WO2017146451A1 - Boîtier détecteur de reconnaissance d'empreintes digitales et procédé destiné à la fabrication associé - Google Patents

Boîtier détecteur de reconnaissance d'empreintes digitales et procédé destiné à la fabrication associé Download PDF

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Publication number
WO2017146451A1
WO2017146451A1 PCT/KR2017/001927 KR2017001927W WO2017146451A1 WO 2017146451 A1 WO2017146451 A1 WO 2017146451A1 KR 2017001927 W KR2017001927 W KR 2017001927W WO 2017146451 A1 WO2017146451 A1 WO 2017146451A1
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WO
WIPO (PCT)
Prior art keywords
base substrate
cutting
fingerprint sensor
molding
laser
Prior art date
Application number
PCT/KR2017/001927
Other languages
English (en)
Korean (ko)
Inventor
정지성
심현섭
송용환
허재석
민빈홍
Original Assignee
주식회사 파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 파트론 filed Critical 주식회사 파트론
Publication of WO2017146451A1 publication Critical patent/WO2017146451A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a fingerprint sensor package and a method for manufacturing the same, and relates to a package structure of a fingerprint sensor and a method for manufacturing the fingerprint sensor mounted on an electronic device such as a smart device and used as an identity verification means.
  • the fingerprint sensor package by its nature, has an exposed portion for contacting the fingerprint to be measured.
  • poor coupling of the exposed portion of the sensor package can undermine the overall aesthetics of the electronic device.
  • the fingerprint sensor package is an important factor for miniaturization and thinning of the electronic device.
  • the coupling property of the fingerprint sensor package and the mechanism of the electronic device is improved, the electronic device can be miniaturized.
  • the problem to be solved by the present invention is to provide a fingerprint recognition sensor package excellent in the aesthetics without damage to the coating layer and a method of manufacturing the same.
  • Another object of the present invention is to provide a fingerprint recognition sensor package and a method of manufacturing the same, which are simple in the manufacturing process and excellent in assembly ability and low in manufacturing cost.
  • the fingerprint sensor package of the present invention for solving the above problems, the base substrate, the fingerprint sensor chip mounted on the upper surface of the base substrate and the fingerprint recognition sensor chip and the molding unit covering and sealing the upper surface of the base substrate.
  • the side surface of the base substrate is formed of a cutting surface, and at least a part of the side surface of the molding part is formed of a laser cutting surface.
  • the side of the base substrate and the side of the molding portion may be formed in a continuous surface.
  • the laser cut surface may be formed on the upper side of the molding portion, the lower side of the molding portion may be formed as a cutting surface.
  • the cutting surface formed on the side surface of the base substrate and the cutting surface formed on the lower side of the molding portion is formed with a blade pattern, the blading pattern is a side surface of the base substrate and the molding portion It can be formed continuously on the lower side.
  • the cutting surface may be formed with a blading pattern formed in an intaglio or embossed.
  • the base substrate and the molding portion may further include a bezel portion disposed to surround at least a portion.
  • it may further include a coating layer bonded to the upper surface of the molding.
  • the bezel portion may be electrically connected to the extension circuit board.
  • the extension circuit board may include a ground portion, and the bezel portion may be electrically connected to the ground portion.
  • Method of manufacturing a fingerprint sensor package of the present invention for solving the above problems, the step of providing a base substrate, mounting a fingerprint sensor chip on the upper surface of the base substrate, the fingerprint sensor chip and the base substrate Forming a molding to cover and seal an upper surface, forming a coating layer on an upper surface of the molding portion, cutting at least a portion of an outer portion of the base substrate, and removing at least a portion of an outer portion of the molding portion with a laser. Cutting and removing
  • At least a portion of the outer portion of the base substrate and at least a portion of the lower outer portion of the molding portion may be cut and removed together.
  • the step of removing by cutting with a laser, by irradiating the laser from above to the bottom may be removed by cutting a portion of the coating layer with at least a portion of the outer portion of the molding.
  • the step of removing by cutting with a laser it can be removed by cutting the upper outer portion of the molding portion with a laser.
  • the method may further include coupling a bezel part to surround at least a portion of a cutting surface of the base substrate and a cutting surface of the molding part.
  • the method may further include coupling an extension circuit board to a bottom surface of the base substrate, and the coupling of the extension circuit board may include electrically connecting the bezel part to the extension circuit board. It may include.
