WO2017150460A1 - Condensateur à film de type enroulé - Google Patents

Condensateur à film de type enroulé Download PDF

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Publication number
WO2017150460A1
WO2017150460A1 PCT/JP2017/007524 JP2017007524W WO2017150460A1 WO 2017150460 A1 WO2017150460 A1 WO 2017150460A1 JP 2017007524 W JP2017007524 W JP 2017007524W WO 2017150460 A1 WO2017150460 A1 WO 2017150460A1
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WIPO (PCT)
Prior art keywords
film
wound
glass film
metal
base glass
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PCT/JP2017/007524
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English (en)
Japanese (ja)
Inventor
篤 虫明
隆 村田
外博 中島
智昭 川村
隆義 齊藤
美紅 藤井
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日本電気硝子株式会社
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Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2018503301A priority Critical patent/JPWO2017150460A1/ja
Publication of WO2017150460A1 publication Critical patent/WO2017150460A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose

Definitions

  • the present invention relates to a wound film capacitor, and more specifically to a wound film capacitor having a wound body obtained by winding a base glass film that is an insulator.
  • an inverter In an electric vehicle (EV) and a hybrid electric vehicle (HEV), an inverter is used to drive the AC motor by converting the DC power of the battery into AC power.
  • a DC power supply circuit (converter, battery, etc.) connected to the inverter switching circuit is generally called a DC link, and the DC power supply voltage is called a DC link voltage.
  • a large-capacitance capacitor called a DC link capacitor is connected in parallel with the DC power source in the DC link of the inverter, and these capacitors compensate for instantaneous load fluctuations caused by the switching circuit.
  • the capacitors used for this purpose are required to have the following characteristics. (1) A large amount of energy can be released / stored instantaneously to compensate for instantaneous load fluctuations, and (2) the temperature dependence of the dielectric constant to prevent the circuit from operating properly due to temperature changes. (3) It operates normally even in a hot and humid environment.
  • ceramic capacitors using BaTiO 3 are mainly used as capacitors for this purpose.
  • this ceramic capacitor has a problem that dielectric breakdown occurs when a high voltage is applied. The reason for this is that when the convex portions of the crystal grains present in the ceramic capacitor are in contact with the electrode and a high voltage is applied to the contact portion, electric field concentration occurs and a short circuit is likely to occur.
  • a ceramic capacitor using BaTiO 3 has a large temperature dependence of dielectric constant, and the dielectric constant is likely to change due to temperature change. Therefore, in order to reduce the temperature dependence of the dielectric constant, it has been considered to be doped with Mg or Mn or the like during BaTiO 3.
  • Mg, Mn, or the like when Mg, Mn, or the like is doped, a relative charge of ⁇ 2 is induced in the crystal lattice of BaTiO 3 . This may cause oxygen defects in BaTiO 3 . This oxygen defect may cause a decrease in dielectric constant under a DC voltage. Therefore, it is difficult for a ceramic capacitor using BaTiO 3 to lower the temperature dependence of the dielectric constant while increasing the dielectric constant.
  • the capacitor needs to secure a large area per unit volume in order to store a large amount of energy.
  • it is difficult for a conventional ceramic material to secure a large area which causes an increase in cost. If ceramic materials are laminated, a large area can be secured.
  • this method also complicates the process and increases costs.
  • capacitors are widely used in diesel trucks and railways as well as electric vehicles (EV) and hybrid electric vehicles (HEV), and in these applications, further improvements in the safety of capacitors are required. Specifically, it is desirable to reduce the risk of leakage and combustion as much as possible even in the event of a failure or accident.
  • the present invention has been made in view of the above circumstances, and its technical problem is that it is highly safe, can release / store a large amount of energy instantaneously, and can secure a large area per unit volume.
  • the technical challenge is to create a capacitor.
  • the wound film capacitor of the present invention is a wound film capacitor having a wound body obtained by winding a substrate glass film having a first surface and a second surface. 50 ⁇ m or less, the first metal film is formed on the first surface of the base glass film, the second metal film is formed on the second surface of the base glass film, and The substrate glass film is wound together with the interposed glass film.
  • the wound film capacitor of the present invention has a wound body obtained by winding a substrate glass film having a first surface and a second surface. Since the glass film hardly generates oxygen vacancies, the temperature dependence of the dielectric constant can be reduced without reducing the dielectric constant. Therefore, when the base glass film is used for a capacitor, it is possible to effectively prevent a situation in which the circuit does not operate properly due to a temperature change. Furthermore, when the base glass film is wound, it becomes easy to reduce the size of the capacitor.
  • the thickness of the base glass film is 50 ⁇ m or less. In this way, since the area per unit volume becomes large, it becomes easy to store a large amount of energy. Moreover, since the flexibility of a base glass film improves, the minimum curvature radius of a base glass film can be made small. As a result, it is easy to reduce the size of the capacitor.
  • the glass film exhibits a higher dielectric constant than the resin film, the electrostatic capacity of the whole wound film capacitor can be increased. Therefore, a larger amount of energy can be released / stored compared to a conventional wound film capacitor.
  • the base glass film is wound together with the interposed glass film. If the base glass film having the metal film on both surfaces is wound as it is, the metal films will come into contact with each other and will not function as a capacitor, but the base glass film and the interposing glass film will be rolled up. Such contact can be effectively avoided.
  • a wound glass film capacitor wound with a glass film that is, a metal film is formed on both surfaces of a glass film as a substrate, and is wound together with paper or a resin film.
  • a wound glass film capacitor wound with a glass film that is, a metal film is formed on both surfaces of a glass film as a substrate, and is wound together with paper or a resin film.
  • the base glass film has a first end surface and a second end surface facing in the width direction, and the first metal film is offset to the first end surface side.
