WO2017094629A1 - Substrat de guide d'ondes optiques et procédé de fabrication de celui-ci, système de connecteur optique et câble optique actif - Google Patents

Substrat de guide d'ondes optiques et procédé de fabrication de celui-ci, système de connecteur optique et câble optique actif Download PDF

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Publication number
WO2017094629A1
WO2017094629A1 PCT/JP2016/085050 JP2016085050W WO2017094629A1 WO 2017094629 A1 WO2017094629 A1 WO 2017094629A1 JP 2016085050 W JP2016085050 W JP 2016085050W WO 2017094629 A1 WO2017094629 A1 WO 2017094629A1
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WO
WIPO (PCT)
Prior art keywords
optical waveguide
substrate
optical
end surface
dummy layer
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Application number
PCT/JP2016/085050
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English (en)
Japanese (ja)
Inventor
勝健 角田
和美 中水流
Original Assignee
京セラコネクタプロダクツ株式会社
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Application filed by 京セラコネクタプロダクツ株式会社 filed Critical 京セラコネクタプロダクツ株式会社
Publication of WO2017094629A1 publication Critical patent/WO2017094629A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means

Definitions

  • the present invention relates to an optical waveguide substrate, a manufacturing method thereof, an optical connector system, and an active optical cable.
  • FIG. 7A and 7B show an example of the configuration of an optical connector system used in the technical field of high-speed and large-capacity optical data communication of, for example, 25 Gbps / ch or more.
  • This optical connector system has an optical waveguide substrate with the end surface of the optical waveguide facing the end surface of the substrate, and a plug (ferrule) holding an optical fiber.
  • a plug ferrule holding an optical fiber.
  • an end face of an optical waveguide and an end face of an optical fiber are opposed to each other, and an optical signal is transmitted and received between both end faces.
  • the height (thickness) of the optical waveguide substrate is smaller than the height (thickness) of the plug (ferrule). Therefore, there is a problem that contact (applying) between the optical waveguide substrate and the plug is insufficient, and the connection between the optical waveguide substrate and the plug becomes unstable. That is, when the optical waveguide substrate and the plug are brought into contact (applied) in order to make the optical waveguide and each end face of the optical fiber face each other, the plug is a boundary between the contact portion with the optical waveguide substrate and the non-contact portion. There is a risk of rotation starting from the part.
  • the end face is exposed by dicing the optical waveguide substrate.
  • the end face of the optical waveguide is cut obliquely following the shape of the tip of the dicing blade (or is cut obliquely with respect to the light propagation direction by the dicing processing method).
  • transmission / reception of an optical signal between the optical waveguide and each end face of the optical fiber may be hindered, and the performance of optical data communication may be deteriorated.
  • the present invention has been made on the basis of the above awareness of problems.
  • An optical waveguide substrate capable of stably connecting an optical waveguide substrate to a plug and exhibiting desired optical data communication performance can be easily and at low cost.
  • the purpose is to manufacture.
  • the optical waveguide substrate of the present invention is an optical waveguide substrate in which the end surface of the optical waveguide faces the end surface of the substrate, and has a dummy layer stacked on the optical waveguide, and the end surface of the dummy layer Is characterized in that it forms a series with each end face of the substrate and the optical waveguide.
  • the end surface of the dummy layer may have a flat surface that is substantially flush with the end surfaces of the substrate and the optical waveguide, and a concave surface that is recessed with respect to the end surfaces of the substrate and the optical waveguide.
  • the concave surface may be formed of an inclined surface that is inclined with respect to each end face of the substrate and the optical waveguide.
  • the dummy layer may have the flat surface on the end surface on the side laminated to the optical waveguide, and the concave surface or the inclined surface on the end surface opposite to the side laminated on the optical waveguide.
  • the optical waveguide substrate of the present invention is an optical waveguide substrate having a substrate and an optical waveguide formed on the substrate, and is located on at least the optical waveguide among the planned cutting lines of the optical waveguide substrate. It is characterized by having a dummy layer.
  • the method for manufacturing an optical waveguide substrate of the present invention is a method for manufacturing an optical waveguide substrate in which the end surface of the optical waveguide faces the end surface of the substrate, and is located on at least the optical waveguide among the planned cutting lines of the optical waveguide substrate.
  • a cutting blade can be brought into contact with the dummy layer, the optical waveguide, and the substrate in the order of the dummy layer first, and then the optical waveguide and the substrate.
  • a flat surface that is substantially flush with the end surfaces of the substrate and the optical waveguide, and a concave surface that is recessed with respect to the end surfaces of the substrate and the optical waveguide are formed on the end surface of the dummy layer. Can be formed.
