US20180218930A1 - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- US20180218930A1 US20180218930A1 US15/545,441 US201715545441A US2018218930A1 US 20180218930 A1 US20180218930 A1 US 20180218930A1 US 201715545441 A US201715545441 A US 201715545441A US 2018218930 A1 US2018218930 A1 US 2018218930A1
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- substrate
- rotation shaft
- processing chamber
- processing apparatus
- sense element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Definitions
- the present invention relates to the field of display device manufacturing, and particularly to a substrate processing apparatus.
- processes such as cleaning and developing need to be performed on a substrate.
- the substrate is transported into a processing chamber of a substrate processing apparatus, and then the treatment liquid is sprayed towards the substrate by a spraying mechanism.
- the processing chamber of the substrate processing apparatus is provided with a sensor therein for sensing whether or not the substrate enters the processing chamber.
- the treatment liquid may be sprayed onto the sensor when the treatment liquid is sprayed towards the substrate, resulting in failure of the sensor.
- the present disclosure provides a substrate processing apparatus for sing a substrate and not prone to failure.
- the present disclosure provides a substrate processing apparatus which includes a processing chamber and a substrate sensing assembly, and further includes:
- a rotation shaft which has a portion provided inside the processing chamber and the remaining portion provided outside the processing chamber, the substrate sensing assembly being provided on the portion of the rotation shaft outside the processing chamber;
- the driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and the substrate sensing assembly transmits, upon sensing the rotation of the rotation shaft along the first direction, a first sensing signal indicative of the substrate entering into the processing chamber;
- the driving assembly drives, when the substrate comes into no contact with the driving assembly from in contact with the driving assembly, the rotation shaft to rotate about its own axis along a second direction opposite to the first direction, and the substrate sensing assembly stop transmitting the first sensing signal upon sensing the rotation of the rotation shaft along the second direction.
- the substrate sensing assembly may include a substrate sensor and a sense element, one of which is configured to rotate with the rotation of the rotation shaft, and the other one of which is provided stationary with respect to the processing chamber;
- the substrate sensor and the sense element become close to each other such that the sense element enters into a sensing range of the substrate sensor, and the substrate sensor transmits the first sensing signal;
- the substrate sensor and the sense element become away from each other such that the sense element is out of the sensing range of the substrate sensor, and the substrate sensor stops transmitting the first sensing signal.
- the substrate sensing assembly may further include a mounting bracket provided stationary with respect to the processing chamber, and the other one of the substrate sensor and the sense element provided stationary with respect to the processing chamber is fixedly provided on the mounting bracket.
- the substrate sensor may be provided stationary with respect to the processing chamber, and the sense element may be fixedly provided on the rotation shaft so as to rotate with the rotation of the rotation shaft.
- the substrate sensor is provided on the mounting bracket, and the sense element is provided on the rotation shaft.
- the substrate sensor is provided on the mounting bracket
- the sense element is fixedly provided on the rotation shaft
- the substrate processing apparatus may further include an initial position sensor provided on the mounting bracket, wherein the initial position sensor and the substrate sensor are positioned at two ends of a movement trajectory of the sense element, respectively, when the driving assembly is not in contact with the substrate, the driving assembly fixes the rotation shaft at such an initial position that the sense element is in a sensing range of the initial position sensor, and when the sense element is in the sensing range of the initial position sensor, the initial position sensor transmits a second sensing signal.
- the substrate sensor includes a first groove
- the initial position sensor includes a second groove
- the sense element has an annulus-sector shape
- the substrate processing apparatus further includes a supporting rod, one end of which is fixedly provided on the rotation shaft, the other end of which is fixedly provided with the sense element thereon, and an extension line of which crosses the axis of the rotation shaft, a center of a circle of the annulus-sector shaped sense element being on the supporting rod.
- the driving assembly includes a lever fixedly connected to the rotation shaft, a counterweight provided at one end of the lever and a contact member provided at the other end of the lever, the lever being configured to drive the rotation shaft to rotate about the axis of the rotation shaft when the contact member comes into contact with the substrate; and
- the substrate processing apparatus further includes a counterweight stopper provided inside the processing chamber and under the lever, the counterweight stopper being configured to stop the one end of the lever provided with the counterweight when the contact member is not in contact with the substrate.
- a distance between the counterweight and a connection point of the lever with the rotation shaft is less than a distance between the contact member and the connection point of the lever with the rotation shaft.
- the contact member includes a roller configured to roll when the substrate comes into contact with an outer surface of the roller and presses down the lever.
- the counterweight stopper includes a stop bar
- the substrate processing apparatus further includes a mounting rod, one end of which is provided with the stop bar, and the other end of which is configured to fix the mounting rod inside the processing chamber, the mounting rod and the stop bar being perpendicular to each other.
- the substrate processing apparatus may further include an adjustment mechanism, and the mounting rod is a telescopic rod, the adjustment mechanism includes an operation part and an execution part connected between the mounting rod and the operation part, the operation part being provided outside the processing chamber so that a force applied to the operation part is transmitted to the mounting rod through the execution part to control the mounting rod to be lengthened or shortened.
- the adjustment mechanism includes an operation part and an execution part connected between the mounting rod and the operation part, the operation part being provided outside the processing chamber so that a force applied to the operation part is transmitted to the mounting rod through the execution part to control the mounting rod to be lengthened or shortened.
- the substrate processing apparatus may further include a controller and a spraying mechanism, the spraying mechanism being provided inside the processing chamber, and the controller being configured to control, upon receiving the first sensing signal, the spraying mechanism to spray.
