WO2017105014A1

WO2017105014A1 - Ultraviolet exposure device for manufacturing biochip

Info

Publication number: WO2017105014A1
Application number: PCT/KR2016/014103
Authority: WO
Inventors: 곽봉섭; 정기수; 이강호; 박경택
Original assignee: 한국기계연구원
Priority date: 2015-12-14
Filing date: 2016-12-02
Publication date: 2017-06-22
Also published as: KR20170070498A; CN108369385A; KR101764836B1

Abstract

The present description relates to an ultraviolet exposure device for manufacturing a biochip, wherein the volume taken up by the device is reduced so that the device can be used even in a small space, the cost required for the manufacture of the device can be reduced so that the device can be generally used without a heavy cost burden, and the device enables the manufacture of a master mold which is used to manufacture a biochip having a microstructure.

Description

UV Exposure Device for Biochip Manufacturing

TECHNICAL FIELD The present disclosure relates to an ultraviolet exposure apparatus for biochip production, and more particularly, to an ultraviolet exposure apparatus for biochip production that is used for manufacturing a biochip having a fine structure and can be used regardless of place and cost.

As modern medical technology has developed, not only technologies for treating human diseases but also technologies for diagnosing diseases have developed. In the past, the diagnosis technology of disease has been greatly progressed since the observation of the outside of the human body or the form of a questionnaire, and the X-ray imaging to observe the inside of the human body. Recently, not only the diagnosis of diseases through large equipment such as magnetic resonance imaging (MRI) and computed tomography (CT) imaging, but also the insertion of the imaging equipment into the human body through endoscopes By observing the disease can be diagnosed. In addition, it is gradually expected that a technology for observing the inside of a human body by introducing a diagnostic robot having a nanometer size into a blood vessel is introduced.

However, cancer, which is one of the intractable diseases that are difficult to overcome by modern people, is difficult to diagnose by X-ray imaging, and in the case of magnetic resonance imaging or computed tomography, the cost of diagnosis is rather high and the economic burden is high. In addition, the endoscope can also be directly observed, but there is a limit to the human organs to which the endoscope can be put, so it will be unreasonable to be widely used for the diagnosis of cancer that can occur in various sites. On the other hand, the diagnostic robot that is inserted into the human body is still in the research and development stage, so it will take a long time to be commercialized.

In order to solve these problems, there is a cancer diagnosis technology using a biochip as a cancer diagnosis technology that is in the spotlight recently. By injecting patient cells into a biochip containing a diagnostic reagent that specifically binds to cancer cells, the specific binding of the cells can be observed to more easily diagnose the onset of cancer.

In the case of a biochip, a fine flow path having a structure similar to that of a cell should be formed to enable separation of cells. In order to manufacture a biochip having such a fine flow path, a master mold having a shape corresponding to the fine flow path is required. Since the master mold must also have a microstructure, an exposure process of curing the photosensitive polymer using an exposure mask having a shape corresponding to the microstructure should be used to form such a microstructure.

However, existing exposure apparatuses have been constrained in the places where they can be used because they are very bulky, including a configuration for aligning a plurality of masks, and the manufacturing cost is high, and the cost is very high to purchase them. Because of this, it has been impossible to use universally.

This substrate is used to manufacture a biochip having a fine structure, and is intended to provide an ultraviolet exposure apparatus for producing a biochip that can be used regardless of place and cost.

In addition, the technical problem to be solved by the present invention is not limited to the above-mentioned technical problem, and other technical problems not mentioned are clearly to those skilled in the art from the following description. It can be understood.

The ultraviolet exposure apparatus for manufacturing a biochip according to an embodiment of the present invention may include a chamber, a wafer substrate having a photosensitive polymer coated thereon, and an exposure mask mounted on the surface thereof to be pulled out of the chamber along a first direction. It is disposed on the mounting portion, the upper portion of the mounting portion, and supports the upper portion of the mounting portion to fix the exposure mask disposed between the mounting portion, the exposure mask fixing portion including a transmission window so as to transmit ultraviolet rays to the exposure mask and the inside of the chamber And a light source unit for providing ultraviolet rays to the wafer substrate and the exposure mask, wherein the mounting unit is disposed under the mounting unit to form a vacuum between the wafer substrate and to fix the wafer substrate and the exposure mask to the mounting unit. And a wafer substrate and an exposure mask fixed by the vacuum pad by flowing air through the vacuum pad from the mounting portion. It includes an air vent for degassing.

