WO2017035868A1 - 一种集泛光、聚光于一体的光源及其系统 - Google Patents

一种集泛光、聚光于一体的光源及其系统 Download PDF

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WO2017035868A1
WO2017035868A1 PCT/CN2015/089509 CN2015089509W WO2017035868A1 WO 2017035868 A1 WO2017035868 A1 WO 2017035868A1 CN 2015089509 W CN2015089509 W CN 2015089509W WO 2017035868 A1 WO2017035868 A1 WO 2017035868A1
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lamp bead
copper film
lamp
film wire
silicon wafer
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PCT/CN2015/089509
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English (en)
French (fr)
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吕建飞
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吕建飞
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Publication of WO2017035868A1 publication Critical patent/WO2017035868A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables

Definitions

  • the invention relates to the field of illumination, in particular to a light source integrating floodlighting and concentrating light and a system thereof.
  • the Chinese meaning of COMMB-LED light source technology is explained as the high-efficiency integrated surface light source technology of LED chip directly attached to the mirror metal substrate with high reflectivity. This technology eliminates the bracket concept, electroless plating, no reflow soldering, no patching process, so The process is reduced by nearly one-third and the cost is saved by one-third. Because the light source is a surface light source, it is particularly convenient for use in floodlight products, but the long-range illumination in the outdoor lighting industry is in the ointment, such as night riding.
  • the outdoor lighting industry realizes long-range shooting with single-chip LEDs, which realizes floodlighting and concentrating by adjusting the distance between the concentrating objects and the LEDs, or concentrating the light through the concentrating reflector to achieve concentrating, but this kind of concentrating The method cannot adjust the floodlight at the same time.
  • the technical problem to be solved by the present invention is to provide a light source integrating floodlighting and concentrating light in view of the above-mentioned deficiencies of the prior art.
  • a light source integrating flooding and concentrating comprising an aluminum substrate, a lamp dam, at least one lamp bead and a plurality of silicon chip LEDs, wherein the aluminum substrate is plate-shaped, The upper surface of the aluminum substrate is coated with white oil, and the lamp base negative copper film wire, the lamp bead positive copper film wire and the silicon negative electrode copper film wire are fixed on the aluminum substrate, and both ends of each of the silicon chip LEDs are fixed
  • the light bulb is connected between the lamp bead positive copper film wire and the silicon negative electrode copper film wire
  • the lamp dam is a frame structure having a boundary smaller than the aluminum substrate, and the lower end of the lamp dam is fixed to the aluminum
  • the lamp bead is fixed On the aluminum substrate and connected between the lamp bead negative copper film wire and the lamp bead positive copper film wire, the lamp bead is located in the frame structure of the lamp dam, and the lamp dam is provided
  • a molded silicone mold and the silicone mold covers the silicon wafer LED
  • the present invention can also be improved as follows:
  • the lamp bead negative copper film wire, the lamp bead positive copper film wire and the silicon negative electrode copper film wire on the aluminum substrate are specifically set as follows:
  • a lamp bead negative contact is respectively disposed at two ends of the lamp bead negative copper film lead, and at least one lamp bead negative pad is disposed in a middle of the lamp bead negative copper film lead, and a negative pole of each of the lamp bead and a Welding the negative electrode pad of the lamp bead;
  • the lamp bead positive copper film wire is respectively provided with a lamp bead positive contact at two ends, and at least one lamp bead positive pad is disposed in the middle of the lamp bead positive copper film wire, and the positive electrode and the one of each of the lamp bead are
  • the bead positive electrode pad is soldered, and the lamp bead positive copper film wire is respectively disposed on the two sides of the positive electrode pad of the lamp bead, and a plurality of positive electrode placement points of the silicon chip are respectively disposed, and the positive electrode of each of the silicon chip LEDs and one silicon Positive electrode placement point welding;
  • the silicon wafer negative electrode copper film wire is respectively provided with a silicon wafer negative electrode contact at both ends thereof, and the silicon wafer negative electrode copper film wire is provided with a heat dissipation point of the same amount and one-to-one correspondence with the positive electrode placement point of the silicon wafer.
  • the heat dissipation point of the silicon wafer is away from the positive electrode placement point of the silicon wafer, and the negative electrode placement point of the silicon wafer is the same as the heat dissipation point of the silicon wafer.
  • the lamp body of the silicon wafer LED is fixed on the upper surface of the heat dissipation point of the silicon wafer, and the negative electrode of each of the silicon chip LEDs is soldered to a negative electrode of the silicon wafer.
  • the lamp bead or the silicon chip LED can be conveniently controlled by setting the lamp bead negative copper film wire, the lamp bead positive copper film wire and the silicon negative copper film wire, which is convenient for panning. Switch between light and spotlights.
  • the lamp bead negative electrode pad and the lamp bead positive electrode pad soldered together with the lamp bead are aligned along the longitudinal direction of the aluminum substrate and are adjacently arranged
  • the beneficial effect of the above further solution is that the lamp bead is located in the middle of the aluminum substrate by the above manner, thereby obtaining a relatively uniform concentrating effect.
  • the silicon wafer positive electrode placement point is uniformly disposed on both sides of the lamp bead positive electrode pad on the lamp bead positive copper film wire.
  • the above-mentioned further solution has the beneficial effects that the silicon wafer LEDs are uniformly distributed on both sides of the aluminum substrate by the above manner, thereby obtaining a relatively uniform flooding effect.