  • the second metal film is formed offset to the second end face side.
  • the first electrode layer that is in contact with the first metal film and not in contact with the second metal film is formed on one side surface of the wound body, and It is preferable that a second electrode layer that is in contact with the second metal film and not in contact with the first metal film is formed on the other side surface of the body. In this way, since the action as an inductor is suppressed, resistance at high frequencies can be easily suppressed.
  • a core that is in contact with the inner peripheral surface of the wound body is disposed at the center of the wound body.
  • the base glass film and the intervening glass film can be wound around the core to form a wound body, so that a high-performance wound film capacitor is maintained while maintaining the shape accuracy during winding. Can be obtained.
  • a through-hole penetrating the wound body in the width direction is provided at the center of the wound body.
  • a hollow space exists in the center of the capacitor over the entire width direction.
  • Inductance may increase due to the influence.
  • This kind of increase in inductance is not preferable because it causes an increase in impedance particularly in a high frequency range.
  • air as an insulator exists inside the wound body, so that the increase in inductance as described above is suppressed. It is possible to avoid as much as possible an increase in impedance in the high frequency range.
  • FIG. 1 is a conceptual cross-sectional view showing an example of a cross-sectional structure in the width direction of the wound film capacitor of the present invention.
  • the wound film capacitor 1 has a laminated structure in which a first metal film 10, a base glass film 11, a second metal film 12, and an interposed glass film 13 are laminated in this order.
  • This laminated structure is repeated according to the number of windings.
  • the first metal film 10 is formed on the first surface 11a of the base glass film 11, and the first edge portion 11c on which the first metal film 10 is formed and the first metal film 10 are formed. It has the 2nd edge part 11d in which the 1st metal film 10 used as the opposite side to the edge part 11c is not formed into a film. This The first metal film 10 is offset to the first edge portion 11 c side of the first base glass film 11.
  • the second metal film 12 is formed on the second surface 11b of the base glass film 11, and the third end edge portion 11e on which the second metal film 12 is formed and the first metal film 12 are formed. It has the 4th edge part 11f in which the 2nd metal film 12 used as the opposite side to the 3rd edge part 11e is not formed into a film. Thereby, the 2nd metal film 12 is offset by the 3rd edge part 11e side.
  • the interposed glass film 13 is disposed between the first metal film 10 and the second metal film 12 so that the first metal film 10 and the second metal film 12 do not contact each other.
  • a first electrode layer 14 that is in contact with the first metal film 10 and is not in contact with the second metal film 12 is formed on the first end surface 11 g of the substrate glass film 11, and the substrate glass film 11 is formed.
  • a second electrode layer 15 that is in contact with the second metal film 12 and is not in contact with the first metal film 10 is formed on the second end face 11h.
  • One side surface of the wound body is covered with the first electrode layer 14, and the entire end portion of the first metal film 10 is electrically connected, and the wound body is covered with the second electrode layer 15.
  • the other side surface of the second metal film 12 is covered and the entire end of the second metal film 12 is electrically connected.
  • the base glass film is wound with a minimum curvature radius of 100 mm or less. If winding is performed in a state where the minimum curvature radius is small, the size of the capacitor can be reduced.
  • the “minimum radius of curvature” refers to the radius of curvature of the innermost portion of the wound base glass film.
  • the length of the base glass film is preferably 0.05 m or more.
  • the base glass film preferably has a (width dimension / thickness) ratio of 1000 or more.
  • the capacitance increases as the area of the insulator increases and the thickness decreases. Therefore, as the (width dimension / thickness) ratio of the base glass film is larger, a larger amount of energy can be accumulated.
  • the base glass film preferably has a dielectric constant of 5 or more.
  • dielectric constant refers to a value measured by a method based on ASTM D150 at a temperature of 25 ° C.
  • the average surface roughness Ra of the base glass film is preferably 50 mm or less. In this way, the voltage causing dielectric breakdown increases, so that a large amount of energy can be easily stored.
  • “average surface roughness Ra” refers to a value measured by a method based on JIS B0601: 2001.
  • the base glass film has a glass composition of 20% by mass to SiO 2 20 to 70%, Al 2 O 3 0 to 20%, B 2 O 3 0 to 17%. MgO 0-10%, CaO 0-15%, SrO 0-15%, BaO 0-40% are preferable. If it does in this way, since it becomes difficult to produce devitrification at the time of shaping
  • the first metal film and the second metal film has a heat resistance of 50 ° C.
  • Both metal films preferably have a heat resistance of 50 ° C.
  • “the metal film has a heat resistance of 50 ° C.” means that the glass film on which the metal film is formed is heat-treated in the atmosphere of 50 ° C. for 1 hour, and the resistance value after the heat treatment is It shall mean that it does not exceed twice the resistance value.
  • the metal film is not easily oxidized or deteriorated even in a high temperature environment, so that the performance of the capacitor can be exhibited without depending on the temperature of the surrounding environment. Further, it is not necessary to install a cooling device or the like, and the capacitor device as a whole including peripheral devices can be downsized.
  • the wound film capacitor of the present invention it is preferable that at least one of the first metal film and the second metal film is an Al film. Furthermore, in the wound film capacitor of the present invention, it is preferable that both the first metal film and the second metal film are Al films.
  • the wound film capacitor of the present invention it is preferable that at least one of the first metal film and the second metal film is a Cu film. Furthermore, in the wound film capacitor of the present invention, it is preferable that both the first metal film and the second metal film are Cu films.
  • the wound film capacitor of the present invention it is preferable that at least one of the first metal film and the second metal film is an Ag film and / or an Ag alloy film, and further, the first metal film
  • the second metal film is preferably an Ag film and / or an Ag alloy film.
