KR20170070498A - Uv exposure system for biochip fabrication - Google Patents

Uv exposure system for biochip fabrication Download PDF

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Publication number
KR20170070498A
KR20170070498A KR1020150178081A KR20150178081A KR20170070498A KR 20170070498 A KR20170070498 A KR 20170070498A KR 1020150178081 A KR1020150178081 A KR 1020150178081A KR 20150178081 A KR20150178081 A KR 20150178081A KR 20170070498 A KR20170070498 A KR 20170070498A
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KR
South Korea
Prior art keywords
exposure mask
mounting portion
wafer substrate
chamber
unit
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KR1020150178081A
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Korean (ko)
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KR101764836B1 (en
Inventor
곽봉섭
정기수
이강호
박경택
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한국기계연구원
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Priority to KR1020150178081A priority Critical patent/KR101764836B1/en
Priority to CN201680072701.3A priority patent/CN108369385A/en
Priority to PCT/KR2016/014103 priority patent/WO2017105014A1/en
Publication of KR20170070498A publication Critical patent/KR20170070498A/en
Application granted granted Critical
Publication of KR101764836B1 publication Critical patent/KR101764836B1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)

Abstract

The present invention relates to a semiconductor device comprising a chamber, a wafer substrate which is disposed inside the chamber in such a manner that it can be drawn out to the outside of the chamber in a first direction, a wafer substrate coated with a photosensitive polymer on one surface thereof and a mounting portion on which the exposure mask is mounted, An exposure mask holding portion for holding the upper portion and fixing the exposure mask disposed between the mounting portion and the exposure mask, and an exposure mask fixing portion including a transmission window for transmitting ultraviolet rays to the exposure mask, And the mounting portion is disposed at a lower portion of the mounting portion to form a vacuum between the wafer substrate and the wafer substrate so that the wafer substrate and the exposure mask are fixed to the mounting portion by a vacuum pad and a vacuum pad A fixed wafer substrate and an air vent for releasing the exposure mask from the mounting portion. The present invention relates to an exposure apparatus, which can reduce the volume occupied by a device and can be used even in a narrow space, and can reduce the cost required for manufacturing the device, so that it can be used for general purposes without any expense, The present invention can provide a UV exposure apparatus for manufacturing a biochip capable of manufacturing a master mold used for manufacturing a biochip having a plurality of microchips.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a UV-

The present invention relates to an ultraviolet ray exposure apparatus for manufacturing a biochip, and more particularly, to an ultraviolet ray exposure apparatus for manufacturing a biochip which is used for manufacturing a biochip having a microstructure and which can be used regardless of place and cost.

As modern medical technology develops, technologies for treating human diseases as well as diagnosing diseases have developed together. Disease diagnosis technology has been developed from the outside of the human body in the past, and has progressed greatly from the time when x-rays can be taken and the inside of the human body can be observed. In recent years, not only diagnosis of diseases through large equipment such as magnetic resonance imaging (MRI), computed tomography (CT) imaging, but also insertion of imaging equipment into the human body through an endoscope, To diagnose the disease. In addition, there is a prospect that gradually introducing a technology capable of observing the inside of a human body by inserting a diagnostic robot having a size of nanometer unit in the blood vessel.

However, in the case of cancer, which is one of the incurable diseases that modern people can not cope with, it is somewhat difficult to diagnose by x-ray imaging, and in the case of magnetic resonance imaging or computed tomography, the diagnosis cost is rather high and the economic burden is large. In addition, although the endoscope can be directly observed, there is a limitation in the human organs that can be inserted into the endoscope, which may be difficult to be widely used for diagnosis of cancer that may occur in various sites. On the other hand, in the case of a diagnostic robot inserted into the human body, since it is still in the stage of research and development, it will take a long time to be commercialized.

In order to solve such problems, there is a cancer diagnosis technology using a biochip as cancer diagnosis technology which is recently being spotlighted. It is possible to more easily diagnose the onset of cancer by injecting cells of a patient into a biochip containing a diagnostic reagent that specifically binds to cancer cells and observing the specific binding of the cells.

In the case of a biochip, a fine channel having a structure similar in size to a cell must be formed so that cells can be separated. In order to manufacture a biochip having such a microchannel, a master mold having a shape corresponding to a microchannel is required. Since the master mold must also have a fine structure, an exposure process for curing the photosensitive polymer using an exposure mask having a shape corresponding to the microstructure should be used in order to form such a microstructure.

