WO2017045651A1 - 一种利用导热材料线材编织物换热的装置 - Google Patents
一种利用导热材料线材编织物换热的装置 Download PDFInfo
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- WO2017045651A1 WO2017045651A1 PCT/CN2016/101041 CN2016101041W WO2017045651A1 WO 2017045651 A1 WO2017045651 A1 WO 2017045651A1 CN 2016101041 W CN2016101041 W CN 2016101041W WO 2017045651 A1 WO2017045651 A1 WO 2017045651A1
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- heat
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- conductive material
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- pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
- F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04C—BRAIDING OR MANUFACTURE OF LACE, INCLUDING BOBBIN-NET OR CARBONISED LACE; BRAIDING MACHINES; BRAID; LACE
- D04C1/00—Braid or lace, e.g. pillow-lace; Processes for the manufacture thereof
- D04C1/02—Braid or lace, e.g. pillow-lace; Processes for the manufacture thereof made from particular materials
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- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04C—BRAIDING OR MANUFACTURE OF LACE, INCLUDING BOBBIN-NET OR CARBONISED LACE; BRAIDING MACHINES; BRAID; LACE
- D04C1/00—Braid or lace, e.g. pillow-lace; Processes for the manufacture thereof
- D04C1/06—Braid or lace serving particular purposes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2101/00—Inorganic fibres
- D10B2101/20—Metallic fibres
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2401/00—Physical properties
- D10B2401/04—Heat-responsive characteristics
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
Definitions
- the invention belongs to the field of heat conduction, and in particular relates to a heat exchange device.
- the so-called heat dissipation in the end, usually always to dissipate heat into the air. Both convection and thermal radiation are related to the surface area of the object's heat dissipation.
- the power of the heat-generating device increases, in order to increase the heat-dissipating surface area of the heat sink, today's heat sinks are becoming larger and more bulky, and the effect is relatively small.
- the heat dissipating surface is increased, the distance from the heat generating component to the heat dissipating surface is greatly increased, so that the temperature difference required for heat transfer at this distance is also greatly increased. This makes the heat dissipation of some devices like high-power LED chips into a dead end, which has become the key node that hinders the rapid development of LED lighting.
- the heat absorption is exactly the same.
- the present invention provides an apparatus for heat exchange using a wire braid of a heat conductive material, and the specific technical solutions are as follows:
- a device for heat exchange using a wire braid of a thermally conductive material comprising a thermally conductive braid woven from a line of thermally conductive material, the diameter d of the line of thermally conductive material being: 0.01 mm ⁇ d ⁇ 2 mm;
- the braid has heat-generating objects or heat-absorbing objects connected by welding, thermal adhesive bonding, and casting.
- the braid integrally comprises a metal frame formed by die casting or welding.
- the heat conductive braid is integrally formed into a bag-like structure having an opening, and a fan is disposed at the opening.
- thermally conductive braid of the pocket structure is a single layer or a plurality of layers.
- the heat conducting braid is fixed on the inner wall of the pipe of the pipe requiring heat exchange, and the pipe wall is Made of a heat conductive material.
- thermally conductive braid is attached to the outer wall of the pipe through which a conduit for air or other fluid can flow, the conduit wall being constructed of a thermally conductive material.
- the heat conducting braids are respectively fixed on the inner wall of the pipe and the outer wall of the pipe through which air or other fluid can flow, and the pipe wall is composed of a heat conductive material.
- the heat conductive braid is fixed on the first pipe that needs heat exchange by welding, thermal adhesive bonding, and casting method, and the heat conductive braid is simultaneously surrounded by the second pipe; The height difference.
- the heat conducting braid is respectively fixed on the inner wall of the pipe of the two pipes; the two pipe walls are made of a heat conductive material and are connected in one body or in close contact.
- An LED lighting device comprising the above-mentioned device for heat exchange using a heat conductive material wire braid, wherein the LED lighting device heat generating device is an LED chip, and the LED chip is fixed on the heat conductive braid.
- An LED lighting device comprising the above-mentioned device for heat exchange using a wire braid of a heat conductive material, the LED chip and the heat conductive braid are enclosed in a ventilation passage including a wall of a heat conductive material, and the fan makes the air flow Flowing through the gap of the heat-conducting braid, taking away heat, and then being cooled by the wall of the heat-conducting material in the ventilation passage, and recirculating back, cooling the heat-conductive braid and the LED chip fixed thereon; thus, the air flow for cooling It is enclosed in a ventilation passage and is isolated from the outside to avoid pollution or other effects.
