WO2017075231A2 - Multi-functional ingester system for additive manufacturing - Google Patents

Multi-functional ingester system for additive manufacturing Download PDF

Info

Publication number
WO2017075231A2
WO2017075231A2 PCT/US2016/059139 US2016059139W WO2017075231A2 WO 2017075231 A2 WO2017075231 A2 WO 2017075231A2 US 2016059139 W US2016059139 W US 2016059139W WO 2017075231 A2 WO2017075231 A2 WO 2017075231A2
Authority
WO
WIPO (PCT)
Prior art keywords
powder
print job
powder samples
samples
powdered material
Prior art date
Application number
PCT/US2016/059139
Other languages
French (fr)
Other versions
WO2017075231A4 (en
WO2017075231A3 (en
Inventor
James A. DEMUTH
Erik Toomre
Francis L. Leard
Kourosh KAMSHAD
Heiner Fees
Eugene Berdichevsky
Original Assignee
Seurat Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seurat Technologies, Inc. filed Critical Seurat Technologies, Inc.
Priority to EP16860796.8A priority Critical patent/EP3368314A4/en
Priority to EP22163020.5A priority patent/EP4035806B1/en
Publication of WO2017075231A2 publication Critical patent/WO2017075231A2/en
Publication of WO2017075231A3 publication Critical patent/WO2017075231A3/en
Publication of WO2017075231A4 publication Critical patent/WO2017075231A4/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/34Process control of powder characteristics, e.g. density, oxidation or flowability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/36Process control of energy beam parameters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/38Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/39Traceability, e.g. incorporating identifier into a workpiece or article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/70Recycling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80Data acquisition or data processing
    • B22F10/85Data acquisition or data processing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22Driving means
    • B22F12/226Driving means for rotary motion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30Platforms or substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30Platforms or substrates
    • B22F12/33Platforms or substrates translatory in the deposition plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/38Housings, e.g. machine housings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/44Radiation means characterised by the configuration of the radiation means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/70Gas flow means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/80Plants, production lines or modules
    • B22F12/88Handling of additively manufactured products, e.g. by robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90Means for process control, e.g. cameras or sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/0006Electron-beam welding or cutting specially adapted for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/0013Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electronbeams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/002Devices involving relative movement between electronbeam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/0026Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/0046Welding
    • B23K15/0086Welding welding for purposes other than joining, e.g. built-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/0046Welding
    • B23K15/0093Welding characterised by the properties of the materials to be welded
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00Electron-beam welding or cutting
    • B23K15/06Electron-beam welding or cutting within a vacuum chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/144Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34Laser welding for purposes other than joining
    • B23K26/342Build-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/703Cooling arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/704Beam dispersers, e.g. beam wells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426Fixtures for other work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/001Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/268Arrangements for irradiation using laser beams; using electron beams [EB]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/286Optical filters, e.g. masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/379Handling of additively manufactured objects, e.g. using robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00Products made by additive manufacturing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B15/00Optical objectives with means for varying the magnification
    • G02B15/02Optical objectives with means for varying the magnification by changing, adding, or subtracting a part of the objective, e.g. convertible objective
    • G02B15/04Optical objectives with means for varying the magnification by changing, adding, or subtracting a part of the objective, e.g. convertible objective by changing a part
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B15/00Optical objectives with means for varying the magnification
    • G02B15/02Optical objectives with means for varying the magnification by changing, adding, or subtracting a part of the objective, e.g. convertible objective
    • G02B15/10Optical objectives with means for varying the magnification by changing, adding, or subtracting a part of the objective, e.g. convertible objective by adding a part, e.g. close-up attachment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G02B27/0068Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration having means for controlling the degree of correction, e.g. using phase modulators, movable elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/14Beam splitting or combining systems operating by reflection only
    • G02B27/141Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/14Mountings, adjusting means, or light-tight connections, for optical elements for lenses adapted to interchange lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/14Mountings, adjusting means, or light-tight connections, for optical elements for lenses adapted to interchange lenses
    • G02B7/16Rotatable turrets
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1822Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors comprising means for aligning the optical axis
    • G02B7/1827Motorised alignment
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0136Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  for the control of polarisation, e.g. state of polarisation [SOP] control, polarisation scrambling, TE-TM mode conversion or separation
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133362Optically addressed liquid crystal cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/135Liquid crystal cells structurally associated with a photoconducting or a ferro-electric layer, the properties of which can be optically or electrically varied
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/32Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/40Structures for supporting workpieces or articles during manufacture and removed afterwards
    • B22F10/47Structures for supporting workpieces or articles during manufacture and removed afterwards characterised by structural features
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/50Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60Treatment of workpieces or articles after build-up
    • B22F10/64Treatment of workpieces or articles after build-up by thermal means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/70Recycling
    • B22F10/73Recycling of powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/10Auxiliary heating means
    • B22F12/17Auxiliary heating means to heat the build chamber or platform
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/20Cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22Driving means
    • B22F12/222Driving means for motion along a direction orthogonal to the plane of a layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/41Radiation means characterised by the type, e.g. laser or electron beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/44Radiation means characterised by the configuration of the radiation means
    • B22F12/45Two or more
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • B22F12/53Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/247Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/248Thermal after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2203/00Controlling
    • B22F2203/03Controlling for feed-back
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/001Turbines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/008Gears
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/02Honeycomb structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/24Frameworks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/35Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/357Recycling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25Solid
    • B29K2105/251Particles, powder or granules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905Dividing and/or superposing multiple light beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/108Beam splitting or combining systems for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00Systems involving the use of models or simulators of said systems
    • G05B17/02Systems involving the use of models or simulators of said systems electric
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/49Nc machine tool, till multiple
    • G05B2219/490233-D printing, layer of powder, add drops of binder in layer, new powder
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07CTIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C3/00Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
    • G07C3/14Quality control systems
    • G07C3/146Quality control systems during manufacturing process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00Climate change mitigation technologies for sector-wide applications
    • Y02P80/40Minimising material used in manufacturing processes

Definitions

  • the present disclosure generally relates to three-dimensional (3D) powder bed fusion additive manufacturing and, more particularly, to in-process (in real-time or in- situ) collection and sampling of powdered materials during a print cycle.
  • the elemental/alloy composition of a powdered material due to thermal cycling and oxidation may be altered during a print cycle.
  • the powder bed fusion additive manufacturing process may need to be adjusted periodically during a print process to improve the quality of printed objects.
  • FIG. 1 A illustrates an additive manufacturing system
  • FIG. IB is a top view of a structure being formed on an additive manufacturing system
  • FIG. 2 illustrates an additive manufacturing method
  • FIG. 3 A is a cartoon illustrating an additive manufacturing system including lasers
  • FIG. 3B is a detailed description of the light patterning unit shown in FIG. 3A.
  • FIG. 3C is one embodiment of an additive manufacturing system with a
  • switchyard for directing and repatterning light using multiple image relays
  • FIG. 3D illustrates a simple mirror image pixel remapping
  • FIG. 3E illustrates a series of image transforming image relays for pixel
  • FIG. 3F illustrates an patternable electron energy beam additive manufacturing system
  • FIG. 3G illustrates a detailed description of the electron beam patterning unit shown in FIG. 3F;
  • FIG. 4 is a block diagram depicting an example apparatus of an ingester system in accordance with an embodiment of the present disclosure.
  • FIG. 5 is a flowchart depicting an example process of in-process collection and sampling of powder samples in accordance with an embodiment of the present disclosure.
  • FIG. 6 is an example implementation of an ingester system used in powder bed fusion additive manufacturing in accordance with an embodiment of the present disclosure.
  • an ingester system used in powder bed fusion additive manufacturing that collects in-process (in real-time or in-situ) powder samples and performs a set of characterizations on the powder samples.
  • an ingester system may collect powder samples periodically at a predetermined interval during a print process. The powder samples may be stored for analysis later or may be
  • the characterization results may determine whether to abort the print process or adjust printing parameters associated with powder bed fusion additive printing.
  • powder samples may be collected and stored for later off- site analysis. This approach may help with diagnostics on properties of the printed object, audit of powder quality, consistency from powder suppliers as well as potential contract violation(s) by a customer using unauthorized powdered materials on the printer.
  • a method of identifying unlicensed powder usage in an additive manufacturing system involves collecting a plurality of powder samples of a powdered material in real-time during a print job.
  • the collected powder samples are used for audit and authorization by performing at least one of the following steps: i) storing the collected powder samples for later characterization; and ii) immediately characterizing the powder samples to determine whether to abort the print job according to a result of the set of characterizations.
  • An additive manufacturing system which has one or more energy sources, including in one embodiment, one or more laser or electron beams, positioned to emit one or more energy beams.
  • Beam shaping optics may receive the one or more energy beams from the energy source and form a single beam.
  • An energy patterning unit receives or generates the single beam and transfers a two-dimensional pattern to the beam, and may reject the unused energy not in the pattern.
  • An image relay receives the two-dimensional patterned beam and focuses it as a two-dimensional image to a desired location on a height fixed or movable build platform (e.g. a powder bed). In certain embodiments, some or all of any rejected energy from the energy patterning unit is reused.
  • multiple beams from the laser array(s) are combined using a beam homogenizer.
  • This combined beam can be directed at an energy patterning unit that includes either a transmissive or reflective pixel addressable light valve.
  • the pixel addressable light valve includes both a liquid crystal module having a polarizing element and a light projection unit providing a two-dimensional input pattern. The two-dimensional image focused by the image relay can be sequentially directed toward multiple locations on a powder bed to build a 3D structure.
  • an additive manufacturing system 100 has an energy patterning system 110 with an energy source 112 that can direct one or more continuous or intermittent energy beam(s) toward beam shaping optics 114. After shaping, if necessary, the beam is patterned by an energy patterning unit 116, with generally some energy being directed to a rejected energy handling unit 118. Patterned energy is relayed by image relay 120 toward an article processing unit 140, typically as a two-dimensional image 122 focused near a bed 146. The bed 146 (with optional walls 148) can form a chamber containing material 144 dispensed by material dispenser 142. Patterned energy, directed by the image relay 120, can melt, fuse, sinter, amalgamate, change crystal structure, influence stress patterns, or otherwise chemically or physically modify the dispensed material 144 to form structures with desired properties.
  • Energy source 112 generates photon (light), electron, ion, or other suitable energy beams or fluxes capable of being directed, shaped, and patterned. Multiple energy sources can be used in combination.
  • the energy source 112 can include lasers, incandescent light, concentrated solar, other light sources, electron beams, or ion beams.
  • Possible laser types include, but are not limited to: Gas Lasers, Chemical Lasers, Dye Lasers, Metal Vapor Lasers, Solid State Lasers (e.g. fiber), Semiconductor (e.g. diode) Lasers, Free electron laser, Gas dynamic laser, "Nickel-like" Samarium laser, Raman laser, or Nuclear pumped laser.
  • a Gas Laser can include lasers such as a Helium-neon laser, Argon laser,
  • Krypton laser Xenon ion laser, Nitrogen laser, Carbon dioxide laser, Carbon monoxide laser or Excimer laser.
  • a Chemical laser can include lasers such as a Hydrogen fluoride laser, Deuterium fluoride laser, COIL (Chemical oxygen-iodine laser), or Agil (All gas-phase iodine laser).
  • lasers such as a Hydrogen fluoride laser, Deuterium fluoride laser, COIL (Chemical oxygen-iodine laser), or Agil (All gas-phase iodine laser).
  • a Metal Vapor Laser can include lasers such as a Helium-cadmium (HeCd)
  • HeHg metal-vapor laser Helium-mercury (HeHg) metal-vapor laser, Helium-selenium (HeSe) metal-vapor laser, Helium-silver (HeAg) metal-vapor laser, Strontium Vapor Laser, Neon-copper (NeCu) metal-vapor laser, Copper vapor laser, Gold vapor laser, or Manganese (Mn/MnCl 2 ) vapor laser.
  • HeHg Helium-mercury
  • HeSe Helium-selenium
  • HeAg metal-vapor laser Helium-silver (HeAg) metal-vapor laser
  • Strontium Vapor Laser Neon-copper (NeCu) metal-vapor laser, Copper vapor laser, Gold vapor laser, or Manganese (Mn/MnCl 2 ) vapor laser.
  • NeCu Neon-copper
  • Cu Copper
  • Au Gold
  • Mn/MnCl 2 Manganese
  • a Solid State Laser can include lasers such as a Ruby laser, Nd: YAG laser,
  • NdCrYAG laser Er: YAG laser
  • Neodymium YLF (Nd: YLF) solid-state laser Neodymium YLF (Nd: YLF) solid-state laser
  • a Semiconductor Laser can include laser medium types such as GaN, InGaN,
  • AlGalnP AlGaAs, InGaAsP, GalnP, InGaAs, InGaAsO, GalnAsSb, lead salt, Vertical cavity surface emitting laser (VCSEL), Quantum cascade laser, Hybrid silicon laser, or combinations thereof.
  • VCSEL Vertical cavity surface emitting laser
  • Quantum cascade laser Hybrid silicon laser, or combinations thereof.
  • a single Nd: YAG q-switched laser can be used in conjunction with multiple semiconductor lasers.
  • an electron beam can be used in conjunction with an ultraviolet semiconductor laser array.
  • a two-dimensional array of lasers can be used.
  • pre-patterning of an energy beam can be done by selectively activating and deactivating energy sources.
  • Beam shaping unit 114 can include a great variety of imaging optics to combine, focus, diverge, reflect, refract, homogenize, adjust intensity, adjust frequency, or otherwise shape and direct one or more energy beams received from the energy source 112 toward the energy patterning unit 116.
  • multiple light beams each having a distinct light wavelength, can be combined using wavelength selective mirrors (e.g. dichroics) or diffractive elements.
  • multiple beams can be homogenized or combined using multifaceted mirrors, microlenses, and refractive or diffractive optical elements.
  • Energy patterning unit 116 can include static or dynamic energy patterning
  • photon, electron, or ion beams can be blocked by masks with fixed or movable elements.
  • pixel addressable masking, image generation, or transmission can be used.
  • the energy patterning unit includes addressable light valves, alone or in conjunction with other patterning mechanisms to provide patterning.
  • the light valves can be transmissive, reflective, or use a combination of transmissive and reflective elements. Patterns can be dynamically modified using electrical or optical addressing.
  • a transmissive optically addressed light valve acts to rotate polarization of light passing through the valve, with optically addressed pixels forming patterns defined by a light projection source.
  • a reflective optically addressed light valve includes a write beam for modifying polarization of a read beam.
  • an electron patterning device receives an address pattern from an electrical or photon stimulation source and generates a patterned emission of electrons.
  • Rejected energy handling unit 118 is used to disperse, redirect, or utilize energy not patterned and passed through the energy pattern image relay 120.
  • the rejected energy handling unit 118 can include passive or active cooling elements that remove heat from the energy patterning unit 116.
  • the rejected energy handling unit can include a "beam dump" to absorb and convert to heat any beam energy not used in defining the energy pattern.
  • rejected beam energy can be recycled using beam shaping optics 114.
  • rejected beam energy can be directed to the article processing unit 140 for heating or further patterning.
  • rejected beam energy can be directed to additional energy patterning systems or article processing units.
  • Image relay 120 receives a patterned image (typically two-dimensional) from the energy patterning unit 116 and guides it toward the article processing unit 140.
  • the image relay 120 can include optics to combine, focus, diverge, reflect, refract, adjust intensity, adjust frequency, or otherwise shape and direct the patterned image.
  • Article processing unit 140 can include a walled chamber 148 and bed 144, and a material dispenser 142 for distributing material. The material dispenser 142 can distribute, remove, mix, provide gradations or changes in material type or particle size, or adjust layer thickness of material.
  • the material can include metal, ceramic, glass, polymeric powders, other melt-able material capable of undergoing a thermally induced phase change from solid to liquid and back again, or combinations thereof.
  • the material can further include composites of melt-able material and non-melt-able material where either or both components can be selectively targeted by the imaging relay system to melt the component that is melt-able, while either leaving along the non-melt-able material or causing it to undergo a vaporizing/destroying/combusting or otherwise destructive process.
  • slurries, sprays, coatings, wires, strips, or sheets of materials can be used. Unwanted material can be removed for disposable or recycling by use of blowers, vacuum systems, sweeping, vibrating, shaking, tipping, or inversion of the bed 146.
  • the article processing unit 140 can include components for holding and supporting 3D structures, mechanisms for heating or cooling the chamber, auxiliary or supporting optics, and sensors and control mechanisms for monitoring or adjusting material or environmental conditions.
  • the article processing unit can, in whole or in part, support a vacuum or inert gas atmosphere to reduce unwanted chemical interactions as well as to mitigate the risks of fire or explosion (especially with reactive metals).
  • Control processor 150 can be connected to control any components of additive manufacturing system 100.
  • the control processor 150 can be connected to variety of sensors, actuators, heating or cooling systems, monitors, and controllers to coordinate operation.
  • a wide range of sensors including imagers, light intensity monitors, thermal, pressure, or gas sensors can be used to provide information used in control or monitoring.
  • the control processor can be a single central controller, or alternatively, can include one or more independent control systems.
  • the controller processor 150 is provided with an interface to allow input of manufacturing instructions. Use of a wide range of sensors allows various feedback control mechanisms that improve quality, manufacturing throughput, and energy efficiency.
  • FIG. IB is a cartoon illustrating a bed 146 that supports material 144. Using a series of sequentially applied, two-dimensional patterned energy beam images (squares in dotted outline 124), a structure 149 is additively manufactured. As will be understood, image patterns having non-square boundaries can be used, overlapping or
  • interpenetrating images can be used, and images can be provided by two or more energy patterning systems.
  • images can be formed in conjunction with directed electron or ion beams, or with printed or selective spray systems.
  • FIG. 2 is a flow chart illustrating one embodiment of an additive manufacturing process supported by the described optical and mechanical components.
  • material is positioned in a bed, chamber, or other suitable support.
  • the material can be a powder capable of being melted, fused, sintered, induced to change crystal structure, have stress patterns influenced, or otherwise chemically or physically modified to form structures with desired properties.
  • step 204 unpatterned energy is emitted by one or more energy emitters
  • the unpatterned energy is shaped and modified (e.g. intensity modulated or focused).
  • this unpatterned energy is patterned, with energy not forming a part of the pattern being handled in step 210 (this can include conversion to waste heat, or recycling as patterned or unpatterned energy).
  • the patterned energy, now forming a two-dimensional image is relayed toward the material.
  • the image is applied to the material, building a portion of a 3D structure.
  • FIG. 3A is one embodiment of an additive manufacturing system 300 that uses multiple semiconductor lasers as part of an energy patterning system 310.
  • a control processor 350 can be connected to variety of sensors, actuators, heating or cooling systems, monitors, and controllers to coordinate operation of multiple lasers 312, light patterning unit 316, and image relay 320, as well as any other component of system 300. These connections are generally indicated by a dotted outline 351 surrounding components of system 300. As will be appreciated, connections can be wired or wireless, continuous or intermittent, and include capability for feedback (for example, thermal heating can be adjusted in response to sensed temperature).
  • the multiple lasers 312 can emit a beam 301 of light at a 1000 nm wavelength that, for example, is 90 mm wide by 20 mm tall.
  • the beam 301 is resized by imaging optics 370 to create beam 303.
  • Beam 303 is 6 mm wide by 6mm tall, and is incident on light homogenization device 372 which blends light together to create blended beam 305.
  • Beam 305 is then incident on imaging assembly 374 which reshapes the light into beam 307 and is then incident on hot cold mirror 376.
  • the mirror 376 allows 1000 nm light to pass, but reflects 450nm light.
  • a light projector 378 capable of projecting low power light at 1080p pixel resolution and 450nm emits beam 309, which is then incident on hot cold mirror 376.
  • Beams 307 and 309 overlay in beam 311, and both are imaged onto optically addressed light valve 380 in a 20mm wide, 20mm tall image. Images formed from the homogenizer 372 and the projector 378 are recreated and overlaid on light valve 380.
  • the optically addressed light valve 380 is stimulated by the light (typically
  • Beam 317 enters the final imaging assembly 320 which includes optics 384 that resize the patterned light.
  • This beam reflects off of a movable mirror 386 to beam 319, which terminates in a focused image applied to material bed 344 in an article processing unit 340.
  • the depth of field in the image selected to span multiple layers, providing optimum focus in the range of a few layers of error or offset.
  • the bed 390 can be raised or lowered (vertically indexed) within chamber walls
  • the bed 390 can remain fixed, and optics of the final imaging assembly 320 can be vertically raised or lowered. Material distribution is provided by a sweeper mechanism 392 that can evenly spread powder held in hopper 394, being able to provide new layers of material as needed. An image 6 mm wide by 6 mm tall can be sequentially directed by the movable mirror 386 at different positions of the bed.
  • the powder can be spread in a thin layer, approximately 1-3 particles thick, on top of a base substrate (and subsequent layers) as the part is built.
  • a patterned beam 319 bonds to the underlying layer, creating a solid structure.
  • the patterned beam 319 can be operated in a pulsed fashion at 40 Hz, moving to the subsequent 6 mm x 6 mm image locations at intervals of 10 ms to 0.5 ms (with 3 to 0.1 ms being desirable) until the selected patterned areas of powder have been melted.
  • the bed 390 then lowers itself by a thickness corresponding to one layer, and the sweeper mechanism 392 spreads a new layer of powdered material. This process is repeated until the 2D layers have built up the desired 3D structure.
  • the article processing unit 340 can have a controlled atmosphere. This allows reactive materials to be manufactured in an inert gas, or vacuum environment without the risk of oxidation or chemical reaction, or fire or explosion (if reactive metals are used).
  • FIG. 3B illustrates in more detail operation of the light patterning unit 316 of FIG.
  • a representative input pattern 333 (here seen as the numeral "9") is defined in an 8x12 pixel array of light projected as beam 309 toward mirror 376.
  • Each grey pixel represents a light filled pixel, while white pixels are unlit.
  • each pixel can have varying levels of light, including light-free, partial light intensity, or maximal light intensity.
  • Unpatterned light 331 that forms beam 307 is directed and passes through a hot/cold mirror 376, where it combines with patterned beam 309. After reflection by the hot/cold mirror 376, the patterned light beam 311 formed from overlay of beams 307 and 309 in beam 311, and both are imaged onto optically addressed light valve 380.
  • the optically addressed light valve 380 which would rotate the polarization state of unpatterned light 331, is stimulated by the patterned light beam 309, 311 to selectively not rotate the polarization state of polarized light 307, 311 in the pattern of the numeral "9" into beam 313.
  • the unrotated light representative of pattern 333 in beam 313 is then allowed to pass through polarizer mirror 382 resulting in beam 317 and pattern 335.
  • Polarized light in a second rotated state is rejected by polarizer mirror 382, into beam 315 carrying the negative pixel pattern 337 consisting of a light-free numeral "9".
  • Non-optically addressed light valves can be used. These can include but are not limited to electrically addressable pixel elements, movable mirror or micro-mirror systems, piezo or micro-actuated optical systems, fixed or movable masks, or shields, or any other conventional system able to provide high intensity light patterning. For electron beam patterning, these valves may selectively emit electrons based on an address location, thus imbuing a pattern on the beam of electrons leaving the valve.
  • FIG. 3C is one embodiment of an additive manufacturing system that includes a switchyard system enabling reuse of patterned two-dimensional energy.
  • an additive manufacturing system 220 has an energy patterning system with an energy source 112 that directs one or more continuous or intermittent energy beam(s) toward beam shaping optics 114. After shaping, the beam is two-dimensionally patterned by an energy patterning unit 230, with generally some energy being directed to a rejected energy handling unit 222. Patterned energy is relayed by one of multiple image relays 232 toward one or more article processing units 234A, 234B, 234C, or 234D, typically as a two-dimensional image focused near a movable or fixed height bed.
  • the bed (with optional walls) can form a chamber containing material dispensed by material dispenser.
  • Patterned energy directed by the image relays 232, can melt, fuse, sinter, amalgamate, change crystal structure, influence stress patterns, or otherwise chemically or physically modify the dispensed material to form structures with desired properties.
  • the rejected energy handling unit has multiple components to permit reuse of rejected patterned energy.
  • Relays 228A, 228B, and 22C can respectively transfer energy to an electricity generator 224, a heat/cool thermal management system 225, or an energy dump 226.
  • relay 228C can direct patterned energy into the image relay 232 for further processing.
  • patterned energy can be directed by relay 228C, to relay 228B and 228A for insertion into the energy beam(s) provided by energy source 112.
  • Reuse of patterned images is also possible using image relay 232. Images can be redirected, inverted, mirrored, sub-patterned, or otherwise transformed for distribution to one or more article processing units. 234A-D.
  • reuse of the patterned light can improve energy efficiency of the additive manufacturing process, and in some cases improve energy intensity directed at a bed, or reduce manufacture time.
  • FIG. 3D is a cartoon 235 illustrating a simple geometrical transformation of a rejected energy beam for reuse.
  • An input pattern 236 is directed into an image relay 237 capable of providing a mirror image pixel pattern 238.
  • image relay 237 capable of providing a mirror image pixel pattern 238.
  • more complex pixel transformations are possible, including geometrical transformations, or pattern remapping of individual pixels and groups of pixels. Instead of being wasted in a beam dump, this remapped pattern can be directed to an article processing unit to improve manufacturing throughput or beam intensity.
  • FIG. 3E is a cartoon 235 illustrating multiple transformations of a rejected energy beam for reuse.
  • An input pattern 236 is directed into a series of image relays 237B-E capable of providing a pixel pattern 238.
  • FIG. 3F and 3G illustrates a non-light based energy beam system 240 that
  • a patterned electron beam 241 capable of producing, for example, a "P" shaped pixel image.
  • a high voltage electricity power system 243 is connected to an optically addressable patterned cathode unit 245.
  • the cathode unit 245 is stimulated to emit electrons wherever the patterned image is optically addressed.
  • Focusing of the electron beam pattern is provided by an image relay system 247 that includes imaging coils 246A and 246B.
  • Final positioning of the patterned image is provided by a deflection coil 248 that is able to move the patterned image to a desired position on a bed of additive manufacturing component 249.
  • multiple beams of light from one or more light sources are provided.
  • the multiple beams of light may be reshaped and blended to provide a first beam of light.
  • a spatial polarization pattern may be applied on the first beam of light to provide a second beam of light.
  • Polarization states of the second beam of light may be split to reflect a third beam of light, which may be reshaped into a fourth beam of light.
  • the fourth beam of light may be introduced as one of the multiple beams of light to result in a fifth beam of light.
  • this or similar systems can reduce energy costs associated with an additive manufacturing system.
  • multiple light beams each having a distinct light wavelength, can be combined using either wavelength selective mirrors or diffractive elements.
  • diffractive elements that are not sensitive to wavelength dependent refractive effects can be used to guide a
  • Patterned light can be directed using movable mirrors, prisms, diffractive optical elements, or solid state optical systems that do not require substantial physical movement.
  • a magnification ratio and an image distance associated with an intensity and a pixel size of an incident light on a location of a top surface of a powder bed can be determined for an additively manufactured, three-dimensional (3D) print job.
  • One of a plurality of lens assemblies can be configured to provide the incident light having the magnification ratio, with the lens assemblies both a first set of optical lenses and a second sets of optical lenses, and with the second sets of optical lenses being swappable from the lens assemblies.
  • Rotations of one or more sets of mirrors mounted on compensating gantries and a final mirror mounted on a build platform gantry can be used to direct the incident light from a precursor mirror onto the location of the top surface of the powder bed.
  • Translational movements of compensating gantries and the build platform gantry are also able to ensure that distance of the incident light from the precursor mirror to the location of the top surface of the powder bed is substantially equivalent to the image distance. In effect, this enables a quick change in the optical beam delivery size and intensity across locations of a build area for different powdered materials while ensuring high availability of the system.
  • a plurality of build chambers each having a build
  • platform to hold a powder bed can be used in conjunction with multiple optical- mechanical assemblies arranged to receive and direct the one or more incident energy beams into the build chambers.
  • Multiple chambers allow for concurrent printing of one or more print jobs inside one or more build chambers.
  • a removable chamber sidewall can simplify removal of printed objects from build chambers, allowing quick exchanges of powdered materials.
  • the chamber can also be equipped with an adjustable process temperature controls.
  • one or more build chambers can have a build chamber that is maintained at a fixed height, while optics are vertically movable.
  • a distance between final optics of a lens assembly and a top surface of powder bed a may be managed to be essentially constant by indexing final optics upwards, by a distance equivalent to a thickness of a powder layer, while keeping the build platform at a fixed height.
  • large and heavy objects can be more easily manufactured, since precise micron scale movements of the build platform are not needed.
  • build chambers intended for metal powders with a volume more than ⁇ 0.1 - 0.2 cubic meters i.e., greater than 100 - 200 liters or heavier than 500 - 1,000 kg will most benefit from keeping the build platform at a fixed height.
  • a portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform.
  • a fluid passageway can be formed in the one or more first walls to enable improved thermal management.
  • Improved powder handling can be another aspect of an improved additive
  • a build platform supporting a powder bed can be capable of tilting, inverting, and shaking to separate the powder bed substantially from the build platform in a hopper.
  • the powdered material forming the powder bed may be collected in a hopper for reuse in later print jobs.
  • the powder collecting process may be automated, and vacuuming or gas jet systems also used to aid powder dislodgement and removal
  • a continuous (long) part can be sequentially advanced in a longitudinal direction from a first zone to a second zone.
  • selected granules of a granular material can be amalgamated.
  • unamalgamated granules of the granular material can be removed.
  • the first portion of the continuous part can be advanced from the second zone to a third zone, while a last portion of the continuous part is formed within the first zone and the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone.
  • unamalgamated granular material may be performed in parallel (i.e., at the same time) at different locations or zones on a part conveyor, with no need to stop for removal of granular material and/or parts.
  • additive manufacturing capability can be improved by use of an enclosure restricting an exchange of gaseous matter between an interior of the enclosure and an exterior of the enclosure.
  • An airlock provides an interface between the interior and the exterior; with the interior having multiple additive manufacturing chambers, including those supporting power bed fusion.
  • a gas management system maintains gaseous oxygen within the interior at or below a limiting oxygen concentration, increasing flexibility in types of powder and processing that can be used in the system.
  • capability can be improved by having a
  • 3D printer contained within an enclosure, the printer able to create a part having a weight greater than or equal to 2,000 kilograms.
  • a gas management system may maintain gaseous oxygen within the enclosure at concentrations below the atmospheric level.
  • a wheeled vehicle may transport the part from inside the enclosure, through an airlock, since the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock.
  • Other manufacturing embodiments involve collecting powder samples in realtime in a powder bed fusion additive manufacturing system.
  • An ingester system is used for in-process collection and characterizations of powder samples. The collection may be performed periodically and the results of characterizations result in adjustments to the powder bed fusion process.
  • the ingester system can optionally be used for one or more of audit, process adjustments or actions such as modifying printer parameters or verifying proper use of licensed powder materials.
  • manipulator device such as a crane, lifting gantry, robot arm, or similar that allows for the manipulation of parts that would be difficult or impossible for a human to move is described.
  • the manipulator device can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.
  • FIG. 4 is a block diagram illustrating an example apparatus 400 including ingester system 410 in accordance with an embodiment of the present disclosure.
  • Ingester system 410 may perform various functions related to techniques, methods and systems described herein, including those described below with respect to process 500 and implementation 600.
  • Ingester system 410 may be installed in, equipped on, connected to or otherwise implemented in a powder bed fusion additive manufacturing system (such as that shown in FIGS. 1 A, IB, 2, 3A and 3B) to effect various embodiments in accordance with the present disclosure.
  • Ingester system 410 may include at least some of the components illustrated in FIG. 4.
  • ingester system 410 may involve ingester 420 collecting powder samples of a powdered material during powder bed fusion additive
  • the powdered material may include metal, ceramic, plastic powders, or other suitable powders able to bond together while subjected to a thermal energy.
  • the collection of powder samples may be performed periodically at a predetermined interval.
  • the powder samples may be collected or taken by ingester 420 from the powder bed or the powder distribution system such as powder dispensing assembly 470.
  • a mechanical assembly such as a scoop, diverter, or mechanical arm may be used to collect or pick up powder samples at predetermined locations.
  • ingester system 410 may include storage container 450 capable of packaging the powder samples in a plurality of sample canister 460(1) - 460(N), with N being a positive integer greater than 0.
  • the sample canister 460(1) - 460(N) may be stored for analyses that may not be suitable for in-process (in real-time or in-situ) characterization or for auditing purposes later.
  • Storage container 450 may be capable of packaging powder samples in an atmosphere substantially equivalent to an in- process atmosphere inside sample canister 460(1) - 460(N).
  • the atmosphere may be air or an inert gas such as nitrogen, argon or helium.
  • ingester system 410 may include test suite 430 capable of performing test 440(1) - 440(K), with K being a positive integer.
  • Test suite 430 may be a collection of instruments having capabilities to perform one or more tests of test 440(1) - 440(K).
  • the collection of instruments may include dilatometer, flash diffusivity analyzer, gas chromatography mass spectrometry, gas pycnometer, inclinometer, particle size analyzer, particle shape analyzer, profilometer, scale, spectrometer, thermometer, tintometer, or other instruments capable of measuring properties or qualities of powders.
  • Test 440(1) - 440(K) may perform characterizations of powder samples on one or more specific properties respectively.
  • the one or more specific properties of powder samples may include thermal diffusivity, density, surface roughness, weight, emissivity, absorptivity, reflectance, transmissivity, temperature, color, and particle size distribution.
  • the one or more qualities of powder samples may include uniformity of particle size, uniformity of composition, or uniformity of surface roughness.
  • Some powdered materials may have undergone undesired changes after a print cycle with inadequate processing conditions or thermal cycles.
  • the inadequate processing conditions may include non-uniform thicknesses of a powder layer dispensed by powder dispensing assembly 470, an excessive temperature of a powder bed caused by an overheating of build platform 490, or an incident beam having an intensity too high.
  • the results of characterization may be used to adjust printing parameters during a print process to improve print quality.
  • the printing parameters may include a rate of dispensing to control a thickness uniformity, a temperature of built platform 490, and an intensity or dwell time (duration) of an incident beam to control a dimension, a pulse shape of energy source incident on the powder material modulated over time and position on the bed, and one or more specific electrical, mechanical, or optical properties of a printed object.
  • 440(K) may indicate significant alternation of one or more powder properties and beyond the range of workable specifications.
  • the print process may be aborted in such conditions.
  • Ingester system 410 may include processor 401 and memory 402.
  • Processor 401 may be coupled to memory 402 to access data stored therein and to execute any programs/instructions stored therein.
  • Processor 701 may control ingester system 410 performing powder sample collection at a predetermined interval.
  • Processor 401 may execute instructions as to which test of test 440(1) - 440(K) in test suite 430 may be performed.
  • Processor 401 may further control storage container 450 packaging the powder samples in sample canister 460(1) - 460(N). The result of test 440(1) - 440(K) may be stored in memory 402.
  • Example apparatus 400 may include components of a powder bed fusion additive manufacturing system such as powder dispensing assembly 470, print head 480, and build platform 490.
  • Powder dispensing assembly 470 may dispense a plurality of layers of a powdered material to form a powder bed supported by build platform 490.
  • Print head 480 may include an energy source (e.g., fiber laser or diode laser) capable of providing a light beam of sufficient energy to melt/sinter the powdered material.
  • Build platform 490 may have resistive heating elements inside to control a temperature of a powder bed formed by layers of a powdered material.
  • Processor 401 may control powder dispensing assembly 470, print head 480, and build platform 490 in response to characterization results of powder samples by ingester system 410 during a print process.
  • FIG. 5 illustrates an example process 500 of collecting and characterizing powder samples of a powdered material during a print process.
  • Process 500 may be utilized to collect the powder samples from a powder bed or a powder distribution assembly, and characterizing the powder samples in real-time in a test suite in accordance with the present disclosure.
  • Process 500 may include one or more operations, actions, or functions shown as blocks such as 510, 520, 530, and 540. Although illustrated as discrete blocks, various blocks of process 500 may be divided into additional blocks, combined into fewer blocks, or eliminated, depending on the desired implementation, and may be performed or otherwise carried out in an order different from that shown in FIG. 5.
  • Process 500 may be implemented in example implementation 600, and may be implemented by example apparatus 400 described above. For illustrative purposes and without limiting the scope, the following description of process 500 is provided in the context of example implementation 600 as being implemented by example apparatus 400.
  • Process 500 may begin with block 510.
  • process 500 may involve processor 401 of example apparatus 400
  • processor 401 may instruct ingester 420 collecting powder samples periodically at a predetermined interval or randomly or at predetermined stages during a print process. For example, processor 401 may instruct ingester 420 to collect powder samples at every 10-minute interval or only at l/5th and 4/5th completion of a print process.
  • Ingester 420 may have a mechanism for diverting incoming powder from a powder bed or powder dispensing assembly 470 of example apparatus 400.
  • Ingester 420 may also control an amount of powders being diverted, depending how many tests are required for analysis.
  • Process 500 may proceed from 510 to 520.
  • process 500 may involve processor 401 controlling test suite 430 to
  • Test suite 430 may include instruments having capabilities to perform one or more tests of test 440(1) - 440(K). For illustrating purposes and without limitation, test 440(1) may measure a distribution of powder sizes by particle size analyzer; test 440(2) may measure a density of powder samples by pycnometer; test 440(3) may identify substances within the powder samples by gas chromatography mass spectrometry. Some example instruments for the possible test suite 430 along with the types of data gathered or property measured are listed, but are not limited to, in the table below. Process 500 may proceed from 520 to 530.
  • process 500 may involve processor 401 determining whether to modify a set of printing parameters employed for the print process or whether to abort the print process according to a result characterization from test 440(1) - 440(K).
  • Processor 401 may determine to modify one or more printing parameters according characterization results of test 440(1) - 440(K). For example, processor 401 may increase or decrease the incident beam intensity provided by print head 480 when gas pycnometer measures a deviation of specified powder density which may affect the energy per unit volume required to melt or sinter the powders.
  • Processor 401 may also control dwell time of the incident beam provided by print head 480 or a thickness of powder layer dispensed by powder dispensing assembly 470 to adjust for the energy requirement change.
  • the temperature of build platform 490 may be controlled to alleviate burden of the energy source by processor 401. If the deviation of the energy per unit volume to the specified powder density is too large, processor 401 may determine to abort the print process since the energy source inside print head 480 may not meet the requirement to melt the powders. In another example, contaminations within powder samples may be detected by gas chromatography mass spectroscopy, which may affect one or more electrical, mechanical and optical properties of the printed object. Thus, processor 401 may determine to abort the print process in such situations.
  • the print process can be stopped if characterization results indicate usage of unlicensed powders or dangerous powders, including unlicensed powders likely to result in inferior additive manufacturing results.
  • the characterization results of test 440(1) - 440(K) may be stored in memory 402.
  • prediction of final print quality based on the results of in- process (in real-time or in-situ) characterizations of powder samples may be performed by simulations using a set of models.
  • dimensional controls of the printed object may rely on a resolution of the incident beam and a temperature gradient of powders across the boundary of melted region. The melted region may expand beyond the intended boundary if the temperature does not drop quick enough across the boundary and result in exceeding the tolerance of the dimensional requirement.
  • the temperature gradient may be simulated by a heat transfer model which calculates a heat conduction rate based on properties of powders such as on the compositions and sizes of powders. If the predicted dimension of a printed object by the simulation model exceeds the tolerance of dimensional requirement, at 530, processor 401 may determine to abort the print process.
  • Process 500 may proceed from 530 to 540.
  • process 500 may involve storage container 450 of example apparatus 400 packaging powder samples in a plurality of sample canister 460(1) - 460(N).
  • the sample canister 460(1) - 460(N) may be stored for analyses that may not be suitable for in- process characterization or for auditing purposes later.
  • Storage container 450 may be capable of packaging powder samples in an atmosphere substantially equivalent to the in- process (in real-time or in-situ) atmosphere inside sample canister 460(1) - 460(N).
  • the atmosphere may be air or an inert gas such as nitrogen, carbon dioxide, argon, helium, or other noble gas.
  • FIG. 6 illustrates an example implementation 600 of collecting powder samples by ingester system 410 in powder bed fusion additive manufacturing in accordance with the present disclosure.
  • build platform 601 supporting a powder bed 612 in a powder bed fusion 3D printer is connected to processor 608 together with ingester system 604.
  • the exemplary powder bed fusion 3D printer may measure lm by lm and is shown without all its side walls for a purpose of clarity.
  • Printing may occur via the action of optical module 602 which directs concentrated laser beam 613 provided by a print head (not shown in FIG. 6) to the surface of powder bed 612.
  • the optical module 602 may be included in the print head in addition to an energy source that provides laser beam 613.
  • Powder bed 612 may be formed by a plurality of powder layers dispensed by powder dispensing assembly 603.
  • the powdered material may include metal, ceramic, plastic powders or other suitable powders able to bond together while subjected to a thermal energy.
  • the processing atmosphere for the powdered material inside the powder bed fusion 3D printer may be air or an inert gas including nitrogen, carbon dioxide, argon, helium, or other noble gas.
  • Ingester system 604 may include ingestion 605, the storage container 606, and test suite 607. Ingester 605 may collect or pick up powder samples in real-time during a print process from powder bed 612 or powder dispensing assembly 603 periodically, randomly, or at predetermined stages.
  • a mechanical arm or diverter mechanism may be implemented as ingester 605 for collecting or picking up powder samples at predetermined locations or randomly and the amount of powder samples being collected may also be predetermined based on a number of requested analyses by users of the powder bed fusion 3D printer.
  • the collected powder samples may be packaged in sample canisters by storage container 606 for auditing purposes or for later analysis.
  • the storage contained may have a substantially equivalent atmosphere to the processing atmosphere used for the powder samples.
  • Test suite 607 may perform characterizations such as those illustrated in test 440(1) - test 440(K) of example apparatus 400 on powder samples in real-time after ingester 605 has collected the powder samples.
  • the characterizations performed by test suite 607 may measure one or more properties or qualities of powder samples from powder bed 612 or powder dispensing assembly 603 using example instruments listed in the table at step 520 of example process 500.
  • the one or more properties of powder samples may include thermal diffusivity, density, surface roughness, weight, emissivity, absorptivity, reflectance, transmissivity, temperature, color, and particle size distribution.
  • Processor 608 may store the characterization result of powder samples in memory 609 or using models in computing facility 611 with the characterization results as inputs to simulation a final dimension, and one or more electrical, mechanical, or optical properties of a printed object.
  • the results of simulation may be utilized to determine whether to modify the printing parameters or abort the print process.
  • processor 608 may control an intensity and dwell time of incident beam 613 from the print head, a dispensing rate and a thickness of powders of powder dispensing assembly 603, and a temperature of build platform 601 as well as powder bed 612 to improve the properties or qualities of the printed object according the characterization results and simulation feedbacks. If the results of simulation indicate that a final dimension or one or more electrical, mechanical, or optical properties may not meet the requirement or specification of the printed object, processor 608 may determine to abort the print process.
  • Whether to modify printing parameters or abort the print process may be also determined by users of powder bed fusion 3D printer based on knowledge and experience of previous characterization results. Some of tests in test suite 607 may not be suitable for in-process characterization and may be performed later for an off-site analysis.
  • the processor 608 may have connectivity to the outside world via the Internet 610 which under selected circumstances connects to a cloud computing facility 611 with simulation models, advanced computing, and data storage.
  • test data such as those illustrated in test 440(1) - 440(K) of powder samples in conjunction with a database and possibly with the additional use of computer simulation models such as those describe at 530 in example process 500, enable a range of process adjustments and actions, either separately or in combination.
  • the class of process adjustments span the range of simple to extremely sophisticated.
  • print head 480 of example apparatus 400 may adjust its print characteristics such as laser dwell time or intensity in the case of powder bed fusion printers, or the powder dispensing assembly 470 may adjust its powder distribution parameters in terms of dispensing rate and layer thickness, in both cases to realize a more effective and higher quality printed object.
  • the printer may adjust printing parameters based on powder sample analysis for a self-protection of the printer, potentially for the case of reactive materials, or non-compatible materials used with the machine itself.
  • the class of actions may include denial of further service because the powdered material is unauthorized, or that the powdered material may damage the printer, or a potential fire risk due to trace amounts of powdered materials from previous builds mixing and interacting in a dangerous manner.
  • the actions may also serve as a trigger for billing and tracking purposes related to customer contracts, either directly for print services or for service.
  • a final example combining both process adjustments and actions may be an

