WO2017170882A1 - 硬化性組成物、硬化物の製造方法、およびその硬化物 - Google Patents
硬化性組成物、硬化物の製造方法、およびその硬化物 Download PDFInfo
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- WO2017170882A1 WO2017170882A1 PCT/JP2017/013287 JP2017013287W WO2017170882A1 WO 2017170882 A1 WO2017170882 A1 WO 2017170882A1 JP 2017013287 W JP2017013287 W JP 2017013287W WO 2017170882 A1 WO2017170882 A1 WO 2017170882A1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Definitions
- the present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and more specifically, a curable composition having a high glass transition temperature and excellent adhesion, a method for producing the cured product, and the method thereof. It relates to a cured product.
- Curable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members and the like. Various reports have been made regarding the improvement of such a curable composition.
- Patent Documents 1 to 3 propose an energy ray curable composition containing a cationic polymerizable component and a radical polymerizable component or a cured product thereof.
- Patent Document 1 proposes an adhesive composition for polarizing plates that is excellent in initial curability and adhesiveness.
- patent document 2 even when it is a case where a resin film with low moisture permeability is used as a protective film, the adhesive force is expressed immediately after light irradiation, and the adhesive force after a certain period of time is good against various forces.
- a low-viscosity photo-curing adhesive has been proposed that does not cause problems even after the endurance test and has good adhesive strength after the end of the wet heat resistance test.
- Patent Document 3 proposes an active energy ray-polymerizable resin composition that can satisfy both high heat resistance, high refractive index and transparency, including an unsaturated alicyclic epoxy ester compound.
- JP 2014-105218 A Japanese Patent Laying-Open No. 2015-040283 JP2015-168757A
- an object of the present invention is to provide a curable composition having a high glass transition temperature of the cured product and excellent adhesion, a method for producing the cured product, and a cured product thereof.
- the curable composition of the present invention comprises 45 to 90 parts by mass of the cationic polymerizable component (A), 0.001 to 15 parts by mass of the cationic polymerization initiator (B), 1 to 1 part of the radical polymerizable component (C).
- radical polymerization initiator (D) 1 to 10 parts by mass, the following formula (I), (Wherein X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, an aryloxy group having 6 to 12 carbon atoms, or a carbon atom)
- the cation polymerizable component (A) includes a glycidylated product of a polyhydric alcohol or a glycidylated product (A1) of a polyhydric alcohol alkylene oxide adduct, and an oxetane compound (A2) as essential components.
- the radical polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, a polyhydric alcohol acrylate ester having 2 to 20 carbon atoms, or a carbon atom number 2 to 20
- a polyhydric alcohol methacrylate (C2) is an essential component.
- the weight average molecular weight is a weight average molecular weight measured by GPC in a tetrahydrofuran (THF) solvent and obtained in terms of styrene.
- the curable composition of the present invention preferably further contains an aromatic epoxy compound (A3) as the cationic polymerizable component (A).
- the said aromatic epoxy compound (A3) is a polyfunctional aromatic epoxy compound.
- the polymer (E) is a polymer obtained from the monomer represented by the formula (I) and the monomer represented by the formula (II).
- X in the formula (I) is an aryl group having 6 to 12 carbon atoms
- X ′ in the formula (II) is an alkyl group having 1 to 7 carbon atoms, It is preferred that the group is substituted with an epoxy group.
- the method for producing a cured product of the present invention is characterized in that the curable composition of the present invention is irradiated with active energy rays or heated.
- the cured product of the present invention is a cured product of the curable composition of the present invention.
- the present invention it is possible to provide a curable composition having a high glass transition temperature and excellent adhesion, a method for producing the cured product, and a cured product thereof.
- the curable composition of the present invention is particularly useful for adhesives.
- the curable composition of the present invention comprises 45 to 90 parts by mass of the cationic polymerizable component (A), 0.001 to 15 parts by mass of the cationic polymerization initiator (B), and 1 to 15 parts by mass of the radical polymerizable component (C).
- radical polymerization initiator (D) 1 to 10 parts by weight, a polymer obtained from a monomer represented by the following formula (I), a polymer obtained from a monomer represented by the following formula (II) A polymer obtained from two or more monomers selected from the monomers represented by the following formula (I), two or more monomers selected from the monomers represented by the following formula (II) A weight average molecular weight selected from the group consisting of a polymer obtained from a monomer and a polymer obtained from a monomer represented by the following formula (I) and a monomer represented by the following formula (II): 1 to 20 parts by mass of a polymer (E) that is 000 to 30,000 .
- the cationically polymerizable component (A) essentially comprises a glycidylated product of a polyhydric alcohol or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1), and an oxetane compound (A2).
- the radical polymerizable component (C) is a compound having an epoxy group and an ethylenically unsaturated group (C1), an acrylate ester of a polyhydric alcohol having 2 to 20 carbon atoms, or 2 to 20 carbon atoms.
