WO2017172692A1 - Sputtering target assembly having a graded interlayer and methods of making - Google Patents

Sputtering target assembly having a graded interlayer and methods of making Download PDF

Info

Publication number
WO2017172692A1
WO2017172692A1 PCT/US2017/024440 US2017024440W WO2017172692A1 WO 2017172692 A1 WO2017172692 A1 WO 2017172692A1 US 2017024440 W US2017024440 W US 2017024440W WO 2017172692 A1 WO2017172692 A1 WO 2017172692A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
sputtering target
backing plate
interlayer
target
Prior art date
Application number
PCT/US2017/024440
Other languages
English (en)
French (fr)
Inventor
Stephane Ferrasse
Susan D. Strothers
Xinlin SHI
Diane L. MORALES
Original Assignee
Honeywell International Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc. filed Critical Honeywell International Inc.
Priority to JP2018552003A priority Critical patent/JP6728389B2/ja
Priority to CN201780028419.XA priority patent/CN109154073A/zh
Priority to EP17776421.4A priority patent/EP3436618B1/en
Priority to KR1020187030315A priority patent/KR102267761B1/ko
Publication of WO2017172692A1 publication Critical patent/WO2017172692A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00Products made by additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106Coating with metal alloys or metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/129Flame spraying
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/131Wire arc spraying
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134Plasma spraying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
PCT/US2017/024440 2016-04-01 2017-03-28 Sputtering target assembly having a graded interlayer and methods of making WO2017172692A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018552003A JP6728389B2 (ja) 2016-04-01 2017-03-28 傾斜中間層を有するスパッタリングターゲットアセンブリ及び作製方法
CN201780028419.XA CN109154073A (zh) 2016-04-01 2017-03-28 具有分级夹层的溅射靶组件和制造方法
EP17776421.4A EP3436618B1 (en) 2016-04-01 2017-03-28 Sputtering target assembly having a graded interlayer and methods of making
KR1020187030315A KR102267761B1 (ko) 2016-04-01 2017-03-28 그레이딩된 중간층을 갖는 스퍼터링 타깃 조립체 및 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662316701P 2016-04-01 2016-04-01
US62/316,701 2016-04-01
US15/470,581 US20170287685A1 (en) 2016-04-01 2017-03-27 Sputtering target assembly having a graded interlayer and methods of making
US15/470,581 2017-03-27

Publications (1)

Publication Number Publication Date
WO2017172692A1 true WO2017172692A1 (en) 2017-10-05

Family

ID=59961223

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/024440 WO2017172692A1 (en) 2016-04-01 2017-03-28 Sputtering target assembly having a graded interlayer and methods of making

Country Status (7)

