WO2017181731A1 - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
WO2017181731A1
WO2017181731A1 PCT/CN2017/000027 CN2017000027W WO2017181731A1 WO 2017181731 A1 WO2017181731 A1 WO 2017181731A1 CN 2017000027 W CN2017000027 W CN 2017000027W WO 2017181731 A1 WO2017181731 A1 WO 2017181731A1
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WO
WIPO (PCT)
Prior art keywords
substrate
sensing
rotating shaft
processing apparatus
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/000027
Other languages
English (en)
French (fr)
Inventor
彭伟刚
周伟
谢呈男
杨玉
林己燮
袁晨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/545,441 priority Critical patent/US10049906B1/en
Publication of WO2017181731A1 publication Critical patent/WO2017181731A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Definitions

  • the present invention relates to the field of display device manufacturing, and in particular to a substrate processing device.
  • the substrate is fed into a processing chamber of the substrate processing apparatus, and then the processing liquid is sprayed toward the substrate by a shower mechanism.
  • a sensor is disposed within the processing chamber of the substrate processing apparatus for sensing whether the substrate enters the processing chamber.
  • the sensor Since the sensor is disposed inside the processing chamber, it is possible to spray the processing liquid onto the sensor when spraying the processing liquid onto the substrate, causing the sensor to malfunction.
  • the present invention provides a substrate processing apparatus for sensing a substrate and is not susceptible to malfunction.
  • the present invention provides a substrate processing apparatus including a processing chamber and a substrate sensing component, the substrate processing apparatus further comprising:
  • a rotating shaft a part of the rotating shaft is disposed in the processing chamber, and the remaining portion is disposed outside the processing chamber, and the substrate sensing component is disposed on a portion of the rotating shaft disposed outside the processing chamber;
  • the driving assembly rotates the rotating shaft about a first axis in a first direction when contacting the substrate, and the substrate sensing component emits a signal indicating that the substrate enters the rotation when the rotating shaft is sensed to rotate in a first direction Processing a first sensing signal in the cavity;
  • the drive assembly rotates the rotating shaft about a second axis thereof in a second direction opposite to the first direction when the substrate changes from contacting the driving assembly to not contacting the driving assembly, the substrate sensing component
  • the first sensing signal is stopped when the rotation of the rotating shaft in the second direction is sensed.
  • the substrate sensing component may include a substrate sensing sensor and a sensing sheet, and one of the substrate sensing sensor and the sensing sheet is configured to rotate with rotation of the rotating shaft, The other of the substrate sensing sensor and the sensing sheet is stationary with respect to the processing chamber;
  • the substrate sensing sensor and the sensing sheet are close to each other such that the sensing sheet enters a sensing range of the substrate sensing sensor, and the substrate
  • the sensing sensor sends the first sensing signal
  • the substrate sensing sensor and the sensing sheet are apart from each other such that the sensing sheet leaves the sensing range of the substrate sensing sensor, and the substrate The sensing sensor stops emitting the first sensing signal.
  • the substrate sensing assembly may further include a mounting bracket that is stationary with respect to the processing chamber, the substrate sensing sensor and the sensing sheet being stationary relative to the processing chamber One of the ones is fixedly disposed on the mounting bracket.
  • the substrate sensing sensor may be stationary with respect to the processing chamber, and the sensing sheet may be fixedly disposed on the rotating shaft to rotate with rotation of the rotating shaft.
  • the substrate sensing sensor may be disposed on the mounting bracket, and the sensing sheet is disposed on the rotating shaft.
  • the substrate sensing sensor is disposed on the mounting bracket, the sensing sheet is fixedly disposed on the rotating shaft, and the substrate processing apparatus may further include an initial position sensing sensor.
  • the initial position sensing sensor is disposed on the mounting bracket, and the initial position sensing sensor and the substrate sensing sensor are respectively located at two ends of the motion track of the sensing sheet, when the driving component is not in contact with the substrate
  • the driving assembly fixes the rotating shaft at an initial position such that the sensing piece is within a sensing range of the initial position sensing sensor, and when the sensing piece is located at the
  • the initial position sensor emits a second sensing signal when the sensing position of the initial position sensor is within.
  • the substrate sensing sensor includes a first groove
  • the initial position sensor includes a second groove
  • one end of the sensing piece enters when the driving component is in contact with the substrate
  • the first groove enters the second groove when the driving component is not in contact with the substrate.
  • the sensing sheet has a fan ring shape
  • the substrate processing apparatus further includes a support rod, one end of the support rod is fixedly disposed on the rotating shaft, and the other end of the supporting rod is fixedly disposed.
  • the substrate processing apparatus further includes a weight stop located within the processing chamber and disposed under the lever, the weight stop for stopping when the contact is not in contact with the substrate
  • the lever is provided with one end of the weight to move.
  • the distance between the weight and the junction of the lever with the rotating shaft is less than the distance of the contact and the joint of the lever with the rotating shaft.
  • the contact includes a roller that can roll as the substrate contacts the outer surface of the roller and presses the lever down.
  • the weight stop includes a stop lever
  • the substrate processing apparatus further includes a mounting rod, one end of the mounting rod is provided with the stopper rod, and the mounting rod is further One end is used to secure the mounting rod within the processing chamber, and the mounting rod and the stop rod are perpendicular to each other.
  • the substrate processing apparatus may further include an adjustment mechanism, the mounting rod being a telescopic rod, the adjustment mechanism including an operation portion and an execution portion, the execution portion being coupled to the mounting rod and Between the operating portions, the operating portion is disposed outside the processing chamber such that a force applied to the operating portion is transmitted to the The rod is mounted to control the length or shortening of the mounting rod.
  • the mounting rod being a telescopic rod
  • the adjustment mechanism including an operation portion and an execution portion, the execution portion being coupled to the mounting rod and Between the operating portions, the operating portion is disposed outside the processing chamber such that a force applied to the operating portion is transmitted to the The rod is mounted to control the length or shortening of the mounting rod.
