WO2017179829A1 - Carrier for deposition - Google Patents

Carrier for deposition Download PDF

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Publication number
WO2017179829A1
WO2017179829A1 PCT/KR2017/003000 KR2017003000W WO2017179829A1 WO 2017179829 A1 WO2017179829 A1 WO 2017179829A1 KR 2017003000 W KR2017003000 W KR 2017003000W WO 2017179829 A1 WO2017179829 A1 WO 2017179829A1
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WO
WIPO (PCT)
Prior art keywords
deposition
carrier
inner space
body portion
plate
Prior art date
Application number
PCT/KR2017/003000
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French (fr)
Korean (ko)
Inventor
김현중
김홍철
김정래
김철훈
최병경
Original Assignee
주식회사 쎄코
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Publication of WO2017179829A1 publication Critical patent/WO2017179829A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source

Definitions

  • the present invention relates to a deposition carrier, and more particularly, to a deposition carrier that can improve deposition efficiency.
  • the base material on which vacuum deposition is performed is made of oxides such as silicon oxide, titanium oxide, zirconium oxide, fluoride such as magnesium fluoride, chromium, nickel, aluminum, stainless steel, etc. Attempts have been made to form various thin film deposition layers using inorganic powders and granular materials such as metals to exhibit various properties.
  • the deposition layer is made of metal and metal oxide, etc., which causes side effects of easily corroded or contaminated by the external environment and film removal.
  • an attempt is made to form an hydrophobic to water repellent film by coating an organic material.
  • a carrier is used which impregnates the organic deposition material so that it can be used in a vacuum.
  • Such deposition is performed by a vacuum deposition method, that is, a deposition method using an electron beam and a resistive heating method that is a thermal method.
  • a vacuum deposition method that is, a deposition method using an electron beam and a resistive heating method that is a thermal method.
  • the deposition method using an electron beam is advantageous due to the convenience of the process and the possibility of automation, but the resistance heating method is mainly performed due to the characteristics of the organic deposition material used in vacuum deposition and the carrier that can impregnate it. .
  • the carrier on which the deposition material is supported is made of a porous material formed by compressing ceramic or metal particles / fibers.
  • the deposition process is performed by heating such a carrier. At this time, some of the vaporized deposition material is in contact with the heated heater, so that some of the deposition material is pyrolyzed by high heat. As a result, the deposition efficiency is reduced, and foreign matter is generated to contaminate the surface of the substrate to be deposited.
  • Patent Document 1 Publication No. 10-2009-0011432 (Published date: February 2, 2009)
  • Patent Document 2 Registered Patent Publication No. 10-1404047 (Notification Date: June 10, 2014)
  • the present invention is to provide a carrier for deposition that can improve the deposition efficiency.
  • a deposition carrier characterized in that it is introduced into the pores.
  • the plate portion discloses a deposition carrier, characterized in that having a porosity of 90% to 95%.
  • each of the pores has a size of 5ppi to 60ppi.
  • the plate portion discloses a carrier for deposition, characterized in that the open cell type metal foam (open cell type metal foam).
  • the plate portion discloses a deposition carrier, characterized in that it has a higher thermal conductivity than the body portion.
  • the body part may include at least one fixing part recessed from the outer side of the body part toward the inner space to protrude from the inner side of the body part and positioned above the upper surface of the plate part.
  • a carrier for vapor deposition Disclosed is a carrier for vapor deposition.
  • the body portion discloses a deposition carrier, characterized in that it comprises a finish extending from the upper end of the body portion toward the inner space portion.
  • the plate portion is made of a plurality, and discloses a carrier for deposition, characterized in that laminated.
  • the deposition carrier according to the present invention has the effect of improving the deposition efficiency.
  • FIG. 1 is a perspective view showing a carrier for deposition according to a first preferred embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view of a plate part in the deposition carrier shown in FIG. 1.
  • FIG. 3 is an enlarged photograph of a portion of a plate part in the deposition carrier shown in FIG. 1.
  • FIG. 4 is a cross-sectional view illustrating a state in which a deposition material is accommodated in the deposition carrier shown in FIG. 1.
  • Fig. 5 is a perspective view showing a deposition carrier according to a second preferred embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a state in which a deposition material is accommodated in the deposition carrier shown in FIG. 5.
  • FIG. 7 is a cross-sectional view illustrating a state in which a deposition material is accommodated in a deposition carrier according to a third embodiment of the present invention.
  • FIG. 1 is a perspective view showing a deposition carrier 100 according to a preferred embodiment of the present invention
  • Figure 2 is a perspective view showing an enlarged plate portion 102 in the deposition carrier 100 shown in FIG. 3 is an enlarged photograph of a portion of the plate portion 102 in the deposition carrier 100 shown in FIG. 1
  • FIG. 4 is a deposition material M in the deposition carrier 100 shown in FIG. 1.
  • the deposition carrier 100 includes a body portion 101 and a plate portion 102 and accommodates a deposition material M. Heated to and used to deposit the vaporized deposition material M onto the surface of the substrate to be deposited.
  • the body portion 101 has an inner space portion 101a, and a part of the inner space portion 101a, particularly the upper portion, is open.
  • the deposition material M may be accommodated in the inner space 101a of the body 101 through the open top.
  • the body portion 101 may be positioned such that the open top faces the surface of the substrate on which the deposition material M is to be deposited.
  • the body 101 is heated, and the deposition material M in contact with the body 101 is also heated.
  • the body portion 101 is made of a metal material such as stainless steel, iron, copper, molybdenum, tungsten, titanium, alloys thereof, and the like.
  • the body portion 101 is preferably made of stainless steel.
  • the body portion 101 has a cylindrical shape, as shown.
  • the diameter is 5mm to 60mm, preferably 10mm to 25mm
  • the height is 4mm to 12mm, preferably 6mm to 8mm
  • the thickness is 0.10mm to 0.50mm And preferably from 0.15 mm to 0.35 mm.
  • the thickness of the body portion 101 is less than 0.10mm, the body portion 101 can be easily deformed, while if the thickness of the body portion 101 is greater than 0.50mm, the processing of the body portion 101 itself is becomes difficult.
  • the body portion 101 is not limited to being made of only a cylindrical shape, it may be made of a variety of shapes, such as rectangular cylinder shape, triangular cylinder shape.
  • the inner space portion 101a has a shape corresponding to the shape of the body portion 101 with the upper portion open.
  • the body portion 101 includes a fixing portion 111 and the finishing portion 113.
