WO2017148074A1 - Module d'imagerie et dispositif électronique. - Google Patents

Module d'imagerie et dispositif électronique. Download PDF

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Publication number
WO2017148074A1
WO2017148074A1 PCT/CN2016/090055 CN2016090055W WO2017148074A1 WO 2017148074 A1 WO2017148074 A1 WO 2017148074A1 CN 2016090055 W CN2016090055 W CN 2016090055W WO 2017148074 A1 WO2017148074 A1 WO 2017148074A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
imaging module
circuit board
mounting portion
camera modules
Prior art date
Application number
PCT/CN2016/090055
Other languages
English (en)
Chinese (zh)
Inventor
申成哲
王昕�
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201620163236.1U external-priority patent/CN205545578U/zh
Priority claimed from CN201610120751.6A external-priority patent/CN107155026A/zh
Priority claimed from CN201620162898.7U external-priority patent/CN205545556U/zh
Priority claimed from CN201610120792.5A external-priority patent/CN107155032A/zh
Priority claimed from CN201610120785.5A external-priority patent/CN107155030A/zh
Priority claimed from CN201610120794.4A external-priority patent/CN107155033A/zh
Priority claimed from CN201620163058.2U external-priority patent/CN205545569U/zh
Priority claimed from CN201610120752.0A external-priority patent/CN107155027A/zh
Priority claimed from CN201620163047.4U external-priority patent/CN205545567U/zh
Priority claimed from CN201620163071.8U external-priority patent/CN205545571U/zh
Priority claimed from CN201610120900.9A external-priority patent/CN107155044A/zh
Priority claimed from CN201620163207.5U external-priority patent/CN205545577U/zh
Priority claimed from CN201620162646.4U external-priority patent/CN205545547U/zh
Priority claimed from CN201620163044.0U external-priority patent/CN205647689U/zh
Priority claimed from CN201610120788.9A external-priority patent/CN107155031A/zh
Priority claimed from CN201620162647.9U external-priority patent/CN205545548U/zh
Priority claimed from CN201610120797.8A external-priority patent/CN107155034A/zh
Priority claimed from CN201610120913.6A external-priority patent/CN107155047A/zh
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Publication of WO2017148074A1 publication Critical patent/WO2017148074A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
  • the dual camera module can be applied to electronic devices such as mobile phones and tablet computers. Therefore, how to reduce the cost of the dual camera module has become an urgent problem to be solved.
  • the present invention is directed to solving one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
  • the imaging module of the embodiment of the invention comprises a flexible circuit board and at least two camera modules.
  • the flexible circuit board includes at least two module mounting portions spaced apart and at least two connector mounting portions spaced apart. Each module mounting portion is connected to a corresponding connector mounting portion.
  • Each camera module is disposed on a corresponding module mounting portion, and at least two camera modules have the same focal length.
  • the structure of at least two camera modules can be made simpler, which is advantageous for reducing the cost of the imaging module. At the same time, this can make the image processing algorithm of the imaging module simpler and further reduce the cost of the imaging module.
  • the number of the camera modules and the number of the module mounting portions are two.
  • the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connector mounting portion.
  • each of the camera modules includes a printed circuit board and is disposed on the printed circuit board And an image sensor electrically connected to the printed circuit board, the printed circuit board is disposed on the module mounting portion and electrically connected to the module mounting portion.
  • the imaging module includes an electrical connection pad disposed between the printed circuit board and the module mounting portion, and electrically connected to the printed circuit board. And the module mounting portion.
  • the camera module includes a lens module disposed on the printed circuit board and positioned above the image sensor.
  • the lens module includes a lens and a voice coil motor
  • the voice coil motor includes a housing, and the lens is disposed in the housing, and the two housings of the two camera modules are spaced apart.
  • the imaging module includes a connector assembly including a substrate and a connector disposed on the substrate, the substrate being disposed on the connector mounting portion and The connector mounting portion is electrically connected.
  • the imaging module includes a gel that bonds the two camera modules.
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by soldering the connection side.
  • the imaging module includes a frame, and the two camera modules are disposed in the frame and are fixedly coupled to the frame.
  • An electronic device includes the imaging module of any of the above embodiments.
  • the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the imaging module of FIG. 2 taken along the line III-III.
  • FIG. 4 is an enlarged schematic view of an IV portion of the imaging module of FIG. 3.
  • FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 6 is another exploded schematic view of an imaging module according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention. Figure 1 does not show the frame of the imaging module.
  • an imaging module 100 includes a flexible circuit board 10 and at least two camera modules 20 .
  • the flexible circuit board 10 includes at least two module mounting portions 11 and at least two connections arranged at intervals Device mounting portion 12. Each of the module mounting portions 11 is connected to a corresponding connector mounting portion 12.
  • Each camera module 20 is disposed on the corresponding module mounting portion 11, and the focal lengths of at least two camera modules 20 are the same.
  • the structure of the at least two camera modules 20 can be made simpler, which is advantageous for reducing the cost of the imaging module 100. At the same time, this can also make the image processing algorithm of the imaging module 100 simpler, and can further reduce the cost of the imaging module 100.
  • the number of the camera modules 20 and the number of the module mounting portions 11 are both two. It can be understood that in other embodiments, the number of camera modules and the number of module mounting portions may be three or more, and the number of camera modules corresponds to the number of module mounting portions.
  • the focal length of each of the two camera modules 20 can be a fixed focal length, and the structure of each camera module 20 can be the same as that of the other camera module 20, thereby achieving two The focal lengths of the camera modules 20 are all the same.