- the essential component is methacrylic acid ester (C2) of polyhydric alcohol.
- X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aryl group having 6 to 12 carbon atoms.
- An oxy group or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, or a hydrogen atom in these groups is one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group; Has been replaced.
- R 1 represents a hydrogen atom, a methyl group or a halogen atom
- X ′ represents an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms or a carbon atom.
- An alicyclic hydrocarbon group of 6 to 10 or a hydrogen atom in these groups substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group is there.
- the cationically polymerizable component (A) according to the curable composition of the present invention is a compound that undergoes polymerization or crosslinking reaction by a cationic polymerization initiator activated by irradiation with energy rays or heating.
- a cationic polymerization initiator activated by irradiation with energy rays or heating.
- An epoxy compound, an oxetane compound, a vinyl ether compound, etc. are mentioned.
- the cationically polymerizable component (A) according to the curable composition of the present invention comprises a glycidylated product of a polyhydric alcohol or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1) and an oxetane compound (A2) as essential components.
- aromatic epoxy compounds (A3) and alicyclic epoxy compounds (A4) can also be used as other epoxy compounds.
- Examples of the glycidylated product of the polyhydric alcohol or the glycidylated product (A1) of the polyhydric alcohol alkylene oxide adduct include those obtained by glycidylating a polyhydric alcohol or polyhydric alcohol alkylene oxide adduct, and the molecular weight of the glycidylated product is 250. The above is preferable.
- Examples of the glycidylated polyhydric alcohol or the glycidylated polyhydric alcohol alkylene oxide adduct (A1) include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether.
- glycidylated product of a polyhydric alcohol or a polyhydric alcohol alkylene oxide adduct (A1) a monoglycidyl ether of a higher aliphatic alcohol, a glycidyl ester of a higher fatty acid, epoxidized soybean oil, octyl epoxy stearate, Examples include epoxy butyl stearate, epoxidized soybean oil, and epoxidized polybutadiene.
- glycidylated product of the polyhydric alcohol or the glycidylated product (A1) of the polyhydric alcohol alkylene oxide adduct those having a saturated condensed ring are preferable because the curability and adhesion of the cured product are improved.
- glycidylated product of polyhydric alcohol or the glycidylated product (A1) of a polyhydric alcohol alkylene oxide adduct commercially available products can be used.
- Examples of the oxetane compound (A2) include 3,7-bis (3-oxetanyl) -5-oxa-nonane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2- Bis [(3-ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether Triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, Bifunctional aliphatic oxygen such as 1,6-bis (3-ethyl-3-o
- oxetane compound (A2) commercially available products can be used.
- the aromatic epoxy compound (A3) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound (A3) include polyphenols having at least one aromatic ring such as phenol, cresol, and butylphenol. Mono- or polyglycidyl etherified products of polyhydric phenols or alkylene oxide adducts thereof, such as glycidyl etherified products of epoxy compounds and bisphenol A, bisphenol F, or compounds obtained by further adding alkylene oxide to these, epoxy novolac resins; resorcinol, hydroquinone, catechol, etc.
- the aromatic epoxy compound (A3) commercially available products can be used.
- Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX -721, on-coat EX-1020, on-coat EX-1030, on-coat EX-1040, on-coat EX-1050, on-coat EX-1051, on-coat EX-1010, on-coat EX-1011, on-coat 1012 (Nagase Chemtex Co., Ltd.); Ogsol PG-100, Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (DIC Corporation) ESN-475 (Manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); Epicoat YX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA,
- the alicyclic epoxy compound (A4) refers to a saturated ring having an oxirane ring directly without a bonding group.
- Specific examples of the alicyclic epoxy compound (A4) are obtained by epoxidizing a polyglycidyl etherified product of a polyhydric alcohol having at least one alicyclic ring or a cyclohexene or cyclopentene ring-containing compound with an oxidizing agent. Examples include cyclohexene oxide and cyclopentene oxide-containing compounds.
- 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4 -Epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5 -Methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexanecarboxylate, methylenebis (3,4-epoxy Cyclohexane), propane-2,2-diyl-bis (3,
- alicyclic epoxy compound (A4) 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxyl
- the rate is preferable from the viewpoint of improving adhesion.
- alicyclic epoxy compound (A4) Commercially available products can be used as the alicyclic epoxy compound (A4), and examples thereof include Celoxide 2021P, Celoxide 2081, Celoxide 2000, and Celoxide 3000 (manufactured by Daicel Corporation).
- Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2- Examples thereof include hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether.
- the compound (A4) and vinyl ether compound are used in an amount of 50 to 80 masses of glycidylated product of polyhydric alcohol or polyhydric alcohol alkylene oxide adduct (A1) with respect to 100 parts by mass of the cationic polymerizable component (A).
