WO2017098554A1 - Dispositif de source de lumière laser - Google Patents

Dispositif de source de lumière laser Download PDF

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Publication number
WO2017098554A1
WO2017098554A1 PCT/JP2015/084282 JP2015084282W WO2017098554A1 WO 2017098554 A1 WO2017098554 A1 WO 2017098554A1 JP 2015084282 W JP2015084282 W JP 2015084282W WO 2017098554 A1 WO2017098554 A1 WO 2017098554A1
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WO
WIPO (PCT)
Prior art keywords
laser light
light emitting
hole
emitting element
base member
Prior art date
Application number
PCT/JP2015/084282
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English (en)
Japanese (ja)
Inventor
廣瀬　達朗
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2015/084282 priority Critical patent/WO2017098554A1/fr
Publication of WO2017098554A1 publication Critical patent/WO2017098554A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements

Definitions

  • the present invention relates to a laser light source device using a laser light emitting element.
  • laser light emitting devices have been used as light sources for large-sized high-intensity projectors for large halls or digital cinema, medium- and small-sized projectors mainly used for meetings or presentations with a small number of people, and projection televisions with a built-in projection optical system in the housing. Those that use are widely commercialized or proposed.
  • Such projectors and projection televisions have advantages in that the color reproduction range is wide, instantaneous lighting is possible, power consumption is low, and the life is long compared to the case where a conventional lamp is used as a light source.
  • the laser light source device can be efficiently combined by combining laser beams from a plurality of laser light-emitting elements. The light output is increased.
  • the laser light emitting element is more efficient as the temperature of the light emitting portion is lower, and a high output and a long life can be obtained.
  • Patent Document 1 a first holder that holds a laser light emitting element and a second holder that holds a lens that collects light emitted from the laser light emitting element are joined together with a heat conductive adhesive, thereby radiating heat from the laser light emitting element.
  • a light source device with improved effects is described.
  • Patent Document 2 describes a technique for suppressing the spread and creeping of the solder while improving the heat conduction efficiency by joining the laser diode and the heat sink with solder.
  • Patent Document 2 has a problem that the structure is complicated because a member that suppresses the spread of solder is required.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a laser light source device capable of realizing high output and high reliability with a simple structure.
  • a laser light source device includes a light emitting part, a flange part to which the light emitting part is fixed, and an electrical connection to the light emitting part and protruding from the flange part.
  • a laser light emitting element having an electric terminal portion to be connected, a bottomed first hole in which the laser light emitting element is disposed, and a second hole provided in a bottom surface of the first hole and through which the electric terminal portion passes.
  • the external shape of the base member and the flange portion when viewed in plan is the same shape as a shape partially cut by two straight lines, and communicates with the second hole and penetrates through the electrical terminal portion.
  • a solder sheet which is sandwiched between the flange portion and the bottom surface and which joins the laser light emitting element and the base member.
  • FIG. 3 is an exploded perspective view for explaining the method for manufacturing the laser light source device according to the first embodiment. Sectional drawing for demonstrating the manufacturing method of the laser light source apparatus which concerns on Embodiment 1.
  • FIG. The bottom view which shows the structure of the laser light emitting element of Embodiment 1.
  • FIG. 3 is a side view showing the configuration of the laser light-emitting element of the first embodiment.
  • FIG. 1 Another side view showing the configuration of the laser light emitting element of the first embodiment
  • the top view which shows the shape of the solder sheet of Embodiment 1
  • the side view which shows the shape of the solder sheet of Embodiment 1 In Embodiment 1, the bottom view of the laser light emitting element for explaining the wet spread of the solder In Embodiment 1, the side view of the laser light emitting element for demonstrating the wetting and spreading of the solder In Embodiment 1, another side view of the laser light emitting element for explaining the wetting and spreading of the solder
  • the figure which shows the characteristic with respect to the combination of the material of a base member, the presence or absence of plating of a base member, and the presence or absence of the flux coating of a solder sheet in Embodiment 2.
