WO2017057542A1

WO2017057542A1 - Probe card-use laminate wiring substrate and probe card equipped with same

Info

Publication number: WO2017057542A1
Application number: PCT/JP2016/078770
Authority: WO
Inventors: 酒井　範夫; 川上　弘倫; 竹村　忠治; 喜人大坪
Original assignee: 株式会社村田製作所
Priority date: 2015-09-30
Filing date: 2016-09-29
Publication date: 2017-04-06
Also published as: JP6589990B2; JPWO2017057542A1

Abstract

Provided is a probe card-use laminate wiring substrate that includes a laminate of resin layers, wherein the probe card laminate wiring substrate reduces the occurrence of defects such as lamination deviations and chipping caused by an increase in the thickness of a ceramic laminate part, and improves a heat dissipating property of the laminate wiring substrate. A laminate wiring substrate 3a is provided with: a core substrate 8; a first resin part 9 that is stacked on the core substrate 8; and a plurality of metal pins 12 that are disposed inside the first resin part 9. The core substrate 8 includes a ceramic laminate part 10 that is arranged on the first resin part 9 side and a second resin part 18 that is stacked on a main surface 19 of the ceramic laminate part 10, the main surface 19 being opposite a main surface 14 of the ceramic laminate 10 on the mother substrate 2 side. The metal pins 12 are disposed so as to be connected to a plurality of electrodes 17 that are provided on the mother substrate 2 side main surface 14 of the core substrate 8 and are electrically connected to probe pins 5 via a wiring layer 10b of the core substrate 8.

Description

Laminated wiring board for probe card and probe card having the same

The present invention relates to a multilayer wiring board having a ceramic layer and a probe card using the multilayer wiring board.

Conventionally, in a probe card used for electrical inspection of a semiconductor element, a laminated wiring board is used for rewiring a probe pin and a mother board. Among this type of multilayer wiring board, there is a ceramic substrate formed by laminating a plurality of ceramic layers. In addition, with the recent narrowing of the pitch of semiconductor elements, there is a type in which a thin film wiring portion is further provided on a ceramic substrate to form fine wiring.

For example, as shown in FIG. 5, a ceramic wiring substrate 100 described in Patent Document 1 includes a ceramic layer 101 in which a plurality of ceramic insulating layers 101a are stacked and a resin layer in which a plurality of insulating resin layers 102a are stacked. 102, and the resin layer 102 is laminated on the ceramic layer 101. In the resin layer 102, insulating resin layers 102a and wiring layers 103 are alternately laminated, and the wiring layers 103 positioned above and below the insulating resin layer 102a are connected by via conductors 104. In addition, the via conductor 104 formed in the lowermost insulating resin layer 102 a and the end of the internal wiring 105 exposed on the upper surface of the ceramic wiring substrate 100 are electrically connected.

A convex portion 109 is formed on the upper surface of the ceramic layer 101 so as to surround and surround the connection portion between the via conductor 104 and the internal wiring 105. The convex portion 109 is formed of a material having a Young's modulus greater than that of the resin forming the insulating resin layer 102a.

According to such a wiring board, the connection portion between the via conductor 104 and the end portion of the internal wiring 105 is surrounded and protected by the convex portion 109 formed of a material having a high Young's modulus. Thereby, the thermal stress added to the said connection part is reduced, the possibility of a disconnection is reduced, and reliability increases.

Japanese Patent Laying-Open No. 2011-108959 (see paragraphs 0027 to 0030, FIG. 1, etc.)

The laminated wiring board used for the probe card may require a thickness of about several mm. The resin layer is a thin film layer in which resins such as polyimide are laminated, and it is difficult to increase the thickness of the resin layer from the viewpoint of cost. Therefore, it is conceivable to form a laminated wiring board by thickening the ceramic layer.

However, when the number of laminated ceramic layers is increased in order to form a multilayer wiring board with a predetermined thickness, the so-called stacking misalignment occurs between the upper and lower ceramic green sheets that are stacked, The risk that the flatness of the substrate is impaired increases. In addition, when cutting the laminated wiring board, it becomes difficult to cut due to the thickness of the ceramic layer, which may cause problems such as chipping. Furthermore, probe cards using these multilayer wiring boards generate heat when high-frequency current flows during use, and the probe card may be deformed due to high temperatures.

The present invention has been made in view of the above-described problems, and reduces the occurrence of defects such as misalignment and chipping that can occur with an increase in the thickness of the ceramic layer, and improves the heat dissipation of the multilayer wiring board. The purpose is to plan.