- An LED lighting device comprising the above-mentioned closed ventilation passage, wherein the closed ventilation passage comprises a lamp cover, a hollow light pole or a support rod, and mainly uses a light pole or a support rod to dissipate heat; thus, the air flow for cooling is enclosed in the lamp cover,
- the hollow pole or support rod is isolated from the outside to avoid contamination or other effects.
- heat dissipation in the end, usually always to dissipate heat into the air.
- Both convection and thermal radiation are related to the surface area of the object's heat dissipation. a copper column and a bundle of the same volume of copper wire, the surface area of which can be phased The difference is dozens or even hundreds of times. Therefore, this allows the heat generated by the heat generating device to be quickly transferred to a maximum heat radiating surface at the shortest distance, thereby effectively achieving heat dissipation.
- the heat conductive material wire is woven into a woven fabric as needed, especially when it has a metal frame, and its further processing and use becomes convenient.
- the heat absorption is exactly the same.
- the present invention converts the heat exchange device from a conventional bulky aluminum profile into a braid of a small amount of metal wire, which makes it possible to greatly reduce the weight and volume of the heat exchange device.
- the weight and volume of the heat sink can be compressed by at least ten times, thereby fundamentally solving the heat dissipation problem that has been restricting the rapid development of the LED.
- the heat exchange device of the invention can be used for heat dissipation of LED chips, can also be used for heat dissipation of various electronic devices, and can also be used for heat dissipation and heat exchange of heating, air conditioners, refrigerators, water heaters and the like.
- Figure 1 Die-cast metal frame and LED chip on a copper wire braid
- Figure 2 Structure of an 80 watt LED lamp
- Figure 3 Structure of a 40 watt LED lamp
- Figure 4 The heat exchange device of claim 8;
- Figure 5 Schematic diagram of 100W LED street light
- 1 is a heat conductive material braid
- 2 is an LED chip
- 3 is a fan
- 4 is a metal frame
- 5 is a first pipe
- 6 is a second pipe
- 7 is a lamp cover
- 8 is a lamp post
- 9 is a plastic pipe;
- the unit of dimensioning is millimeters.
- the heat conductive braid 1 is fixed to the heat generating or heat absorbing object by welding, thermal conductive bonding, casting, etc., and ensures that the heat generating or heat absorbing object can effectively conduct heat between the heat conducting material wires of the heat conductive braid 1 .
- the heat is conducted on the heat conductive material line of the heat conductive braid 1, and the surface of the heat conductive material line is heated or cooled by air or other fluid to achieve heat dissipation or heat absorption by convection.
- the heat conductive braid 1 of the present invention can be formed by casting or welding to form a metal frame 4 so as to maintain a certain shape structure for other processing.
- the heat exchange device of the present invention is characterized in that: the device requiring heat dissipation or heat absorption is fixed on the braid or its metal frame by welding, thermal adhesive bonding or the like, and the device requiring heat dissipation or heat absorption can be ensured. Effectively transferring heat between the heat conductive material wires of the braid; heat is conducted on the heat conductive material wires of the braid, heating or cooling air or other fluid by the surface of the heat conductive material wires, by convection heat transfer, and finally achieving the need Heat or heat absorption of a device that dissipates heat or absorbs heat.
- the heat exchange device of the present invention is characterized in that the heat conductive material wire braid is formed into a pocket structure alone or together with other materials, the fan is installed at the opening of the pocket, and the fan sends the air to the inlet bag, from the weaving.
- the gap of the object is blown out, so that the heat dissipating surface of the heat conductive material wire of the braid can heat or cool the air in a large amount to achieve effective heat dissipation or heat absorption.
- the heat exchange device of the present invention is characterized in that: the heat conductive material wire braid can be multi-layered, and can have various structures, and air penetrates through the gap between the heat conductive material wires of the braid to realize heat exchange.
- Other materials that make up the pocket may also have a suitable structure to ensure that air is evenly blown out of the braid.
