WO2017148072A1 - Module d'imagerie et dispositif électronique - Google Patents

Module d'imagerie et dispositif électronique Download PDF

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Publication number
WO2017148072A1
WO2017148072A1 PCT/CN2016/090053 CN2016090053W WO2017148072A1 WO 2017148072 A1 WO2017148072 A1 WO 2017148072A1 CN 2016090053 W CN2016090053 W CN 2016090053W WO 2017148072 A1 WO2017148072 A1 WO 2017148072A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging module
hole
circuit board
camera modules
module according
Prior art date
Application number
PCT/CN2016/090053
Other languages
English (en)
Chinese (zh)
Inventor
申成哲
王昕�
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610120911.7A external-priority patent/CN107155046A/zh
Priority claimed from CN201620162763.0U external-priority patent/CN205545552U/zh
Priority claimed from CN201620163058.2U external-priority patent/CN205545569U/zh
Priority claimed from CN201620163056.3U external-priority patent/CN205545568U/zh
Priority claimed from CN201610120830.7A external-priority patent/CN107155039A/zh
Priority claimed from CN201610120752.0A external-priority patent/CN107155027A/zh
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Publication of WO2017148072A1 publication Critical patent/WO2017148072A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
  • the imaging module of the embodiment of the present invention includes: a flexible circuit board; at least two camera modules, the at least two camera modules are disposed on the flexible circuit board, and the at least two camera modules are formed a first gap; a cover body, the cover body is disposed on the at least two camera modules, a second gap is formed between the cover body and the camera module, and the cover body is spaced apart a first glue hole and a second glue hole, wherein the first glue hole corresponds to the first gap, the second glue hole corresponds to the second gap; and the first gap is disposed And a colloid in the second gap, the colloid connecting the at least two camera modules and the cover.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first point during the assembly process.
  • the glue hole and the second glue hole are arranged to enable the glue to fill the gap, and at least two camera modules are firmly fixed on the cover body.
  • the number of camera modules is two.
  • the flexible circuit board includes two module mounting portions spaced apart and connects the two a connector mounting portion of the module mounting portion; each of the camera modules is disposed on the corresponding module mounting portion.
  • the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the connector mounting portion.
  • the flexible circuit board includes two module mounting portions spaced apart from each other and two connector mounting portions spaced apart, and each of the module mounting portions is connected to the corresponding connector mounting portion.
  • Each of the camera modules is disposed on a corresponding one of the module mounting portions.
  • the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connector mounting portion.
  • the flexible circuit board includes a module mounting portion and a connector mounting portion that connects the module mounting portion; and the two camera modules are disposed on the module mounting portion.
  • the flexible circuit board includes a connection portion that connects the module mounting portion and the connector mounting portion.
  • the first dispensing aperture is elongated.
  • the first dispensing aperture has a width of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length greater than or equal to 1.5 mm.
  • the first dispensing aperture has a width of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length of 8.4 ⁇ 0.1 mm.
  • the first dispensing aperture has a width of 0.5 mm and the first dispensing aperture has a length of 8.4 mm.
  • the distance of the first dispensing aperture to the long side sidewall of the cover is greater than 0.45 mm.
  • the first dispensing hole comprises an elongated hole and two end holes connected at opposite ends of the elongated hole, the end hole being along a width direction of the elongated hole
  • the size of the strip is larger than the width of the long strip hole; the strip hole corresponds to two side walls of the two camera modules; each of the end holes corresponds to two of the two camera modules Corner location.
  • the elongated holes have a width of 0.5 ⁇ 0.1 mm and the elongated holes have a length greater than or equal to 1.5 mm.
  • the elongated aperture has a width of 0.5 ⁇ 0.1 mm and the elongated aperture has a length of 8.4 ⁇ 0.1 mm.
  • the elongated aperture has a width of 0.5 mm and the elongated aperture has a length of 8.4 mm.
  • the distance from the elongated aperture to the long side wall of the cover is greater than 0.45 mm.
  • the end holes are triangular in shape.
  • the second dispensing hole includes a plurality of cylindrical holes spaced apart at different set positions of the cover.
  • the cylindrical bore has a pore size of 1 ⁇ 0.1 mm.
  • the cylindrical bore has a pore size of 1 mm.
  • the cover includes a frame surrounding the at least two camera modules and a top cover connected to the frame, the top cover passes the gel and the at least two cameras The module is fixedly connected.
  • the first dispensing hole is a single dispensing hole