  • the fixing portion 111 is recessed toward the inner space portion 101a from the outer surface of the body portion 101. At this time, the inner surface of the body portion 101 protrudes toward the inner space portion 101a by the fixing portion 111. In addition, the fixing portion 111 is located above the upper surface of the plate portion 102 located in the inner space portion 101a.
  • the upper portion of the plate portion 102 contacts the fixing portion 111 and the inner space portion 101a. It can be maintained in a fixed state and is not separated from the body portion (101).
  • the fixing portion 111 is formed by the beading treatment or embossing of the body portion 101.
  • the beading process is such that one fixing portion 111 is formed as a whole along the circumferential direction of the body portion 101 as shown in this embodiment, and the embossing treatment is spaced along the circumferential direction of the body portion 101 While forming the plurality of fixing parts 111 to be formed.
  • the finishing portion 113 extends from an upper end of the body portion 101 and bends toward the inner space portion 101a. When the plate portion 102 is located in the inner space portion 101a, the plate portion 102 is in contact with the finish portion 113 so that the plate portion 102 is not separated from the body portion 101. That is, the finishing portion 113 is used in combination with the fixing portion 111 to prevent the separation of the plate portion 102 from the body portion 101.
  • the finish portion 113 is bent, the upper end of the finish portion 113 is formed in a round shape. Thus, the worker can safely handle the body portion 101.
  • the plate portion 102 has a plate shape and is located in the inner space portion 101a of the body portion 101.
  • a plurality of pores 102a are formed in the plate portion 102, and at least some of the pores 102a are connected to each other.
  • the deposition material M is accommodated in the inner space 101a of the body portion 101, the deposition material M is introduced into the pores 102a.
  • the plate portion 102 is located below the inner space portion 101a and may be used to prevent the deposition material M from flowing inside the inner space portion 101a.
  • the plate portion 102 can be sufficiently used to heat the deposition material M.
  • the edge of the plate portion 102 is in contact with the inner side surface of the inner space portion 101a.
  • the plate portion 102 covers at least a portion of the bottom surface of the inner space portion (101a).
  • the plate portion 102 is heated in contact with the body portion 101 to heat and vaporize the deposition material M introduced into the pore 102a. That is, the deposition material M corresponding to the opened portion of the inner space portion 101a is also uniformly heated. Therefore, the deposition material M may be vaporized and uniformly discharged from the internal space 101a to be deposited on the surface of the substrate to be deposited.
  • the plate portion 102 has a porosity of 90% to 95% due to the pores 102a.
  • the porosity means the ratio of the total volume of the pores 102a to the total volume of the plate portion 102.
  • the plate portion 102 provides a fairly large surface area due to the pores 102a.
  • heat transfer is performed between the plate portion 102 and the deposition material M through the upper surface of the plate portion 102 and the inner surface of the pores 102a, and the deposition material M introduced into the pores 102a. ) May be heated and vaporized to deposit on the surface of the substrate to be deposited.
  • the porosity of the plate portion 102 is less than 90%, the inflow of the deposition material M into the pores 102a may be somewhat limited, whereas if the porosity of the plate portion 102 is greater than 95% The part 102 may be deformed by heat or external force.
  • each of the pores 102a has a size of 5 ppi to 60 ppi.
  • the size of the pores 102a is less than 5 ppi, heat transfer from the plate portion 102 made through the inner surface of the pores 102a to the deposition material M may be somewhat limited, whereas the pore 102a If the size of the larger than 60 ppi it is difficult to be formed in the plate portion 102 due to the size too small.
  • ppi pore per inch means the number of pores per inch.
  • the plate portion 102 may be made of a metal material, such as stainless steel, iron, copper, molybdenum, tungsten, titanium, alloys thereof, and the like, similar to the body portion 101.
  • the plate portion 102 is preferably made of copper, nickel, aluminum, aluminum alloy and the like having a higher thermal conductivity than the body portion 101, which is stainless steel. This allows for faster heat transfer in the plate portion 102 so that the deposition material M in the pores 102a can be uniformly vaporized corresponding to the plate portion 102.
  • the plate portion 102 is made of a disk shape in consideration of the shape of the inner space 101a.
  • the plate portion 102 is not limited to a disc shape, and may be formed in various shapes such as a square plate and a triangular plate according to the shape of the inner space portion 101a of the body portion 101. In some cases, the plate portion 102 may have a size corresponding to the inner space portion 101a.
  • the plate 102 has a plurality of pores 102a and is made of a metal material, and thus may be formed of an open cell type metal foam.
  • the plate portion 102 can be easily machined to have the porosity and the size of the pores 102a to be obtained.
  • the deposition carrier 100 of the present embodiment as described above is uniformly heated the deposition material (M) by the combination of the body portion 101 and the plate portion 102, and is deposited through the open top of the body portion 101 Discharge the material (M) uniformly. As a result, the deposition material M uniformly reaches the surface of the substrate to be deposited from the body portion 101. Therefore, the deposition carrier 100 of the present embodiment improves the deposition efficiency.
  • FIG. 5 is a perspective view illustrating a deposition carrier 200 according to a second preferred embodiment of the present invention
  • FIG. 6 is a view illustrating a deposition material M being accommodated in the deposition carrier 200 shown in FIG. 5. It is a cross section.
  • the deposition carrier 200 according to the second preferred embodiment of the present invention has a body portion 201 and a plate portion 202 similar to the deposition carrier 100 of the first embodiment. ). However, in the present embodiment, the number of plate portions 201 is different. This embodiment will be described mainly on the points different from the first embodiment.
  • the plate part 201 consists of a plurality and is laminated
  • the height of the fixing part 211 is determined in consideration of the overall thickness of the plate parts 201. For this reason, various numbers of plate portions 201 may be located in the internal space 201a of the body portion 201 according to the position where the fixing portion 211 is formed.
  • the body portion 201 of the present embodiment does not include the finishing portion 113 of the first embodiment, the upper end of the body portion 201 may be rounded through polishing. Thus, the worker can safely handle the body portion 201.
  • FIG. 7 is a cross-sectional view illustrating a state in which the deposition material M is accommodated in the deposition carrier 300 according to the third embodiment of the present invention.
  • the deposition carrier 300 includes a body portion 301 and a plate portion 302, except for the plate portion 302. It has the same configuration as the deposition carrier 200 of the second embodiment.
  • the plate portion 302 may have a thickness corresponding to the overall thickness of the plate portion 202 of the second embodiment of the plurality.
