WO2017123834A1 - Conditionneur de patin cmp, système et procédé de conditionnement de patin - Google Patents

Conditionneur de patin cmp, système et procédé de conditionnement de patin Download PDF

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Publication number
WO2017123834A1
WO2017123834A1 PCT/US2017/013289 US2017013289W WO2017123834A1 WO 2017123834 A1 WO2017123834 A1 WO 2017123834A1 US 2017013289 W US2017013289 W US 2017013289W WO 2017123834 A1 WO2017123834 A1 WO 2017123834A1
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WO
WIPO (PCT)
Prior art keywords
pad conditioner
abrasive member
computing device
measurement
identification data
Prior art date
Application number
PCT/US2017/013289
Other languages
English (en)
Inventor
Sze Wei Kelvin ANG
Kok Chian LOH
Saujit Bandhu
Yunlong Qiao
Chin Hua Lim
Kar Yam TAY
Maria Celina M. ALCASABAS
Yang Lu
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2017123834A1 publication Critical patent/WO2017123834A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Definitions

  • the present invention relates broadly, but not exclusively, to a chemical mechanical planarization (CMP) pad conditioner, and to a CMP pad conditioning system and method.
  • CMP chemical mechanical planarization
  • CMP Chemical mechanical planarization
  • a polish pad dispensed with a slurry is used to remove material from a surface of the wafer through relative movement between the polishing pad and the wafer.
  • the slurry may also contain chemicals that react with the wafer material.
  • the surface of the polishing pad may become glazed, i.e. it loses its abrasiveness, and requires conditioning in order to restore its abrasiveness.
  • the conditioning process typically involves using a pad conditioner having an abrasive surface and is usually run periodically using a fixed amount of time.
  • a customer may not know if the process is inadequate or over-done.
  • the pad conditioner fails to descend onto the polishing pad to do the conditioning due to machine malfunctioning.
  • the slurry fails to dispense onto the polishing pad either due to recipe error or machine malfunctioning, causing the temperature of the polishing pad to increase when the polishing continues without the slurry. Such incidents may go unnoticed until later in the inline parameter measurement of product, which is the wafer, after the CMP step.
  • a prior approach to solving the above problems comprises incorporating a sensor into an abrasive article used to roughen the surface of the polishing pad.
  • the sensor can provide CMP information to a remote receiver via a wireless transmitter also incorporated into the abrasive article.
  • the sensor and transmitter typically have much longer useful lifespans than the abrasive article.
  • (CMP) pad conditioner comprising:
  • an adaptor configured to receive an abrasive member
  • a sensing circuit comprising one or more sensing elements, each of the one or more sensing elements configured to measure a respective parameter associated with the abrasive member.
  • the sensing circuit may further comprise a wireless module and a processor coupled between the one or more sensing elements and the wireless module.
  • the processor may be configured to control the wireless module to transmit parameter measurements received from the one or more sensing elements to a remote receiver.
  • the wireless module may be configured to transmit the parameter measurements at predetermined intervals.
  • the parameter measurements may be real time measurements.
  • the one or more sensing elements may be selected from a group consisting of a force sensor, a temperature sensor, a roughness sensor, a wear sensor, a geometric sensor and a microphone.
  • the sensing circuit may be configured to be mounted adjacent to one major surface of the adaptor, the opposing major surface of the adaptor configured to receive the abrasive member. [0013] The sensing circuit may be further configured to read identification data associated with the abrasive member, the identification data being stored in a passive circuit embedded in the abrasive member.
  • the adaptor may comprise a contact point connected to the sensing circuit, the contact point configured to engage with a corresponding contact element of the passive circuit for reading the identification data.
  • the sensing circuit may be configured to generate a radio frequency (RF) field to engage a near field communication (NFC) tag of the passive circuit for reading the identification data.