In order to achieve the above object, a multilayer wiring board for a probe card according to one aspect of the present invention is a ceramic in which a plurality of ceramic layers are laminated in a multilayer wiring board for a probe card to which a plurality of probe pins are connected. A core substrate having a laminated portion, wherein the plurality of probe pins are connected to one main surface; a first resin portion laminated on the other main surface of the core substrate; and the first resin portion, One end surface is provided on a surface of the first resin portion that faces the surface on the core substrate side, and includes metal pins that are electrically connected to the plurality of probe pins.

According to this configuration, by giving the first resin portion a thickness, the multilayer wiring board can be formed thin while maintaining a predetermined thickness. Note that the thickness of the first resin portion can be adjusted by polishing the surface. For this reason, the occurrence of misalignment due to the thickness of the ceramic laminated portion can be reduced, and the laminated wiring board can be easily fired and cut. Further, by using a metal pin having a higher thermal conductivity than the via conductor, the heat dissipation of the multilayer wiring board can be improved, and the temperature rise of the board when the probe card is used can be prevented. Furthermore, the flatness of the board, which is important as a laminated wiring board for probe cards, can be ensured by polishing the metal pins and the resin portion.

The core substrate further includes a second resin portion laminated on a surface of the ceramic laminate portion that faces the surface on the first resin portion side, and the second resin portion includes a second resin portion on the first resin portion side. A surface facing the surface may form the one main surface of the core substrate. In this case, for example, if the second resin portion is formed of a resin such as polyimide capable of forming a fine wiring, the wiring can be easily thinned. In addition, the probe card is brought into contact with the semiconductor element to be inspected many times, but by laminating the second resin part on the ceramic laminated part, the stress and impact can be alleviated, and deformation of the laminated wiring board is prevented. can do.

Further, a component may be built in the first resin portion. It is desirable to place components such as bypass capacitors near the probe pins in order to improve the ability to remove noise generated during inspection. Conventionally, such components are separated from the probe pins. Often placed on top. Therefore, by incorporating a component such as a bypass capacitor in the first resin portion laminated on the core substrate, the component can be arranged at a position closer to the probe pin than in the prior art. Further, by incorporating the components that have been mounted on the mother board into the multilayer wiring board, the mounting area of the mother board can be saved.

In addition, a via conductor formed inside the core substrate may be provided, and a cross-sectional area in a direction perpendicular to the axis of the metal pin may be larger than a cross-sectional area in a direction perpendicular to the axis of the via conductor. . In this case, the metal pin disposed in the first resin portion is a columnar conductor that is thicker than the via conductor disposed in the ceramic laminated portion, and the electrical resistivity of the metal pin is greater than the electrical resistivity of the via conductor. small. Therefore, by forming the wiring of the first resin portion with metal pins, the electrical resistance of the entire laminated wiring board is lowered, and the mother board and the probe pins can be connected with low resistance. In addition, the structure provided with resin around the metal pin can relieve stress applied by the contact when the multilayer wiring board contacts the IC when used as a probe.

Further, a pad electrode formed on a surface of the first resin portion facing the core substrate side and connected to the one end surface of the metal pin may be provided. In this case, the laminated wiring board and the mother board are connected by soldering, but by providing a pad electrode on the end face of the metal pin, it is easier to attach the plating to the pad electrode than plating the end face of the metal pin directly. The solderability is improved, and the connection reliability between the multilayer wiring board and the mother board is improved. Further, by increasing the pad electrode, it is possible to easily perform alignment when connecting the laminated wiring board to the mother board.

Moreover, it is preferable to use the above laminated wiring board for a probe card for performing an electrical inspection of an object to be inspected. In this way, it is possible to provide a probe card having high durability and high connection reliability with the mother board.

According to the present invention, the ceramic laminated portion can be formed thin while maintaining the entire thickness of the probe card laminated wiring board, so that the stacking deviation caused by the thick ceramic laminated portion can be reduced. In addition, the problems at the time of cutting and firing the laminated wiring board can be solved. Furthermore, by disposing the metal pins in the resin portion, the heat dissipation of the multilayer wiring board is improved, and the temperature rise of the board when using the probe card can be prevented.

It is sectional drawing of the probe card concerning 1st Embodiment of this invention. It is sectional drawing of the laminated wiring board for probe cards of FIG. It is sectional drawing of the laminated wiring board concerning 2nd Embodiment of this invention. It is sectional drawing of the laminated wiring board concerning 3rd Embodiment of this invention. It is sectional drawing of the conventional multilayer wiring board.