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Quality & Reliability (AREA)
  • Powder Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laser Beam Processing (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Bakery Products And Manufacturing Methods Therefor (AREA)
  • Optical Head (AREA)
  • Meat, Egg Or Seafood Products (AREA)
  • Medicinal Preparation (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Packages (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

Description

MULTI-FUNCTIONAL INGESTER SYSTEM FOR ADDITIVE MANUFACTURING CROSS -REFERENCE TO RELATED PATENT APPLICATION
[1] The present disclosure is part of a non-provisional patent application claiming the priority benefit of
[2] U.S. Patent Application No. 62/248,758, filed on October 30, 2015,
[3] U.S. Patent Application No. 62/248,765, filed on October 30, 2015,
[4] U.S. Patent Application No. 62/248,770, filed on October 30, 2015,
[5] U.S. Patent Application No. 62/248,776, filed on October 30, 2015,
[6] U.S. Patent Application No. 62/248,783, filed on October 30, 2015,
[7] U.S. Patent Application No. 62/248,791, filed on October 30, 2015,
[8] U.S. Patent Application No. 62/248,799, filed on October 30, 2015,
[9] U.S. Patent Application No. 62/248,966, filed on October 30, 2015,
[10] U s. Patent Application No. 62/248,968, filed on October 30, 2015,
[Π] U s. Patent Application No. 62/248,969, filed on October 30, 2015,
[12] u s. Patent Application No. 62/248,980, filed on October 30, 2015,
[13] u s. Patent Application No. 62/248,989, filed on October 30, 2015,
[14] u s. Patent Application No. 62/248,780, filed on October 30, 2015,
[15] u s. Patent Application No. 62/248,787, filed on October 30, 2015,
[16] u s. Patent Application No. 62/248,795, filed on October 30, 2015,
[17] u s. Patent Application No. 62/248,821, filed on October 30, 2015,
[18] u s. Patent Application No. 62/248,829, filed on October 30, 2015,
[19] u s. Patent Application No. 62/248,833, filed on October 30, 2015,
[20] u s. Patent Application No. 62/248,835, filed on October 30, 2015,
[21] u s. Patent Application No. 62/248,839, filed on October 30, 2015,
[22] u s. Patent Application No. 62/248,841, filed on October 30, 2015,
[23] u s. Patent Application No. 62/248,847, filed on October 30, 2015, and
[24] u s. Patent Application No. 62/248,848, filed on October 30, 2015, which are
incorporated by reference in its entirety. TECHNICAL FIELD
[25] The present disclosure generally relates to three-dimensional (3D) powder bed fusion additive manufacturing and, more particularly, to in-process (in real-time or in- situ) collection and sampling of powdered materials during a print cycle.
BACKGROUND
[26] In 3D powder bed fusion additive manufacturing, known sourced and designated powders are preferred or required. This may be motivated by a number of reasons including (1) better print quality due to the powdered material meeting specifications tailored to the specific printer, (2) better audit trail of the powdered material composition and higher probability that it is free of defects, (3) protection of the printer from contaminants which might break the printer or cause more warranty repair, or (4) higher revenues and margins from sales of designated powdered materials. Interests of customers and powder suppliers may diverge when customers wish to use non-authorized powdered materials in a given printer. Furthermore, if a powdered material is re-used, characteristics of the powdered material could change overtime such as particle size distribution and density. The elemental/alloy composition of a powdered material due to thermal cycling and oxidation may be altered during a print cycle. To most accurately account for these changes of a powdered material, the powder bed fusion additive manufacturing process may need to be adjusted periodically during a print process to improve the quality of printed objects.
BRIEF DESCRIPTION OF THE DRAWINGS
[27] Non-limiting and non-exhaustive embodiments of the present disclosure are
described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various figures unless otherwise specified.
[28] FIG. 1 A illustrates an additive manufacturing system;
[29] FIG. IB is a top view of a structure being formed on an additive manufacturing system;
[30] FIG. 2 illustrates an additive manufacturing method; [31] FIG. 3 A is a cartoon illustrating an additive manufacturing system including lasers;
[32] FIG. 3B is a detailed description of the light patterning unit shown in FIG. 3A.;
[33] FIG. 3C is one embodiment of an additive manufacturing system with a
"switchyard" for directing and repatterning light using multiple image relays;
[34] FIG. 3D illustrates a simple mirror image pixel remapping;
[35] FIG. 3E illustrates a series of image transforming image relays for pixel
remapping; FIG. 3F illustrates an patternable electron energy beam additive manufacturing system;
[36] FIG. 3G illustrates a detailed description of the electron beam patterning unit shown in FIG. 3F;
[37] FIG. 4 is a block diagram depicting an example apparatus of an ingester system in accordance with an embodiment of the present disclosure.
[38] FIG. 5 is a flowchart depicting an example process of in-process collection and sampling of powder samples in accordance with an embodiment of the present disclosure.
[39] FIG. 6 is an example implementation of an ingester system used in powder bed fusion additive manufacturing in accordance with an embodiment of the present disclosure.
DETAILED DESCRIPTION
[40] In the following description, reference is made to the accompanying drawings that form a part thereof, and in which is shown by way of illustrating specific exemplary embodiments in which the disclosure may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the concepts disclosed herein, and it is to be understood that modifications to the various disclosed embodiments may be made, and other embodiments may be utilized, without departing from the scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense.
[41] The present disclosure describes an ingester system used in powder bed fusion additive manufacturing that collects in-process (in real-time or in-situ) powder samples and performs a set of characterizations on the powder samples. [42] In various embodiments in accordance with the present disclosure, an ingester system may collect powder samples periodically at a predetermined interval during a print process. The powder samples may be stored for analysis later or may be
characterized in real-time to understand changes of characteristics of the powders during the print process. The characterization results may determine whether to abort the print process or adjust printing parameters associated with powder bed fusion additive printing.
[43] In some embodiments, powder samples may be collected and stored for later off- site analysis. This approach may help with diagnostics on properties of the printed object, audit of powder quality, consistency from powder suppliers as well as potential contract violation(s) by a customer using unauthorized powdered materials on the printer.
[44] In another embodiment, a method of identifying unlicensed powder usage in an additive manufacturing system involves collecting a plurality of powder samples of a powdered material in real-time during a print job. The collected powder samples are used for audit and authorization by performing at least one of the following steps: i) storing the collected powder samples for later characterization; and ii) immediately characterizing the powder samples to determine whether to abort the print job according to a result of the set of characterizations.
[45] An additive manufacturing system is disclosed which has one or more energy sources, including in one embodiment, one or more laser or electron beams, positioned to emit one or more energy beams. Beam shaping optics may receive the one or more energy beams from the energy source and form a single beam. An energy patterning unit receives or generates the single beam and transfers a two-dimensional pattern to the beam, and may reject the unused energy not in the pattern. An image relay receives the two-dimensional patterned beam and focuses it as a two-dimensional image to a desired location on a height fixed or movable build platform (e.g. a powder bed). In certain embodiments, some or all of any rejected energy from the energy patterning unit is reused.
[46] In some embodiments, multiple beams from the laser array(s) are combined using a beam homogenizer. This combined beam can be directed at an energy patterning unit that includes either a transmissive or reflective pixel addressable light valve. In one embodiment, the pixel addressable light valve includes both a liquid crystal module having a polarizing element and a light projection unit providing a two-dimensional input pattern. The two-dimensional image focused by the image relay can be sequentially directed toward multiple locations on a powder bed to build a 3D structure.
[47] As seen in FIG. 1, an additive manufacturing system 100 has an energy patterning system 110 with an energy source 112 that can direct one or more continuous or intermittent energy beam(s) toward beam shaping optics 114. After shaping, if necessary, the beam is patterned by an energy patterning unit 116, with generally some energy being directed to a rejected energy handling unit 118. Patterned energy is relayed by image relay 120 toward an article processing unit 140, typically as a two-dimensional image 122 focused near a bed 146. The bed 146 (with optional walls 148) can form a chamber containing material 144 dispensed by material dispenser 142. Patterned energy, directed by the image relay 120, can melt, fuse, sinter, amalgamate, change crystal structure, influence stress patterns, or otherwise chemically or physically modify the dispensed material 144 to form structures with desired properties.
[48] Energy source 112 generates photon (light), electron, ion, or other suitable energy beams or fluxes capable of being directed, shaped, and patterned. Multiple energy sources can be used in combination. The energy source 112 can include lasers, incandescent light, concentrated solar, other light sources, electron beams, or ion beams. Possible laser types include, but are not limited to: Gas Lasers, Chemical Lasers, Dye Lasers, Metal Vapor Lasers, Solid State Lasers (e.g. fiber), Semiconductor (e.g. diode) Lasers, Free electron laser, Gas dynamic laser, "Nickel-like" Samarium laser, Raman laser, or Nuclear pumped laser.
[49] A Gas Laser can include lasers such as a Helium-neon laser, Argon laser,
Krypton laser, Xenon ion laser, Nitrogen laser, Carbon dioxide laser, Carbon monoxide laser or Excimer laser.
[50] A Chemical laser can include lasers such as a Hydrogen fluoride laser, Deuterium fluoride laser, COIL (Chemical oxygen-iodine laser), or Agil (All gas-phase iodine laser).
[51] A Metal Vapor Laser can include lasers such as a Helium-cadmium (HeCd)
metal-vapor laser, Helium-mercury (HeHg) metal-vapor laser, Helium-selenium (HeSe) metal-vapor laser, Helium-silver (HeAg) metal-vapor laser, Strontium Vapor Laser, Neon-copper (NeCu) metal-vapor laser, Copper vapor laser, Gold vapor laser, or Manganese (Mn/MnCl2) vapor laser.
[52] A Solid State Laser can include lasers such as a Ruby laser, Nd: YAG laser,
NdCrYAG laser, Er: YAG laser, Neodymium YLF (Nd: YLF) solid-state laser,
Neodymium doped Yttrium orthovanadate(Nd: YV04) laser, Neodymium doped yttrium calcium oxoborateNd:YCa40(B03)3 or simply Nd:YCOB, Neodymium glass(Nd:Glass) laser, Titanium sapphire(Ti: sapphire) laser, Thulium YAG (Tm:YAG) laser, Ytterbium YAG (Yb:YAG) laser, Ytterbium:203 (glass or ceramics) laser, Ytterbium doped glass laser (rod, plate/chip, and fiber), Holmium YAG (Ho: YAG) laser, Chromium ZnSe (CnZnSe) laser, Cerium doped lithium strontium (or calcium)aluminum
fluoride(Ce:LiSAF, Ce:LiCAF), Promethium 147 doped phosphate glass(147Pm+3: Glass) solid-state laser, Chromium doped chrysoberyl (alexandrite) laser, Erbium doped anderbium-ytterbium co-doped glass lasers, Trivalent uranium doped calcium fluoride (U:CaF2) solid-state laser, Divalent samarium doped calcium fluoride(Sm:CaF2) laser, or F -Center laser.
[53] A Semiconductor Laser can include laser medium types such as GaN, InGaN,
AlGalnP, AlGaAs, InGaAsP, GalnP, InGaAs, InGaAsO, GalnAsSb, lead salt, Vertical cavity surface emitting laser (VCSEL), Quantum cascade laser, Hybrid silicon laser, or combinations thereof.
[54] For example, in one embodiment a single Nd: YAG q-switched laser can be used in conjunction with multiple semiconductor lasers. In another embodiment, an electron beam can be used in conjunction with an ultraviolet semiconductor laser array. In still other embodiments, a two-dimensional array of lasers can be used. In some embodiments with multiple energy sources, pre-patterning of an energy beam can be done by selectively activating and deactivating energy sources.
[55] Beam shaping unit 114 can include a great variety of imaging optics to combine, focus, diverge, reflect, refract, homogenize, adjust intensity, adjust frequency, or otherwise shape and direct one or more energy beams received from the energy source 112 toward the energy patterning unit 116. In one embodiment, multiple light beams, each having a distinct light wavelength, can be combined using wavelength selective mirrors (e.g. dichroics) or diffractive elements. In other embodiments, multiple beams can be homogenized or combined using multifaceted mirrors, microlenses, and refractive or diffractive optical elements.
[56] Energy patterning unit 116 can include static or dynamic energy patterning
elements. For example, photon, electron, or ion beams can be blocked by masks with fixed or movable elements. To increase flexibility and ease of image patterning, pixel addressable masking, image generation, or transmission can be used. In some
embodiments, the energy patterning unit includes addressable light valves, alone or in conjunction with other patterning mechanisms to provide patterning. The light valves can be transmissive, reflective, or use a combination of transmissive and reflective elements. Patterns can be dynamically modified using electrical or optical addressing. In one embodiment, a transmissive optically addressed light valve acts to rotate polarization of light passing through the valve, with optically addressed pixels forming patterns defined by a light projection source. In another embodiment, a reflective optically addressed light valve includes a write beam for modifying polarization of a read beam. In yet another embodiment, an electron patterning device receives an address pattern from an electrical or photon stimulation source and generates a patterned emission of electrons.
[57] Rejected energy handling unit 118 is used to disperse, redirect, or utilize energy not patterned and passed through the energy pattern image relay 120. In one embodiment, the rejected energy handling unit 118 can include passive or active cooling elements that remove heat from the energy patterning unit 116. In other embodiments, the rejected energy handling unit can include a "beam dump" to absorb and convert to heat any beam energy not used in defining the energy pattern. In still other embodiments, rejected beam energy can be recycled using beam shaping optics 114. Alternatively, or in addition, rejected beam energy can be directed to the article processing unit 140 for heating or further patterning. In certain embodiments, rejected beam energy can be directed to additional energy patterning systems or article processing units.
[58] Image relay 120 receives a patterned image (typically two-dimensional) from the energy patterning unit 116 and guides it toward the article processing unit 140. In a manner similar to beam shaping optics 114, the image relay 120 can include optics to combine, focus, diverge, reflect, refract, adjust intensity, adjust frequency, or otherwise shape and direct the patterned image. [59] Article processing unit 140 can include a walled chamber 148 and bed 144, and a material dispenser 142 for distributing material. The material dispenser 142 can distribute, remove, mix, provide gradations or changes in material type or particle size, or adjust layer thickness of material. The material can include metal, ceramic, glass, polymeric powders, other melt-able material capable of undergoing a thermally induced phase change from solid to liquid and back again, or combinations thereof. The material can further include composites of melt-able material and non-melt-able material where either or both components can be selectively targeted by the imaging relay system to melt the component that is melt-able, while either leaving along the non-melt-able material or causing it to undergo a vaporizing/destroying/combusting or otherwise destructive process. In certain embodiments, slurries, sprays, coatings, wires, strips, or sheets of materials can be used. Unwanted material can be removed for disposable or recycling by use of blowers, vacuum systems, sweeping, vibrating, shaking, tipping, or inversion of the bed 146.
[60] In addition to material handling components, the article processing unit 140 can include components for holding and supporting 3D structures, mechanisms for heating or cooling the chamber, auxiliary or supporting optics, and sensors and control mechanisms for monitoring or adjusting material or environmental conditions. The article processing unit can, in whole or in part, support a vacuum or inert gas atmosphere to reduce unwanted chemical interactions as well as to mitigate the risks of fire or explosion (especially with reactive metals).
[61] Control processor 150 can be connected to control any components of additive manufacturing system 100. The control processor 150 can be connected to variety of sensors, actuators, heating or cooling systems, monitors, and controllers to coordinate operation. A wide range of sensors, including imagers, light intensity monitors, thermal, pressure, or gas sensors can be used to provide information used in control or monitoring. The control processor can be a single central controller, or alternatively, can include one or more independent control systems. The controller processor 150 is provided with an interface to allow input of manufacturing instructions. Use of a wide range of sensors allows various feedback control mechanisms that improve quality, manufacturing throughput, and energy efficiency. [62] FIG. IB is a cartoon illustrating a bed 146 that supports material 144. Using a series of sequentially applied, two-dimensional patterned energy beam images (squares in dotted outline 124), a structure 149 is additively manufactured. As will be understood, image patterns having non-square boundaries can be used, overlapping or
interpenetrating images can be used, and images can be provided by two or more energy patterning systems. In other embodiments, images can be formed in conjunction with directed electron or ion beams, or with printed or selective spray systems.
[63] FIG. 2 is a flow chart illustrating one embodiment of an additive manufacturing process supported by the described optical and mechanical components. In step 202, material is positioned in a bed, chamber, or other suitable support. The material can be a powder capable of being melted, fused, sintered, induced to change crystal structure, have stress patterns influenced, or otherwise chemically or physically modified to form structures with desired properties.
[64] In step 204, unpatterned energy is emitted by one or more energy emitters,
including but not limited to solid state or semiconductor lasers, or electrical power supply flowing electrons down a wire. In step 206, the unpatterned energy is shaped and modified (e.g. intensity modulated or focused). In step 208, this unpatterned energy is patterned, with energy not forming a part of the pattern being handled in step 210 (this can include conversion to waste heat, or recycling as patterned or unpatterned energy). In step 212, the patterned energy, now forming a two-dimensional image is relayed toward the material. In step 214, the image is applied to the material, building a portion of a 3D structure. These steps can be repeated (loop 218) until the image (or different and subsequent image) has been applied to all necessary regions of a top layer of the material. When application of energy to the top layer of the material is finished, a new layer can be applied (loop 216) to continue building the 3D structure. These process loops are continued until the 3D structure is complete, when remaining excess material can be removed or recycled.
[65] FIG. 3A is one embodiment of an additive manufacturing system 300 that uses multiple semiconductor lasers as part of an energy patterning system 310. A control processor 350 can be connected to variety of sensors, actuators, heating or cooling systems, monitors, and controllers to coordinate operation of multiple lasers 312, light patterning unit 316, and image relay 320, as well as any other component of system 300. These connections are generally indicated by a dotted outline 351 surrounding components of system 300. As will be appreciated, connections can be wired or wireless, continuous or intermittent, and include capability for feedback (for example, thermal heating can be adjusted in response to sensed temperature). The multiple lasers 312 can emit a beam 301 of light at a 1000 nm wavelength that, for example, is 90 mm wide by 20 mm tall. The beam 301 is resized by imaging optics 370 to create beam 303. Beam 303 is 6 mm wide by 6mm tall, and is incident on light homogenization device 372 which blends light together to create blended beam 305. Beam 305 is then incident on imaging assembly 374 which reshapes the light into beam 307 and is then incident on hot cold mirror 376. The mirror 376 allows 1000 nm light to pass, but reflects 450nm light. A light projector 378 capable of projecting low power light at 1080p pixel resolution and 450nm emits beam 309, which is then incident on hot cold mirror 376. Beams 307 and 309 overlay in beam 311, and both are imaged onto optically addressed light valve 380 in a 20mm wide, 20mm tall image. Images formed from the homogenizer 372 and the projector 378 are recreated and overlaid on light valve 380.
[66] The optically addressed light valve 380 is stimulated by the light (typically
ranging from 400-500 nm) and imprints a polarization rotation pattern in transmitted beam 313 which is incident upon polarizer 382. The polarizer 382 splits the two polarization states, transmitting p-polarization into beam 317 and reflecting s-polarization into beam 315 which is then sent to a beam dump 318 that handles the rejected energy. As will be understood, in other embodiments the polarization could be reversed, with s- polarization formed into beam 317 and reflecting p-polarization into beam 315. Beam 317 enters the final imaging assembly 320 which includes optics 384 that resize the patterned light. This beam reflects off of a movable mirror 386 to beam 319, which terminates in a focused image applied to material bed 344 in an article processing unit 340. The depth of field in the image selected to span multiple layers, providing optimum focus in the range of a few layers of error or offset.
[67] The bed 390 can be raised or lowered (vertically indexed) within chamber walls
388 that contain material 344 dispensed by material dispenser 342. In certain
embodiments, the bed 390 can remain fixed, and optics of the final imaging assembly 320 can be vertically raised or lowered. Material distribution is provided by a sweeper mechanism 392 that can evenly spread powder held in hopper 394, being able to provide new layers of material as needed. An image 6 mm wide by 6 mm tall can be sequentially directed by the movable mirror 386 at different positions of the bed.
[68] When using a powdered ceramic or metal material in this additive manufacturing system 300, the powder can be spread in a thin layer, approximately 1-3 particles thick, on top of a base substrate (and subsequent layers) as the part is built. When the powder is melted, sintered, or fused by a patterned beam 319, it bonds to the underlying layer, creating a solid structure. The patterned beam 319 can be operated in a pulsed fashion at 40 Hz, moving to the subsequent 6 mm x 6 mm image locations at intervals of 10 ms to 0.5 ms (with 3 to 0.1 ms being desirable) until the selected patterned areas of powder have been melted. The bed 390 then lowers itself by a thickness corresponding to one layer, and the sweeper mechanism 392 spreads a new layer of powdered material. This process is repeated until the 2D layers have built up the desired 3D structure. In certain embodiments, the article processing unit 340 can have a controlled atmosphere. This allows reactive materials to be manufactured in an inert gas, or vacuum environment without the risk of oxidation or chemical reaction, or fire or explosion (if reactive metals are used).
[69] FIG. 3B illustrates in more detail operation of the light patterning unit 316 of FIG.
3A. As seen in FIG. 3B, a representative input pattern 333 (here seen as the numeral "9") is defined in an 8x12 pixel array of light projected as beam 309 toward mirror 376. Each grey pixel represents a light filled pixel, while white pixels are unlit. In practice, each pixel can have varying levels of light, including light-free, partial light intensity, or maximal light intensity. Unpatterned light 331 that forms beam 307 is directed and passes through a hot/cold mirror 376, where it combines with patterned beam 309. After reflection by the hot/cold mirror 376, the patterned light beam 311 formed from overlay of beams 307 and 309 in beam 311, and both are imaged onto optically addressed light valve 380. The optically addressed light valve 380, which would rotate the polarization state of unpatterned light 331, is stimulated by the patterned light beam 309, 311 to selectively not rotate the polarization state of polarized light 307, 311 in the pattern of the numeral "9" into beam 313. The unrotated light representative of pattern 333 in beam 313 is then allowed to pass through polarizer mirror 382 resulting in beam 317 and pattern 335. Polarized light in a second rotated state is rejected by polarizer mirror 382, into beam 315 carrying the negative pixel pattern 337 consisting of a light-free numeral "9".
[70] Other types of light valves can be substituted or used in combination with the described light valve. Reflective light valves, or light valves base on selective diffraction or refraction can also be used. In certain embodiments, non-optically addressed light valves can be used. These can include but are not limited to electrically addressable pixel elements, movable mirror or micro-mirror systems, piezo or micro-actuated optical systems, fixed or movable masks, or shields, or any other conventional system able to provide high intensity light patterning. For electron beam patterning, these valves may selectively emit electrons based on an address location, thus imbuing a pattern on the beam of electrons leaving the valve.
[71] FIG. 3C is one embodiment of an additive manufacturing system that includes a switchyard system enabling reuse of patterned two-dimensional energy. Similar to the embodiment discussed with respect to FIG. 1 A, an additive manufacturing system 220 has an energy patterning system with an energy source 112 that directs one or more continuous or intermittent energy beam(s) toward beam shaping optics 114. After shaping, the beam is two-dimensionally patterned by an energy patterning unit 230, with generally some energy being directed to a rejected energy handling unit 222. Patterned energy is relayed by one of multiple image relays 232 toward one or more article processing units 234A, 234B, 234C, or 234D, typically as a two-dimensional image focused near a movable or fixed height bed. The bed (with optional walls) can form a chamber containing material dispensed by material dispenser. Patterned energy, directed by the image relays 232, can melt, fuse, sinter, amalgamate, change crystal structure, influence stress patterns, or otherwise chemically or physically modify the dispensed material to form structures with desired properties.
[72] In this embodiment, the rejected energy handling unit has multiple components to permit reuse of rejected patterned energy. Relays 228A, 228B, and 22C can respectively transfer energy to an electricity generator 224, a heat/cool thermal management system 225, or an energy dump 226. Optionally, relay 228C can direct patterned energy into the image relay 232 for further processing. In other embodiments, patterned energy can be directed by relay 228C, to relay 228B and 228A for insertion into the energy beam(s) provided by energy source 112. Reuse of patterned images is also possible using image relay 232. Images can be redirected, inverted, mirrored, sub-patterned, or otherwise transformed for distribution to one or more article processing units. 234A-D.
Advantageously, reuse of the patterned light can improve energy efficiency of the additive manufacturing process, and in some cases improve energy intensity directed at a bed, or reduce manufacture time.
[73] FIG. 3D is a cartoon 235 illustrating a simple geometrical transformation of a rejected energy beam for reuse. An input pattern 236 is directed into an image relay 237 capable of providing a mirror image pixel pattern 238. As will be appreciated, more complex pixel transformations are possible, including geometrical transformations, or pattern remapping of individual pixels and groups of pixels. Instead of being wasted in a beam dump, this remapped pattern can be directed to an article processing unit to improve manufacturing throughput or beam intensity.
[74] FIG. 3E is a cartoon 235 illustrating multiple transformations of a rejected energy beam for reuse. An input pattern 236 is directed into a series of image relays 237B-E capable of providing a pixel pattern 238.
[75] FIG. 3F and 3G illustrates a non-light based energy beam system 240 that
includes a patterned electron beam 241 capable of producing, for example, a "P" shaped pixel image. A high voltage electricity power system 243 is connected to an optically addressable patterned cathode unit 245. In response to application of a two-dimensional patterned image by projector 244, the cathode unit 245 is stimulated to emit electrons wherever the patterned image is optically addressed. Focusing of the electron beam pattern is provided by an image relay system 247 that includes imaging coils 246A and 246B. Final positioning of the patterned image is provided by a deflection coil 248 that is able to move the patterned image to a desired position on a bed of additive manufacturing component 249.
[76] In another embodiment supporting light recycling and reuse, multiplex multiple beams of light from one or more light sources are provided. The multiple beams of light may be reshaped and blended to provide a first beam of light. A spatial polarization pattern may be applied on the first beam of light to provide a second beam of light. Polarization states of the second beam of light may be split to reflect a third beam of light, which may be reshaped into a fourth beam of light. The fourth beam of light may be introduced as one of the multiple beams of light to result in a fifth beam of light. In effect, this or similar systems can reduce energy costs associated with an additive manufacturing system. By collecting, beam combining, homogenizing and reintroducing unwanted light rejected by a spatial polarization valve or light valve operating in polarization modification mode, overall transmitted light power can potentially be unaffected by the pattern applied by a light valve. This advantageously results in an effective re-distribution of the light passing through the light valve into the desired pattern, increasing the light intensity proportional to the amount of area patterned.
[77] Combining beams from multiple lasers into a single beam is one way to
increasing beam intensity. In one embodiment, multiple light beams, each having a distinct light wavelength, can be combined using either wavelength selective mirrors or diffractive elements. In certain embodiments, reflective optical elements that are not sensitive to wavelength dependent refractive effects can be used to guide a
multiwavelength beam.
[78] Patterned light can be directed using movable mirrors, prisms, diffractive optical elements, or solid state optical systems that do not require substantial physical movement. In one embodiment, a magnification ratio and an image distance associated with an intensity and a pixel size of an incident light on a location of a top surface of a powder bed can be determined for an additively manufactured, three-dimensional (3D) print job. One of a plurality of lens assemblies can be configured to provide the incident light having the magnification ratio, with the lens assemblies both a first set of optical lenses and a second sets of optical lenses, and with the second sets of optical lenses being swappable from the lens assemblies. Rotations of one or more sets of mirrors mounted on compensating gantries and a final mirror mounted on a build platform gantry can be used to direct the incident light from a precursor mirror onto the location of the top surface of the powder bed. Translational movements of compensating gantries and the build platform gantry are also able to ensure that distance of the incident light from the precursor mirror to the location of the top surface of the powder bed is substantially equivalent to the image distance. In effect, this enables a quick change in the optical beam delivery size and intensity across locations of a build area for different powdered materials while ensuring high availability of the system.
[79] In certain embodiments, a plurality of build chambers, each having a build
platform to hold a powder bed, can be used in conjunction with multiple optical- mechanical assemblies arranged to receive and direct the one or more incident energy beams into the build chambers. Multiple chambers allow for concurrent printing of one or more print jobs inside one or more build chambers. In other embodiments, a removable chamber sidewall can simplify removal of printed objects from build chambers, allowing quick exchanges of powdered materials. The chamber can also be equipped with an adjustable process temperature controls.
[80] In another embodiment, one or more build chambers can have a build chamber that is maintained at a fixed height, while optics are vertically movable. A distance between final optics of a lens assembly and a top surface of powder bed a may be managed to be essentially constant by indexing final optics upwards, by a distance equivalent to a thickness of a powder layer, while keeping the build platform at a fixed height. Advantageously, as compared to a vertically moving the build platform, large and heavy objects can be more easily manufactured, since precise micron scale movements of the build platform are not needed. Typically, build chambers intended for metal powders with a volume more than ~ 0.1 - 0.2 cubic meters (i.e., greater than 100 - 200 liters or heavier than 500 - 1,000 kg) will most benefit from keeping the build platform at a fixed height.
[81] In one embodiment, a portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform. In selected embodiments, a fluid passageway can be formed in the one or more first walls to enable improved thermal management.
[82] Improved powder handling can be another aspect of an improved additive
manufacturing system. A build platform supporting a powder bed can be capable of tilting, inverting, and shaking to separate the powder bed substantially from the build platform in a hopper. The powdered material forming the powder bed may be collected in a hopper for reuse in later print jobs. The powder collecting process may be automated, and vacuuming or gas jet systems also used to aid powder dislodgement and removal
[83] Some embodiments of the disclosed additive manufacturing system can be
configured to easily handle parts longer than an available chamber. A continuous (long) part can be sequentially advanced in a longitudinal direction from a first zone to a second zone. In the first zone, selected granules of a granular material can be amalgamated. In the second zone, unamalgamated granules of the granular material can be removed. The first portion of the continuous part can be advanced from the second zone to a third zone, while a last portion of the continuous part is formed within the first zone and the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone. In effect, additive manufacture and clean-up (e.g., separation and/or reclamation of unused or
unamalgamated granular material) may be performed in parallel (i.e., at the same time) at different locations or zones on a part conveyor, with no need to stop for removal of granular material and/or parts.
[84] In another embodiment, additive manufacturing capability can be improved by use of an enclosure restricting an exchange of gaseous matter between an interior of the enclosure and an exterior of the enclosure. An airlock provides an interface between the interior and the exterior; with the interior having multiple additive manufacturing chambers, including those supporting power bed fusion. A gas management system maintains gaseous oxygen within the interior at or below a limiting oxygen concentration, increasing flexibility in types of powder and processing that can be used in the system.
[85] In another manufacturing embodiment, capability can be improved by having a
3D printer contained within an enclosure, the printer able to create a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure at concentrations below the atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, since the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock. [86] Other manufacturing embodiments involve collecting powder samples in realtime in a powder bed fusion additive manufacturing system. An ingester system is used for in-process collection and characterizations of powder samples. The collection may be performed periodically and the results of characterizations result in adjustments to the powder bed fusion process. The ingester system can optionally be used for one or more of audit, process adjustments or actions such as modifying printer parameters or verifying proper use of licensed powder materials.
[87] Yet another improvement to an additive manufacturing process can be provided by use of a manipulator device such as a crane, lifting gantry, robot arm, or similar that allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator device can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.
[88] FIG. 4 is a block diagram illustrating an example apparatus 400 including ingester system 410 in accordance with an embodiment of the present disclosure. Ingester system 410 may perform various functions related to techniques, methods and systems described herein, including those described below with respect to process 500 and implementation 600. Ingester system 410 may be installed in, equipped on, connected to or otherwise implemented in a powder bed fusion additive manufacturing system (such as that shown in FIGS. 1 A, IB, 2, 3A and 3B) to effect various embodiments in accordance with the present disclosure. Ingester system 410 may include at least some of the components illustrated in FIG. 4.
[89] In some embodiments, ingester system 410 may involve ingester 420 collecting powder samples of a powdered material during powder bed fusion additive
manufacturing. The powdered material may include metal, ceramic, plastic powders, or other suitable powders able to bond together while subjected to a thermal energy. The collection of powder samples may be performed periodically at a predetermined interval. The powder samples may be collected or taken by ingester 420 from the powder bed or the powder distribution system such as powder dispensing assembly 470. A mechanical assembly such as a scoop, diverter, or mechanical arm may be used to collect or pick up powder samples at predetermined locations. [90] In some embodiments, ingester system 410 may include storage container 450 capable of packaging the powder samples in a plurality of sample canister 460(1) - 460(N), with N being a positive integer greater than 0. The sample canister 460(1) - 460(N) may be stored for analyses that may not be suitable for in-process (in real-time or in-situ) characterization or for auditing purposes later. Storage container 450 may be capable of packaging powder samples in an atmosphere substantially equivalent to an in- process atmosphere inside sample canister 460(1) - 460(N). The atmosphere may be air or an inert gas such as nitrogen, argon or helium.
[91] In some embodiments, ingester system 410 may include test suite 430 capable of performing test 440(1) - 440(K), with K being a positive integer. Test suite 430 may be a collection of instruments having capabilities to perform one or more tests of test 440(1) - 440(K). For example, the collection of instruments may include dilatometer, flash diffusivity analyzer, gas chromatography mass spectrometry, gas pycnometer, inclinometer, particle size analyzer, particle shape analyzer, profilometer, scale, spectrometer, thermometer, tintometer, or other instruments capable of measuring properties or qualities of powders. Test 440(1) - 440(K) may perform characterizations of powder samples on one or more specific properties respectively. The one or more specific properties of powder samples may include thermal diffusivity, density, surface roughness, weight, emissivity, absorptivity, reflectance, transmissivity, temperature, color, and particle size distribution. The one or more qualities of powder samples may include uniformity of particle size, uniformity of composition, or uniformity of surface roughness. Some powdered materials may have undergone undesired changes after a print cycle with inadequate processing conditions or thermal cycles. The inadequate processing conditions may include non-uniform thicknesses of a powder layer dispensed by powder dispensing assembly 470, an excessive temperature of a powder bed caused by an overheating of build platform 490, or an incident beam having an intensity too high. The results of characterization may be used to adjust printing parameters during a print process to improve print quality. The printing parameters may include a rate of dispensing to control a thickness uniformity, a temperature of built platform 490, and an intensity or dwell time (duration) of an incident beam to control a dimension, a pulse shape of energy source incident on the powder material modulated over time and position on the bed, and one or more specific electrical, mechanical, or optical properties of a printed object.
[92] In some embodiments, the result of characterizations performed by Test 440(1) -
440(K) may indicate significant alternation of one or more powder properties and beyond the range of workable specifications. The print process may be aborted in such conditions.
[93] Ingester system 410 may include processor 401 and memory 402. Processor 401 may be coupled to memory 402 to access data stored therein and to execute any programs/instructions stored therein. Processor 701 may control ingester system 410 performing powder sample collection at a predetermined interval. Processor 401 may execute instructions as to which test of test 440(1) - 440(K) in test suite 430 may be performed. Processor 401 may further control storage container 450 packaging the powder samples in sample canister 460(1) - 460(N). The result of test 440(1) - 440(K) may be stored in memory 402.
[94] Example apparatus 400 may include components of a powder bed fusion additive manufacturing system such as powder dispensing assembly 470, print head 480, and build platform 490. Powder dispensing assembly 470 may dispense a plurality of layers of a powdered material to form a powder bed supported by build platform 490. Print head 480 may include an energy source (e.g., fiber laser or diode laser) capable of providing a light beam of sufficient energy to melt/sinter the powdered material. Build platform 490 may have resistive heating elements inside to control a temperature of a powder bed formed by layers of a powdered material. Processor 401 may control powder dispensing assembly 470, print head 480, and build platform 490 in response to characterization results of powder samples by ingester system 410 during a print process.
[95] FIG. 5 illustrates an example process 500 of collecting and characterizing powder samples of a powdered material during a print process. Process 500 may be utilized to collect the powder samples from a powder bed or a powder distribution assembly, and characterizing the powder samples in real-time in a test suite in accordance with the present disclosure. Process 500 may include one or more operations, actions, or functions shown as blocks such as 510, 520, 530, and 540. Although illustrated as discrete blocks, various blocks of process 500 may be divided into additional blocks, combined into fewer blocks, or eliminated, depending on the desired implementation, and may be performed or otherwise carried out in an order different from that shown in FIG. 5. Process 500 may be implemented in example implementation 600, and may be implemented by example apparatus 400 described above. For illustrative purposes and without limiting the scope, the following description of process 500 is provided in the context of example implementation 600 as being implemented by example apparatus 400. Process 500 may begin with block 510.
[96] At 510, process 500 may involve processor 401 of example apparatus 400
controlling ingester 420 to collect a plurality of powder samples of a powdered material in forming a printed object during a print cycle. The powdered material may include metal, ceramic, plastic powders, or other suitable powders able to bond together while subjected to a thermal energy. At 510, processor 401 may instruct ingester 420 collecting powder samples periodically at a predetermined interval or randomly or at predetermined stages during a print process. For example, processor 401 may instruct ingester 420 to collect powder samples at every 10-minute interval or only at l/5th and 4/5th completion of a print process. Ingester 420 may have a mechanism for diverting incoming powder from a powder bed or powder dispensing assembly 470 of example apparatus 400.
Ingester 420 may also control an amount of powders being diverted, depending how many tests are required for analysis. Process 500 may proceed from 510 to 520.
[97] At 520, process 500 may involve processor 401 controlling test suite 430 to
perform one or more tests of test 440(1) - 440(K). In some embodiments, one or more specific properties of a powdered material may need to be tightly controlled within a certain range to guarantee the mechanical, electrical, or optical properties of the printed object. In other embodiments, characteristics of powders during a print process may need to be retained for auditing purposes. Test suite 430 may include instruments having capabilities to perform one or more tests of test 440(1) - 440(K). For illustrating purposes and without limitation, test 440(1) may measure a distribution of powder sizes by particle size analyzer; test 440(2) may measure a density of powder samples by pycnometer; test 440(3) may identify substances within the powder samples by gas chromatography mass spectrometry. Some example instruments for the possible test suite 430 along with the types of data gathered or property measured are listed, but are not limited to, in the table below. Process 500 may proceed from 520 to 530.
Figure imgf000023_0001
[98] At 530, process 500 may involve processor 401 determining whether to modify a set of printing parameters employed for the print process or whether to abort the print process according to a result characterization from test 440(1) - 440(K). The
determination may include computer simulations by processor 401 based on a set of models using results of the characterizations as input. Powder samples may have undergone undesired changes for powders without certification or inadequate processing conditions. Test 440(1) - 440(K) may provide a real-time feedback on the properties of powders during the print process. Processor 401 may determine to modify one or more printing parameters according characterization results of test 440(1) - 440(K). For example, processor 401 may increase or decrease the incident beam intensity provided by print head 480 when gas pycnometer measures a deviation of specified powder density which may affect the energy per unit volume required to melt or sinter the powders. Processor 401 may also control dwell time of the incident beam provided by print head 480 or a thickness of powder layer dispensed by powder dispensing assembly 470 to adjust for the energy requirement change. The temperature of build platform 490 may be controlled to alleviate burden of the energy source by processor 401. If the deviation of the energy per unit volume to the specified powder density is too large, processor 401 may determine to abort the print process since the energy source inside print head 480 may not meet the requirement to melt the powders. In another example, contaminations within powder samples may be detected by gas chromatography mass spectroscopy, which may affect one or more electrical, mechanical and optical properties of the printed object. Thus, processor 401 may determine to abort the print process in such situations. In still other embodiments, the print process can be stopped if characterization results indicate usage of unlicensed powders or dangerous powders, including unlicensed powders likely to result in inferior additive manufacturing results. The characterization results of test 440(1) - 440(K) may be stored in memory 402.
[99] In some embodiments, prediction of final print quality based on the results of in- process (in real-time or in-situ) characterizations of powder samples may be performed by simulations using a set of models. For example, dimensional controls of the printed object may rely on a resolution of the incident beam and a temperature gradient of powders across the boundary of melted region. The melted region may expand beyond the intended boundary if the temperature does not drop quick enough across the boundary and result in exceeding the tolerance of the dimensional requirement. The temperature gradient may be simulated by a heat transfer model which calculates a heat conduction rate based on properties of powders such as on the compositions and sizes of powders. If the predicted dimension of a printed object by the simulation model exceeds the tolerance of dimensional requirement, at 530, processor 401 may determine to abort the print process. Process 500 may proceed from 530 to 540.
[100] At 540, process 500 may involve storage container 450 of example apparatus 400 packaging powder samples in a plurality of sample canister 460(1) - 460(N). The sample canister 460(1) - 460(N) may be stored for analyses that may not be suitable for in- process characterization or for auditing purposes later. Storage container 450 may be capable of packaging powder samples in an atmosphere substantially equivalent to the in- process (in real-time or in-situ) atmosphere inside sample canister 460(1) - 460(N). The atmosphere may be air or an inert gas such as nitrogen, carbon dioxide, argon, helium, or other noble gas.
] FIG. 6 illustrates an example implementation 600 of collecting powder samples by ingester system 410 in powder bed fusion additive manufacturing in accordance with the present disclosure. In FIG. 6, build platform 601 supporting a powder bed 612 in a powder bed fusion 3D printer is connected to processor 608 together with ingester system 604. The exemplary powder bed fusion 3D printer may measure lm by lm and is shown without all its side walls for a purpose of clarity. Printing may occur via the action of optical module 602 which directs concentrated laser beam 613 provided by a print head (not shown in FIG. 6) to the surface of powder bed 612. The optical module 602 may be included in the print head in addition to an energy source that provides laser beam 613. Powder bed 612 may be formed by a plurality of powder layers dispensed by powder dispensing assembly 603. The powdered material may include metal, ceramic, plastic powders or other suitable powders able to bond together while subjected to a thermal energy. The processing atmosphere for the powdered material inside the powder bed fusion 3D printer may be air or an inert gas including nitrogen, carbon dioxide, argon, helium, or other noble gas. Ingester system 604 may include ingestion 605, the storage container 606, and test suite 607. Ingester 605 may collect or pick up powder samples in real-time during a print process from powder bed 612 or powder dispensing assembly 603 periodically, randomly, or at predetermined stages. A mechanical arm or diverter mechanism may be implemented as ingester 605 for collecting or picking up powder samples at predetermined locations or randomly and the amount of powder samples being collected may also be predetermined based on a number of requested analyses by users of the powder bed fusion 3D printer. The collected powder samples may be packaged in sample canisters by storage container 606 for auditing purposes or for later analysis. The storage contained may have a substantially equivalent atmosphere to the processing atmosphere used for the powder samples. Test suite 607 may perform characterizations such as those illustrated in test 440(1) - test 440(K) of example apparatus 400 on powder samples in real-time after ingester 605 has collected the powder samples. The characterizations performed by test suite 607 may measure one or more properties or qualities of powder samples from powder bed 612 or powder dispensing assembly 603 using example instruments listed in the table at step 520 of example process 500. The one or more properties of powder samples may include thermal diffusivity, density, surface roughness, weight, emissivity, absorptivity, reflectance, transmissivity, temperature, color, and particle size distribution. Processor 608 may store the characterization result of powder samples in memory 609 or using models in computing facility 611 with the characterization results as inputs to simulation a final dimension, and one or more electrical, mechanical, or optical properties of a printed object.
[102] The results of simulation may be utilized to determine whether to modify the printing parameters or abort the print process. Upon determining to modifying the printing parameters for the printed object during a print process, processor 608 may control an intensity and dwell time of incident beam 613 from the print head, a dispensing rate and a thickness of powders of powder dispensing assembly 603, and a temperature of build platform 601 as well as powder bed 612 to improve the properties or qualities of the printed object according the characterization results and simulation feedbacks. If the results of simulation indicate that a final dimension or one or more electrical, mechanical, or optical properties may not meet the requirement or specification of the printed object, processor 608 may determine to abort the print process. Whether to modify printing parameters or abort the print process may be also determined by users of powder bed fusion 3D printer based on knowledge and experience of previous characterization results. Some of tests in test suite 607 may not be suitable for in-process characterization and may be performed later for an off-site analysis. The processor 608 may have connectivity to the outside world via the Internet 610 which under selected circumstances connects to a cloud computing facility 611 with simulation models, advanced computing, and data storage.
[103] The computer processing of the test data such as those illustrated in test 440(1) - 440(K) of powder samples in conjunction with a database and possibly with the additional use of computer simulation models such as those describe at 530 in example process 500, enable a range of process adjustments and actions, either separately or in combination. [104] The class of process adjustments span the range of simple to extremely sophisticated. Two related examples as described in example process 500 are that print head 480 of example apparatus 400 may adjust its print characteristics such as laser dwell time or intensity in the case of powder bed fusion printers, or the powder dispensing assembly 470 may adjust its powder distribution parameters in terms of dispensing rate and layer thickness, in both cases to realize a more effective and higher quality printed object. Another example is for the printer to adjust printing parameters based on powder sample analysis for a self-protection of the printer, potentially for the case of reactive materials, or non-compatible materials used with the machine itself.
[105] The class of actions may include denial of further service because the powdered material is unauthorized, or that the powdered material may damage the printer, or a potential fire risk due to trace amounts of powdered materials from previous builds mixing and interacting in a dangerous manner. The actions may also serve as a trigger for billing and tracking purposes related to customer contracts, either directly for print services or for service.
[106] A final example combining both process adjustments and actions may be an
exemplary scenario of a customer being able to load virtually any powdered material, from any source into the printer, and the printer may adjust its printing parameters and print an object using the loaded powdered material. This could be immensely useful to customers in terms of flexibility and to the ability to use low-cost, high-value powdered materials.
[107] Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that
modifications and embodiments are intended to be included within the scope of the appended claims. It is also understood that other embodiments of this invention may be practiced in the absence of an element/step not specifically disclosed herein.