  • the plate part 302 may be fixed to the inner space part 301a by contacting the fixing part 311.
  • various thicknesses and various numbers of plate parts may be located in the inner space.
  • an appropriate thickness and number of plate portions may be selected.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Catalysts (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Disclosed is a carrier for deposition, comprising: a body part having an opened upper part so as to expose an internal space part, and having deposition material accommodated in the internal space part; and a plate part formed in a plate shape, having a plurality of pores of which at least a portion are connected to each other, and located in the internal space part so as to come into contact with the body part, wherein at least a portion of the deposition material accommodated in the internal space part is introduced into the pores. The carrier for deposition improves deposition efficiency.

Description

증착용 담체Deposition Carrier
본 발명은 증착용 담체에 관한 것으로서, 특히, 증착 효율을 향상시킬 수 있는 증착용 담체에 관한 것이다.The present invention relates to a deposition carrier, and more particularly, to a deposition carrier that can improve deposition efficiency.
최근 들어 안경렌즈를 포함한 각종 광학용 렌즈 및 필터분야를 비롯하여 스마트폰, 태블릿 PC, 노트북 등의 휴대용 전자제품 및 디스플레이 제품 등에 진공증착공정을 이용하여 반사방지, 광학적 필터링, 반사율 및 흡수율의 조절, 컬러링 등의 다양한 시도가 수행되고 있다. 이에 진공증착이 수행되는 모재는 유리, 플라스틱 및 금속으로 이루어진 기재(substrate)의 표면에 산화규소, 산화티탄, 산화지르코늄 등의 산화물, 불화마그네슘 등의 불화물, 크롬, 니켈, 알루미늄, 스테인리스 스틸 등의 금속 등과 같은 무기질 분말 및 입상 재료를 이용하여 박막 증착층을 형성시켜 다양한 특성을 나타나게 시도하고 있다.Recently, anti-reflection, optical filtering, control of reflectance and absorption rate, coloring, etc., using vacuum deposition processes in various optical lens and filter fields including spectacle lenses, portable electronic products and display products such as smartphones, tablet PCs, notebooks, etc. Various attempts have been carried out. The base material on which vacuum deposition is performed is made of oxides such as silicon oxide, titanium oxide, zirconium oxide, fluoride such as magnesium fluoride, chromium, nickel, aluminum, stainless steel, etc. Attempts have been made to form various thin film deposition layers using inorganic powders and granular materials such as metals to exhibit various properties.
이러한 증착층은 금속 및 금속산화물 등으로 이루어져 외부환경에 의해 손쉽게 부식되거나 오염되어 탈막되는 부작용이 발생된다. 이러한 증착층의 탈막을 방지하기 위하여, 유기물을 코팅하여 소수성 내지 발수성 막을 형성시키기 위한 시도가 이루어지기도 한다. 이런 유기물을 증착하기 위한 방법 중 유기계 증착 물질을 함침시켜 진공 내에서 사용할 수 있도록 하는 담체가 이용된다.The deposition layer is made of metal and metal oxide, etc., which causes side effects of easily corroded or contaminated by the external environment and film removal. In order to prevent the deposition of such a deposition layer, an attempt is made to form an hydrophobic to water repellent film by coating an organic material. Among the methods for depositing such organic materials, a carrier is used which impregnates the organic deposition material so that it can be used in a vacuum.
이러한 증착은 진공증착에 의한 방법, 즉 전자빔을 이용한 증착 방법과 열적인 방법인 저항가열식 방법들이 사용되고 있다. 일반적으로는 공정의 편리성 및 자동화의 가능성으로 인해 전자빔을 이용한 증착 방법이 유리하나, 현재 진공증착에서 사용되는 유기계 증착 물질의 특성과 이를 함침할 수 있는 담체로 인해 저항가열식 방법이 주로 이루어지고 있다.Such deposition is performed by a vacuum deposition method, that is, a deposition method using an electron beam and a resistive heating method that is a thermal method. In general, the deposition method using an electron beam is advantageous due to the convenience of the process and the possibility of automation, but the resistance heating method is mainly performed due to the characteristics of the organic deposition material used in vacuum deposition and the carrier that can impregnate it. .
일반적으로, 증착 물질이 담지된 담체는 세라믹 또는 금속 입자/섬유를 압축하여 성형시킨 다공성 물질로 이루어진다. 이러한 담체의 가열을 통해 증착 공정이 이루어진다. 이때, 기화된 증착 물질 중 일부가 가열된 히터와 접촉되어, 증착 물질의 일부는 고열에 의해 열분해된다. 이로 인해, 증착 효율은 감소되고, 이물질이 발생되어 증착되는 기재의 표면이 오염되기도 한다.In general, the carrier on which the deposition material is supported is made of a porous material formed by compressing ceramic or metal particles / fibers. The deposition process is performed by heating such a carrier. At this time, some of the vaporized deposition material is in contact with the heated heater, so that some of the deposition material is pyrolyzed by high heat. As a result, the deposition efficiency is reduced, and foreign matter is generated to contaminate the surface of the substrate to be deposited.
또한, 담체의 형태로 인해, 증착 물질 중 일부만이 인접하게 위치한 기재의 표면을 향하고, 나머지 증착 물질은 기재의 표면의 반대쪽에 도달된다. 이로 인해, 증착 물질이 불순물과 반응하여 증착이 원활하게 이루어지지 않고, 증착이 균일하게 이루어지기 어렵다. 따라서, 증착 효율을 향상시킬 수 있는 증착용 담체가 요구되고 있는 실정이다.In addition, due to the shape of the carrier, only some of the deposition material faces the surface of the adjacently located substrate and the remaining deposition material reaches the opposite side of the surface of the substrate. As a result, the deposition material reacts with the impurities and thus the deposition is not smooth, and the deposition is difficult to be uniform. Therefore, there is a demand for a deposition carrier capable of improving deposition efficiency.
[선행기술문헌][Preceding technical literature]
[특허문헌][Patent Documents]
(특허문헌 1) 공개특허공보 제10-2009-0011432호(공개일: 2009년 2월 2일)(Patent Document 1) Publication No. 10-2009-0011432 (Published date: February 2, 2009)
(특허문헌 2) 등록특허공보 제10-1404047호(공고일: 2014년 6월 10일)(Patent Document 2) Registered Patent Publication No. 10-1404047 (Notification Date: June 10, 2014)
본 발명은 증착 효율을 향상시킬 수 있는 증착용 담체를 제공하고자 한다.The present invention is to provide a carrier for deposition that can improve the deposition efficiency.