- the substrate processing apparatus may further include a controller and a spraying mechanism, the spraying mechanism being provided inside the processing chamber, and the controller being configured to control, upon receiving the second sensing signal, the spraying mechanism to stop spraying.
- the substrate processing apparatus may further include a plurality of transmission shafts provided inside the processing chamber, and the rotation shaft is provided between two adjacent transmission shafts.
- the rotation shaft has a rod shape, and at least one of two ends of the rotation shaft is provided outside the processing chamber.
- the treatment liquid does not affect the substrate sensor.
- the failure can be found in time, thereby avoiding breakdown of apparatus, lamination and breakage of substrate and so on caused by the failure of the substrate sensor.
- FIG. 1 is a schematic structural diagram of a substrate processing apparatus according to an embodiment of the present invention
- FIG. 2 is a schematic diagram of a substrate sensing assembly including a mounting bracket in a case where a sense element is in an initial state;
- FIG. 3 is a schematic diagram of the substrate sensing assembly including the mounting bracket in a case where the sense element is in a final state;
- FIG. 4 is a schematic diagram illustrating the sense element not entering into a sensing range of a substrate sensor
- FIG. 5 is a schematic diagram illustrating the sense element entering into the sensing range of a substrate sensor.
- FIG. 6 is a schematic diagram illustrating a positional relationship between a transmission shaft and a rotation shaft in a substrate processing apparatus according to an embodiment of the present invention.
- a substrate processing apparatus which includes a processing chamber and a substrate sensing assembly, and as illustrated in FIG. 1 , the substrate processing apparatus further includes a rotation shaft 300 and a driving assembly 400 .
- a portion of the rotation shaft 300 is provided inside the processing chamber (as illustrated in FIG. 1 , two dotted lines represent boundaries of the processing chamber, and a portion between the dotted lines represents the interior of the processing chamber), and at least one of two end portions of the rotation shaft 300 extends to the outside of the processing chamber.
- the substrate sensing assembly is provided on the rotation shaft 300 and outside the processing chamber.
- the driving assembly 400 is fixed at the portion of the rotation shaft 300 inside the processing chamber.
- the driving assembly 400 may drive the rotation shaft 300 to rotate about its own axis along a first direction, and when the rotation shaft 300 rotates by a first angle along the first direction, the substrate sensing assembly may transmit a first sensing signal indicative of the entry of the substrate into the processing chamber.
- the driving assembly 400 may drive the rotation shaft 300 to rotate about its own axis along a second direction opposite to the first direction, and when the rotation shaft 300 rotates by a second angle along the second direction, the substrate sensing assembly stop transmitting the first sensing signal.
- the first direction may be a clockwise direction or a counterclockwise direction, depending on the conveying direction of the substrate.
- the second direction is a counterclockwise direction and vice versa.
- the first angle and the second angle are predetermined angles, and they may be equal to each other or may not be equal to each other.
- the driving assembly 400 drives the rotation shaft 300 to rotate about its own axis along the first direction.
- the substrate sensing assembly transmits the first sensing signal to a controller for controlling a spraying mechanism to spray, and upon receiving the sensing signal, the controller controls the spraying mechanism to start the spraying of the treatment liquid. Since the substrate sensing assembly is provided outside the processing chamber, the treatment liquid may be not sprayed onto the substrate sensing assembly, and thus the substrate sensing assembly does not fail due to the treatment liquid, so that the lifetime of the substrate processing apparatus can be improved.
- the substrate processing apparatus also has the following advantages. Since the substrate sensing assembly is provided outside the processing chamber, once the substrate sensing assembly has failed, the failure can be found in time, and the failed substrate sensing assembly can be replaced easily, thereby avoiding breakdown of apparatus, lamination and breakage of substrate and so on caused by the failure of the substrate sensing assembly.
- the specific structure of the substrate sensing assembly is not particularly limited.
- the substrate sensing assembly may include an angular sensor for measuring an angle by which the rotation shaft 300 rotates.
- the substrate sensing assembly includes a substrate sensor 110 and a sense element 200 .
- One of the substrate sensor 110 and the sense element 200 is configured to rotate with the rotation of the rotation shaft 300 , and the other of the substrate sensor 110 and the sense element 200 is provided stationary with respect to the processing chamber.
- one of the substrate sensor 110 and the sense element 200 may be fixedly attached to the rotation shaft 300 .
- the substrate sensor 110 and the sense element 200 become close to each other such that the sense element 200 enters into a sensing range of the substrate sensor 110 , and the substrate sensor 110 transmits the first sensing signal.
- the substrate sensor 110 and the sense element 200 become away from each other such that the sense element 200 is out of the sensing range of the substrate sensor 110 , and the substrate sensor 110 stops transmitting the first sensing signal.
- the substrate sensor 110 and the sense element 200 have low cost and are easy to install, so the overall cost of the substrate processing apparatus can be reduced by using the substrate sensing assembly including the substrate sensor 110 and the sense element 200 .
- the substrate sensing assembly may further include a mounting bracket 500 provided stationary with respect to the processing chamber, and the other one of the substrate sensor 110 and the sense element 200 provided stationary with respect to the processing chamber is fixedly provided on the mounting bracket 500 .
- the substrate sensor 110 is connected with signal transmission lines, in some exemplary embodiments, the substrate sensor 110 is stationary with respect to the processing chamber and the sense element 200 rotates with the rotation of the rotation shaft 300 , thereby preventing the signal transmission lines of the substrate sensor 110 from being caught or dragged. Accordingly, the substrate sensor 110 is fixedly provided on the mounting bracket 500 , and the sense element 200 is provided on the rotation shaft 300 .