  • RF radio frequency
  • NFC near field communication
  • CMP pad conditioning system comprising:
  • a pad conditioner comprising:
  • an adaptor configured to receive an abrasive member; and a sensing circuit comprising one or more sensing elements, each of the one or more sensing elements configured to measure a respective parameter associated with the abrasive member;
  • a computing device communicatively coupled to the pad conditioner, wherein the computing device is configured to receive parameter measurements from the pad conditioner and generate an alarm if a parameter measurement is outside of a respective operating range.
  • the parameter measurement may comprise one selected from a group consisting of a down force measurement, a temperature measurement, a roughness measurement a wear measurement, a geometry measurement and a sound measurement.
  • the computing device may be configured to receive the parameter measurements at predetermined intervals.
  • the parameter measurements may be real time measurements.
  • the computing device may be further configured to authenticate the abrasive member based on identification data associated with the abrasive member, the identification data being read and transmitted by the pad conditioner to the computing device.
  • the identification data may be stored in a passive circuit embedded in the abrasive member.
  • the computing device may comprise a storage unit for storing at least one of the parameter measurements and identification data received from the pad conditioner.
  • the computing device may be further configured to compensate a parameter measurement in response to the identification data of the respective abrasive member.
  • CMP chemical mechanical planarization
  • a CMP pad conditioner comprising:
  • an adaptor configured to receive an abrasive member; and a sensing circuit comprising one or more sensing elements, each of the one or more sensing elements configured to measure a respective parameter associated with the abrasive member;
  • the method may further comprise generating an alarm if a parameter measurement is outside of a predetermined range.
  • the parameter measurement may comprise one selected from a group consisting of a down force measurement, a temperature measurement, a roughness measurement and a wear measurement, a geometry measurement and a sound measurement.
  • the parameter measurements may be transmitted at predetermined intervals.
  • the parameter measurements may be real time measurements.
  • Mounting the abrasive member to the adaptor may comprise:
  • Reading identification data associated with the abrasive member may comprise reading identification data stored in a non-volatile memory of a passive circuit embedded in the abrasive member.
  • the method may further comprise storing, in a storage unit of the computing device, at least one of the parameter measurements and identification data received from the pad conditioner. [0032] The method may further comprise compensating, by the computing device, a parameter measurement in response to the identification data of the respective abrasive member.
  • Figure 1 a shows a schematic perspective view of a pad conditioner according to an example embodiment.
  • Figure 1 b shows an alternate schematic perspective view of the pad conditioner of Figure 1 a.
  • Figure 1 c shows an alternate schematic perspective view of the pad conditioner of Figure 1 a with an abrasive member mounted thereon.
  • Figure 1 d shows a schematic exploded view of the pad conditioner of Figure 1 a.
  • Figure 2 shows a schematic perspective view of a pad conditioner and an abrasive member according to another example embodiment.
  • Figures 3a-3b show schematic perspective views of a pad conditioner according to another example embodiment.
  • Figure 4 shows a schematic block diagram illustrating a chemical mechanical planarization (CMP) pad conditioning system according to an example embodiment.
  • Figure 5 shows graphs comparing measured weights and actual weights for 5 data sets using the CMP conditioning system of Figure 4.
  • CMP chemical mechanical planarization
  • Figure 6 shows a graph comparing measured temperature and actual temperature using the CMP conditioning system of Figure 4.
  • Figures 7a-7c show schematic block diagrams illustrating embodiments of a passive circuit embedded in an abrasive member.
  • Figure 8 shows a flow chart illustrating a method of authenticating an abrasive member using the pad conditioner of the example embodiments.
  • Figure 9 shows a flow chart illustrating a CMP pad conditioning method according to an example embodiment.
  • Figure 10 shows a schematic block diagram illustrating a computing system suitable for use in the example embodiments
  • FIG. 1a-1 d shows various views of a chemical mechanical planarization (CMP) pad conditioner 100 according to an example embodiment.
  • the pad conditioner 100 includes an adaptor or holder 102 configured to receive an abrasive member 104, for example, a sintered abrasive plate.