본 발명은 상부가 개방되어 내부 공간부가 노출되고, 상기 내부 공간부에 증착 물질이 수용되는 몸체부; 및 판 형상으로 이루어지고, 적어도 일부가 상호 간에 연결되는 복수 개의 포어들이 형성되며, 상기 내부 공간부 안에 위치되어 상기 몸체부에 접촉되는 플레이트부를 포함하되, 상기 내부 공간부에 수용된 증착 물질의 적어도 일부는 상기 포어들 안에 유입되는 것을 특징으로 하는 증착용 담체를 개시한다.According to an aspect of the present invention, there is provided an upper portion of which an inner space portion is exposed, and a body portion in which a deposition material is received. And a plate portion formed in a plate shape and at least partially connected to each other, the plate portion being positioned in the inner space portion and contacting the body portion, wherein at least a portion of the deposition material accommodated in the inner space portion is included. Discloses a deposition carrier characterized in that it is introduced into the pores.
또한, 상기 플레이트부는 90% 내지 95%의 공극률을 갖는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, the plate portion discloses a deposition carrier, characterized in that having a porosity of 90% to 95%.
또한, 상기 포어들의 각각은 5ppi 내지 60ppi의 크기를 갖는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, it discloses a carrier for deposition, characterized in that each of the pores has a size of 5ppi to 60ppi.
또한, 상기 플레이트부는 개포형 발포 금속(open cell type metal foam)으로 이루어지는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, the plate portion discloses a carrier for deposition, characterized in that the open cell type metal foam (open cell type metal foam).
또한, 상기 플레이트부는 상기 몸체부보다 높은 열전도율을 갖는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, the plate portion discloses a deposition carrier, characterized in that it has a higher thermal conductivity than the body portion.
또한, 상기 몸체부는, 상기 몸체부의 외측면에서 상기 내부 공간부를 향하여 함몰형성되어 상기 몸체부의 내측면으로부터 돌출형성되고, 상기 플레이트부의 상면보다 상측에 위치되는 적어도 하나의 고정부를 포함하는 것을 특징으로 하는 증착용 담체를 개시한다.The body part may include at least one fixing part recessed from the outer side of the body part toward the inner space to protrude from the inner side of the body part and positioned above the upper surface of the plate part. Disclosed is a carrier for vapor deposition.
또한, 상기 몸체부는, 상기 몸체부의 상단으로부터 연장되어 상기 내부 공간부를 향하여 구부러지는 마감부를 포함하는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, the body portion discloses a deposition carrier, characterized in that it comprises a finish extending from the upper end of the body portion toward the inner space portion.
또한, 상기 플레이트부는 복수 개로 이루어지고, 적층되는 것을 특징으로 하는 증착용 담체를 개시한다.In addition, the plate portion is made of a plurality, and discloses a carrier for deposition, characterized in that laminated.
본 발명에 따른 증착용 담체는 증착 효율을 향상시키는 효과를 갖는다.The deposition carrier according to the present invention has the effect of improving the deposition efficiency.
도 1은 본 발명의 바람직한 제 1 실시예에 따른 증착용 담체를 도시하는 사시도이다.1 is a perspective view showing a carrier for deposition according to a first preferred embodiment of the present invention.
도 2는 도 1에 도시된 증착용 담체에서 플레이트부를 확대하여 도시하는 사시도이다.FIG. 2 is an enlarged perspective view of a plate part in the deposition carrier shown in FIG. 1.
도 3은 도 1에 도시된 증착용 담체에서 플레이트부의 일부를 확대하여 도시하는 사진이다.FIG. 3 is an enlarged photograph of a portion of a plate part in the deposition carrier shown in FIG. 1.
도 4는 도 1에 도시된 증착용 담체에 증착 물질이 수용된 모습을 도시하는 단면도이다.4 is a cross-sectional view illustrating a state in which a deposition material is accommodated in the deposition carrier shown in FIG. 1.
도 5는 본 발명의 바람직한 제 2 실시예에 따른 증착용 담체를 도시하는 사시도이다.Fig. 5 is a perspective view showing a deposition carrier according to a second preferred embodiment of the present invention.
도 6은 도 5에 도시된 증착용 담체에 증착 물질이 수용된 모습을 도시하는 단면도이다.6 is a cross-sectional view illustrating a state in which a deposition material is accommodated in the deposition carrier shown in FIG. 5.
도 7은 본 발명의 바람직한 제 3 실시예에 따른 증착용 담체에 증착 물질이 수용된 모습을 도시하는 단면도이다.7 is a cross-sectional view illustrating a state in which a deposition material is accommodated in a deposition carrier according to a third embodiment of the present invention.
이하 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다. 본 발명을 설명함에 있어서, 관련된 공지기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.
도 1은 본 발명의 바람직한 실시예에 따른 증착용 담체(100)를 도시하는 사시도이고, 도 2는 도 1에 도시된 증착용 담체(100)에서 플레이트부(102)를 확대하여 도시하는 사시도이며, 도 3은 도 1에 도시된 증착용 담체(100)에서 플레이트부(102)의 일부를 확대하여 도시하는 사진이고, 도 4는 도 1에 도시된 증착용 담체(100)에 증착 물질(M)이 수용된 모습을 도시하는 단면도이다.1 is a perspective view showing a deposition carrier 100 according to a preferred embodiment of the present invention, Figure 2 is a perspective view showing an enlarged plate portion 102 in the deposition carrier 100 shown in FIG. 3 is an enlarged photograph of a portion of the plate portion 102 in the deposition carrier 100 shown in FIG. 1, and FIG. 4 is a deposition material M in the deposition carrier 100 shown in FIG. 1. ) Is a cross-sectional view showing the state accommodated.
도 1 내지 도 4에 도시된 바와 같이, 본 발명의 바람직한 실시예에 따른 증착용 담체(100)는 몸체부(101) 및 플레이트부(102)를 포함하고, 증착 물질(M)을 수용한 상태로 가열되어, 기화된 증착 물질(M)을 증착하고자 하는 기재(substrate)의 표면에 증착시키는 데에 이용된다.1 to 4, the deposition carrier 100 according to a preferred embodiment of the present invention includes a body portion 101 and a plate portion 102 and accommodates a deposition material M. Heated to and used to deposit the vaporized deposition material M onto the surface of the substrate to be deposited.
