300 to be described later is formed to form the same plane as the top surface 211 of the upper surface 210 of the sensor chip 200, the wire 250 is preferably encapsulated in the molding part 300. Because.
  • the light receiving surface 240 is formed on one surface of the sensor chip 200 and is exposed to the outside of the sensor chip 200.
  • the light receiving surface 240 may be formed on a portion of the upper surface 210 of the sensor chip 200. More specifically, the light receiving surface 240 may be formed on a part of the upper surface 211 of the upper surface 210 of the sensor chip 200. In the top surface 211, the light receiving surface 240 is positioned at the center portion, and the edge portion may be formed as an outer surface of the sensor chip 200 instead of the light receiving surface 240 to surround the light receiving surface 240.
  • the light receiving surface 240 is a light receiving element that detects light emitted from the outside and converts it into an electrical signal.
  • a plurality of light receiving elements may be integrated on the light receiving surface 240.
  • the light receiving surface 240 may correspond to an active area of the image sensor.
  • the light receiving surface 240 may be determined to operate best in a predetermined wavelength band. Specifically, the light receiving surface 240 may operate most suitably in the first wavelength band to be described later. However, the light receiving surface 240 may not detect only light of the first wavelength band. The light receiving surface 240 may detect light other than the first wavelength band, and in some cases, the sensor chip 200 may recognize the noise as noise. Therefore, the optical filter 400 to be described later may be coupled to the upper portion of the light receiving surface 240. The optical filter 400 will be described in detail below.
  • the sensor chip 200 may be a fingerprint recognition sensor chip 200 that optically recognizes a unique pattern of a fingerprint.
  • the fingerprint to be recognized is located above the light receiving surface 240.
  • the sensor chip 200 includes an imaging sensor for imaging at least the unique pattern of the fingerprint.
  • the sensor chip 200 may further include a signal processor that processes an image of the captured fingerprint and converts the image into data.
  • the sensor chip 200 may further include a determination unit that determines whether the fingerprint is matched by comparing the converted data with already stored data. If the sensor chip 200 does not include a signal processor or a determiner, a separate component for performing such a function may be provided.
  • the molding part 300 encapsulates a part of the sensor chip 200 on the upper surface of the base substrate 100.
  • the molding part 300 is preferably formed of an electrically stable material such as an epoxy molding compound (EMC).
  • EMC epoxy molding compound
  • the molding part 300 may be formed on a portion of the upper surface of the base substrate 100 except for a portion in which the sensor chip 200 is mounted. In addition, it may be formed so as not to exceed the upper surface of the base substrate 100.
  • the molding part 300 may expose one surface on which the light receiving surface 240 is formed on the sensor chip 200 without being exposed, and the other surface may be formed to cover the other surface.
  • the molding part 300 may be formed by an exposure molding method of exposing one surface on which the light receiving surface 240 of the sensor chip 200 is formed.
  • the molding part 300 has the side surface 230 and the lower surface of the sensor chip 200. 212 and the stepped surface 213 may be formed to cover both.
  • the lower surface 220 of the sensor chip 200 is coupled to the upper surface of the base substrate 100 so that it cannot be covered by the molding part 300. Therefore, the molding part 300 may be formed to cover all surfaces of the sensor chip 200 except for the surface on which the light receiving surface 240 is formed and the surface in contact with the base substrate 100.
  • the upper surface 310 of the molding part 300 may be formed to form the same plane as the upper surface 211 of the sensor chip 200. Therefore, the upper surface 211 of the sensor chip 200 and the upper surface 310 of the molding part 300 in the upper surface portion of the optical sensor package is preferably formed almost continuously without being spaced apart.
  • a part of the molding part 300 may include a flash covering a part of the upper surface 211 of the sensor chip 200, but the flash may be formed at a portion other than the part where the light receiving surface 240 is formed. It is formed only on the top surface 211. If the flash of the molding part 300 is formed to cover the light receiving surface 240, a deflash process of removing the molding part 300 should be performed.
  • the optical filter 400 is formed to cover the light receiving surface 240.
  • the optical filter 400 has a predetermined wavelength band as a pass band.
  • the optical filter 400 has a first wavelength band as a pass band.
  • the first wavelength band may correspond to the infrared wavelength band. Since the optical filter 400 covers the light receiving surface 240, only light passing through the optical filter 400 may be irradiated onto the light receiving surface 240. Therefore, only light in the infrared band may be irradiated to the light receiving surface 240. Some of the light may be irradiated to the light receiving surface 240 without passing through the optical filter 400 through the space between the optical filter 400 and the light receiving surface 240, but this may be relatively insignificant.
  • the optical filter 400 may be an optical device based on a film and having at least one coating layer or a deposition layer formed thereon.