In this case, the mounting unit may further include a driving unit to move the wafer substrate and the vacuum pad mounted on the mounting unit along a second direction parallel to the height direction of the chamber.

The drive unit may include an inclined cam that moves the vacuum pad along the second direction by rotation and a cam shaft that is a rotation axis of the inclined cam.

The ultraviolet exposure apparatus for manufacturing a biochip of this embodiment further includes a pair of rail parts installed along the first direction on the inner wall of the chamber to guide movement of the mounting part when the mounting part is drawn out of the chamber or drawn into the chamber. can do.

The chamber includes a plurality of surfaces to block the interior from the outside, and at least a portion of any one of the plurality of surfaces may be opened, and the mounting unit may be pulled out and drawn in through one open surface.

One wafer substrate may be mounted on the mounting portion.

The exposure mask fixing part may be hinged to one side of the mounting part.

The mounting unit may further include a pressing unit disposed at edges of the mounting unit and the exposure mask fixing unit to press the exposure mask fixing unit to be in close contact with the mounting unit.

On the other hand, the light source unit may include a light emitting diode that emits light of the ultraviolet wavelength.

In addition, the light source unit may emit ultraviolet light of a single wavelength.

The ultraviolet exposure apparatus for manufacturing a biochip of the present embodiment may further include a timer configured to set a time for exposing the photosensitive polymer.

The wafer substrate may comprise a silicon material.

The vacuum pad may be made of an elastic material.

According to the present disclosure, it is possible to use even in a narrow place by further reducing the volume occupied by the whole device, and further reduces the cost required for manufacturing the device, so that it can be used universally without any cost, and thus can be used for biochip production. A device can be provided. In addition, it is possible to provide an ultraviolet exposure apparatus for producing a biochip capable of manufacturing a master mold used for manufacturing a biochip having a microstructure.

1 is a perspective view showing the appearance of an ultraviolet exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a mounting part of the ultraviolet exposure apparatus for manufacturing a biochip according to an embodiment of the present invention, drawn out to the outside.

3 is a side view of the ultraviolet exposure apparatus for manufacturing a biochip of FIG. 2.

FIG. 4 is a view illustrating a state in which a side surface of a chamber and a vacuum pad are deleted in the ultraviolet exposure apparatus for manufacturing a biochip of FIG. 2.

5 is a cross-sectional view illustrating a cross section taken along a line VV of FIG. 1.

FIG. 6 is an enlarged view illustrating region A of FIG. 5.

7 is a diagram illustrating a state in which a wafer substrate and an exposure mask are mounted on a mounting unit according to an embodiment of the present invention.

FIG. 8 is a diagram illustrating a state in which a wafer substrate and an exposure mask are mounted on a mounting unit and cover the exposure mask fixing unit.

FIG. 9 is a view showing a state where the exposure mask fixing part is covered with a wafer substrate and a mounting portion on which the exposure mask is mounted and fixed by a pressing unit.

FIG. 10 is a view showing a state after the mounting portion to which the exposure mask fixing portion is fixed is drawn into the chamber.

FIG. 11 is a photograph of a first embodiment of a biochip fabrication master mold manufactured by an ultraviolet exposure apparatus for biochip fabrication according to an embodiment of the present invention.

FIG. 12 is a photograph of a second embodiment of a biochip fabrication master mold manufactured by an ultraviolet exposure apparatus for biochip fabrication according to an embodiment of the present invention.

FIG. 13 is a photograph of a third embodiment of a biochip fabrication master mold manufactured by an ultraviolet exposure apparatus for biochip fabrication according to an embodiment of the present invention.