Claims

1. A method comprising the steps of:
collecting a plurality of powder samples of a powdered material in real-time during a print job;
performing a set of characterizations on the powder samples; and
determining whether to modify a set of printing parameters employed during the print job or abort the print job according to a result of the set of characterizations.
2. The method of claim 1, wherein the collecting of the powder samples of the powdered material in real-time comprises collecting the powder samples of the powdered material periodically at a predetermined interval, randomly, or at one or more predetermined stages during, before, or after the print job.
3. The method of claim 1, further comprising the step of aborting the print job when an unlicensed powder is used.
4. The method of claim 1, wherein the set of printing parameters comprises one or more of:
a temperature of the powder material;
a intensity of an energy source incident on the powder material;
a duration of the energy source incident on the powder material;
a pulse shape of energy source incident on the powder material modulated over time and position on the bed;
a thickness of a layer the powder material being dispensed; and
a rate of dispensing a layer of the powdered material.
5. The method of claim 1, wherein the determining of whether to modify the set of printing parameters employed during the print job or abort the print job according to the result of the characterizations comprises performing computer simulations based on a set of models using the result of the characterizations as an input.
6. The method of claim 1, further comprising packaging the powder samples in a plurality of sample canisters, with a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job.
7. The method of claim 6, wherein the first atmosphere or the second atmosphere comprises air or an inert gas.
7. The method of claim 7, wherein the inert gas comprises nitrogen, carbon dioxide, argon, helium, or other noble gas.
8. An apparatus implementable in an ingester system, comprising:
an ingester capable of collecting a plurality of powder samples of a powdered material during a print job; and
a storage container capable of packaging the powder samples in a plurality of sample canisters for audit purposes.
9. The apparatus of claim 8, further comprising:
a test suite capable of performing a set of characterizations on the powder samples;
a powder dispensing assembly capable of dispensing a plurality layers of the powdered material;
a build platform configured to support a powder bed formed by the layers of the powdered material; and
an energy source configured to emit energy to bond the powdered material to form one or more integral objects.
10. The apparatus of claim 8, wherein, in collecting the powder samples of the powder material during the print job, the ingester is configured to collect the powder samples of the powdered material periodically at a predetermined interval, randomly, or at one or more predetermined stages during the print job.
11. The apparatus of claim 8, wherein, in packaging the powder samples in the sample canister, the storage container is configured to provide a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job.
12. The apparatus of claim 8, wherein the first atmosphere or the second atmosphere comprises air or an inert gas.
13. The apparatus of claim 8, wherein the inert gas comprises nitrogen, carbon dioxide, argon, helium, or other noble gas.
14. The apparatus of claim 8, wherein the set of printing parameters comprises at least one of:
a temperature of the powder material;
an intensity of an energy source incident on the powder material;
a duration of the energy source incident on the powder material;
a pulse shape of energy source incident on the powder material modulated over time and position on the bed;
a thickness of a layer of the powder material being dispensed; and
a rate of dispensing a layer of the powdered material.
15. The apparatus of claim 8, wherein, in controlling the ingester system, the processor is configured to control the ingester system to perform operations comprising one or more of:
collecting the powder samples of the powder material in real-time during a print job; packaging the powder samples in the sample canisters having a second atmosphere in the sample canisters substantially equivalent to a first atmosphere utilized during the print job;
performing the characterizations on the powder samples during the print job; and determining whether to modify a set of printing parameters employed for the print job or abort the print job according a result of the characterizations.
16. A method of identifying unlicensed powder usage in an additive manufacturing system, comprising the steps of:
collecting a plurality of powder samples of a powdered material in during a print job; using the collected powder samples for audit and authorization by performing at least one of the following steps:
i) storing the collected powder samples for later characterization; and
ii) immediately characterizing the powder samples to determine whether to abort the print job according to a result of the set of characterizations.
17. The method of claim 16, wherein the collecting of the powder samples of the powdered material in real-time comprises collecting the powder samples of the powdered material periodically at a predetermined interval, randomly, or at one or more
predetermined stages during, before, or after the print job.
PCT/US2016/059139 2015-10-30 2016-10-27 Multi-functional ingester system for additive manufacturing WO2017075231A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP16860796.8A EP3368314A4 (en) 2015-10-30 2016-10-27 Multi-functional ingester system for additive manufacturing
EP22163020.5A EP4035806B1 (en) 2015-10-30 2016-10-27 Multi-functional ingester system for additive manufacturing

Applications Claiming Priority (46)

Application Number Priority Date Filing Date Title
US201562248835P 2015-10-30 2015-10-30
US201562248770P 2015-10-30 2015-10-30
US201562248758P 2015-10-30 2015-10-30
US201562248848P 2015-10-30 2015-10-30
US201562248847P 2015-10-30 2015-10-30
US201562248795P 2015-10-30 2015-10-30
US201562248791P 2015-10-30 2015-10-30
US201562248968P 2015-10-30 2015-10-30
US201562248787P 2015-10-30 2015-10-30
US201562248799P 2015-10-30 2015-10-30
US201562248765P 2015-10-30 2015-10-30
US201562248833P 2015-10-30 2015-10-30
US201562248839P 2015-10-30 2015-10-30
US201562248821P 2015-10-30 2015-10-30
US201562248780P 2015-10-30 2015-10-30
US201562248980P 2015-10-30 2015-10-30
US201562248841P 2015-10-30 2015-10-30
US201562248829P 2015-10-30 2015-10-30
US201562248783P 2015-10-30 2015-10-30
US201562248969P 2015-10-30 2015-10-30
US201562248989P 2015-10-30 2015-10-30
US201562248776P 2015-10-30 2015-10-30
US201562248966P 2015-10-30 2015-10-30
US62/248,833 2015-10-30
US62/248,969 2015-10-30
US62/248,783 2015-10-30
US62/248,821 2015-10-30
US62/248,968 2015-10-30
US62/248,839 2015-10-30
US62/248,795 2015-10-30
US62/248,829 2015-10-30
US62/248,841 2015-10-30
US62/248,787 2015-10-30
US62/248,776 2015-10-30
US62/248,980 2015-10-30
US62/248,848 2015-10-30
US62/248,835 2015-10-30
US62/248,780 2015-10-30
US62/248,847 2015-10-30
US62/248,770 2015-10-30
US62/248,758 2015-10-30
US62/248,989 2015-10-30
US62/248,966 2015-10-30
US62/248,799 2015-10-30
US62/248,765 2015-10-30
US62/248,791 2015-10-30

Publications (3)

Publication Number Publication Date
WO2017075231A2 true WO2017075231A2 (en) 2017-05-04
WO2017075231A3 WO2017075231A3 (en) 2017-09-28
WO2017075231A4 WO2017075231A4 (en) 2017-11-16

Family

ID=58630770

Family Applications (11)

Application Number Title Priority Date Filing Date
PCT/US2016/059144 WO2017075234A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method
PCT/US2016/059165 WO2017075244A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method
PCT/US2016/059139 WO2017075231A2 (en) 2015-10-30 2016-10-27 Multi-functional ingester system for additive manufacturing
PCT/US2016/059217 WO2017075285A1 (en) 2015-10-30 2016-10-27 Chamber systems for additive manufacturing
PCT/US2016/059188 WO2017075258A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method
PCT/US2016/059207 WO2017075277A1 (en) 2015-10-30 2016-10-27 Part manipulation using printed manipulation points
PCT/US2016/059401 WO2017075408A1 (en) 2015-10-30 2016-10-28 Polarization combining system in additive manufacturing
PCT/US2016/059326 WO2017075353A1 (en) 2015-10-30 2016-10-28 Light recycling for additive manufacturing optimization
PCT/US2016/059461 WO2017075449A1 (en) 2015-10-30 2016-10-28 Recycling powdered material for additive manufacturing
PCT/US2016/059422 WO2017075423A1 (en) 2015-10-30 2016-10-28 Dynamic optical assembly for laser-based additive manufacturing
PCT/US2016/059329 WO2017075356A1 (en) 2015-10-30 2016-10-28 Long and high resolution structures formed by additive manufacturing techniques

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2016/059144 WO2017075234A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method
PCT/US2016/059165 WO2017075244A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method

Family Applications After (8)

Application Number Title Priority Date Filing Date
PCT/US2016/059217 WO2017075285A1 (en) 2015-10-30 2016-10-27 Chamber systems for additive manufacturing
PCT/US2016/059188 WO2017075258A1 (en) 2015-10-30 2016-10-27 Additive manufacturing system and method
PCT/US2016/059207 WO2017075277A1 (en) 2015-10-30 2016-10-27 Part manipulation using printed manipulation points
PCT/US2016/059401 WO2017075408A1 (en) 2015-10-30 2016-10-28 Polarization combining system in additive manufacturing
PCT/US2016/059326 WO2017075353A1 (en) 2015-10-30 2016-10-28 Light recycling for additive manufacturing optimization
PCT/US2016/059461 WO2017075449A1 (en) 2015-10-30 2016-10-28 Recycling powdered material for additive manufacturing
PCT/US2016/059422 WO2017075423A1 (en) 2015-10-30 2016-10-28 Dynamic optical assembly for laser-based additive manufacturing
PCT/US2016/059329 WO2017075356A1 (en) 2015-10-30 2016-10-28 Long and high resolution structures formed by additive manufacturing techniques

Country Status (9)

Country Link
US (35) US10843266B2 (en)
EP (23) EP4035806B1 (en)
JP (6) JP7499562B2 (en)
KR (3) KR102562730B1 (en)
CN (7) CN109874321B (en)
CA (1) CA3002392A1 (en)
IL (3) IL287642B (en)
TW (2) TWI713617B (en)
WO (11) WO2017075234A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3369146A4 (en) * 2015-10-30 2019-10-23 Seurat Technologies, Inc. Polarization combining system in additive manufacturing
EP4028244A4 (en) * 2019-09-09 2023-05-24 Hewlett-Packard Development Company, L.P. Fusing build material based on thermal transfer