  • the substrate processing apparatus may further include a controller and a shower mechanism disposed in the processing chamber, the controller configured to receive the first sensing When the signal is signaled, the shower mechanism is controlled to spray.
  • the substrate processing apparatus further includes a controller and a shower mechanism disposed within the processing chamber, the controller configured to receive the second sensing signal When the spraying mechanism is controlled to stop spraying.
  • the substrate processing apparatus may further include a plurality of transmission shafts disposed within the processing chamber, the rotation shaft being disposed between two adjacent transmission shafts.
  • the rotating shaft has a rod shape, and at least one of the two ends of the rotating shaft is disposed outside the processing chamber.
  • the processing liquid does not affect the substrate sensing sensor.
  • the substrate sensing sensor fails, it can be found in time, and the substrate sensing sensor can be conveniently replaced, thereby avoiding the phenomenon of equipment outage, lamination, fragmentation, etc. caused by the substrate sensing sensor failure.
  • FIG. 1 is a schematic structural diagram of a substrate processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of a substrate sensing assembly including a mounting bracket, wherein the sensing sheet is in an initial state
  • FIG. 3 is a schematic view of a substrate sensing assembly including a mounting bracket, wherein the sensing sheet is in a final state;
  • FIG. 5 is a schematic diagram of the sensing range of the sensing sheet entering the substrate sensing sensor
  • FIG. 6 is a diagram showing a transmission shaft and a rotation in a substrate processing apparatus according to an embodiment of the present invention. Schematic diagram of the positional relationship between the moving axes.
  • a substrate processing apparatus including a processing chamber and a substrate sensing assembly, wherein, as shown in FIG. 1, the substrate processing apparatus further includes a rotating shaft 300 and a driving assembly 400.
  • a part of the rotating shaft 300 is disposed in the processing chamber (in FIG. 1, two broken lines indicate the boundary of the processing chamber, and a portion between the broken lines is the inside of the processing chamber), and both ends of the rotating shaft 300 are At least one of the plurality extends to the exterior of the processing chamber.
  • the substrate sensing component is disposed on the rotating shaft 300 and located outside the processing chamber.
  • the drive assembly 400 is fixed to a portion of the rotating shaft 300 located inside the processing chamber.
  • the driving assembly 400 can drive the rotating shaft 300 to rotate in a first direction about its own axis when it touches the substrate to be processed, and the substrate sensing component when the rotating shaft 300 rotates through the first angle in the first direction A first sensing signal indicative of the substrate entering the processing chamber can be emitted.
  • the drive assembly 400 can also rotate the rotating shaft 300 about its own axis in a second direction opposite to the first direction when the substrate changes from contacting the drive assembly 400 to not contacting the drive assembly 400.
  • the substrate sensing component stops emitting the first sensing signal when the rotating shaft 300 is rotated through the second angle in the second direction.
  • the first direction may be a clockwise direction or a counterclockwise direction, which is related to the transport direction of the substrate.
  • first direction is clockwise
  • second direction is counterclockwise, and vice versa.
  • the first angle and the second angle are predetermined angles, which may be equal to each other or may not be equal to each other.
  • the driving assembly 400 drives the rotating shaft 300 to rotate in a first direction about the axis thereof.
  • the substrate sensing component transmits the first sensing signal.
  • a controller for controlling the spray mechanism The controller controls the sprinkler mechanism to start spraying the treatment liquid after receiving the sensing signal. Since the substrate sensing component is disposed outside the processing chamber, the processing liquid is not sprayed onto the substrate sensing component, and the substrate sensing component does not cause a defect due to the processing liquid, thereby improving the substrate processing apparatus. Service life.
  • the substrate processing apparatus has the following advantages: since the substrate sensing component is disposed outside the processing chamber, when the substrate sensing component fails, it can be timely It is found that the faulty substrate sensing component can be easily replaced, so that the device outage, lamination, fragmentation and the like caused by the failure of the substrate sensing component can be avoided.
  • the specific structure of the substrate sensing assembly is not particularly limited.
  • the substrate sensing assembly may include an angle sensor for measuring an angle at which the rotating shaft 300 is rotated.
  • the substrate sensing component includes a substrate sensing sensor 110 and a sensing sheet 200.
  • One of the substrate sensing sensor 110 and the sensing sheet 200 is set to rotate with the rotation of the rotating shaft 300, and the other of the substrate sensing sensor 110 and the sensing sheet 200 is stationary with respect to the processing chamber.
  • one of the substrate sensing sensor 110 and the sensing sheet 200 may be fixedly attached to the rotating shaft 300.
  • the substrate sensing sensor 110 and the sensing sheet 200 are close to each other such that the sensing sheet 200 enters the sensing range of the substrate sensing sensor 110, and the substrate sensing sensor 110 issues the The first sensing signal.
  • the substrate sensing sensor 110 and the sensing sheet 200 are apart from each other such that the sensing sheet 200 leaves the sensing range of the substrate sensing sensor 110, and the substrate sensing sensor 110 stops emitting.
  • the first sensing signal is described.
  • the substrate sensing sensor 110 and the sensing sheet 200 are low in cost and easy to mount, and therefore, the overall cost of the substrate processing apparatus can be reduced by using the substrate sensing assembly including the substrate sensing sensor 110 and the sensing sheet 200.
  • the substrate sensing component may further include a mounting bracket 500, the mounting bracket 500 is statically disposed with respect to the processing chamber, and the substrate sensing sensor 110 and the sensing sheet 200 are opposite to each other.
  • One of the stationary chambers It is set on the mounting bracket 500.
