WO2017177906A1 - 一种可以射频通讯与支付的金属芯片卡 - Google Patents

一种可以射频通讯与支付的金属芯片卡 Download PDF

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Publication number
WO2017177906A1
WO2017177906A1 PCT/CN2017/080135 CN2017080135W WO2017177906A1 WO 2017177906 A1 WO2017177906 A1 WO 2017177906A1 CN 2017080135 W CN2017080135 W CN 2017080135W WO 2017177906 A1 WO2017177906 A1 WO 2017177906A1
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chip card
radio frequency
metal
antenna circuit
metal chip
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PCT/CN2017/080135
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English (en)
French (fr)
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扶志力
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深圳市高福科技有限公司
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Priority to US16/092,764 priority Critical patent/US10395163B2/en
Publication of WO2017177906A1 publication Critical patent/WO2017177906A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07788—Antenna details the antenna being of the capacitive type
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the problem to be solved by the present application is to provide a technical solution for effectively blocking the electromagnetic field interference between the metal card body and the RF antenna and the RF working circuit, so that the RFID and NFC working circuits can still exist in the metal card body.
  • the corresponding RF function is normally performed independently and without interference.
  • the metal chip card capable of communication and payment as described above, wherein the lower layer of the FPC/PCBA antenna circuit board is pasted with a curing protection sealant of the IC chip and the chip and the gold wire solder joint.

Abstract

一种可以射频通讯与支付的金属芯片卡，所述金属芯片卡的天线电路模块由FPC/PCBA天线电路板（11）和IC芯片（12）与芯片封胶（13）及双面镀金接触电极（26）构成，其下面粘贴有超薄铁氧体吸波电磁屏蔽层（27），其与铣有凹槽并内壁涂有热熔胶层（14）的金属材质的基片（28）热压封装成金属芯片卡。所述金属芯片卡可以在金属卡体上实现RFID、NFC射频功能并无障碍地正常使用。