몸체부(101)는 내부 공간부(101a)를 갖고, 내부 공간부(101a)의 일부, 특히 상부는 개방된다. 증착 물질(M)은 개방된 상부를 통해 몸체부(101)의 내부 공간부(101a)에 수용될 수 있다. 또한, 몸체부(101)는 개방된 상부가 증착 물질(M)을 증착하고자 하는 기재의 표면을 향하도록 위치될 수 있다. 증착 공정을 위하여, 몸체부(101)의 가열이 이루어지고, 몸체부(101)와 접촉된 증착 물질(M)의 가열도 이루어진다.The body portion 101 has an inner space portion 101a, and a part of the inner space portion 101a, particularly the upper portion, is open. The deposition material M may be accommodated in the inner space 101a of the body 101 through the open top. In addition, the body portion 101 may be positioned such that the open top faces the surface of the substrate on which the deposition material M is to be deposited. For the deposition process, the body 101 is heated, and the deposition material M in contact with the body 101 is also heated.
또한, 몸체부(101)는 금속 재료, 예컨대 스테인리스스틸, 철, 구리, 몰리브덴, 텅스텐, 티타늄, 및 이들의 합금 등으로 이루어진다. 특히, 본 실시예에서 몸체부(101)는 스테인리스스틸로 이루어지는 것이 바람직하다. 이로 인해, 몸체부(101)는 가열로 인한 변형이나 표면 손상이 이루어지지 않을 수 있으며, 몸체부(101)가 가열될 때 이물질이 증착 물질(M)에 유입되는 것이 현저하게 감소될 수 있다. Further, the body portion 101 is made of a metal material such as stainless steel, iron, copper, molybdenum, tungsten, titanium, alloys thereof, and the like. In particular, in this embodiment, the body portion 101 is preferably made of stainless steel. As a result, the body portion 101 may not be deformed or damaged due to heating, and when the body portion 101 is heated, it is possible to significantly reduce inflow of foreign matter into the deposition material M. FIG.
본 실시예에서 몸체부(101)는 도시된 바와 같이, 원통 형상으로 이루어진다. 이때, 몸체부(101)에서 직경은 5㎜ 내지 60㎜이고 바람직하게는 10㎜ 내지 25㎜이며, 높이는 4㎜ 내지 12㎜이고 바람직하게는 6㎜ 내지 8㎜이며, 두께는 0.10㎜ 내지 0.50㎜이고 바람직하게는 0.15㎜ 내지 0.35㎜이다. 또한, 몸체부(101)의 두께가 0.10㎜보다 작으면 몸체부(101)는 손쉽게 변형될 수 있는 반면에, 몸체부(101)의 두께가 0.50㎜보다 크면 몸체부(101) 자체의 가공이 어렵게 된다.In this embodiment, the body portion 101 has a cylindrical shape, as shown. At this time, in the body portion 101, the diameter is 5mm to 60mm, preferably 10mm to 25mm, the height is 4mm to 12mm, preferably 6mm to 8mm, the thickness is 0.10mm to 0.50mm And preferably from 0.15 mm to 0.35 mm. In addition, if the thickness of the body portion 101 is less than 0.10mm, the body portion 101 can be easily deformed, while if the thickness of the body portion 101 is greater than 0.50mm, the processing of the body portion 101 itself is Becomes difficult.
한편, 본 실시예에서 몸체부(101)는 원통 형상만으로 이루어진 것으로 한정되지 않고, 사각통 형상, 삼각통 형상 등 다양한 형상으로 이루어질 수 있다. 이때, 내부 공간부(101a)는 상부가 개방된 몸체부(101)의 형상에 상응하는 형상으로 이루어진다.On the other hand, in the present embodiment, the body portion 101 is not limited to being made of only a cylindrical shape, it may be made of a variety of shapes, such as rectangular cylinder shape, triangular cylinder shape. At this time, the inner space portion 101a has a shape corresponding to the shape of the body portion 101 with the upper portion open.
또한, 몸체부(101)는 고정부(111) 및 마감부(113)를 포함한다.In addition, the body portion 101 includes a fixing portion 111 and the finishing portion 113.
고정부(111)는 몸체부(101)의 외측면에서 내부 공간부(101a)를 향하여 함몰 형성된다. 이때, 몸체부(101)의 내측면은 고정부(111)에 의해 내부 공간부(101a)를 향하여 돌출된다. 또한, 고정부(111)는 내부 공간부(101a)에 위치되는 플레이트부(102)의 상면보다 상측에 위치된다. The fixing portion 111 is recessed toward the inner space portion 101a from the outer surface of the body portion 101. At this time, the inner surface of the body portion 101 protrudes toward the inner space portion 101a by the fixing portion 111. In addition, the fixing portion 111 is located above the upper surface of the plate portion 102 located in the inner space portion 101a.
플레이트부(102)가 내부 공간부(101a)에 위치되어 내부 공간부(101a)의 바닥면에 도달하면, 플레이트부(102)는 상측이 고정부(111)에 접촉되어, 내부 공간부(101a)에서 고정된 상태로 유지될 수 있고 몸체부(101)로부터 이탈되지 않는다.When the plate portion 102 is located in the inner space portion 101a and reaches the bottom surface of the inner space portion 101a, the upper portion of the plate portion 102 contacts the fixing portion 111 and the inner space portion 101a. It can be maintained in a fixed state and is not separated from the body portion (101).
한편, 고정부(111)는 몸체부(101)의 비딩 처리 또는 엠보 처리에 의해 형성된다. 여기서, 비딩 처리는 본 실시예에 도시된 바와 같이 몸체부(101)의 둘레방향을 따라 전체적으로 하나의 고정부(111)가 형성되도록 하고, 엠보 처리는 몸체부(101)의 둘레방향을 따라 간격을 형성하면서 복수 개의 고정부(111)들이 형성되도록 한다.On the other hand, the fixing portion 111 is formed by the beading treatment or embossing of the body portion 101. Here, the beading process is such that one fixing portion 111 is formed as a whole along the circumferential direction of the body portion 101 as shown in this embodiment, and the embossing treatment is spaced along the circumferential direction of the body portion 101 While forming the plurality of fixing parts 111 to be formed.