- the heat exchange device is characterized in that: the braid is fixed on the pipe wall outside the pipe requiring heat exchange by welding, thermal adhesive bonding, casting, etc., the pipe wall is composed of a heat conductive material, and the braid is The metal frame may be part of the pipe wall or in close contact with the heat conductive material of the pipe wall to ensure that the pipe requiring heat exchange can effectively conduct heat between the wire of the heat conductive material of the braid; the heat conduction of heat in the braid Conducting on the material wire, heating or cooling the air or other fluid in contact with it by the surface of the heat conductive material wire, heat exchange by convection, and finally heat exchange between the pipe wall and air or other fluid outside the pipe.
- the heat exchange device of the present invention is characterized in that the heat conductive material wire braid is fixed on a pipe wall in a pipe capable of circulating air or other fluid, the pipe wall is composed of a heat conductive material, and the metal frame of the braid can be Is a part of the pipe wall, or in close contact with the heat conductive material of the pipe wall, to ensure that the pipe requiring heat exchange can effectively transfer heat between the heat conductive material wire of the braid; the heat is uploaded on the heat conductive material wire of the braid
- heat exchange is achieved by convection, and ultimately heat exchange between the pipe wall and the air or other fluid within the pipe is achieved.
- the heat exchange device of the present invention is characterized in that the heat conductive material wire braid is separately fixed In the inner wall of the pipe and the outer wall of the pipe through which air or other fluid can flow, the pipe wall is composed of a heat conductive material, and the inside of the pipe and the outside of the pipe have a metal frame in close contact with the heat conductive material of the pipe wall, or a part of the pipe wall.
- the heat is conducted on the pipe wall and the heat conductive material wires of the two sides of the braid, and the braids on both sides of the pipe are heated by the surface of the heat conductive material wire or
- the air or other fluid that is in contact with it is cooled by heat exchange with the air or other fluid in contact with it, and finally conducted through the wall of the pipe to effect heat exchange between air or other fluid inside and outside the pipe.
- the heat exchange device is characterized in that the braid is fixed on the pipe 1 requiring heat exchange by welding, thermal adhesive bonding, casting, etc., and the entire braid is surrounded by another pipe 2 There is a height difference between the inlet and outlet of the pipeline 2, which is heated and expanded by the air, and is cooled and contracted to generate a pressure difference, which promotes air circulation and realizes convective heat exchange; the pipeline 2 can also be installed with a fan to enhance the heat exchange effect.
- the heat exchange device of the present invention is characterized in that: the heat conductive material wire braid is respectively fixed on the inner wall of the pipe of the two pipes; the two pipe walls are made of a heat conductive material and are connected in one body or in close contact; The metal frame of the braid is in intimate contact with the heat conductive material of the pipe wall, or a part of the pipe wall, to ensure that the pipe can effectively conduct heat between the heat conductive material wires of the braid; the heat is on the pipe wall and the braid on both sides
- the heat conducting material is conducted on the wire, and the respective braids are heated or cooled by the surface of the heat conducting material wire to heat or cool the air or other fluid in contact with it, and convectively exchanges air or other fluid in contact with it, and finally passes through the pipe.
- Wall conduction enables heat exchange between air or other fluids within the two ducts.
- the heat exchange device of the present invention is characterized in that the LED chip and the heat conductive braid are enclosed in a ventilation passage including a wall of a heat conductive material, and the fan flows the airflow through the gap of the heat conductive braid. Take away the heat, then cool it in the ventilation channel by the wall of the heat-conducting material, and recirculate it back, cooling the heat-conducting braid and the LED chip fixed on it; thus, the air flow for cooling is enclosed in the ventilation channel, and is isolated from the outside To avoid pollution or other effects.
- the heat exchange device of the present invention is characterized in that the closed ventilation passage comprises a lamp cover, a hollow light pole or a support rod, and mainly uses a light pole or a support rod to dissipate heat; thus, the air flow for cooling is enclosed in the lamp cover,
- the hollow pole or support rod is isolated from the outside to avoid contamination or other effects.
- a metal frame 4 is formed by die casting to obtain a cylinder. One end of the cylinder is sealed with a braid or other material, and the other end is connected to the fan 3.
- the LED chip 2 is adhered to the metal frame 4 with a thermal conductive adhesive.