<First Embodiment>
A probe card 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a cross-sectional view of the probe card 1, and FIG. 2 is a cross-sectional view of a laminated wiring board 3a mounted on the probe card 1 of FIG.

As shown in FIG. 1, the probe card 1 according to this embodiment includes a mother board 2, a laminated wiring board 3a mounted on one main surface of the mother board 2, and one end connected to the laminated wiring board 3a. A plurality of probe pins 5, a probe head 4 that supports each probe pin 5, and a cover body 32 that fixes the probe head 4 are provided, and are used for, for example, an electrical inspection of an object to be inspected 50 such as a semiconductor element.

The mother substrate 2 has a plurality of mounting electrodes 6 for mounting the multilayer wiring board 3a on one main surface, and a plurality of external electrodes 7 for external connection formed on the other main surface. Here, each mounting electrode 6 is connected to a predetermined external electrode 7 by a wiring electrode 30 and a plurality of via conductors 31 formed inside the mother substrate. The mother substrate 2 is made of, for example, glass epoxy resin. The probe head 4 that holds each probe pin 5 is fixed to a cover body 32 that is fixed to the mother board 2.

The laminated wiring board 3 a includes a core substrate 8, a first resin portion 9 laminated on the core substrate 8, and a plurality of metal pins 12 disposed inside the first resin portion 9. The core substrate 8 includes a ceramic laminated portion 10 disposed on the first resin portion 9 side and a second resin portion 18 laminated on a main surface 19 opposite to the main surface 14 on the mother substrate 2 side in the ceramic laminated portion 10. And have. At this time, the ceramic laminated portion 10 is formed by alternately laminating ceramic layers 10a and wiring layers 10b. Each ceramic layer 10a is formed of various ceramics such as a low-temperature co-fired ceramic (LTCC) or a high-temperature fired ceramic (HTCC) mainly composed of a ceramic (for example, alumina) containing borosilicate glass. be able to. In this embodiment, the ceramic laminated portion 10 is formed of four ceramic layers 10a and three wiring layers 10b. However, the number of these layers can be changed as appropriate.

Various wiring electrodes 15 are formed on each wiring layer 10 b of the ceramic laminated portion 10. Each ceramic layer 10a is formed with a plurality of via conductors 16 that connect the wiring electrodes 15 formed in different wiring layers 10b. Each wiring electrode 15 and each via conductor 16 are each formed of a metal such as Cu, Ag, or Al. The various wiring electrodes 15 formed in each wiring layer 10b are formed by screen printing using a conductive paste containing the metal (Cu, Ag, Al, etc.), for example.

The second resin portion 18 is a laminated body composed of a plurality of resin layers 18a, and is laminated on the main surface 19 on the opposite side of the ceramic laminated portion 10 from the mother substrate 2 side. Here, a plurality of connection electrodes 21 to which the probe pins 5 are connected are formed on the main surface 11 of the second resin portion 18 located on the opposite side of the main surface 19 of the ceramic laminated portion 10. Each connection electrode 21 can be formed by, for example, a base electrode formed of Cu or the like and a surface electrode obtained by performing Ni / Au plating on the base electrode.

In each resin layer 18a, various wiring electrodes 20 and a plurality of via conductors 22 are formed. In this case, for example, each wiring electrode 20 forms a Ti film as a base electrode on the main surface of the resin layer 18a by sputtering or the like, and similarly forms a Cu film on the Ti film by sputtering or the like. And it can form by forming a Cu film | membrane similarly on a Cu film | membrane by electrolysis or electroless plating. Each wiring electrode 15 formed in the ceramic laminated portion 10 is formed by screen printing or the like and thus has a thick film pattern, whereas each wiring electrode 20 formed in the second resin portion 18 is sputtered. Since the film is formed by a method such as that, a thin film pattern is formed. In addition, each wiring electrode 20 formed in the second resin portion 18 is thinned by photolithography.

Each connection electrode 21 is electrically connected to a plurality of external electrodes 7 formed on the other main surface of the mother substrate 2. Specifically, as shown in FIGS. 1 and 2, each connection electrode 21 is formed on each wiring electrode 20 and each via conductor 22 formed on the second resin portion 18, and on the ceramic laminated portion 10, respectively. Each wiring electrode 15 and each via conductor 16 are connected to each predetermined external electrode 7 via the wiring electrode 30 and each via conductor 31 formed on the mother substrate 2.