마감부(113)는 몸체부(101)의 상단으로부터 연장되어 내부 공간부(101a)를 향하여 구부러진다. 플레이트부(102)가 내부 공간부(101a)에 위치될 때, 플레이트부(102)는 상측이 마감부(113)에 접촉되어, 몸체부(101)로부터 이탈되지 않게 된다. 즉, 마감부(113)는 고정부(111)와 조합하여 몸체부(101)로부터 플레이트부(102)의 이탈을 방지하는 데에 이용된다.The finishing portion 113 extends from an upper end of the body portion 101 and bends toward the inner space portion 101a. When the plate portion 102 is located in the inner space portion 101a, the plate portion 102 is in contact with the finish portion 113 so that the plate portion 102 is not separated from the body portion 101. That is, the finishing portion 113 is used in combination with the fixing portion 111 to prevent the separation of the plate portion 102 from the body portion 101.
또한, 마감부(113)가 구부러진 형태이기에, 마감부(113)의 상단은 둥근 형태로 이루어진다. 이로 인해, 작업자는 몸체부(101)를 안전하게 취급할 수 있다.In addition, since the finish portion 113 is bent, the upper end of the finish portion 113 is formed in a round shape. Thus, the worker can safely handle the body portion 101.
플레이트부(102)는 판 형상으로 이루어지고, 몸체부(101)의 내부 공간부(101a)에 위치된다. 플레이트부(102)에는 복수 개의 포어(102a)들이 형성되고, 포어들(102a)들 중 적어도 일부는 상호 간에 연결된다. 또한, 증착 물질(M)이 몸체부(101)의 내부 공간부(101a)에 수용될 때, 증착 물질(M)은 포어(102a)들 안으로 유입된다. 플레이트부(102)는 내부 공간부(101a)의 하부에 위치되고, 증착 물질(M)이 내부 공간부(101a)의 내부에서 유동하는 것을 방지하는 데에 이용될 수 있다. 또한, 플레이트부(102)가 내부 공간부(101a)의 하부에 위치됨에 따라, 플레이트부(102)는 증착 물질(M)을 가열하는 데에 충분히 이용될 수 있다. The plate portion 102 has a plate shape and is located in the inner space portion 101a of the body portion 101. A plurality of pores 102a are formed in the plate portion 102, and at least some of the pores 102a are connected to each other. In addition, when the deposition material M is accommodated in the inner space 101a of the body portion 101, the deposition material M is introduced into the pores 102a. The plate portion 102 is located below the inner space portion 101a and may be used to prevent the deposition material M from flowing inside the inner space portion 101a. In addition, as the plate portion 102 is positioned below the inner space portion 101a, the plate portion 102 can be sufficiently used to heat the deposition material M. FIG.
플레이트부(102)가 내부 공간부(101a) 안에 위치될 때, 플레이트부(102)의 가장자리는 내부 공간부(101a)의 내측면에 접촉된다. 이때, 플레이트부(102)는 내부 공간부(101a)의 바닥면의 적어도 일부를 덮는다. 이로 인해, 플레이트부(102)는 몸체부(101)에 접촉되어 가열되어, 포어(102a) 안에 유입된 증착 물질(M)을 가열하여 기화시킨다. 즉, 내부 공간부(101a)의 개방된 일부에 대응하는 증착 물질(M)도 균일하게 가열된다. 따라서, 증착 물질(M)은 기화되어 내부 공간부(101a)로부터 균일하게 배출되어 증착하고자 하는 기재의 표면에 증착될 수 있다.When the plate portion 102 is located in the inner space portion 101a, the edge of the plate portion 102 is in contact with the inner side surface of the inner space portion 101a. At this time, the plate portion 102 covers at least a portion of the bottom surface of the inner space portion (101a). Thus, the plate portion 102 is heated in contact with the body portion 101 to heat and vaporize the deposition material M introduced into the pore 102a. That is, the deposition material M corresponding to the opened portion of the inner space portion 101a is also uniformly heated. Therefore, the deposition material M may be vaporized and uniformly discharged from the internal space 101a to be deposited on the surface of the substrate to be deposited.
또한, 플레이트부(102)는 포어(102a)들로 인해 90% 내지 95%의 공극률을 갖는다. 여기서, 공극률은 플레이트부(102)의 총 체적에 대한 포어(102a)들의 총 체적의 비율을 의미한다. 이때, 플레이트부(102)는 포어(102a)들로 인해 상당히 넓은 표면적을 제공하게 된다. 이로 인해, 플레이트부(102)의 상면 및 포어(102a)들의 내측면을 통해 플레이트부(102)와 증착 물질(M) 사이의 열전달이 이루어지고, 포어(102a)들 안에 유입된 증착 물질(M)은 가열 및 기화되어 증착하고자 하는 기재의 표면에 증착될 수 있다. In addition, the plate portion 102 has a porosity of 90% to 95% due to the pores 102a. Here, the porosity means the ratio of the total volume of the pores 102a to the total volume of the plate portion 102. At this time, the plate portion 102 provides a fairly large surface area due to the pores 102a. As a result, heat transfer is performed between the plate portion 102 and the deposition material M through the upper surface of the plate portion 102 and the inner surface of the pores 102a, and the deposition material M introduced into the pores 102a. ) May be heated and vaporized to deposit on the surface of the substrate to be deposited.
한편, 플레이트부(102)의 공극률이 90%보다 작으면 포어(102a)들 안으로 증착 물질(M)의 유입이 다소 제한될 수 있는 반면에, 플레이트부(102)의 공극률이 95%보다 크면 플레이트부(102)는 열 또는 외력에 의해 변형될 우려가 있다. On the other hand, if the porosity of the plate portion 102 is less than 90%, the inflow of the deposition material M into the pores 102a may be somewhat limited, whereas if the porosity of the plate portion 102 is greater than 95% The part 102 may be deformed by heat or external force.
또한, 포어(102a)들의 각각은 5ppi 내지 60ppi의 크기를 갖는다. 한편, 포어(102a)들의 크기가 5ppi보다 작으면 포어(102a)들의 내측면을 통해 이루어지는 플레이트부(102)로부터 증착 물질(M)로의 열전달이 다소 제한될 우려가 있는 반면에, 포어(102a)들의 크기가 60ppi보다 크면 너무 작은 크기로 인해 플레이트부(102)에 형성되는 데에 어려움이 있다. 여기서, ppi(pore per inch)는 1인치 당 포어들의 개수를 의미한다.In addition, each of the pores 102a has a size of 5 ppi to 60 ppi. On the other hand, if the size of the pores 102a is less than 5 ppi, heat transfer from the plate portion 102 made through the inner surface of the pores 102a to the deposition material M may be somewhat limited, whereas the pore 102a If the size of the larger than 60 ppi it is difficult to be formed in the plate portion 102 due to the size too small. Here, ppi (pore per inch) means the number of pores per inch.