FIG. 14 is a photograph of a fourth embodiment of a biochip fabrication master mold manufactured by an ultraviolet exposure apparatus for biochip fabrication according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted to clarify the gist of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification. In addition, the size and thickness of each configuration shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to the illustrated.

1 is a perspective view showing the appearance of the ultraviolet light exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention, Figure 2 is a mounting of the ultraviolet light exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention. 3 is a perspective view illustrating a state in which the unit 120 is drawn out to the outside, and FIG. 3 is a side view of the ultraviolet exposure apparatus 100 for manufacturing a biochip of FIG. 2. FIG. 4 is a view illustrating the side surface of the chamber 110 and the vacuum pad 122 removed from the ultraviolet exposure apparatus 100 for manufacturing the biochip of FIG. 2, and FIG. 5 is a view along the line V-V of FIG. 1. It is sectional drawing which shows the cut cross section, and FIG. 6 is the enlarged view which expanded the area A of FIG.

As illustrated in FIGS. 1 to 6, the UV exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention may include a chamber 110, a mounting unit 120, an exposure mask fixing unit 130, and a light source unit 140. ).

The chamber 110 forms an outer shape of the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment, and a space is formed therein, and may distinguish an interior from an exterior. At this time, the chamber 110 according to the present embodiment may be made of a material capable of shielding the ultraviolet rays so that the ultraviolet rays used for manufacturing the biochip are not emitted to the outside. In addition, it may be made of an opaque material for the same reason.

The chamber 110 of the present embodiment may include a plurality of surfaces to distinguish the exterior from the interior. For example, the chamber 110 may have a shape of a hexahedron having six surfaces as illustrated in FIG. 1.

In this case, at least one surface of any one of the plurality of surfaces forming the chamber 110 may be opened, and the mounting unit 120 described later may be drawn out and drawn in through the opened one surface. It is the arrangement relationship between the user and the ultraviolet exposure apparatus 100 for manufacturing a biochip of this embodiment to determine the open one side. In the process of using the UV exposure apparatus 100 for manufacturing a biochip, a surface of the chamber 110 disposed closest to the user must be opened so that the mounting unit 120 drawn out and drawn through the biochip may be disposed adjacent to the user. Therefore, the user may more conveniently use the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment.

The mounting unit 120 according to the present exemplary embodiment is disposed inside the chamber 110 as shown in FIG. 1 and then drawn out of the chamber 110 along the first direction as shown in FIGS. 2 and 3. Can be. When the mounting unit 120 is drawn out of the chamber 110, the photosensitive polymer-coated wafer substrate 10 and the exposure mask 20 are sequentially mounted on the mounting unit 120.

The "first direction" according to this embodiment is similar to determining the open one side of the chamber 110 as described above. The direction extending from the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment toward the user using the same is the "first direction" according to the present embodiment. Therefore, the mounting unit 120 according to the present exemplary embodiment may be drawn out from the inside of the chamber 110 toward the user of the ultraviolet exposure apparatus 100 for manufacturing the biochip.

The wafer substrate 10 of the present embodiment may be a silicon wafer, and the photosensitive polymer may be, for example, SU-8 series of MicroChem, but is not limited thereto. If the material is cured by ultraviolet light and the photoresist process is possible, it may be included in the scope of the present invention.

The mounting unit 120 of this embodiment mounts only one wafer substrate 10 and one exposure mask 20, and the mounting unit 120 of this embodiment is also disposed as one. Therefore, the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment can further reduce the volume and can be used even in a narrow place. In addition, since the cost required for manufacturing can be further reduced, it can be used universally without burdening the cost.

In the exposure mask 20 of this embodiment, the pattern which can manufacture the master mold required for biochip manufacture is formed. When the exposure mask 20 is disposed on the photosensitive polymer coated wafer substrate 10 and exposed to ultraviolet rays, the photosensitive polymer is cured into a shape corresponding to the master mold formed on the exposure mask 20. After removing the unnecessary portion that is not cured by the etching process, it is possible to form a master mold for biochip manufacturing.