  • FIG. 1 is a cross-sectional view showing a configuration of a laser light source device according to the present embodiment
  • FIG. 2 is an exploded perspective view for explaining a method for manufacturing the laser light source device according to the present embodiment, and FIG. Sectional drawing for demonstrating the manufacturing method of the laser light source apparatus which concerns on embodiment
  • FIG. 4 is a bottom view which shows the structure of the laser light emitting element of this Embodiment
  • FIG. 5 is the laser light emitting element of this Embodiment
  • FIG. 6 is another side view showing the configuration of the laser light emitting element of the present embodiment
  • FIG. 7 is a plan view showing the shape of the solder sheet of the present embodiment
  • FIG. It is a side view which shows the shape of the solder sheet
  • a laser light source device 1 includes a laser light emitting element 10 that emits laser light and a hole 21 that is a bottomed first hole in which the laser light emitting element 10 is disposed. And a solder sheet 30 that is sandwiched between the base member 20 and the laser light emitting element 10 and joins the laser light emitting element 10 and the base member 20 to each other.
  • the laser light source device 1 is used for a projector or a projector television.
  • the laser light emitting element 10 includes a light emitting unit 14 that emits laser light, an electric terminal unit 11 that is electrically connected to the light emitting unit 14, and a flange to which the light emitting unit 14 is fixed. Part 12.
  • the light emitting unit 14 has a cylindrical outer shape.
  • the flange portion 12 has a disk shape.
  • the outer diameter of the flange portion 12 is larger than the outer diameter of the light emitting portion 14, and the outer peripheral edge portion of the flange portion 12 protrudes from the light emitting portion 14 outward in the radial direction.
  • the light emitting portion 14 is fixed to the upper end surface of the flange portion 12 coaxially with the flange portion 12.
  • the flange portion 12 has a circular outer shape in plan view, and has two notches 13 as concave portions on the outer periphery. Specifically, the two notches 13 are arranged at positions symmetrical in the circumferential direction with respect to the center of the flange portion 12. That is, the two cutouts 13 are spaced apart in the radial direction.
  • the notch 13 has a corner E on the inside in the radial direction.
  • the electric terminal portion 11 has a pin shape and protrudes from the lower end surface of the flange portion 12.
  • the number of electrical terminal portions 11 is generally two.
  • Two notches 13 are arranged on an extension line of a line connecting the two electric terminal portions 11.
  • the base member 20 includes a plurality of holes 21 in which the plurality of laser light emitting elements 10 are respectively disposed.
  • the base member 20 is a plate-shaped metal member.
  • the hole 21 is a counterbore, and the depth thereof is smaller than the thickness of the base member 20.
  • the hole 21 is circular when viewed from above.
  • the diameter of the hole 21 is equal to or larger than the diameter of the flange portion 12 so that the flange portion 12 can be inserted.
  • the bottom surface 21a of the hole 21 is flat, and a hole 22 that is a second hole is provided at the center of the bottom surface 21a.
  • the hole 22 is an oval long hole.
  • the size of the hole 22 is smaller than the size of the flange portion 12, and the electric terminal portion 11 can penetrate the hole 22 without contacting the base member 20. Is set to That is, the electrical terminal portion 11 passes through the hole 22 in a state where the laser light emitting element 10 is disposed in the hole 21. As a result, wiring for energization from the lower end surface side of the base member 20 to the laser light emitting element 10 becomes possible.
  • the base member 20 includes a positioning hole 23.
  • the positioning hole 23 is used when the laser light source device 1 is attached to a projection optical system of a projector or a projector television, and has a function of increasing optical efficiency. Therefore, disposing the laser light emitting element 10 on the base member 20 with high positional accuracy is also an important element for improving optical efficiency.
  • the exhaust heat of the laser light emitting element 10 is mainly made from the lower surface of the laser light emitting element 10 that is in contact with the base member 20, that is, the lower surface of the flange portion 12.