또한, 플레이트부(102)는 몸체부(101)와 마찬가지로, 금속 재료, 예컨대 스테인리스스틸, 철, 구리, 몰리브덴, 텅스텐, 티타늄, 및 이들의 합금 등으로 이루어질 수 있다. 특히, 본 실시예에서는 플레이트부(102)는 스테인리스틸인 몸체부(101)보다 높은 열전도율을 갖는 구리, 니켈, 알루미늄, 알루미늄 합금 등으로 이루어지는 것이 바람직하다. 이로 인해, 플레이트부(102)에서 더 신속한 열전달이 이루어져, 포어(102a)들 안의 증착 물질(M)은 플레이트부(102)에 대응하여 균일하게 기화될 수 있다. In addition, the plate portion 102 may be made of a metal material, such as stainless steel, iron, copper, molybdenum, tungsten, titanium, alloys thereof, and the like, similar to the body portion 101. In particular, in this embodiment, the plate portion 102 is preferably made of copper, nickel, aluminum, aluminum alloy and the like having a higher thermal conductivity than the body portion 101, which is stainless steel. This allows for faster heat transfer in the plate portion 102 so that the deposition material M in the pores 102a can be uniformly vaporized corresponding to the plate portion 102.
한편, 본 실시예에서, 플레이트부(102)는 내부 공간부(101a)의 형상을 고려하여 원판 형상으로 이루어진다. 또한, 플레이트부(102)는 원판 형상으로만 한정되지 않고, 몸체부(101)의 내부 공간부(101a)의 형상에 따라 사각판, 삼각판 등 다양한 형상으로 이루어질 수 있다. 경우에 따라, 플레이트부(102)는 내부 공간부(101a)에 상응하는 크기를 가질 수 있다.On the other hand, in the present embodiment, the plate portion 102 is made of a disk shape in consideration of the shape of the inner space 101a. In addition, the plate portion 102 is not limited to a disc shape, and may be formed in various shapes such as a square plate and a triangular plate according to the shape of the inner space portion 101a of the body portion 101. In some cases, the plate portion 102 may have a size corresponding to the inner space portion 101a.
상기와 같이 플레이트부(102)는 복수 개의 포어(102a)들을 갖고 금속 재료로 이루어지기에, 개포형 발포 금속(open cell type metal foam)으로 이루어질 수 있다. 이 경우에, 플레이트부(102)는 획득하고자 하는 공극률 및 포어(102a)들의 크기를 갖도록 용이하게 가공될 수 있다.As described above, the plate 102 has a plurality of pores 102a and is made of a metal material, and thus may be formed of an open cell type metal foam. In this case, the plate portion 102 can be easily machined to have the porosity and the size of the pores 102a to be obtained.
상기와 같은 본 실시예의 증착용 담체(100)는 증착 물질(M)을 몸체부(101)와 플레이트부(102)의 조합으로 균일하게 가열하고, 몸체부(101)의 개방된 상부를 통해 증착 물질(M)을 균일하게 배출시킨다. 이로 인해, 증착 물질(M)은 몸체부(101)로부터 증착하고자 하는 기재의 표면에 균일하게 도달하게 된다. 따라서, 본 실시예의 증착용 담체(100)는 증착 효율을 향상시킨다. The deposition carrier 100 of the present embodiment as described above is uniformly heated the deposition material (M) by the combination of the body portion 101 and the plate portion 102, and is deposited through the open top of the body portion 101 Discharge the material (M) uniformly. As a result, the deposition material M uniformly reaches the surface of the substrate to be deposited from the body portion 101. Therefore, the deposition carrier 100 of the present embodiment improves the deposition efficiency.
도 5는 본 발명의 바람직한 제 2 실시예에 따른 증착용 담체(200)를 도시하는 사시도이고, 도 6은 도 5에 도시된 증착용 담체(200)에 증착 물질(M)이 수용된 모습을 도시하는 단면도이다.FIG. 5 is a perspective view illustrating a deposition carrier 200 according to a second preferred embodiment of the present invention, and FIG. 6 is a view illustrating a deposition material M being accommodated in the deposition carrier 200 shown in FIG. 5. It is a cross section.
도 5와 도 6에 도시된 바와 같이, 본 발명의 바람직한 제 2 실시예에 따른 증착용 담체(200)는 제 1 실시예의 증착용 담체(100)와 마찬가지로 몸체부(201) 및 플레이트부(202)를 포함한다. 다만, 본 실시예는 플레이트부(201)의 개수가 상이하다. 본 실시예는 제 1 실시예와 상이한 점을 중심으로 기재하고자 한다.5 and 6, the deposition carrier 200 according to the second preferred embodiment of the present invention has a body portion 201 and a plate portion 202 similar to the deposition carrier 100 of the first embodiment. ). However, in the present embodiment, the number of plate portions 201 is different. This embodiment will be described mainly on the points different from the first embodiment.
플레이트부(201)는 복수 개로 이루어지고, 적층된다. 고정부(211)의 높이는 플레이트부(201)들의 전체 두께를 고려하여 결정된다. 이로 인해, 몸체부(201)의 내부 공간부(201a)에는 고정부(211)가 형성된 위치에 따라 다양한 개수의 플레이트부(201)들이 위치될 수 있다.The plate part 201 consists of a plurality and is laminated | stacked. The height of the fixing part 211 is determined in consideration of the overall thickness of the plate parts 201. For this reason, various numbers of plate portions 201 may be located in the internal space 201a of the body portion 201 according to the position where the fixing portion 211 is formed.
또한, 본 실시예의 몸체부(201)는 제 1 실시예의 마감부(113)를 포함하지 않으며, 몸체부(201)의 상단은 연마를 통해 라운딩 처리될 수 있다. 따라서, 작업자는 몸체부(201)를 안전하게 취급할 수 있다.In addition, the body portion 201 of the present embodiment does not include the finishing portion 113 of the first embodiment, the upper end of the body portion 201 may be rounded through polishing. Thus, the worker can safely handle the body portion 201.
도 7은 본 발명의 바람직한 제 3 실시예에 따른 증착용 담체(300)에 증착 물질(M)이 수용된 모습을 도시하는 단면도이다.7 is a cross-sectional view illustrating a state in which the deposition material M is accommodated in the deposition carrier 300 according to the third embodiment of the present invention.