- the substrate processing apparatus further includes an initial position sensor 120 fixedly provided on the mounting bracket 500 , wherein the initial position sensor 120 and the substrate sensor 110 are positioned at two ends of a movement trajectory of the sense element 200 , respectively.
- the initial position sensor 120 and the substrate sensor 110 may be positioned on two sides of the mounting bracket, respectively.
- the driving assembly 400 may fix the rotation shaft 300 such that the sense element 200 is in a sensing range of the initial position sensor 120 , and once the sense element 200 is in the sensing range of the initial position sensor 120 , the initial position sensor 120 may transmit a second sensing signal.
- the sense element 200 when the driving assembly 400 is not in contact with the substrate, the sense element 200 is in the sensing range of the initial position sensor 120 , and at this time, the initial position sensor 120 may generate the second sensing signal indicative of the absence of the substrate inside the processing chamber.
- the sense element 200 when the driving assembly comes into contact with the substrate, the sense element 200 is in the sensing range of the substrate sensor 110 , and at this time, the substrate sensor 110 may generate the first sensing signal indicative of the presence of the substrate inside the processing chamber.
- the controller may determine, upon receiving the second sensing signal transmitted by the initial position sensor 120 , that there is no substrate inside the processing chamber, and thus may control the spraying mechanism to stop spraying the treatment liquid.
- the specific structures of the substrate sensor 110 and the initial position sensor 120 are not particularly limited.
- the substrate sensor 110 includes a first groove 110 a , and one end of the sense element 200 can enter into the first groove.
- the initial position sensor includes a second groove, and the other end of the sense element 200 can enter into the second groove.
- the rotation shaft 300 when there is no substrate inside the processing chamber, the rotation shaft 300 is driven by the driving assembly 400 to the initial position, and one end of the sense element 200 is inserted into the second groove.
- the rotation shaft 300 is driven by the driving assembly 400 to rotate such that the other end of the sense element 200 is inserted into the first groove, as illustrated in FIG. 3 .
- the substrate processing apparatus further includes a supporting rod 140 .
- One end of the supporting rod 140 is fixedly provided on the rotation shaft 300 , the other end of the supporting rod 140 is fixedly provided with the sense element 200 thereon, an extension line of the supporting rod 140 crosses the axis of the rotation shaft 300 , and a center of a circle of the annulus-sector shaped sense element 200 is on the supporting rod 140 .
- the specific structure of the driving assembly 400 is not particularly limited.
- the driving assembly 400 includes a lever 410 , a counterweight 420 provided at one end of the lever 410 and a contact member 430 provided at the other end of the lever 410 .
- the substrate processing substrate further includes a counterweight stopper 600 , which is provided under the rotation shaft 300 and inside the processing chamber.
- the lever 410 is provided on the rotation shaft 300 , and can rotate, along with the rotation of the rotation shaft 300 , about the axis of the rotation shaft 300 .
- the contact member 430 is configured to contact with the substrate.
- a portion of the lever 410 between one end of the lever 410 provided with the counterweight 420 and the connection point of the lever 410 with the rotation shaft 300 may be supported by the counterweight stopper 600 .
- the rotation of the rotation shaft 300 causes one of the sense element 200 and the substrate sensor 110 to move, such that a distance between the sense element 200 and the substrate sensor 110 is gradually reduced and eventually the sense element 200 enters into the sensing range of the substrate sensor 110 .
- the driving assembly 400 having the above-described arrangement can be driven to rotate by the movement of the substrate without any other power source for providing driving force. Thus, energy consumption can be reduced by using the driving assembly 400 having the above-described arrangement.
- a distance between the counterweight 420 and the connection point of the lever 410 with the rotation shaft 300 is less than a distance between the contact member 430 and the connection point of the lever 410 with the rotation shaft 300 , so that the stroke of the contact member 430 after contacting with the substrate can be increased, and the probability that the driving assembly erroneously drives the rotation shaft 300 can be reduced, thereby improving the stability and accuracy for detecting the substrate.
- the contact member 430 may include a roller which is configured to roll when the substrate comes into contact with its outer surface and presses down the lever 410 .
- the specific structure of the counterweight stopper 600 is not particularly limited.
- the counterweight stopper 600 includes a stop bar
- the substrate processing apparatus may further include a mounting rod 610
- the counterweight stopper 600 formed as the stop bar is provided at one end of the mounting rod 610 , and the other end of the mounting rod 610 is mounted inside the processing chamber.
- the mounting rod 610 and the counterweight stopper 600 are perpendicular to each other. In the initial state, the one end of the lever 410 provided with the counterweight 420 leans against the counterweight stopper 600 .
- the mounting rod 610 is a telescopic rod
- the substrate processing apparatus further includes an adjustment mechanism 700 .
- the adjustment mechanism 700 includes an operation part 710 and an execution part 720 .
- the execution part 720 is connected with the mounting rod and configured to adjust the length of the mounting rode 610
- the operation part 710 is provided outside the processing chamber and configured to operate the execution part 720 .
- the mounting rod 610 may include a cylinder
- the operation part 710 of the adjustment mechanism 700 may include a pneumatic valve
- the execution part 720 of the adjustment mechanism 700 may include a pipe.
- both ends of the rotation shaft 300 are supported in holes on side walls of the processing chamber.
- the substrate processing apparatus further includes two bearings 800 provided around two ends of the rotation shaft 300 , respectively, and the sense element 200 and the substrate sensor 110 are positioned at a side of one of the bearings 800 distal to the processing chamber, the one of the bearings 800 , the sense element 200 and the substrate sensor 110 being at the same side of the processing chamber.
- the substrate processing apparatus further includes a controller and a spraying mechanism.