  • the base member 20 enables thermal diffusion of the laser light emitting element 10, and furthermore, the base member 20 can be efficiently cooled by increasing the exhaust heat area through a cooler (not shown) attached to the base member 20. Therefore, reducing the contact thermal resistance between the laser light emitting element 10 and the base member 20 is an important element for increasing the cooling efficiency.
  • the outer shape of the solder sheet 30 is oval.
  • the solder sheet 30 is a sheet-like solder and has a constant thickness. Further, the solder sheet 30 is provided with a hole 32 which is a third hole. Here, the hole 32 is an oval long hole.
  • the outer shape of the solder sheet 30 is a part of a circle that forms the outer shape of the flange portion 12, and more precisely, a circle having the same size as the circle is arranged in parallel with two straight lines arranged symmetrically with respect to the center thereof. The shape is cut out. That is, the outer shape of the solder sheet 30 connects the string portions 31a and 31b, which are first and second string portions spaced apart from each other in the radial direction, and one end of the string portion 31a and one end of the string portion 31b.
  • the arc portions 31c and 31d are spaced apart in the radial direction perpendicular to the arrangement direction of the chord portions 31a and 31b.
  • the hole 32 has the same shape and the same size as the hole 22.
  • the short direction of the hole 32 is parallel to the two parallel straight lines described above.
  • the solder sheet 30 is disposed on the bottom surface 21 a of the hole 21 with the hole 32 and the hole 22 communicating with each other.
  • the arc portions 31c and 31d coincide with a part of the outer shape of the flange portion 12, and 2 on the outer side in the radial direction of the chord portion 31a.
  • One of the notches 13 is disposed, and the other of the two notches 13 is disposed on the outer side in the radial direction of the string portion 31b.
  • the string portion 31a faces one of the two notches 13 in the radial direction in plan view
  • the string portion 31b faces the other of the two notches 13 in the radial direction in plan view.
  • the radial direction is the radial direction of the flange portion 12.
  • the dimensions of the configuration of the laser light source device 1 will be described.
  • the outer diameter D 9 mm
  • the outer diameter d of the electric terminal portion 11 0.6 mm
  • the pitch P 2.5 mm, which is the distance between the electric terminal portions 11.
  • the longitudinal width W1 of the hole 32 3.8 mm
  • the lateral width W2 of the hole 32 1.3 mm
  • the width W3 between the chord portions 31a and 31b. 7 mm
  • thickness W4 0.1 mm.
  • the solder placement jig 50 has the same shape as the hole 22 of the base member 20 in plan view and has a slightly smaller outer shape. Further, the solder arrangement jig 50 has a bottomed hole 50a into which the electric terminal portion 11 can be inserted at the tip. The shape of the hole 50 a is also the same shape as the hole 22.
  • the solder arrangement jig 50 is passed through the hole 22, and the solder arrangement jig 50 having the tip protruding upward from the bottom surface 21a is disposed in the hole 32 of the solder sheet 30. While passing the jig 50, the solder sheet 30 is moved to the bottom surface 21a side, and the solder sheet 30 is arranged on the bottom surface 21a. After the solder sheet 30 is placed on the bottom surface 21 a, the solder placement jig 50 is pulled out from the hole 22. As described above, since the arrangement position of the solder sheet 30 is limited by the solder arrangement jig 50, it is uniquely determined with respect to the base member 20.
  • the laser arrangement jig 40 has a cylindrical portion 40a and two claw portions 41 provided at one end of the cylindrical portion 40a in the axial direction.
  • the cylindrical portion 40a has the same shape as the hole 21 of the base member 20 in plan view and has a slightly smaller outer shape.
  • the two claw portions 41 can be locked by the two notches 13 of the laser light emitting element 10, respectively, and the laser light emitting element 10 can be sandwiched and held at the two notches 13. is there.