The exposure mask fixing unit 130 supports the upper portion of the mounting unit 120 inside the chamber 110 to fix the exposure mask 20 disposed between the mounting unit 120 to provide a wafer substrate (eg, UV light). The misalignment between 10) and the exposure mask 20 is prevented from occurring.

The exposure mask fixing part 130 of the present embodiment is generated by the light source part 140 described later in order to smoothly provide ultraviolet rays to the wafer substrate 10 and the exposure mask 20 disposed between the mounting part 120. It includes a transmission window 132 so that the ultraviolet rays can be transmitted smoothly.

The exposure mask fixing part 130 of the present embodiment is located on one side of the mounting part 120, more specifically, on one side of the mounting part 120 closest to the chamber 110 when the mounting part 120 is pulled out. The hinges are combined. Therefore, when the mounting unit 120 is pulled out and the wafer substrate 10 and the exposure mask 20 are fixed to the mounting unit 120, the exposure mask fixing unit 130 may be connected to the mounting unit 120 by a hinge movement. And may be arranged as shown in FIGS. 2 and 3 separately. On the contrary, when the mounting unit 120 is retracted so that the mounting unit 120 and the exposure mask fixing unit 130 are disposed in the chamber 110, the mounting unit 120 is illustrated in FIGS. 4 and 5. It is disposed side by side and supports the mounting portion 120 from the upper portion of the mounting portion (120).

At this time, the mounting unit 120 of the present embodiment further includes a pressing unit 128 to improve the fixing force with the exposure mask fixing unit 130. The pressurizing unit 128 is disposed at the edge of the mounting unit 120 and the exposure mask fixing unit 130 so that the exposure mask fixing unit 130 can be firmly supported by the upper part of the mounting unit 120 to be fixed. The exposure mask fixing part 130 is fixed while being pressed toward the part 120.

1 to 3 illustrate a single pressurizing unit 128 according to an example of the present embodiment, but the present invention is not limited thereto, and when a plurality of pressurizing units 128 are formed, fixing force may be improved.

In this case, the mounting unit 120 of the present embodiment may include a vacuum pad 122 and an air vent 124.

The vacuum pad 122 forms a vacuum in the space in contact with the wafer substrate 10 as shown in FIGS. 5 and 6 to fix the wafer substrate 10 while the ultraviolet rays are provided to the wafer substrate 10. Play a role. The vacuum pad 122 according to the present embodiment is made of an elastic material to more smoothly assist in the formation of a vacuum.

The air vent 124 injects air into the vacuum space formed between the vacuum pad 122 and the wafer substrate 10 so that the exposed wafer substrate 10 is separated from the vacuum pad 122. According to the present exemplary embodiment, the air vent 124 may be blocked to form a vacuum by the vacuum pad 122, and when the wafer substrate 10 is separated, the air vent 124 is opened to flow air. Can be.

The vacuum pad 122 and the air vent 124 according to the present exemplary embodiment are disposed on opposite sides of one surface of the photosensitive polymer-coated wafer substrate 10 so as not to affect the exposure process by ultraviolet rays. To this end, the mounting unit 120 is disposed to be opposite to the exposure mask fixing unit 130, and more specifically, the mounting unit opposite to the upper side of which the exposure mask fixing unit 130 supports the mounting unit 120. It may be disposed below the 120.

Meanwhile, the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment further includes a driving unit 126 as shown in FIGS. 5 and 6. The driving unit 126 may move the vacuum pad 122 disposed in the mounting unit 120 along a second direction parallel to the height direction of the chamber 110.

The drive unit 126 in this embodiment includes, for example, an inclined cam 126a and a cam shaft 126b. The inclined cam 126a is a structure which transforms a rotational motion into linear motion, and the cam axis 126b forms the rotational axis of the inclined cam 126a.

According to this embodiment, the inclined cam 126a is rotated about the cam axis 126b, so that the rotational movement of the inclined cam 126a can be transformed into a linear movement that is moved up and down relative to the ground along the second direction. have. Therefore, the vacuum pad 122 connected to the driving unit 126 of the present embodiment may also linearly move in the vertical direction, and the height may be adjusted.