  • metal film Various materials can be used for the metal film.
  • one or two or more metal materials selected from the group consisting of Al, Pt, Ni, Cu, Ag, and an Ag alloy are preferable.
  • Al and Cu are preferable, and from the viewpoint of heat resistance, cost, and conductivity, Ag and Ag alloy are preferable.
  • the first electrode layer and the second electrode layer has a heat resistance of 50 ° C.
  • Both of the second electrode layers preferably have a heat resistance of 50 ° C.
  • the electrode layer has a heat resistance of 50 ° C.” means that there is no breakage such as a crack when visually confirmed after heat treatment in air at 50 ° C. for 1 hour. It shall be.
  • the wound film capacitor of the present invention it is preferable that at least one of the first electrode layer and the second electrode layer is composed only of an inorganic substance containing a metal powder. It is preferable that both the electrode layer and the second electrode layer are composed of only an inorganic substance containing a metal powder.
  • the electrode layers can be easily formed on both sides in the width direction of the wound body, but also excellent heat resistance can be imparted to the wound film capacitor.
  • the wound film capacitor of the present invention is composed of Ag and / or metal powder of at least one of the first electrode layer and the second electrode layer from the viewpoints of heat resistance, cost, and conductivity. It is preferable that it is an Ag alloy, and it is more preferable that the metal powders of the first electrode layer and the second electrode layer are both Ag and / or an Ag alloy.
  • the wound body of the present invention is a wound body obtained by winding a base film having a first surface and a second surface, and the base film is wound together with the intervening glass film. It is preferable that the wound body is characterized by the following.
  • FIG. 1 It is a conceptual sectional view showing an example of the section structure of the winding type film capacitor of the present invention in the width direction. It is a cross-sectional conceptual diagram of the width direction which shows the state by which Cu film
  • the thickness of the base glass film is 50 ⁇ m or less, 40 ⁇ m or less, 30 ⁇ m or less, 20 ⁇ m or less, 10 ⁇ m or less, 8 ⁇ m or less, 6 ⁇ m or less, 5 ⁇ m or less, 3 ⁇ m or less, particularly 1 ⁇ m or less.
  • the smaller the thickness of the base glass film the larger the area per unit volume, so that a large amount of energy can be easily stored.
  • the minimum curvature radius of a base glass film can be made small. As a result, it is easy to reduce the size of the capacitor. Furthermore, it becomes easy to reduce the weight of the device.
  • the first metal film is formed on the first surface of the base glass film
  • the second metal film is formed on the second surface of the base glass film.
  • These metal films act as electrodes.
  • Various materials can be used as the metal film, but from the viewpoint of cost and conductivity, one or two or more selected from the group of Al, Pt, Ni, Cu, Ag, Ag alloy, etc. are preferable.
  • Al is suitable because it is difficult to oxidize and the resistance value is difficult to increase
  • Cu is suitable because a film formation rate is high when forming a film on a base glass film.
  • Ag is preferable from the viewpoint of heat resistance, and particularly an Ag alloy is preferable because it has higher heat resistance than Ag alone.
  • the metal film has a heat resistance of 50 ° C., preferably has a heat resistance of 80 ° C., more preferably has a heat resistance of 100 ° C. , 130 ° C, 140 ° C, 150 ° C, 160 ° C, 170 ° C, 180 ° C, 190 ° C, 200 ° C, 220 ° C, 240 ° C, 250 ° C, 270 ° C, 300 ° C, 400 ° C It is preferable to form the metal film so as to have a heat resistance of 500 ° C. particularly preferably.
  • the heat resistance of the metal film can be evaluated by measuring the resistance value before and after the above-described heat treatment using a digital multimeter (M-04 manufactured by Custom Inc.).
  • the base glass film has a first end face and a second end face opposed to each other in the width direction, and the first metal film is formed offset to the first end face side. And the second metal film is preferably formed offset to the second end face side.
  • region in which the metal film is not formed in the 1st surface and the 2nd surface of a base glass film has a preferable area
  • the wound film capacitor of the present invention is wound in a state in which a base glass film and an interposed glass film are stacked. In this way, contact between the first metal film and the second metal film can be effectively avoided.
  • the wound film capacitor of the present invention can be reduced in size as compared with a resin-based wound film capacitor having the same structure or a glass film-resin film hybrid wound capacitor.
  • the wound film capacitor of the present invention has a base glass film and an interposed glass film as main members.
  • all the main components are non-flammable inorganic substances, so that the heat resistance is high, and there is no risk of leakage or burning, and the safety is high. In addition, it is difficult to deteriorate over time and has excellent long-term reliability.
  • the conventional resin-based wound film capacitor has low heat resistance, so a cooling device is required as a peripheral member.
  • the wound film capacitor of the present invention has high heat resistance.
  • the cooling device can be omitted or simplified. As a result, the entire apparatus can be reduced in size.
  • the width dimension of the interposed glass film is preferably smaller than the width dimension of the base glass film. If it does in this way, it will become easy to form an electrode layer in the both sides
  • the base glass film is preferably wound with a minimum curvature radius of 100 mm or less, and the minimum curvature radius is further 80 mm or less, 75 mm or less, 50 mm or less, 30 mm or less, It is preferably 20 mm or less, 10 mm or less, 5 mm or less, particularly 3 mm or less. If the base glass film is wound in a state where the minimum curvature radius is small, a large area can be secured per unit volume, so that a large amount of energy can be stored.
  • the length dimension of the base glass film is preferably 0.05 m or more, 0.5 m or more, 1 m or more, 3 m or more, 5 m or more, 10 m or more, 30 m or more, 50 m or more, 70 m or more, particularly 100 m or more.