- oxetane compound (A2) 20-50 parts by weight, aromatic epoxy compound (A3) 0-50 parts by weight, alicyclic epoxy compound (A4) 0-30 parts by weight, vinyl ether compound 0-20 parts by weight
- aromatic epoxy compound (A3) 0-50 parts by weight
- alicyclic epoxy compound (A4) 0-30 parts by weight
- vinyl ether compound 0-20 parts by weight it is preferable because viscosity, coating property, reactivity, and curability are improved.
- the cationic polymerization initiator (B) may be any compound as long as it can release a substance that initiates cationic polymerization by energy ray irradiation or heating.
- it is a double salt that is an onium salt that releases a Lewis acid upon irradiation with energy rays, or a derivative thereof.
- Representative examples of such compounds include the following general formula: [A] r + [B] r- And cation and anion salts represented by the formula:
- the cation [A] r + is preferably onium, and the structure thereof is, for example, the following general formula: [(R 2 ) a Q] r + Can be expressed as
- R 2 is an organic group having 1 to 60 carbon atoms and any number of atoms other than carbon atoms.
- a is an integer of 1 to 5.
- the a R 2 s are independent and may be the same or different.
- at least one is preferably an organic group as described above having an aromatic ring.
- the anion [B] r- is preferably a halide complex, and the structure thereof is, for example, the following general formula: [LY b ] r- .
- L is a metal or metalloid which is a central atom of a halide complex
- B P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like.
- Y is a halogen atom.
- b is an integer of 3 to 7.
- anion [LY b ] r- of the above general formula examples include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF 4 ) ⁇ , Examples include hexafluorophosphate (PF 6 ) ⁇ , hexafluoroantimonate (SbF 6 ) ⁇ , hexafluoroarsenate (AsF 6 ) ⁇ , hexachloroantimonate (SbCl 6 ) ⁇ and the like.
- the anion [B] r- is represented by the following general formula: [LY b-1 (OH)] r-
- the thing of the structure represented by can also be used preferably. L, Y, and b are the same as described above.
- Other anions that can be used include perchlorate ion (ClO 4 ) ⁇ , trifluoromethylsulfite ion (CF 3 SO 3 ) ⁇ , fluorosulfonate ion (FSO 3 ) ⁇ , and toluenesulfonate anion.
- Trinitrobenzenesulfonate anion camphor sulfonate, nonafluorobutane sulfonate, hexadecafluorooctane sulfonate, tetraarylborate, tetrakis (pentafluorophenyl) borate and the like.
- the onium salts it is particularly effective to use the following aromatic onium salts (a) to (c).
- aromatic onium salts (a) to (c) one of them can be used alone, or two or more of them can be mixed and used.
- Aryl diazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
- Diaryls such as diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-butylphenyl) iodonium hexafluorophosphate, and tricumyliodonium tetrakis (pentafluorophenyl) borate Iodonium salt
- Sulfonium salts such as sulfonium cations represented by the following group I or group II and hexafluoroantimony ions, hexafluorophosphate ions, tetrakis (pentafluorophenyl) borate ions, etc.
- Aromatic sulfonium salts having the following structure are used as cationic polymerization initiators (B ) It is more preferable to contain at least 0.1% by mass with respect to 100% by mass.
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 are each independently a hydrogen atom, a halogen atom, or a carbon atom number.
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or 1 carbon atom.
- R 30 , R 31 , R 32 , R 33 and R 34 each independently represents a hydrogen atom, a halogen atom or 1 to 10 carbon atoms. Represents an alkyl group.
- Examples of the halogen atom represented include fluorine, chlorine, bromine and iodine.
- R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Is methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t-amyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3- Methoxypropyl, 4-methoxybutyl, 2-
- the alkoxy group having 1 to 10 carbon atoms includes methoxy, ethoxy, propyloxy, isopropyloxy, butyloxy, s-butyloxy, t-butyloxy, isobutyloxy, pentyloxy, isoamyloxy, t-amyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-methoxyethyloxy, 3-methoxypropyloxy, 4- Methoxybutyloxy, 2-butoxye
- R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 R 29 , R 35 , R 36 , R 37 , R 38 and R 39 are ester groups having 2 to 10 carbon atoms such as methoxycarbonyl, ethoxycarbonyl, isopropyloxycarbonyl, phenoxycarbonyl, acetoxy, propionyl Examples include oxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, t-butylcarbonyloxy, methoxyacetyloxy, benzoyloxy and the like.
- the proportion of the cationic polymerization initiator (B) used relative to a total of 100 parts by mass of the component (A), the component (B) and the component (C) is 0.001 to 15 parts by mass of the cationic polymerization initiator (B), preferably 0.1 to 10 parts by mass. If the amount is too small, curing tends to be insufficient, and if the amount is too large, various physical properties such as the water absorption rate and the strength of the cured product may be adversely affected.