Families Citing this family (245)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144346B (en) 2013-02-21 2017-12-15 恩耐公司 The laser scribing of sandwich construction
US20150202825A1 (en) * 2014-01-17 2015-07-23 Christopher Cordingley Three Dimensional Printing Method
US10069271B2 (en) 2014-06-02 2018-09-04 Nlight, Inc. Scalable high power fiber laser
KR101795994B1 (en) 2014-06-20 2017-12-01 벨로3디, 인크. Apparatuses, systems and methods for three-dimensional printing
US9837783B2 (en) 2015-01-26 2017-12-05 Nlight, Inc. High-power, single-mode fiber sources
US10050404B2 (en) 2015-03-26 2018-08-14 Nlight, Inc. Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss
US10520671B2 (en) 2015-07-08 2019-12-31 Nlight, Inc. Fiber with depressed central index for increased beam parameter product
US9676145B2 (en) 2015-11-06 2017-06-13 Velo3D, Inc. Adept three-dimensional printing
US10331109B2 (en) * 2015-11-19 2019-06-25 Xerox Corporation System and method to embed objects into structure using stereolithography
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US10434600B2 (en) 2015-11-23 2019-10-08 Nlight, Inc. Fine-scale temporal control for laser material processing
US11125206B2 (en) * 2015-11-30 2021-09-21 Vestas Wind Systems A/S Method of manufacturing a wind turbine blade and wind turbine blade
WO2017100695A1 (en) 2015-12-10 2017-06-15 Velo3D, Inc. Skillful three-dimensional printing
US10688596B2 (en) * 2015-12-18 2020-06-23 Illinois Tool Works Inc. Wire manufactured by additive manufacturing methods
TWI582885B (en) * 2015-12-30 2017-05-11 國立中央大學 Platform structure for low temperature manufacturing tissue engineering bracket and method for manufacturing low temperature manufacturing tissue engineering bracket
US11701819B2 (en) 2016-01-28 2023-07-18 Seurat Technologies, Inc. Additive manufacturing, spatial heat treating system and method
US20170239719A1 (en) 2016-02-18 2017-08-24 Velo3D, Inc. Accurate three-dimensional printing
US10384389B2 (en) 2016-03-08 2019-08-20 Beehex, Inc. Apparatus for performing three-dimensional printing
CN109073903B (en) * 2016-04-12 2022-05-27 麦格纳国际公司 High power dynamic lens
US10888428B2 (en) * 2016-05-12 2021-01-12 University Of Notre Dame Du Lac Additive manufacturing device for biomaterials
US10286452B2 (en) 2016-06-29 2019-05-14 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
CN109414872B (en) * 2016-07-19 2022-03-01 惠普发展公司,有限责任合伙企业 3D printer fresh and recycled powder supply management
US10178868B2 (en) 2016-07-21 2019-01-15 BeeHex, LLC 3D-print system with integrated CNC robot and automatic self-cleaning mechanism
US10349663B2 (en) 2016-07-21 2019-07-16 Beehex Inc. System, apparatus and method for customizing and generating a 3D printed food item
US9987682B2 (en) * 2016-08-03 2018-06-05 3Deo, Inc. Devices and methods for three-dimensional printing
US11426993B2 (en) * 2016-08-29 2022-08-30 Young Optics Inc. Three-dimensional printing system
US10730785B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Optical fiber bending mechanisms
US10673197B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-based optical modulator
US10673199B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-based saturable absorber
US10668537B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Systems for and methods of temperature control in additive manufacturing
US10673198B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-coupled laser with time varying beam characteristics
US10423015B2 (en) 2016-09-29 2019-09-24 Nlight, Inc. Adjustable beam characteristics
US20180095450A1 (en) 2016-09-30 2018-04-05 Velo3D, Inc. Three-dimensional objects and their formation
US20180126460A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
US20180127296A1 (en) * 2016-11-10 2018-05-10 Goodrich Corporation Additive manufacture of optical components
DE102016222068A1 (en) * 2016-11-10 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for generative component production with a plurality of spatially separated beam guides
US10611092B2 (en) 2017-01-05 2020-04-07 Velo3D, Inc. Optics in three-dimensional printing
US20180200962A1 (en) 2017-01-13 2018-07-19 General Electric Company Additive manufacturing using a dynamically grown build envelope
US10478893B1 (en) 2017-01-13 2019-11-19 General Electric Company Additive manufacturing using a selective recoater
US10022794B1 (en) 2017-01-13 2018-07-17 General Electric Company Additive manufacturing using a mobile build volume
US11123924B2 (en) * 2017-02-21 2021-09-21 Renishaw Plc Powder bed fusion apparatus and methods
US20180250745A1 (en) 2017-03-02 2018-09-06 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
US11433613B2 (en) * 2017-03-15 2022-09-06 Carbon, Inc. Integrated additive manufacturing systems
US20180281282A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
US11007713B2 (en) * 2017-04-26 2021-05-18 GM Global Technology Operations LLC High throughput additive manufacturing system
WO2018209226A1 (en) 2017-05-11 2018-11-15 Seurat Technologies, Inc. Solid state routing of patterned light for additive manufacturing optimization
JP7136811B2 (en) 2017-05-11 2022-09-13 シューラット テクノロジーズ,インク. Switchyard Beam Routing of Patterned Light for Additive Manufacturing
JP6926655B2 (en) * 2017-05-12 2021-08-25 セイコーエプソン株式会社 3D modeling equipment and 3D object manufacturing method
AU2018273352B2 (en) 2017-05-22 2023-07-27 Howmedica Osteonics Corp. Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process
US20180339466A1 (en) * 2017-05-26 2018-11-29 Divergent Technologies, Inc. Material handling in additive manufacturing
CN107414351A (en) * 2017-06-20 2017-12-01 成都环龙智能机器人有限公司 A kind of spot welding robot's work station
CN110891762A (en) 2017-07-06 2020-03-17 惠普发展公司,有限责任合伙企业 Additive manufacturing with vibration isolation interface
WO2019014257A1 (en) * 2017-07-10 2019-01-17 Arconic Inc. Systems and methods for automated powder handling and dispensing
EP3431263B1 (en) * 2017-07-21 2021-04-21 CL Schutzrechtsverwaltungs GmbH Method for operating at least one apparatus for additively manufacturing three-dimensional objects
WO2019022751A1 (en) * 2017-07-28 2019-01-31 Hewlett-Packard Development Company, L.P. Three-dimensional printer with pneumatic conveyance
US10661552B2 (en) * 2017-07-28 2020-05-26 General Electric Company Systems and methods for advanced additive manufacturing
CN110997285B (en) * 2017-07-31 2022-05-06 惠普发展公司,有限责任合伙企业 Different mixtures of build materials deliverable during three-dimensional printing operations
US20190079492A1 (en) * 2017-09-14 2019-03-14 Divergent Technologies, Inc. Apparatus and methods for additively manufacturing lattice structures
US10646960B2 (en) * 2017-10-03 2020-05-12 Lawrence Livermore National Security, Llc Compact absorptivity measurement system for additive manufacturing
US11351724B2 (en) 2017-10-03 2022-06-07 General Electric Company Selective sintering additive manufacturing method
US11420384B2 (en) 2017-10-03 2022-08-23 General Electric Company Selective curing additive manufacturing method
US11404180B2 (en) * 2017-10-09 2022-08-02 Ut-Battelle, Llc Method for producing collimators and other components from neutron absorbing materials using additive manufacturing
US10870219B2 (en) * 2017-10-11 2020-12-22 Caterpillar Inc. Monitoring system for three-dimensional printing
EP3470207B1 (en) * 2017-10-13 2021-12-01 CL Schutzrechtsverwaltungs GmbH Plant for additively manufacturing of three-dimensional objects
WO2019078882A1 (en) 2017-10-20 2019-04-25 Hewlett-Packard Development Company, L.P. Additive manufacturing layering
WO2019083493A1 (en) 2017-10-23 2019-05-02 Hewlett-Packard Development Company, L.P. Forming a layer of build material
JP2021500476A (en) * 2017-10-23 2021-01-07 レニショウ パブリック リミテッド カンパニーRenishaw Public Limited Company Powder bed melting equipment
EP3473441B1 (en) * 2017-10-23 2021-05-19 General Electric Company Moveable molding assembly for use with additive manufacturing
TWI642536B (en) * 2017-10-30 2018-12-01 國立成功大學 Method of performing powder bed fusion process
EP3684592A4 (en) 2017-10-30 2021-04-21 Hewlett-Packard Development Company, L.P. Three-dimensional printing
US11590691B2 (en) 2017-11-02 2023-02-28 General Electric Company Plate-based additive manufacturing apparatus and method
US11254052B2 (en) 2017-11-02 2022-02-22 General Electric Company Vatless additive manufacturing apparatus and method
WO2019094262A1 (en) * 2017-11-10 2019-05-16 General Electric Company Additive manufacturing using growth build wall heat passageways
US11396135B2 (en) 2017-11-10 2022-07-26 General Electric Company Powder reclamation and cleaning system for an additive manufacturing machine
EP3706944A1 (en) 2017-11-10 2020-09-16 General Electric Company Gas flow systems for an additive manufacturing machine
US11571743B2 (en) * 2017-11-13 2023-02-07 General Electric Company Systems and methods for additive manufacturing
US10307823B1 (en) 2017-11-13 2019-06-04 General Electric Company Methods and systems for repairing powder containment structures
US10766190B2 (en) 2017-11-28 2020-09-08 General Electric Company Additive manufacturing apparatus and related process
CN108000675A (en) * 2017-11-30 2018-05-08 西安理工大学 A kind of 3D printing method of skeleton growth formula concrete component
CN107779866B (en) * 2017-12-12 2023-06-30 沈阳农业大学 Multifunctional workbench for plasma cladding
DE102017223223A1 (en) * 2017-12-19 2019-06-19 Siemens Aktiengesellschaft Method for the additive construction of a structure and computer program product
US10272525B1 (en) * 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US11090724B2 (en) 2017-12-28 2021-08-17 Applied Materials, Inc. Additive manufacturing with powder dispensing
EP3713693B8 (en) * 2017-12-29 2022-11-23 EOS of North America, Inc. Additive manufacture system using light valve device
US10906101B2 (en) 2018-01-09 2021-02-02 General Electric Company Systems and methods for additive manufacturing powder assessment
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10821669B2 (en) 2018-01-26 2020-11-03 General Electric Company Method for producing a component layer-by-layer
US10821551B2 (en) 2018-01-26 2020-11-03 General Electronic Company Systems and methods for dynamic shaping of laser beam profiles in additive manufacturing
US10821668B2 (en) 2018-01-26 2020-11-03 General Electric Company Method for producing a component layer-by- layer
US10814429B2 (en) 2018-01-26 2020-10-27 General Electric Company Systems and methods for dynamic shaping of laser beam profiles for control of micro-structures in additively manufactured metals
US10967459B2 (en) 2018-02-05 2021-04-06 General Electric Company Customizable powder bed containment systems for use with direct metal laser melting systems
US11224943B2 (en) * 2018-03-07 2022-01-18 Divergent Technologies, Inc. Variable beam geometry laser-based powder bed fusion
CN111819065A (en) 2018-03-09 2020-10-23 惠普发展公司,有限责任合伙企业 Virtual object volume
US11872689B2 (en) 2018-03-19 2024-01-16 Divergent Technologies, Inc. End effector features for additively manufactured components
WO2019182617A1 (en) * 2018-03-23 2019-09-26 Hewlett-Packard Development Company, L.P. Build material particle optical property identification
US10974456B2 (en) 2018-03-23 2021-04-13 Lawrence Livermore National Security, Llc Additive manufacturing power map to mitigate defects
US11035339B2 (en) * 2018-03-26 2021-06-15 General Electric Company Shear web assembly interconnected with additive manufactured components
WO2019190470A1 (en) * 2018-03-27 2019-10-03 Hewlett-Packard Development Company, L.P. Additive manufacturing system
DE102018107585B3 (en) * 2018-03-29 2019-03-28 Universität Rostock Device for producing 3D printed drug delivery systems with drug depots, and methods for manufacturing 3D printed drug delivery systems
WO2019195708A1 (en) * 2018-04-06 2019-10-10 3D Fortify Systems and methods for increasing an additive manufacturing build area size
JP2019185002A (en) * 2018-04-11 2019-10-24 ソニー株式会社 Microscope system and medical light source device
US11273496B2 (en) 2018-04-16 2022-03-15 Panam 3D Llc System and method for rotational 3D printing
US11273601B2 (en) * 2018-04-16 2022-03-15 Panam 3D Llc System and method for rotational 3D printing
US11759996B2 (en) 2018-04-27 2023-09-19 Hewlett-Packard Development Company, L.P. Surface feature formation for three-dimensional printing
US11914932B2 (en) 2018-04-27 2024-02-27 Hewlett-Packard Development Company, L.P. User-assisted parts packing optimization
US11340597B2 (en) 2018-04-27 2022-05-24 Hewlett-Packard Development Company, L.P. 3-D printing batch analysis
US11052647B2 (en) 2018-05-10 2021-07-06 Lockheed Martin Corporation Direct additive synthesis of diamond semiconductor
US10960571B2 (en) 2018-05-10 2021-03-30 Lockheed Martin Corporation Direct additive synthesis from UV-induced solvated electrons in feedstock of halogenated material and negative electron affinity nanoparticle
EP3570127B1 (en) * 2018-05-15 2023-04-26 Siemens Energy Global GmbH & Co. KG Determination of a life defining quantity
US11014189B2 (en) 2018-05-25 2021-05-25 General Electric Company Method to control additive manufacturing builds using laser angle of incidence
JP7060799B2 (en) * 2018-05-31 2022-04-27 日亜化学工業株式会社 Light source device
WO2019236070A1 (en) * 2018-06-05 2019-12-12 Hewlett-Packard Development Company, L.P. Storage tank loading
US10919115B2 (en) 2018-06-13 2021-02-16 General Electric Company Systems and methods for finishing additive manufacturing faces with different orientations
AU2019204143A1 (en) 2018-06-15 2020-01-16 Howmedica Osteonics Corp. Stackable build plates for additive manufacturing powder handling
EP3587004A1 (en) * 2018-06-26 2020-01-01 Linde Aktiengesellschaft Device and method for cooling a build chamber for additive manufacturing using metal powders
CN108890157A (en) * 2018-07-04 2018-11-27 潘真清 A kind of laser soldering device for repairing torsion cylinder
CN108890156A (en) * 2018-07-04 2018-11-27 潘真清 A kind of laser welding repairs the device of torsion cylinder
CN110711859B (en) * 2018-07-11 2024-01-09 北京万维增材科技有限公司 Composite manufacturing equipment and manufacturing method for increasing and decreasing materials
US11325299B2 (en) * 2018-07-16 2022-05-10 Massachusetts Institute Of Technology Additive manufacturing via optical aperture division multiplexing
US11033989B2 (en) * 2018-07-22 2021-06-15 Asia Vital Components Co., Ltd. Jig structure for manufacturing heat dissipation unit
US11090861B2 (en) 2018-07-26 2021-08-17 General Electric Company Systems and methods for lateral material transfer in additive manufacturing system
US20210331414A1 (en) * 2018-07-26 2021-10-28 Hewlett-Packard Development Company, L.P. Determining melting point of build material
US11426818B2 (en) 2018-08-10 2022-08-30 The Research Foundation for the State University Additive manufacturing processes and additively manufactured products
DE102018213675A1 (en) * 2018-08-14 2020-02-20 Eos Gmbh Electro Optical Systems Additive manufacturing device and associated additive manufacturing process
EP3840911A4 (en) * 2018-08-24 2022-06-01 Nuburu, Inc. Blue laser metal additive manufacturing system
US11376792B2 (en) 2018-09-05 2022-07-05 Carbon, Inc. Robotic additive manufacturing system
CA3112458A1 (en) * 2018-09-11 2020-03-19 Greene, Tweed Technologies, Inc. Crosslinkable aromatic polymer compositions for use in additive manufacturing processes and methods for forming the same
US11511350B2 (en) 2018-09-13 2022-11-29 Desktop Metal, Inc. Techniques for depowdering additively fabricated parts via rapid pressure change and related systems and methods
CN109188649B (en) * 2018-09-19 2021-07-02 珠海达理宇航科技有限公司 Protective device for polygonal barrel and space telescope lens
EP3820674B1 (en) * 2018-10-01 2023-11-22 Orta Dogu Teknik Universitesi Production method with molten filaments on a powder bed
WO2020072638A1 (en) 2018-10-05 2020-04-09 Vulcanforms Inc. Additive manufacturing system with fixed build plate
WO2020075198A2 (en) * 2018-10-10 2020-04-16 Indian Institute Of Technology Bombay Multi-station multi-axis hybrid layered manufacturing system
US11597156B2 (en) 2018-10-29 2023-03-07 Hewlett-Packard Development Company, L.P. Monitoring additive manufacturing
WO2020091744A1 (en) * 2018-10-30 2020-05-07 Hewlett-Packard Development Company, L.P. Feedback control of microwave energy emitters
DE102018219301A1 (en) * 2018-11-12 2020-05-14 Trumpf Laser- Und Systemtechnik Gmbh Method for detecting a work area of a generative manufacturing device and manufacturing device for the generative manufacturing of components from a powder material
DE102018128243A1 (en) 2018-11-12 2020-05-14 AM Metals GmbH Manufacturing device for additive manufacturing of three-dimensional components
DE102018128757A1 (en) * 2018-11-15 2020-05-20 Gebr. Becker Gmbh Method and device for operating a metal printing device
WO2020112175A1 (en) * 2018-11-29 2020-06-04 Arconic Inc. Systems and methods for additive manufacturing
CN109351972B (en) * 2018-12-10 2021-04-02 有研工程技术研究院有限公司 Controllable component continuous powder feeding system
JP6748181B2 (en) 2018-12-14 2020-08-26 株式会社ソディック Additive manufacturing equipment
WO2020123828A1 (en) * 2018-12-14 2020-06-18 Seurat Technologies, Inc Additive manufacturing system for object creation from powder using a high flux laser for two-dimensional printing
WO2020132215A1 (en) * 2018-12-19 2020-06-25 Seurat Technologies, Inc. Additive manufacturing system using a pulse modulated laser for two-dimensional printing
WO2020132093A1 (en) * 2018-12-20 2020-06-25 Jabil Inc. Apparatus, system and method of heat filtering for additive manufacturing
CN109658360B (en) * 2018-12-25 2021-06-22 北京旷视科技有限公司 Image processing method and device, electronic equipment and computer storage medium
US11110649B2 (en) * 2019-01-04 2021-09-07 Carbon, Inc. Additively manufactured products having a matte surface finish
US20200220332A1 (en) * 2019-01-07 2020-07-09 Li-Cor, Inc. Laser line illumination using combined single-mode and multi-mode laser sources
CN109676928B (en) * 2019-01-11 2020-10-30 中国科学院工程热物理研究所 Smoke dust absorption device for additive manufacturing equipment
KR102154624B1 (en) * 2019-01-11 2020-09-10 울산대학교 산학협력단 Apparatus for additive manufacturing high strength materials for punch dies
WO2020150251A1 (en) * 2019-01-14 2020-07-23 Arizona Board Of Regents On Behalf Of The University Of Arizona High resolution, high throughput additive manufacturing
US11794412B2 (en) 2019-02-20 2023-10-24 General Electric Company Method and apparatus for layer thickness control in additive manufacturing
US11498283B2 (en) 2019-02-20 2022-11-15 General Electric Company Method and apparatus for build thickness control in additive manufacturing
WO2020178220A1 (en) * 2019-03-04 2020-09-10 SLM Solutions Group AG Device and method for producing a three-dimensional workpiece
US11305352B2 (en) 2019-03-13 2022-04-19 United States Of America As Represented By The Secretary Of The Air Force Powder fused components with unique internal structures for damping
US11179891B2 (en) 2019-03-15 2021-11-23 General Electric Company Method and apparatus for additive manufacturing with shared components
KR102157874B1 (en) * 2019-03-20 2020-09-18 조선대학교산학협력단 Power feeding device for metal additive manufacturing process using a plasma electron beam
US11858202B2 (en) * 2019-03-26 2024-01-02 Lawrence Livermore National Security, Llc System and method for performing laser powder bed fusion using controlled, supplemental in situ surface heating to control microstructure and residual stresses in formed part
US12059847B2 (en) * 2019-03-28 2024-08-13 Stratasys Ltd. Method for additive manufacturing an object
US11130291B2 (en) * 2019-03-29 2021-09-28 Xerox Corporation Composite-based additive manufacturing (CBAM) use of gravity for excess polymer removal
CN113382845A (en) * 2019-04-29 2021-09-10 惠普发展公司,有限责任合伙企业 Cooling unit with self-locking latch mechanism
US11667080B2 (en) * 2019-04-29 2023-06-06 Mighty Buildings, Inc. System for obtaining a photopolymerized prepolymer
EP3741542A1 (en) 2019-05-20 2020-11-25 LayerWise N.V. Three-dimensional printing system with self-maintaining powder distribution subsystem
FR3096511B1 (en) * 2019-05-22 2021-07-02 Amplitude Systemes Optical component mount and associated light beam control system
CN110194669B (en) * 2019-05-27 2020-11-24 华中科技大学 Selective laser sintering forming equipment, system and method for large-scale complex part
US11623279B2 (en) 2019-06-03 2023-04-11 Hamilton Sundstrand Corporation Recoaters with gas flow management
US11590650B2 (en) * 2019-06-10 2023-02-28 Preferred Networks, Inc. Generation method for training dataset, model generation method, training data generation apparatus, inference apparatus, robotic controller, model training method and robot
US10987866B2 (en) 2019-06-25 2021-04-27 Hewlett-Packard Development Company, L.P. Removing build material
US12062885B2 (en) * 2019-07-25 2024-08-13 Trinamix Gmbh Light module and a method for its operation
CA3148849A1 (en) 2019-07-26 2021-02-04 Velo3D, Inc. Quality assurance in formation of three-dimensional objects
US11541457B2 (en) * 2019-07-26 2023-01-03 Arcam Ab Devices, systems, and methods for monitoring a powder layer in additive manufacturing processes
KR102236112B1 (en) * 2019-07-31 2021-04-06 한국기계연구원 Method for three-dimensional printing in a partial area of bed and three-dimensional printer used in the method
JP6734447B1 (en) * 2019-07-31 2020-08-05 株式会社ソディック Material powder for metal additive manufacturing and manufacturing method thereof
CN111215811B (en) * 2019-08-12 2021-08-17 杭州顺达伯耐特电梯有限公司 Well frame welding tool and welding method
JP2021037716A (en) * 2019-09-04 2021-03-11 株式会社荏原製作所 Machine learning device, AM device, machine learning method, and learning model generation method
NL2023878B1 (en) * 2019-09-23 2021-05-25 Ultimaker Bv A filament path length measuring device
JP2023511476A (en) * 2019-11-06 2023-03-20 ヌブル インク Blue laser metal additive manufacturing system
CN110977171B (en) * 2019-11-12 2021-11-23 江苏大学 Vacuum laser-electric arc hybrid welding method and device for improving weld formation
US20240001612A1 (en) * 2019-12-13 2024-01-04 Stratasys Powder Production Ltd. Infrared radiation deflector and apparatus for the layer-by-layer formation of three-dimensional objects
CN111196033B (en) * 2020-01-13 2021-09-03 哈尔滨工业大学 Rapid multi-material photocuring 3D printing device and method based on double-light-source initiation
CN111283193A (en) * 2020-01-22 2020-06-16 华东理工大学 Double-forming-cylinder device for SLM equipment and powder spreading system thereof
US11884025B2 (en) * 2020-02-14 2024-01-30 Divergent Technologies, Inc. Three-dimensional printer and methods for assembling parts via integration of additive and conventional manufacturing operations
BR112022014249A2 (en) * 2020-02-18 2022-09-20 Vulcanforms Inc ADDITIVE MANUFACTURING SYSTEMS AND RELATED METHODS USING OPTICAL PHASE ARRAY BEAM DIRECTION
DE102020106516A1 (en) * 2020-03-10 2021-09-16 Universität Paderborn Sensor-integrated manufacturing system for additive manufacturing
US20210316502A1 (en) * 2020-04-10 2021-10-14 Seurat Technologies, Inc. High Throughput Additive Manufacturing System Supporting Absorption Of Amplified Spontaneous Emission In Laser Amplifiers
CN113524685B (en) * 2020-04-14 2023-11-10 上海普利生机电科技有限公司 Three-dimensional printing method and device for correcting geometric distortion of lens
US20230052382A1 (en) * 2020-04-30 2023-02-16 Hewlett-Packard Development Company, L.P. Removal of excess build material from a three-dimensional printed job
US11580279B1 (en) * 2020-05-05 2023-02-14 Ansys, Inc. System and method for performing a thermal simulation of a powder bed based additive process
CN111564752A (en) * 2020-05-15 2020-08-21 中康瑞鑫(深圳)科技有限公司 755 nanometer picosecond pulse solid laser
US11913839B2 (en) * 2020-05-18 2024-02-27 National Technology & Engineering Solutions Of Sandia, Llc Methods and apparatus for improved thermal monitoring by correlating infrared emissivity to surface topography
US11286043B2 (en) 2020-05-21 2022-03-29 The Boeing Company Nose landing gear assembly for use with an aircraft
US11835082B2 (en) 2020-05-21 2023-12-05 The Boeing Company Folding assembly
EP4161370A4 (en) * 2020-06-09 2024-03-20 Seurat Technologies, Inc. Additive manufacturing with photo-acoustic tomography defect testing
WO2021249659A1 (en) * 2020-06-12 2021-12-16 Volkswagen Aktiengesellschaft Additively manufactured article and method for producing an additively manufactured article
WO2021257611A1 (en) * 2020-06-15 2021-12-23 Seurat Technologies, Inc. Thermal compensation for laser energy delivery for additive manufacturing
US20210406429A1 (en) 2020-06-26 2021-12-30 Sentient Science Corporation Method and system for predicting wear and crack growth in a rail system
US11925981B2 (en) * 2020-06-29 2024-03-12 Arcam Ab Method, apparatus and control unit for selectively sintering a powder layer in additive manufacturing processes to achieve a future, desired heat conductivity
DE102020117245A1 (en) 2020-06-30 2021-12-30 Carl Zeiss Ag Optical unit, manufacturing device and method for additive manufacturing of an object
AU2021306181A1 (en) * 2020-07-08 2023-01-19 Vulcanforms Inc. Optical zoom in additive manufacturing
CN111855034B (en) * 2020-07-24 2021-12-10 芜湖传方智能科技有限公司 Manufacturing process of pressure sensor sensitive element
US11828879B2 (en) 2020-07-29 2023-11-28 Lg Innotek Co., Ltd. Vibrated polarizing beam splitter for improved return light detection
US20220063199A1 (en) * 2020-08-26 2022-03-03 Baker Hughes Oilfield Operations Llc Artificial intelligence in additive manufacturing and related systems, methods, and devices
US11534972B2 (en) 2020-08-31 2022-12-27 GM Global Technology Operations LLC Post-build quick powder removal system for powder bed fusion additive manufacturing
US11724315B2 (en) * 2020-09-02 2023-08-15 Sentient Science Corporation Systems and methods for defect detection and correction in additive manufacturing processes
US11638959B2 (en) * 2020-09-03 2023-05-02 General Electric Company Systems and methods for estimating powder dosing in additive manufacturing processes
KR102247582B1 (en) * 2020-09-21 2021-05-04 (주)케이랩스 Binder jet type 3D printer capable of printing continuously
US11633799B2 (en) * 2020-10-01 2023-04-25 Hamilton Sundstrand Corporation Control assembly fabrication via brazing
JP6932834B1 (en) * 2020-10-20 2021-09-08 株式会社ソディック Laminated modeling equipment
EP4232284A1 (en) * 2020-10-23 2023-08-30 Agnikul Cosmos Private Limited Design and manufacturing of a single piece rocket engine
EP4237170A4 (en) * 2020-10-29 2024-10-16 Seurat Tech Inc High speed light valve system
US11733672B2 (en) 2020-11-26 2023-08-22 Industrial Technology Research Institute Recoater collision prediction and correction method for additive manufacturing and system thereof
CN112563113B (en) * 2020-11-26 2021-11-02 中国地质大学(武汉) Heating and condensing device for improving sensitivity of ICP-MS instrument
TWI784354B (en) * 2020-11-26 2022-11-21 財團法人工業技術研究院 Parameter analysis method and parameter analysis system for metal additive manufacturing
CN112881122A (en) * 2021-01-15 2021-06-01 北京工业大学 Monitoring method of piezoelectric sensor applied to 3D printing tunnel model
US11981081B2 (en) 2021-01-19 2024-05-14 General Electric Company Powder removal systems and assemblies for additive manufacturing
US12042866B2 (en) 2021-03-16 2024-07-23 General Electric Company Additive manufacturing apparatus and fluid flow mechanism
CN113103573A (en) * 2021-03-23 2021-07-13 武汉大学 Atmosphere detection device and method in additive manufacturing
US12030119B2 (en) 2021-03-31 2024-07-09 Baker Hughes Oilfield Operations Llc In-situ powder witness coupon
US12109613B2 (en) * 2021-04-01 2024-10-08 Battelle Savannah River Alliance, Llc Additive manufacturing systems and associated methods
US11135771B1 (en) * 2021-04-09 2021-10-05 Curiteva, Inc. System and method of manufacturing a medical implant
EP4323193A1 (en) * 2021-04-27 2024-02-21 Essentium IPCo, LLC Three-dimensional printer
US20220371097A1 (en) * 2021-05-20 2022-11-24 Delavan Inc. System and method for controlling gas flow temperature in additive manufacturing
US11951679B2 (en) 2021-06-16 2024-04-09 General Electric Company Additive manufacturing system
US11731367B2 (en) 2021-06-23 2023-08-22 General Electric Company Drive system for additive manufacturing
US11958249B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11958250B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11846927B2 (en) * 2021-07-02 2023-12-19 Stratasys, Inc. Method for controlling dimensional tolerances, surface quality, and print time in 3D-printed parts
US11826950B2 (en) 2021-07-09 2023-11-28 General Electric Company Resin management system for additive manufacturing
US11874535B2 (en) 2021-07-26 2024-01-16 Concept Laser Gmbh Modulating a working beam of an additive manufacturing machine with a solid-state optical modulator
US20230037200A1 (en) 2021-07-28 2023-02-02 DePuy Synthes Products, Inc. 3D-Printed Implants And Methods For 3D Printing Of Implants
US11865617B2 (en) * 2021-08-25 2024-01-09 Divergent Technologies, Inc. Methods and apparatuses for wide-spectrum consumption of output of atomization processes across multi-process and multi-scale additive manufacturing modalities
US11813799B2 (en) 2021-09-01 2023-11-14 General Electric Company Control systems and methods for additive manufacturing
JP2023042934A (en) * 2021-09-15 2023-03-28 新東工業株式会社 Test system and test method
US20230079964A1 (en) * 2021-09-15 2023-03-16 Freeform Future Corp. 3d printing system with moving build module
CN113634959B (en) * 2021-09-28 2023-06-09 贵阳大东汽车配件有限公司 Quick-change welding device for inner and outer sheet metal parts of main beam of rear longitudinal beam
EP4197744A1 (en) * 2021-12-14 2023-06-21 Linde GmbH Method for a fast cooling of polymer (plastic) parts following 3d printing process
CN114247901B (en) * 2021-12-17 2024-02-27 福建国锐中科光电有限公司 Metal 3D printing and post-treatment integrated forming equipment and printing method
WO2023122170A1 (en) * 2021-12-21 2023-06-29 Firehawk Aerospace, Inc. Catalytic decomposition reactors
CN115502417B (en) * 2021-12-30 2024-03-22 北京航空航天大学 Vacuum additive manufacturing device and method
CN115216766B (en) * 2022-08-01 2023-11-17 乐清市明实车辆配件有限公司 Local anticorrosive alloy layer cladding device of railway freight car side door
WO2024040357A1 (en) * 2022-08-25 2024-02-29 Nanogrande Inc. Additive manufacturing system and method adapted for simultaneous high and low accuracy build
CN115416299B (en) * 2022-11-04 2023-03-24 杭州爱新凯科技有限公司 Need not to remove laser galvanometer 3D printing apparatus of focusing
US20240181700A1 (en) * 2022-12-01 2024-06-06 Vulcanforms Inc. Optical system
WO2024137624A1 (en) * 2022-12-19 2024-06-27 The Trustees Of Dartmouth College Modeling and fabrication of functional ceramic-polymer composites
WO2024197260A1 (en) * 2023-03-23 2024-09-26 Williams Christopher B Methods and systems for large-scale additive manufacturing with robotic conveying
CN116890122B (en) * 2023-09-11 2023-11-14 中国地质大学(武汉) Full-period in-situ monitoring method for splash formation, emission and fall back in laser additive manufacturing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013000511A1 (en) 2013-01-15 2014-07-17 Cl Schutzrechtsverwaltungs Gmbh Device for producing three-dimensional objects
WO2015025171A2 (en) 2013-08-22 2015-02-26 Renishaw Plc Apparatus and methods for building objects by selective solidification of powder material
US20150061170A1 (en) 2013-09-02 2015-03-05 Thomas Engel Method and arrangement for producing a workpiece by using additive manufacturing techniques