Description

一种可以射频通讯与支付的金属芯片卡
交叉引用
本申请基于申请号为CN201620289896.4、申请日为2016年04月11日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及金属银行卡、会员卡、纪念卡等金属智能卡制造领域，解决了金属对RFID即射频识别和NFC即近距离无线通讯之天线的射频干扰问题，实现了RFID、NFC射频功能可以在金属卡上无障碍地正常使用。
背景技术
芯片卡是IC卡和ID卡的统称，通常又可称智能卡，它已是当今国际电子信息产业的热点产品之一，它的应用范围已不再局限于早期的通信领域，而广泛地应用于金融财务、社会保险、交通旅游、医疗卫生、政府行政、商品零售、休闲娱乐，学校管理等各种领域。
双界面芯片卡和非接触式芯片卡又称射频卡，它由IC芯片，感应天线组成，封装在一个标准的PVC塑料卡片内，芯片及天线无任何外露部分，它成功的将射频识别技术和IC技术结合起来，结束了无源和免接触这一难题，卡片在5-10mm范围内靠近读卡器表面，通过无线电波的传递来完成数据的读写操作。
目前市场上生产的PVC芯片卡封装结构的纵向剖面分解示意图如图1所示。IC芯片12贴片于印刷天线电路板11的下表层，封胶13固化和保护芯片及金丝焊接点，由PVC塑料基材制成的卡片15的上表面铣出一个凹槽，在其内壁上涂有热熔胶层14，将天线电路板模块热压入PVC卡体凹槽内，封装成PVC芯片卡。
现有的PVC芯片卡及其封装技术方案有以下缺点：
1、由PVC塑料材质制成的芯片卡，其品质的耐候性，可靠性，卡体寿命即耐用性都比金属材质的卡片差。
2、从外观，装璜上看，金属芯片卡更显高贵些，它应是智能卡产品中的高端化、差别化、精益化产品系列。
3、如果在金属卡体上使用PVC芯片卡的封装技术方案，由于金属卡体本身对射频天线的天然干扰，相应的天线电路无法产生正确的射频信号，从而无法实现相应的射频产品功能。
4、由于金属卡体对天线电路产生分布电容的影响，使其射频信号频率偏移，交流信号稳定性变差，射频交换的数据品质会受到减弱和干扰，无法与读卡器进行正常的射频信号交流与数据信息沟通。
所以，目前在全球范围成熟商业市场内，尚缺乏相关的全金属卡适用的RFID，NFC解决方案，现有的RFID、NFC射频方案使用于金属芯片卡，基本无法正常实现相应设计功能。
发明内容
本申请需要解决的问题是：提供一种可以有效隔断金属卡体与射频天线及射频工作电路之间的相关电磁场干扰的技术方案，使得RFID、NFC工作电路可以在金属卡体存在同时，仍然可以独立地不受干扰地正常进行相应的射频功能工作。
本申请技术方案的核心是：根据RFID或者双界面芯片定制设计NFC13.56MHz的微型天线方案，以FPC或者PCBA的方式呈现，FPC是指高密度配线、耐弯折，极薄的柔性电路板，PCBA是指经过SMT上件及DIP插件的印刷电路板，再于制作好的PCBA天线背面使用相匹配的厚度小于0.3mm的超薄铁氧体吸波电磁屏蔽材料作为中间层，使用粘胶将附有铁氧体吸波电磁屏蔽层材料的FPC/PCBA模块粘贴于铣好的金属卡体中。
本申请所述可以射频通讯与支付的金属芯片的天线电路模块，由FPC/PCBA天线电路和IC芯片与芯片封胶及双面镀金接触电极构成，其下表面粘贴有超薄铁氧体吸波电磁屏蔽层，其与铣有凹槽并内壁涂有热熔胶层的金属材质的基片热压封装成金属芯片卡。
如上所述的可以通讯与支付的金属芯片卡，其中，所述FPC/PCBA天线电路板的上表层镶嵌入面积小于卡面积1/4的NFC天线。如上所述的可以通讯与支付的金属芯片卡，其中，所述FPC/PCBA天线电路板的上表层还镶入双面镀金的接触电极。
如上所述的可以通讯与支付的金属芯片卡，其中，所述FPC/PCBA天线电路板的下表层粘贴有IC芯片及芯片和金丝焊接点的固化保护封胶。
如上所述的可以通讯与支付的金属芯片卡，其中，所述FPC/PCBA天线电路板的下表层还粘贴有厚度小于0.3mm的超薄铁氧体吸波电磁屏蔽材料层。
如上所述的可以通讯与支付的金属芯片卡，其中，所述铣有凹槽并内壁涂有热熔胶层的金属材质的基片的材料，是铜或者不锈钢或者轻质铝合金或者钛合金或者金或者银。
如上所述的可以通讯与支付的金属芯片卡，其中，所述铣有凹槽并内壁涂有热熔胶层的金属材质的基片的材料，是铜、不锈钢、轻质铝合金、钛合金、金、银。
本申请实现了具有RFID、NFC射频功能的全金属卡，并且可以根据通用射频功能智能卡的IC设计相应天线电路，形成相应功能的应用，也可设计为双界面金属芯片卡的应用，从而解决了智能卡通用产品领域目前尚无射频功能应用的金属芯片卡产品的问题。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些 实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1为常用的PVC芯片卡封装结构的纵向剖面分解示意图；
图2为本申请一种可以通讯与支付的金属芯片卡的封装结构的纵向剖面分解；
图3为本申请具体实施例之金属射频卡的封装结构的纵向剖面分解示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
参考图2，为本申请一种可以通讯与支付的金属芯片卡的封装结构的纵向剖面分解。所述可以射频通讯与支付的金属芯片的天线电路模块，由FPC/PCBA天线电路板11和IC芯片12与芯片封胶13及双面镀金接触电极26构成，其下表面粘贴有超薄铁氧体吸波电磁屏蔽层27，其与铣有凹槽并内壁涂有热熔胶层14的金属材质的基片28热压封装成金属芯片卡。
所述FPC/PCBA天线电路板11的上表层镶嵌入面积小于卡面积1/4的NFC天线。所述FPC/PCBA天线电路板11的上表层还镶入双面镀金的接触电极。
所述FPC/PCBA天线电路板11的下表层粘贴有IC芯片12和金丝焊接点的固化保护封胶。所述FPC/PCBA天线电路板11的下表层还粘贴有厚度小于0.3mm的超薄铁氧体吸波电磁屏蔽材料层。
所述铣有凹槽并内壁涂有热熔胶层14的金属材质的基片28的材料，是铜 或者不锈钢或者轻质铝合金或者钛合金或者金或者银。
本申请一种可以通讯与支付的金属芯片卡的具体实施方式的例子为非接触金属芯片卡，又可称金属射频卡，其封装结构的纵向剖面分解示意图如图3所示。根据射频卡的应用功能选择RFID功能的IC芯片12，其型号为NXP MifareS50，对应设计匹配的小尺寸天线，并制作为FPC/PCBA天线电路11，将芯片封装于FPC/PCBA的下表层并固化和封胶为13，在封有芯片的天线电路板FPC/PCBA的下表层贴装超薄铁氧体吸波电磁屏蔽材料层27，其厚度小于0.2mm，其导磁参数：Ferriteμ’＝50以上，磁损μ”＝1，将贴有超薄铁氧体吸波电磁屏蔽材料层的天线电路板模块，贴装与金属卡预先铣好的槽中，金属材质选用TC4钛合金，并同时在金属槽内壁涂热熔胶层14，以粘接芯片封胶13与金属槽体28，封装成金属芯片卡后，可以进行读卡和测试。数据读写卡和设备型号为HID OMINIKEY 5321，频率与品质因子值测试设备型号为Smartware US-CLT分析读卡器。测试结果：
(1)测试频率14MHz-16MHz，Q值在8-15。
(2)卡片单面可读，有效读卡距离大于1cm。
(3)个人化数据可有效写入与读出。
(4)测试结果显示，该金属芯片卡可以实现通讯与支付的NFC射频功能。
上述实施例为本申请较佳的实施方式，但本申请的实施方式并不受上述实施例的限制，其他的任何未背离本申请的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本申请的保护范围之内。