  • the optical filter 400 is substantially formed of a film or a layer.
  • the optical filter 400 is provided with the same width as the light receiving surface 240 or larger than the light receiving surface 240 to cover the light receiving surface 240.
  • the optical filter 400 may be coupled to the light receiving surface 240 in various ways.
  • the optical filter 400 may be coupled to the light receiving surface 240 by an adhesive film (not shown).
  • the adhesive film is positioned between the optical filter 400 and the light receiving surface 240 to couple the optical filter 400 and the light receiving surface 240.
  • the adhesive film may be formed to cover the light receiving surface 240. Therefore, the light passing through the optical filter 400 passes through the adhesive film and is then irradiated onto the light receiving surface 240.
  • the adhesive film may be a die attach film.
  • the adhesive film may have a deformable physical property under predetermined processing conditions, and may be cured into a shape that is not deformed after curing.
  • predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
  • the adhesive film may be an epoxy-based die attach film.
  • Such an adhesive film has a property of being heat cured by heating, and a portion of the adhesive film may be changed in the process of being cured by heating.
  • the adhesive film may be cured when treated at a temperature of 100 ° C. to 150 ° C. for a predetermined time.
  • the adhesive film may be partially changed in shape while being hot treated and completely cured.
  • the adhesive film for bonding the optical filter 400 is preferably cured at a lower temperature than the adhesive film 260 for bonding the sensor chip 200. This is to suppress the optical filter 400 from being damaged by heat as much as possible.
  • the adhesive film is light transmissive for the first wavelength band.
  • the first wavelength band may correspond to the infrared wavelength band.
  • the adhesive film may have a light transmittance of 88% or more with respect to the first wavelength band.
  • the adhesive film may have a transmissivity of 93% or more with respect to the first wavelength band. Therefore, the external light passing through the optical filter 400 is irradiated to the light receiving surface 240 with little loss in the adhesive film. Therefore, the light receiving surface 240 may sense a relatively large amount of light, which contributes to improving the sensing accuracy of the sensor chip 200.
  • the optical filter 400 may be a coating layer formed by being directly bonded to the light receiving surface 240 of the sensor chip 200, not in the form of a film.
  • the coating layer may be directly coupled to the light receiving surface 240 of the sensor chip 200 without a separate adhesive film or the like interposed therebetween.
  • the flexible printed circuit board (FPCB) 500 is a circuit board formed of a material that can be deformed by an external force.
  • the flexible circuit board 500 includes a flexible film, a pad 510, a conductor pattern 520, and a terminal 530.
  • the pad 510, the conductor pattern 520, and the terminal 530 are formed on the flexible film.
  • the pad 510 of the flexible circuit board 500 is electrically connected to the terminal 530 through the conductor pattern 520.
  • the terminal 530 may be combined with an external device to transmit or receive an electrical signal or to receive power.
  • the flexible circuit board 500 is coupled to the bottom surface of the base substrate 100.
  • the pad 510 exposed on the top surface of the flexible circuit board 500 is electrically connected to the pad 120 on the bottom surface of the base substrate 100.
  • the pad 510 of the flexible circuit board 500 and the pad 120 of the bottom surface of the base substrate 100 may be coupled by a surface mount method.
  • the base substrate 100 and the flexible circuit board 500 are generally subjected to a reflow process.
  • the portion bonded to the base substrate 100, the flexible circuit board 500, and the base substrate 100 is exposed to high heat. Therefore, a configuration in which heat resistance is not good is preferably combined after the base substrate 100 and the flexible circuit board 500 are bonded in a surface mount manner. This will be described in more detail with reference to the manufacturing method of the optical sensor package below.
  • the position where the sensor chip 200 is coupled on the base substrate 100 may be adjusted relatively accurately.
  • the manufacturing method of the optical sensor package of the present invention corresponds to the method of manufacturing the optical sensor package described above with reference to FIGS. Therefore, for convenience of description, some of the descriptions will be omitted while describing the optical sensor package.
  • FIG. 4 is a flowchart illustrating a method of manufacturing an optical sensor package according to an embodiment of the present invention.
  • a method of manufacturing an optical sensor package includes preparing a base substrate (S100), bonding a sensor chip (S200), forming a molding unit (S300), and combining a flexible circuit board ( S400) and combining the optical filter (S500).
  • FIG. 5 is a cross-sectional view illustrating the process of preparing a base substrate (S100) and combining a sensor chip (S200).
  • the preparing of the base substrate 100 including the mounting area to which the sensor chip 200 is coupled is provided.
  • the step of coupling the sensor chip (S200) is a step of coupling the sensor chip 200 including the light receiving surface 240 on the upper surface of the base substrate 100.