- the radical polymerizable component (C) according to the curable composition of the present invention is a compound (C1) having an epoxy group and an ethylenically unsaturated group, an acrylate ester of an alcohol having 2 to 20 carbon atoms, or the number of carbon atoms.
- the methacrylic acid ester (C2) of alcohol 2 to 20 is an essential component.
- Examples of the compound (C1) having an epoxy group and an ethylenically unsaturated group include epoxy acrylate or epoxy methacrylate.
- epoxy acrylate or epoxy methacrylate Specifically, conventionally known aromatic epoxy resins, alicyclic epoxy resins, An acrylate obtained by reacting an aliphatic epoxy resin or the like with acrylic acid or methacrylic acid.
- epoxy acrylates or epoxy methacrylates particularly preferred are acrylates or methacrylates of glycidyl ethers of alcohols.
- Examples of the acrylate of alcohol having 2 to 20 carbon atoms or the methacrylate (C2) of alcohol having 2 to 20 carbon atoms include aromatic or aliphatic alcohols having at least one hydroxyl group in the molecule, and alkylenes thereof. Examples thereof include acrylates or methacrylates obtained by reacting an oxide adduct with acrylic acid or methacrylic acid.
- radically polymerizable component (C) a compound that is polymerized or cross-linked by a radical polymerization initiator activated by energy ray irradiation or heating other than (C1) or (C2) can be used. Examples include urethane compounds, unsaturated polyester compounds, and styrene compounds.
- the proportion of the component (C1) and the component (C2) in the radical polymerizable component (C) is preferably 50% by mass or more.
- the radical initiator (D) according to the curable composition of the present invention is not particularly limited, and known ones can be used.
- ketone compounds such as acetophenone compounds, benzyl compounds, benzophenone compounds, and thioxanthone compounds, oxime compounds, and the like can be used.
- the polymer (E) according to the curable composition of the present invention is a polymer obtained from the monomer represented by the above formula (I), a polymer obtained from the monomer represented by the above formula (II), Polymer obtained from two or more monomers selected from monomers represented by formula (I), two or more monomers selected from monomers represented by formula (II) Selected from the group consisting of a polymer obtained from the above, a monomer represented by the above formula (I) and a polymer obtained from the monomer represented by the above formula (II), and the weight average molecular weight is in terms of polystyrene 1,000 to 30,000.
- alkyl group having 1 to 7 carbon atoms represented by X in the formula (I) examples include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, Examples include iso-amyl, tert-amyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl and the like.
- an alkyl group having 1 to 4 carbon atoms, or 1 to 1 carbon atom partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group 4 alkyl groups are preferable from the viewpoint of curability.
- alkoxy group having 1 to 7 carbon atoms represented by X in the formula (I) examples include methoxy, ethoxy, propyloxy, iso-propyloxy, butyloxy, sec-butyloxy, tert-butyloxy, iso-butyloxy, Amyloxy, iso-amyloxy, tert-amyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, and tert-heptyloxy.
- an alkoxy group having 1 to 4 carbon atoms, or 1 to 1 carbon atoms partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group 4 alkoxy groups are preferred from the viewpoint of curability.
- Examples of the aryl group having 6 to 12 carbon atoms represented by X in the above formula (I) include phenyl, methylphenyl, naphthyl and the like.
- Examples of the aryloxy group having 6 to 12 carbon atoms represented by X in the above formula (I) include phenyloxy, methylphenyloxy, naphthyloxy and the like.
- Examples of the alicyclic hydrocarbon group having 6 to 10 carbon atoms represented by X in the formula (I) include cyclohexyl, methylcyclohexyl, norbornyl, bicyclopentyl, bicyclooctyl, trimethylbicycloheptyl, tricyclooctyl. , Tricyclodecanyl, spirooctyl, spirobicyclopentyl, adamantyl, isobornyl and the like.
- alkyl group, alkoxy group, aryl group, aryloxy group, and alicyclic hydrocarbon group are selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group, and a carboxyl group in which the hydrogen atom in these groups is 1 It may be substituted with more than one group.
- examples of the monomer represented by the formula (I) include the following formulas (1) to (3): The monomer represented by these is mentioned.
- R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6.
- R 4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.
- R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6.
- examples of the halogen atom represented by R 1 include fluorine, chlorine, bromine and iodine.
- the alkyl group having 1 to 7 carbon atoms, the aryl group having 6 to 12 carbon atoms, or the alicyclic hydrocarbon group having 6 to 10 carbon atoms as X ′ can be represented by the above formula (I ).
- R 1 is the same as in the above formula (II)
- R 6 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- t is an integer of 1 to 6 It is.
- R 1 is the same as in Formula (II) above, R 7 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and q is an integer of 1 to 6 It is.