Claims (6)

  1. 一种可以射频通讯与支付的金属芯片卡，其特征在于：所述可以射频通讯与支付的金属芯片卡的天线电路模块，由FPC/PCBA天线电路板和IC芯片与芯片封胶及双面镀金接触电极构成，其下面粘贴有超薄铁氧体吸波电磁屏蔽层，其与铣有凹槽并内壁涂有热熔胶层的金属材质的基片热压封装成金属芯片卡。
  2. 如权利要求1所述可以射频通讯与支付的金属芯片卡，其特征在于：所述FPC/PCBA天线电路板的上表层镶嵌入面积小于卡面积1/4的NFC天线。
  3. 如权利要求1所述可以射频通讯与支付的金属芯片卡，其特征在于：所述FPC/PCBA天线电路板的上表层还镶嵌入双面镀金的接触电极。
  4. 如权利要求1所述可以射频通讯与支付的金属芯片卡，其特征在于：所述FPC/PCBA天线电路板的下表层粘贴有IC芯片和金丝焊接点的固化保护封胶。
  5. 如权利要求1所述可以射频通讯与支付的金属芯片卡，其特征在于：所述FPC/PCBA天线电路板的下表层还粘贴有厚度小于0.3mm的超薄铁氧体吸波电磁屏蔽材料层。
  6. 如权利要求1所述可以射频通讯与支付的金属芯片卡，其特征在于：所述铣有凹槽并内壁涂有热熔胶层的金属材质的基片的材料是铜或者不锈钢或者轻质铝合金或者钛合金或者金或者银。
PCT/CN2017/080135 2016-04-11 2017-04-11 一种可以射频通讯与支付的金属芯片卡 WO2017177906A1 (zh)

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US16/092,764 US10395163B2 (en) 2016-04-11 2017-04-11 Metal chip card capable of supporting radio frequency communication and payment

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CN201620289896.4U CN205721902U (zh) 2016-04-11 2016-04-11 一种可以射频通讯与支付的金属芯片卡
CN201620289896.4 2016-04-11

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US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10885419B2 (en) 2017-09-07 2021-01-05 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US10926439B2 (en) 2016-07-27 2021-02-23 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
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