However, the conventional exposure apparatuses have a large volume including a structure for aligning a plurality of masks, so that the apparatuses have been limited in the places where they can be used, and the manufacturing cost is high, So it has been difficult to use it for general purpose.

The present invention aims to provide an ultraviolet exposure apparatus for manufacturing a biochip which is used in the production of a biochip having a fine structure and which can be used at any place and cost.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. It can be understood.

The ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention includes a chamber, a wafer substrate on which a photosensitive polymer is coated, and an exposure mask are mounted on a surface of the chamber, An exposure mask holding section including a mounting section and a mounting section for supporting the upper portion of the mounting section and fixing an exposure mask disposed between the mounting section and the mounting section, an exposure mask holding section including a transmission window for transmitting ultraviolet rays to the exposure mask, And a light source unit for providing ultraviolet rays to the wafer substrate and the exposure mask. The mounting unit includes a vacuum pad arranged at a lower portion of the mounting unit to form a vacuum between the wafer substrate and the exposure mask, And a wafer substrate and an exposure mask fixed by a vacuum pad by flowing air to the vacuum pad from the mounting portion It includes an air vent for degassing.

The mounting portion may further include a driving unit for moving the wafer substrate and the vacuum pad mounted on the mounting portion along a second direction parallel to the height direction of the chamber.

The drive unit may include an inclined cam that moves the vacuum pad along the second direction by rotation and a camshaft that is a rotation shaft of the inclined cam.

The ultraviolet ray exposure apparatus for manufacturing a biochip of the present embodiment further includes a pair of rail portions provided along the first direction on the inner wall of the chamber and guiding movement of the mounting portion when the mounting portion is drawn out of the chamber or introduced into the chamber can do.

The chamber includes a plurality of surfaces for blocking the interior from the outside, and at least a portion of one of the plurality of surfaces may be opened and opened through one side of the opening.

One wafer substrate can be mounted on the mounting portion.

The exposure mask fixing portion can be hinged to one side of the mounting portion.

The mounting portion may further include a mounting unit and a pressing unit disposed at an edge of the exposure mask fixing unit and configured to press the exposure mask fixing unit so as to be in close contact with the mounting unit.

The light source unit may include a light emitting diode emitting ultraviolet light.

Further, the light source unit can emit ultraviolet light of a single wavelength.

The ultraviolet ray exposure apparatus for manufacturing a biochip of the present embodiment may further include a timer unit for setting a time for exposing the photosensitive polymer.

The wafer substrate may comprise a silicon material.

The vacuum pad may be made of an elastic material.

According to the present invention, since the volume occupied by the entire apparatus can be further reduced, it can be used even in a narrow space, and the cost required for manufacturing the apparatus can be further reduced. Therefore, the ultraviolet exposure for manufacturing a biochip Device can be provided. Further, it is possible to provide an ultraviolet exposure apparatus for manufacturing a biochip capable of manufacturing a master mold used for manufacturing a biochip having a fine structure.

1 is a perspective view showing an external appearance of an ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating a mounting portion of an ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.
3 is a side view of the ultraviolet ray exposure apparatus for manufacturing a biochip shown in Fig.
FIG. 4 is a view showing a side of a chamber and a vacuum pad removed from the ultraviolet ray exposure apparatus for manufacturing a biochip shown in FIG. 2;
5 is a cross-sectional view taken along the line V-V in FIG.
FIG. 6 is an enlarged view of the area A in FIG. 5; FIG.
7 is a view showing a state in which a wafer substrate and an exposure mask are mounted on a mounting portion according to an embodiment of the present invention.
8 is a view showing a state in which the wafer substrate and the exposure mask are mounted on the mounting portion and covers the exposure mask fixing portion.
9 is a view showing a state in which the wafer substrate and the mounting portion with the exposure mask mounted thereon are covered with the exposure mask fixing portion and fixed by the pressing unit.
10 is a view showing a state after a mounting portion to which the exposure mask fixing portion is fixed is led into the chamber.
11 is a photograph of a first embodiment of a master mold for manufacturing a biochip manufactured by an ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.
12 is a photograph of a second embodiment of a master mold for manufacturing a biochip manufactured by the ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.
13 is a photograph of a third embodiment of a master mold for fabricating a biochip manufactured by an ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.
FIG. 14 is a photograph of a fourth embodiment of a master mold for fabricating a biochip manufactured by an ultraviolet ray exposure apparatus for manufacturing a biochip according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

In order to clearly illustrate the present invention, parts that are not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, since the sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, the present invention is not necessarily limited thereto.