- the spraying mechanism includes a spraying head provided inside the processing chamber.
- An output terminal of the controller is connected to a control terminal of the spraying mechanism, and an input terminal of the controller is connected to an output terminal of the substrate sensing assembly.
- the controller Upon receiving the first sensing signal from the substrate sensing assembly, the controller transmits a first control signal to the control terminal of the spraying mechanism to control the spraying mechanism to spray.
- the input terminal of the controller is connected to the output terminal of the substrate sensing assembly.
- the controller Upon receiving the second sensing signal, the controller transmits a second control signal to the spraying mechanism to control the spraying mechanism to stop spraying.
- the substrate processing apparatus includes a plurality of transmission shafts 900 provided inside the processing chamber, and the rotation shaft 300 is provided between two adjacent transmission shafts 900 .
- the transmission shaft 900 is provided with transmission rollers 910 and can rotate about its own axis so as to transfer the substrate entering the processing chamber to the outside of the processing chamber.
- the rotation shaft 300 is provided between two transmission shafts 900 .
- the sense element 200 When there is no substrate inside the processing chamber, driven by the counterweight, the sense element 200 is in the sensing range of the initial position sensor 120 , and the initial position sensor 120 transmits the second sensing signal to the controller, so the controller controls the spraying mechanism not to spray the treatment liquid.
- the transmission shaft 900 rotates to drive the substrate to move along a direction indicated by an arrow in FIG. 6 .
- the contact member 430 is pressed downward, drives the rotation shaft 300 to rotate about its own axis along the first direction, and drives the sense element 200 to move towards the substrate sensor 110 and eventually enter into the sensing range of the substrate sensor 110 .
- the substrate sensor 110 transmits the first sensing signal to the controller so as to control the spraying mechanism to spray the treatment liquid into the processing chamber.
- the transmission shaft 900 continues to drive the substrate to move along the direction indicated by the arrow, and when the substrate comes into no contact with the contact member 430 , the counterweight 420 drives the rotation shaft 300 to rotate counterclockwise, and drives the sense element 200 to move towards the initial position sensor 120 .
- the initial position sensor 120 transmits the second sensing signal to the controller when the sense element 200 completely reaches the sensing range of the initial position sensor 120 , and the controller controls the spraying mechanism to stop spraying.
Abstract
Description
- The present invention relates to the field of display device manufacturing, and particularly to a substrate processing apparatus.
- In the manufacture of a display device, processes such as cleaning and developing need to be performed on a substrate. During the above processes, the substrate is transported into a processing chamber of a substrate processing apparatus, and then the treatment liquid is sprayed towards the substrate by a spraying mechanism. Typically, the processing chamber of the substrate processing apparatus is provided with a sensor therein for sensing whether or not the substrate enters the processing chamber.
- Since the sensor is provided inside the processing chamber, the treatment liquid may be sprayed onto the sensor when the treatment liquid is sprayed towards the substrate, resulting in failure of the sensor.
- Therefore, how to avoid sensor failure has become an urgent technical problem to be solved in the art.
- The present disclosure provides a substrate processing apparatus for sing a substrate and not prone to failure.
- To achieve the above object(s), the present disclosure provides a substrate processing apparatus which includes a processing chamber and a substrate sensing assembly, and further includes:
- a rotation shaft, which has a portion provided inside the processing chamber and the remaining portion provided outside the processing chamber, the substrate sensing assembly being provided on the portion of the rotation shaft outside the processing chamber; and
- a driving assembly fixed at the portion of the rotation shaft inside the processing chamber;
- wherein the driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and the substrate sensing assembly transmits, upon sensing the rotation of the rotation shaft along the first direction, a first sensing signal indicative of the substrate entering into the processing chamber;
- the driving assembly drives, when the substrate comes into no contact with the driving assembly from in contact with the driving assembly, the rotation shaft to rotate about its own axis along a second direction opposite to the first direction, and the substrate sensing assembly stop transmitting the first sensing signal upon sensing the rotation of the rotation shaft along the second direction.
- In some exemplary embodiments, the substrate sensing assembly may include a substrate sensor and a sense element, one of which is configured to rotate with the rotation of the rotation shaft, and the other one of which is provided stationary with respect to the processing chamber;
- when the rotation shaft rotates by a first angle along the first direction, the substrate sensor and the sense element become close to each other such that the sense element enters into a sensing range of the substrate sensor, and the substrate sensor transmits the first sensing signal; and
- when the rotation shaft rotates by a second angle along the second direction, the substrate sensor and the sense element become away from each other such that the sense element is out of the sensing range of the substrate sensor, and the substrate sensor stops transmitting the first sensing signal.
- In some exemplary embodiments, the substrate sensing assembly may further include a mounting bracket provided stationary with respect to the processing chamber, and the other one of the substrate sensor and the sense element provided stationary with respect to the processing chamber is fixedly provided on the mounting bracket.
- In some exemplary embodiments, the substrate sensor may be provided stationary with respect to the processing chamber, and the sense element may be fixedly provided on the rotation shaft so as to rotate with the rotation of the rotation shaft.
- In some exemplary embodiments, the substrate sensor is provided on the mounting bracket, and the sense element is provided on the rotation shaft.
- In some exemplary embodiments, the substrate sensor is provided on the mounting bracket, the sense element is fixedly provided on the rotation shaft, and the substrate processing apparatus may further include an initial position sensor provided on the mounting bracket, wherein the initial position sensor and the substrate sensor are positioned at two ends of a movement trajectory of the sense element, respectively, when the driving assembly is not in contact with the substrate, the driving assembly fixes the rotation shaft at such an initial position that the sense element is in a sensing range of the initial position sensor, and when the sense element is in the sensing range of the initial position sensor, the initial position sensor transmits a second sensing signal.