  • the electrostatic capacity becomes small, so that it is difficult to accumulate a large amount of energy.
  • the (width dimension / thickness) ratio of the base glass film is preferably 1000 or more, 1200 or more, 1400 or more, 1600 or more, 1800 or more, 2000 or more, particularly 2400 or more.
  • the electrostatic capacity becomes small, so that it is difficult to accumulate a large amount of energy.
  • the dielectric constant of the substrate glass film is preferably 5 or more, 5.5 or more, 6 or more, 7 or more, 8 or more, 9 or more, 10 or more, particularly 11 or more. If the dielectric constant of the substrate glass film is too low, it will be difficult to store a large amount of energy.
  • the average surface roughness Ra of the base glass film is preferably 50 mm or less, 30 mm or less, 10 mm or less, 8 mm or less, 4 mm or less, 3 mm or less, particularly 2 mm or less. If the average surface roughness Ra of the substrate glass film is too large, the voltage causing dielectric breakdown when a high voltage is applied tends to decrease. In addition, this makes it easier to make optical contact when the glass films are brought into direct contact with each other at the start of winding or at the end of winding.
  • the surface roughness Rmax of the substrate glass film is preferably 10 nm or less, 5 nm or less, particularly 3 nm or less. If the surface roughness Rmax of the base glass film is too large, the voltage that causes dielectric breakdown when a high voltage is applied tends to decrease.
  • “average surface roughness Rmax” refers to a value measured by a method based on JIS B0601: 2001. In addition, this makes it easier to make optical contact when the glass films are brought into direct contact with each other at the start of winding or at the end of winding.
  • the end portions of the adjacent first metal films in the wound body are electrically connected, and the end portions of the adjacent second metal films are also electrically connected.
  • a first electrode layer that is in contact with the first metal film and is not in contact with the second metal film is formed on one side surface of the wound body, and the second metal film is formed on the other side surface of the wound body. It is preferable that a second electrode layer that is in contact with and not in contact with the first metal film is formed. In this way, since the action as an inductor is suppressed, resistance at high frequencies can be easily suppressed.
  • the electrode layer various materials can be used, but from the viewpoint of cost and conductivity, one or more selected from the group of Al, Pt, Ni, Cu, Ag, Ag alloy and the like are preferable. Al and Cu are particularly suitable. Further, Ag is preferable from the viewpoint of heat resistance, and particularly an Ag alloy is preferable because it has higher heat resistance than Ag alone.
  • the electrode layer can be formed, for example, by applying a conductive paste containing metal powder (a paste-like conductive material having a predetermined viscosity) to the end face of the base glass film.
  • the organic conductive paste is relatively easy to handle.
  • the resin containing the metal powder is cured by mixing two liquids.
  • an organic component that easily volatilizes at a low temperature may be included. Therefore, when the electrode layer is exposed to a high temperature environment, the organic component volatilizes and the electrode layer may shrink in volume. . As a result, a crack that is large enough to be visually confirmed is generated, which may lead to damage of the capacitor. Therefore, by appropriately selecting the material for forming the electrode layer, the above situation can be avoided as much as possible, so that the performance of the capacitor can be exhibited without depending on the temperature of the surrounding environment. .
  • the electrode layer is formed so as to have a heat resistance of 500 ° C.
  • an electrode forming material may be a thermosetting resin or a thermoplastic resin.
  • melamine resin epoxy resin, silicone resin, polypropylene resin, acrylic resin, urethane resin, vinyl resin, styrene resin, various elastomers, engineering plastics, super engineering plastics, and the like can also be used.
  • polyacetal resin polycarbonate resin, polyamide resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polyethylene resin, syndiotactic polystyrene resin, amorphous polyarylate resin
  • Polysulfone resin fluororesin, liquid crystal polymer resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyphenylene sulfide resin, polyethersulfone resin, polyetheretherketone resin, and the like can be used.
  • these resins can be appropriately selected according to the heat resistance required for the electrode layer, and the electrode layer can be formed by any method that matches the characteristics of the resin.
  • the electrode layer can be formed by cooling and fixing the softened resin to the contacted surface and forming it as necessary.
  • the above-mentioned various resins can be used as an electrode forming material after being made into a paste.
  • the conductive paste containing metal powder can be composed only of an inorganic substance.
  • the inorganic conductive paste include water glass in which metal powder is dispersed. Since the water glass paste does not contain an organic substance, volume shrinkage or deformation does not occur in the formed electrode layer even under a high temperature environment, and as a result, damage to the capacitor can be suppressed.
  • the viscosity can be lowered to a preferable viscosity, and the electrode layer can be easily formed.
  • a dense electrode layer can be formed by evaporating water after forming the electrode layer and promoting dehydration condensation in the water glass.
  • the form in particular which the electrode layer of this invention can take is not restrict
  • the wound film capacitor of the present invention since the wound film capacitor of the present invention has high heat resistance, it can exhibit performance even in a high temperature environment. That is, since characteristics such as capacitance, dielectric loss, and equivalent series resistance do not deteriorate even in a high temperature environment, there is little performance variation due to ambient temperature fluctuations, and reliability is very high.
  • the wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ⁇ 10%, preferably ⁇ 5%, ⁇ Within 4%, within ⁇ 3%, within ⁇ 2%, within ⁇ 1.5%.
  • the wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ⁇ 10%, preferably within ⁇ 8%, ⁇ 6 regarding dielectric loss. %, ⁇ 5%, ⁇ 4%, and ⁇ 3%.
  • the wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ⁇ 10%, preferably within ⁇ 5%, ⁇ Within 4%, within ⁇ 3%, within ⁇ 2%, within ⁇ 1.5%.
  • the wound film capacitor of the present invention can naturally adopt various forms as long as it does not change the gist of the present invention.