  • the step of removing by cutting may be to cut using a blade.
  • the step of bonding the extension circuit board to the lower surface of the base substrate is performed, the step of removing by cutting with a laser, the laser irradiation Forming a protective layer on an upper surface of the extended circuit board facing the cut portion and irradiating the laser from above to below to cut and remove a portion of the coating layer together with at least a portion of an outer portion of the molding part. It may include.
  • Fingerprint sensor package according to an embodiment of the present invention has the advantage that the aesthetics are excellent because there is no damage to the coating layer.
  • the fingerprint sensor package according to an embodiment of the present invention has the advantage that the manufacturing cost is low because the assembly process is simple and excellent assembly.
  • FIG. 1 is a cross-sectional view of a fingerprint sensor package according to an embodiment of the present invention.
  • FIG. 2 is a side view illustrating the side portion of FIG. 1.
  • FIG. 2 is a side view illustrating the side portion of FIG. 1.
  • FIG 3 is a cross-sectional view of a fingerprint sensor package according to an embodiment of the present invention.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a fingerprint sensor package according to an embodiment of the present invention.
  • 5 to 10 is a cross-sectional view of each step of the manufacturing method of the fingerprint sensor package according to an embodiment of the present invention.
  • FIGS. 1 to 3 a fingerprint sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.
  • FIG. 1 is a cross-sectional view of a fingerprint sensor package according to an embodiment of the present invention.
  • the fingerprint sensor package includes a base substrate 100, a fingerprint sensor chip 200, a molding part 300, and a coating layer 400.
  • the base substrate 100 is formed in a flat plate shape.
  • the base substrate 100 may be formed of a printed circuit board (PCB).
  • PCB printed circuit board
  • the base substrate 100 may be a rigid printed circuit board or a flexible printed circuit board, or may be a rigid-flexible PCB in which a rigid portion and a flexible portion are combined. Can be formed.
  • a stiffener may be coupled to a lower portion of the flexible printed circuit board to maintain a shape.
  • the signal pad 110 is formed on the top surface of the base substrate 100.
  • the signal pad 110 may be connected to the fingerprint sensor chip 200 which will be described later.
  • the terminal pad 120 may be formed on the bottom surface of the base substrate 100.
  • the base substrate 100 may be coupled to a circuit board of the electronic device by a LGA (Land Grid Array) method.
  • the fingerprint sensor chip 200 is located on the top surface of the base substrate 100.
  • the fingerprint sensor chip 200 may be formed smaller than the base substrate 100 and positioned at the center of the upper surface of the base substrate 100.
  • the fingerprint sensor chip 200 may be connected to the base substrate 100 in various ways.
  • the fingerprint sensor chip 200 may be connected to the base substrate 100 by a ball grid array (BGA) method.
  • BGA ball grid array
  • solder pads are formed on the bottom surface of the fingerprint sensor chip 200, and the solder balls are positioned between the sensor chip 200 and the base substrate 100, and the solder pads and the base of the fingerprint sensor chip 200 are located thereon.
  • the signal pad 110 of the substrate 100 may be electrically connected.
  • the fingerprint sensor chip 200 may be connected to the base substrate 100 by a wire bonding method.
  • Fingerprint recognition sensor chip 200 may include a transceiver for transmitting and receiving a fingerprint and a signal to be recognized.
  • the transceiver may be formed on an upper surface of the fingerprint sensor chip 200.
  • the transceiver may transmit or receive a signal by directly contacting a fingerprint to be recognized, or may transmit or receive a signal through another intermediate layer.
  • the molding part 300 is positioned on the upper surface of the fingerprint sensor chip 200 at a predetermined thickness. Therefore, the signal between the transceiver and the fingerprint to be recognized is transmitted through the molding unit 300 therebetween.
  • the molding part 300 covers and encapsulates the fingerprint sensor chip 200.
  • the molding part 300 is formed to cover the peripheral portion of the upper surface portion of the base substrate 100 on which the fingerprint sensor chip 200 is mounted.
  • the molding part 300 is formed to directly cover the side and the top surface of the fingerprint sensor chip 200.
  • the molding part 300 may be formed to cover the entire upper surface of the base substrate 100.
  • a portion of the molding part 300 that covers the upper surface of the fingerprint sensor chip 200 may be formed to have a predetermined thickness.
  • This part passes the signal of the transmitter and the receiver, because the signal transmission efficiency is closely related to the thickness of this part.
  • the molding part 300 may be formed to cover the upper surface of the fingerprint recognition sensor chip 200 with a sufficient thickness, and a portion of the upper surface may be removed by a process such as polishing to be processed to the predetermined thickness.