  • the pad conditioner 100 also includes a sensing circuit comprising one or more sensing elements or sensors 106, 108. Each of the one or more sensing elements 106, 108 is configured to measure a respective parameter associated with the abrasive member 104.
  • the one or more sensing elements 106, 108 are disposed at suitable positions relative to the adaptor 102 and are coupled to a printed circuit board 110, which is disposed in a housing 112.
  • sensor 106 may be disposed substantially flush with a major surface 1 14 ( Figure 1 b) of the adaptor 102 while sensor 108 is disposed on the opposing major surface 116 of the adaptor 102.
  • the housing 112 is radio-translucent, and more preferably, transparent to facilitate a visual inspection of the sensing circuit and to permit transmission/receipt of radio frequency signals.
  • the pad conditioner 100 including the adaptor 102, abrasive member 104, sensing circuit and housing 1 12, is normally mounted to a rotatable motor shaft 1 18 of a suitable CMP machine (not shown in Figures 1a-1 d). During operation, the rotation of the shaft 1 18 causes the pad conditioner 100 to move relative to a polishing pad (not shown) and the abrasive member 104 brushes/abrades against the surface of the polishing pad to condition the polishing pad.
  • the parameters measured by the sensing elements 106, 108 during conditioning include press down-force, temperature between the polishing surfaces, polishing pad surface roughness, pad wear, geometry and sound.
  • the one or more sensing elements 106, 108 include a force sensor, a temperature sensor, a roughness sensor, a wear sensor, a geometric sensor and a microphone.
  • the sensing circuit further comprises a transmitter/transceiver and a processor (not shown in Figures 1a-1 d) coupled between the one or more sensing elements 106, 108 and the transmitter/transceiver, such that the processor can control the transmitter/transceiver to transmit parameter measurements received from the one or more sensing elements 106, 108 to a remote receiver (not shown in Figures 1 a-1 d).
  • the transmitter/transceiver can be a wireless module configured to transmit the parameter measurements at predetermined intervals, for example, when the pad conditioner 100 is in use. Further, the parameter measurements may be transmitted instantaneously, i.e. in real-time, at predetermined levels.
  • FIG. 2 show a schematic perspective view of a pad conditioner 200 and an abrasive member 202 according to another example embodiment.
  • the pad conditioner 200 is substantially the same as the pad conditioner 100 as described above with reference to Figures 1 a-1 d, except that the pad conditioner 200 is capable of authenticating the abrasive member 202 based on identification data stored in the abrasive member 202.
  • the abrasive member 202 includes an accessory circuit which is a passive electronic circuit embedded into the abrasive member.
  • the passive electronic circuit includes at least one non-volatile memory component where the identification data is stored.
  • the pad conditioner 200 is configured to read the non-volatile memory component through a connection between the accessory circuit and the sensing circuit in the pad conditioner 200.
  • the connection can be established through contact means such as exposed conductive pads, or contactless means such as near field communication (NFC) or radio frequency identification (RFID).
  • NFC near field communication
  • RFID radio frequency identification
  • the pad conditioner 200 includes a contact point 204 disposed on a lower surface 206 of adaptor 208 and connected to a sensing circuit disposed in housing 210.
  • the contact point 204 is configured to engage with a corresponding contact element 212 of the passive electronic circuit embedded in the abrasive member 202 for reading the identification data. Further details are provided below with reference to Figures 7a-7c and 8.
  • FIGs 3a-3b show schematic perspective views of a pad conditioner 300 according to another example embodiment.
  • the pad conditioner 300 has a flatter design compared to the pad conditioners 100, 200 described above, and includes an adaptor or holder 302 that can also act as the housing for the sensing circuit.
  • the adaptor 302 has a substantially cylindrical wall 304 extending from a base 306.
  • sensing elements 308, 310 can be seen but the printed circuit board is omitted for the sake of brevity.
  • An abrasive member (not shown) can be mounted to a lower surface 312 of the adaptor 302.