  • a core may be disposed at the center of the wound body, or a through hole may be provided.
  • FIG. 3 is a perspective view showing a winding type film capacitor of the present invention and showing an aspect in which a core is disposed.
  • the wound film capacitor 2 is in contact with the wound body 4 and the wound body 4 in the width direction (here, coincides with the direction along the center line X1 of the wound body 4). Electrode layers 24 and 25 are provided. Lead wires (not shown) are attached to the electrode layers 24 and 25 so that a predetermined voltage can be applied between the electrode layers 24 and 25.
  • the outermost layer and / or the innermost layer in which the glass films are in direct contact may be fixed by optical contact.
  • the presence or absence of protrusion from the wound body 4 of the core 17 is arbitrary.
  • the wound body 4 includes first and second metal films 20 and 22, a base glass film 21, and an interposed glass film 23, and these two metal films 20 and 22. Is formed by laminating the base glass film 21 formed on both sides and the intervening glass film 23 (as the laminated film 16) and winding it in a roll shape with the core 17 as a core.
  • the 1st and 2nd metal films 20 and 22 are each formed in the 1st surface 21a and the 2nd surface 21b which face the direction which opposes in the thickness direction of the base glass film 21. . Thereby, both the first and second metal films 20 and 22 are integrated with the base glass film 21.
  • FIG. 5 is a perspective view showing an aspect in which a through hole is provided in the wound film capacitor of the present invention.
  • the wound film capacitor 3 is in contact with the wound body 5 and the wound body 5 in the width direction (here, coincides with the direction along the center line X4 of the wound body 5). Electrode layers 34 and 35 are provided. Lead wires (not shown) are attached to the electrode layers 34 and 35 so that a predetermined voltage can be applied between the electrode layers 34 and 35.
  • the through hole 18 that penetrates the wound body 5 in the direction along the width direction of the wound body 5, that is, in the direction along the center line X ⁇ b> 2 of the wound body 5 in FIG. 5.
  • the through hole 18 penetrates not only the wound body 5 but also the electrode layers 34 and 35 attached to both sides in the width direction. Therefore, as shown in FIG. 5, the through hole 18 penetrates the wound film capacitor 3 in the direction along the center line at the center of the wound film capacitor 3.
  • the center line of the wound film capacitor 3 is equal to the center line X2 of the wound body 5 (see FIG. 5).
  • the outermost layer and / or the innermost layer portion in which the glass films are in direct contact may be fixed by an optical contact.
  • the wound film capacitor 3 having the above-described configuration forms the wound body 5 integrally with the core, for example, in the same manner as in the first embodiment, and the core is removed from the core-integrated wound body on both sides in the width direction. It can be manufactured by providing the electrode layers 34 and 35.
  • a through hole 18 that penetrates the wound body 5 in the width direction is provided at the center of the wound body 5 constituting the wound film capacitor 3.
  • a hollow space that is, air as an insulator exists in the center of the wound film capacitor 3 in the entire width direction.
  • Inductance may increase. This kind of increase in inductance is not preferable because it causes an increase in impedance particularly in a high frequency range.
  • the wound film capacitor 3 can be reduced in weight by that amount, which is suitable for generalization of the capacitor 3.
  • the wound body of the wound type film capacitor is exemplified by the base glass film and the interposed glass film wound in a true cylindrical shape (see FIG. 3 and the like).
  • the base glass film and the interposed glass film wound in a true cylindrical shape see FIG. 3 and the like.
  • other shapes may be used.
  • a base glass film and an intervening glass film such as an elliptical winding body and a flat winding body including a straight portion when viewed from the direction along the center line.
  • the film is wound into a roll, it can take various forms.
  • the laminated film 16 as shown in FIG. 4 may be prepared in advance and then wound up as the laminated film 16, or the base glass film or the intervening glass film may be used first. After starting to wind, the other glass film may be put in between and rolled up.
  • the beginning of winding and / or the end of winding for example, by making the length of one glass film long, glass films that are not formed can be superposed and fixed by optical contact.
  • the base glass film has a glass composition in terms of mass%, SiO 2 20 to 70%, Al 2 O 3 0 to 20%, B 2 O 3 0 to 17%, MgO 0 to 10%, CaO 0 to 15%. SrO 0 to 15% and BaO 0 to 40% are preferable.
  • % display means the mass%.
  • the content of SiO2 is preferably 70% or less, 65% or less, 60% or less, 58% or less, 55% or less, 50% or less, particularly 45% or less.
  • the content of SiO2 is preferably 20% or more, 25% or more, particularly 30% or more.
  • the content of Al 2 O 3 is 0 to 20%.
  • the content of Al 2 O 3 is preferably 20% or less, 18% or less, 15% or less, 12% or less, particularly 10% or less.
  • the content of Al 2 O 3 is preferably 0% or more, 1% or more, 3% or more, particularly 5% or more.
  • the content of B 2 O 3 is preferably 15% or less, 13% or less, 11% or less, 7% or less, particularly 5% or less.
  • MgO is a component that increases the strain point and also decreases the high-temperature viscosity.
  • the content of MgO is preferably 10% or less, 5% or less, 3% or less, 2% or less, 1.5% or less, 1% or less, particularly 0.5% or less.
  • the content of CaO is preferably 15% or less, 12% or less, 10% or less, 9% or less, particularly 8.5% or less.
  • the content of CaO is preferably 0% or more, 0.5% or more, 1% or more, 2% or more, 3% or more, particularly 5% or more.