- R 1 is the same as in the above formula (II)
- R 8 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- y is an integer of 1 to 6 It is.
- the proportion of the monomer constituting the polymer is such that X is a carbon substituted with one or more groups selected from the group consisting of epoxy groups, oxetane groups, hydroxyl groups and carboxyl groups.
- X is a carbon substituted with one or more groups selected from the group consisting of epoxy groups, oxetane groups, hydroxyl groups and carboxyl groups.
- an alkyl group having 1 to 7 atoms, an aryl group having 6 to 12 carbon atoms, or an alicyclic hydrocarbon group having 6 to 10 carbon atoms the single group represented by the above (I) or (II) It is preferable to use the polymer in an amount of 10 to 100% by mass because the adhesiveness is improved.
- the total amount of the cationic polymerizable component (A), the radical polymerizable component (C), and the polymer (E) is 100 parts by mass, and the cationic polymerizable component (A) is 45%. ⁇ 90 parts by mass, 0.001 to 15 parts by mass of the cationic polymerization initiator (B), 1 to 15 parts by mass of the radical polymerizable component (C), and 1 to 10 parts by mass of the radical polymerization initiator (D). Parts, and the polymer (E) is 1 to 20 parts by mass. If the blending ratio is other than the above, the curability and adhesion of the cured product may be deteriorated.
- a sensitizer and / or a sensitization aid can be further used as necessary.
- the sensitizer is a compound that exhibits maximum absorption at a wavelength longer than the maximum absorption wavelength indicated by the cationic polymerization initiator (B) and promotes the polymerization initiation reaction by the cationic polymerization initiator (B).
- the sensitization aid is a compound that further promotes the action of the sensitizer.
- Sensitizers and sensitizers include anthracene compounds and naphthalene compounds.
- anthracene compound examples include those represented by the following formula (7).
- R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 2 to 12 carbon atoms
- R 52 represents a hydrogen atom. Or an alkyl group having 1 to 6 carbon atoms.
- anthracene compound represented by the above formula (7) include the following compounds.
- naphthalene compound examples include those represented by the following formula (8).
- R 53 and R 54 each independently represents an alkyl group having 1 to 6 carbon atoms.
- naphthalene compound represented by the above formula (8) include the following compounds.
- 4-methoxy-1-naphthol 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyloxy-1-naphthol, 1,4-dimethoxynaphthalene
- Examples thereof include 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene, 1,4-dibutoxynaphthalene and the like.
- the use ratio of the sensitizer and the sensitization aid to the cationic polymerizable component (A) is not particularly limited, and may be used at a generally normal use ratio within a range not inhibiting the purpose of the present invention. From the viewpoint of improving curability, the amount of the sensitizer and the sensitizer is 0.1 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable component (A).
- a silane coupling agent can be used as necessary.
- the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, and ethyltrimethoxysilane.
- Alkyl-functional alkoxysilanes vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, and other alkenyl-functional alkoxysilanes, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, ⁇ Epoxy-functional alkoxysilanes such as glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N- ⁇ (aminoethyl) - ⁇ Aminofunctional alkoxysilanes such as amino
- the amount of the silane coupling agent used is not particularly limited, but is usually in the range of 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of solids in the curable composition.
- the properties of the cured product can be improved by using a thermoplastic organic polymer as necessary.
- the thermoplastic organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly (meth) acrylic acid, styrene- (meth) acrylic acid copolymer, Examples include (meth) acrylic acid-methyl methacrylate copolymer, glycidyl (meth) acrylate-polymethyl (meth) acrylate copolymer, polyvinyl butyral, cellulose ester, polyacrylamide, and saturated polyester.
- the UV-absorbing agent is inactivated at room temperature, and the protective group is released by heating to a predetermined temperature, light irradiation, acid, etc. and activated.
- a compound exhibiting ultraviolet absorbing ability can also be used.
- coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, antifoaming agents, thickeners, surfactants, leveling agents, difficulty
- resin additives such as flame retardants, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, UV absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc. may be added. it can.
- the curable composition of the present invention is not particularly limited, and a solvent that can dissolve or disperse the components (A), (B), (C), (D) and (E) which are usually used is used.
- a solvent that can dissolve or disperse the components (A), (B), (C), (D) and (E) which are usually used is used.
- the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1 Ether solvents such as 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, acetic acid-n
- Paraffin solvents Paraffin solvents; halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, and 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; propylene carbonate, carbitol solvents Aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, water and the like. These solvents can be used as one or a mixture of two or more.
- the water content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less because the curability, adhesiveness, and liquid storage stability are improved. Too much moisture is not preferred because it may cause cloudiness or components may precipitate.