  • the focal length of one of the two camera modules 20 may be a fixed focal length, and the focal length of the other camera module 20 is a zoom distance, which can be adjusted by the zoom module.
  • the focal length is the same as the focal length of the camera module 20 with a fixed focal length.
  • the two camera modules 20 can simultaneously zoom the camera module 20, so that the focal lengths of the two camera modules 20 can be conveniently adjusted to be the same.
  • the two camera modules 20 are respectively fixed to the module mounting portion 11, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot.
  • the position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel.
  • the flexible circuit board 10 includes two connecting portions 13 disposed at intervals, and each connecting portion 13 is connected to the corresponding module mounting portion 11 and the corresponding connector mounting portion 12 .
  • the connecting portion 13 can realize communication between the module mounting portion 11 and the connector mounting portion 12, so that the camera module disposed on the module mounting portion 11 transmits the collected image information to the electronic device.
  • the spacing of the two connecting portions 13 also facilitates replacement of the flexible circuit board 10.
  • each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 .
  • the printed circuit board 21 is disposed on the module mounting portion 11 and is electrically connected to the module mounting portion 11.
  • the image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
  • the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10. It should be noted that the sensing faces of the two image sensors 22 are parallel or coplanar and face the same side.
  • the image sensor 22 can be, for example, a complementary metal oxide semiconductor (Complementary Metal Oxide). Semiconductor, CMOS) image sensor or charge-coupled device (CCD) image sensor.
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the imaging module 100 includes an electrical connection pad 211.
  • the electrical connection pad 211 is disposed between the printed circuit board 21 and the module mounting portion 11 and electrically connected to the printed circuit board 21 and the module mounting portion 11 .
  • the electrical connection pad 211 can electrically connect and communicate between the flexible circuit board 10 and the camera module 20 .
  • the electrical connection pads 211 are all made of a conductive paste.
  • the shape and size of the printed circuit board 21 are slightly smaller than the shape and size of the corresponding module mounting portion 11.
  • the volume of the electronic device can be further reduced.
  • each printed circuit board 21 and the corresponding module mounting portion 11 have a flat shape.
  • the shape of each printed circuit board and the corresponding module mounting portion may be specifically set according to actual needs.
  • the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
  • the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
  • the lens module 23 includes a lens 231 and a voice coil motor 232.
  • the voice coil motor 232 includes a housing 2321.
  • the lens 231 is disposed in the housing 2321.
  • the two housings 2321 of the two camera modules 20 are spaced apart from each other. .
  • the voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image.
  • the voice coil motor 232 can realize the movement of the driving lens 231, the focal lengths of the two camera modules 20 can be the same.
  • a filter 24 is disposed between the lens 231 and the image sensor 22.
  • the filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
  • the filter 24 is an infrared cut filter.
  • the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.
  • the lens module 23 further includes a base 233.
  • the base 233 defines a recess 2331.
  • the bottom surface of the recess 2331 defines a through hole 2332.
  • the filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
  • the light passes through the lens 231 and the filter 24 in turn and reaches the image sensor 22, so that the image sensor 22 can collect the external image.
  • the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
  • the imaging module 100 includes a connector assembly 30, and the connector assembly 30 includes a substrate 31 and a device.
  • a connector 32 is disposed on the substrate 31.
  • the substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12.
  • the connector 32 can quickly mount the imaging module 100 to the electronic device.
  • the substrate 31 corresponds to the shape and size of the connector mounting portion 12. This makes the structure of the connector 32 and the flexible circuit board 10 more compact.
  • the imaging module 100 includes a colloid 40, and the colloid 40 bonds the two camera modules 20.
  • the colloid 40 is inserted between the two camera modules.
  • the colloid 40 ensures that the two camera modules 20 are relatively fixed.
  • the colloid 40 can increase the connection strength of the two camera modules 20, and can reduce the probability of the optical axis offset of the two camera modules 20.
  • the colloid 40 is located at a lower portion of the gap between the two camera modules 20 .
  • the colloid can fill the gap between the two camera modules.
  • the colloid 40 may be, for example, a colloidal colloid such as UV glue (Ultraviolet Glue).
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by a solder connection side.
  • the two camera modules can be firmly fixed together by welding.
  • the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire bonding.
  • the imaging module 100 includes a frame 50 , and the two camera modules 20 are disposed in the frame 50 and fixedly connected to the frame 50 .
  • the frame 50 and the two camera modules 20 can be fixedly connected by welding or colloid.
  • the frame 50 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging.
  • the quality of the module 100 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging. The quality of the module 100.
  • the frame 50 is provided with a fixing hole 50a, and a gap is formed between the hole wall of the fixing hole 50a and the two camera modules 20. Solder or colloid is filled in the gap between the wall of the fixing hole 50a and the two camera modules 20, and the two camera modules 20 are fixedly connected to the frame 50.
  • the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 11 are fixed on the reinforcing plate 60.
  • the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
  • the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70.
  • the anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image.
  • the electromagnetic wave preventing member 70 can be made of, for example, a metal material.
  • An electronic device includes the imaging module of any of the above embodiments.
  • the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.