The first resin portion 9 is laminated on the main surface 14 of the core substrate 8 on the mother substrate 2 side, and has an opposite surface 13 that faces the main surface 14. The first resin portion 9 is provided with the metal pins 12 standing in the thickness direction of the core substrate 8, fixing them, laminating the resin so as to cover the metal pins 12, curing, and then adjusting the thickness. In order to cue the metal pin 12, the surface 13 of the first resin portion 9 opposite to the main surface 14 is polished and molded. For the first resin portion 9, for example, a resin such as an epoxy resin can be used. In addition, techniques such as a coating method, a printing method, a transfer mold method, and a compression mold method can be used for forming the first resin portion 9. The opposite surface 13 of the first resin portion 9 and the mother substrate 2 are connected by solder.

The plurality of metal pins 12 are disposed in the first resin portion 9 so as to be joined to the plurality of electrodes 17 provided on the main surface 14 of the core substrate 8 on the mother substrate 2 side, and are formed by the wiring layer 10 b of the core substrate 8. Each probe pin 5 is electrically connected. Each metal pin 12 can be formed by, for example, shearing a wire formed of a metal such as Cu, Ag, or Al. Further, the end surface 12 a that is the exposed portion of each metal pin 12 on the opposite surface 13 of the first resin portion 9 may be plated.

In this embodiment, the cross-sectional area in the direction perpendicular to the axis (length direction) of each metal pin 12 is formed larger than the cross-sectional area in the direction perpendicular to the axis of each via conductor 16. Each electrode 17 is formed on the main surface 14 of the core substrate 8 in accordance with the size of the cross-sectional area of each metal pin 12, and each metal pin 12 is disposed so as to be joined to each electrode 17. Each electrode 17 is formed of a metal such as Cu, Ag, or Al. Note that the size of the cross-sectional area of each metal pin 12 can be changed as appropriate, such as the same as the cross-sectional area of the via conductor 16.

Therefore, according to the above-described embodiment, by providing the first resin portion 9 on the multilayer wiring substrate 3a, it is possible to suppress the thickness of the ceramic multilayer portion 10 while forming the multilayer wiring substrate 3a with a predetermined thickness. it can. 1 and 2 show a configuration in which the first resin portion 9 is thinner than the ceramic laminated portion 10, the first resin portion 9 is formed thicker than the ceramic laminated portion 10. Also good. Alternatively, the thickness of the first resin portion 9 may be larger than the total thickness of the ceramic laminated portion 10 and the second resin portion 18. According to the present embodiment, since the thickness of the ceramic multilayer portion 10 can be suppressed, the occurrence of misalignment due to the increase in the thickness of the ceramic multilayer portion 10 can be reduced, and the multilayer wiring board 3a. Since it becomes easy to sinter and cut, manufacturing cost can be reduced. Further, since the connection of the multilayer wiring substrate 3a to the mother substrate 2 can be performed on the first resin portion 9 side where the difference in thermal expansion coefficient from the mother substrate 2 is small, the connection between the multilayer wiring substrate 3a and the mother substrate 2 is possible. Reliability can be improved. Furthermore, since the thickness of the laminated wiring board 3a can be adjusted by polishing the first resin part 9, the polishing process is more than the conventional method of adjusting the thickness by polishing the ceramic laminated part 10. It becomes easy.

Moreover, since each metal pin 12 has higher thermal conductivity than each via conductor 16 in the core substrate 8, it is possible to improve heat dissipation of the multilayer wiring board 3a, and the multilayer wiring board 3a when the probe card is used. Temperature rise can be prevented. Furthermore, since the electrical resistivity of each metal pin 12 is smaller than the electrical resistivity of each via conductor 16, compared to the case where the wiring of the first resin portion 9 is formed of a via conductor, the electrical resistance of the entire multilayer wiring board 3 a is increased. The resistance decreases, and the mother board 2 and each probe pin 5 can be connected with low resistance. Further, by forming the cross-sectional area of each metal pin 12 to be larger than the cross-sectional area of each via conductor 16, the electrical resistance of the multilayer wiring board 3a can be further reduced.

Furthermore, providing the second resin portion 18 on the core substrate 8 facilitates thinning of the wiring, so that it is possible to provide the multilayer wiring substrate 3a that can be used for electrical inspection of semiconductor elements having a narrow terminal pitch. Further, by laminating the first resin portion 9 and the second resin portion 18 on both the

main surfaces

14 and 19 of the ceramic laminated portion 10, both the

resin portions

9 and 18 function as a cushioning material, and the physical properties when the probe card is used. Stress and impact due to mechanical contact can be reduced. Therefore, deformation and breakage of the ceramic laminated portion 10 can be reduced, durability of the laminated wiring board 3a can be improved, and occurrence of disconnection of each wiring electrode 15 can be reduced.