  • the substrate sensing sensor 110 Since the signal transmission line is connected to the substrate sensing sensor 110, in order to prevent the signal transmission line of the substrate sensing sensor 110 from being caught or pulled, in some exemplary embodiments, the substrate sensing sensor 110 is stationary with respect to the processing cavity, and the sensing sheet 200 The rotating shaft 300 rotates. Accordingly, the substrate sensing sensor 110 is fixedly disposed on the mounting bracket 500, and the sensing sheet 200 is disposed on the rotating shaft 300.
  • the substrate processing apparatus further includes an initial position sensing sensor 120 fixedly disposed on the mounting bracket 500, and the initial position sensing sensor 120 and the substrate sensing
  • the sensors 110 are respectively located at both ends of the motion track of the sensor sheet 200.
  • the initial position sensing sensor 120 and the substrate sensing sensor 110 may be located on both sides of the sensor mounting bracket, respectively.
  • the driving assembly 400 can fix the rotating shaft 300 such that the sensing sheet 200 is located within the sensing range of the initial position sensing sensor 120, and when the sensing sheet 200 is located within the sensing range of the initial position sensor 120
  • the initial position sensor 120 is capable of emitting a second sensing signal.
  • the sensing sheet 200 When the driving component is not in contact with the substrate, as shown in FIG. 2, the sensing sheet 200 is located within the sensing range of the initial external sensor 120. At this time, the initial position sensor 120 may generate a second indicating that the substrate is not present in the processing chamber. Perceive the signal.
  • the sensing sheet 200 When the driving component is in contact with the substrate, as shown in FIG. 3, the sensing sheet 200 is located within the sensing range of the substrate sensing sensor 110. At this time, the substrate sensing sensor 110 can generate a first sensing signal indicating that the substrate exists in the processing cavity.
  • the controller When the controller receives the second sensing signal sent by the initial position sensing sensor 120, it can be concluded that there is no substrate in the processing chamber at this time, so that the spraying mechanism can be controlled to stop spraying the processing liquid.
  • the specific structure of the substrate sensing sensor 110 and the initial position sensor 120 is not particularly limited.
  • the substrate sensing sensor 110 includes a first recess 110a into which one end of the sensing sheet 200 can enter.
  • the initial position sensor includes a second groove into which the other end of the sensing piece 200 can enter.
  • the driving component 400 is driven.
  • the rotating shaft 300 is in the initial position, and one end of the sensing piece 200 is inserted into the second groove.
  • the rotating shaft 300 is rotated by the driving assembly 400, and the other end of the sensing sheet 200 is inserted into the first recess, as shown in FIG.
  • the substrate processing apparatus further includes a support rod 140.
  • One end of the support rod 140 is fixedly disposed on the rotating shaft 300, and the sensing sheet 200 is fixedly disposed at the other end of the supporting rod 140.
  • the extension line of the support rod 140 intersects the axis of the rotating shaft 300, and the center of the sensing piece 200 is located on the support rod 140.
  • the specific structure of the driving assembly 400 is not particularly limited.
  • the driving assembly 400 includes a lever 410, a weight 420 disposed at one end of the lever 410, and a The contact 430 at the other end of the lever 410.
  • the substrate processing apparatus further includes a weight stop 600 disposed below the rotating shaft 300 and located within the processing chamber.
  • the lever 410 is disposed on the rotating shaft 300 and is rotatable about the axis of the rotating shaft 300 with the rotating shaft 300.
  • the contact member 430 is for contacting the substrate. When the contact member 430 is not in contact with the substrate, a portion of the lever 410 provided with one end of the weight 420 and a portion where the lever 410 and the rotating shaft 300 are connected may be supported at the counterweight.
  • On the stop 600 On the stop 600.
  • the substrate to be processed enters the processing chamber, when it contacts the contact 430 on the lever 410, the forward movement of the substrate pushes down the contact 430 on the lever. Since the lever is fixed to the rotating shaft 300, the rotation of the lever will drive the rotating shaft 300 to rotate about its own axis, and the substrate sensing unit emits the first sensing signal when the rotating shaft 300 rotates through the predetermined angle.
  • the rotation of the rotating shaft 300 drives one of the sensing sheet 200 and the substrate sensing sensor 110 to move, so that the sensing sheet 200 and the substrate sensing sensor 110 The distance between the two gradually decreases, and finally the sensing sheet 200 enters the sensing range of the substrate sensing sensor 110.
  • the rotation of the substrate can drive the rotation of the drive assembly 400 of the above form without Other power sources for power supply are required, and therefore, the use of the drive assembly 400 having the above structure can reduce power consumption.
  • the distance between the weight 420 and the junction of the lever 410 and the rotating shaft 300 is smaller than the distance between the contact 430 and the joint of the lever 410 with the rotating shaft 300, so that the contact can be improved.
  • the stroke of the 430 after contacting the substrate reduces the probability that the driving assembly erroneously drives the rotating shaft 300, thereby improving the stability and accuracy of the detecting substrate.
  • the contact 430 may include a roller, and the roller can contact the outer surface of the substrate and press the lever 410 Scroll when.
  • the specific structure of the weight stopper 600 is not particularly limited.
  • the weight stopper 600 includes a stopper lever, and the substrate processing apparatus further
  • a mounting bar 610 may be included, with a counterweight stop 600 in the form of a stop bar disposed at one end of the mounting bar 610, and the other end of the mounting bar 610 for mounting within the processing chamber.
  • the mounting rod 610 and the weight stop 600 are perpendicular to each other. In the initial state, one end of the setting weight 420 of the lever 410 abuts against the weight stop 600.
  • the mounting rod 610 is a telescopic rod
  • the substrate processing apparatus further includes an adjustment mechanism 700 including an operation portion 710 and an execution portion 720, the execution portion and the The mounting rods are connected to adjust the length of the mounting rod 610, and the operating portion is disposed outside the processing chamber for operating the executing portion.
  • the mounting rod 610 may include a cylinder
  • the operating portion 710 of the adjusting mechanism 700 may include a pneumatic valve.