FIG. 1 is a perspective view showing an appearance of an ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention. FIG. 2 is a perspective view of an ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention. FIG. 3 is a side view of the ultraviolet ray exposure apparatus 100 for manufacturing a biochip shown in FIG. 2. Referring to FIG. 4 is a view showing a state in which the side surface of the chamber 110 and the vacuum pad 122 are removed from the ultraviolet ray exposure apparatus 100 for manufacturing a biochip shown in FIG. 2. FIG. 5 is a cross- FIG. 6 is an enlarged view of the area A in FIG. 5. FIG.

1 to 6, an ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention includes a chamber 110, a mounting unit 120, an exposure mask fixing unit 130, and a light source 140 ).

The chamber 110 forms the outer shape of the ultraviolet ray exposure apparatus 100 for fabricating the biochip of the present embodiment, and a space is formed therein, and the inside and the outside can be distinguished. At this time, the chamber 110 according to the present embodiment may be made of a material capable of shielding ultraviolet rays so that ultraviolet rays used in the production of biochips are not emitted to the outside. For the same reason, it may be made of an opaque material.

The chamber 110 of the present embodiment may include a plurality of surfaces for distinguishing between the outside and the inside. For example, the chamber 110 may have a hexahedron shape having six sides as shown in FIG.

At this time, at least a part of the plurality of surfaces forming the chamber 110 can be opened at a part, and the mounting part 120 to be described later can be taken out and drawn through the opened surface. The open side is determined by the arrangement relationship of the ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to the present embodiment and the user. In the process of using the ultraviolet ray exposure apparatus 100 for manufacturing a biochip, a user may open one side of a chamber 110 disposed nearest to the user, so that the mounting unit 120 drawn and drawn through is also disposed adjacent to the user The user can more easily use the ultraviolet exposure apparatus 100 for fabricating the biochip of the present embodiment.

The mounting portion 120 of the present embodiment is disposed inside the chamber 110 as shown in FIG. 1 and is drawn out of the chamber 110 along the first direction as shown in FIGS. 2 and 3 . When the mounting portion 120 is drawn out of the chamber 110, the wafer substrate 10 coated with the photosensitive polymer and the exposure mask 20 are sequentially mounted on the mounting portion 120.

The "first direction" according to this embodiment is similar to determining the open one side of the chamber 110 as previously described. The direction extending from the ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment toward the user using the apparatus is the "first direction" according to this embodiment. Therefore, the mounting portion 120 according to the present embodiment can be drawn out from the inside of the chamber 110 toward the user of the ultraviolet ray exposure apparatus 100 for manufacturing biochips.

The wafer substrate 10 of the present embodiment may be a wafer made of silicon. The photosensitive polymer may be, for example, SU-8 series manufactured by MicroChem Co., but is not limited thereto. It may be included in the scope of the present invention if it is a material which is cured by ultraviolet rays and is capable of a photoresist process.

The mounting portion 120 of this embodiment mounts only one wafer substrate 10 and one exposure mask 20, and the mounting portion 120 of this embodiment is also arranged as one. Therefore, the ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment can further reduce the volume and can be used in a narrow space. In addition, since the cost required for production can be further reduced, it can be used for general purposes without any expense.

In the exposure mask 20 of the present embodiment, a pattern capable of forming a master mold necessary for manufacturing a biochip is formed. When the exposure mask 20 is placed on the wafer substrate 10 coated with the photosensitive polymer and then exposed to ultraviolet rays, the photosensitive polymer is cured in a shape corresponding to the master mold formed on the exposure mask 20. After removing unnecessary portions that are not cured by the etching process, a master mold for producing a biochip can be formed.

The exposure mask fixing part 130 supports the upper part of the mounting part 120 in the chamber 110 to fix the exposure mask 20 disposed between the mounting part 120 and the wafer substrate 10 and the exposure mask 20 are shifted from each other so that defects do not occur.