Family Cites Families (529)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3080760A (en) 1960-06-29 1963-03-12 American Cyanamid Co Disposable sample probe for bulk chemicals
US3704997A (en) * 1971-05-19 1972-12-05 American Optical Corp Variable amplitude polarizing beam splitter
US3796162A (en) 1972-06-28 1974-03-12 Rolair Syst Inc Conveyor system
US4286466A (en) 1979-10-09 1981-09-01 International Business Machines Corporation Method and apparatus for pneumatically sampling powders
US4247508B1 (en) 1979-12-03 1996-10-01 Dtm Corp Molding process
DE3029104A1 (en) 1980-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Focussing of laser beam on work-piece during laser beam machining - where angular movement of beam deflection mirror automatically alters position of focussing lens
JPS5933512B2 (en) 1980-12-19 1984-08-16 日本鋼管株式会社 Liquid honing method
US4338022A (en) 1980-12-22 1982-07-06 Minnesota Mining And Manufacturing Company Multiple magnification optical assembly
GB2127567B (en) * 1982-09-09 1986-01-29 Laser Applic Limited Laser marking
DE3416595A1 (en) 1984-05-04 1985-11-07 Kurt Prof. Dr.-Ing. Leschonski METHOD AND DEVICE FOR SAMPLE DISPOSAL OF PROTECTIVE GOODS AND SUSPENSIONS
FR2567668B1 (en) 1984-07-16 1987-10-16 Cilas Alcatel DEVICE FOR PRODUCING AN INDUSTRIAL PART MODEL
US5236637A (en) 1984-08-08 1993-08-17 3D Systems, Inc. Method of and apparatus for production of three dimensional objects by stereolithography
US4655548A (en) * 1984-10-22 1987-04-07 Grumman Aerospace Corporation Multi-degree of freedom mount
US4659902A (en) 1985-04-22 1987-04-21 Westinghouse Electric Corp. Robot laser system
US4712120A (en) 1986-03-17 1987-12-08 C-E Industrial Lasers, Incorporated Laser materials treatment system
US5296062A (en) 1986-10-17 1994-03-22 The Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
US5155324A (en) 1986-10-17 1992-10-13 Deckard Carl R Method for selective laser sintering with layerwise cross-scanning
US4944817A (en) 1986-10-17 1990-07-31 Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
DE3637757A1 (en) 1986-11-05 1988-05-11 Krupp Polysius Ag SAMPLE DIVIDER
JPS63140787A (en) * 1986-12-01 1988-06-13 Komatsu Ltd Collecting device for laser reflected light
US4782945A (en) 1987-06-12 1988-11-08 Geiler William A Reclaimable polyester bottle and carrier assembly
ATE135622T1 (en) 1988-04-18 1996-04-15 3D Systems Inc SUPPORT FOR STEREOLITHOGRAPHY
EP0402944A3 (en) 1989-06-16 1992-05-27 Seiko Instruments Inc. Light addressed liquid crystal light valve
GB9003097D0 (en) 1990-02-12 1990-04-11 Scient Generics Ltd Solid state laser diode light source
DE69128103T2 (en) 1990-04-05 1998-04-02 Seiko Epson Corp Optical device
US5155321A (en) 1990-11-09 1992-10-13 Dtm Corporation Radiant heating apparatus for providing uniform surface temperature useful in selective laser sintering
AU9065991A (en) 1990-11-09 1992-06-11 Dtm Corporation Controlled gas flow for selective laser sintering
JP2953179B2 (en) * 1991-05-30 1999-09-27 三菱電機株式会社 Light processing equipment
JP2555822B2 (en) * 1991-10-30 1996-11-20 日本電装株式会社 High-speed picking device for piled parts
US5314003A (en) 1991-12-24 1994-05-24 Microelectronics And Computer Technology Corporation Three-dimensional metal fabrication using a laser
US5686960A (en) 1992-01-14 1997-11-11 Michael Sussman Image input device having optical deflection elements for capturing multiple sub-images
US5269982A (en) * 1992-02-12 1993-12-14 Brotz Gregory R Process for manufacturing a shaped product
US5352405A (en) 1992-12-18 1994-10-04 Dtm Corporation Thermal control of selective laser sintering via control of the laser scan
DE4302418A1 (en) 1993-01-28 1994-08-11 Eos Electro Optical Syst Method and device for producing a three-dimensional object
US5337620A (en) 1993-06-02 1994-08-16 Kalidini Sanyasi R Sampling tool
WO1994029069A1 (en) 1993-06-04 1994-12-22 Seiko Epson Corporation Apparatus and method for laser machining, and liquid crystal panel
EP0724498B1 (en) * 1993-09-30 1997-12-29 Cymer, Inc. Full field mask illumination enhancement methods and apparatus
US5393482A (en) * 1993-10-20 1995-02-28 United Technologies Corporation Method for performing multiple beam laser sintering employing focussed and defocussed laser beams
JP3225740B2 (en) * 1994-05-25 2001-11-05 株式会社デンソー High-speed picking device for piled parts
US5503785A (en) 1994-06-02 1996-04-02 Stratasys, Inc. Process of support removal for fused deposition modeling
US5473408A (en) * 1994-07-01 1995-12-05 Anvik Corporation High-efficiency, energy-recycling exposure system
US5674414A (en) 1994-11-11 1997-10-07 Carl-Zeiss Stiftung Method and apparatus of irradiating a surface of a workpiece with a plurality of beams
DE19516972C1 (en) 1995-05-09 1996-12-12 Eos Electro Optical Syst Device for producing a three-dimensional object by means of laser sintering
US5837960A (en) 1995-08-14 1998-11-17 The Regents Of The University Of California Laser production of articles from powders
GB2304291B (en) * 1995-08-23 1999-08-11 Draeger Ltd Breathing apparatus
US5622577A (en) 1995-08-28 1997-04-22 Delco Electronics Corp. Rapid prototyping process and cooling chamber therefor
US6270335B2 (en) 1995-09-27 2001-08-07 3D Systems, Inc. Selective deposition modeling method and apparatus for forming three-dimensional objects and supports
US5583304A (en) 1995-09-28 1996-12-10 Kalidindi; Sanyasi R. Apparatus and method for testing powder properties
US5640667A (en) 1995-11-27 1997-06-17 Board Of Regents, The University Of Texas System Laser-directed fabrication of full-density metal articles using hot isostatic processing
DE19707834A1 (en) 1996-04-09 1997-10-16 Zeiss Carl Fa Material irradiation unit used e.g. in production of circuit boards
US6043475A (en) 1996-04-16 2000-03-28 Olympus Optical Co., Ltd. Focal point adjustment apparatus and method applied to microscopes
US6476343B2 (en) 1996-07-08 2002-11-05 Sandia Corporation Energy-beam-driven rapid fabrication system
US6053615A (en) 1996-08-02 2000-04-25 In Focus Systems, Inc. Image projector with polarization conversion system
US5771260A (en) 1996-10-04 1998-06-23 Excimer Laser Systems, Inc. Enclosure system for laser optical systems and devices
US6007318A (en) 1996-12-20 1999-12-28 Z Corporation Method and apparatus for prototyping a three-dimensional object
CA2227672A1 (en) * 1997-01-29 1998-07-29 Toyota Jidosha Kabushiki Kaisha Method for producing a laminated object and apparatus for producing the same
US5840239A (en) * 1997-01-31 1998-11-24 3D Systems, Inc. Apparatus and method for forming three-dimensional objects in stereolithography utilizing a laser exposure system having a diode pumped frequency quadrupled solid state laser
US5980812A (en) 1997-04-30 1999-11-09 Lawton; John A. Solid imaging process using component homogenization
US6085122A (en) * 1997-05-30 2000-07-04 Dtm Corporation End-of-vector laser power control in a selective laser sintering system
US6486997B1 (en) 1997-10-28 2002-11-26 3M Innovative Properties Company Reflective LCD projection system using wide-angle Cartesian polarizing beam splitter
US6066285A (en) 1997-12-12 2000-05-23 University Of Florida Solid freeform fabrication using power deposition
US6183092B1 (en) 1998-05-01 2001-02-06 Diane Troyer Laser projection apparatus with liquid-crystal light valves and scanning reading beam
US5991015A (en) 1998-10-06 1999-11-23 Trw Inc. Beam monitoring assembly
US6887710B2 (en) 1998-11-13 2005-05-03 Mesosystems Technology, Inc. Robust system for screening mail for biological agents
US6005717A (en) 1998-11-17 1999-12-21 Ceramoptec Industries, Inc. Diode laser beam combiner system
US6064528A (en) 1998-11-20 2000-05-16 Eastman Kodak Company Multiple laser array sources combined for use in a laser printer
DE19853947C1 (en) 1998-11-23 2000-02-24 Fraunhofer Ges Forschung Process chamber for selective laser fusing of material powder comprises a raised section in the cover surface above the structure volume, in which a window is arranged for the coupling in of the laser beam
TW388790B (en) 1999-04-13 2000-05-01 Inst Of Unclear Energy Res Roc An automatic sampling method and facility for the heterogeneous materials
JP2002542043A (en) 1999-04-27 2002-12-10 ジーエスアイ ルモニクス インコーポレイテッド Material processing system and method using multiple laser beams
US6405095B1 (en) 1999-05-25 2002-06-11 Nanotek Instruments, Inc. Rapid prototyping and tooling system
US6666556B2 (en) 1999-07-28 2003-12-23 Moxtek, Inc Image projection system with a polarizing beam splitter
JP2001100172A (en) 1999-09-28 2001-04-13 Hamamatsu Photonics Kk Spatial optical modulating device
JP2001124987A (en) * 1999-10-29 2001-05-11 Sony Corp Projection lens
US6491207B1 (en) * 1999-12-10 2002-12-10 General Electric Company Weld repair of directionally solidified articles
EP1115255A1 (en) 2000-01-04 2001-07-11 CTX Opto-Electronics Corporation Liquid crystal projector with two light sources
JP3980822B2 (en) * 2000-01-19 2007-09-26 浜松ホトニクス株式会社 Image projection apparatus and image projection method
US6558606B1 (en) 2000-01-28 2003-05-06 3D Systems, Inc. Stereolithographic process of making a three-dimensional object
US6424670B1 (en) 2000-02-17 2002-07-23 Universal Laser Systems, Inc. Apparatus and method for making laser sources and laser platforms interchangeable and interfaceable
US6499361B1 (en) * 2000-02-18 2002-12-31 Alkermes Controlled Therapeutics, Inc. Method and apparatus for uniform sorbate equilibration of solid samples
JP4052542B2 (en) * 2000-02-25 2008-02-27 富士フイルム株式会社 Printer
FI20000876A (en) 2000-04-12 2001-10-13 Metso Paper Inc A step conveyor
JP2001305040A (en) 2000-04-20 2001-10-31 Sumikinbussan Intec Corp Sampling system for inline grain size measuring machine
JP2001334583A (en) * 2000-05-25 2001-12-04 Minolta Co Ltd Three-dimensional molding apparatus
WO2001091924A1 (en) 2000-06-01 2001-12-06 Board Of Regents, The University Of Texas System Direct selective laser sintering of metals
US6682688B1 (en) * 2000-06-16 2004-01-27 Matsushita Electric Works, Ltd. Method of manufacturing a three-dimensional object
JP3820930B2 (en) 2000-08-02 2006-09-13 セイコーエプソン株式会社 Laser processing method and processing apparatus
US6587269B2 (en) 2000-08-24 2003-07-01 Cogent Light Technologies Inc. Polarization recovery system for projection displays
US6682684B1 (en) 2000-09-07 2004-01-27 Honeywell International Inc. Procedures for rapid build and improved surface characteristics in layered manufacture
US7088432B2 (en) 2000-09-27 2006-08-08 The Regents Of The University Of California Dynamic mask projection stereo micro lithography
GB0024227D0 (en) * 2000-10-04 2000-11-15 Secr Defence Air samplers
US6339966B1 (en) 2000-10-04 2002-01-22 Sanyasi R. Kalidindi Bulk powder sampler with removable partitions and method of using
DE10053742C5 (en) 2000-10-30 2006-06-08 Concept Laser Gmbh Device for sintering, ablating and / or inscribing by means of electromagnetic radiation and method for operating the device
DE60114453T2 (en) 2000-11-27 2006-07-13 National University Of Singapore METHOD AND DEVICE FOR PREPARING A THREE-DIMENSIONAL METAL PART USING HIGH-TEMPERATURE DIRECT LASER MELTS
JP2002178412A (en) * 2000-12-14 2002-06-26 Sanyo Electric Co Ltd Stereo lithographic apparatus and method for manufacturing stereo lithography
JP2002205338A (en) * 2001-01-11 2002-07-23 Minolta Co Ltd Powder material removing apparatus and three- dimensional shaping system
US20020090410A1 (en) 2001-01-11 2002-07-11 Shigeaki Tochimoto Powder material removing apparatus and three dimensional modeling system
US6621044B2 (en) 2001-01-18 2003-09-16 Anvik Corporation Dual-beam materials-processing system
US20020126727A1 (en) 2001-02-05 2002-09-12 Universal Laser Systems, Inc. Quick change laser design
US6969177B2 (en) 2001-03-23 2005-11-29 Wavien, Inc. Polarization recovery system using redirection
US20020149137A1 (en) 2001-04-12 2002-10-17 Bor Zeng Jang Layer manufacturing method and apparatus using full-area curing
TW522280B (en) * 2001-04-13 2003-03-01 Fusion Lighting Inc Projection systems
US6641778B2 (en) 2001-05-17 2003-11-04 National Research Council Of Canada Device and method for regulating flow of particulate material, especially small flows of fine powder
US6672722B2 (en) * 2001-06-19 2004-01-06 Intel Corporation Projection engine
JP2003080604A (en) * 2001-09-10 2003-03-19 Fuji Photo Film Co Ltd Laminate shaping apparatus
US6627016B2 (en) 2001-10-25 2003-09-30 Abb, Inc. (Flexible Automation Division) Robotic assembly process for plastic components
GB2383024B (en) 2001-12-13 2004-04-21 Ashton Ind Sales Ltd By-pass conveyor
AU2003239171A1 (en) * 2002-01-31 2003-09-02 Braintech Canada, Inc. Method and apparatus for single camera 3d vision guided robotics
US6781763B1 (en) 2002-04-01 2004-08-24 The United States Of America As Represented By The Secretary Of The Air Force Image analysis through polarization modulation and combination
RU2316748C2 (en) 2002-05-20 2008-02-10 Нортроп Грумман Корпорейшен Method and device for detecting point source of biological agent
US6822194B2 (en) * 2002-05-29 2004-11-23 The Boeing Company Thermocouple control system for selective laser sintering part bed temperature control
JP4110856B2 (en) 2002-06-28 2008-07-02 松下電工株式会社 Manufacturing method of mold
JP3839366B2 (en) * 2002-06-28 2006-11-01 株式会社リコー Sampling device for particle size distribution measurement
DE10235427A1 (en) 2002-08-02 2004-02-12 Eos Gmbh Electro Optical Systems Device for producing three-dimensional objects under the action of electromagnetic or particle radiation has a switching unit for switching the radiation between the construction regions so that each construction region is irradiated
US20040060639A1 (en) * 2002-08-13 2004-04-01 Dawn White Method of apparatus for ensuring uniform build quality during object consolidation
US20060111807A1 (en) * 2002-09-12 2006-05-25 Hanan Gothait Device, system and method for calibration in three-dimensional model printing
US20040084814A1 (en) 2002-10-31 2004-05-06 Boyd Melissa D. Powder removal system for three-dimensional object fabricator
US20060091120A1 (en) 2002-11-06 2006-05-04 Markle David A Recycling optical systems and methods for thermal processing
US20050049751A1 (en) * 2002-11-11 2005-03-03 Farnworth Warren M. Machine vision systems for use with programmable material consolidation apparatus and systems
SE524421C2 (en) * 2002-12-19 2004-08-10 Arcam Ab Apparatus and method for making a three-dimensional product
DE112004000301B4 (en) 2003-02-25 2010-05-20 Panasonic Electric Works Co., Ltd., Kadoma-shi Method and device for producing a three-dimensional object
DE10310385B4 (en) * 2003-03-07 2006-09-21 Daimlerchrysler Ag Method for the production of three-dimensional bodies by means of powder-based layer-building methods
US6867388B2 (en) * 2003-04-08 2005-03-15 Branson Ultrasonics Corporation Electronic masking laser imaging system
DE10318621A1 (en) 2003-04-24 2004-11-25 Siemens Ag Conveyor for the transport of load carriers
EP1475220A3 (en) 2003-05-09 2009-07-08 FUJIFILM Corporation Process for producing three-dimensional model, and three-dimensional model
US20050012246A1 (en) * 2003-06-19 2005-01-20 Kazutora Yoshino High resolution and rapid three dimensional object generator
US6920973B2 (en) 2003-06-19 2005-07-26 The Regents Of The University Of Michigan Integrated reconfigurable manufacturing system
US20050035085A1 (en) * 2003-08-13 2005-02-17 Stowell William Randolph Apparatus and method for reducing metal oxides on superalloy articles
JP4280583B2 (en) * 2003-08-25 2009-06-17 新光電気工業株式会社 Via formation method
DE10342882A1 (en) 2003-09-15 2005-05-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Apparatus and method for producing a three-dimensional shaped body
TW594437B (en) 2003-10-16 2004-06-21 Univ Nat Taiwan Science Tech Dynamic mask module
JP3839017B2 (en) * 2003-11-27 2006-11-01 ファナック株式会社 Laser processing equipment
US7146082B2 (en) 2003-12-23 2006-12-05 Intel Corporation Steering isolator for an opto-electronic assembly focusing apparatus
CN1914905A (en) 2004-01-30 2007-02-14 皇家飞利浦电子股份有限公司 Projection display with light recycling
TWM252024U (en) 2004-02-12 2004-12-01 Benq Corp Image display apparatus
JP2005250426A (en) 2004-03-02 2005-09-15 Plus Vision Corp Digital micromirror apparatus
JP2005254281A (en) 2004-03-11 2005-09-22 Mitsubishi Electric Corp Laser beam machining apparatus
JP2005262251A (en) 2004-03-17 2005-09-29 Shibaura Mechatronics Corp Laser beam machining apparatus
WO2005097475A1 (en) * 2004-03-30 2005-10-20 Valspar Sourcing, Inc. Selective laser sintering process and polymers used therein
US20050280185A1 (en) 2004-04-02 2005-12-22 Z Corporation Methods and apparatus for 3D printing
US20050242473A1 (en) 2004-04-28 2005-11-03 3D Systems, Inc. Uniform thermal distribution imaging
JP4561187B2 (en) 2004-05-26 2010-10-13 パナソニック電工株式会社 Method for producing three-dimensional shaped object and powder material recycling apparatus for producing three-dimensional shaped object
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
CN1268047C (en) 2004-07-06 2006-08-02 华北工学院 Method and apparatus for applying optical fiber array energy source to laser sintering rapid forming
DE102004041633A1 (en) * 2004-08-27 2006-03-02 Fockele, Matthias, Dr. Device for the production of moldings
US20080192205A1 (en) * 2004-10-22 2008-08-14 Koninklijke Philips Electronics, N.V. Projection Display Device
US20060091199A1 (en) * 2004-10-29 2006-05-04 Loughran Stephen A Retrieving information on material used in solid freeform fabrication
US7301592B2 (en) 2004-11-19 2007-11-27 Rohm And Haas Denmark Finance A/S Dark state light recycling film and display
DE602005024758D1 (en) 2004-12-06 2010-12-30 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method and semiconductor device manufacturing method
US7569174B2 (en) 2004-12-07 2009-08-04 3D Systems, Inc. Controlled densification of fusible powders in laser sintering
US7521652B2 (en) * 2004-12-07 2009-04-21 3D Systems, Inc. Controlled cooling methods and apparatus for laser sintering part-cake
US7136147B2 (en) 2004-12-20 2006-11-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7509738B2 (en) 2005-01-26 2009-03-31 Honeywell International, Inc. Solid-free-form fabrication of hot gas valve discs
WO2006083998A2 (en) 2005-02-03 2006-08-10 Pd-Ld, Inc. High-power, phased-locked, laser arrays
US7495852B2 (en) * 2005-02-28 2009-02-24 Siimpel Corporation Zoom lens assembly
US20060214335A1 (en) 2005-03-09 2006-09-28 3D Systems, Inc. Laser sintering powder recycle system
US7357629B2 (en) 2005-03-23 2008-04-15 3D Systems, Inc. Apparatus and method for aligning a removable build chamber within a process chamber
US7790096B2 (en) 2005-03-31 2010-09-07 3D Systems, Inc. Thermal management system for a removable build chamber for use with a laser sintering system
US7234820B2 (en) 2005-04-11 2007-06-26 Philips Lumileds Lighting Company, Llc Illuminators using reflective optics with recycling and color mixing
DE102005016940B4 (en) 2005-04-12 2007-03-15 Eos Gmbh Electro Optical Systems Apparatus and method for applying layers of powdered material to a surface
US20060232750A1 (en) 2005-04-14 2006-10-19 Sanyo Electric Co., Ltd. Optical member and illuminating device
US7804642B2 (en) 2005-05-16 2010-09-28 Olympus Corporation Scanning examination apparatus
DE102005024790A1 (en) 2005-05-26 2006-12-07 Eos Gmbh Electro Optical Systems Radiant heating for heating the building material in a laser sintering device
US20100182582A1 (en) * 2005-06-13 2010-07-22 Asml Netherlands B.V, Passive reticle tool, a lithographic apparatus and a method of patterning a device in a lithography tool
DE102005030854B3 (en) 2005-07-01 2007-03-08 Eos Gmbh Electro Optical Systems Device for producing a three-dimensional object
US20070008311A1 (en) * 2005-07-05 2007-01-11 Kazutora Yoshino High resolution and rapid three dimensional object generator advanced
US20070024825A1 (en) 2005-07-26 2007-02-01 Stephanes Maria De Vaan Adrian Light valve projection systems with light recycling
JP3980610B2 (en) 2005-07-26 2007-09-26 株式会社アスペクト Powder sintering additive manufacturing equipment
US20070026102A1 (en) * 2005-07-28 2007-02-01 Devos John A Systems and methods of solid freeform fabrication with improved powder supply bins
US7700016B2 (en) 2005-08-02 2010-04-20 Solidscape, Inc. Method and apparatus for fabricating three dimensional models
EP1759791A1 (en) 2005-09-05 2007-03-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Apparatus and method for building a three-dimensional article
JP2009508723A (en) 2005-09-20 2009-03-05 ピーティーエス ソフトウェア ビーブイ Apparatus for constructing three-dimensional article and method for constructing three-dimensional article
US20070077323A1 (en) * 2005-09-30 2007-04-05 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7444046B2 (en) 2005-10-18 2008-10-28 Nlight Photonics Corporation Diode laser array coupling optic and system
GB0522974D0 (en) 2005-11-10 2005-12-21 Sherwood Technology Ltd Hand-held laser device
US20070164202A1 (en) * 2005-11-16 2007-07-19 Wurz David A Large depth of field line scan camera
US20070122560A1 (en) 2005-11-30 2007-05-31 Honeywell International, Inc. Solid-free-form fabrication process including in-process component deformation
US8728387B2 (en) * 2005-12-06 2014-05-20 Howmedica Osteonics Corp. Laser-produced porous surface
WO2007072837A1 (en) 2005-12-20 2007-06-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device
EP1804100B1 (en) 2005-12-30 2018-02-21 Datalogic IP TECH S.r.l. Device and method for focusing a laser light beam
WO2007114895A2 (en) * 2006-04-06 2007-10-11 Z Corporation Production of three-dimensional objects by use of electromagnetic radiation
DE102006019964C5 (en) 2006-04-28 2021-08-26 Envisiontec Gmbh Device and method for producing a three-dimensional object by means of mask exposure
US20070273797A1 (en) 2006-05-26 2007-11-29 Silverstein Barry D High efficiency digital cinema projection system with increased etendue
KR101537494B1 (en) 2006-05-26 2015-07-16 3디 시스템즈 인코오퍼레이티드 Apparatus and methods for handling materials in a 3-d printer
EP2032345B1 (en) 2006-06-20 2010-05-05 Katholieke Universiteit Leuven Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing
JP4353219B2 (en) 2006-08-14 2009-10-28 日産自動車株式会社 Laser processing apparatus and control method of laser processing apparatus
US20080061531A1 (en) 2006-09-07 2008-03-13 Nugent Paul J Transporting apparatus
US8133163B2 (en) 2006-10-03 2012-03-13 Smurfit-Stone Container Enterprises, Inc. Apparatus for forming a barrel from a blank
WO2008044693A1 (en) 2006-10-10 2008-04-17 Shofu Inc. Modeling data creating system, manufacturing method, and modeling data creating program
EP2088123A1 (en) * 2006-11-10 2009-08-12 Sumitomo Electric Industries, Ltd. Si-O CONTAINING HYDROGENATED CARBON FILM, OPTICAL DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE Si-O CONTAINING HYDROGENATED FILM AND THE OPTICAL DEVICE
DE102006055050A1 (en) 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Apparatus for layering a three-dimensional object and method for adjusting an optical system therefrom
DE102006055054A1 (en) 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Apparatus for layering a three-dimensional object
JP5018076B2 (en) * 2006-12-22 2012-09-05 ソニー株式会社 Stereolithography apparatus and stereolithography method
JP4957242B2 (en) * 2006-12-28 2012-06-20 ソニー株式会社 Stereolithography equipment
JP2008164955A (en) 2006-12-28 2008-07-17 Konica Minolta Opto Inc Laser projection device
US7706910B2 (en) * 2007-01-17 2010-04-27 3D Systems, Inc. Imager assembly and method for solid imaging
DE102007006478B4 (en) 2007-02-09 2011-06-30 Universität Stuttgart, 70174 Apparatus and method for supplying sinterable powder to an application site of a laser sintering device
US7777155B2 (en) * 2007-02-21 2010-08-17 United Technologies Corporation System and method for an integrated additive manufacturing cell for complex components
JP2008221299A (en) 2007-03-14 2008-09-25 Hitachi Via Mechanics Ltd Laser beam machining apparatus
US20080231953A1 (en) 2007-03-22 2008-09-25 Young Garrett J System and Method for LED Polarization Recycling
DE102007014968A1 (en) * 2007-03-28 2008-10-02 Fockele, Matthias, Dr. Device for the production of articles
US20080246705A1 (en) 2007-04-03 2008-10-09 Texas Instruments Incorporated Off-state light recapturing in display systems employing spatial light modulators
US7515986B2 (en) 2007-04-20 2009-04-07 The Boeing Company Methods and systems for controlling and adjusting heat distribution over a part bed
EP2142953B1 (en) * 2007-04-22 2019-06-05 Lumus Ltd A collimating optical device and system
US7821713B2 (en) 2007-05-18 2010-10-26 3M Innovative Properties Company Color light combining system for optical projector
JP4916392B2 (en) * 2007-06-26 2012-04-11 パナソニック株式会社 Manufacturing method and manufacturing apparatus for three-dimensional shaped object
EP2011631B1 (en) 2007-07-04 2012-04-18 Envisiontec GmbH Process and device for producing a three-dimensional object
DE102007033434A1 (en) * 2007-07-18 2009-01-22 Voxeljet Technology Gmbh Method for producing three-dimensional components
US10226919B2 (en) 2007-07-18 2019-03-12 Voxeljet Ag Articles and structures prepared by three-dimensional printing method
JP2009034694A (en) 2007-07-31 2009-02-19 Disco Abrasive Syst Ltd Laser beam machining method
JP5147849B2 (en) * 2007-09-14 2013-02-20 パナソニック株式会社 projector
EP2481555B1 (en) 2007-09-17 2021-08-25 3D Systems, Inc. Region-based supports for parts produced by solid freeform fabrication
WO2009042671A1 (en) 2007-09-24 2009-04-02 The Board Of Trustees Of The University Of Illinois Three-dimensional microfabricated bioreactors with embedded capillary network
DE102007048385B3 (en) 2007-10-09 2009-01-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Production of components using generative processes, especially fused deposition modeling, comprises forming grid around component which is gripped to manipulate component, without direct contact with component itself
JP5176853B2 (en) 2007-10-09 2013-04-03 住友電気工業株式会社 Optical module and light source device including the same
GB0719747D0 (en) 2007-10-10 2007-11-21 Materialise Nv Method and apparatus for automatic support generation for an object made by means of a rapid prototype production method
US20090101278A1 (en) 2007-10-17 2009-04-23 Louis Laberge-Lebel Methods for preparing freeform three-dimensional structures
DE102007050679A1 (en) * 2007-10-21 2009-04-23 Voxeljet Technology Gmbh Method and device for conveying particulate material in the layered construction of models
GB2453945A (en) 2007-10-23 2009-04-29 Rolls Royce Plc Apparatus for Additive Manufacture Welding
JP4258567B1 (en) 2007-10-26 2009-04-30 パナソニック電工株式会社 Manufacturing method of three-dimensional shaped object
WO2009054445A1 (en) * 2007-10-26 2009-04-30 Panasonic Electric Works Co., Ltd. Production device and production method of metal powder sintered component
EP2052693B2 (en) * 2007-10-26 2021-02-17 Envisiontec GmbH Process and freeform fabrication system for producing a three-dimensional object
US7895879B2 (en) * 2007-12-06 2011-03-01 International Business Machines Corporation Sample holder for holding samples at pre-determined angles
US8070473B2 (en) * 2008-01-08 2011-12-06 Stratasys, Inc. System for building three-dimensional objects containing embedded inserts, and method of use thereof
US9348208B2 (en) 2008-01-22 2016-05-24 Nikon Corporation Projector having a light-emitting element, image forming unit and reflecting member
CN101526443A (en) 2008-03-04 2009-09-09 南通联亚药业有限公司 Powder sampling device
US8126028B2 (en) 2008-03-31 2012-02-28 Novasolar Holdings Limited Quickly replaceable processing-laser modules and subassemblies
US8636496B2 (en) * 2008-05-05 2014-01-28 Georgia Tech Research Corporation Systems and methods for fabricating three-dimensional objects
DE102008031587A1 (en) * 2008-07-03 2010-01-07 Eos Gmbh Electro Optical Systems Apparatus for layering a three-dimensional object
GB0813241D0 (en) 2008-07-18 2008-08-27 Mcp Tooling Technologies Ltd Manufacturing apparatus and method
US8515013B2 (en) 2008-08-08 2013-08-20 Koninklijke Philips N.V. Grid and method of manufacturing a grid for selective transmission of electromagnetic radiation, particularly X-ray radiation
US9027668B2 (en) * 2008-08-20 2015-05-12 Foro Energy, Inc. Control system for high power laser drilling workover and completion unit
US20100253769A1 (en) * 2008-09-04 2010-10-07 Laser Light Engines Optical System and Assembly Method
GB0816308D0 (en) 2008-09-05 2008-10-15 Mtt Technologies Ltd Optical module
US8155775B2 (en) 2008-10-02 2012-04-10 Stratasys, Inc. Support structure packaging
US8048359B2 (en) 2008-10-20 2011-11-01 3D Systems, Inc. Compensation of actinic radiation intensity profiles for three-dimensional modelers
GB0819935D0 (en) * 2008-10-30 2008-12-10 Mtt Technologies Ltd Additive manufacturing apparatus and method
EP2184139B1 (en) * 2008-11-10 2011-03-30 JENOPTIK Automatisierungstechnik GmbH Device for highly dynamic 3D machining of a workpiece with laser beam
US8666142B2 (en) 2008-11-18 2014-03-04 Global Filtration Systems System and method for manufacturing
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
DE202009002387U1 (en) 2008-12-22 2010-05-12 Maiorova, Tatiana, Dmitrov Optical arrangement for changing an imaging ratio or a refractive power
MX2011006850A (en) 2008-12-23 2011-08-15 Xoma Technology Ltd Flexible manufacturing system.
WO2010083997A2 (en) 2009-01-23 2010-07-29 Eos Gmbh Electro Optical Systems Method and system for reusing residual powder from an installation for the rapid prototyping of three-dimensional objects
WO2010091100A1 (en) * 2009-02-03 2010-08-12 Abbott Cardiovascular Systems Inc. Multiple beam laser system for forming stents
IL197349A0 (en) 2009-03-02 2009-12-24 Orbotech Ltd A method and system for electrical circuit repair
JP2010204333A (en) * 2009-03-03 2010-09-16 Seiko Epson Corp Projector
US7903701B2 (en) 2009-03-27 2011-03-08 Electro Scientific Industries, Inc. Intracavity harmonic generation using a recycled intermediate harmonic
DE102009015130A1 (en) 2009-03-31 2010-10-07 Sintermask Gmbh Shipping containers
US8326024B2 (en) * 2009-04-14 2012-12-04 Global Filtration Systems Method of reducing the force required to separate a solidified object from a substrate
US8470231B1 (en) 2009-06-01 2013-06-25 Stratasys Ltd. Three-dimensional printing process for producing a self-destructible temporary structure
KR20120039012A (en) 2009-07-15 2012-04-24 더 세크러터리 오브 스테이트 포 디펜스 Optically addressed light valve
US8160113B2 (en) 2009-07-21 2012-04-17 Mobius Photonics, Inc. Tailored pulse burst
WO2011014743A2 (en) 2009-07-31 2011-02-03 North Carolina State University Beam steering devices including stacked liquid crystal polarization gratings and related methods of operation
MX345159B (en) 2009-08-16 2017-01-18 G-Con Mfg Inc Modular, self-contained, mobile clean room.
DE102009037815B4 (en) 2009-08-18 2016-06-09 Sintermask Gmbh Method and device for producing a three-dimensional object
EP3709061B1 (en) 2009-08-19 2022-12-14 Lawrence Livermore National Security, LLC Method of fabricating and method of using a diffractive optic
US8902497B2 (en) 2009-08-20 2014-12-02 Lawrence Livermore National Security, Llc Spatial filters for high power lasers
EP2286982B1 (en) * 2009-08-20 2013-09-25 Matthias Fockele Device for manufacturing moulded bodies by layered construction using a material powder
CN101997187B (en) 2009-08-21 2014-04-23 鸿富锦精密工业(深圳)有限公司 Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly
TW201111087A (en) * 2009-08-25 2011-04-01 Masonite Corp Methods of forming graphics on a substrate and laser active coatings
EP2289462B1 (en) * 2009-08-25 2012-05-30 BEGO Medical GmbH Device and method for continuous generative production
JP2011048070A (en) 2009-08-26 2011-03-10 Sanyo Electric Co Ltd Optical element, optical unit, and image display device of projection type
GB2473642A (en) * 2009-09-21 2011-03-23 Anthony Miles System for identifying compatibility of printing media and consumables
JP5653358B2 (en) 2009-10-21 2015-01-14 パナソニック株式会社 Manufacturing method and manufacturing apparatus for three-dimensional shaped object
ES2514520T3 (en) 2009-12-04 2014-10-28 Slm Solutions Gmbh Optical irradiation unit for a plant for the production of workpieces by irradiating dust layers with laser radiation
US9174390B2 (en) * 2009-12-30 2015-11-03 DePuy Synthes Products, Inc. Integrated multi-material implants and methods of manufacture
DE102010004035A1 (en) * 2010-01-05 2011-07-07 EOS GmbH Electro Optical Systems, 82152 Device for the generative production of a three-dimensional object with an insulated construction field
US8018980B2 (en) 2010-01-25 2011-09-13 Lawrence Livermore National Security, Llc Laser diode package with enhanced cooling
DE102010008960A1 (en) 2010-02-23 2011-08-25 EOS GmbH Electro Optical Systems, 82152 Method and device for producing a three-dimensional object that is particularly suitable for use in microtechnology
US8575528B1 (en) 2010-03-03 2013-11-05 Jeffrey D. Barchers System and method for coherent phased array beam transmission and imaging
DE102010011724B3 (en) * 2010-03-17 2011-02-17 Glatt Systemtechnik Gmbh Device for extracting e.g. pharmaceutical substance, from powder flow, has extraction pincer provided on container in resting position of slider or axially above sample cavity, where extraction pincer is connected with sample container
EP2555902B1 (en) 2010-03-31 2018-04-25 Sciaky Inc. Raster methodology for electron beam layer manufacturing using closed loop control
US8553311B2 (en) 2010-04-02 2013-10-08 Electro Scientific Industries, Inc. Method for accomplishing high-speed intensity variation of a polarized output laser beam
GB201006154D0 (en) 2010-04-14 2010-05-26 Materials Solutions A method of forming an article using a powder layer manufacturing process
JP4566285B1 (en) 2010-04-14 2010-10-20 株式会社松浦機械製作所 Manufacturing equipment for 3D modeling products
JP4566286B1 (en) 2010-04-14 2010-10-20 株式会社松浦機械製作所 Manufacturing equipment for 3D modeling products
DE102010015451A1 (en) * 2010-04-17 2011-10-20 Voxeljet Technology Gmbh Method and device for producing three-dimensional objects
DE202010005162U1 (en) * 2010-04-17 2010-11-04 Evonik Degussa Gmbh Device for reducing the lower installation space of a laser sintering system
JP5585940B2 (en) 2010-04-22 2014-09-10 株式会社リコー Surface emitting laser element, surface emitting laser array, optical scanning device, image forming apparatus, and method for manufacturing surface emitting laser element
DE102010020158A1 (en) * 2010-05-11 2011-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for producing three-dimensional structures
DE102010020416A1 (en) 2010-05-12 2011-11-17 Eos Gmbh Electro Optical Systems Construction space changing device and a device for producing a three-dimensional object with a construction space changing device
JP2011241450A (en) * 2010-05-19 2011-12-01 Keijiro Yamamoto Layered manufacturing method and layered manufacturing apparatus
FR2961942B1 (en) 2010-06-25 2014-04-11 Tn Int CONTAINER FOR THE TRANSPORT AND / OR STORAGE OF RADIOACTIVE MATERIALS
DE102010027071A1 (en) 2010-07-13 2012-01-19 Voxeljet Technology Gmbh Device for producing three-dimensional models by means of layer application technology
DE202010010771U1 (en) * 2010-07-28 2011-11-14 Cl Schutzrechtsverwaltungs Gmbh Laser melting apparatus for producing a three-dimensional component
US8965156B2 (en) 2010-08-12 2015-02-24 Octrolix Bv Beam combiner
DE102010034311A1 (en) * 2010-08-13 2012-02-16 Mtu Aero Engines Gmbh Apparatus for manufacturing, repairing and/or replacing a component, comprises a powder production device for producing a powder, a powder processing device that solidifies the powder produced by the production device and a collecting unit
US8668859B2 (en) 2010-08-18 2014-03-11 Makerbot Industries, Llc Automated 3D build processes
US8282380B2 (en) 2010-08-18 2012-10-09 Makerbot Industries Automated 3D build processes
CN102380264B (en) 2010-08-31 2014-04-09 研能科技股份有限公司 Automatic powder recovery device
FR2964458B1 (en) 2010-09-06 2012-09-07 Commissariat Energie Atomique HIGH-RESOLUTION CARTOGRAPHY AND ANALYSIS DEVICE FOR ELEMENTS IN SOLIDS
DE11826290T1 (en) 2010-09-25 2019-10-10 Ipg Photonics (Canada) Inc. PROCESSES AND SYSTEMS FOR COHERENT IMAGING AND FEEDBACK CONTROL FOR MODIFYING MATERIALS
US8514475B2 (en) 2010-10-27 2013-08-20 Lawrence Livermore National Security, Llc Electro-optic device with gap-coupled electrode
WO2012058599A1 (en) 2010-10-29 2012-05-03 Lawrence Livermore National Security, Llc Method and system for compact efficient laser architecture
CN103429075B (en) 2010-12-21 2016-08-10 斯特塔西有限公司 The method and system of the Reuse of materials in adding type manufacture system
US9409255B1 (en) 2011-01-04 2016-08-09 Nlight, Inc. High power laser imaging systems
US9283593B2 (en) 2011-01-13 2016-03-15 Siemens Energy, Inc. Selective laser melting / sintering using powdered flux
TW201232153A (en) 2011-01-26 2012-08-01 Hon Hai Prec Ind Co Ltd Laser projecting device
AU2012212488B2 (en) 2011-01-31 2017-02-09 Global Filtration Systems, A Dba Of Gulf Filtration Systems Inc. Method and apparatus for making three-dimensional objects from multiple solidifiable materials
BE1020619A3 (en) 2011-02-04 2014-02-04 Layerwise N V METHOD FOR LAYERALLY MANUFACTURING THIN-WANDED STRUCTURES.
DE202011003443U1 (en) * 2011-03-02 2011-12-23 Bego Medical Gmbh Device for the generative production of three-dimensional components
WO2012119144A1 (en) * 2011-03-03 2012-09-07 Cornell University Method for specifying and fabricating an object, associated apparatus, and applications
US8462828B1 (en) 2011-03-04 2013-06-11 The United States Of Americas As Represented By The Secretary Of The Navy System for generating coherent single-frequency single transverse mode light pulses
US8279544B1 (en) 2011-03-18 2012-10-02 Premier Systems USA, Inc Selectively attachable and removable lenses for communication devices
WO2012131481A1 (en) 2011-03-29 2012-10-04 Inspire Ag, Irpd Part structure built by metal powder based added manufacturing
FR2974524B1 (en) 2011-04-29 2014-09-12 Phenix Systems METHOD OF MAKING AN OBJECT BY SOLIDIFYING POWDER USING A LASER BEAM WITH INSERTION OF A DEFORMATION ABSORPTION MEMBER
US9485480B2 (en) 2011-05-02 2016-11-01 The Research Foundation Of The City University Of New York Laser based projection display system
US8569187B2 (en) 2011-06-24 2013-10-29 Applied Materials, Inc. Thermal processing apparatus
JP5447445B2 (en) * 2011-07-11 2014-03-19 株式会社リコー Illumination optical system, exposure apparatus, and projection apparatus
JP2013022723A (en) * 2011-07-26 2013-02-04 Toyota Industries Corp Conveying device
US9246299B2 (en) 2011-08-04 2016-01-26 Martin A. Stuart Slab laser and amplifier
US8700205B2 (en) 2011-08-05 2014-04-15 GM Global Technology Operations LLC Moving stop station for robotic assembly
JP2013049137A (en) 2011-08-30 2013-03-14 Sony Corp Powder removing apparatus, molding system, and method of manufacturing molded object
EP2565018B1 (en) 2011-08-31 2020-12-30 Fit Ag Data model for describing a component manufactured using a layer construction method
DE102011111498A1 (en) * 2011-08-31 2013-02-28 Voxeljet Technology Gmbh Device for the layered construction of models
US9192056B2 (en) 2011-09-12 2015-11-17 Lawrence Livermore National Security, Llc Methods and system for controlled laser-driven explosive bonding
EP2759137A4 (en) 2011-09-14 2015-08-19 Intel Corp Holographic display systems, methods and devices
US9108360B2 (en) 2011-09-23 2015-08-18 Stratasys, Inc. Gantry assembly for use in additive manufacturing system
US9069183B2 (en) * 2011-09-28 2015-06-30 Applied Materials, Inc. Apparatus and method for speckle reduction in laser processing equipment
JP2013073003A (en) * 2011-09-28 2013-04-22 Oki Data Corp Developing device and image forming apparatus
TWI576300B (en) 2011-09-30 2017-04-01 Ats自動模具系統股份有限公司 System and method for providing vacuum to a moving element
US20130101746A1 (en) * 2011-10-21 2013-04-25 John J. Keremes Additive manufacturing management of large part build mass
US20130101729A1 (en) * 2011-10-21 2013-04-25 John J. Keremes Real time cap flattening during heat treat
US20130101728A1 (en) * 2011-10-21 2013-04-25 John J. Keremes Additive manufacturing in situ stress relief
CH705662A1 (en) * 2011-11-04 2013-05-15 Alstom Technology Ltd Process for producing articles of a solidified by gamma-prime nickel-base superalloy excretion by selective laser melting (SLM).
US20130112672A1 (en) 2011-11-08 2013-05-09 John J. Keremes Laser configuration for additive manufacturing
DE102011119319A1 (en) * 2011-11-24 2013-05-29 Slm Solutions Gmbh Optical irradiation device for a plant for the production of three-dimensional workpieces by irradiation of powder layers of a raw material powder with laser radiation
FR2984779B1 (en) * 2011-12-23 2015-06-19 Michelin Soc Tech METHOD AND APPARATUS FOR REALIZING THREE DIMENSIONAL OBJECTS
TWI472427B (en) 2012-01-20 2015-02-11 財團法人工業技術研究院 Device and method for powder distribution and additive manufacturing method using the same
US8915728B2 (en) * 2012-01-27 2014-12-23 United Technologies Corporation Multi-dimensional component build system and process
DE102012101102A1 (en) 2012-02-10 2013-08-14 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and arrangement with a plurality of such components
US9172208B1 (en) 2012-02-21 2015-10-27 Lawrence Livermore National Security, Llc Raman beam combining for laser brightness enhancement
GB2499669B (en) 2012-02-24 2016-08-10 Malcolm Ward-Close Charles Processing of metal or alloy objects
JP5772668B2 (en) * 2012-03-08 2015-09-02 カシオ計算機株式会社 Three-dimensional modeling method, three-dimensional modeling complex, and three-dimensional modeling apparatus
JP5926592B2 (en) * 2012-03-27 2016-05-25 川崎重工業株式会社 Laser processing equipment for patterning
GB201205591D0 (en) 2012-03-29 2012-05-16 Materials Solutions Apparatus and methods for additive-layer manufacturing of an article
CN103358555A (en) * 2012-03-30 2013-10-23 通用电气公司 Multi-beam laser scanning system and method for laser rapid prototyping processing equipment
US9064671B2 (en) 2012-05-09 2015-06-23 Arcam Ab Method and apparatus for generating electron beams
US10415390B2 (en) 2012-05-11 2019-09-17 Siemens Energy, Inc. Repair of directionally solidified alloys
US9126167B2 (en) 2012-05-11 2015-09-08 Arcam Ab Powder distribution in additive manufacturing
US20130309121A1 (en) 2012-05-16 2013-11-21 Crucible Intellectual Property Llc Layer-by-layer construction with bulk metallic glasses
EP2666613A1 (en) 2012-05-25 2013-11-27 Technische Universität Darmstadt Invention related to auxiliary structures for the production of components by means of generative or additive methods
DE102012010272A1 (en) 2012-05-25 2013-11-28 Voxeljet Technology Gmbh Method for producing three-dimensional models with special construction platforms and drive systems
EP2671706A1 (en) * 2012-06-04 2013-12-11 Ivoclar Vivadent AG Method for creating an object
DE102012012363A1 (en) 2012-06-22 2013-12-24 Voxeljet Technology Gmbh Apparatus for building up a layer body with a storage or filling container movable along the discharge container
US20160193695A1 (en) * 2012-07-27 2016-07-07 Aerojet Rocketdyne Of De, Inc. Solid axisymmetric powder bed for selective laser melting
FR2993805B1 (en) * 2012-07-27 2014-09-12 Phenix Systems DEVICE FOR MANUFACTURING THREE-DIMENSIONAL OBJECTS WITH SUPERIMPOSED LAYERS AND METHOD OF MANUFACTURING THE SAME
FR2994113B1 (en) 2012-07-31 2017-10-06 Michelin & Cie MACHINE AND PROCESS FOR ADDITIVE MANUFACTURE OF POWDER
US9168697B2 (en) 2012-08-16 2015-10-27 Stratasys, Inc. Additive manufacturing system with extended printing volume, and methods of use thereof
US9636868B2 (en) 2012-08-16 2017-05-02 Stratasys, Inc. Additive manufacturing system with extended printing volume, and methods of use thereof
US9511547B2 (en) 2012-08-16 2016-12-06 Stratasys, Inc. Method for printing three-dimensional parts with additive manufacturing systems using scaffolds
US9327350B2 (en) * 2012-08-16 2016-05-03 Stratasys, Inc. Additive manufacturing technique for printing three-dimensional parts with printed receiving surfaces
US8888480B2 (en) 2012-09-05 2014-11-18 Aprecia Pharmaceuticals Company Three-dimensional printing system and equipment assembly