  • the laser light emitting element 10 When the laser light emitting element 10 is arranged on the base member 20, the two claw portions 41 are respectively locked by the two notches 13, and the laser light emitting element 10 is held by the laser arrangement jig 40, and the base member The laser arrangement jig 40 is inserted into the 20 holes 21 from above, and the laser light emitting element 10 is arranged on the solder sheet 30 arranged on the bottom surface 21a.
  • the rotation direction of the laser arrangement jig 40 is limited by the outer shape of the base member 20 or the positioning shape such as the positioning hole 23, and the arrangement position of the laser light emitting element 10 is also unique with respect to the base member 20. It is determined.
  • the solder sheet 30 is heated and melted.
  • the solder sheet 30 is heated, for example, via the base member 20.
  • the temperature of the solder sheet 30 exceeds its melting point, the solder sheet 30 becomes liquid and wets and spreads on the surfaces of the laser light emitting element 10 and the base member 20.
  • the solder sheet 30 is cooled to a temperature below the melting point, so that the solder sheet 30 returns to the solid state again, and the laser light emitting element 10 and the base member 20 are soldered.
  • the laser arrangement jig 40 remains attached to the laser light emitting element 10 even in the temperature rising process for melting the solder, and is removed from the laser light emitting element 10 and the base member 20 after being soldered through the cooling process. It is. Thereby, the arrangement position of the laser light emitting element 10 is fixed by the position accuracy determined by the laser arrangement jig 40 even after the solder bonding.
  • the laser arrangement jig 40 may be applied with an external force from the top in order to prevent the laser light emitting element 10 from being lifted during the temperature rising process.
  • the laser light source device 1 after the laser arrangement jig 40 is removed is obtained as shown in FIG.
  • FIGS. 9 to 11 are diagrams for explaining solder wetting and spreading on the surface of the laser light emitting element 10 in a state where the laser light emitting element 10 is soldered to the base member 20.
  • FIG. 10 is a side view of the laser light emitting element 10
  • FIG. 11 is another side view of the laser light emitting element 10. 9 to 11, the same components as those shown in FIGS. 4 to 6 are denoted by the same reference numerals.
  • the hatched area is an area where wetting and spreading of solder is prevented.
  • the solder is prevented from spreading around the notch 13, and corresponding to the hole 32 of the solder sheet 30, the solder is prevented from spreading around the electrical terminal portion 11. Is done.
  • the distance L representing the range of solder wetting and spreading in the radial direction connecting the two notches 13 is 7.7 mm
  • the width W3 between the chord portions 31a and 31b of the solder sheet 30 is 7 mm. Is also increased by wet spreading.
  • the outer diameter D is 9 mm, and the dimension is set so that the wet spread area does not reach the corner E of the notch 13.
  • the spread of the solder to the hatched area in FIGS. 9 to 11 is sufficiently limited.
  • the solder sheet 30 having the shape shown in FIG. 7 is used for joining the laser light emitting element 10 and the base member 20, the molten solder is the laser light emitting element 10.
  • the range of wetting and spreading on the surface is limited.
  • solder does not spread over a part of the side surface of the flange portion 12 including the notch 13 and a portion of the end surface of the flange portion 12 on the solder sheet 30 side including the notch 13. Therefore, when the laser light emitting element 10 is assembled using the side surface of the notch 13 by the laser arrangement jig 40, the laser arrangement jig 40 is unintentionally soldered to the laser light emission element 10 or soldered to the laser arrangement jig 40. Is prevented from becoming unusable due to adhesion, and simple and accurate positioning and assembly using the outer shape of the laser light emitting element 10 are possible.
  • solder does not spread even in the region around the electric terminal portion 11 in the end surface of the flange portion 12 on the solder sheet 30 side. Therefore, it is possible to prevent a solder bridge from being formed between the electric terminal portion 11 and the base member 20, and it is possible to maintain electric insulation, and reliability is improved.
  • the contact thermal resistance between the laser light emitting element 10 and the base member 20 can be kept low by performing solder bonding between the laser light emitting element 10 and the base member 20.