The "second direction" of the present embodiment may be formed in a direction parallel to the height direction of the ultraviolet exposure apparatus 100 for manufacturing a biochip according to the present embodiment from the ground, and may be perpendicular to the first direction. Can be side by side.

The vacuum pad 122 according to the present exemplary embodiment is higher than the mounting unit 120 when the mounting unit 120 is drawn out of the chamber 110 and the exposure mask fixing unit 130 is separated from the mounting unit 120. Or it may be disposed in the center of the mounting portion 120 to have the same height. When the wafer substrate 10 is mounted on the mounting unit 120 such that the other surface of the photosensitive polymer-coated wafer substrate 10 contacts the vacuum pad 122, the vacuum pad 122 is driven by the driving unit 126 of the present embodiment. ) Moves toward the ground, and a vacuum is formed in the space between the wafer substrate 10 and the vacuum pad 122 while the vacuum unit adsorbs the other surface of the wafer substrate 10.

On the other hand, the ultraviolet light exposure apparatus 100 for producing a biochip of the present embodiment includes a light source unit 140. The light source unit 140 is disposed above the inside of the chamber 110 as shown in FIG. 5 to provide ultraviolet rays to cure the photosensitive polymer coated on the wafer substrate 10.

The light source unit 140 of the present embodiment may include a light emitting diode (LED) that emits light in the ultraviolet region in order to provide ultraviolet rays, and more uniform exposure to prevent the occurrence of product defects. The light source unit 140 of the present embodiment may emit light in the ultraviolet region of a single wavelength.

The ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment further includes a rail unit 150 to assist withdrawal of the mounting unit 120.

The rail unit 150 is provided as a pair, and is installed along the first direction on the inner wall of the chamber 110. The pair of edges of the edges of the mounting unit 120 is engaged with the rail unit 150, and the movement of the mounting unit 120 is performed when the mounting unit 120 is drawn out of the chamber 110 or drawn into the inside. Guide.

On the other hand, the UV exposure apparatus 100 for manufacturing a biochip of the present embodiment may further include a timer unit 160. The timer unit 160 adjusts the time for which ultraviolet light is provided to the wafer substrate 10 and the exposure mask 20 by the light source unit 140. The timer unit 160 of the present embodiment may include an input unit for adjusting the time for which ultraviolet rays are provided and a display unit for visually displaying and informing the user. In addition, the display unit of the present embodiment may control whether or not the power is supplied or display the same together.

In the above, the configuration of the ultraviolet light exposure apparatus 100 for manufacturing a biochip according to the present embodiment has been described. Hereinafter, with reference to FIGS. 7 to 10 will be described an example of use of the ultraviolet exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention. However, this is merely an example and various modifications of the use example may be possible at the general knowledge level of the related art.

7 to 10 illustrate a process of mounting and exposing the wafer substrate 10 and the exposure mask 20 in the ultraviolet exposure apparatus 100 for manufacturing a biochip according to the present embodiment. 7 is a diagram illustrating a state in which the wafer substrate 10 and the exposure mask 20 are mounted on the mounting unit 120 according to an embodiment of the present invention. FIG. 8 is a diagram illustrating a state in which the wafer substrate 10 and the exposure mask 20 are mounted on the mounting unit 120 to cover the exposure mask fixing unit 130. FIG. 9 is a view illustrating a state in which the exposure mask fixing part 130 is covered with a mounting unit 120 on which the wafer substrate 10 and the exposure mask 20 are mounted and fixed by the pressing unit 128. 10 is a view illustrating a state after the mounting unit 120 to which the exposure mask fixing unit 130 is fixed is introduced into the chamber 110.