- In some exemplary embodiments, the substrate sensor includes a first groove, and the initial position sensor includes a second groove, when the driving assembly comes into contact with the substrate, one end of the sense element enters into the first groove, and when the driving assembly is not in contact with the substrate, the other end of the sense element enters into the second groove.
- In some exemplary embodiments, the sense element has an annulus-sector shape, and the substrate processing apparatus further includes a supporting rod, one end of which is fixedly provided on the rotation shaft, the other end of which is fixedly provided with the sense element thereon, and an extension line of which crosses the axis of the rotation shaft, a center of a circle of the annulus-sector shaped sense element being on the supporting rod.
- In some exemplary embodiments, the driving assembly includes a lever fixedly connected to the rotation shaft, a counterweight provided at one end of the lever and a contact member provided at the other end of the lever, the lever being configured to drive the rotation shaft to rotate about the axis of the rotation shaft when the contact member comes into contact with the substrate; and
- the substrate processing apparatus further includes a counterweight stopper provided inside the processing chamber and under the lever, the counterweight stopper being configured to stop the one end of the lever provided with the counterweight when the contact member is not in contact with the substrate.
- In some exemplary embodiments, a distance between the counterweight and a connection point of the lever with the rotation shaft is less than a distance between the contact member and the connection point of the lever with the rotation shaft.
- In some exemplary embodiments, the contact member includes a roller configured to roll when the substrate comes into contact with an outer surface of the roller and presses down the lever.
- In some exemplary embodiments, the counterweight stopper includes a stop bar, and the substrate processing apparatus further includes a mounting rod, one end of which is provided with the stop bar, and the other end of which is configured to fix the mounting rod inside the processing chamber, the mounting rod and the stop bar being perpendicular to each other.
- In some exemplary embodiments, the substrate processing apparatus may further include an adjustment mechanism, and the mounting rod is a telescopic rod, the adjustment mechanism includes an operation part and an execution part connected between the mounting rod and the operation part, the operation part being provided outside the processing chamber so that a force applied to the operation part is transmitted to the mounting rod through the execution part to control the mounting rod to be lengthened or shortened.
- In some exemplary embodiments, the substrate processing apparatus may further include a controller and a spraying mechanism, the spraying mechanism being provided inside the processing chamber, and the controller being configured to control, upon receiving the first sensing signal, the spraying mechanism to spray.
- In some exemplary embodiments, the substrate processing apparatus may further include a controller and a spraying mechanism, the spraying mechanism being provided inside the processing chamber, and the controller being configured to control, upon receiving the second sensing signal, the spraying mechanism to stop spraying.
- In some exemplary embodiments, the substrate processing apparatus may further include a plurality of transmission shafts provided inside the processing chamber, and the rotation shaft is provided between two adjacent transmission shafts.
- In some exemplary embodiments, the rotation shaft has a rod shape, and at least one of two ends of the rotation shaft is provided outside the processing chamber.
- In the substrate processing apparatus provided by the embodiments of the present invention, since the substrate sensor and the sense element are provided outside the processing chamber, the treatment liquid does not affect the substrate sensor. In addition, once the substrate sensor has failed, the failure can be found in time, thereby avoiding breakdown of apparatus, lamination and breakage of substrate and so on caused by the failure of the substrate sensor.
- The accompanying drawings, which constitute a part of the specification, are provided for further understanding of embodiments of the present invention, and for explaining the present invention together with the following specific implementations, but not intended to limit the present invention, in which:
-
FIG. 1 is a schematic structural diagram of a substrate processing apparatus according to an embodiment of the present invention; -
FIG. 2 is a schematic diagram of a substrate sensing assembly including a mounting bracket in a case where a sense element is in an initial state; -
FIG. 3 is a schematic diagram of the substrate sensing assembly including the mounting bracket in a case where the sense element is in a final state; -
FIG. 4 is a schematic diagram illustrating the sense element not entering into a sensing range of a substrate sensor; -
FIG. 5 is a schematic diagram illustrating the sense element entering into the sensing range of a substrate sensor; and -
FIG. 6 is a schematic diagram illustrating a positional relationship between a transmission shaft and a rotation shaft in a substrate processing apparatus according to an embodiment of the present invention. - Specific embodiments of the present invention will be described below in detail in conjunction with the accompanying drawings. It should be understood that the embodiments to be described are merely intended to illustrate and explain the present invention, but not to limit the present invention.
- As one aspect of the present disclosure, there is provided a substrate processing apparatus which includes a processing chamber and a substrate sensing assembly, and as illustrated in
FIG. 1 , the substrate processing apparatus further includes arotation shaft 300 and adriving assembly 400. - A portion of the
rotation shaft 300 is provided inside the processing chamber (as illustrated inFIG. 1 , two dotted lines represent boundaries of the processing chamber, and a portion between the dotted lines represents the interior of the processing chamber), and at least one of two end portions of therotation shaft 300 extends to the outside of the processing chamber. The substrate sensing assembly is provided on therotation shaft 300 and outside the processing chamber. - As illustrated in
FIG. 1 , thedriving assembly 400 is fixed at the portion of therotation shaft 300 inside the processing chamber. - When coming into contact with a to-be-processed substrate, the
driving assembly 400 may drive therotation shaft 300 to rotate about its own axis along a first direction, and when therotation shaft 300 rotates by a first angle along the first direction, the substrate sensing assembly may transmit a first sensing signal indicative of the entry of the substrate into the processing chamber. - In addition, when the substrate comes into no contact with the
driving assembly 400 from in contact with thedriving assembly 400, thedriving assembly 400 may drive therotation shaft 300 to rotate about its own axis along a second direction opposite to the first direction, and when therotation shaft 300 rotates by a second angle along the second direction, the substrate sensing assembly stop transmitting the first sensing signal. - In the present application, the first direction may be a clockwise direction or a counterclockwise direction, depending on the conveying direction of the substrate. When the first direction is a clockwise direction, the second direction is a counterclockwise direction and vice versa. The first angle and the second angle are predetermined angles, and they may be equal to each other or may not be equal to each other.