  • the transmission of the signal through the molding part 300 is related to the capacitance on the upper surface of the fingerprint sensor chip 200.
  • the molding part 300 on the upper surface of the fingerprint sensor chip 200 should have a capacitance C or higher than a predetermined level.
  • the capacitance C of any object is determined by the following equation.
  • ⁇ r is the relative dielectric constant of the molding part 300
  • S is the area where the fingerprint is in contact
  • d corresponds to the thickness of the block molding part 300 on the upper surface of the fingerprint recognition sensor chip 200.
  • the area S to which the fingerprint is in contact corresponds to a fixed value, so in order to increase the capacitance C, the material of the molding part 300 is used as having a high relative dielectric constant ⁇ or a fingerprint recognition sensor chip. (200)
  • the thickness d of the block molding part 300 on the upper surface should be reduced.
  • the molding part 300 is preferably formed of a material having a relative dielectric constant of 3.6 or more.
  • the molding part 300 may be formed of an epoxy molding compound material. Epoxy molding compound is widely used products having various dielectric constants, it can be easily found that the relative dielectric constant is 3.6 or more.
  • the coating layer 400 may be formed on the upper surface of the molding part 300.
  • the coating layer 400 may suppress that the upper surface of the molding part 300 is damaged by an external magnetic pole or impact.
  • the coating layer 400 is formed in a very thin film form than the molding part 300 of the upper portion of the sensor chip 200.
  • the coating layer 400 When the coating layer 400 is formed on the upper surface of the molding part 300, signals of the output part and the input part of the sensor chip 200 also pass along the coating layer 400 together with the molding part 300 on the sensor chip 200. Done.
  • the coating layer 400 may be formed to be relatively thin in thickness to smoothly transmit a signal.
  • FIG. 2 is a side view illustrating the side portion of FIG. 1.
  • FIG. 2 Referring to FIG. 2 together with FIG. 1, side surfaces 150 and 350 of the base substrate 100 and the molding part 300 will be described.
  • the molding part 300 may be formed to cover the entire upper surface of the base substrate 100, and the side surface may be formed as a vertically cut surface. Therefore, the side surface 150 of the base substrate and the side surface 350 of the molding part may be formed in a continuous surface with each other, and may be formed in a vertical shape.
  • the side surface 150 of the base substrate may be formed as a cutting surface.
  • the cutting surface means a surface cut by a cutting mechanism such as a blade.
  • the cutting blade may have a cutting blade pattern formed in the cutting surface.
  • the blading pattern refers to a pattern formed in an intaglio or emboss on the cutting surface.
  • the lower side surface 352 adjacent to the side surface 150 of the base substrate of the molding part 350 may be formed as a cutting surface like the side surface 150 of the base substrate. This is formed by cutting together the lower side 352 of the molding part while cutting the base substrate 100. Accordingly, a continuous blading pattern may be formed on the side surface 150 of the base substrate and the lower side surface 352 of the molding part.
  • the upper side 351 adjacent to the coating layer 400 of the side portion 350 may be formed as a laser cut surface.
  • the side surface 450 of the coating layer may also be formed as a laser cut surface.
  • the laser cut surface is a surface cut by the laser irradiated to the cut portion.
  • the cut surface may be formed by melting traces by a laser.
  • cutting surfaces 150 and 352 and the laser cutting surfaces 351 and 450 are preferably formed to be continuous surfaces, a slight step may be formed at the boundary portion due to the tolerance of the cutting and cutting processes.
  • the fingerprint sensor package may include an extension circuit board 600 and a bezel part 500 in addition to the above-described configuration.
  • the extension circuit board 600 may be coupled to the bottom surface of the base substrate 100.
  • the extension circuit board 600 may be electrically connected to the terminal pad 120 on the bottom surface of the base substrate 100 to transmit signals and power.
  • the bezel part 500 is disposed to surround at least a portion of the side surface 350 of the base substrate 100 and the molding part 300.
  • the bezel part 500 may be disposed to be in close contact with the side surface as the cutting surface and the laser cutting surface are continuously formed without being substantially stepped. have.
  • the bezel part 500 may be electrically connected to the ground part of the base substrate 100 or the extension circuit board 600.
  • the base substrate 100 and / or the extension circuit board 600 may include a ground portion, and the bezel portion 500 may be electrically connected to the ground portion by a conductive adhesive member such as silver (Ag) epoxy. Accordingly, the electrical stability of the fingerprint sensor package can be achieved.