  • the second dispensing hole includes four cylindrical holes, and the four cylindrical holes are respectively distributed on the top of the top cover Corner location.
  • each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the The flexible circuit board is electrically connected to the flexible circuit board, the imaging module includes an electrical connection pad, and the electrical connection pad is disposed between the flexible circuit board and the printed circuit board and electrically Connecting the flexible circuit board to the printed circuit board.
  • An electronic device includes the imaging module according to any of the above embodiments.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole and the second during the assembly process.
  • the glue holes are inserted so that the glue can fill the gap, and at least two camera modules are firmly fixed to the cover.
  • FIG. 1 is a perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 2 is a partially exploded perspective view of an imaging module in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic plan view of an imaging module according to an embodiment of the present invention.
  • FIG 4 is another perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of an imaging module according to an embodiment of the present invention.
  • Figure 7 is an enlarged schematic view of a portion VII of the imaging module of Figure 6.
  • Figure 8 is an enlarged schematic view of a portion VIII of the imaging module of Figure 6.
  • FIG. 9 is a schematic plan view of a cover of an imaging module according to an embodiment of the present invention.
  • FIG. 10 is a perspective view of a cover body of an imaging module according to an embodiment of the present invention.
  • FIG. 11 is a perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • FIG. 12 is another perspective view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • FIG. 13 is another schematic plan view of a cover body of an imaging module according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • the imaging module 100 of the embodiment of the present invention includes a flexible circuit board 10 , at least two camera modules 20 , a cover 30 , and a colloid 40 .
  • At least two camera modules 20 are disposed on the flexible circuit board 10, and a first gap 50 is formed between the at least two camera modules 20.
  • the cover 30 is disposed on the at least two camera modules 20, and a second gap 51 is formed between the cover 30 and the camera module 20.
  • the cover 30 is provided with a first dispensing hole 32 and a second point.
  • the glue hole 33 has a first glue hole 32 corresponding to the first gap 50 and a second glue hole 33 corresponding to the second gap 51.
  • the colloid 40 is disposed in the first gap 50 and the second gap 51 , and the colloid 40 connects at least two camera modules 20 and the cover 30 .
  • the first dispensing hole 32 corresponds to the first gap 50
  • the second dispensing hole 33 corresponds to the second spacing 51, so that the imaging module 100 can be assembled during the assembly process.
  • the adhesive is spotted into the first dispensing hole 32 and the second dispensing opening 33 to enable the adhesive to fill the gap, thereby securing the at least two camera modules 20 to the cover 30 securely.
  • the number of the camera modules 20 is two.
  • the two camera modules 20 are respectively fixed to the flexible circuit board 10, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot.
  • the position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.
  • the flexible circuit board 10 includes two module mounting portions 12 that are spaced apart from each other and a connector mounting portion 14 that connects the two module mounting portions 12.
  • Each camera module 20 is disposed on the corresponding module mounting portion 12 such that the two camera modules 20 are spaced apart.
  • the two camera modules 20 are spaced apart so that there is sufficient space between the two camera modules 20, and the optical axes of the two camera modules 20 can be conveniently adjusted to parallel positions to ensure the imaging of the imaging module 100. quality.
  • the flexible circuit board 10 includes two connecting portions 16 that are spaced apart, and each of the connecting portions 16 is connected to the corresponding module mounting portion 12 and the connector mounting portion 14.
  • the two connecting portions 16 are spaced apart to further facilitate the deformation of the flexible circuit board 10, thereby facilitating adjustment of the positions of the two camera modules 20 such that the optical axes of the two camera modules 20 are parallel.
  • the flexible circuit board includes two module mounting portions 112 spaced apart from each other and two connector mounting portions 114 spaced apart, and each module mounting portion 112 is connected to a corresponding connector.
  • the mounting portion 114 is provided on each of the corresponding module mounting portions 112.
  • the two module mounting portions 112 and the two connector mounting portions 114 are provided at intervals, so that when the flexible circuit board is faulty, only one of the module mounting portions and/or the connector mounting portion needs to be repaired or replaced, which is reduced. Maintenance cost of the imaging module.
  • the flexible circuit board includes two connecting portions 116 spaced apart, and each connecting portion 116 is connected to the corresponding module mounting portion 112 and the corresponding connector mounting portion 114 .