The exposure mask fixing portion 130 of the present embodiment is generated by the light source portion 140 to be described later in order to smoothly provide ultraviolet rays to the wafer substrate 10 and the exposure mask 20 disposed between the mounting portion 120 And a transmission window 132 for allowing ultraviolet rays to be transmitted smoothly.

The exposure mask fixing portion 130 of the present embodiment is mounted on one side of the mounting portion 120 and more specifically on one side of the mounting portion 120 closest to the chamber 110 when the mounting portion 120 is drawn out to the outside Hinged. When the mounting portion 120 is drawn out and the wafer substrate 10 and the exposure mask 20 are fixed to the mounting portion 120, the exposure mask fixing portion 130 is fixed to the mounting portion 120 And can be arranged separately as shown in FIG. 2 and FIG. Conversely, when the mounting portion 120 is drawn in and the mounting portion 120 and the exposure mask fixing portion 130 are disposed inside the chamber 110, as shown in FIGS. 4 and 5, So as to support the mounting portion 120 at an upper portion of the mounting portion 120.

In this case, the mounting portion 120 of the present embodiment further includes a pressing unit 128 for improving fixing force with the exposure mask fixing portion 130. The pressing unit 128 is disposed at the edge of the mounting portion 120 and the exposure mask fixing portion 130 so that the exposure mask fixing portion 130 can firmly support the upper portion of the mounting portion 120, The exposure mask fixing unit 130 is fixed while being pressed against the support member 120.

1 to 3 illustrate one pressing unit 128 according to an example of the present embodiment, but the present invention is not limited thereto. In the case where a plurality of pressing units 128 are formed, the fixing force may be further improved.

At this time, the mounting portion 120 of the present embodiment may include a vacuum pad 122 and an air vent 124.

5 and 6, the vacuum pad 122 is vacuum-formed in a space in contact with the wafer substrate 10 to fix the wafer substrate 10 while ultraviolet light is being applied to the wafer substrate 10. [ It plays a role. The vacuum pad 122 according to the present embodiment is made of an elastic material to assist the formation of vacuum more smoothly.

The air vent 124 injects air into the vacuum space formed between the vacuum pad 122 and the wafer substrate 10 so that the exposed wafer substrate 10 is separated from the vacuum pad 122. In order to form a vacuum by the vacuum pad 122 according to the present embodiment, the air vent 124 may be shut off, and then, when the wafer substrate 10 is detached, the air vent 124 is opened, .

The vacuum pads 122 and the air vents 124 according to the present embodiment are disposed on the opposite side of one side of the wafer substrate 10 coated with the photosensitive polymer and do not affect the exposure process by ultraviolet rays. The exposure mask fixing part 130 is disposed on the opposite side of the exposure mask fixing part 130 with the mounting part 120 interposed therebetween. More specifically, (Not shown).

Meanwhile, the ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment further includes a drive unit 126 as shown in FIGS. The driving unit 126 can move the vacuum pad 122 disposed in the mounting portion 120 along a second direction parallel to the height direction of the chamber 110. [

The drive unit 126 of the present embodiment includes, for example, an inclined cam 126a and a camshaft 126b. The inclined cam 126a is configured to deform the rotational motion into a linear motion, and the cam shaft 126b forms a rotational axis of the inclined cam 126a.

According to the present embodiment, as the inclined cam 126a rotates around the cam shaft 126b, the rotational motion of the inclined cam 126a can be transformed into a linear motion that moves in the up and down direction with respect to the paper surface along the second direction have. Therefore, the vacuum pad 122 connected to the driving unit 126 of the present embodiment can also linearly move in the vertical direction, so that the height can be adjusted.

The "second direction " of this embodiment can be formed perpendicularly to the first direction in a direction parallel to the height direction of the ultraviolet ray exposure apparatus 100 for fabricating a biochip according to the present embodiment from the ground, You will be able to do it side by side.

The vacuum pad 122 according to the present embodiment is configured such that when the mounting portion 120 is drawn out of the chamber 110 and the exposure mask fixing portion 130 is separated from the mounting portion 120, Or may be disposed at the center of the mounting portion 120 so as to have the same height. When the wafer substrate 10 is mounted on the mounting portion 120 such that the other surface of the wafer substrate 10 coated with the photosensitive polymer is brought into contact with the vacuum pad 122, the driving unit 126 of the present embodiment causes the vacuum pad 122 Is vacuum-formed in the space between the wafer substrate 10 and the vacuum pad 122 while the vacuum unit sucks the other surface of the wafer substrate 10.