  • the adaptor 302 can be attached to a translucent or transparent cover 314 which is then mounted to a rotating shaft (not shown) similar to that of the pad conditioner 100 ( Figures 1 a-1 d).
  • the pad conditioner as described can be incorporated in a chemical mechanical planarization (CMP) pad conditioning system.
  • FIG 4 shows a schematic block diagram illustrating a pad conditioning system 400 according to an example embodiment.
  • the pad conditioning system includes a pad conditioner 402, similar to those described above with reference to Figures 1 -3, and a computing device 404 communicatively coupled to the pad conditioner 402.
  • the connection between the pad conditioner 402 and the computing device 404 is through a wireless network 406 facilitated by a wireless module 408 incorporated in the sensing circuit of the pad conditioner 402.
  • the wireless network 406 can be one of a Bluetooth network, a ZigBee network, a IEEE 802.15.4 network, a WiFi network, etc. It will be appreciated by those skilled in the art that, instead of a wireless connection, a wired connection can be used to communicatively couple the pad conditioner 402 and the computing device 404.
  • the computing device 404 searches for all the pad conditioners 402 within the wireless network 406.
  • multiple pad conditioners can be integrated in the system 400 although only one pad conditioner 402 is shown in Figure 4.
  • Individual pad conditioners 402 register to the computing device 404, including their device information, services they offer, etc.
  • each pad conditioner 402 sends device and process information (i.e. parameter measurements) including temperature, pressure sensor values, battery level, etc.
  • the computing device 404 processes the data received from the pad conditioners 402 and displays corresponding information in its user interface, e.g. on a display device. All relevant information is also saved in its database, e.g. in a storage unit.
  • the computing device 404 generates an alarm if a parameter measurement is outside of a respective operating range.
  • the parameter measurements are sent from the individual pad conditioners 402 to the computing device 404 in real time so that timely intervention can be made in case of an alarm.
  • the pad conditioner 402 is typically connected to a CMP machine 410 which can control, for example, the speed, position, etc., of the pad conditioner 402.
  • the CMP machine 410 is controlled by a CMP Controller 412, e.g. a server system, that includes CMP software which would be understood by those skilled in the art.
  • a connection between the computing device 404 and the CMP Controller 412 can be provided so that a closed-loop system can be implemented.
  • the mode of communication between the computing device 404 and the CMP Controller 412 can be, for example, through a serial connection, a remote protocol call (RPC), or an application programming interface (API), etc.
  • RPC remote protocol call
  • API application programming interface
  • FIG. 5 shows graphs comparing measured weights (y-axis) and actual weights (x-axis) for 5 data sets using the CMP conditioning system 400 of Figure 4. The result shows that the measured weight is accurately fed back to the computing device 404 using the wireless connection.
  • Figure 6 shows a graph comparing measured temperature (y- axis) and actual temperature (x-axis) using the CMP conditioning system 400 of Figure 4. As can be seen from Figure 6, the measured temperature is also accurately fed back to the computing device 404 using the wireless connection up to about 45°C.
  • the pad conditioner can read identification data stored in a passive circuit embedded in the abrasive member to authenticate the abrasive member.
  • the identification data is stored in a non-volatile memory of the passive circuit and includes, for example, serial number, date of manufacturing, hash digest and other relevant data. This information can be read by the pad conditioner through a contact or contactless mechanism once the abrasive member is attached to the pad conditioner.
  • a suitable non-volatile memory for storing the identification data is Electrically Erasable Programmable Read-Only Memory (EEPROM), for example, one with a 128-bit capacity. Other types of non- volatile memory are possible. Table 1 shows an example of how the relevant information is stored in the non-volatile memory of the passive circuit.
  • EEPROM Electrically Erasable Programmable Read-Only Memory
  • the non-volatile memory can be read using a contact connection or a contactless connection.
  • the passive circuit also referred to as the accessory circuit, can be implemented in a number of ways, depending on the type of connection being used.