  • each camera module corresponds to the independent module mounting portion 112, the connector mounting portion 114, and the connecting portion 116, so that the circuit connecting portions of the two camera modules are independent of each other, further reducing the maintenance cost of the imaging module.
  • the flexible circuit board includes a module mounting portion 212 and a connector mounting portion 214 that connects the module mounting portion 212 .
  • Two camera modules are disposed on the module mounting portion 212. Therefore, the two camera modules are disposed on the same module mounting portion 212, and the module mounting portion 212 does not need to be manufactured to a smaller size, thereby reducing the manufacturing cost of the module mounting portion.
  • the flexible circuit board includes a connecting portion 216 that connects the module mounting portion 212 and the connector mounting portion 214 . Therefore, the module mounting portion 212, the connector mounting portion 214, and the connecting portion 216 form a unitary single structure, which reduces the manufacturing cost of the flexible circuit board.
  • the first dispensing hole 32 is a single dispensing hole, which includes an elongated hole 34 and two end holes 36 connected to both ends of the elongated hole 34.
  • the dimension of the elongated hole 34 in the width direction is larger than the width of the elongated hole 34.
  • the elongated holes 34 correspond to the two side walls of the two camera modules 20 .
  • Each of the end holes 36 corresponds to two corner positions 20a, 20b of the two camera modules 20.
  • the colloid 40 enters the gap between the two camera modules 20 through the elongated holes 34, so that the colloid 40 connects the intermediate side walls of the two camera modules 30 and the cover 30;
  • the colloid 40 enters the gap between the two corner positions 20a, 20b of the two camera modules 20 and the cover 30 through the two end holes 36, so that the colloid 40 connects the corner side walls of the two camera modules 20 and the cover 30. .
  • the connection strength of the colloid 40 to fix the two camera modules 20 to the cover 30 is improved.
  • the dimension of the end hole 36 along the width direction of the elongated hole 34 is larger than the width of the elongated hole 34, so that the two camera modules 20 form a T-shaped colloidal connection portion with the cover 30 at the corner positions 20a, 20b.
  • the connection strength between the two camera modules 20 and the cover 30 is further improved.
  • the width W of the elongated hole 34 is 0.5 ⁇ 0.1 mm, preferably 0.5 mm.
  • the width of the elongated hole 34 is smaller than the above range, this is not easy to dispense and is easy to overflow; when the width of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the width of the hole 34 is 0.5 mm, the colloid 40 easily enters the first dispensing hole 32.
  • the length L of the elongated hole 34 is 8.4 ⁇ 0.1 mm, preferably 8.4 mm.
  • the length of the elongated hole 34 is less than the above range, this is not easy to dispense and is easy to overflow; when the length of the elongated hole 34 is larger than the above range, this causes the strength of the cover 30 to be low; When the length of the hole 34 is 8.4 mm, the colloid 40 does not easily overflow outside the first dispensing hole 32.
  • the elongated hole 34 has a width W of 0.5 ⁇ 0.1 mm and the elongated hole 34 has a length L greater than or equal to 1.5 mm.
  • the distance H between the elongated holes 34 and the long side walls of the cover 30 is greater than 0.45 mm.
  • the end hole 36 has a triangular shape.
  • the triangular shaped end holes 36 facilitate the formation of the correspondingly shaped colloids 40 such that the connection of the two camera modules 20 to the cover 30 is stronger.
  • the first dispensing holes 130 are elongated. Further, the width W1 of the first dispensing hole 130 is 0.5 ⁇ 0.1 mm, preferably 0.5 mm, and the length L1 of the first dispensing hole 130 is 8.4 ⁇ 0.1 mm, preferably 8.4 mm.
  • the first dispensing aperture 130 has a width W1 of 0.5 ⁇ 0.1 mm and the first dispensing aperture has a length L1 greater than or equal to 1.5 mm.
  • the distance H1 of the first dispensing hole 130 to the long side wall of the cover is greater than 0.45 mm.
  • the second dispensing hole 33 includes a plurality of cylindrical holes 37, and the plurality of cylindrical holes 37 are spaced apart at different set positions of the cover 30.
  • the cover 30 has a substantially rectangular parallelepiped shape.
  • the cover 30 includes a frame 38 surrounding the two camera modules 20 and a top cover 39 connected to the frame 38.
  • the cover 39 is fixedly connected to the two camera modules 20 via the glue 40.
  • the number of the cylindrical holes 37 is four, and the four cylindrical holes 37 are respectively distributed at the four corner positions of the top cover 39. In this way, the distribution of the colloid 40 can be made more reasonable, and the connection strength of the colloid 40 to the camera module 20 and the cover 30 can be improved.
  • top cover 39 is provided with two light-passing holes 391, and the two camera modules 20 are respectively exposed through the two light-passing holes 391.
  • both of the light-passing holes 391 have a cylindrical shape.
  • the shape of the two light-passing holes can be determined specifically. Therefore, the shape of the light-passing hole of the present embodiment is not to be construed as limiting the invention.