AU2013313053B2 (en) * 2012-09-05 2015-04-30 Aprecia Pharmaceuticals LLC Three-dimensional printing system and equipment assembly
JP6538558B2 (en) 2012-09-06 2019-07-03 イーティーエックスイー−ティーエーアール、 エス.エー. Method and apparatus for laser curing on workpiece surfaces
US9149870B2 (en) * 2012-09-14 2015-10-06 Aerojet Rocketdyne Of De, Inc. Additive manufacturing chamber with reduced load
TWI562854B (en) * 2012-10-30 2016-12-21 Hon Hai Prec Ind Co Ltd Device for manufacturing mold core
EP3632593A1 (en) 2012-11-01 2020-04-08 General Electric Company Additive manufacturing method
JP6342912B2 (en) 2012-11-08 2018-06-13 ディーディーエム システムズ, インコーポレイテッド Additive manufacturing and repair of metal components
CN105163922B (en) 2012-11-08 2018-11-06 Ddm系统有限责任公司 System and method for manufacturing three-dimension object
EP2730353B1 (en) * 2012-11-12 2022-09-14 Airbus Operations GmbH Additive layer manufacturing method and apparatus
EP2737965A1 (en) 2012-12-01 2014-06-04 Alstom Technology Ltd Method for manufacturing a metallic component by additive laser manufacturing
US10132027B2 (en) * 2012-12-13 2018-11-20 Sewbo, Inc. Facilitating the assembly of goods by temporarily altering attributes of flexible component materials
WO2014095208A1 (en) * 2012-12-17 2014-06-26 Arcam Ab Method and apparatus for additive manufacturing
JPWO2014104083A1 (en) 2012-12-27 2017-01-12 コニカミノルタ株式会社 Projection lens and projector having zoom function
US9364897B2 (en) 2012-12-29 2016-06-14 United Technologies Corporation Method and apparatus for reconditioning oxidized powder
US9429023B2 (en) 2013-01-14 2016-08-30 Honeywell International Inc. Gas turbine engine components and methods for their manufacture using additive manufacturing techniques
US20150125335A1 (en) 2013-11-05 2015-05-07 Gerald J. Bruck Additive manufacturing using a fluidized bed of powdered metal and powdered flux
US9289946B2 (en) 2013-02-01 2016-03-22 Massachusetts Institute Of Technology Automated three-dimensional printer part removal
BR112015017976A2 (en) * 2013-02-12 2017-07-11 Carbon3D Inc continuous liquid interphase printing
EP2956269B1 (en) 2013-02-15 2021-10-13 Matthew Fagan Method and system of processing of a long product
JP2014164027A (en) 2013-02-22 2014-09-08 Adtec Engineeng Co Ltd Exposure optical system, exposure head, and exposure apparatus
US9308583B2 (en) 2013-03-05 2016-04-12 Lawrence Livermore National Security, Llc System and method for high power diode based additive manufacturing
CN203109233U (en) 2013-03-07 2013-08-07 余振新 Mechanical structure of powdered material selective laser sintering forming device
EP2969489B1 (en) 2013-03-12 2019-04-24 Orange Maker Llc 3d printing using spiral buildup
CN105142826B (en) 2013-03-13 2018-01-30 联合工艺公司 Uninterrupted filtration system for selective laser melting powder bed increment manufacturing process
US9110294B2 (en) * 2013-03-15 2015-08-18 Christie Digital Systems Usa, Inc. Imaging with shaped highlight beam
US9931785B2 (en) 2013-03-15 2018-04-03 3D Systems, Inc. Chute for laser sintering systems
US9669583B2 (en) 2013-03-15 2017-06-06 Renishaw Plc Selective laser solidification apparatus and method
US20140265049A1 (en) * 2013-03-15 2014-09-18 Matterfab Corp. Cartridge for an additive manufacturing apparatus and method
US8977378B2 (en) 2013-03-15 2015-03-10 Northeastern University Systems and methods of using a hieroglyphic machine interface language for communication with auxiliary robotics in rapid fabrication environments
DE102013205029A1 (en) 2013-03-21 2014-09-25 Siemens Aktiengesellschaft Method for laser melting with at least one working laser beam
EP3782798B1 (en) 2013-04-03 2022-03-09 SLM Solutions Group AG Method and apparatus for producing three-dimensional work pieces
US20140302187A1 (en) 2013-04-04 2014-10-09 Tyco Electronics Corporation Powder dam for powder bed laser sintering device
US20140303942A1 (en) 2013-04-05 2014-10-09 Formlabs, Inc. Additive fabrication support structures
DE102013206542A1 (en) 2013-04-12 2014-10-16 Matthias Fockele Powder processing device
WO2014172496A1 (en) 2013-04-19 2014-10-23 United Technologies Corporation Build plate and apparatus for additive manufacturing
US9676031B2 (en) 2013-04-23 2017-06-13 Arcam Ab Method and apparatus for forming a three-dimensional article
CN105209192B (en) * 2013-04-26 2018-06-01 联合工艺公司 Local pollution detection in increasing material manufacturing
US10971896B2 (en) 2013-04-29 2021-04-06 Nuburu, Inc. Applications, methods and systems for a laser deliver addressable array
CA2910559C (en) 2013-04-29 2021-06-01 Mark S. Zediker Devices, systems, and methods for three-dimensional printing
US9555582B2 (en) 2013-05-07 2017-01-31 Google Technology Holdings LLC Method and assembly for additive manufacturing
US9446871B2 (en) 2013-05-24 2016-09-20 L'Air Liquide Société Anonyme Pour L'Étude Et L'Exploitation Des Procedes Georges Claude Trolley and method of using the trolley for vertical rolling
US10335901B2 (en) 2013-06-10 2019-07-02 Renishaw Plc Selective laser solidification apparatus and method
GB201310398D0 (en) 2013-06-11 2013-07-24 Renishaw Plc Additive manufacturing apparatus and method
FR3006606B1 (en) 2013-06-11 2015-07-03 Tech Avancees Et Membranes Industrielles PROCESS FOR MANUFACTURING FILTRATION MEMBRANES BY ADDITIVE TECHNIQUE AND MEMBRANES OBTAINED
US10166751B2 (en) 2013-06-14 2019-01-01 Lawrence Livermore National Security, Llc Method for enhanced additive manufacturing
GB201310762D0 (en) 2013-06-17 2013-07-31 Rolls Royce Plc An additive layer manufacturing method
WO2015002517A1 (en) 2013-07-05 2015-01-08 한국전자통신연구원 Virtual sound image localization method for two dimensional and three dimensional spaces
CN103341625B (en) 2013-07-10 2015-05-13 湖南航天工业总公司 3D printing manufacturing device and method of metal parts
DE102013011676A1 (en) 2013-07-11 2015-01-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for generative component production
EP2832528B1 (en) * 2013-07-31 2021-08-25 Limacorporate S.p.A. Method and apparatus for the recovery and regeneration of metal powder in ebm applications
US20150033561A1 (en) 2013-08-01 2015-02-05 Gerald J. Bruck Laser melt particle injection hardfacing
DE102013109162A1 (en) 2013-08-23 2015-02-26 Fit Fruth Innovative Technologien Gmbh Device for producing three-dimensional objects
EP2843192B1 (en) * 2013-08-28 2021-03-24 Safran Aero Boosters SA Composite blade made by additive manufacturing and associated manufacturing process
US9688024B2 (en) 2013-08-30 2017-06-27 Adobe Systems Incorporated Adaptive supports for 3D printing
TWI618640B (en) * 2013-09-13 2018-03-21 Silicon Touch Technology Inc. Three dimensional printing system, and method for three dimensional printing
US10052820B2 (en) * 2013-09-13 2018-08-21 Made In Space, Inc. Additive manufacturing of extended structures
FR3010785B1 (en) * 2013-09-18 2015-08-21 Snecma METHOD FOR CONTROLLING THE ENERGY DENSITY OF A LASER BEAM BY IMAGE ANALYSIS AND CORRESPONDING DEVICE
GB201316815D0 (en) 2013-09-23 2013-11-06 Renishaw Plc Additive manufacturing apparatus and method
EP2865465B1 (en) 2013-09-27 2018-01-17 Ansaldo Energia IP UK Limited Method for manufacturing a metallic component by additive laser manufacturing
US10086564B2 (en) 2013-10-04 2018-10-02 Stratsys, Inc. Additive manufacturing process with dynamic heat flow control
US9248611B2 (en) 2013-10-07 2016-02-02 David A. Divine 3-D printed packaging
EP2862651B1 (en) 2013-10-15 2019-07-17 SLM Solutions Group AG Method and apparatus for producing a large three-dimensional work piece
US20150102526A1 (en) * 2013-10-16 2015-04-16 Huyck Licensco, Inc. Fabric formed by three-dimensional printing process
EP3063341B1 (en) 2013-10-30 2021-03-24 Branch Technology, Inc. Additive manufacturing of buildings and other structures
US20150125334A1 (en) 2013-11-01 2015-05-07 American Hakko Products, Inc. Materials and Process Using a Three Dimensional Printer to Fabricate Sintered Powder Metal Components
WO2015066607A1 (en) 2013-11-04 2015-05-07 Invisidex, Inc. Systems and methods for developing quantifiable material standards for feedstocks and products used in additive manufactruing processes
DE102013222339A1 (en) 2013-11-04 2015-05-07 Eos Gmbh Electro Optical Systems Device for producing a three-dimensional object
US20150132173A1 (en) 2013-11-12 2015-05-14 Siemens Energy, Inc. Laser processing of a bed of powdered material with variable masking
EP3068607B1 (en) 2013-11-13 2020-08-05 ABB Schweiz AG System for robotic 3d printing
SG10201804040VA (en) 2013-11-14 2018-07-30 Structo Pte Ltd Additive manufacturing device and method
RU2580145C2 (en) 2013-11-21 2016-04-10 Юрий Александрович Чивель Production of 3d articles with gradient of properties of powders and device to this end
EP2875897B1 (en) 2013-11-21 2016-01-20 SLM Solutions Group AG Method of and device for controlling an irradiation system for producing a three-dimensional workpiece
EP2878409B2 (en) 2013-11-27 2022-12-21 SLM Solutions Group AG Method of and device for controlling an irradiation system
DK2878912T3 (en) * 2013-11-28 2016-12-12 Alfa Laval Corp Ab System and method for dynamic management of a heat exchange
US9232129B2 (en) * 2013-12-02 2016-01-05 Nvidia Corporation Method and apparatus for augmenting and correcting mobile camera optics on a mobile device
DE102013018031A1 (en) 2013-12-02 2015-06-03 Voxeljet Ag Swap body with movable side wall
CN104669619B (en) 2013-12-03 2019-03-05 上海普利生机电科技有限公司 Light-cured type 3D printing equipment and its imaging system
GB2521191B (en) * 2013-12-12 2016-09-21 Exmet Ab Magnetic materials and methods for their manufacture
TWM477638U (en) * 2013-12-12 2014-05-01 三緯國際立體列印科技股份有限公司 Heating platform and three dimensional printing apparatus
US10328685B2 (en) 2013-12-16 2019-06-25 General Electric Company Diode laser fiber array for powder bed fabrication or repair
RU2656205C1 (en) 2013-12-17 2018-05-31 Конинклейке Филипс Н.В. Laser printing system
US20150165681A1 (en) * 2013-12-18 2015-06-18 Board Of Regents, The University Of Texas System Real-time process control for additive manufacturing
EP3083084A4 (en) * 2013-12-18 2017-08-16 United Technologies Corporation Powder classification system and method
WO2015094720A1 (en) * 2013-12-20 2015-06-25 United Technologies Corporation Gradient sintered metal preform
CN203635917U (en) 2014-01-03 2014-06-11 广东奥基德信机电有限公司 Laser additive manufacturing equipment
US9561626B2 (en) * 2014-01-05 2017-02-07 Makerbot Industries, Llc Controlling build chamber temperature
WO2015108991A2 (en) 2014-01-17 2015-07-23 Imra America, Inc. Laser-based modification of transparent materials
US9815139B2 (en) 2014-01-22 2017-11-14 Siemens Energy, Inc. Method for processing a part with an energy beam
WO2015112723A1 (en) 2014-01-24 2015-07-30 United Technologies Corporation Conditioning one or more additive manufactured objects
DE102014201739B4 (en) 2014-01-31 2021-08-12 Trumpf Laser- Und Systemtechnik Gmbh Laser processing device and method for generating two partial beams
WO2015120168A1 (en) 2014-02-06 2015-08-13 United Technologies Corporation An additive manufacturing system with a multi-energy beam gun and method of operation
CN104858430A (en) 2014-02-25 2015-08-26 通用电气公司 Manufacturing method of three-dimensional part
DE102014203386A1 (en) 2014-02-25 2015-08-27 Siemens Aktiengesellschaft Powder bed-based additive manufacturing process, in which a support structure is used for the production of the component
BG111711A (en) 2014-02-28 2015-08-31 "Принт Каст" Оод Machine for layered building of three-dimensional models from powdered material
US9789541B2 (en) * 2014-03-07 2017-10-17 Arcam Ab Method for additive manufacturing of three-dimensional articles
GB201404854D0 (en) * 2014-03-18 2014-04-30 Renishaw Plc Selective solidification apparatus and method
US9643357B2 (en) * 2014-03-18 2017-05-09 Stratasys, Inc. Electrophotography-based additive manufacturing with powder density detection and utilization
TWI686290B (en) 2014-03-31 2020-03-01 光引研創股份有限公司 Apparatus for forming 3d object
US20150283613A1 (en) * 2014-04-02 2015-10-08 Arcam Ab Method for fusing a workpiece
KR20150115596A (en) 2014-04-04 2015-10-14 가부시키가이샤 마쓰우라 기카이 세이사쿠쇼 Device and method for forming a 3-dimensional shaped object
JP2015199195A (en) 2014-04-04 2015-11-12 株式会社松浦機械製作所 Three-dimensional object molding device
DE102014206996B3 (en) 2014-04-11 2015-07-23 MTU Aero Engines AG Device for the generative production of a component
TWI510279B (en) 2014-04-22 2015-12-01 研能科技股份有限公司 Powder recycling system
TWI678274B (en) * 2014-04-30 2019-12-01 荷蘭商荷蘭Tno自然科學組織公司 Method and production line for making tangible products by layerwise manufacturing
CN103990798B (en) 2014-05-06 2015-10-21 华中科技大学 A kind of high-temperature powder bed system manufactured for laser gain material
US20150343664A1 (en) 2014-05-27 2015-12-03 Jian Liu Method and Apparatus for Three-Dimensional Additive Manufacturing with a High Energy High Power Ultrafast Laser
WO2015181772A1 (en) 2014-05-30 2015-12-03 Prima Industrie S.P.A. Laser operating machine for additive manufacturing by laser sintering and corresponding method
US10399322B2 (en) 2014-06-11 2019-09-03 Applied Nanostructured Solutions, Llc Three-dimensional printing using carbon nanostructures
US10195692B2 (en) 2014-06-12 2019-02-05 General Electric Company Parallel direct metal laser melting
KR101795994B1 (en) 2014-06-20 2017-12-01 벨로3디, 인크. Apparatuses, systems and methods for three-dimensional printing
CN114734628A (en) 2014-06-23 2022-07-12 卡本有限公司 Method for producing three-dimensional objects from materials with multiple hardening mechanisms
EP3161557B1 (en) 2014-06-27 2019-12-11 Dolby Laboratories Licensing Corporation Light recycling for projectors with high dynamic range
US9925715B2 (en) 2014-06-30 2018-03-27 General Electric Company Systems and methods for monitoring a melt pool using a dedicated scanning device
SG11201700024UA (en) 2014-07-09 2017-02-27 Applied Materials Inc Layerwise heating, linewise heating, plasma heating and multiple feed materials in additive manufacturing
CN107073581A (en) * 2014-07-21 2017-08-18 诺沃皮尼奥内股份有限公司 For manufacturing the method to manufacture mechanical component by increment
DE102014215061A1 (en) * 2014-07-31 2016-02-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Micromechanical component and process for its preparation
US10730142B2 (en) 2014-08-12 2020-08-04 Air Products And Chemicals, Inc. Gas atmosphere control in laser printing using metallic powders
CN104190928A (en) 2014-08-18 2014-12-10 中国科学院重庆绿色智能技术研究院 Multi-wavelength laser area selection quick forming system and method
US9999924B2 (en) 2014-08-22 2018-06-19 Sigma Labs, Inc. Method and system for monitoring additive manufacturing processes
EP2992942B1 (en) 2014-09-03 2019-06-05 SLM Solutions Group AG Apparatus for producing 3d work pieces by additive manufacturing with an improved recycling gas circuit and related method using the same
US10029417B2 (en) 2014-09-09 2018-07-24 Siemens Energy, Inc. Articulating build platform for laser additive manufacturing
US10029421B2 (en) 2014-09-18 2018-07-24 3Dm Digital Manufacturing Ltd Device and a method for 3D printing and manufacturing of materials using quantum cascade lasers
EP3044008B1 (en) 2014-10-03 2023-07-26 Hewlett-Packard Development Company, L.P. Method and apparatus for controlling heating of a surface of a layer of build material in additive manufacturing of an object
US20160096326A1 (en) * 2014-10-03 2016-04-07 Tyco Electronics Corporation Selective zone temperature control build plate
KR101612254B1 (en) * 2014-10-30 2016-04-15 한국생산기술연구원 A multi-channel head assembly for 3D printer comprising polygon mirrors rotating in single direction, and a scanning method therewith and a 3D printer therewith
FR3027841B1 (en) 2014-11-04 2017-05-19 Michelin & Cie MACHINE AND PROCESS FOR ADDITIVE MANUFACTURE OF POWDER
GB201420717D0 (en) 2014-11-21 2015-01-07 Renishaw Plc Additive manufacturing apparatus and methods
EP3227088A1 (en) 2014-12-01 2017-10-11 SABIC Global Technologies B.V. Additive manufacturing process automation systems and methods
EP3028841A1 (en) 2014-12-05 2016-06-08 United Technologies Corporation Additive manufacture system with a containment chamber and a low pressure operating atmosphere
US9360816B1 (en) 2014-12-15 2016-06-07 Ricoh Company, Ltd. Toner bottle driving device control method and image forming apparatus
DE102014226243A1 (en) 2014-12-17 2016-06-23 MTU Aero Engines AG Device for the generative production of a component
EP3241071B1 (en) * 2014-12-31 2021-12-22 Dolby Laboratories Licensing Corporation Improved integration rod assemblies for image projectors
CN107428079A (en) 2015-01-07 2017-12-01 Eos有限公司电镀光纤系统 For the equipment and production layer building method using a plurality of ray manufacture three-dimensional body
US10226817B2 (en) * 2015-01-13 2019-03-12 Sigma Labs, Inc. Material qualification system and methodology
WO2016126779A1 (en) 2015-02-05 2016-08-11 Carbon3D, Inc. Method of additive manufacturing by fabrication through multiple zones
US20160236422A1 (en) * 2015-02-13 2016-08-18 Ricoh Company, Ltd. Device and method for removing powder and apparatus for fabricating three-dimensional object
CN104759623B (en) * 2015-03-10 2017-06-23 清华大学 Using the increasing material manufacturing device of electron beam laser compound scanning
CN104785779B (en) * 2015-03-20 2017-08-18 徐州奕创光电科技有限公司 A kind of laser scanning head, 3 D-printing device and Method of printing
DE102015205314A1 (en) * 2015-03-24 2016-09-29 Siemens Aktiengesellschaft Plant for an additive manufacturing process with a heater for the powder chamber
EP3075470A1 (en) 2015-03-31 2016-10-05 Linde Aktiengesellschaft Method for layered production of a metallic workpiece by means of laser assisted additive manufacturing
US9884449B2 (en) 2015-04-02 2018-02-06 Xerox Corporation Three-dimensional printed part removal using an interlaced platen
WO2016161276A1 (en) 2015-04-03 2016-10-06 Materialise N.V. Support structures in additive manufacturing
US10315408B2 (en) * 2015-04-28 2019-06-11 General Electric Company Additive manufacturing apparatus and method
US20180162051A1 (en) * 2015-05-19 2018-06-14 Addifab Aps Additive manufacturing arrangement with shared radiation source
KR102444026B1 (en) 2015-06-10 2022-09-15 아이피지 포토닉스 코포레이션 Multi-beam additive manufacturing
GB201510220D0 (en) * 2015-06-11 2015-07-29 Renishaw Plc Additive manufacturing apparatus and method
DE102015212837A1 (en) * 2015-07-09 2017-01-12 Siemens Aktiengesellschaft A method of monitoring a process for powder bed additive manufacturing of a component and equipment suitable for such process
US20170017054A1 (en) * 2015-07-15 2017-01-19 Preco, Inc. Optic heating compensation in a laser processing system
JP6877418B2 (en) * 2015-07-17 2021-05-26 トリナミクス ゲゼルシャフト ミット ベシュレンクテル ハフツング Detector for optically detecting at least one object
EP3325276B1 (en) 2015-07-23 2018-12-12 Koninklijke Philips N.V. Laser printing system
US10166752B2 (en) 2015-07-31 2019-01-01 The Boeing Company Methods for additively manufacturing composite parts
EP3331659A4 (en) 2015-08-03 2019-08-14 Made In Space, Inc. In-space manufacturing and assembly of spacecraft device and techniques
KR101982328B1 (en) * 2015-08-31 2019-05-24 셀링크 에이비 Clean chamber technology for 3d printers and bioprinters
US10843410B2 (en) * 2015-10-09 2020-11-24 Southern Methodist University System and method for a three-dimensional optical switch display (OSD) device
TWI674964B (en) 2015-10-22 2019-10-21 揚明光學股份有限公司 Three dimensional printing apparatus and three dimensional printing method
WO2017075600A1 (en) 2015-10-30 2017-05-04 Stratasys, Inc. Platen removal for additive manufacturing system
US10843266B2 (en) * 2015-10-30 2020-11-24 Seurat Technologies, Inc. Chamber systems for additive manufacturing
CN205128922U (en) * 2015-11-20 2016-04-06 北京易加三维科技有限公司 A rapid sampling base plate for selective laser sintering equipment
WO2017100695A1 (en) 2015-12-10 2017-06-15 Velo3D, Inc. Skillful three-dimensional printing
DE102016224790A1 (en) 2015-12-15 2017-06-22 Nabtesco Corporation Three-dimensional modeling device
WO2017115406A1 (en) * 2015-12-28 2017-07-06 Dmg森精機株式会社 Head for additive processing, processing machine, and processing method
TWI592609B (en) 2015-12-30 2017-07-21 中強光電股份有限公司 Illumination system and projection apparatus
US11701819B2 (en) 2016-01-28 2023-07-18 Seurat Technologies, Inc. Additive manufacturing, spatial heat treating system and method
EP3995277A1 (en) 2016-01-29 2022-05-11 Seurat Technologies, Inc. System for additive manufacturing
US20200094478A1 (en) * 2016-04-29 2020-03-26 Nuburu, Inc. Blue Laser Metal Additive Manufacturing System
TW201811542A (en) 2016-07-28 2018-04-01 應用材料股份有限公司 Controlling an intensity profile of an energy beam for an additive manufacturing apparatus
US10394222B2 (en) 2016-08-29 2019-08-27 Honeywell Federal Manufacturing & Technologies, Llc Device for controlling additive manufacturing machinery
EP3487681B1 (en) 2016-10-19 2024-06-05 Hewlett-Packard Development Company, L.P. Additive manufacturing
DE102016222068A1 (en) 2016-11-10 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for generative component production with a plurality of spatially separated beam guides
CN206217173U (en) * 2016-12-05 2017-06-06 上海普睿玛智能科技有限公司 A kind of sampler for powdering formula 3D printer
US20180215093A1 (en) 2017-01-30 2018-08-02 Carbon, Inc. Additive manufacturing with high intensity light
US10730240B2 (en) 2017-03-09 2020-08-04 Applied Materials, Inc. Additive manufacturing with energy delivery system having rotating polygon
US11433613B2 (en) * 2017-03-15 2022-09-06 Carbon, Inc. Integrated additive manufacturing systems
US10471508B2 (en) * 2017-03-28 2019-11-12 GM Global Technology Operations LLC Additive manufacturing with laser energy recycling
US20180281282A1 (en) * 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
WO2018209226A1 (en) * 2017-05-11 2018-11-15 Seurat Technologies, Inc. Solid state routing of patterned light for additive manufacturing optimization
GB2578869A (en) * 2018-11-09 2020-06-03 Airbus Operations Ltd Detection of contaminant in additive manufacturing
US11275037B2 (en) * 2018-12-07 2022-03-15 General Electric Company Alloy powder cleanliness inspection using computed tomography