As shown in FIG. 7, when the mounting unit 120 is pulled out of the chamber 110 by the rail unit 150, the exposure mask fixing unit 130 is opened by the hinge movement and separated from the mounting unit 120. do. Here, the separation does not mean that the exposure mask fixing unit 130 is completely separated from the mounting unit 120, and the hinge axis portion is opened by the hinge movement while being coupled with the mounting unit 120. When the exposure mask fixing unit 130 is opened, the driving unit 126 to have the same height as the mounting unit 120 or higher than the mounting unit 120 is disposed in the center of the mounting unit 120. ) Can be lifted from the ground.

When the exposure mask fixing unit 130 is opened, the wafer substrate 10 and the exposure mask 20 may be sequentially mounted on the mounting unit 120. In this case, one surface of the wafer substrate 10 may be coated with a photosensitive polymer. For example, the photosensitive polymer according to the present exemplary embodiment may be applied in a liquid state to be evenly coated on the wafer substrate 10 by spin coating, but is not limited thereto. The other surface of the wafer substrate 10 is not coated with the photosensitive polymer, and the surface not coated with the photosensitive polymer is mounted on the mounting unit 120 to contact the vacuum pad 122.

After the wafer substrate 10 and the exposure mask 20 are mounted on the mounting unit 120, the exposure mask fixing unit 130 may be hinged toward the mounting unit 120, as shown in FIG. 8. .

As shown in FIG. 9, when the exposure mask fixing unit 130 is disposed in parallel with the mounting unit 120 by the hinge movement, the pressing unit 128 presses the edge of the exposure mask fixing unit 130 while the mounting unit ( 120 and the exposure mask fixing part 130 are fixed. After the coupling of the mounting unit 120 and the exposure mask fixing unit 130 by the pressing unit 128 is completed, the mounting unit 120 coupled with the exposure mask fixing unit 130 is along the rail unit 150. It may be drawn into the chamber 110.

On the other hand, after the coupling of the mounting unit 120 and the exposure mask fixing unit 130 by the pressing unit 128 is completed, the driving unit 126 is raised so that the wafer substrate 10 and the exposure mask 20 are mutually different. Closely placed. The driving unit 126 is lifted up before or after the mounting unit 120 coupled with the exposure mask fixing unit 130 is introduced into the chamber 110, regardless of the order.

The drawing is completed as shown in FIG. Thereafter, the user may set a time for irradiating ultraviolet rays by using the timer unit 160. When the light in the ultraviolet region is emitted by the light source unit 140, the user passes through the transmission window 132 of the exposure mask fixing unit 130. Ultraviolet rays may cure the photosensitive polymer of the wafer substrate 10 to correspond to the appearance of the exposure mask 20.

Although not shown in the drawing, when the exposure is completed, the process may proceed in the reverse order to FIGS. 7 to 10. That is, the process may proceed in the order of FIGS. 10, 9, 8, and 7. After the exposure is completed, the mounting unit 120 coupled with the exposure mask fixing unit 130 may be drawn out again from the inside of the chamber 110 along the rail unit 150 to the outside of the chamber 110. After the mounting unit 120 is completely drawn out of the chamber 110, the pressurization by the pressing unit 128 is released and the exposure mask fixing unit 130 is hinged to be separated from the mounting unit 120.

Prior to this, the drive unit 126 is lowered by the drive unit 126 while the vacuum between the vacuum pad 122 and the wafer substrate 10 is maintained, whereby the wafer substrate 10 and the exposure mask that are closely arranged to each other. The process of separating the 20 from each other may proceed. As the driving unit 126 descends, air flows naturally into the vacuum pad 122 through the air vent 124 to release the vacuum. Therefore, the vacuum pad 122 and the wafer substrate 10 fixed by the vacuum can be naturally separated. Therefore, smooth separation is possible without damaging the wafer substrate 10.

Thereafter, the photopolymer may be removed by an etching process to remove the uncured polymer, thereby forming a biochip manufacturing master mold. The biochip may be manufactured using the master mold provided according to the present embodiment.

11 to 14 show actual pictures of the biochip production master mold manufactured by the UV exposure apparatus 100 for biochip production according to the present embodiment. According to the ultraviolet exposure apparatus 100 for manufacturing a biochip according to the present embodiment, it is possible to provide a master mold capable of manufacturing a biochip having a fine flow path.