  • the SrO content When the SrO content increases, the density and the thermal expansion coefficient tend to increase. Therefore, the SrO content is preferably 15% or less, particularly 12% or less. On the other hand, when the content of SrO decreases, the dielectric constant and meltability tend to decrease. Therefore, the content of SrO is preferably 0% or more, 0.5% or more, 1% or more, 3% or more, particularly 5% or more.
  • the BaO content is preferably 40% or less, particularly 35% or less.
  • the content of BaO is preferably 0% or more, 0.5% or more, 1% or more, 2% or more, 5% or more, 10% or more, 15% or more, 20% or more, particularly 25% or more. .
  • Each component of MgO, CaO, SrO, and BaO is a component that improves the dielectric constant, devitrification resistance, meltability, and moldability.
  • the content of MgO + CaO + SrO + BaO decreases, in addition to the difficulty of increasing the dielectric constant, the function as a flux cannot be fully exhibited, and the meltability decreases. It becomes easy. Therefore, the content of MgO + CaO + SrO + BaO is preferably 5% or more, 10% or more, 15% or more, 20% or more, 25% or more, particularly 30% or more.
  • the content of MgO + CaO + SrO + BaO is preferably 60% or less, 55% or less, and particularly 50% or less.
  • Each component of Li 2 O, Na 2 O, and K 2 O is a component that reduces the viscosity and adjusts the thermal expansion coefficient. However, if it is contained in a large amount, the voltage that causes dielectric breakdown tends to decrease. In addition, the temperature characteristics of dielectric constant tend to decrease. Therefore, the total amount of these components is preferably 15% or less, 10% or less, 5% or less, 2% or less, 1% or less, 0.5% or less, particularly 0.1% or less.
  • ZnO is a component that increases the dielectric constant and also increases the meltability. However, when it is contained in a large amount, the glass tends to devitrify and the density tends to increase. Therefore, the content of ZnO is preferably 0 to 30%, 0 to 20%, 0.5 to 15%, particularly 1 to 10%.
  • ZrO 2 is a component that increases the dielectric constant, but if it is contained in a large amount, the liquidus temperature rises rapidly, and devitrified foreign substances of zircon are likely to precipitate. Therefore, the upper limit range of ZrO 2 is preferably 20% or less, 15% or less, and particularly preferably 10% or less. Further, the lower limit range of ZrO 2 is preferably 0% or more, 0.1% or more, 0.5% or more, 1% or more, 2% or more, and particularly preferably 3% or more.
  • Y 2 O 3 , Nb 2 O 3 , and La 2 O 3 can each be added up to 20%. These components have a function of increasing the dielectric constant and the like, but if they are contained in a large amount, the density tends to increase.
  • a fining agent 0 to 3% of one or more selected from the group of As 2 O 3 , Sb 2 O 3 , CeO 2 , SnO 2 , F, Cl, and SO 3 can be added. However, it is preferable to refrain from using As 2 O 3 , Sb 2 O 3 and F as much as possible from an environmental viewpoint, and the content of each is preferably less than 0.1%. From the environmental point of view, SnO 2 , Cl and SO 3 are preferable as the fining agent.
  • the content of SnO 2 + Cl + SO 3 (the total amount of SnO 2, Cl and SO 3 ) is preferably 0.001 to 1%, 0.01 to 0.5%, particularly preferably 0.01 to 0.3%.
  • the SnO 2 content is preferably 0 to 1%, 0.01 to 0.5%, particularly preferably 0.05 to 0.4%.
  • other components can be added to the glass composition up to 20%, particularly 10%.
  • the liquidus temperature of the substrate glass film is preferably 1200 ° C. or lower, 1150 ° C. or lower, 1090 ° C. or lower, 1050 ° C. or lower, 1030 ° C. or lower, particularly 1000 ° C. or lower. If the liquidus temperature of the base glass film is too high, the glass tends to devitrify at the time of molding, and it becomes difficult to increase the surface accuracy of the base glass film.
  • the liquidus viscosity of the base glass film is preferably 10 3.5 dPa ⁇ s or more, 10 4.0 dPa ⁇ s or more, 10 4.5 dPa ⁇ s or more, 10 4.8 dPa ⁇ s or more, In particular, it is 10 5.0 dPa ⁇ s or more. If the liquidus viscosity of the substrate glass film is too low, the glass tends to devitrify during molding, and it becomes difficult to increase the surface accuracy of the substrate glass film.
  • the “liquid phase viscosity” refers to a value obtained by measuring the viscosity of glass at the liquid phase temperature by a platinum ball pulling method.
  • Liquid phase temperature refers to the temperature at which crystals pass through a standard sieve 30 mesh (500 ⁇ m) and the glass powder remaining on 50 mesh (300 ⁇ m) is placed in a platinum boat and kept in a temperature gradient furnace for 24 hours. Refers to the measured value.
  • the density of the base glass film is 4.5 g / cm 3 or less, 4.0 g / cm 3 or less, 3.6 g / cm 3 or less, 3.3 g / cm 3 or less, 3.0 g / cm 3 or less, 2.8 g / Cm 3 or less, and particularly preferably 2.5 g / cm 3 or less.
  • density refers to a value measured by the well-known Archimedes method.
  • the thermal expansion coefficient of the base glass film is preferably 25 ⁇ 10 ⁇ 7 to 120 ⁇ 10 ⁇ 7 / ° C., 30 ⁇ 10 ⁇ 7 to 120 ⁇ 10 ⁇ 7 / ° C., 40 ⁇ 10 ⁇ 7 to 110 ⁇ 10 ⁇ 7 / ° C., 60 ⁇ 10 ⁇ 7 to 100 ⁇ 10 ⁇ 7 / ° C., especially 70 ⁇ 10 ⁇ 7 to 95 ⁇ 10 ⁇ 7 / ° C.
  • thermal expansion coefficient refers to an average value measured by a dilatometer in a temperature range of 30 to 380 ° C.