  • the sensor chip 200 is disposed such that the light receiving surface 240 is formed on the upper surface of the sensor chip 200.
  • the sensor chip 200 includes a plurality of surfaces.
  • the plurality of surfaces of the sensor chip 200 may be divided by bending each other.
  • the sensor chip 200 includes an upper surface 210, a lower surface 220, and a side surface 230 connecting the upper surface 210 and the lower surface 220.
  • the lower surface 220 of the sensor chip 200 abuts on and contacts the upper surface of the base substrate 100.
  • the upper surface 210 of the sensor chip 200 corresponds to the surface opposite to the lower surface 220.
  • the upper surface 210 of the sensor chip 200 may include an upper surface 211 and a lower surface 212 formed to be stepped with each other. A stepped surface 213 extending in the vertical direction may be formed between the top surface 211 and the bottom surface 212.
  • the light receiving surface 240 is formed on one surface of the sensor chip 200 and is exposed to the outside of the sensor chip 200.
  • the light receiving surface 240 may be formed on a portion of the upper surface 210 of the sensor chip 200. More specifically, the light receiving surface 240 may be formed on a part of the upper surface 211 of the upper surface 210 of the sensor chip 200. In the top surface 211, the light receiving surface 240 is positioned at the center portion, and the edge portion may be formed as an outer surface of the sensor chip 200 instead of the light receiving surface 240 to surround the light receiving surface 240.
  • the sensor chip 200 may be electrically connected to the base substrate 100 by a wire 250.
  • the wire 250 may be coupled to the bonding pad 251 of the sensor chip 200 and the pad 110 of the upper surface of the base substrate 100 to achieve electrical connection.
  • FIG. 6 is a cross-sectional view illustrating a process of forming a molding part (S300).
  • the molding part 300 encapsulates a part of the sensor chip 200 on an upper surface of the base substrate 100.
  • the molding part 300 is preferably formed of an electrically stable material such as an epoxy molding compound (EMC).
  • EMC epoxy molding compound
  • the molding part 300 may be formed on a portion of the upper surface of the base substrate 100 except for a portion in which the sensor chip 200 is mounted. In addition, it may be formed so as not to exceed the upper surface of the base substrate 100.
  • the molding part 300 may expose one surface on which the light receiving surface 240 is formed on the sensor chip 200 without being exposed, and the other surface may be formed to cover the other surface.
  • the molding part 300 may be formed by an exposure molding method of exposing one surface on which the light receiving surface 240 of the sensor chip 200 is formed.
  • the process of performing the exposure molding method may be as follows. First, an assembly of the base substrate 100 and the sensor chip 200 is disposed in a mold for injecting the molding part 300. At this time, one surface of the sensor chip 200 to be exposed without being covered by the molding part 300 is disposed to be in close contact with the inner surface of the mold. For example, the upper surface 211 of the upper surface of the sensor chip 200 may be disposed to be in close contact with the inner surface of the mold. Thereafter, when the resin material forming the molding part 300 is injected into the mold and cured, the molding part 300 covering the other surface is formed without covering the top surface 211 of the sensor chip 200.
  • the molding part 300 exposes the upper surface 211 without covering the sensor chip 200.
  • the side surface, the bottom surface 212 and the step surface 213 of the 200 may be formed to cover all.
  • the lower surface 220 of the sensor chip 200 is coupled to the upper surface of the base substrate 100 so that it cannot be covered by the molding part 300. Therefore, the molding part 300 may be formed to cover all surfaces of the sensor chip 200 except for the surface on which the light receiving surface 240 is formed and the surface in contact with the base substrate 100.
  • the upper surface 310 of the molding part 300 may be formed to form the same plane as the upper surface 211 of the sensor chip 200. Therefore, the upper surface 211 of the sensor chip 200 and the upper surface 310 of the molding part 300 in the upper surface portion of the optical sensor package is preferably formed almost continuously without being spaced apart.
  • a part of the molding part 300 may include a flash covering a part of the upper surface 211 of the sensor chip 200, but the flash may be formed at a portion other than the part where the light receiving surface 240 is formed. It is formed only on the top surface 211. If the flash of the molding part 300 is formed to cover the light receiving surface 240, a deflash process of removing the molding part 300 should be performed.
  • FIG. 7 is a cross-sectional view illustrating a state in which a step S400 of bonding a flexible circuit board is performed.
  • the flexible circuit board 500 includes a flexible film, a pad 510, a conductor pattern 520, and a terminal 530.
  • the pad 510, the conductor pattern 520, and the terminal 530 are formed on the flexible film.
  • the pad 510 of the flexible circuit board 500 is electrically connected to the terminal 530 through the conductor pattern 520.