  • the end face of the optical waveguide faces the end face of the optical fiber supported by the plug, and the substrate is provided with positioning protrusions for positioning the plug with respect to the substrate.
  • the dummy layer and the positioning protrusion can be formed in the same process.
  • the optical connector system of the present invention includes an optical waveguide substrate having an end surface of the optical waveguide facing the end surface of the substrate, and a plug holding the optical fiber, and the end surface of the optical waveguide and the end surface of the optical fiber are opposed to each other.
  • the optical waveguide substrate has a dummy layer laminated on the optical waveguide, and the end surface of the dummy layer forms a series with each end surface of the substrate and the optical waveguide, and the plug is It has a contact surface that contacts the end surface of the dummy layer of the optical waveguide substrate.
  • the optical connector system of the present invention further includes a receptacle that connects the optical waveguide substrate and the plug, and that makes an end face of the optical waveguide and an end face of the optical fiber face each other, and the receptacle includes the plug of the plug.
  • a through hole that allows the contact surface to pass therethrough can be provided.
  • the active optical cable of the present invention has one of the optical waveguide substrates or the optical connector system described above.
  • an optical waveguide substrate capable of stably connecting the optical waveguide substrate to the plug and exhibiting desired optical data communication performance can be manufactured easily and at low cost.
  • the optical connector system 100 can be applied to active optical cables (AOC: Active Optical Cables) that realize high-speed and large-capacity optical data communication (for example, 25 Gbps / ch or more) over a long distance.
  • AOC Active Optical Cables
  • the optical connector system 100 includes an optical waveguide substrate 10, a plug (ferrule) 20, and a receptacle 30 as main components.
  • the optical waveguide substrate 10 has a substrate (wiring substrate) 11 made of an organic substrate or a ceramic substrate. A large number (24 in this embodiment) of optical waveguides 13 are formed on the substrate 11 by a thin film technique and a photolithography technique via a substrate layer 12. On the substrate 11, a light emitting element (for example, VCSEL (Vertical Cavity Surface Emitting Laser)) 14 as a photoelectric conversion element that makes an optical signal incident on the optical waveguide 13 is formed. On the substrate 11 (substrate layer 12), a pair of positioning projections 15 are formed which are positioned on both sides in the alignment direction of a large number of optical waveguides 13 and have a substantially circular shape in plan view.
  • VCSEL Vertical Cavity Surface Emitting Laser
  • the optical waveguide substrate 10 has a dummy layer (dummy structure portion) 16 located at the center on the dicing planned line (scheduled cutting line) DL before dicing (before cutting) shown in FIG.
  • the dummy layer 16 has a substantially rectangular shape in plan view.
  • the dummy layer 16 is laminated on a portion of the planned dicing line DL on the optical waveguide 13 and is not laminated on a portion of the substrate 11 (substrate layer 12) where the optical waveguides 13 on both sides do not exist.
  • the dummy layer 16 is stacked at least on the portion of the planned dicing line DL on the optical waveguide 13, and there is a degree of freedom in the shape and arrangement of the other portions.
  • the constituent materials of the pair of positioning projections 15 and the dummy layer 16 have a degree of freedom, but can be made of, for example, an epoxy resin.
  • the optical waveguide substrate 10 is processed (manufactured) by sequentially executing the following first step and second step.
  • a dummy layer 16 located at least on a portion on the optical waveguide 13 of the planned dicing line DL of the optical waveguide substrate 10 is formed (laminated) by a photolithography technique.
  • a pair of positioning protrusions 15 are formed (laminated) by the same photolithography technique.
  • the optical waveguide substrate 10 is diced (cut) along the planned dicing line DL.
  • the end face 11t of the substrate 11, the end face 12t of the substrate layer 12, the end face 13t of the optical waveguide 13, and the end face 16t of the dummy layer 16 are exposed. Therefore, the end surface 13t of the optical waveguide 13 faces the end surface 11t (end surface 12t) of the substrate 11 (substrate layer 12), and the end surface 16t of the dummy layer 16 is the end surface 11t (end surface 12t) of the substrate 11 (substrate layer 12). And a series of end faces 13t of the optical waveguide 13 (adjacent in the vertical direction).
  • the dummy layer 16 first the optical waveguide 13 and the substrate 11 (substrate layer 12), and then the dummy layer 16, the optical waveguide 13, and the substrate 11 (substrate layer).
  • the dicing blade (cutting blade) DB contacts 12).
  • the dummy layer 16, the optical waveguide 13, and the substrate 11 (substrate layer 12) are entirely formed (total thickness) in a plane.
  • the dummy layer 16 to which the dicing blade DB first comes into contact is cut obliquely following the tip shape of the dicing blade DB only in the upper part of the end surface 16t (or the dicing processing method).