도 7에 도시된 바와 같이, 본 발명의 바람직한 제 3 실시예에 따른 증착용 담체(300)는 몸체부(301) 및 플레이트부(302)를 포함하면서, 플레이트부(302)를 제외하고는 제 2 실시예의 증착용 담체(200)와 동일한 구성을 갖는다.As shown in FIG. 7, the deposition carrier 300 according to the third exemplary embodiment of the present invention includes a body portion 301 and a plate portion 302, except for the plate portion 302. It has the same configuration as the deposition carrier 200 of the second embodiment.
플레이트부(302)는 복수 개로 이루어진 제 2 실시예의 플레이트부(202)의 전체 두께에 상응하는 두께를 가질 수 있다. 플레이트부(302)는 고정부(311)에 접촉됨으로써 내부 공간부(301a)에 고정될 수 있다.The plate portion 302 may have a thickness corresponding to the overall thickness of the plate portion 202 of the second embodiment of the plurality. The plate part 302 may be fixed to the inner space part 301a by contacting the fixing part 311.
앞서 살펴본 바와 같이, 본 발명의 증착용 담체에는 다양한 두께 및 다양한 개수의 플레이트부가 내부 공간부에 위치될 수 있다. 증착 공정을 고려하여 적절한 두께 및 개수의 플레이트부가 선택될 수 있다.As described above, in the deposition carrier of the present invention, various thicknesses and various numbers of plate parts may be located in the inner space. In consideration of the deposition process, an appropriate thickness and number of plate portions may be selected.
이상, 구체적인 실시예에 관해서 설명하였으나, 본 발명의 범위에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 당해 분야에서 통상의 지식을 가진 자에게 있어서 자명하다 할 것이다.While specific embodiments have been described above, it will be apparent to those skilled in the art that various modifications may be made without departing from the scope of the present invention.
[부호의 설명][Description of the code]
100, 200, 300: 증착용 담체100, 200, 300: carrier for deposition
101, 201, 301: 몸체부101, 201, 301: body part
101a, 201a, 301a: 내부 공간부101a, 201a, 301a: internal space part
111, 211, 311: 고정부111, 211, 311: fixed part
113: 마감부113: finish
102, 202, 302: 플레이트부102, 202, and 302: plate portion
102a, 202a, 302a: 포어(pore)102a, 202a, and 302a: pores

Claims (8)

  1. 상부가 개방되어 내부 공간부가 노출되고, 상기 내부 공간부에 증착 물질이 수용되는 몸체부; 및A body part having an upper portion open to expose an inner space part and accommodating a deposition material in the inner space part; And
    판 형상으로 이루어지고, 적어도 일부가 상호 간에 연결되는 복수 개의 포어들이 형성되며, 상기 내부 공간부 안에 위치되어 상기 몸체부에 접촉되는 플레이트부를 포함하되,A plurality of pores are formed in a plate shape, at least a part of which is connected to each other, and includes a plate portion located in the inner space and in contact with the body portion,
    상기 내부 공간부에 수용된 증착 물질의 적어도 일부는 상기 포어들 안에 유입되는 것을 특징으로 하는 증착용 담체.At least a portion of the deposition material contained in the inner space is introduced into the pores.
  2. 제1항에 있어서, The method of claim 1,
    상기 플레이트부는 90% 내지 95%의 공극률을 갖는 것을 특징으로 하는 증착용 담체.And the plate portion has a porosity of 90% to 95%.
  3. 제1항에 있어서,The method of claim 1,
    상기 포어들의 각각은 5ppi 내지 60ppi의 크기를 갖는 것을 특징으로 하는 증착용 담체.Deposition carrier, characterized in that each of the pores has a size of 5ppi to 60ppi.
  4. 제1항에 있어서,The method of claim 1,
    상기 플레이트부는 개포형 발포 금속(open cell type metal foam)으로 이루어지는 것을 특징으로 하는 증착용 담체.And the plate portion is made of an open cell type metal foam.
  5. 제1항에 있어서,The method of claim 1,
    상기 플레이트부는 상기 몸체부보다 높은 열전도율을 갖는 것을 특징으로 하는 증착용 담체.And the plate portion has a higher thermal conductivity than the body portion.
  6. 제1항에 있어서, 상기 몸체부는,The method of claim 1, wherein the body portion,
    상기 몸체부의 외측면에서 상기 내부 공간부를 향하여 함몰형성되어 상기 몸체부의 내측면으로부터 돌출형성되고, 상기 플레이트부의 상면보다 상측에 위치되는 적어도 하나의 고정부를 포함하는 것을 특징으로 하는 증착용 담체.Deposition formed from the outer surface of the body portion toward the inner space portion is formed to protrude from the inner surface of the body portion, and the deposition carrier comprising at least one fixing portion located above the upper surface of the plate portion.
  7. 제1항에 있어서, 상기 몸체부는,The method of claim 1, wherein the body portion,
    상기 몸체부의 상단으로부터 연장되어 상기 내부 공간부를 향하여 구부러지는 마감부를 포함하는 것을 특징으로 하는 증착용 담체.And a finishing portion extending from an upper end of the body portion and bent toward the inner space portion.
  8. 제1항에 있어서,The method of claim 1,
    상기 플레이트부는 복수 개로 이루어지고, 적층되는 것을 특징으로 하는 증착용 담체.The plate portion is made of a plurality, deposition carrier, characterized in that laminated.
PCT/KR2017/003000 2016-04-11 2017-03-21 Carrier for deposition WO2017179829A1 (en)

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Citations (5)

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JP2008150678A (en) * 2006-12-19 2008-07-03 Sony Corp Evaporation source, vapor deposition apparatus, vapor deposition method, apparatus for manufacturing organic electroluminescence display unit, and method for manufacturing organic electroluminescence display unit
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KR20140017403A (en) * 2012-08-01 2014-02-11 (주)에버그린켐텍 Carrier of vacuum vapor deposition material
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JP2008150678A (en) * 2006-12-19 2008-07-03 Sony Corp Evaporation source, vapor deposition apparatus, vapor deposition method, apparatus for manufacturing organic electroluminescence display unit, and method for manufacturing organic electroluminescence display unit
KR20090011432A (en) * 2007-07-26 2009-02-02 주식회사 쎄코 Multipurpose carrier of vacuum vapor deposition material and method thereof
KR20140017403A (en) * 2012-08-01 2014-02-11 (주)에버그린켐텍 Carrier of vacuum vapor deposition material
KR20150002744U (en) * 2014-01-03 2015-07-13 박윤성 Cosmetics container

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