  • the executing portion 720 of the adjusting structure 710 may include a pipe. By operating the operating portion 710, the guiding rod 610 and the guide of the air source may be controlled. The through state and the expansion and contraction of the mounting rod 610 are controlled to control the height of the weight stop 600.
  • the substrate sensing device further includes two bearings 800. Two bearings 800 are respectively sleeved at both ends of the rotating shaft 300, and the sensing piece 200 and the substrate sensing sensor 110 are located outside the bearing 800 on the same side of the sensing piece 200 and the substrate sensing sensor.
  • the substrate processing apparatus further includes a controller and a shower mechanism
  • the shower mechanism includes a shower head
  • the shower head is disposed in the processing chamber
  • an output end of the controller is The control end of the shower mechanism is connected
  • the input end of the controller is connected to the output end of the substrate sensing component, and when the controller receives the first sensing signal of the substrate sensing component, the The control end of the spray mechanism sends a first control signal to control the spray mechanism to spray.
  • the substrate processing apparatus further includes the initial position sensing sensor
  • an input end of the controller is connected to an output end of the substrate sensing component, and when the controller receives the second sensing signal, The spray mechanism sends a second control signal to control the spray mechanism to stop spraying.
  • the substrate processing apparatus includes a plurality of transmission shafts 900 disposed in the processing chamber, and the rotating shaft 300 is disposed in two adjacent transmissions. Between the shafts 900. A transfer wheel 910 is disposed on the transmission shaft 900, and the transmission shaft 900 is rotatable about its own axis to transfer the substrate entering the processing chamber to the outside of the processing chamber.
  • the rotating shaft 300 is disposed between the two transmission shafts 900.
  • the sensing sheet 200 When the substrate does not enter the processing chamber, under the action of the weight, the sensing sheet 200 is located within the sensing range of the initial position sensor 120, and the initial position sensor 120 sends a second sensing signal to the controller, and the controller controls the spraying.
  • the assembly does not spray the treatment fluid.
  • the rotation of the transmission shaft 900 causes the substrate to move in the direction indicated by the arrow in FIG.
  • the contact member 430 When the substrate contacts the contact 430 on the driving assembly, the contact member 430 is pressed downward, and drives the rotating shaft 300 to rotate around the axis in the first direction, and drives the sensing sheet 200 to move toward the substrate sensing sensor 110 until the substrate is entered.