  • an inclined surface 16t2 (unintentionally cut obliquely with respect to the light propagation direction) is formed.
  • a flat surface 16t1 that is not affected by the tip shape of the dicing blade DB (or the dicing processing method) is formed on the other portion of the end surface 16t of the dummy layer 16.
  • a flat surface that is not affected by the tip shape (or dicing processing method) of the dicing blade DB is formed on the end surface 11t (end surface 12t) of the substrate 11 (substrate layer 12) and the end surface 13t of the optical waveguide 13.
  • the end surface 16t of the dummy layer 16 after dicing is formed by a flat surface 16t1 that is substantially flush with the end surface 11t (end surface 12t) of the substrate 11 (substrate layer 12) and the end surface 13t of the optical waveguide 13, and the substrate 11 (substrate layer). 12) and an inclined surface 16t2 inclined with respect to the end surface 13t of the optical waveguide 13.
  • the flat surface 16t1 is formed on the end surface of the dummy layer 16 on the side where the dummy waveguide 16 is laminated on the optical waveguide 13.
  • the inclined surface 16t2 is formed on the end surface of the dummy layer 16 opposite to the side on which the dummy layer 16 is laminated on the optical waveguide 13.
  • the plug 20 guides and supports a large number (24 in this embodiment) of optical fibers 22 of a multimode fiber 22 ⁇ / b> M to a synthetic resin main body 21.
  • the main body 21 includes an introduction opening 23, an operation opening 24, a large number (24 in this embodiment) of semicircular holding grooves 25 facing the operation opening 24, and a large number (in this embodiment) connected to the holding grooves 25. 24) fiber insertion holes 26.
  • the fiber insertion hole 26 has a large-diameter portion that opens to the operation opening 24 and a small-diameter portion that continues to the large-diameter portion.
  • the tip of the small diameter portion of the fiber insertion hole 26 is open to the end surface (contact surface) 21t (FIG. 6A) of the main body 21 of the plug 20.
  • the optical fiber 22 is guided from the introduction opening 23 onto the corresponding holding groove 25 in the operation opening 24. Further, the optical fiber 22 is inserted into the fiber insertion hole 26. As a result, the end face 22t is exposed at the end face of the fiber insertion hole 26 (end face 21t of the main body 21 of the plug 20) (FIG. 6A). A portion of the main body 21 of the plug 20 where the fiber insertion hole 26 is formed (a portion where the optical fiber 22 is inserted) forms a fitting convex portion 27 into the receptacle 30.
  • the optical fiber 22 includes a central core portion and an outer cladding portion.
  • the end face 22t of the core portion exposed at the end face of the fiber insertion hole 26 (end face 21t of the main body 21 of the plug 20) is flat so as to be flush with the end face of the fiber insertion hole 26 (end face 21t of the main body 21 of the plug 20). It is polished into an optical plane (FIG. 6A).
  • the receptacle 30 connects the optical waveguide substrate 10 and the plug 20. Further, the receptacle 30 optically connects the end face 13t of the optical waveguide 13 and the end face 22t of the optical fiber 22 (FIG. 6A) facing each other.
  • the receptacle 30 has an upper surface wall 31 along the surface on which the optical waveguide 13 of the substrate 11 (substrate layer 12) is formed, and an end formed so as to be substantially orthogonal to the upper surface wall 31 at the end of the upper surface wall 31 on the plug 20 side. And a face wall 32.
  • the lower surface of the upper surface wall 31 is engaged with a positioning surface 31a that contacts (contacts) the upper surface of the substrate 11 (substrate layer 12) and a pair of positioning protrusions 15 of the optical waveguide substrate 10 from above, so that the optical waveguide substrate 10 is engaged.
  • a pair of positioning recesses 31b for positioning the receptacle 30 is formed.
  • the pair of positioning recesses 31b have a substantially semicircular shape in plan view with which approximately half of the pair of positioning projections 15 in a substantially circular shape in plan view engage.
  • a positioning surface 32 a that contacts (contacts) the end surface (end surface 11 t, end surface 12 t, end surface 13 t, and end surface 16 t) of the optical waveguide substrate 10 and positions the receptacle 30 with respect to the optical waveguide substrate 10 is provided on the end surface wall 32.
  • a fitting hole (through hole) 32b into which the fitting convex portion 27 of the plug 20 is fitted is formed.
  • the optical connector system (active optical cable) 100 configured as described above is used by integrating a receptacle 30 between the optical waveguide substrate 10 and the plug 20. That is, the pair of positioning recesses 31b of the receptacle 30 are engaged with the pair of positioning protrusions 15 of the optical waveguide substrate 10, and the positioning surface 31a of the upper surface wall 31 is brought into contact (contact) with the upper surface of the substrate 11 (substrate layer 12). In addition, the positioning surface 32a of the end surface wall 32 is brought into contact (contact) with the end surfaces (end surface 11t, end surface 12t, end surface 13t, and end surface 16t) of the optical waveguide substrate 10.