  • Solder has a thermal conductivity of 10 times or more and a thickness of 1/2 or less compared to a heat-dissipating grease or heat conductive adhesive that is generally used, and therefore the contact thermal resistance is 1/20 or less. It is possible. Thus, by suppressing the contact thermal resistance to a low level, the cooling efficiency of the laser light emitting element 10 is increased and the temperature of the light emitting unit 14 is lowered. Therefore, the laser light source device 1 with higher output and longer life and higher reliability. Is obtained.
  • the laser light emitting element 10 and the base member 20 are soldered, the fixing strength of the laser light emitting element 10 to the base member 20 increases. Therefore, it becomes difficult for the user to easily remove the laser light emitting element 10, and unauthorized use can be prevented in advance.
  • the laser light source device 1 that can realize high output and high reliability with a simple structure.
  • the hole 21 has a circular shape
  • the flange portion 12 has a disk shape
  • the holes 22 and 32 have long holes
  • the outer shape of the solder sheet 30 is obtained when the flange portion 12 is viewed in plan view.
  • the present invention is not limited to these shapes.
  • the shape is not limited to these shapes.
  • the solder sheet 30 having an outer shape that is the same shape as a shape partially cut out by two straight lines that are parallel when the flange portion 12 is viewed in plan view. May be used.
  • the size and shape of the hole 21 can be determined according to the size and shape of the flange portion 12.
  • the size and shape of the hole 22 may be any as long as the electrical terminal portion 11 is not in contact with the base member 20.
  • the size and shape of the positioning hole 23 are the same as in the case of the hole 22.
  • the notch 13 has a shape having a corner E, but is not limited thereto, and may be a concave shape with respect to the outer periphery of the flange portion 12.
  • the dimensions of the configuration of the laser light source device 1 described above are an example.
  • the longitudinal width W1 of the hole 32 may be 3.8 mm or more
  • the lateral width W2 of the hole 32 may be 1.3 mm or more
  • the width W3 between the chord portions 31a and 31b may be 7 mm or less. It can. By doing so, it is possible to limit the spread of the solder onto the surface of the laser light emitting element 10 while securing the area of the solder joint.
  • the width W3 is larger than the width W1.
  • the laser light source device 1 is used for a projector or a projector television, but is not limited to this, and can be used for other devices.
  • Embodiment 2 a combination of the material of the base member 20 and the material of the solder sheet 30 will be described. Other configurations of the present embodiment are the same as those of the first embodiment.
  • FIG. 12 is a diagram showing characteristics with respect to a combination of the material of the base member 20, the presence or absence of plating of the base member 20, and the presence or absence of flux coating of the solder sheet 30.
  • the material of the base member 20 is required to have the structural strength of the laser light source device 1, the manufacturability of the base member 20, and the heat resistance in the temperature rising process at the time of soldering.
  • copper, aluminum, or iron is assumed.
  • the base material of the base member 20 is preferably copper or aluminum in consideration of the heat dissipation performance of the base member 20, and more preferably aluminum in consideration of cost.
  • heat dissipation performance of the base member “ ⁇ ” indicates that the heat dissipation performance is higher than “ ⁇ ”
  • cost indicates that “ ⁇ ” is less expensive than “ ⁇ ”. Low, “ ⁇ ” indicates that the cost is lower than “x”.
  • the presence / absence of a surface oxide film on the base member 20 affects the solder wettability and the solder joint strength at the time of solder joint. Since a strong oxide film is formed on the surface of aluminum, solder bonding is generally difficult. Therefore, when aluminum is used for the base material of the base member 20, it is important to apply gold plating or nickel boron plating, which is a material in which a surface oxide film is difficult to be formed. It is desirable to do.
  • the formation state of the surface oxide film changes depending on the temperature and humidity environment when the base member 20 is transported and stored.
  • the formation of a surface oxide film is accelerated in a high-temperature and high-humidity environment, but limiting the temperature-humidity environment during transportation and storage significantly affects cost and productivity.