- the curable composition of the present invention is applied onto a support substrate by a known means such as a roll coater, a curtain coater, various types of printing, and immersion. Moreover, after once applying on support bases, such as a film, it can also transfer on another support base
- the material for the support substrate is not particularly limited and may be any commonly used material, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetylpropionyl.
- inorganic materials such as glass
- Cellulose esters such as cellulose and nitrocellulose; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxy Polyesters such as ethane-4,4′-dicarboxylate and polybutylene terephthalate; polystyrene; polyethylene, polypropylene, polymethylpente Polyolefin such as polyvinyl acetate, polyvinyl compounds such as polyvinyl chloride and polyvinyl fluoride, acrylic resins such as polymethyl methacrylate and polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxy Polymer materials such as ethylene, norbornene resin, and cycloolefin polymer (COP) can be used.
- the support substrate may
- examples of energy rays include ultraviolet rays, electron beams, X-rays, radiation, high frequencies, and the like, and ultraviolet rays are most preferable economically.
- examples of the ultraviolet light source include an ultraviolet laser, a mercury lamp, a xenon laser, and a metal halide lamp.
- the conditions for the method of curing the curable composition of the present invention by heating are 70 to 250 ° C. and 1 to 100 minutes. After performing pre-baking (PAB), pressurization and post-baking (PEB) may be performed, or baking may be performed at several different temperatures.
- the heating conditions vary depending on the type and mixing ratio of each component, but are, for example, 70 to 180 ° C., 5 to 15 minutes for an oven, and 1 to 5 minutes for a hot plate.
- a cured film can be obtained by heat treatment at 180 to 250 ° C., preferably 200 to 250 ° C., for 30 to 90 minutes for an oven and 5 to 30 minutes for a hot plate.
- curable composition of the present invention or a cured product thereof include adhesives, glasses, optical materials represented by imaging lenses, paints, coating agents, lining agents, inks, resists, liquid resists, printing Plates, color TVs, PC monitors, personal digital assistants, digital cameras, organic EL, touch panels and other display elements, insulating varnishes, insulating sheets, laminates, printed boards, semiconductor devices, LED packages, liquid crystal inlets, organic Sealants for EL, optical elements, electrical insulation, electronic parts, separation membranes, molding materials, putty, glass fiber impregnating agents, sealants, passivation films for semiconductors and solar cells, interlayers Insulating film, protective film, prism lens sheet used for backlight of liquid crystal display device, Fresnel label used for screen of projection TV, etc. Lens parts of lens sheets such as lens sheets, lenticular lens sheets, or backlights using such sheets, optical lenses such as micro lenses, optical elements, optical connectors, optical waveguides, castings for optical modeling, etc. Can be mentioned
- the display device of the present invention includes a transparent support, an undercoat layer, an antireflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coat layer, a lubricating layer, and a protective layer as necessary.
- cured material of this invention can be used for each layer.
- Examples 1 to 20, Comparative Examples 1 to 7 The components shown in [Table 1] to [Table 5] below were mixed thoroughly to obtain curable compositions of Examples 1 to 20 and curable compositions of Comparative Examples 1 to 7, respectively.
- the unit of an Example and a comparative example is a mass part.
- Compound (A1-1) Neopentyl glycol diglycidyl ether
- Compound (A1-2) 1,4-butanediol diglycidyl ether
- Compound (A2-1) Aron oxetane OXT-221 (manufactured by Toagosei Co., Ltd.)
- Compound (A3-1) Bisphenol type diglycidyl ether
- the following compound (B-1) was used as the cationic polymerization initiator (B).
- Compound (B-1) 50% propylene carbonate solution of a mixture of a compound represented by the following formula (9) and a compound represented by the following formula (10)
- the following compound (E-1) was used as the polymer (E).
- Polymer (E-1) copolymer of 75 parts by mass of methyl methacrylate and glycidyl methacrylate 25 (weight average molecular weight 7,000)
- the following compounds (E′-1) and (E′-2) were used.
- Compound (E′-1) copolymer of 75 parts by mass of methyl methacrylate and glycidyl methacrylate 25 (weight average molecular weight 800)
- Compound (E′-2 Copolymer of 75 parts by mass of methyl methacrylate and glycidyl methacrylate 25 (weight average molecular weight 35,000)
- compositions of Examples 1 to 20 and Comparative Examples 1 to 7 obtained above were applied to one corona-treated PMMA film (Sumitomo Chemical Co., Ltd .: Technoloy 125S001), and then another sheet.
- COP cycloolefin polymer, manufactured by Nippon Zeon: product number ZEONOR film 14-060
- film subjected to corona discharge treatment is bonded to a laminator, and light corresponding to 1000 mJ / cm 2 is emitted using an electrodeless ultraviolet lamp.