- When a substrate comes into contact with the
driving assembly 400, thedriving assembly 400 drives therotation shaft 300 to rotate about its own axis along the first direction. After therotation shaft 300 rotates by the first angle, the substrate sensing assembly transmits the first sensing signal to a controller for controlling a spraying mechanism to spray, and upon receiving the sensing signal, the controller controls the spraying mechanism to start the spraying of the treatment liquid. Since the substrate sensing assembly is provided outside the processing chamber, the treatment liquid may be not sprayed onto the substrate sensing assembly, and thus the substrate sensing assembly does not fail due to the treatment liquid, so that the lifetime of the substrate processing apparatus can be improved. - In addition to the advantage of long lifetime, the substrate processing apparatus also has the following advantages. Since the substrate sensing assembly is provided outside the processing chamber, once the substrate sensing assembly has failed, the failure can be found in time, and the failed substrate sensing assembly can be replaced easily, thereby avoiding breakdown of apparatus, lamination and breakage of substrate and so on caused by the failure of the substrate sensing assembly.
- In the present application, the specific structure of the substrate sensing assembly is not particularly limited. For example, the substrate sensing assembly may include an angular sensor for measuring an angle by which the
rotation shaft 300 rotates. - In an embodiment of the present invention, the substrate sensing assembly includes a
substrate sensor 110 and asense element 200. One of thesubstrate sensor 110 and thesense element 200 is configured to rotate with the rotation of therotation shaft 300, and the other of thesubstrate sensor 110 and thesense element 200 is provided stationary with respect to the processing chamber. For example, one of thesubstrate sensor 110 and thesense element 200 may be fixedly attached to therotation shaft 300. - As the
rotation shaft 300 rotates by the first angle along the first direction, thesubstrate sensor 110 and thesense element 200 become close to each other such that thesense element 200 enters into a sensing range of thesubstrate sensor 110, and thesubstrate sensor 110 transmits the first sensing signal. - As the
rotation shaft 300 rotates by the second angle along the second direction, thesubstrate sensor 110 and thesense element 200 become away from each other such that thesense element 200 is out of the sensing range of thesubstrate sensor 110, and thesubstrate sensor 110 stops transmitting the first sensing signal. - The
substrate sensor 110 and thesense element 200 have low cost and are easy to install, so the overall cost of the substrate processing apparatus can be reduced by using the substrate sensing assembly including thesubstrate sensor 110 and thesense element 200. - For ease of installation, in an embodiment of the present application, the substrate sensing assembly may further include a mounting
bracket 500 provided stationary with respect to the processing chamber, and the other one of thesubstrate sensor 110 and thesense element 200 provided stationary with respect to the processing chamber is fixedly provided on the mountingbracket 500. - Because the
substrate sensor 110 is connected with signal transmission lines, in some exemplary embodiments, thesubstrate sensor 110 is stationary with respect to the processing chamber and thesense element 200 rotates with the rotation of therotation shaft 300, thereby preventing the signal transmission lines of thesubstrate sensor 110 from being caught or dragged. Accordingly, thesubstrate sensor 110 is fixedly provided on the mountingbracket 500, and thesense element 200 is provided on therotation shaft 300. - In an embodiment of the present invention, for ease of monitoring, the substrate processing apparatus further includes an
initial position sensor 120 fixedly provided on the mountingbracket 500, wherein theinitial position sensor 120 and thesubstrate sensor 110 are positioned at two ends of a movement trajectory of thesense element 200, respectively. For example, theinitial position sensor 120 and thesubstrate sensor 110 may be positioned on two sides of the mounting bracket, respectively. When the drivingassembly 400 is not in contact with the substrate, the drivingassembly 400 may fix therotation shaft 300 such that thesense element 200 is in a sensing range of theinitial position sensor 120, and once thesense element 200 is in the sensing range of theinitial position sensor 120, theinitial position sensor 120 may transmit a second sensing signal. - As illustrated in
FIG. 2 , when the drivingassembly 400 is not in contact with the substrate, thesense element 200 is in the sensing range of theinitial position sensor 120, and at this time, theinitial position sensor 120 may generate the second sensing signal indicative of the absence of the substrate inside the processing chamber. As illustrated inFIG. 3 , when the driving assembly comes into contact with the substrate, thesense element 200 is in the sensing range of thesubstrate sensor 110, and at this time, thesubstrate sensor 110 may generate the first sensing signal indicative of the presence of the substrate inside the processing chamber. - The controller may determine, upon receiving the second sensing signal transmitted by the
initial position sensor 120, that there is no substrate inside the processing chamber, and thus may control the spraying mechanism to stop spraying the treatment liquid. - In the present application, the specific structures of the
substrate sensor 110 and theinitial position sensor 120 are not particularly limited. For example, as illustrated inFIGS. 4 and 5 , thesubstrate sensor 110 includes afirst groove 110 a, and one end of thesense element 200 can enter into the first groove. Similarly, the initial position sensor includes a second groove, and the other end of thesense element 200 can enter into the second groove. - As illustrated in
FIG. 2 , when there is no substrate inside the processing chamber, therotation shaft 300 is driven by the drivingassembly 400 to the initial position, and one end of thesense element 200 is inserted into the second groove. When a substrate is inside the processing chamber, therotation shaft 300 is driven by the drivingassembly 400 to rotate such that the other end of thesense element 200 is inserted into the first groove, as illustrated inFIG. 3 . - Since the movement trajectory of the