Country Link
US (1) US20170287685A1 (ko)
EP (1) EP3436618B1 (ko)
JP (1) JP6728389B2 (ko)
KR (1) KR102267761B1 (ko)
CN (1) CN109154073A (ko)
TW (1) TWI791432B (ko)
WO (1) WO2017172692A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019005972A1 (en) 2017-06-27 2019-01-03 Fluid Handling Llc METHOD FOR MODIFYING THE DIMENSIONS OF A PUMP PART IN CAST IRON
CA3200543A1 (en) 2017-07-28 2019-01-31 Fluid Handling Llc Fluid routing methods for a spiral heat exchanger with lattice cross section made via additive manufacturing
US11351590B2 (en) 2017-08-10 2022-06-07 Honda Motor Co., Ltd. Features of dissimilar material-reinforced blanks and extrusions for forming
US10532421B2 (en) * 2017-08-29 2020-01-14 Honda Motor Co., Ltd. UAM resistance spot weld joint transition for multimaterial automotive structures
US10870166B2 (en) 2018-02-01 2020-12-22 Honda Motor Co., Ltd. UAM transition for fusion welding of dissimilar metal parts
WO2019225472A1 (ja) * 2018-05-21 2019-11-28 株式会社アルバック スパッタリングターゲット及びその製造方法
CN113474108A (zh) * 2019-02-22 2021-10-01 欧瑞康表面处理解决方案股份公司普费菲孔 用于制造物理气相沉积(pvd)用靶的方法
JP7424093B2 (ja) * 2019-03-08 2024-01-30 株式会社リコー 立体造形物を造形する装置、立体造形物を造形する方法
CN110508809B (zh) * 2019-08-29 2020-11-17 华中科技大学 一种增材制造与表面涂覆复合成形系统及方法
EP3797904A1 (de) * 2019-09-27 2021-03-31 Flender GmbH Additives herstellungsverfahren mit härtung
US11465390B2 (en) 2020-03-02 2022-10-11 Honda Motor Co., Ltd. Post-process interface development for metal-matrix composites
US20230043638A1 (en) * 2020-10-14 2023-02-09 Questek Innovations Llc Steel to tungsten functionally graded material systems
US20220176449A1 (en) * 2020-12-07 2022-06-09 Divergent Technologies, Inc. Ultrasonic additive manufacturing of box-like parts
KR102370835B1 (ko) * 2020-12-16 2022-03-08 주식회사 이엠엘 3D 프린팅을 이용한 고효율 Zr계 실린더형 합금타겟 제조방법
CN112743216A (zh) * 2020-12-29 2021-05-04 宁波江丰电子材料股份有限公司 一种靶材和背板的焊接方法
CN112828316A (zh) * 2020-12-31 2021-05-25 西安铂力特增材技术股份有限公司 粉状金属实时混合均匀的方法及金属3d打印方法和装置
US11951542B2 (en) * 2021-04-06 2024-04-09 Eaton Intelligent Power Limited Cold spray additive manufacturing of multi-material electrical contacts
EP4323134A1 (en) * 2021-04-15 2024-02-21 Tokamak Energy Ltd Graded interlayer
GB202105385D0 (en) * 2021-04-15 2021-06-02 Tokamak Energy Ltd Graded interlayer
CN113523298B (zh) * 2021-06-30 2023-07-07 洛阳科威钨钼有限公司 一种平面锂靶材的制备方法
JP7378907B2 (ja) * 2022-02-28 2023-11-14 山陽特殊製鋼株式会社 3d造形用混合粉末の製造方法
CN117904619A (zh) 2023-04-28 2024-04-19 甚磁科技(上海)有限公司 一种合金靶材的制备装置及制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681143A (ja) * 1992-08-31 1994-03-22 Mitsubishi Kasei Corp スパッタリングターゲット及びその製造方法
WO2000006793A1 (en) 1998-07-27 2000-02-10 Applied Materials, Inc. Sputtering target assembly
US6619537B1 (en) 2000-06-12 2003-09-16 Tosoh Smd, Inc. Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers
US20040262157A1 (en) * 2003-02-25 2004-12-30 Ford Robert B. Method of forming sputtering target assembly and assemblies made therefrom
US20060065517A1 (en) 2002-06-14 2006-03-30 Tosoh Smd, Inc. Target and method of diffusion bonding target to backing plate
US20080197017A1 (en) * 2003-08-11 2008-08-21 Honeywell International Inc. Target/Backing Plate Constructions, and Methods of Forming Them
US20140141264A1 (en) * 2012-11-16 2014-05-22 The Boeing Company Interlayer composite substrates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
JP3660014B2 (ja) * 1995-03-31 2005-06-15 株式会社テクノファイン スパッタ用ターゲット
US5901336A (en) * 1996-08-30 1999-05-04 Brush Wellman Inc. Bonding beryllium to copper alloys using powder metallurgy compositional gradients
US6089444A (en) * 1997-09-02 2000-07-18 Mcdonnell Douglas Corporation Process of bonding copper and tungsten
US5988488A (en) * 1997-09-02 1999-11-23 Mcdonnell Douglas Corporation Process of bonding copper and tungsten
US6579431B1 (en) * 1998-01-14 2003-06-17 Tosoh Smd, Inc. Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers
EP1715077A4 (en) * 2003-12-25 2010-09-29 Nippon Mining Co ARRANGEMENT OF COPPER OR COPPER ALLOY STARGET AND COPPER ALLOY CARRIER PLATE
WO2008079461A2 (en) * 2006-09-08 2008-07-03 Reactive Nanotechnologies, Inc. Reactive multilayer joining with improved metallization techniques
US8439252B2 (en) * 2006-11-07 2013-05-14 Excelitas Technologies Gmbh & Co Kg Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode
TWI516624B (zh) * 2010-06-18 2016-01-11 烏明克公司 用於接合濺鍍靶的組件之方法,濺鍍靶組件的接合總成,及其用途
CN102248160B (zh) * 2011-07-07 2013-01-23 中国科学院理化技术研究所 一种钨/铜梯度材料的制备方法
CN103706939B (zh) * 2012-09-28 2015-10-28 清华大学 一种钨铜异种金属的扩散连接方法
WO2015008864A1 (ja) * 2013-07-18 2015-01-22 三菱マテリアル株式会社 シリコンターゲット構造体の製造方法およびシリコンターゲット構造体
CN104259644B (zh) * 2014-07-24 2016-04-27 有研亿金新材料有限公司 一种钨钛合金靶材焊接方法
CN105234547A (zh) * 2015-10-20 2016-01-13 兰微悦美(天津)科技有限公司 互不固溶金属的连接工艺