- the fan 3 and the LED chip 2 are connected to each other to obtain an LED lamp with a power of 80 watts.
- the maximum length, width and height of this LED lamp are: 100 (mm) X 40 (mm) X 40 (mm).
- the temperature rise of the heat dissipation surface (back surface) of the LED chip during stable operation is 25 to 28 °C.
- a metal frame 4 is formed by die casting to obtain a frustoconical cylinder. One end of the cone is sealed with a braid and the other end is connected to the fan 3.
- the LED chip 2 is adhered to the metal frame with a thermal conductive adhesive.
- the fan 3 and the LED chip 2 are connected to each other to obtain a 40 watt LED lamp.
- the temperature rise of the heat dissipation surface (back surface) of the LED chip during stable operation is less than 25 °C.
- a copper braided heat conductive braid 1 is disposed between a first tube body 5 and a second tube body 6, and the wind passes through a gap between the first tube body 5 and the second tube body 6, and the heat conductive braid is 1 heat is taken away. Achieve stable heat dissipation.
- a 100W LED street light A closed ventilation passage is formed by a lampshade, a hollow pole and a plastic tube, and the pole is mainly used for heat dissipation.
- the fan blows air out of the gap of the heat-conducting braid, enters the pole through the lampshade, cools and then circulates back to the fan by the plastic tube to form a circulating cooling airflow.
- the air flow for cooling is enclosed in the lamp cover and the hollow lamp pole, and is isolated from the outside, thereby avoiding pollution and other influences of the outdoor environment.
Abstract
Description
Claims (12)
- 一种利用导热材料线材编织物换热的装置,其特征在于:所述装置包含一个由导热材料线编织而成的导热编织物,所述导热材料线的线径d为:0.01mm≤d≤2mm;需要散热或吸热的器件通过焊接、导热胶粘、浇铸连接在所述导热编织物上。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,所述导热编织物包含一个金属框架,所述导热编织物上的金属框架通过铸造或焊接形成,需要散热或吸热的器件通过焊接、导热胶粘或浇铸连接在所述导热编织物的金属框架上。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物整体为具有一开口的袋状结构,所述开口处设有一风机。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物固定在能流通空气或其它流体的管道的管道内壁上,管道壁由导热材料构成。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物固定在能流通空气或其它流体的管道的管道外壁上,管道壁由导热材料构成。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物被分别固定在能流通空气或其它流体的管道内壁和管道外壁上,管道壁由导热材料构成。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物通过焊接、导热胶粘、浇铸方法固定在需要换热的第一管道上,所述导热编织物同时处在第二管道的包围之中。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述导热编织物被分别固定两个管道的管道内壁上;两个管道壁由导热材料构成,且连成一体或紧密接触。
- 根据权利要求1所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述口袋状结构的导热编织物为单层或多层。
- 一种LED照明设备,包含根据权利要求1~4之一所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述需要散热或吸热的器件的器件为LED芯片,所述LED芯片固定在所述导热编织物上。
- 一种LED照明设备,包含根据权利要求1-4之一所述的一种利用导热材料线材编织物换热的装置,其特征在于:所述LED芯片、风机和所述导热编织物都封闭在一个包含有导热材料管壁的通风通道里,风机使气流从导热编织物的缝隙中流过,带走热量,然后在通风通道里被导热材料管壁冷却,并重新循环回来,冷却导热编织物和固定在上面的LED芯片.
- 根据权利要求11所述的一种LED照明设备,其特征在于:其封闭的通风通道包括灯罩、中空的灯杆或支撑杆,主要利用灯杆或支撑杆散热.
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KR102018430B1 (ko) * | 2017-09-08 | 2019-09-04 | 최연서 | 취급성이 우수한 발광장치 |
CN111670321A (zh) * | 2018-02-01 | 2020-09-15 | 昕诺飞控股有限公司 | 支撑照明的挤压轮廓 |
CN111849428B (zh) * | 2020-06-18 | 2021-11-05 | 上海大陆天瑞激光表面工程有限公司 | 一种热界面材料 |
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KR20180084736A (ko) | 2018-07-25 |
US10697624B2 (en) | 2020-06-30 |
EP3354982A4 (en) | 2018-10-31 |
US20180274771A1 (en) | 2018-09-27 |
JP2018538682A (ja) | 2018-12-27 |
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