  • the temperature at 10 2.5 dPa ⁇ s of the base glass film is preferably 1550 ° C. or lower, 1450 ° C. or lower, 1350 ° C. or lower, 1250 ° C. or lower, 1200 ° C. or lower, 1170 ° C. or lower, particularly 1150 ° C. or lower.
  • “temperature at 10 2.5 dPa ⁇ s” refers to a value measured by a platinum ball pulling method.
  • the base glass film preferably has an unpolished surface, and it is particularly preferred that all of the first surface and the second surface of the base glass film are unpolished.
  • the theoretical strength of glass is very high, it often leads to fracture even at a stress much lower than the theoretical strength. This is because a small defect called Griffith flow is generated on the surface of the glass in a post-molding process such as a polishing process. Therefore, if the surface of the base glass film is unpolished, the original mechanical strength is hardly lost, and the base glass film is difficult to break.
  • it is a redraw method or an overflow downdraw method, the base glass film with high surface accuracy which is unpolished can be shape
  • the base glass film is preferably formed by a redraw method. If it does in this way, it will become easy to reduce the thickness of a substrate glass film. Moreover, the surface quality of the substrate glass film can be improved. Furthermore, it becomes possible to make the both end surfaces of a base glass film into a fire-making surface. And if a both-ends surface is a fire-making surface, it will become difficult to damage a base glass film from an end surface.
  • the “redraw method” is a method for forming a glass film by heating a molded glass again to a temperature near the softening point, followed by stretching.
  • an overflow down draw method for forming the base glass film.
  • the “overflow down draw method” is also called a fusion method, and the molten glass overflows from both sides of the heat-resistant cage-like structure, and the overflowing molten glass is joined at the lower end of the cage-like structure.
  • the base glass film is formed by stretching downward. If the base glass film is formed by the overflow down draw method, the surface quality of the base glass film can be improved.
  • the wound film capacitor of the present invention includes an interposed glass film.
  • the use of a glass film having the same material and thickness as the intervening glass film is preferable from the viewpoint of cost and productivity, but a glass film having a different material and thickness may be used.
  • the material of the base material and the intervening glass film a material that is difficult to break and highly flexible is more preferable, but it is not limited to the above glass composition as long as it can be wound, and various materials can be used. , Alkali-free glass, soda glass, alkali-containing glass and the like.
  • the thickness of the glass film is preferably a ratio of (intervening glass film thickness / base glass film thickness), preferably 0.3 or more, 0.4 or more, 0.5 or more, 0.6 or more, 0.7 or more. 0.8 or more, particularly 0.9 or more, and more preferably 3.0 or less, 2.5 or less, 2.0 or less, 1.8 or less, 1.5 or less, 1.3 or less, 1. 2 or less, 1.1 or less, particularly 1.05 or less.
  • the glass films are rubbed together by appropriately managing the manufacturing conditions such as the winding speed, winding angle, and winding direction of each glass film. And unreasonable stress concentration can be suppressed, and the fracture probability of the glass film can be reduced.
  • the wound body of this invention winds up base films, such as resin and a metal, with the above-mentioned interposed glass film, for example.
  • base films such as resin and a metal
  • the wound body of the present invention when a functional film is formed on the surface of the base film, it is possible to avoid contact between the functional films.
  • the interposed glass film has high heat resistance and electrical insulation
  • the wound body of the present invention is preferably used for a wound body for electronic parts such as a wound film capacitor.
  • the intervening glass film has good optical properties, it is preferably used for a wound body for video and lighting applications that require visibility and decorativeness.
  • the density is a value measured by the well-known Archimedes method.
  • Strain point and annealing point are values measured based on the method of ASTM C336-71.
  • Softening point is a value measured based on the method of ASTM C338-93.
  • the temperatures at high temperature viscosities of 10 4.0 dPa ⁇ s, 10 3.0 dPa ⁇ s and 10 2.5 dPa ⁇ s are values measured by the platinum ball pulling method.
  • the thermal expansion coefficient is an average value measured with a dilatometer in a temperature range of 30 to 380 ° C.
  • the liquid phase temperature passed through a standard sieve 30 mesh (500 ⁇ m), the glass powder remaining in 50 mesh (300 ⁇ m) was placed in a platinum boat and held in a temperature gradient furnace for 24 hours, and the temperature at which crystals precipitated was measured. Value.
  • Liquid phase viscosity is a value obtained by measuring the viscosity of glass at the liquid phase temperature by a platinum ball pulling method.
  • Dielectric constant is a value measured by a method based on ASTM D150.
  • FIG. 2 is a cross-sectional conceptual diagram in the width direction showing a state in which a Cu film is formed on the first surface and the second surface of the base glass film.
  • the base glass film and the interposed glass film were overlapped and wound around an insulating tube having a diameter of 50 mm.
  • a conductive film is applied to one end surface of the base glass film to thereby form a metal film on the first surface (corresponding to the first metal film) ) On the side surface of the wound body so that the entire end portion of the metal film (corresponding to the second metal film) on the second surface is not electrically connected.
  • An electrode layer (corresponding to the first electrode layer) was formed.
  • an electrode layer (second electrode layer) on the other side surface of the wound body so that the entire end of the metal film (corresponding to the first metal film) on the first surface is not electrically connected.
  • CW2400 manufactured by ITW Chemtronics was used as the conductive paste. In this way, sample no. Winding type film capacitors according to 1 to 9 were produced.