Abstract

La présente invention concerne un module d'imagerie et un dispositif électronique. Le module d'imagerie comprend une carte de circuit imprimé souple et au moins deux modules de photographie. La carte de circuit imprimé souple comprend au moins deux parties de montage de module qui sont espacées l'une de l'autre et au moins deux parties de montage de connecteur qui sont espacées l'une de l'autre. Les parties de montage de module sont chacune reliées à une partie de montage de connecteur correspondante. Les modules de photographie sont chacun disposés sur une partie de montage de module correspondante. Les deux, ou plus, modules de photographie présentent la même distance focale.
PCT/CN2016/090055 2016-03-03 2016-07-14 Module d'imagerie et dispositif électronique. WO2017148074A1 (fr)

Applications Claiming Priority (36)

Application Number Priority Date Filing Date Title
CN201620162898.7U CN205545556U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120785.5 2016-03-03
CN201610120792.5A CN107155032A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620162646.4 2016-03-03
CN201610120788.9 2016-03-03
CN201610120785.5A CN107155030A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120794.4A CN107155033A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120794.4 2016-03-03
CN201620163058.2U CN205545569U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163071.8 2016-03-03
CN201610120900.9A CN107155044A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120752.0A CN107155027A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120913.6A CN107155047A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163236.1U CN205545578U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163044.0 2016-03-03
CN201620163207.5U CN205545577U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620162647.9 2016-03-03
CN201620162646.4U CN205545547U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120751.6 2016-03-03
CN201610120913.6 2016-03-03
CN201620163044.0U CN205647689U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163207.5 2016-03-03
CN201620162898.7 2016-03-03
CN201610120788.9A CN107155031A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120792.5 2016-03-03
CN201620162647.9U CN205545548U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201620163047.4 2016-03-03
CN201610120797.8A CN107155034A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120752.0 2016-03-03
CN201610120751.6A CN107155026A (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120900.9 2016-03-03
CN201620163058.2 2016-03-03
CN201620163071.8U CN205545571U (zh) 2016-03-03 2016-03-03 成像模组及电子装置
CN201610120797.8 2016-03-03
CN201620163236.1 2016-03-03
CN201620163047.4U CN205545567U (zh) 2016-03-03 2016-03-03 成像模组及电子装置

Publications (1)

Publication Number Publication Date
WO2017148074A1 true WO2017148074A1 (fr) 2017-09-08

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Application Number Title Priority Date Filing Date
PCT/CN2016/090055 WO2017148074A1 (fr) 2016-03-03 2016-07-14 Module d'imagerie et dispositif électronique.

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Country Link
WO (1) WO2017148074A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020038052A1 (fr) * 2018-08-22 2020-02-27 Oppo广东移动通信有限公司 Ensemble d'entrée/sortie et dispositif mobile
CN113660402A (zh) * 2021-08-19 2021-11-16 南昌逸勤科技有限公司 摄像头模组及电子设备

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Publication number Priority date Publication date Assignee Title
JP2001305535A (ja) * 2000-04-18 2001-10-31 Miyota Kk 直下型バックライト
CN104333687A (zh) * 2014-11-28 2015-02-04 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN104580857A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN105187695A (zh) * 2015-07-21 2015-12-23 南昌欧菲光电技术有限公司 双摄像头模组及摄像装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001305535A (ja) * 2000-04-18 2001-10-31 Miyota Kk 直下型バックライト
CN104333687A (zh) * 2014-11-28 2015-02-04 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN104580857A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN105187695A (zh) * 2015-07-21 2015-12-23 南昌欧菲光电技术有限公司 双摄像头模组及摄像装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020038052A1 (fr) * 2018-08-22 2020-02-27 Oppo广东移动通信有限公司 Ensemble d'entrée/sortie et dispositif mobile
CN113660402A (zh) * 2021-08-19 2021-11-16 南昌逸勤科技有限公司 摄像头模组及电子设备

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