  • the method of manufacturing the fingerprint sensor package to be described below corresponds to the method of manufacturing the fingerprint sensor package described above. Therefore, for convenience of description, some of the contents overlapping with the above description will be omitted.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a fingerprint sensor package according to an embodiment of the present invention.
  • the method of manufacturing a fingerprint sensor package includes preparing a base substrate (S100), mounting a fingerprint sensor chip (S200), forming a molding unit (S300), and cutting and removing the base substrate. (S400), combining the extended circuit board (S500), forming a coating layer (S600), cutting with a laser (S700) and bezel portion bonding step (S800).
  • a step (S100) of preparing a base substrate, a step (S200) of mounting a fingerprint sensor chip, and a step of forming a molding unit (S300) are performed.
  • the base substrate 100 and the molding part 300 may be divided into the removal areas 130 and 330 and the remaining area.
  • the removal areas 130 and 330 are areas to be separated and removed by a subsequent process (specifically, a cutting process or a laser cutting process), and the remaining areas are areas forming a finished product.
  • the removal regions 130 and 330 correspond to the outer region, and the remaining region corresponds to the central region surrounded by the removal region.
  • the removal area 330 of the molding part 300 may be formed on the removal area 130 of the base substrate 100, and the remaining area of the molding part 300 may be formed on the remaining area of the base substrate 100. have.
  • Cutting and removal may be performed by a mechanism such as a blade cutter.
  • the removal region 110 corresponding to the outer region of the base substrate 100 and the lower removal region 331 corresponding to the lower outer region of the molding part 300 adjacent thereto are removed.
  • a blading pattern remains on the side surfaces 150 and 352 of the remaining area.
  • the blading pattern has a continuous pattern shape.
  • the extension circuit board 600 is coupled to the bottom surface of the base substrate 100.
  • the extension circuit board 600 may be coupled to the bottom surface of the base substrate 100 by using a surface mounting technology (SMT) method.
  • SMT surface mounting technology
  • a portion of the extended circuit board 600 faces the upper removal region 332 of the molding part 300.
  • a portion of the extended circuit board 600 is opposed to the upper removal region 332 of the molding part 300 with the cut portion removed therebetween.
  • the coating layer 400 is formed on the upper surface of the molding part 300.
  • the coating layer 400 is formed in a very thin film form than the molding of the upper portion of the fingerprint sensor chip 200.
  • Forming a coating layer is preferably formed after the extension circuit board is bonded (S500).
  • the surface mount technology of the extension circuit board 600 is combined with the base substrate 100 to be used. In this process, a high temperature heat treatment is performed, and the coating layer 400 may be damaged during the heat treatment process. Therefore, the coating layer 400 is preferably formed after the heat treatment process is performed.
  • a step (S700) for cutting with a laser In the laser cutting process, the upper removal area 332 of the molding part 300 and a portion 430 of the coating layer formed on the upper surface of the molding part 300 are cut and removed. The laser is irradiated from above from below.
  • the protective layer 610 is formed on the extended circuit board 600.
  • the laser is irradiated from above to below, the laser beam passing through the molding part 300 reaches the extension circuit board 600. Therefore, the extended circuit board 600 may be damaged. Therefore, the upper surface of the extended circuit board 600 facing the laser cut portion of the extended circuit board 600 is covered with the protective layer 610.
  • the protective layer 610 is preferably formed of a metal material or a material having high strength so that the laser does not pass through. When the cutting process by the laser is completed, the protective layer 610 may be removed.
  • a portion of the coating layer 430 and the molding part 300 may be irradiated with a laser. Only the upper removal area 332 is cut and removed.
  • Cutting by irradiating the laser has a disadvantage that the process cost is higher and takes longer than the cutting process.
  • the laser is irradiated and cut for a relatively long time, some regions may be burned or thermally deformed and damaged. Therefore, in the present invention, the cutting surface is minimized through the cutting process before cutting with the laser.
  • a step of coupling the bezel part is included (S800).
  • the bezel part 500 may be electrically connected to the ground part of the base substrate 100 or the extension circuit board 600.
  • the bezel part 500 may be electrically connected to the ground part by a conductive adhesive member 510 such as silver epoxy. Since the electrical connection to the conductive adhesive member 510 does not require a heat treatment process, there is little risk of damaging the already formed coating layer 400.
  • base substrate 150 side of base substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