  • FIG. 7a-7b show schematic block diagrams illustrating embodiments of a passive circuit embedded in an abrasive member when a contact connection is used.
  • the accessory circuit 700 includes an EEPROM data store (i.e. non-volatile memory) 702 and connections thereto, including a power connection 704, a ground connection 706, a serial clock line (SCL) 708 and a serial data line (SDA) 710.
  • EEPROM data store i.e. non-volatile memory
  • SCL serial clock line
  • SDA serial data line
  • the accessory circuit 712 includes a microcontroller 714 and an EEPROM data store 716.
  • the connections to the microcontroller 714 includes power line 718, ground line 720, receiver pin 722 and transmitter pin 724.
  • This embodiment can be useful when a stronger authentication is necessary, for example, the main circuit can throw dynamic authentication to the data store 716 of the accessory circuit 712 via a challenge-response protocol.
  • the microcontroller 714 is necessary because the accessory circuit 712 has to perform local computation.
  • FIG. 7c shows a schematic block diagram illustrating a passive circuit 726 embedded in an abrasive member 728 when a contactless connection is used according to an example embodiment.
  • the passive circuit 726 also referred to as accessory circuit, includes a data store (i.e. non-volatile memory) 730, a microcontroller 732 and an NFC interface 734.
  • a data store i.e. non-volatile memory
  • microcontroller 732 i.e. non-volatile memory
  • NFC interface 734 i.e. non-volatile memory
  • an NFC-enabled pad conditioner actively generates an RF field when it comes into close proximity with the abrasive member 728.
  • the passive circuit 726 in the abrasive member 728 gets powered up, enabling the sensing circuit in the pad conditioner to communicate with the passive circuit 726.
  • FIG 8 shows a flow chart 800 illustrating a method of authenticating an abrasive member, also referred to as sintered abrasive (SA) plate, using the pad conditioner of the example embodiments.
  • SA sintered abrasive
  • an accessory circuit such as one described above with reference to Figures 7a-7c, is embedded into the SA plate (step 802), and identification data associated with the SA plate is stored in the accessory circuit (step 804).
  • the SA plate is attached to the pad conditioner (step 806), thereby forming a connection between the accessory circuit and the sensing circuit of the pad conditioner (step 808).
  • the sensing circuit reads the identification data stored in the accessory circuit (step 810) and sends the data to server (step 812) such as the computing device 404 of Figure 4.
  • the server then performs an authentication of the SA plate (step 814). If the result is positive, the server saves the serial number of the SA plate and associates it with the pad conditioner (step 816). On the other hand, if the result is negative, the server records the result and proceeds to operate the pad conditioner in a reduced functionality mode (step 818).
  • FIG. 9 shows a flow chart 900 illustrating a CMP pad conditioning method according to an example embodiment.
  • a CMP pad conditioner is provided.
  • the pad conditioner includes an adaptor configured to receive an abrasive member, and a sensing circuit comprising one or more sensing elements, each of the one or more sensing elements configured to measure a respective parameter associated with the abrasive member.
  • the pad conditioner is communicatively coupled to a computing device.
  • the abrasive member is mounted to the adaptor.
  • the CMP pad is conditioned while parameter measurements are transmitted from the pad conditioner to the computing device.
  • the device, system and method of the example embodiments can provide real-time monitoring of the pad conditioning process.
  • the pad conditioner is able to collect and record various measurements with the SA plate attached to it.
  • the productivity of the CMP process can be improved with reduced production time and machine downtime with early warning feature.
  • the pad conditioner can detect an abnormal down-force and raise an alarm.
  • the pad conditioner can detect an abnormal increase in the temperature and raise an alarm.
  • the real time performance of the conditioning process can provide the end-user a greater understanding of the CMP process.
  • the polishing process time can be varied according to the readiness of the pad by the data collected, thereby improving the overall quality and efficiency of the CMP process.
  • the pad will be conditioned until the desired surface roughness is achieved measured by the adaptor.