  • the terminal 530 may be combined with an external device to transmit or receive an electrical signal or to receive power.
  • the flexible circuit board 500 is coupled to the bottom surface of the base substrate 100.
  • the pad 510 exposed on the top surface of the flexible circuit board 500 is electrically connected to the pad 120 on the bottom surface of the base substrate 100.
  • the pad 510 of the flexible circuit board 500 and the pad 120 of the bottom surface of the base substrate 100 may be coupled by a surface mount method.
  • the base substrate 100 and the flexible circuit board 500 are generally subjected to a reflow process.
  • the portion bonded to the base substrate 100, the flexible circuit board 500, and the base substrate 100 is exposed to high heat.
  • the temperature rises from 150 ° C to 250 ° C in the reflow process.
  • the step of coupling the flexible circuit board (S400) is performed before the step of coupling the optical filter (S500). It is preferable to carry out.
  • FIG 8 is a cross-sectional view illustrating the process of coupling the optical filter (S500).
  • the optical filter 400 is formed to cover the light receiving surface 240.
  • the optical filter 400 may be coupled to the light receiving surface 240 in various ways.
  • the optical filter 400 may be coupled to the light receiving surface 240 by an adhesive film (not shown).
  • the optical filter 400 may be a coating layer formed by being directly bonded to the light receiving surface 240 of the sensor chip 200, not in the form of a film.
  • the coating layer may be directly coupled to the light receiving surface 240 of the sensor chip 200 without a separate adhesive film or the like interposed therebetween.
  • the optical sensor package is not exposed to high temperature. This is because the optical filter 400 is typically poor in heat resistance to high temperature, and thus may degrade optical performance when exposed to high temperature.
  • the sensor chip can be protected from external impact, the position where the sensor chip is coupled can be adjusted relatively accurately, and the optical performance of the optical filter can be maintained.
  • top side 212 bottom side
  • step difference 220 lower surface

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

La présente invention concerne un boîtier de capteur optique et son procédé de fabrication. Le boîtier de capteur optique selon la présente invention est un boîtier de capteur de réception de lumière permettant de détecter la lumière réfléchie par la surface d'un objet à détecter, et peut contribuer à la finesse du dispositif électronique sur lequel il est monté. Le boîtier de capteur optique selon la présente invention comprend : une plaque de base ; une puce de capteur qui est couplée à la surface supérieure de la plaque de base, et qui comprend une surface de réception de lumière ; une partie de moulage formée de manière à recouvrir une partie de la puce de capteur sur la surface supérieure de la plaque de base et ne pas recouvrir la surface de réception de lumière ; un filtre optique recouvrant la surface de réception de lumière ; et une carte de circuit imprimé souple couplée à la surface inférieure de la plaque de base.
PCT/KR2017/005492 2017-05-23 2017-05-26 Boîtier de capteur optique et son procédé de fabrication WO2018216834A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170063248A KR20180128142A (ko) 2017-05-23 2017-05-23 광학센서 패키지 및 그 제조 방법
KR10-2017-0063248 2017-05-23

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WO2018216834A1 true WO2018216834A1 (fr) 2018-11-29

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KR (1) KR20180128142A (fr)
WO (1) WO2018216834A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111508903A (zh) * 2019-01-30 2020-08-07 相互股份有限公司 电子装置的封装基板结构及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189627A (ja) * 1996-12-24 1998-07-21 Tokyo Gas Co Ltd 素子、半導体回路基板及びセンサ
US20050285016A1 (en) * 2004-06-29 2005-12-29 Yung-Cheol Kong Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
JP2006194791A (ja) * 2005-01-14 2006-07-27 Denso Corp 赤外線センサ装置
KR20120134080A (ko) * 2011-05-31 2012-12-11 크루셜텍 (주) 포인팅 장치 및 그 제조방법
JP2016524329A (ja) * 2013-06-03 2016-08-12 オプティツ インコーポレイテッド 露出センサアレイを伴うセンサパッケージ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189627A (ja) * 1996-12-24 1998-07-21 Tokyo Gas Co Ltd 素子、半導体回路基板及びセンサ
US20050285016A1 (en) * 2004-06-29 2005-12-29 Yung-Cheol Kong Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
JP2006194791A (ja) * 2005-01-14 2006-07-27 Denso Corp 赤外線センサ装置
KR20120134080A (ko) * 2011-05-31 2012-12-11 크루셜텍 (주) 포인팅 장치 및 그 제조방법
JP2016524329A (ja) * 2013-06-03 2016-08-12 オプティツ インコーポレイテッド 露出センサアレイを伴うセンサパッケージ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111508903A (zh) * 2019-01-30 2020-08-07 相互股份有限公司 电子装置的封装基板结构及其制造方法

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