Meanwhile, the ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment includes a light source unit 140. The light source 140 is disposed on the upper side of the interior of the chamber 110 as shown in FIG. 5 to provide ultraviolet rays for curing the photosensitive polymer coated on the wafer substrate 10.

The light source unit 140 may include a light emitting diode (LED) that emits light in the ultraviolet region in order to provide ultraviolet light. In order to prevent the occurrence of defective products due to more uniform exposure, The light source unit 140 of this embodiment can emit light in a single wavelength ultraviolet region.

The ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment further includes a rail part 150 for assisting the drawing of the mounting part 120.

The rails 150 are provided in a pair and are installed along the first direction on the inner wall of the chamber 110. A pair of edges of the mounting part 120 are engaged with the rail part 150 and the movement of the mounting part 120 when the mounting part 120 is pulled out of the chamber 110 or drawn into the inside of the chamber 110 Guide.

Meanwhile, the ultraviolet ray exposure apparatus 100 for manufacturing a biochip of the present embodiment may further include a timer unit 160. The timer unit 160 adjusts the time that ultraviolet rays are supplied to the wafer substrate 10 and the exposure mask 20 by the light source unit 140. The timer unit 160 of the present embodiment may include an input unit for adjusting the time when ultraviolet rays are provided and a display unit for visually displaying the information to the user. The display unit of the present embodiment may control whether or not the power source is supplied or display the power source together.

The configuration of the ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to the present embodiment has been described above. Hereinafter, an example of using the ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to an embodiment of the present invention will be described with reference to FIGS. 7 to 10. FIG. However, this is merely an example and various modifications may be made in the ordinary skill in the art.

FIGS. 7 to 10 sequentially illustrate the process of exposing the wafer substrate 10 and the exposure mask 20 to the ultraviolet exposure apparatus 100 for fabricating a biochip according to the present embodiment. 7 is a view showing a state in which the wafer substrate 10 and the exposure mask 20 are mounted on the mounting portion 120 according to an embodiment of the present invention. 8 is a view showing a state in which the wafer substrate 10 and the exposure mask 20 are mounted on the mounting portion 120 and covers the exposure mask fixing portion 130. FIG. 9 is a view showing a state in which the wafer mask 10 and the mounting portion 120 in which the exposure mask 20 is mounted are covered with the exposure mask fixing portion 130 and fixed by the pressing unit 128. Fig. 10 is a view showing a state after the mounting portion 120 to which the exposure mask fixing portion 130 is fixed is inserted into the chamber 110. FIG.

7, when the mounting portion 120 is drawn out of the chamber 110 by the rail portion 150, the exposure mask fixing portion 130 is opened by the hinge movement and is separated from the mounting portion 120 do. Here, the separation does not mean that the exposure mask fixing portion 130 is completely separated from the mounting portion 120, which means that the hinge shaft portion is opened by the hinge movement while being coupled with the mounting portion 120. When the exposure mask fixing part 130 is opened, the vacuum pad 122 disposed at the center of the mounting part 120 is mounted on the driving unit 126 (not shown) so as to have the same height as the mounting part 120 or higher than the mounting part 120 ) Can be moved upward from the ground.

When the exposure mask fixing part 130 is opened, the wafer substrate 10 and the exposure mask 20 may be mounted on the mounting part 120 in order. At this time, a photosensitive polymer may be coated on one surface of the wafer substrate 10. The photosensitive polymer according to this embodiment may be, for example, coated in a liquid state and uniformly coated on the wafer substrate 10 by spin coating, but the present invention is not limited thereto. A photosensitive polymer is not coated on the other surface of the wafer substrate 10 and a surface on which the photosensitive polymer is not coated is mounted on the mounting portion 120 so as to be in contact with the vacuum pad 122.

After the wafer substrate 10 and the exposure mask 20 are mounted on the mounting portion 120, the exposure mask fixing portion 130 may be hingedly coupled to the mounting portion 120 as shown in FIG. 8 .