sense element 200 is arc-shaped, in some exemplary embodiments, in order to facilitate thesense element 200 to enter into the sensing ranges of theinitial position sensor 120 and thesubstrate sensing sensor 110, respectively, thesense element 120 is formed in an annular-sector shape, as illustrated inFIGS. 2 and 3 . Accordingly, the substrate processing apparatus further includes a supportingrod 140. One end of the supportingrod 140 is fixedly provided on therotation shaft 300, the other end of the supportingrod 140 is fixedly provided with thesense element 200 thereon, an extension line of the supportingrod 140 crosses the axis of therotation shaft 300, and a center of a circle of the annulus-sector shapedsense element 200 is on the supportingrod 140. - In the present application, the specific structure of the driving
assembly 400 is not particularly limited. For example, in an embodiment as illustrated inFIG. 1 , the drivingassembly 400 includes alever 410, acounterweight 420 provided at one end of thelever 410 and acontact member 430 provided at the other end of thelever 410. The substrate processing substrate further includes acounterweight stopper 600, which is provided under therotation shaft 300 and inside the processing chamber. Thelever 410 is provided on therotation shaft 300, and can rotate, along with the rotation of therotation shaft 300, about the axis of therotation shaft 300. Thecontact member 430 is configured to contact with the substrate. When thecontact member 430 is not in contact with a substrate, a portion of thelever 410 between one end of thelever 410 provided with thecounterweight 420 and the connection point of thelever 410 with therotation shaft 300 may be supported by thecounterweight stopper 600. - When a to-be-processed substrate enters the processing chamber and comes into contact with the
contact member 430 on thelever 410, thecontact member 430 on the lever will be pressed down due to the forward movement of the substrate. Since the lever is fixed on therotation shaft 300, the rotation of the lever will cause therotation shaft 300 to rotate about its own axis, and when therotation shaft 300 rotates by the first angle, the substrate sensing assembly transmits the first sensing signal. - In embodiments where the substrate sensing assembly includes the
sense element 200 and thesubstrate sensor 110, the rotation of therotation shaft 300 causes one of thesense element 200 and thesubstrate sensor 110 to move, such that a distance between thesense element 200 and thesubstrate sensor 110 is gradually reduced and eventually thesense element 200 enters into the sensing range of thesubstrate sensor 110. - The driving
assembly 400 having the above-described arrangement can be driven to rotate by the movement of the substrate without any other power source for providing driving force. Thus, energy consumption can be reduced by using the drivingassembly 400 having the above-described arrangement. - In some exemplary embodiments, a distance between the
counterweight 420 and the connection point of thelever 410 with therotation shaft 300 is less than a distance between thecontact member 430 and the connection point of thelever 410 with therotation shaft 300, so that the stroke of thecontact member 430 after contacting with the substrate can be increased, and the probability that the driving assembly erroneously drives therotation shaft 300 can be reduced, thereby improving the stability and accuracy for detecting the substrate. - In some exemplary embodiments, in order to reduce the frictional force between the substrate and the lever assembly and to prevent the substrate from being scratched, the
contact member 430 may include a roller which is configured to roll when the substrate comes into contact with its outer surface and presses down thelever 410. - In the present application, the specific structure of the
counterweight stopper 600 is not particularly limited. In an embodiment as illustrated inFIG. 1 , thecounterweight stopper 600 includes a stop bar, and the substrate processing apparatus may further include a mountingrod 610, and thecounterweight stopper 600 formed as the stop bar is provided at one end of the mountingrod 610, and the other end of the mountingrod 610 is mounted inside the processing chamber. The mountingrod 610 and thecounterweight stopper 600 are perpendicular to each other. In the initial state, the one end of thelever 410 provided with thecounterweight 420 leans against thecounterweight stopper 600. - In some exemplary embodiments, for ease of adjustment, the mounting
rod 610 is a telescopic rod, and the substrate processing apparatus further includes anadjustment mechanism 700. Theadjustment mechanism 700 includes anoperation part 710 and anexecution part 720. Theexecution part 720 is connected with the mounting rod and configured to adjust the length of the mountingrode 610, and theoperation part 710 is provided outside the processing chamber and configured to operate theexecution part 720. - For example, the mounting
rod 610 may include a cylinder, theoperation part 710 of theadjustment mechanism 700 may include a pneumatic valve, and theexecution part 720 of theadjustment mechanism 700 may include a pipe. By operating theoperation part 710, communication condition of the mountingrod 610 with a gas source can be controlled, and the mountingrod 610 can be controlled to be lengthened or to be shortened, and thereby the height of thecounterweight stopper 600 can be controlled. - In the present application, both ends of the
rotation shaft 300 are supported in holes on side walls of the processing chamber. For ease of the rotation of therotation shaft 300, in some exemplary embodiments, the substrate processing apparatus further includes twobearings 800 provided around two ends of therotation shaft 300, respectively, and thesense element 200 and thesubstrate sensor 110 are positioned at a side of one of thebearings 800 distal to the processing chamber, the one of thebearings 800, thesense element 200 and thesubstrate sensor 110 being at the same side of the processing chamber. - As described above, the substrate processing apparatus further includes a controller and a spraying mechanism. The spraying mechanism includes a spraying head provided inside the processing chamber. An output terminal of the controller is connected to a control terminal of the spraying mechanism, and an input terminal of the controller is connected to an output terminal of the substrate sensing assembly. Upon receiving the first sensing signal from the substrate sensing assembly, the controller transmits a first control signal to the control terminal of the spraying mechanism to control the spraying mechanism to spray.