- a test piece was obtained by irradiation through a film and adhesion. About the obtained test piece, the 90 degree
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Abstract
Description
(式中、Xは、炭素原子数1~7のアルキル基、炭素原子数1~7のアルコキシ基、炭素原子数6~12のアリール基、炭素原子数6~12のアリールオキシ基もしくは炭素原子数6~10の脂環式炭化水素基、またはこれらの基中の水素原子が、エポキシ基、オキセタン基、水酸基およびカルボキシル基からなる群より選択される1種以上の基で置換されたものである)で表される単量体から得られるポリマー、下記式(II)、
(式中、R1は、水素原子、メチル基またはハロゲン原子を表し、X’は、炭素原子数1~7のアルキル基、炭素原子数6~12のアリール基もしくは炭素原子数6~10の脂環式炭化水素基、またはこれらの基中の水素原子が、エポキシ基、オキセタン基、水酸基およびカルボキシル基からなる群より選択される1種以上の基で置換されたものである)で表される単量体から得られるポリマー、前記式(I)で表される単量体から選択される二種以上の単量体から得られるポリマー、前記式(II)で表される単量体から選択される二種以上の単量体からな得られるポリマー、並びに前記式(I)で表される単量体および前記式(II)で表される単量体から得られるポリマーからなる群より選択される重量平均分子量1,000~30,000であるポリマー(E)1~20質量部とを、前記カチオン重合性成分(A)と前記ラジカル重合性成分(C)と前記ポリマー(E)との合計が100質量部となるように含有し、
前記カチオン重合性成分(A)が、多価アルコールのグリシジル化物または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A1)と、オキセタン化合物(A2)と、を必須成分とし、
前記ラジカル重合性成分(C)が、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20である多価アルコールのアクリル酸エステルあるいは炭素原子数2~20である多価アルコールのメタクリル酸エステル(C2)を必須成分とすることを特徴とするものである。ここで、重量平均分子量とは、テトラヒドロフラン(THF)溶媒中、GPCにより測定し、スチレン換算で求めた重量平均分子量をいう。
本発明の硬化性組成物は、カチオン重合性成分(A)45~90質量部と、カチオン重合開始剤(B)0.001~15質量部と、ラジカル重合性成分(C)1~15質量部と、ラジカル重合開始剤(D)1~10質量部と、下記式(I)で表される単量体から得られるポリマー、下記式(II)で表される単量体から得られるポリマー、下記式(I)で表される単量体から選択される二種以上の単量体から得られるポリマー、下記式(II)で表される単量体から選択される二種以上の単量体からな得られるポリマー、並びに下記式(I)で表される単量体および下記式(II)で表される単量体から得られるポリマーからなる群より選択される重量平均分子量1,000~30,000であるポリマー(E)1~20質量部と、を含有する。本発明の硬化性組成物においては、カチオン重合性成分(A)は、多価アルコールのグリシジル化物または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A1)と、オキセタン化合物(A2)と、を必須成分とし、ラジカル重合性成分(C)は、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20である多価アルコールのアクリル酸エステルあるいは炭素原子数2~20である多価アルコールのメタクリル酸エステル(C2)を必須成分とする。
[A]r+[B]r-
で表される陽イオンと陰イオンの塩を挙げることができる。
[(R2)aQ]r+
で表すことができる。
[LYb]r-で
表すことができる。
[LYb-1(OH)]r-
で表される構造のものも好ましく用いることができる。L,Y,bは上記と同様である。また、その他用いることのできる陰イオンとしては、過塩素酸イオン(ClO4)-、トリフルオロメチル亜硫酸イオン(CF3SO3)-、フルオロスルホン酸イオン(FSO3)-、トルエンスルホン酸陰イオン、トリニトロベンゼンスルホン酸陰イオン、カンファースルフォネート、ノナフロロブタンスルフォネート、ヘキサデカフロロオクタンスルフォネート、テトラアリールボレート、テトラキス(ペンタフルオロフェニル)ボレート等を挙げることができる。
下記の[表1]~[表5]に示す配合で各成分を十分に混合して、各々実施例1~20の硬化性組成物および比較例1~7の硬化性組成物を得た。なお、実施例および比較例の単位は質量部である。
化合物(A1-1):ネオペンチルグリコールジグリシジルエーテル
化合物(A1-2):1,4-ブタンジオールジグリシジルエーテル
化合物(A2-1):アロンオキセタンOXT-221(東亞合成(株)社製)
化合物(A3-1):ビスフェノール型ジグリシジルエーテル