  • the sensing range of the sensor 110 is sensed.
  • the substrate sensing sensor 110 sends a first sensing signal to the controller, and controls the spraying mechanism to spray the processing liquid into the processing chamber.
  • the transmission shaft 900 drives the substrate to continue to move in the direction of the arrow.
  • the weight 420 rotates the rotating shaft 300 counterclockwise and drives the sensing piece.
  • the 200 moves toward the initial position sensor 120.
  • the sensing piece 200 completely reaches the sensing range of the initial position sensor 120, the initial position sensor 120 sends a second sensing signal to the controller, and the controller controls the spraying mechanism to stop spraying.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Physical Vapour Deposition (AREA)
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Abstract

一种基板处理装置，包括处理腔、基板感知组件、转动轴(300)和驱动组件(400)，转动轴(300)的一部分设置在处理腔内，其余部分设置在处理腔外，基板感知组件设置在转动轴(300)的设置在处理腔外的部分上；驱动组件(400)固定在转动轴(300)位于处理腔内的部分上；驱动组件(400)能够在接触到待处理的基板时带动转动轴(300)绕自身轴线沿第一方向转动，基板感知组件在感知到转动轴(300)沿第一方向的转动时发出表示基板进入处理腔内的第一感知信号，驱动组件(400)能够在基板离开驱动组件(400)时带动转动轴(300)绕自身轴线沿与第一方向相反的第二方向转动，基板感知组件在感知到转动轴(300)沿第二方向的转动时停止发出第一感知信号。由于基板感知组件设置在处理腔的外部，因此，处理液不会对基板感知组件造成影响。

Description

基板处理装置 技术领域
本发明涉及显示装置制造领域，具体地，涉及一种基板处理装置。
背景技术
在制造显示装置时，需要对基板进行清洗、显影等工艺。在执行上述工艺时，将基板送入基板处理设备的处理腔中，然后利用喷淋机构朝基板喷涂处理液。通常，基板处理设备的处理腔内设置有传感器，该传感器用于感应基板是否进入处理腔。
由于传感器设置在处理腔内部，因此，向基板喷涂处理液时有可能会将处理液喷洒在传感器上，导致传感器失灵。
因此，如何避免传感器失灵成为本领域亟待解决的技术问题。
发明内容
本发明提供一种基板处理装置，所述基板感应装置用于感应基板，且不易失灵。
为了实现上述目的，本发明提供一种基板处理装置，包括处理腔和基板感知组件，所述基板处理装置还包括：
转动轴，所述转动轴的一部分设置在所述处理腔内，其余部分设置在所述处理腔外，所述基板感知组件设置在所述转动轴的设置在所述处理腔外的部分上；和
驱动组件，所述驱动组件固定在所述转动轴的位于所述处理腔内的部分上；
所述驱动组件在接触到基板时带动所述转动轴绕自身轴线沿第一方向转动，所述基板感知组件在感知到所述转动轴沿第一方向的转动时发出表示所述基板进入所述处理腔内的第一感知信号；
所述驱动组件在所述基板从接触所述驱动组件变为不接触所述驱动组件时带动所述转动轴绕自身轴线沿与所述第一方向相反的第二方向转动，所述基板感知组件在感知到所述转动轴沿第二方向的转动时停止发出所述第一感知信号。
在一些示例性实施例中，所述基板感知组件可包括基板感知传感器和感应片，所述基板感知传感器和所述感应片中的一者设置为随所述转动轴的转动而转动，所述基板感知传感器和所述感应片中的另一者相对于所述处理腔静止设置；
当所述转动轴沿所述第一方向转过第一角度时，所述基板感知传感器和所述感应片互相接近以使得所述感应片进入所述基板感知传感器的感知范围，且所述基板感知传感器发出所述第一感知信号；
当所述转动轴沿所述第二方向转过第二角度时，所述基板感知传感器和所述感应片互相远离以使得所述感应片离开所述基板感知传感器的感知范围，并且所述基板感知传感器停止发出所述第一感知信号。
在一些示例性实施例中，所述基板感知组件还可包括安装架，所述安装架相对于所述处理腔静止设置，所述基板感知传感器和所述感应片中相对于所述处理腔静止的一者固定设置在所述安装架上。
在一些示例性实施例中，所述基板感知传感器可相对于所述处理腔静止设置，所述感应片可固定地设置在所述转动轴上从而随所述转动轴的转动而转动。
在一些示例性实施例中，所述基板感知传感器可设置在所述安装架上，所述感应片设置在所述转动轴上。
在一些示例性实施例中，所述基板感知传感器设置在所述安装架上，所述感应片固定地设置在所述转动轴上，并且所述基板处理装置还可包括初始位置感应传感器，所述初始位置感应传感器设置在所述安装架上，且所述初始位置感应传感器与所述基板感知传感器分别位于所述感应片的运动轨迹的两端，当所述驱动组件与所述基板不接触时，所述驱动组件将所述转动轴固定在使得所述感应片位于所述初始位置感应传感器的感知范围内的初始位置，且当所述感应片位于所 述初始位置传感器的感知范围内时，所述初始位置传感器发出第二感知信号。
在一些示例性实施例中，所述基板感知传感器包括第一凹槽，所述初始位置传感器包括第二凹槽，当所述驱动组件与所述基板接触时，所述感应片的一端进入所述第一凹槽，当所述驱动组件与所述基板不接触时，所述感应片的另一端进入所述第二凹槽。