- In a case where the substrate processing apparatus further includes the initial position sensor, the input terminal of the controller is connected to the output terminal of the substrate sensing assembly. Upon receiving the second sensing signal, the controller transmits a second control signal to the spraying mechanism to control the spraying mechanism to stop spraying.
- For ease of conveying the substrate, in some exemplary embodiments as illustrated in
FIG. 6 , the substrate processing apparatus includes a plurality oftransmission shafts 900 provided inside the processing chamber, and therotation shaft 300 is provided between twoadjacent transmission shafts 900. Thetransmission shaft 900 is provided withtransmission rollers 910 and can rotate about its own axis so as to transfer the substrate entering the processing chamber to the outside of the processing chamber. - The operation principle of the substrate processing apparatus according to embodiments of the present invention will be described below with reference to
FIG. 6 . - As illustrated in the drawing, the
rotation shaft 300 is provided between twotransmission shafts 900. - When there is no substrate inside the processing chamber, driven by the counterweight, the
sense element 200 is in the sensing range of theinitial position sensor 120, and theinitial position sensor 120 transmits the second sensing signal to the controller, so the controller controls the spraying mechanism not to spray the treatment liquid. - When the substrate enters into the processing chamber through an entry of the processing chamber, the
transmission shaft 900 rotates to drive the substrate to move along a direction indicated by an arrow inFIG. 6 . - Once the substrate contacts the
contact member 430, thecontact member 430 is pressed downward, drives therotation shaft 300 to rotate about its own axis along the first direction, and drives thesense element 200 to move towards thesubstrate sensor 110 and eventually enter into the sensing range of thesubstrate sensor 110. At this moment, thesubstrate sensor 110 transmits the first sensing signal to the controller so as to control the spraying mechanism to spray the treatment liquid into the processing chamber. - The
transmission shaft 900 continues to drive the substrate to move along the direction indicated by the arrow, and when the substrate comes into no contact with thecontact member 430, thecounterweight 420 drives therotation shaft 300 to rotate counterclockwise, and drives thesense element 200 to move towards theinitial position sensor 120. Theinitial position sensor 120 transmits the second sensing signal to the controller when thesense element 200 completely reaches the sensing range of theinitial position sensor 120, and the controller controls the spraying mechanism to stop spraying. - It can be understood that the foregoing embodiments are merely exemplary embodiments used for describing the principle of the present invention, but the present invention is not limited thereto. Those of ordinary skill in the art may make various variations and improvements without departing from the spirit and essence of the present invention, and these variations and improvements shall also fall into the protection scope of the present invention.
Claims (21)
Applications Claiming Priority (4)
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CN201610252093 | 2016-04-21 | ||
CN201610252093.6 | 2016-04-21 | ||
CN201610252093.6A CN105679698B (en) | 2016-04-21 | 2016-04-21 | Substrate board treatment |
PCT/CN2017/000027 WO2017181731A1 (en) | 2016-04-21 | 2017-01-03 | Substrate processing apparatus |
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US20180218930A1 true US20180218930A1 (en) | 2018-08-02 |
US10049906B1 US10049906B1 (en) | 2018-08-14 |
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US15/545,441 Expired - Fee Related US10049906B1 (en) | 2016-04-21 | 2017-01-03 | Substrate processing apparatus |
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CN105679698B (en) * | 2016-04-21 | 2018-09-18 | 京东方科技集团股份有限公司 | Substrate board treatment |
US20210013072A1 (en) * | 2017-11-30 | 2021-01-14 | China Triumph International Engineering Co., Ltd. | Method for determining a substrate position in a closed chamber and apparatus for performing the method |
CN110634789B (en) * | 2018-06-22 | 2021-08-24 | 合肥欣奕华智能机器有限公司 | Adjusting method of glass bearing device |
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JP2797657B2 (en) * | 1990-06-01 | 1998-09-17 | 松下電器産業株式会社 | High frequency heating equipment |
CN1220256C (en) * | 2002-12-27 | 2005-09-21 | 友达光电股份有限公司 | Detector for substrate defect |
CN201952487U (en) * | 2010-12-01 | 2011-08-31 | 东莞宏威数码机械有限公司 | Vacuum substrate heating and loading device |
KR101413708B1 (en) | 2012-11-26 | 2014-06-30 | 하이디스 테크놀로지 주식회사 | Apparatus for aligning substrate |
CN105468025B (en) * | 2014-09-05 | 2018-10-23 | 浙江同景新能源集团有限公司 | Photovoltaic Dual-spindle linked tracking system |
CN203877494U (en) * | 2014-06-18 | 2014-10-15 | 北京京东方光电科技有限公司 | Glass substrate conveying press wheel automatic adjusting mechanism |
CN104617018B (en) | 2015-01-23 | 2017-07-11 | 深圳市华星光电技术有限公司 | A kind of substrate board treatment and substrate processing method using same |
CN105679698B (en) | 2016-04-21 | 2018-09-18 | 京东方科技集团股份有限公司 | Substrate board treatment |
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2016
- 2016-04-21 CN CN201610252093.6A patent/CN105679698B/en not_active Expired - Fee Related
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2017
- 2017-01-03 WO PCT/CN2017/000027 patent/WO2017181731A1/en active Application Filing
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CN105679698A (en) | 2016-06-15 |
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WO2017181731A1 (en) | 2017-10-26 |
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