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013000511A1 (en) 2013-01-15 2014-07-17 Cl Schutzrechtsverwaltungs Gmbh Device for producing three-dimensional objects
WO2015025171A2 (en) 2013-08-22 2015-02-26 Renishaw Plc Apparatus and methods for building objects by selective solidification of powder material
US20150061170A1 (en) 2013-09-02 2015-03-05 Thomas Engel Method and arrangement for producing a workpiece by using additive manufacturing techniques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NANDWANA PEEYUSH ET AL., RECYCLABILITY STUDY ON INCONEL 718 AND TI-6A1-4V POWDERS FOR USE IN ELECTRON BEAM MELTING

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3369146A4 (en) * 2015-10-30 2019-10-23 Seurat Technologies, Inc. Polarization combining system in additive manufacturing
US10960466B2 (en) 2015-10-30 2021-03-30 Seurat Technologies, Inc. Polarization combining system in additive manufacturing
EP4028244A4 (en) * 2019-09-09 2023-05-24 Hewlett-Packard Development Company, L.P. Fusing build material based on thermal transfer

Also Published As

Publication number Publication date
EP4035806B1 (en) 2023-08-23
TW201726363A (en) 2017-08-01
JP2022160522A (en) 2022-10-19
US11666971B1 (en) 2023-06-06
US12070902B2 (en) 2024-08-27
JP2024116123A (en) 2024-08-27
EP3368313B1 (en) 2021-05-05
CN116901437A (en) 2023-10-20
US11292090B2 (en) 2022-04-05
US11065810B2 (en) 2021-07-20
EP3368311A4 (en) 2019-07-03
CN113561478B (en) 2023-06-06
EP3368236B1 (en) 2021-01-20
CN109874321A (en) 2019-06-11
EP3368279A4 (en) 2019-04-03
WO2017075408A1 (en) 2017-05-04
US11446774B2 (en) 2022-09-20
JP7488855B2 (en) 2024-05-22
KR102562730B1 (en) 2023-08-01
US20230061317A1 (en) 2023-03-02
IL287642B (en) 2022-07-01
US20170123237A1 (en) 2017-05-04
WO2017075244A1 (en) 2017-05-04
US10967566B2 (en) 2021-04-06
EP4253010A3 (en) 2024-01-03
IL258692A (en) 2018-06-28
US20170120387A1 (en) 2017-05-04
EP3838445B1 (en) 2024-07-10
EP3368242A4 (en) 2019-12-11
CN109874321B (en) 2021-12-24
CN113561478A (en) 2021-10-29
EP3368271A1 (en) 2018-09-05
US20230158616A1 (en) 2023-05-25
US11524369B2 (en) 2022-12-13
EP3825038A1 (en) 2021-05-26
EP4035806A1 (en) 2022-08-03
EP3368271A4 (en) 2019-04-10
EP4173740A3 (en) 2023-06-21
EP3368314A4 (en) 2019-05-01
US20240239046A1 (en) 2024-07-18
US20170120333A1 (en) 2017-05-04
US10960466B2 (en) 2021-03-30
EP4173740A2 (en) 2023-05-03
WO2017075277A1 (en) 2017-05-04
IL293991A (en) 2022-08-01
EP4049783A1 (en) 2022-08-31
EP4275899A2 (en) 2023-11-15
US20170144224A1 (en) 2017-05-25
US20170123222A1 (en) 2017-05-04
US11548101B2 (en) 2023-01-10
WO2017075231A4 (en) 2017-11-16
US20210053123A1 (en) 2021-02-25
US20170120332A1 (en) 2017-05-04
US10583484B2 (en) 2020-03-10
US10843266B2 (en) 2020-11-24
EP3368313A1 (en) 2018-09-05
EP3838445A1 (en) 2021-06-23
EP3369146A1 (en) 2018-09-05
JP7499562B2 (en) 2024-06-14
JP7009362B2 (en) 2022-01-25
TWI713617B (en) 2020-12-21
US20210008623A1 (en) 2021-01-14
EP3368242A1 (en) 2018-09-05
EP3368312A4 (en) 2019-07-03
CN108290180A (en) 2018-07-17
EP3368271B1 (en) 2022-04-20
JP2021183355A (en) 2021-12-02
US20220234147A1 (en) 2022-07-28
EP3368279A1 (en) 2018-09-05
CN114248438A (en) 2022-03-29
US20230356466A1 (en) 2023-11-09
US10960465B2 (en) 2021-03-30
US20200164438A1 (en) 2020-05-28
EP3825038B1 (en) 2022-12-07
EP4137256A1 (en) 2023-02-22
EP3368227A1 (en) 2018-09-05
EP4275899A3 (en) 2024-01-17
JP2018535320A (en) 2018-11-29
US20200376553A1 (en) 2020-12-03
JP7114785B2 (en) 2022-08-08
WO2017075258A1 (en) 2017-05-04
EP3368314A2 (en) 2018-09-05
US20170120537A1 (en) 2017-05-04
JP6987051B2 (en) 2021-12-22
EP3368242B1 (en) 2023-09-13
TW202110611A (en) 2021-03-16
WO2017075285A1 (en) 2017-05-04
KR20180077199A (en) 2018-07-06
US20230311413A1 (en) 2023-10-05
IL258692B (en) 2021-12-01
EP4137255A1 (en) 2023-02-22
US20240342988A1 (en) 2024-10-17
KR102533547B1 (en) 2023-05-17
CN109874322A (en) 2019-06-11
CA3002392A1 (en) 2017-05-04
US12042992B2 (en) 2024-07-23
WO2017075353A1 (en) 2017-05-04
US20230302729A1 (en) 2023-09-28
US11911964B2 (en) 2024-02-27
US11872758B2 (en) 2024-01-16
KR102558359B1 (en) 2023-07-21
CN114211748A (en) 2022-03-22
US11724455B2 (en) 2023-08-15
US20170120335A1 (en) 2017-05-04
US20170120530A1 (en) 2017-05-04
US11691341B2 (en) 2023-07-04
US11577347B2 (en) 2023-02-14
US11964429B2 (en) 2024-04-23
EP3368312B1 (en) 2022-10-26
WO2017075449A1 (en) 2017-05-04
US20210316409A1 (en) 2021-10-14
US20230356465A1 (en) 2023-11-09
EP3368235A4 (en) 2019-07-03
US11745425B2 (en) 2023-09-05
EP3368235A1 (en) 2018-09-05
WO2017075231A3 (en) 2017-09-28
EP3368227A4 (en) 2019-12-11
US20170120518A1 (en) 2017-05-04
US20210031267A1 (en) 2021-02-04
EP3368311A1 (en) 2018-09-05
EP3368236A4 (en) 2019-08-14
EP4005702A3 (en) 2022-08-10
US20230079006A1 (en) 2023-03-16
EP3368313A4 (en) 2019-04-03
EP3369146B1 (en) 2020-12-16
JP2018535319A (en) 2018-11-29
US20240208143A1 (en) 2024-06-27
KR20180077201A (en) 2018-07-06
IL287642A (en) 2021-12-01
CN108290180B (en) 2021-07-27
KR20180077200A (en) 2018-07-06
EP3368311B1 (en) 2022-09-14
US10870150B2 (en) 2020-12-22
WO2017075234A1 (en) 2017-05-04
WO2017075356A1 (en) 2017-05-04
JP2019503864A (en) 2019-02-14
US10518328B2 (en) 2019-12-31
US11072114B2 (en) 2021-07-27
US10843265B2 (en) 2020-11-24
US10596626B2 (en) 2020-03-24
TWI845790B (en) 2024-06-21
US11344978B2 (en) 2022-05-31
WO2017075423A1 (en) 2017-05-04
EP4005702A2 (en) 2022-06-01
EP4049783B1 (en) 2023-09-20
CN109874322B (en) 2021-11-16
US20170120336A1 (en) 2017-05-04
US20170120334A1 (en) 2017-05-04
EP3369146A4 (en) 2019-10-23
US20170120529A1 (en) 2017-05-04
EP4049772A1 (en) 2022-08-31
EP3368227B1 (en) 2021-12-08
US20210187833A1 (en) 2021-06-24
EP3368312A1 (en) 2018-09-05
WO2017075285A8 (en) 2022-02-17
US20210001404A1 (en) 2021-01-07
US20170120538A1 (en) 2017-05-04
EP4253010A2 (en) 2023-10-04
KR20230117760A (en) 2023-08-09
EP3368279B1 (en) 2022-10-19
EP4122625A1 (en) 2023-01-25
EP3368236A1 (en) 2018-09-05
US20220362894A1 (en) 2022-11-17

Similar Documents

Publication Publication Date Title
US11577347B2 (en) Multi-functional ingester system for additive manufacturing

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16860796

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16860796

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2016860796

Country of ref document: EP