  • under-polishing and over-polishing can be prevented or minimized.
  • wafer rework can be reduced and pad life can be extended respectively, improving the process productivity.
  • the ability to authenticate an abrasive member or SA plate can the individual SA plate to be part of the real time monitoring system by providing a way to identify and track the abrasive plate attached to a particular pad conditioner. For example, if over-polishing occurs and can be attributed to a manufacturing defect in the SA plate, it is possible to identify the plate, get the serial and batch number, crosscheck other SA plates in the same manufacturing batch and inspect if these plates have the same issue. In addition, the system can identify how many times a particular sintered abrasive plate has been used, and if it is time for a replacement. The authentication also allows verification whether the sintered abrasive plate being used is proprietary or generic. Additional information can be embedded to the sintered abrasive plate which can improve the measurements of the pad conditioner. As an example, if there are different types of abrasive plates with different weights, the pad conditioner can use an appropriate compensation method when measuring the pressure.
  • Figure 10 depicts an exemplary computing device 1000, hereinafter interchangeably referred to as a computer system 1000, where one or more such computing devices 1000 may be used for the computing device 404 or CMP controller 412 ( Figure 4).
  • the following description of the computing device 1000 is provided by way of example only and is not intended to be limiting.
  • the example computing device 1000 includes a processor 1004 for executing software routines. Although a single processor is shown for the sake of clarity, the computing device 1000 may also include a multi-processor system.
  • the processor 1004 is connected to a communication infrastructure 1006 for communication with other components of the computing device 1000.
  • the communication infrastructure 1006 may include, for example, a communications bus, cross-bar, or network.
  • the computing device 1000 further includes a main memory 1008, such as a random access memory (RAM), and a secondary memory 1010.
  • the secondary memory 1010 may include, for example, a hard disk drive 1012 and/or a removable storage drive 1014, which may include a floppy disk drive, a magnetic tape drive, an optical disk drive, or the like.
  • the removable storage drive 1014 reads from and/or writes to a removable storage unit 1018 in a well-known manner.
  • the removable storage unit 1018 may include a floppy disk, magnetic tape, optical disk, or the like, which is read by and written to by removable storage drive 1014.
  • the removable storage unit 1018 includes a computer readable storage medium having stored therein computer executable program code instructions and/or data.
  • the secondary memory 1010 may additionally or alternatively include other similar means for allowing computer programs or other instructions to be loaded into the computing device 1000.
  • Such means can include, for example, a removable storage unit 1022 and an interface 1020.
  • a removable storage unit 1022 and interface 1020 include a program cartridge and cartridge interface (such as that found in video game console devices), a removable memory chip (such as an EPROM or PROM) and associated socket, and other removable storage units 1022 and interfaces 1020 which allow software and data to be transferred from the removable storage unit 1022 to the computer system 1000.
  • the computing device 1000 also includes at least one communication interface 1024.
  • the communication interface 1024 allows software and data to be transferred between computing device 1000 and external devices via a communication path 1026.
  • the communication interface 1024 permits data to be transferred between the computing device 1000 and a data communication network, such as a public data or private data communication network.
  • the communication interface 1024 may be used to exchange data between different computing devices 1000 which such computing devices 1000 form part an interconnected computer network. Examples of a communication interface 1024 can include a modem, a network interface (such as an Ethernet card), a communication port, an antenna with associated circuitry and the like.
  • the communication interface 1024 may be wired or may be wireless.
  • Software and data transferred via the communication interface 1024 are in the form of signals which can be electronic, electromagnetic, optical or other signals capable of being received by communication interface 1024. These signals are provided to the communication interface via the communication path 1026.
  • the computing device 1000 further includes a display interface 1002 which performs operations for rendering images to an associated display 1030 and an audio interface 1032 for performing operations for playing audio content via associated speaker(s) 1034.