Second Embodiment
A laminated wiring board 3b according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view of the multilayer wiring board 3b.

The laminated wiring board 3b according to this embodiment differs from the first embodiment described with reference to FIGS. 1 and 2 in that a component 23 is built in the first resin portion 9 as shown in FIG. It is that you are. Since other configurations are the same as those of the multilayer wiring board 3a of the first embodiment, description thereof is omitted by attaching the same reference numerals.

In this case, a component 23 is mounted on one main surface 14 of the core substrate 8, and the component 23 is built in the first resin portion 9. The component 23 includes, for example, a chip capacitor, a chip inductor, a chip resistor, a fuse chip, and the like. In this embodiment, the component 23 is configured by a bypass capacitor (chip capacitor) that connects the power supply line and the ground.

As described above, when the component 23 is built in the first resin portion 9, the component 23 can be arranged at a position closer to each probe pin 5 than the conventional mounting on the mother board 2. The removal ability can be improved. In addition, since the mounting area of the mother board 2 can be reduced by incorporating components previously mounted on the mother board 2 in the multilayer wiring board 3b, the probe card 1 can be reduced in size.

<Third Embodiment>
A laminated wiring board 3c according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of the multilayer wiring board 3c.

The laminated wiring board 3c according to this embodiment differs from the first embodiment described with reference to FIGS. 1 and 2 in that pad electrodes 24 are provided on the end surfaces 12a of the respective metal pins 12, as shown in FIG. It is provided. Since other configurations are the same as those of the multilayer wiring board 3a of the first embodiment, description thereof is omitted by attaching the same reference numerals.

In this case, a plurality of pad electrodes 24 are arranged so as to cover the end surfaces 12a of the respective metal pins 12 on the opposite surface 13 of the first resin portion 9. Each pad electrode 24 is formed larger than the end surface 12a of each metal pin 12 to be connected. Each pad electrode 24 may be formed by plating, or may be a conductive paste that has been plated. Further, another electrode may be provided on the opposite surface 13 of the first resin portion 9.

According to the above-described embodiment, by covering the end surface 12a of each metal pin 12 with each pad electrode 24, compared with the case where the end surface 12a of each metal pin 12 is directly plated, each pad electrode 24 is plated. Since it adheres easily, the solderability can be improved. Further, by forming each pad electrode 24 larger than the end face 12a of each metal pin 12, the connection reliability between the multilayer wiring board 3c and the mother board 2 is improved, and the multilayer wiring board 3c is connected to the mother board 2. Position alignment can be easily performed.

The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, in the above-described embodiment, the core substrate 8 includes the ceramic laminated portion 10 and the second resin portion 18, but the portion of the second resin portion 18 may also be formed of ceramic.

The present invention can be widely applied to various probe cards used for electrical inspection of an object to be inspected.

DESCRIPTION OF SYMBOLS 1 Probe card 3a-3c Multilayer wiring board 5 Probe pin 8 Core board 9 1st resin part 10 Ceramic laminated part 10a Ceramic layer 12 Metal pin 18 2nd resin part 18a Resin layer 23 Parts 24 Pad electrode

Claims

In the multilayer wiring board for probe cards to which a plurality of probe pins are connected,
A core substrate having a ceramic laminated portion formed by laminating a plurality of ceramic layers, and having a plurality of probe pins connected to one main surface;
A first resin portion laminated on the other main surface of the core substrate;
A metal pin disposed on the first resin portion, with one end surface provided on a surface facing the core substrate side surface of the first resin portion, and electrically connected to the plurality of probe pins. A laminated wiring board for a probe card characterized by
The core substrate further includes a second resin portion laminated on a surface facing the surface on the first resin portion side in the ceramic laminate portion,
2. The multilayer wiring board for probe cards according to claim 1, wherein a surface of the second resin portion that faces the surface on the first resin portion side forms the one main surface of the core substrate.
3. The probe card laminated wiring board according to claim 1, wherein a component is built in the first resin portion.
Comprising via conductors formed inside the core substrate;
4. The probe card according to claim 1, wherein a cross-sectional area in a direction perpendicular to the axis of the metal pin is larger than a cross-sectional area in a direction perpendicular to the axis of the via conductor. Multilayer wiring board.
The pad electrode which is formed in the surface facing the said core substrate side surface in the said 1st resin part, and is connected to said one end surface of the said metal pin is provided. The laminated wiring board for probe cards as described.
A probe card comprising the probe card multilayer wiring board according to claim 1 and performing an electrical inspection of an object to be inspected.