在一些示例性实施例中，所述感应片具有扇环形，所述基板处理装置还包括支撑杆，所述支撑杆的一端固定设置在所述转动轴上，所述支撑杆的另一端固定设置有所述感应片，且所述支撑杆的延长线穿过所述旋转轴的轴线，所述感应片的圆心位于所述支撑杆上。
在一些示例性实施例中，所述驱动组件包括固定连接在所述转动轴上的杠杆、设置在所述杠杆一端的配重和设置在所述杠杆的另一端的接触件，所述杠杆用于当所述接触件与所述基板接触时带动所述转动轴绕该转动轴的轴线转动；
所述基板处理装置还包括位于处理腔内并设置在所述杠杆下方的配重止挡件，所述配重止挡件用于当所述接触件不与所述基板接触时，止挡所述杠杆设置有配重的一端运动。
在一些示例性实施例中，所述配重与所述杠杆同所述转动轴的连接处之间的距离小于所述接触件与所述杠杆同所述转动轴的连接处的距离。
在一些示例性实施例中，所述接触件包括滚轮，所述滚轮能在所述基板接触所述滚轮外表面并将所述杠杆压下时滚动。
在一些示例性实施例中，所述配重止挡件包括止挡杆，所述基板处理装置还包括安装杆，所述安装杆的一端设置有所述止挡杆，所述安装杆的另一端用于将所述安装杆固定在所述处理腔内，所述安装杆和所述止挡杆互相垂直。
在一些示例性实施例中，所述基板处理装置还可包括调节机构，所述安装杆为可伸缩杆，所述调节机构包括操作部和执行部，所述执行部连接在所述安装杆和所述操作部之间，所述操作部设置在所述处理腔外部，以使得施加给所述操作部的力通过所述执行部传递至所述 安装杆，从而控制所述安装杆伸长或缩短。
在一些示例性实施例中，所述基板处理装置还可包括控制器和喷淋机构，所述喷淋机构设置在所述处理腔内，所述控制器配置为在接收到所述第一感知信号时，控制所述喷淋机构进行喷淋。
在一些示例性实施例中，所述基板处理装置还包括控制器和喷淋机构，所述喷淋机构设置在所述处理腔内，所述控制器配置为在接收到所述第二感知信号时，控制所述喷淋机构停止喷淋。
在一些示例性实施例中，所述基板处理装置还可包括设置在所述处理腔内的多个传输轴，所述转动轴设置在相邻两根所述传输轴之间。
在一些示例性实施例中，所述转动轴具有杆形，并且所述转动轴的两个端部中的至少一个设置在所述处理腔外。
在本发明实施例所提供给的基板处理装置中，由于基板感知传感器和感应片均设置在处理腔的外部，因此，处理液不会对基板感知传感器造成影响。除此之外，一旦基板感知传感器发生故障，可以及时发现，并且可以方便地对基板感知传感器进行更换，从而可以避免因基板感知传感器故障造成的设备停运、叠片、破片等现象。
附图说明
附图是用来提供对本发明实施例的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1是本发明实施例所提供的基板处理装置的结构示意图；
图2是包括有安装架的基板感知组件的示意图，其中，所述感应片处于初始状态；
图3是包括有安装架的基板感知组件的示意图，其中，所述感应片处于最终状态；
图4是感应片未进入基板感知传感器的感知范围的示意图；
图5是感应片进入基板感知传感器的感知范围的示意图；
图6是展示本发明实施例所提供的基板处理装置中传输轴与转 动轴之间位置关系的示意图。
具体实施方式
以下结合附图对本发明实施例的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
作为本发明的一个方面，提供一种基板处理装置，所述基板处理装置包括处理腔和基板感知组件，其中，如图1所示，所述基板处理装置还包括转动轴300和驱动组件400。
转动轴300的一部分设置在所述处理腔内(图1中，两条虚线所示的是处理腔的边界，虚线之间的部分即为处理腔内部)，转动轴300的两个端部中的至少一个延伸至所述处理腔外部。所述基板感知组件设置在转动轴300上，且位于所述处理腔的外部。
如图1中所示，驱动组件400固定在转动轴300位于所述处理腔内部的部分上。
驱动组件400能够在其自身接触到待处理的基板时带动转动轴300绕自身轴线沿第一方向转动，且当转动轴300沿所述第一方向转过第一角度时，所述基板感知组件能够发出表示所述基板进入所述处理腔的第一感知信号。
除此之外，驱动组件400还能够在基板从接触该驱动组件400变为不接触该驱动组件400时带动转动轴300绕自身轴线沿与第一方向相反的第二方向转动。当转动轴300沿第二方向转过第二角度时，所述基板感知组件停止发出所述第一感知信号。
在本申请中，第一方向可以是顺时针方向，也可以是逆时针方向，这与基板的传输方向有关。当第一方向为顺时针方向时，第二方向则为逆时针方向，反之亦然。第一角度和第二角度为预定的角度，它们可以彼此相等，也可以彼此不相等。
当有基板接触驱动组件400时，该驱动组件400带动转动轴300绕自身轴线沿第一方向旋转，当旋转轴300转过第一角度后，所述基板感知组件将所述第一感知信号发送给控制喷淋机构喷淋的控制器， 该控制器在接收到传感信号后控制喷淋机构开始喷淋处理液。由于所述基板感知组件设置在处理腔的外部，因此，处理液不会喷到所述基板感知组件上，基板感知组件也不会因为处理液而发生不良，从而可以提高所述基板处理装置的使用寿命。
除了具有较长的使用寿命这一优点外，所述基板处理装置还具有以下优点：由于所述基板感知组件设置在所述处理腔外部，因此，当所述基板感知组件发生故障，可以及时被发现，并且可以方便地更换发生故障的基板感知组件，从而可以避免因所述基板感知组件故障造成的设备停运、叠片、破片等现象。
在本发明中，对所述基板感知组件的具体结构并没有特殊的限制，例如，所述基板感知组件可以包括用于测量转动轴300转过的角度的角度传感器。
作为本发明的一种实施方式，所述基板感知组件包括基板感知传感器110和感应片200。基板感知传感器110和感应片200中的一者设置为随转动轴300的转动而转动，基板感知传感器110和感应片200中的另一者相对于所述处理腔静止设置。例如，基板感知传感器110和感应片200中的一者可固定地附接在转动轴300上。
当转动轴300沿所述第一方向转过第一角度时，基板感知传感器110和感应片200互相接近以使得该感应片200进入基板感知传感器110的感知范围，且基板感知传感器110发出所述第一感知信号。
当转动轴300沿所述第二方向转过第二角度时，基板感知传感器110和感应片200互相远离以使得该感应片200离开基板感知传感器110的感知范围，并且基板感知传感器110停止发出所述第一感知信号。
所述基板感知传感器110和感应片200成本较低，并且便于安装，因此，利用包括基板感知传感器110和感应片200的基板感知组件可以降低所述基板处理装置的总体成本。
为了便于安装，作为本发明的一种实施方式，所述基板感知组件还可以包括安装架500，该安装架500相对于所述处理腔静止设置，基板感知传感器110和感应片200中相对于所述处理腔静止的一者固 定设置在安装架500上。