  • computer program product may refer, in part, to removable storage unit 1018, removable storage unit 1022, a hard disk installed in hard disk drive 1012, or a carrier wave carrying software over communication path 1026 (wireless link or cable) to communication interface 1024.
  • Computer readable storage media refers to any non-transitory tangible storage medium that provides recorded instructions and/or data to the computing device 1000 for execution and/or processing.
  • Examples of such storage media include floppy disks, magnetic tape, CD-ROM, DVD, Blu-rayTM Disc, a hard disk drive, a ROM or integrated circuit, USB memory, a magneto-optical disk, or a computer readable card such as a PCMCIA card and the like, whether or not such devices are internal or external of the computing device 1000.
  • Examples of transitory or non-tangible computer readable transmission media that may also participate in the provision of software, application programs, instructions and/or data to the computing device 1000 include radio or infra-red transmission channels as well as a network connection to another computer or networked device, and the Internet or Intranets including e-mail transmissions and information recorded on Websites and the like.
  • the computer programs are stored in main memory 1008 and/or secondary memory 1010. Computer programs can also be received via the communication interface 1024. Such computer programs, when executed, enable the computing device 1000 to perform one or more features of embodiments discussed herein. In various embodiments, the computer programs, when executed, enable the processor 1004 to perform features of the above-described embodiments. Accordingly, such computer programs represent controllers of the computer system 1000.
  • Software may be stored in a computer program product and loaded into the computing device 1000 using the removable storage drive 1014, the hard disk drive 1012, or the interface 1020.
  • the computer program product may be downloaded to the computer system 1000 over the communications path 1026.
  • the software when executed by the processor 1004, causes the computing device 1000 to perform functions of embodiments described herein.
  • FIG. 10 It is to be understood that the embodiment of Figure 10 is presented merely by way of example. Therefore, in some embodiments one or more features of the computing device 1000 may be omitted. Also, in some embodiments, one or more features of the computing device 1000 may be combined together. Additionally, in some embodiments, one or more features of the computing device 1000 may be split into one or more component parts.
  • a server may be generally described as a physical device comprising at least one processor and at least one memory including computer program code.
  • the at least one memory and the computer program code are configured to, with the at least one processor, cause the physical device to perform the requisite operations.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un conditionneur de patin de planarisation mécano-chimique (CMP), un système de conditionnement de patin CMP et un procédé de conditionnement de patin CMP. Le conditionneur de patin CMP comprend un adaptateur configuré pour recevoir un élément abrasif et un circuit de détection comprenant un ou plusieurs éléments de détection. Chacun des éléments de détection est configuré pour mesurer un paramètre respectif associé à l'élément abrasif.
PCT/US2017/013289 2016-01-14 2017-01-13 Conditionneur de patin cmp, système et procédé de conditionnement de patin WO2017123834A1 (fr)

Applications Claiming Priority (2)

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SG10201600301SA SG10201600301SA (en) 2016-01-14 2016-01-14 CMP Pad Conditioner, Pad Conditioning System And Method
SG10201600301S 2016-01-14