  • Sample No. 1 was measured using an impedance analyzer (Solartron 1260 type, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV), the result shown in FIG. 6 was obtained. Obtained. The capacitance was calculated from the impedance at 1 Hz and found to be 9.5 ⁇ F. [Example 2]
  • sample No. 1 was used under the same conditions as in [Example 1]. 1 was produced. [Example 3]
  • the width of the base glass film was changed to 25.4 mm, the length was changed to 12.1 m, the width of the interposed glass film was changed to 19.0 mm, and the length was changed to 12.1 m.
  • an area of 4.7 mm from one end face of the first and second surfaces is masked, and an Ag alloy film having a thickness of 65 nm using “APC-TR” manufactured by Furuya Metal Co., Ltd. ( (Corresponding to a first metal film and a second metal film) were formed by sputtering. Then, the first glass film and the second glass film were overlapped, wound around a core of ⁇ 50 mm, and then the core was removed. 1 was produced.
  • the electrostatic capacity of the obtained wound film capacitor was measured by using an impedance analyzer (Solartron 1260 type, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV).
  • the capacitance was calculated from the impedance at 1 Hz to be 1.91 ⁇ F.
  • the capacitance, dielectric loss, and equivalent series resistance were measured by changing the ambient temperature in the order of room temperature (26 ° C.), 50 ° C., 75 ° C., 100 ° C., 125 ° C., and 150 ° C. Results were obtained. In addition, no damage or the like was found in the metal film and the electrode layer in appearance.
  • Sample No. 1 was used under the same conditions as in [Example 1] except that a resin film (length 50 m, width 22 mm, thickness 9 ⁇ m) was used instead of the interposed glass film in [Example 1]. 1 was produced. Here, a PET film (dielectric constant 3.2) was used as the resin film. The capacitance of the obtained capacitor was measured using an impedance analyzer (Model 1260 manufactured by Solartron, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV), and the capacitance was calculated from the impedance at 1 Hz. 4 ⁇ F.
  • an impedance analyzer Model 1260 manufactured by Solartron, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV
  • the wound film capacitor of the present invention has high safety, can instantly release / store a large amount of energy, and can secure a large area per unit volume. It is suitable for a DC link capacitor of HEV or HEV.
  • the wound body of the present invention is preferably used for a wound film capacitor, but can be developed for other purposes. For example, after forming a functional film on the surface of a substrate film of resin, metal, etc., in order to avoid contact between the functional films when it is used as a wound body, it can be wound with an intervening glass film. is there.
  • Winding type film capacitor 4 5 Winding body 10, 20 First metal film 11, 21 Base glass film 11a, 21a First surface 11b, 21b Second surface 12, 22 Second Metal film 13, 23 Intercalated glass film 14, 24, 34 First electrode layer 15, 25, 35 Second electrode layer 16 Laminated film 17 Core 18 Through hole

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Ce condensateur à film de type enroulé comporte un corps enroulé qui est obtenu par enroulement d'un film de verre de base qui présente une première surface et une seconde surface, et est caractérisé en ce que : l'épaisseur du film de verre de base est inférieure ou égale à 50 µm ; un premier film métallique est formé sur la première surface du film de verre de base ; un second film métallique est formé sur la seconde surface du film de verre de base ; et le film de verre de base est enroulé avec un film de verre intercalé.
PCT/JP2017/007524 2016-02-29 2017-02-27 Condensateur à film de type enroulé WO2017150460A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2570378A (en) * 2017-12-21 2019-07-24 General Atomics Glass dielectric capacitors manufacturing processes for glass dielectric capacitors

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412932U (fr) * 1977-06-30 1979-01-27
JPS556826A (en) * 1978-06-28 1980-01-18 Matsushita Electric Ind Co Ltd Chip capacitor buried in circuit board and method of manufacturing same
JP2009054669A (ja) * 2007-08-24 2009-03-12 Toray Ind Inc 金属化コンデンサフィルムの製造方法及び金属化フィルム
JP2011029294A (ja) * 2009-07-23 2011-02-10 Nippon Electric Glass Co Ltd コンデンサー用ガラスフィルム
JP2012517692A (ja) * 2009-02-10 2012-08-02 ショット アクチエンゲゼルシャフト キャパシタおよびその製造方法
JP2013247264A (ja) * 2012-05-28 2013-12-09 Daikin Ind Ltd フィルムコンデンサ
WO2014099517A1 (fr) * 2012-12-19 2014-06-26 Imra America, Inc. Matériau actif d'électrode négative pour stockage d'énergie

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412932U (fr) * 1977-06-30 1979-01-27
JPS556826A (en) * 1978-06-28 1980-01-18 Matsushita Electric Ind Co Ltd Chip capacitor buried in circuit board and method of manufacturing same
JP2009054669A (ja) * 2007-08-24 2009-03-12 Toray Ind Inc 金属化コンデンサフィルムの製造方法及び金属化フィルム
JP2012517692A (ja) * 2009-02-10 2012-08-02 ショット アクチエンゲゼルシャフト キャパシタおよびその製造方法
JP2011029294A (ja) * 2009-07-23 2011-02-10 Nippon Electric Glass Co Ltd コンデンサー用ガラスフィルム
JP2013247264A (ja) * 2012-05-28 2013-12-09 Daikin Ind Ltd フィルムコンデンサ
WO2014099517A1 (fr) * 2012-12-19 2014-06-26 Imra America, Inc. Matériau actif d'électrode négative pour stockage d'énergie

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2570378A (en) * 2017-12-21 2019-07-24 General Atomics Glass dielectric capacitors manufacturing processes for glass dielectric capacitors
US10586654B2 (en) 2017-12-21 2020-03-10 General Atomics Glass dielectric capacitors and manufacturing processes for glass dielectric capacitors
GB2570378B (en) * 2017-12-21 2022-07-06 General Atomics Glass dielectric capacitors and manufacturing processes for glass dielectric capacitors

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