9, when the exposure mask fixing part 130 is arranged side by side with the mounting part 120 by the hinge movement, the pressing unit 128 presses the edge of the exposure mask fixing part 130, 120 and the exposure mask fixing unit 130 are fixed. When the mounting unit 120 and the exposure mask fixing unit 130 are coupled by the pressing unit 128, the mounting unit 120 coupled with the exposure mask fixing unit 130 is moved along the rail 150 And may be introduced into the interior of the chamber 110.

On the other hand, after the mounting unit 120 and the exposure mask fixing unit 130 are coupled by the pressing unit 128, the driving unit 126 is raised so that the wafer substrate 10 and the exposure mask 20 And are closely arranged. The process of raising the driving unit 126 is before or after the mounting portion 120 coupled with the exposure mask fixing portion 130 is introduced into the chamber 110 or is not related to the order.

The state in which the introduction is completed is as shown in Fig. The user can set the time for irradiating the ultraviolet rays using the timer unit 160. When the light in the ultraviolet region is emitted by the light source unit 140, the user passes through the transmission window 132 of the exposure mask fixing unit 130 The ultraviolet rays can harden the photosensitive polymer of the wafer substrate 10 so as to correspond to the shape formed on the exposure mask 20. [

Although not shown in the drawing, when the exposure is completed, the process can be performed in the reverse order of FIGS. 7 to 10. That is, the process can be performed in the order of FIGS. 10, 9, 8, and 7. After the exposure is completed, the mounting portion 120 coupled with the exposure mask fixing portion 130 may be drawn out from the inside of the chamber 110 to the outside of the chamber 110 along the rail portion 150. When the mounting portion 120 is completely drawn out of the chamber 110, the pressing by the pressing unit 128 is released and the exposure mask fixing portion 130 is hinged and separated from the mounting portion 120.

The drive unit 126 descends while the vacuum between the vacuum pad 122 and the wafer substrate 10 is held by the drive unit 126 so that the wafer substrate 10 and the exposure mask 126, (20) are separated from each other. By the descent of the drive unit 126, air flows naturally through the air vents 124 to the vacuum pad 122, so that the vacuum can be released. Therefore, the vacuum pad 122 fixed by the vacuum can be separated from the wafer substrate 10 naturally. Therefore, the wafer substrate 10 can be smoothly separated without being damaged.

Thereafter, the uncured portion of the photosensitive polymer is removed by an etching process to form a master mold for fabricating the biochip, and the biochip can be fabricated using the master mold provided according to the present embodiment.

11 to 14 show actual photographs of a master mold for producing a biochip manufactured by the ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to the present embodiment. According to the ultraviolet ray exposure apparatus 100 for manufacturing a biochip according to the present embodiment, a master mold capable of manufacturing a biochip having a minute flow path can be provided.

In the case of a biochip, the microchannel includes microchannels formed by micron-scale fine structures and fine structures. Therefore, a master mold for forming a microchannel having a micrometer unit will also require precise machining to have a fine structure. Therefore, the ultraviolet exposure apparatus 100 for manufacturing a biochip of the present embodiment is configured such that the wafer substrate 10 and the exposure mask 20 are not misaligned while being exposed by the same configuration as the vacuum pad 122 and the pressure unit 128, So that it is possible to manufacture a master mold for a fine flow path.

In addition, since the ultraviolet exposure apparatus 100 for manufacturing a biochip according to the present embodiment eliminates an unnecessary configuration and exposes only one wafer substrate 10 at a time, the volume occupied by the entire apparatus can be further reduced, Can also be used. In addition, since the cost required for manufacturing the ultraviolet ray exposure apparatus 100 for manufacturing a biochip can be further reduced, it can be used for general purposes without any cost.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious to those who have. Accordingly, such modifications or variations should not be individually understood from the technical spirit and viewpoint of the present invention, and modified embodiments should be included in the claims of the present invention.