由于基板感知传感器110上连接有信号传输线，因此，为了防止基板感知传感器110的信号传输线被挂住或拉扯，在一些示例性实施例中，基板感知传感器110相对于处理腔静止，感应片200随转动轴300转动。相应地，基板感知传感器110固定地设置在安装架500上，感应片200设置在转动轴300上。
作为本发明的一种实施方式，为了便于监控，所述基板处理装置还包括初始位置感应传感器120，该初始位置感应传感器120固定地设置在安装架500上，且初始位置感应传感器120与基板感知传感器110分别位于感应片200的运动轨迹的两端。例如，初始位置感应传感器120与基板感知传感器110可分别位于所述传感器安装架的两侧。当驱动组件400不与基板接触时，驱动组件400可以将转动轴300固定在使得感应片200位于初始位置感应传感器120的感知范围内，且当感应片200位于初始位置传感器120的感知范围内时，该初始位置传感器120能够发出第二感知信号。
当所述驱动组件不与基板接触时，如图2所示，感应片200位于初始外置传感器120的感知范围内，此时，初始位置传感器120可以产生表示处理腔内不存在基板的第二感知信号。当驱动组件与基板接触时，如图3所示，感应片200位于基板感知传感器110的感知范围内，此时，基板感知传感器110可以产生表示处理腔内存在基板的第一感知信号。
当控制器接收到初始位置感应传感器120发送的第二感知信号时可以断定此时处理腔内并没有基板，从而可以控制喷淋机构停止喷淋处理液。
在本发明中，对基板感知传感器110和初始位置传感器120的具体结构并不做特殊的限定。例如，如图4和图5所示，基板感知传感器110包括第一凹槽110a，感应片200的一端能够进入所述第一凹槽。类似地，所述初始位置传感器包括第二凹槽，感应片200的另一端能够进入所述第二凹槽。
如图2所示，当处理腔内没有基板时，在驱动组件400的带动 下，转动轴300处于初始位置，并且感应片200的一端插入第二凹槽中。当处理腔内有基板时，在驱动组件400的带动下，转动轴300旋转，并使得感应片200的另一端插入第一凹槽中，如图3所示。
由于感应片200的运动轨迹是圆弧形的，为了便于使得感应片200分别进入到初始位置传感器120以及基板感知传感器110的感知范围，在一些示例性实施例中，如图2和图3所示，感应片120形成为扇环形，相应地，所述基板处理装置还包括支撑杆140，该支撑杆140的一端固定设置在转动轴300上，感应片200固定设置在支撑杆140的另一端，且支撑杆140的延长线与旋转轴300的轴线相交，感应片200的圆心位于支撑杆140上。
在本发明中，对驱动组件400的具体结构并没有特殊的限制，例如，在图1所示的实施方式中，驱动组件400包括杠杆410、设置在该杠杆410一端的配重420和设置在杠杆410另一端的接触件430。所述基板处理装置还包括配重止挡件600，该配重止挡件600设置在转动轴300的下方，并且位于所述处理腔内。杠杆410设置在转动轴300上，且能够随转动轴300绕该转动轴300的轴线转动。接触件430用于与所述基板接触，当接触件430不与基板接触时，杠杆410的设置有配重420的一端与杠杆410与转动轴300相连处之间的部分可以支撑在配重止挡件600上。
当待处理的基板进入所述处理腔中时，接触到杠杆410上的接触件430时，基板的向前移动会将杠杆上的接触件430压低。由于杠杆固定在转动轴300上，因此，杠杆的转动将带动转动轴300绕自身轴线转动，当转动轴300转过所述预定角度时，所述基板感知组件发出所述第一感知信号。
在所述基板感知组件包括感应片200和基板感知传感器110的实施方式中，转动轴300的转动带动感应片200和基板感知传感器110中的一者移动，使得感应片200与基板感知传感器110之间的距离逐渐减小，并最终使得感应片200进入基板感知传感器110的感知范围。
利用基板的移动即可带动上述形式的驱动组件400的转动，无 需其他提供动力的动力源，因此，使用具有上述结构的驱动组件400可以降低能耗。
在一些示例性实施例中，配重420与杠杆410同转动轴300的相连处之间的距离小于接触件430与该杠杆410同转动轴300的相连处之间的距离，从而可以提高接触件430在接触到基板后的行程，减少驱动组件误驱动转动轴300的概率，从而可以提高检测基板的稳定性和准确性。
为了减小基板与杠杆组件之间的摩擦力并且防止基板被刮伤，在一些示例性实施例中，接触件430可以包括滚轮，并且该滚轮能够在基板接触其外表面并将杠杆410压下时滚动。
在本发明中，对配重止挡件600的具体结构并没有特殊的限制，在图1中所示的具体实施方式中，配重止挡件600包括止挡杆，所述基板处理装置还可以包括安装杆610，形式为止挡杆的配重止挡件600设置在安装杆610的一端，安装杆610的另一端用于安装在所述处理腔内。安装杆610与配重止挡件600互相垂直。在初始状态中，杠杆410的设置配重420的一端靠在配重止挡件600上。
为了便于调节，在一些示例性实施例中，安装杆610为可伸缩杆，所述基板处理装置还包括调节机构700，该调节机构700包括操作部710和执行部720，所述执行部与所述安装杆相连，以调节安装杆610的长度，所述操作部设置在所述处理腔外部，用于对所述执行部进行操作。
例如，安装杆610可以包括气缸，调节机构700的操作部710可以包括气动阀，调节结构710的执行部720可以包括管道，通过对操作部710进行操作，可以控制安装杆610与气源的导通状态，并控制安装杆610的伸缩，进而控制配重止挡件600的高度。
在本发明中，转动轴300的两端支撑在处理腔的侧壁上的孔中，为了便于转动轴300的转动，在一些示例性实施例中，所述基板感应装置还包括两个轴承800，两个轴承800分别套设在转动轴300的两个端部，并且，感应片200和基板感知传感器110位于和该感应片200和基板感知传感器同侧的轴承800的外侧。
如上文中所述，所述基板处理装置还包括控制器和喷淋机构，所述喷淋机构包括喷淋头，所述喷淋头设置在所述处理腔内，所述控制器的输出端与所述喷淋机构的控制端相连，所述控制器的输入端与所述基板感知组件的输出端相连，当所述控制器接收到所述基板感知组件的第一感知信号时，向所述喷淋机构的控制端发出第一控制信号，以控制所述喷淋机构进行喷淋。
当所述基板处理装置还包括所述初始位置感知传感器时，所述控制器的输入端与所述基板感知组件的输出端相连，当所述控制器接收到所述第二感知信号时，向所述喷淋机构发出第二控制信号，以控制所述喷淋机构停止喷淋。
为了便于基板的运输，在一些示例性实施例中，如图6所示，所述基板处理装置包括设置在所述处理腔内的多个传输轴900，转动轴300设置在相邻两根传输轴900之间。传输轴900上设置有传输轮910，并且传输轴900可以绕自身轴线转动，以将进入处理腔的基板传输至处理腔外部。