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WO2017123834A1 true WO2017123834A1 (fr) 2017-07-20

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019071053A1 (fr) * 2017-10-04 2019-04-11 Saint-Gobain Abrasives, Inc. Article abrasif et son procédé de formation
CN110391168A (zh) * 2018-04-23 2019-10-29 东京毅力科创株式会社 基片载置装置和基片载置方法
JP2019192765A (ja) * 2018-04-25 2019-10-31 東京エレクトロン株式会社 基板処理装置、基板処理方法およびブラシ
JP2019198901A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ 切削装置
CN110712131A (zh) * 2019-10-31 2020-01-21 邓筑蓉 一种半导体晶圆平坦化设备
EP3597362A1 (fr) * 2018-07-16 2020-01-22 Officina Meccanica Domaso SpA Rectifieuse d'extrémités de ressorts
JP2020049600A (ja) * 2018-09-27 2020-04-02 株式会社ディスコ 研削ホイール及び研削装置
US10857651B2 (en) 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
JP2021008008A (ja) * 2019-07-01 2021-01-28 株式会社ディスコ 加工装置及びチャックテーブル

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343974B1 (en) * 2000-06-26 2002-02-05 International Business Machines Corporation Real-time method for profiling and conditioning chemical-mechanical polishing pads
US20030190868A1 (en) * 2002-04-03 2003-10-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor
US20060052036A1 (en) * 2004-09-09 2006-03-09 Hyeung-Yeul Kim System and method detecting malfunction of pad conditioner in polishing apparatus
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
US20120100779A1 (en) * 2010-10-21 2012-04-26 Applied Materials, Inc. Apparatus and method for compensation of variability in chemical mechanical polishing consumables

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343974B1 (en) * 2000-06-26 2002-02-05 International Business Machines Corporation Real-time method for profiling and conditioning chemical-mechanical polishing pads
US20030190868A1 (en) * 2002-04-03 2003-10-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor
US20060052036A1 (en) * 2004-09-09 2006-03-09 Hyeung-Yeul Kim System and method detecting malfunction of pad conditioner in polishing apparatus
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
US20120100779A1 (en) * 2010-10-21 2012-04-26 Applied Materials, Inc. Apparatus and method for compensation of variability in chemical mechanical polishing consumables

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11712784B2 (en) 2017-10-04 2023-08-01 Saint-Gobain Abrasives, Inc. Abrasive article and method for forming same
CN111315535A (zh) * 2017-10-04 2020-06-19 圣戈班磨料磨具公司 磨料制品及其形成方法
WO2019071053A1 (fr) * 2017-10-04 2019-04-11 Saint-Gobain Abrasives, Inc. Article abrasif et son procédé de formation
US10857651B2 (en) 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
CN110391168A (zh) * 2018-04-23 2019-10-29 东京毅力科创株式会社 基片载置装置和基片载置方法
CN110391168B (zh) * 2018-04-23 2024-03-22 东京毅力科创株式会社 基片载置装置和基片载置方法
CN110400765B (zh) * 2018-04-25 2023-11-28 东京毅力科创株式会社 基片处理装置、基片处理方法和刷
JP2019192765A (ja) * 2018-04-25 2019-10-31 東京エレクトロン株式会社 基板処理装置、基板処理方法およびブラシ
CN110400765A (zh) * 2018-04-25 2019-11-01 东京毅力科创株式会社 基片处理装置、基片处理方法和刷
TWI796467B (zh) * 2018-04-25 2023-03-21 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法、及刷子
JP7101528B2 (ja) 2018-04-25 2022-07-15 東京エレクトロン株式会社 基板処理装置
JP2019198901A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ 切削装置
EP4234162A1 (fr) * 2018-07-16 2023-08-30 OFFICINA MECCANICA DOMASO S.p.A. Rectifieuse d'extrémités de ressorts
EP3597362A1 (fr) * 2018-07-16 2020-01-22 Officina Meccanica Domaso SpA Rectifieuse d'extrémités de ressorts
JP2020049600A (ja) * 2018-09-27 2020-04-02 株式会社ディスコ 研削ホイール及び研削装置
JP7143027B2 (ja) 2018-09-27 2022-09-28 株式会社ディスコ 研削ホイール及び研削装置
JP2021008008A (ja) * 2019-07-01 2021-01-28 株式会社ディスコ 加工装置及びチャックテーブル
JP7250637B2 (ja) 2019-07-01 2023-04-03 株式会社ディスコ 加工装置及びチャックテーブル
CN112847141A (zh) * 2019-10-31 2021-05-28 邓筑蓉 一种半导体晶圆平坦化系统及使用方法
CN110712131B (zh) * 2019-10-31 2021-04-02 邓筑蓉 一种半导体晶圆平坦化设备
CN110712131A (zh) * 2019-10-31 2020-01-21 邓筑蓉 一种半导体晶圆平坦化设备

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