10: Wafer substrate
20: Exposure mask
100: Ultraviolet exposure device for biochip production
110: chamber
112: open side
120:
122: Vacuum pad
124: Airbent
126: drive unit
126a:
126b: cam shaft
128: Pressure unit
130: Exposure mask fixing section
132: Transmission window
140: Light source
150: Le Mans
160:

Claims (13)

chamber;
A mounting portion on which a photosensitive substrate is mounted and on which a photosensitive polymer is coated on one surface of the chamber;
An exposure mask fixing unit disposed at an upper portion of the mounting unit and fixing the exposure mask disposed between the mounting unit and the upper surface of the mounting unit and including a transmission window for transmitting ultraviolet rays to the exposure mask; And
And a light source unit disposed in the chamber and providing ultraviolet light to the wafer substrate and the exposure mask,
Wherein,
A vacuum pad disposed at a lower portion of the mounting portion to form a vacuum between the wafer substrate and the wafer substrate to fix the wafer substrate and the exposure mask to the mounting portion; And
And an air vent for allowing air to flow through the vacuum pad to separate the wafer substrate and the exposure mask fixed by the vacuum pad from the mounting portion. The method according to claim 1,
Wherein,
And a driving unit for moving the wafer substrate and the vacuum pad mounted on the mounting unit along a second direction parallel to the height direction of the chamber. 3. The method of claim 2,
The driving unit includes:
An inclined cam that moves the vacuum pad along the second direction by rotation; And
And a cam shaft as a rotation axis of the inclined cam. The method according to claim 1,
Further comprising a pair of rail portions provided along the first direction on the inner wall of the chamber and guiding movement of the mounting portion when the mounting portion is drawn out of the chamber or drawn into the chamber, For ultraviolet exposure. The method according to claim 1,
Wherein the chamber includes a plurality of surfaces for shielding the inside from the outside, and at least a part of one of the plurality of surfaces is opened and the mounting portion is drawn out and drawn through the one surface, For ultraviolet exposure. The method according to claim 1,
Wherein one wafer substrate is mounted on the mounting portion. The method according to claim 1,
Wherein the exposure mask fixing portion is hinged to one side of the mounting portion. The method according to claim 1,
Wherein,
Further comprising: a pressing unit disposed at an edge of the mounting portion and the exposure mask fixing portion, for pressing the exposure mask fixing portion so that the exposure mask fixing portion closely contacts the mounting portion. The method according to claim 1,
Wherein the light source unit includes a light emitting diode emitting ultraviolet light. The method according to claim 1,
Wherein the light source unit emits ultraviolet light of a single wavelength. The method according to claim 1,
Further comprising a timer unit for setting a time for exposing the photosensitive polymer to ultraviolet light. The method according to claim 1,
Wherein the wafer substrate comprises a silicon material. The method according to claim 1,
Wherein the vacuum pad is made of an elastic material.
KR1020150178081A 2015-12-14 2015-12-14 Uv exposure system for biochip fabrication KR101764836B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150178081A KR101764836B1 (en) 2015-12-14 2015-12-14 Uv exposure system for biochip fabrication
CN201680072701.3A CN108369385A (en) 2015-12-14 2016-12-02 Biochip making ultraviolet exposure apparatus according
PCT/KR2016/014103 WO2017105014A1 (en) 2015-12-14 2016-12-02 Ultraviolet exposure device for manufacturing biochip

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Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0943849A (en) * 1995-08-02 1997-02-14 Dainippon Screen Mfg Co Ltd Both side exposure device
KR20070027013A (en) * 2005-08-29 2007-03-09 삼성전자주식회사 Exposing apparatus and method for controlling the same
JP2007219242A (en) 2006-02-17 2007-08-30 Mitsubishi Precision Co Ltd Contact exposure method and contact exposure apparatus
CN101363984A (en) * 2007-08-10 2009-02-11 庄添财 Lifting mechanism for objective table
JP5200622B2 (en) 2008-03-28 2013-06-05 ウシオ電機株式会社 Method for removing mask in light irradiation device
KR101110790B1 (en) * 2011-07-14 2012-02-15 주식회사 옵티레이 Exposure apparatus
JP5867916B2 (en) 2011-12-06 2016-02-24 国立研究開発法人産業技術総合研究所 Exposure apparatus and exposure method
KR101256791B1 (en) 2012-08-27 2013-04-19 주식회사 필옵틱스 Exposure apparatus
CN104637854B (en) * 2013-11-13 2018-12-07 沈阳新松机器人自动化股份有限公司 It is a kind of for adsorbing the sucker of silicon wafer
KR101464706B1 (en) * 2014-07-16 2014-11-28 마이다스시스템주식회사 Scan and step exposure system

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