  • solder joint strength As “solder wettability and solder joint strength”, “ ⁇ ” has higher solder wettability than “ ⁇ ” and higher solder joint strength, and “ ⁇ ” has higher solder wettability than “x”. It shows that solder joint strength is high.
  • the base member 20 is constituted by using nickel-plated aluminum as a base material, and the solder sheet 30 has a flux coating on the surface.
  • a laser light source device 1 that is inexpensive and easily obtained with high fixing strength and has high cooling efficiency and high reliability.
  • the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

Abstract

La présente invention porte sur un dispositif de source de lumière laser qui est pourvu : d'un élément d'émission de lumière laser 10 qui a une section électroluminescente 14, une section de bride 12, à laquelle la section électroluminescente 14 est fixée, et d'une section de borne électrique 11, qui est électriquement connectée à la section électroluminescente 14, et qui fait saillie à partir de la section de bride 12 ; d'un élément de base 20 ayant un trou inférieur 21, dans lequel l'élément d'émission de lumière laser 10 est disposé, et d'un trou 22, qui est disposé dans une surface inférieure du trou 21a, et que la section de borne électrique 11 traverse ; et d'une feuille de soudure 30 ayant un trou 32, qui a une forme externe égale à une forme formée en découpant partiellement, en vue en plan, la forme extérieure de la section de bride 12 par deux lignes droites parallèles, et qui est en communication avec le trou 22, et que la section de borne électrique 11 traverse, ladite feuille de soudure étant intercalée entre la section de bride 12 et la surface inférieure 21a, et liant l'élément d'émission de lumière laser 10 et l'élément de base 20 l'un à l'autre.
PCT/JP2015/084282 2015-12-07 2015-12-07 Dispositif de source de lumière laser WO2017098554A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2015/084282 WO2017098554A1 (fr) 2015-12-07 2015-12-07 Dispositif de source de lumière laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/084282 WO2017098554A1 (fr) 2015-12-07 2015-12-07 Dispositif de source de lumière laser

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WO2017098554A1 true WO2017098554A1 (fr) 2017-06-15

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10180483A (ja) * 1996-12-03 1998-07-07 Lucent Technol Inc はんだ組成物からなる物品
JP2002111112A (ja) * 2000-09-29 2002-04-12 Furukawa Electric Co Ltd:The 光モジュールの製造方法及び光モジュール
JP2004193315A (ja) * 2002-12-11 2004-07-08 Sharp Corp 半導体レーザ装置
JP2013251295A (ja) * 2012-05-30 2013-12-12 Nichia Chem Ind Ltd 光源装置
JP2014050871A (ja) * 2012-09-10 2014-03-20 Renesas Electronics Corp 半導体装置の製造方法
US9130336B2 (en) * 2012-07-26 2015-09-08 Osram Gmbh Arrangement of optical semiconductor elements
JP2015213057A (ja) * 2014-04-17 2015-11-26 パナソニックＩｐマネジメント株式会社 光源装置および投写型映像表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10180483A (ja) * 1996-12-03 1998-07-07 Lucent Technol Inc はんだ組成物からなる物品
JP2002111112A (ja) * 2000-09-29 2002-04-12 Furukawa Electric Co Ltd:The 光モジュールの製造方法及び光モジュール
JP2004193315A (ja) * 2002-12-11 2004-07-08 Sharp Corp 半導体レーザ装置
JP2013251295A (ja) * 2012-05-30 2013-12-12 Nichia Chem Ind Ltd 光源装置
US9130336B2 (en) * 2012-07-26 2015-09-08 Osram Gmbh Arrangement of optical semiconductor elements
JP2014050871A (ja) * 2012-09-10 2014-03-20 Renesas Electronics Corp 半導体装置の製造方法
JP2015213057A (ja) * 2014-04-17 2015-11-26 パナソニックＩｐマネジメント株式会社 光源装置および投写型映像表示装置

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