  • the fitting convex portion 27 of the plug 20 is fitted into the fitting hole 32 b of the end surface wall 32, and the end surface (contact surface) 21 t of the main body 21 of the plug 20 is inserted into the fitting hole (through hole) 32 b of the end surface wall 32. Pass through.
  • the optical waveguide substrate 10, the plug 20, and the receptacle 30 are integrated.
  • the end surface 13t of the optical waveguide 13 of the optical waveguide substrate 10 and the end surface 22t of the optical fiber 22 supported by the plug 20 face each other with a minute clearance (FIG. 6A).
  • 6A and 6B are conceptual diagrams for explaining the technical superiority of the optical waveguide substrate 10 according to the present embodiment.
  • the end face 16t (flat face 16t1) of the dummy layer 16 is the end face 11t (end face 12t) of the substrate 11 (substrate layer 12) and the end face 13t of the optical waveguide 13. It is a series (adjacent in the vertical direction).
  • the end surface (contact surface) 21t of the main body 21 of the plug 20 is in addition to the end surface 11t (end surface 12t) of the substrate 11 (substrate layer 12) and the end surface 13t of the optical waveguide 13, and also the end surface 16t (flat) of the dummy layer 16. Abuts against the surface 16t1).
  • the plug 20 As a result, it is possible to secure sufficient contact (apply) between the optical waveguide substrate 10 and the plug 20 and stably connect the optical waveguide substrate 10 to the plug 20. That is, even when the optical waveguide substrate 10 and the plug 20 are brought into contact (applied) in order to make the end surface 13t of the optical waveguide 13 and the end surface 22t of the optical fiber 22 face each other, the plug 20 is not connected to the optical waveguide substrate. Therefore, it is possible to reliably prevent rotation (in the counterclockwise direction in the figure) from the boundary portion between the contact portion and the non-contact portion with respect to 10 as a starting point. At the same time, the main body 21 of the plug 20 can be reliably prevented from being inclined (dripped) with respect to the optical waveguide substrate 10.
  • a dicing blade is used.
  • the portion that is obliquely cut following the tip shape of the DB (or by the processing method of the dicing blade DB) is only the portion above the end surface 16t of the dummy layer 16 (inclined surface 16t2).
  • the end surface 13t of the optical waveguide 13 is guaranteed to be a highly accurate smooth surface (flat surface) without being affected by the tip shape of the dicing blade DB (or the dicing processing method).
  • the optical waveguide substrate 10 can be manufactured easily and at low cost.
  • the receptacle 30 that connects the optical waveguide substrate 10 and the plug 20 and makes the end surface 13t of the optical waveguide 13 and the end surface 22t of the optical fiber 22 face each other has been described as an example.
  • a mode in which the receptacle 30 is omitted, the optical waveguide substrate 10 and the plug 20 are directly connected, and the end surface 13t of the optical waveguide 13 and the end surface 22t of the optical fiber 22 are opposed to each other is possible.
  • the case where an optical signal is transmitted from the optical waveguide 13 side of the optical waveguide substrate 10 to the optical fiber 22 (multimode fiber 22M) side of the plug 20 has been described as an example.
  • a mode in which an optical signal is transmitted from the optical fiber 22 (multi-mode fiber 22M) side of the plug 20 to the optical waveguide 13 side of the optical waveguide substrate 10 is also possible.
  • a receiving element (not shown) that receives an optical signal from the optical waveguide 13 is provided on the optical waveguide substrate 10, and a light emitting element is provided at the end of the optical fiber 22 (multimode fiber 22M) of the plug 20. (Not shown) is provided.
  • the dummy layer 16 has a substantially rectangular shape in plan view has been described as an example.
  • the shape of the dummy layer 16 has a degree of freedom, and various design changes are possible.
  • the case where the inclined surface 16t2 is formed on the upper side of the end surface 16t of the dummy layer 16 (on the side opposite to the side where the dummy layer 16 is laminated on the optical waveguide 13) has been described as an example.
  • the concave surface 16t2 as a concept wider than the inclined surface 16t2 may be formed.
  • the case where the number of the optical waveguides 13 of the optical waveguide substrate 10 and the number of the optical fibers 22 of the plug 20 is 24 has been described as an example.
  • the number of optical waveguides and optical fibers is flexible, and various design changes are possible.
  • Optical waveguide substrate 11 Substrate (wiring substrate) 11t End face 12 Substrate layer 12t End face 13 Optical waveguide 13t End face (Flux incident / exit end face) 14 Light Emitting Element 15 Positioning Projection 16 Dummy Layer (Dummy Structure) 16t End surface 16t1 Flat surface 16t2 Inclined surface (concave surface) 20 plug (ferrule) 21 Main body 21t End surface (contact surface) 22 Optical fiber 22t End face (Flux incident / exit end face) 22M multimode fiber 23 introduction opening 24 operation opening 25 holding groove 26 fiber insertion hole 27 fitting convex part 30 receptacle 31 upper surface wall 31a positioning surface 31b positioning concave part 32 end face wall 32a positioning surface 32b fitting hole (through hole) 100 Optical connector system (active optical cable) DL dicing planned line (scheduled cutting line) DB dicing blade (cutting blade)