下面结合图6介绍本发明所提供的基板处理装置的优选实施方式的工作原理。
如图所示，转动轴300设置在两个传输轴900之间。
当基板未进入处理腔中时，在配重块的作用下下，感应片200位于初始位置传感器120的感知范围内，并且初始位置传感器120向控制器发送第二感知信号，控制器控制喷淋组件不喷淋处理液。
当基板通过处理腔的入口进入所述处理腔内部时，传输轴900的转动带动基板沿图6中箭头所指的方向移动。
当基板接触到驱动组件上的接触件430时，接触件430被向下压，并带动转动轴300沿第一方向绕自身轴线转动，并带动感应片200朝向基板感知传感器110移动，直至进入基板感知传感器110的感知范围。此时基板感知传感器110向控制器发出第一感知信号，控制喷淋机构向处理腔内喷淋处理液。
传输轴900带动基板继续沿箭头方向移动，当基板与接触件430脱离接触时，配重块420带动转动轴300逆时针转动，并带动感应片 200朝向初始位置传感器120移动，当感应片200彻底到达初始位置传感器120的感知范围时，初始位置传感器120向控制器发出第二感知信号，控制器控制喷淋机构停止喷淋。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (16)

  1. 一种基板处理装置，包括：
    处理腔；
    基板感知组件；
    转动轴，所述转动轴的一部分设置在所述处理腔内，其余部分设置在所述处理腔外，所述基板感知组件设置在所述转动轴的设置在所述处理腔外的部分上；和
    驱动组件，所述驱动组件固定在所述转动轴的位于所述处理腔内的部分上，
    其中，所述驱动组件在接触到基板时带动所述转动轴绕自身轴线沿第一方向转动，所述基板感知组件在感知到所述转动轴沿第一方向的转动时发出表示所述基板进入所述处理腔内的第一感知信号，并且
    其中，所述驱动组件在所述基板从接触所述驱动组件变为不接触所述驱动组件时带动所述转动轴绕自身轴线沿与所述第一方向相反的第二方向转动，所述基板感知组件在感知到所述转动轴沿第二方向的转动时停止发出所述第一感知信号。
  2. 根据权利要求1所述的基板处理装置，其中，所述基板感知组件包括基板感知传感器和感应片，所述基板感知传感器和所述感应片中的一者设置为随所述转动轴的转动而转动，所述基板感知传感器和所述感应片中的另一者相对于所述处理腔静止设置；
    当所述转动轴沿所述第一方向转过第一角度时，所述基板感知传感器和所述感应片互相接近以使得所述感应片进入所述基板感知传感器的感知范围，且所述基板感知传感器发出所述第一感知信号；
    当所述转动轴沿所述第二方向转过第二角度时，所述基板感知传感器和所述感应片互相远离以使得所述感应片离开所述基板感知传感器的感知范围，并且所述基板感知传感器停止发出所述第一感知信号。
  3. 根据权利要求2所述的基板处理装置，其中，所述基板感知组件还包括安装架，所述安装架相对于所述处理腔静止设置，所述基板感知传感器和所述感应片中相对于所述处理腔静止的一者固定设置在所述安装架上。
  4. 根据权利要求2所述的基板处理装置，其中，所述基板感知传感器相对于所述处理腔静止设置，所述感应片固定地设置在所述转动轴上从而随所述转动轴的转动而转动。
  5. 根据权利要求3所述的基板处理装置，其中，所述基板感知传感器设置在所述安装架上，所述感应片固定地设置在所述转动轴上，并且所述基板处理装置还包括初始位置感应传感器，所述初始位置感应传感器设置在所述安装架上，且所述初始位置感应传感器与所述基板感知传感器分别位于所述感应片的运动轨迹的两端，当所述驱动组件与所述基板不接触时，所述驱动组件将所述转动轴固定在使得所述感应片位于所述初始位置感应传感器的感知范围内的初始位置，且当所述感应片位于所述初始位置传感器的感知范围内时，所述初始位置传感器发出第二感知信号。
  6. 根据权利要求5所述的基板处理装置，其中，所述基板感知传感器包括第一凹槽，所述初始位置传感器包括第二凹槽，当所述驱动组件与所述基板接触时，所述感应片的一端进入所述第一凹槽，当所述驱动组件与所述基板不接触时，所述感应片的另一端进入所述第二凹槽。
  7. 根据权利要求5所述的基板处理装置，其中，所述感应片具有扇环形，所述基板处理装置还包括支撑杆，所述支撑杆的一端固定设置在所述转动轴上，所述支撑杆的另一端固定设置有所述感应片，且所述支撑杆的延长线穿过所述旋转轴的轴线，所述感应片的圆心位 于所述支撑杆上。
  8. 根据权利要求1至7中任意一项所述的基板处理装置，其中，所述驱动组件包括固定连接在所述转动轴上的杠杆、设置在所述杠杆一端的配重和设置在所述杠杆的另一端的接触件，所述杠杆用于当所述接触件与所述基板接触时带动所述转动轴绕该转动轴的轴线转动；
    所述基板处理装置还包括位于处理腔内并设置在所述杠杆下方的配重止挡件，所述配重止挡件用于当所述接触件不与所述基板接触时，止挡所述杠杆设置有配重的一端运动。
  9. 根据权利要求8所述的基板处理装置，其中，所述配重与所述杠杆同所述转动轴的连接处之间的距离小于所述接触件与所述杠杆同所述转动轴的连接处的距离。
  10. 根据权利要求8所述的基板处理装置，其中，所述接触件包括滚轮，所述滚轮能在所述基板接触所述滚轮外表面并将所述杠杆压下时滚动。
  11. 根据权利要求8所述的基板处理装置，其中，所述配重止挡件包括止挡杆，所述基板处理装置还包括安装杆，所述安装杆的一端设置有所述止挡杆，所述安装杆的另一端用于将所述安装杆固定在所述处理腔内，所述安装杆和所述止挡杆互相垂直。
  12. 根据权利要求11所述的基板处理装置，还包括调节机构，并且其中所述安装杆为可伸缩杆，所述调节机构包括操作部和执行部，所述执行部连接在所述安装杆和所述操作部之间，所述操作部设置在所述处理腔外部，以使得施加给所述操作部的力通过所述执行部传递至所述安装杆，从而控制所述安装杆伸长或缩短。
  13. 根据权利要求1至7中任意一项所述的基板处理装置，还 包括控制器和喷淋机构，所述喷淋机构设置在所述处理腔内，所述控制器配置为在接收到所述第一感知信号时，控制所述喷淋机构进行喷淋。
  14. 根据权利要求5至7中任意一项所述的基板处理装置，还包括控制器和喷淋机构，所述喷淋机构设置在所述处理腔内，所述控制器配置为在接收到所述第二感知信号时，控制所述喷淋机构停止喷淋。
  15. 根据权利要求1至7中任意一项所述的基板处理装置，还包括设置在所述处理腔内的多个传输轴，所述转动轴设置在相邻两根所述传输轴之间。
  16. 根据权利要求1所述的基板处理装置，其中，所述转动轴具有杆形，并且所述转动轴的两个端部中的至少一个设置在所述处理腔外。
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