La présente invention concerne un boîtier détecteur de reconnaissance d'empreintes digitales. Le boîtier détecteur de reconnaissance d'empreintes digitales de la présente invention comprend : un substrat de base; une puce de détecteur de reconnaissance d'empreintes digitales montée sur une surface supérieure du substrat; et une unité de modelage destinée à recouvrir et à sceller la puce de détecteur de reconnaissance d'empreintes digitales et la surface supérieure du substrat de base, les surfaces latérales du substrat de base étant formées comme des surfaces de coupe, et au moins une partie des surfaces latérales de l'unité de modelage sont formées comme une surface de coupe au laser.
PCT/KR2017/001927 2016-02-22 2017-02-22 Boîtier détecteur de reconnaissance d'empreintes digitales et procédé destiné à la fabrication associé WO2017146451A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0020421 2016-02-22
KR1020160020421A KR20170098476A (ko) 2016-02-22 2016-02-22 지문인식 센서 패키지 및 그 제조 방법

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109670372A (zh) * 2017-10-13 2019-04-23 南昌欧菲生物识别技术有限公司 指纹模组

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220056666A (ko) 2020-10-28 2022-05-06 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드

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KR20150095586A (ko) * 2014-02-13 2015-08-21 세이코 인스트루 가부시키가이샤 반도체 장치 및 그 제조 방법
KR101558439B1 (ko) * 2014-04-09 2015-10-12 (주)드림텍 모바일 기기의 지문인식 모듈 제조방법 및 그 지문인식 모듈
KR20160002442A (ko) * 2014-06-30 2016-01-08 (주)드림텍 모바일 기기의 지문인식센서 패키징 방법 및 구조

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KR20130043161A (ko) * 2010-06-18 2013-04-29 오쎈테크, 인코포레이티드 감지 영역 위에 캡슐화 층을 포함하는 핑거 센서 및 관련 방법
KR20140076712A (ko) * 2012-12-13 2014-06-23 (주)파트론 지문인식모듈 및 그 제조방법
KR20150095586A (ko) * 2014-02-13 2015-08-21 세이코 인스트루 가부시키가이샤 반도체 장치 및 그 제조 방법
KR101558439B1 (ko) * 2014-04-09 2015-10-12 (주)드림텍 모바일 기기의 지문인식 모듈 제조방법 및 그 지문인식 모듈
KR20160002442A (ko) * 2014-06-30 2016-01-08 (주)드림텍 모바일 기기의 지문인식센서 패키징 방법 및 구조

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109670372A (zh) * 2017-10-13 2019-04-23 南昌欧菲生物识别技术有限公司 指纹模组

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