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Selon la présente invention, un substrat de guide d'ondes optiques est fabriqué aisément et à un coût faible, de sorte que le substrat de guide d'ondes optiques puisse être connecté de façon stable à une prise et les performances de communication de données optiques souhaitées puissent être obtenues. L'invention concerne en outre un substrat de guide d'ondes optiques (10) dans lequel une surface d'extrémité (13t) d'un guide d'ondes optiques (13) fait face à une surface d'extrémité (11t) d'un substrat (11), le substrat de guide d'ondes optiques (10) étant caractérisé en ce qu'il comporte une couche factice (16) stratifiée sur le guide d'ondes optiques (13), une surface d'extrémité (16t) de la couche factice (16) formant une série avec les surfaces d'extrémité du substrat (11) et du guide d'ondes optiques (13). L'invention concerne en outre un substrat de guide d'ondes optiques (10) comportant un substrat (11) et un guide d'ondes optiques (13) formé sur le substrat (11), le substrat de guide d'ondes optiques (10) étant caractérisé en ce qu'il comporte une couche factice (16) positionnée sur au moins le guide d'ondes optiques (13) dans une ligne de coupe prévue (DL) du substrat de guide d'ondes optiques (10).
PCT/JP2016/085050 2015-12-02 2016-11-25 Substrat de guide d'ondes optiques et procédé de fabrication de celui-ci, système de connecteur optique et câble optique actif WO2017094629A1 (fr)

Applications Claiming Priority (2)

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JP2015235538 2015-12-02
JP2015-235538 2015-12-02

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384523A (ja) * 1989-08-29 1991-04-10 Nec Corp 光制御デバイス
JPH11352350A (ja) * 1998-06-08 1999-12-24 Sony Corp 光導波路素子の製造方法
JP2004021005A (ja) * 2002-06-18 2004-01-22 Fujitsu Ltd 光導波路基板
JP2005017648A (ja) * 2003-06-25 2005-01-20 Matsushita Electric Works Ltd 光導波路モジュール
JP2013029624A (ja) * 2011-07-28 2013-02-07 Kyocera Corp 光コネクタおよび光伝送モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384523A (ja) * 1989-08-29 1991-04-10 Nec Corp 光制御デバイス
JPH11352350A (ja) * 1998-06-08 1999-12-24 Sony Corp 光導波路素子の製造方法
JP2004021005A (ja) * 2002-06-18 2004-01-22 Fujitsu Ltd 光導波路基板
JP2005017648A (ja) * 2003-06-25 2005-01-20 Matsushita Electric Works Ltd 光導波路モジュール
JP2013029624A (ja) * 2011-07-28 2013-02-07 Kyocera Corp 光コネクタおよび光伝送モジュール

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