WO2017172692A1 - Sputtering target assembly having a graded interlayer and methods of making - Google Patents
Sputtering target assembly having a graded interlayer and methods of making Download PDFInfo
- Publication number
- WO2017172692A1 WO2017172692A1 PCT/US2017/024440 US2017024440W WO2017172692A1 WO 2017172692 A1 WO2017172692 A1 WO 2017172692A1 US 2017024440 W US2017024440 W US 2017024440W WO 2017172692 A1 WO2017172692 A1 WO 2017172692A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- sputtering target
- backing plate
- interlayer
- target
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/129—Flame spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/131—Wire arc spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018552003A JP6728389B2 (ja) | 2016-04-01 | 2017-03-28 | 傾斜中間層を有するスパッタリングターゲットアセンブリ及び作製方法 |
CN201780028419.XA CN109154073A (zh) | 2016-04-01 | 2017-03-28 | 具有分级夹层的溅射靶组件和制造方法 |
EP17776421.4A EP3436618B1 (en) | 2016-04-01 | 2017-03-28 | Sputtering target assembly having a graded interlayer and methods of making |
KR1020187030315A KR102267761B1 (ko) | 2016-04-01 | 2017-03-28 | 그레이딩된 중간층을 갖는 스퍼터링 타깃 조립체 및 제조 방법 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662316701P | 2016-04-01 | 2016-04-01 | |
US62/316,701 | 2016-04-01 | ||
US15/470,581 US20170287685A1 (en) | 2016-04-01 | 2017-03-27 | Sputtering target assembly having a graded interlayer and methods of making |
US15/470,581 | 2017-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017172692A1 true WO2017172692A1 (en) | 2017-10-05 |
Family
ID=59961223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2017/024440 WO2017172692A1 (en) | 2016-04-01 | 2017-03-28 | Sputtering target assembly having a graded interlayer and methods of making |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170287685A1 (ko) |
EP (1) | EP3436618B1 (ko) |
JP (1) | JP6728389B2 (ko) |
KR (1) | KR102267761B1 (ko) |
CN (1) | CN109154073A (ko) |
TW (1) | TWI791432B (ko) |
WO (1) | WO2017172692A1 (ko) |
Families Citing this family (22)
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---|---|---|---|---|
WO2019005972A1 (en) | 2017-06-27 | 2019-01-03 | Fluid Handling Llc | METHOD FOR MODIFYING THE DIMENSIONS OF A PUMP PART IN CAST IRON |
CA3200543A1 (en) | 2017-07-28 | 2019-01-31 | Fluid Handling Llc | Fluid routing methods for a spiral heat exchanger with lattice cross section made via additive manufacturing |
US11351590B2 (en) | 2017-08-10 | 2022-06-07 | Honda Motor Co., Ltd. | Features of dissimilar material-reinforced blanks and extrusions for forming |
US10532421B2 (en) * | 2017-08-29 | 2020-01-14 | Honda Motor Co., Ltd. | UAM resistance spot weld joint transition for multimaterial automotive structures |
US10870166B2 (en) | 2018-02-01 | 2020-12-22 | Honda Motor Co., Ltd. | UAM transition for fusion welding of dissimilar metal parts |
WO2019225472A1 (ja) * | 2018-05-21 | 2019-11-28 | 株式会社アルバック | スパッタリングターゲット及びその製造方法 |
CN113474108A (zh) * | 2019-02-22 | 2021-10-01 | 欧瑞康表面处理解决方案股份公司普费菲孔 | 用于制造物理气相沉积(pvd)用靶的方法 |
JP7424093B2 (ja) * | 2019-03-08 | 2024-01-30 | 株式会社リコー | 立体造形物を造形する装置、立体造形物を造形する方法 |
CN110508809B (zh) * | 2019-08-29 | 2020-11-17 | 华中科技大学 | 一种增材制造与表面涂覆复合成形系统及方法 |
EP3797904A1 (de) * | 2019-09-27 | 2021-03-31 | Flender GmbH | Additives herstellungsverfahren mit härtung |
US11465390B2 (en) | 2020-03-02 | 2022-10-11 | Honda Motor Co., Ltd. | Post-process interface development for metal-matrix composites |
US20230043638A1 (en) * | 2020-10-14 | 2023-02-09 | Questek Innovations Llc | Steel to tungsten functionally graded material systems |
US20220176449A1 (en) * | 2020-12-07 | 2022-06-09 | Divergent Technologies, Inc. | Ultrasonic additive manufacturing of box-like parts |
KR102370835B1 (ko) * | 2020-12-16 | 2022-03-08 | 주식회사 이엠엘 | 3D 프린팅을 이용한 고효율 Zr계 실린더형 합금타겟 제조방법 |
CN112743216A (zh) * | 2020-12-29 | 2021-05-04 | 宁波江丰电子材料股份有限公司 | 一种靶材和背板的焊接方法 |
CN112828316A (zh) * | 2020-12-31 | 2021-05-25 | 西安铂力特增材技术股份有限公司 | 粉状金属实时混合均匀的方法及金属3d打印方法和装置 |