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681143A (ja) * 1992-08-31 1994-03-22 Mitsubishi Kasei Corp スパッタリングターゲット及びその製造方法
WO2000006793A1 (en) 1998-07-27 2000-02-10 Applied Materials, Inc. Sputtering target assembly
US6619537B1 (en) 2000-06-12 2003-09-16 Tosoh Smd, Inc. Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers
US20060065517A1 (en) 2002-06-14 2006-03-30 Tosoh Smd, Inc. Target and method of diffusion bonding target to backing plate
US20040262157A1 (en) * 2003-02-25 2004-12-30 Ford Robert B. Method of forming sputtering target assembly and assemblies made therefrom
US20080197017A1 (en) * 2003-08-11 2008-08-21 Honeywell International Inc. Target/Backing Plate Constructions, and Methods of Forming Them
US20140141264A1 (en) * 2012-11-16 2014-05-22 The Boeing Company Interlayer composite substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3436618A4

Also Published As

Publication number Publication date
KR102267761B1 (ko) 2021-06-24
TW201807228A (zh) 2018-03-01
TWI791432B (zh) 2023-02-11
JP2019518865A (ja) 2019-07-04
EP3436618A4 (en) 2019-12-25
CN109154073A (zh) 2019-01-04
US20170287685A1 (en) 2017-10-05
EP3436618B1 (en) 2023-05-03
EP3436618A1 (en) 2019-02-06
JP6728389B2 (ja) 2020-07-22
KR20190004702A (ko) 2019-01-14

Similar Documents

Publication Publication Date Title
EP3436618B1 (en) Sputtering target assembly having a graded interlayer and methods of making
US8893954B2 (en) Friction stir fabrication
EP2326443B1 (en) Method of producing objects containing nano metal or composite metal
US9101979B2 (en) Methods for fabricating gradient alloy articles with multi-functional properties
JP7018603B2 (ja) クラッド層の製造方法
CN112139650A (zh) 基于增材制造方法原位增材制备金属间化合物构件的方法
US20180323047A1 (en) Sputter target backing plate assemblies with cooling structures
EP2081714A1 (en) Method of producing products of amorphous metal
US20090101629A1 (en) Erosion resistant torch
CA3032195A1 (en) Aluminum alloy products, and methods of making the same
KR20210113640A (ko) 알루미늄 합금
JP2023156376A (ja) 付加製造された耐火金属部材、付加製造方法及び粉末
CN112839757B (zh) 硬化层的层叠方法和层叠造型物的制造方法
WO2020080425A1 (ja) 硬化層の積層方法、及び積層造形物の製造方法
KR20210087968A (ko) 적층 제조된 내화 금속 부품, 적층 제조 방법 및 분말
US20230073429A1 (en) Methods to create structures with engineered internal features, pores, and/or connected channels utilizing cold spray particle deposition
US11951542B2 (en) Cold spray additive manufacturing of multi-material electrical contacts
WO2022078630A1 (en) Method of manufacturing a build plate for use in an additive manufacturing process
KR101466039B1 (ko) 비정질 형성능을 가지는 금속원소를 포함하는 결정질 합금들의 접합 방법, 스퍼터링 타겟 구조체 및 그 제조방법
Beaman et al. Direct SLS Fabrication of Metals and Ceramics

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2018552003

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20187030315

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2017776421

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2017776421

Country of ref document: EP

Effective date: 20181102

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17776421

Country of ref document: EP

Kind code of ref document: A1