化合物(A3-2):TECHMORE VG3101(芳香族3官能エポキシ:(株)プリンテック社製)
化合物(B-1):下記式(9)で表される化合物および下記式(10)で表される化合物の混合物のプロピレンカーボネート50%溶液
化合物(C1-1):エポキシエステルM-600A(共栄社化学(株)社製)
化合物(C1-2):エポキシエステル70PA(共栄社化学(株)社製)
化合物(C2-1):1,6-ヘキサンジオールジアクリレート
化合物(D-1):イルガキュア184(BASF社製)
ポリマー(E-1):メチルメタクリレート75質量部とグリシジルメタクリレート25の共重合体(重量平均分子量7,000)
化合物(E’-1):メチルメタクリレート75質量部とグリシジルメタクリレート25の共重合体(重量平均分子量800)
化合物(E’-2:メチルメタクリレート75質量部とグリシジルメタクリレート25の共重合体(重量平均分子量35,000)
得られた実施例1~20および比較例1~7の各硬化性組成物を、それぞれをポリエチレンテレフタレート(PET)フィルム上に、バーコーターで30μmの厚さに塗布し、メタルハライドランプを用いて3000mJ/cm2のエネルギーを照射した。24時間後にフィルムから接着剤硬化物を取り出し、(株)日立ハイテクサイエンス製の粘弾性測定装置(DMA7100)を用いTgおよび80℃における弾性率を測定した
上記で得られた実施例1~20および比較例1~7の組成物を、一枚のコロナ処理PMMAフィルム(住友化学(株)社製:テクノロイ125S001)にそれぞれ塗布した後、もう一枚のコロナ放電処理を施したCOP(シクロオレフィンポリマー、日本ゼオン製:品番ゼオノアフィルム14-060)フィルムとラミネーターを用いて貼り合わせ、無電極紫外光ランプを用いて1000mJ/cm2に相当する光をCOPフィルム越しに照射して接着して試験片を得た。得られた試験片につき、90度ピール試験を行った。
Claims (7)
- カチオン重合性成分(A)45~90質量部と、カチオン重合開始剤(B)0.001~15質量部と、ラジカル重合性成分(C)1~15質量部と、ラジカル重合開始剤(D)1~10質量部と、下記式(I)、
(式中、Xは、炭素原子数1~7のアルキル基、炭素原子数1~7のアルコキシ基、炭素原子数6~12のアリール基、炭素原子数6~12のアリールオキシ基もしくは炭素原子数6~10の脂環式炭化水素基、またはこれらの基中の水素原子が、エポキシ基、オキセタン基、水酸基およびカルボキシル基からなる群より選択される1種以上の基で置換されたものである)で表される単量体から得られるポリマー、下記式(II)、
(式中、R1は、水素原子、メチル基またはハロゲン原子を表し、X’は、炭素原子数1~7のアルキル基、炭素原子数6~12のアリール基もしくは炭素原子数6~10の脂環式炭化水素基、またはこれらの基中の水素原子が、エポキシ基、オキセタン基、水酸基およびカルボキシル基からなる群より選択される1種以上の基で置換されたものである)で表される単量体から得られるポリマー、前記式(I)で表される単量体から選択される二種以上の単量体から得られるポリマー、前記式(II)で表される単量体から選択される二種以上の単量体からな得られるポリマー、並びに前記式(I)で表される単量体および前記式(II)で表される単量体から得られるポリマーからなる群より選択される重量平均分子量1,000~30,000であるポリマー(E)1~20質量部とを、前記カチオン重合性成分(A)と前記ラジカル重合性成分(C)と前記ポリマー(E)との合計が100質量部となるように含有し、
前記カチオン重合性成分(A)が、多価アルコールのグリシジル化物または多価アルコールアルキレンオキサイド付加物のグリシジル化物(A1)と、オキセタン化合物(A2)と、を必須成分とし、
前記ラジカル重合性成分(C)が、エポキシ基およびエチレン性不飽和基を有する化合物(C1)、または炭素原子数2~20である多価アルコールのアクリル酸エステルあるいは炭素原子数2~20である多価アルコールのメタクリル酸エステル(C2)を必須成分とすることを特徴とする硬化性組成物。 - 前記カチオン重合性成分(A)として、さらに芳香族エポキシ化合物(A3)を含有する請求項1記載の硬化性組成物。
- 前記芳香族エポキシ化合物(A3)が、多官能芳香族エポキシ化合物である請求項2記載の硬化性組成物。
- 前記ポリマー(E)が、前記式(I)で表される単量体および前記式(II)で表される単量体から得られるポリマーであって、前記式(I)中のXが、炭素原子数6~12のアリール基であり、前記式(II)中のX’が、炭素原子数1~7のアルキル基であって、前記アルキル基がエポキシ基で置換されている請求項1記載の硬化性組成物。
- 請求項1~4のうちいずれか一項記載の硬化性組成物に、活性エネルギー線を照射することを特徴とする硬化性組成物の硬化方法。
- 請求項1~4のうちいずれか一項記載の硬化性組成物を、加熱することを特徴とする硬化性組成物の硬化方法。
- 請求項1~4のうちいずれか一項記載の硬化性組成物の硬化物であることを特徴とする硬化物。
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