US11951542B2 (en) * | 2021-04-06 | 2024-04-09 | Eaton Intelligent Power Limited | Cold spray additive manufacturing of multi-material electrical contacts |
EP4323134A1 (en) * | 2021-04-15 | 2024-02-21 | Tokamak Energy Ltd | Graded interlayer |
GB202105385D0 (en) * | 2021-04-15 | 2021-06-02 | Tokamak Energy Ltd | Graded interlayer |
CN113523298B (zh) * | 2021-06-30 | 2023-07-07 | 洛阳科威钨钼有限公司 | 一种平面锂靶材的制备方法 |
JP7378907B2 (ja) * | 2022-02-28 | 2023-11-14 | 山陽特殊製鋼株式会社 | 3d造形用混合粉末の製造方法 |
CN117904619A (zh) | 2023-04-28 | 2024-04-19 | 甚磁科技(上海)有限公司 | 一种合金靶材的制备装置及制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0681143A (ja) * | 1992-08-31 | 1994-03-22 | Mitsubishi Kasei Corp | スパッタリングターゲット及びその製造方法 |
WO2000006793A1 (en) | 1998-07-27 | 2000-02-10 | Applied Materials, Inc. | Sputtering target assembly |
US6619537B1 (en) | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
US20040262157A1 (en) * | 2003-02-25 | 2004-12-30 | Ford Robert B. | Method of forming sputtering target assembly and assemblies made therefrom |
US20060065517A1 (en) | 2002-06-14 | 2006-03-30 | Tosoh Smd, Inc. | Target and method of diffusion bonding target to backing plate |
US20080197017A1 (en) * | 2003-08-11 | 2008-08-21 | Honeywell International Inc. | Target/Backing Plate Constructions, and Methods of Forming Them |
US20140141264A1 (en) * | 2012-11-16 | 2014-05-22 | The Boeing Company | Interlayer composite substrates |
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US5522535A (en) * | 1994-11-15 | 1996-06-04 | Tosoh Smd, Inc. | Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies |
JP3660014B2 (ja) * | 1995-03-31 | 2005-06-15 | 株式会社テクノファイン | スパッタ用ターゲット |
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US6089444A (en) * | 1997-09-02 | 2000-07-18 | Mcdonnell Douglas Corporation | Process of bonding copper and tungsten |
US5988488A (en) * | 1997-09-02 | 1999-11-23 | Mcdonnell Douglas Corporation | Process of bonding copper and tungsten |
US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
EP1715077A4 (en) * | 2003-12-25 | 2010-09-29 | Nippon Mining Co | ARRANGEMENT OF COPPER OR COPPER ALLOY STARGET AND COPPER ALLOY CARRIER PLATE |
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-
2017
- 2017-03-27 US US15/470,581 patent/US20170287685A1/en not_active Abandoned
- 2017-03-28 CN CN201780028419.XA patent/CN109154073A/zh active Pending
- 2017-03-28 JP JP2018552003A patent/JP6728389B2/ja active Active
- 2017-03-28 KR KR1020187030315A patent/KR102267761B1/ko active IP Right Grant
- 2017-03-28 WO PCT/US2017/024440 patent/WO2017172692A1/en active Application Filing
- 2017-03-28 EP EP17776421.4A patent/EP3436618B1/en active Active
- 2017-03-31 TW TW106110978A patent/TWI791432B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0681143A (ja) * | 1992-08-31 | 1994-03-22 | Mitsubishi Kasei Corp | スパッタリングターゲット及びその製造方法 |
WO2000006793A1 (en) | 1998-07-27 | 2000-02-10 | Applied Materials, Inc. | Sputtering target assembly |
US6619537B1 (en) | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
US20060065517A1 (en) | 2002-06-14 | 2006-03-30 | Tosoh Smd, Inc. | Target and method of diffusion bonding target to backing plate |
US20040262157A1 (en) * | 2003-02-25 | 2004-12-30 | Ford Robert B. | Method of forming sputtering target assembly and assemblies made therefrom |
US20080197017A1 (en) * | 2003-08-11 | 2008-08-21 | Honeywell International Inc. | Target/Backing Plate Constructions, and Methods of Forming Them |
US20140141264A1 (en) * | 2012-11-16 | 2014-05-22 | The Boeing Company | Interlayer composite substrates |
Non-Patent Citations (1)
Title |
---|
See also references of EP3436618A4 |
Also Published As
Publication number | Publication date |
---|---|
KR102267761B1 (ko) | 2021-06-24 |
TW201807228A (zh) | 2018-03-01 |
TWI791432B (zh) | 2023-02-11 |
JP2019518865A (ja) | 2019-07-04 |
EP3436618A4 (en) | 2019-12-25 |
CN109154073A (zh) | 2019-01-04 |
US20170287685A1 (en) | 2017-10-05 |
EP3436618B1 (en) | 2023-05-03 |
EP3436618A1 (en) | 2019-02-06 |
JP6728389B2 (ja) | 2020-07-22 |
KR20190004702A (ko) | 2019-01-14 |
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