  • the cylindrical hole 37 has a hole diameter of 1 ⁇ 0.1 mm, and preferably, the cylindrical hole 37 has a hole diameter of 1 mm.
  • the second gap 51 includes a side gap 53 and a top gap 55 formed by an inner surface of the frame 38 and an outer side surface of the camera module 20 , and the top gap 55 is formed by The inner surface of the top cover 39 is formed between the inner surface of the top cover 39 and the outer top surface of the camera module 20.
  • the side gap 53 connects the top gap 55 and communicates with the second glue hole 33 in common, for example, directly communicating with the second glue hole 33.
  • the colloid 40 when the colloid 40 enters the second interval 51 from the second dispensing hole 33, a part of the colloid 40 flows into the side gap 53, and another part of the colloid 40 flows into the top gap 55, so that the colloid 40 sticks the camera module 20 from different directions. Connected within the cover 30. After the colloid 40 is cured, the colloid 40 securely fixes the camera module 20 within the cover 30.
  • each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 .
  • the sensing faces of the two image sensors 22 are oriented on the same side.
  • the printed circuit board 21 is disposed on the flexible circuit board 10 and electrically connected to the flexible circuit board 10.
  • the image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
  • the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10.
  • the image sensor 22 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor.
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the printed circuit board 21 is disposed on the module mounting portion 12 and electrically connected to the module mounting portion 12.
  • the imaging module 100 includes an electrical connection pad 52.
  • the electrical connection pad 52 is disposed between the flexible circuit board 10 and the printed circuit board 21 and electrically connected to the flexible circuit board 10 and the printed circuit. Board 21.
  • the electrical connection pads 52 electrically connect and communicate between the flexible circuit board 10 and the camera module 20.
  • the electrical connection pad 52 can be made of a conductive paste.
  • the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
  • the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
  • the lens module 23 includes a lens 231 and a voice coil motor 232.
  • the voice coil motor 232 includes a housing 2321.
  • the lens 231 is disposed in the housing 2321.
  • the first gap 50 is formed in two of the two camera modules. Between the housings 2321, a second gap is formed between the two housings and the cover.
  • the voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image.
  • a filter 24 is disposed between the lens 231 and the image sensor 22. The filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
  • the filter 24 is an infrared cut filter.
  • the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.
  • the light passes through the light-passing hole 391, the lens 231 and the filter 24 in sequence, and then reaches the image sensor 22, so that the image sensor 22 can collect an external image.
  • the lens module 23 further includes a base 233.
  • the base 233 defines a recess 2331.
  • the bottom surface of the recess 2331 defines a through hole 2332.
  • the filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
  • the housing 2321 can be coupled to the base 233 by a first rubber ring 54.
  • the pedestal 233 can be attached to the printed circuit board 21 via a second rubber ring 56.
  • the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
  • the imaging module 100 includes a connector 58 .
  • the connector 58 is disposed on the connector mounting portion 14 and electrically connected to the connector mounting portion 14 .
  • the connector 58 can quickly mount the imaging module 100 to the electronic device.
  • the light passing hole 391 is disposed coaxially with the optical axis of the lens 231.
  • the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 12 are fixed on the reinforcing plate 60.
  • the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
  • the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70.
  • the anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image.
  • the electromagnetic wave preventing member 70 can be made of, for example, a metal material.
  • FIG. 3, FIG. 5 and FIG. 6 do not show the colloid 40 so as to clearly show the relationship between other elements.
  • FIGS. 3, 5 and 6 do not show the colloid 40 so as to clearly show the relationship between other elements.
  • FIGS. 1 and 2 show the positions of the colloid 40 in FIGS. 3, 5 and 6 by means of FIGS. 1 and 2 and corresponding textual descriptions.
  • part of the colloid 40 is also omitted in FIG. 2, for example, the colloid 40 located in the second dispensing hole 33 is omitted.
  • An electronic device includes the imaging module of any of the above embodiments.
  • Electronic device such as hand Machine, tablet, etc.
  • the first dispensing hole corresponds to the first gap
  • the second dispensing hole corresponds to the second spacing, so that the imaging module can point the adhesive to the first dispensing hole during the assembly process.
  • the second point is in the glue hole so that the glue can fill the gap, and then at least two camera modules are firmly fixed on the cover body.