In the case of a biochip, the microchip includes a microchannel formed by a micrometer-wide width and a fine structure. Therefore, the master mold for forming a micro flow path having a micrometer unit will also need precise processing to have a fine structure. Therefore, the ultraviolet exposure apparatus 100 for manufacturing the biochip of the present embodiment has a fixing force so that the alignment of the wafer substrate 10 and the exposure mask 20 does not deviate during exposure by the same configuration as the vacuum pad 122 and the pressing unit 128. This can improve the production of the master mold for the micro-channel.

In addition, since the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment eliminates unnecessary configuration and exposes only one wafer substrate 10 at a time, the volume occupied by the entire apparatus can be further reduced, and the location is narrow. Can also be used at In addition, since the cost required for manufacturing the ultraviolet exposure apparatus 100 for manufacturing a biochip can be reduced more, it can be used universally without any cost.

While specific embodiments of the invention have been described and illustrated above, it is to be understood that the invention is not limited to the described embodiments, and that various modifications and changes can be made without departing from the spirit and scope of the invention. It is self-evident to those who have. Therefore, such modifications or variations are not to be understood individually from the technical spirit or point of view of the present invention, the modified embodiments will belong to the claims of the present invention.

Claims

chamber;

A mounting part disposed in the chamber so as to be pulled out of the chamber along a first direction and having a photosensitive polymer coated on one surface thereof with a wafer substrate and an exposure mask mounted thereon;

An exposure mask fixing part disposed on the mounting part, supporting the upper part of the mounting part to fix the exposure mask disposed between the mounting part, and including a transmission window to transmit ultraviolet rays to the exposure mask; And

A light source unit disposed in the chamber and providing ultraviolet rays to the wafer substrate and the exposure mask;

The mounting portion,

A vacuum pad disposed under the mounting unit to form a vacuum between the wafer substrate and to fix the wafer substrate and the exposure mask to the mounting unit; And

And an air vent for discharging the wafer substrate and the exposure mask fixed by the vacuum pad from the mounting portion by flowing air through the vacuum pad.
The method of claim 1,

The mounting portion,

And a driving unit for moving the wafer substrate and the vacuum pad mounted in the mounting unit along a second direction parallel to a height direction of the chamber.
The method of claim 2,

The drive unit,

An inclined cam that moves the vacuum pad along the second direction by rotation; And

Ultraviolet exposure apparatus for biochip manufacture containing a camshaft which is a rotational axis of the said inclined cam.
The method of claim 1,

It is installed on the inner wall of the chamber along the first direction, and further comprises a pair of rail portion for guiding the movement of the mounting portion when the mounting portion is drawn out of the chamber or drawn into the interior of the chamber; UV exposure device.
The method of claim 1,

The chamber includes a plurality of surfaces to block the inside from the outside, wherein at least a portion of any one of the plurality of surfaces is open and the mounting portion is drawn out and drawn in through the one surface is open, biochip manufacturing UV exposure device.
The method of claim 1,

An ultraviolet exposure apparatus for manufacturing a biochip, wherein one wafer substrate is mounted on the mounting portion.
The method of claim 1,

The exposure mask fixing unit is hinged to one side of the mounting unit, UV exposure apparatus for producing a biochip.
The method of claim 1,

The mounting portion,

And a pressurizing unit disposed at edges of the mounting unit and the exposure mask fixing unit to press the exposure mask fixing unit to be in close contact with the mounting unit.
The method of claim 1,

The light source unit includes a light emitting diode that emits light of ultraviolet wavelength, ultraviolet exposure apparatus for producing a biochip.
The method of claim 1,

The light source unit emits ultraviolet light of a single wavelength, UV exposure apparatus for producing a biochip.
The method of claim 1,

And a timer unit for setting a time for exposing the photosensitive polymer.
The method of claim 1,

The wafer substrate comprises a silicon material, UV exposure apparatus for producing a biochip.
The method of claim 1,

The vacuum pad is made of an elastic material, UV exposure apparatus for producing a biochip.