Abstract

L'invention concerne un module d'imagerie et un dispositif électronique. Le module d'imagerie comprend : une carte de circuit imprimé flexible ; au moins deux modules photographiques placés sur la carte de circuit imprimé flexible, un premier espace étant formé entre les deux modules photographiques ou plus ; un capot recouvrant les deux modules photographiques ou plus, un second espace étant formé entre le capot et les modules photographiques, le capot comportant un premier trou de distribution d'adhésif et un second trou de distribution d'adhésif qui sont espacés l'un de l'autre, le premier trou de distribution d'adhésif correspondant au premier espace et le second trou de distribution d'adhésif correspondant au second espace ; et des adhésifs placés dans les premier et second intervalles et utilisés pour relier les deux modules photographiques ou plus au capot. Dans le module d'imagerie, le premier trou de distribution d'adhésif correspond au premier espace et le second trou de distribution d'adhésif correspond au second espace. Par conséquent, les adhésifs peuvent être distribués dans les premier et second trous de distribution d'adhésif pendant l'assemblage du module d'imagerie. De la sorte, les espaces peuvent être remplis avec les adhésifs, assurant ainsi fermement les deux modules photographiques ou plus au capot.
PCT/CN2016/090053 2016-03-03 2016-07-14 Module d'imagerie et dispositif électronique WO2017148072A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN201610120752.0 2016-03-03
CN201610120911.7A CN107155046A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620162763.0U CN205545552U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163058.2U CN205545569U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163056.3U CN205545568U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120830.7A CN107155039A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163056.3 2016-03-03
CN201610120752.0A CN107155027A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163058.2 2016-03-03
CN201610120911.7 2016-03-03
CN201620162763.0 2016-03-03
CN201610120830.7 2016-03-03

Publications (1)

Publication Number Publication Date
WO2017148072A1 true WO2017148072A1 (fr) 2017-09-08

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Application Number Title Priority Date Filing Date
PCT/CN2016/090053 WO2017148072A1 (fr) 2016-03-03 2016-07-14 Module d'imagerie et dispositif électronique

Country Status (1)

Country Link
WO (1) WO2017148072A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001305535A (ja) * 2000-04-18 2001-10-31 Miyota Kk 直下型バックライト
CN104333687A (zh) * 2014-11-28 2015-02-04 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN104580857A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN104932174A (zh) * 2015-06-25 2015-09-23 南昌欧菲光电技术有限公司 双摄像头模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001305535A (ja) * 2000-04-18 2001-10-31 Miyota Kk 直下型バックライト
CN104333687A (zh) * 2014-11-28 2015-02-04 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN104580857A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN104932174A (zh) * 2015-06-25 2015-09-23 南昌欧菲光电技术有限公司 双摄像头模组

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