  • the silicon wafer positive electrode placement point, the silicon wafer heat dissipation point and the silicon wafer negative electrode placement point are aligned and spaced apart along the width direction of the aluminum substrate.
  • the beneficial effect of the above further solution is that the flooding effect of the silicon wafer LED can be further enhanced by the above manner.
  • the positive electrode contact of the lamp bead is connected to the positive pole of the external power source, and the negative pole of the external power source is connected to the negative contact of the lamp bead or the negative contact of the silicon wafer through a switch.
  • the above-mentioned further solution has the beneficial effects that the lamp bead and the silicon LED are lightly switched by the external switch, so that the switching of the concentrated light or the flood light can be conveniently performed.
  • the surface of the lamp bead negative copper film wire, the lamp bead positive copper film wire and the silicon negative electrode copper film wire are coated with white oil having electrical insulation function.
  • the above-mentioned further solution has the beneficial effects that the electrical insulation property with the aluminum substrate can be further enhanced by coating the surface of the lamp bead negative copper film wire, the lamp bead positive copper film wire and the silicon negative electrode copper film wire with white oil. Improve the stability of the power supply and extend the service life of the light source.
  • the lamp bead is an XQ-E light source.
  • a plurality of lamp dam pads are further disposed on the aluminum substrate, and a lower end of the lamp dam is soldered on the aluminum substrate through the lamp dam pad.
  • the above-mentioned further solution has the beneficial effects that the lamp dam can be firmly fixed on the aluminum substrate by the above manner, and the service life of the light source is prolonged.
  • the invention also provides a light source system integrating floodlighting and concentrating, including for adjusting the institute The voltage regulator of the lamp or the brightness of the silicon LED and the light source integrated with the light and the light are integrated, and the voltage regulator is connected to the light source integrated with the light and the light.
  • the invention has the beneficial effects that the light source and the system which integrates the flooding and the concentrating in the invention can realize the combination of the flooding and the concentrating on the same substrate without adjusting the concentrating object. It only needs to be switched by the switch gear position, which makes it easier to achieve concentrating and flooding, has better heat dissipation effect, and effectively reduces the cost of the lighting product in the design of adjustable floodlight and concentrating structure. At the same time, the product The cost of external parts can also be greatly reduced.
  • FIG. 1 is a schematic structural view of a light source integrating floodlighting and concentrating light according to the present invention
  • FIG. 2 is a front view of an aluminum substrate of a light source integrating floodlighting and concentrating light according to the present invention.
  • Lamp bead negative copper film wire 12, lamp bead positive copper film wire, 13, silicon film negative copper film wire, 14, lamp dam pad;
  • lamp bead negative contact 112
  • lamp bead negative pad 121
  • lamp bead positive contact 122
  • lamp bead positive pad 123
  • wafer positive pole placement point 131
  • silicon wafer negative contact 132
  • the heat dissipation point of the silicon wafer 133, the negative point of the silicon wafer.
  • a schematic diagram of a light source structure integrating floodlighting and concentrating comprises an aluminum substrate 1, a light dam 2, at least one light bead 4 and a plurality of silicon LEDs 5, wherein the aluminum substrate 1 is a plate shape.
  • the upper surface of the aluminum substrate 1 is coated with white oil, and the lamp base negative copper film lead 11 is fixed on the aluminum substrate 1.
  • a lamp positive electrode copper film wire 12 and a silicon wafer negative electrode copper film wire 13 each of the two ends of the silicon chip LED5 is connected between the lamp bead positive copper film wire 12 and the silicon chip negative copper film wire 13
  • the lamp dam 2 is a frame structure having a smaller boundary than the aluminum substrate 1, and the lower end of the lamp dam 2 is sealed and fixed on the aluminum substrate 1.
  • the lamp bead 4 is fixed on the aluminum substrate 1 and Connected between the lamp bead negative copper film wire 11 and the lamp bead positive copper film wire 12, the lamp bead 4 is located in the frame structure of the lamp dam 2, and the lamp dam 2 is provided with a molding A silicone mold 3, and the silicone mold 3 covers the silicon wafer LED 5, and an upper end of the lamp bead 4 protrudes from an upper surface of the silicone mold 3.
  • the aluminum substrate 1 has a rectangular plate-like structure, but is not limited to a rectangular plate-like structure, and other shapes (for example, a circle, a diamond, etc.) may be used as long as the present invention can be solved.
  • the problem is fine.
  • the lamp bead negative copper film wire 11, the lamp bead positive copper film wire 12 and the silicon negative electrode copper film wire 13 on the aluminum substrate 1 are specifically set as follows:
  • the lamp bead negative copper film lead 11 is respectively provided with a lamp bead negative contact 111, and at least one lamp bead negative electrode 112 is disposed in the middle of the lamp bead negative copper film lead 11 , and each of the lamp bead 4 a negative electrode is soldered to one of the lamp bead negative pads 112;
  • the lamp bead positive electrode copper film wire 12 is respectively provided with a lamp bead positive electrode contact 121, and at least one lamp bead positive electrode pad 122 is disposed in the middle of the lamp bead positive copper film wire 12, and each of the lamp bead 4
  • the positive electrode is soldered to a positive electrode pad 122 of the lamp bead.
  • the positive electrode copper film wire 12 of the lamp bead is disposed on each side of the positive electrode pad 122 of the lamp bead, and a plurality of positive electrode placement points 123 are disposed on each side of the positive electrode pad 122.
  • the positive electrode of the silicon wafer LED5 is soldered to a silicon wafer positive electrode placement point 123;
  • the silicon wafer negative electrode copper film wire 13 is respectively provided with a silicon wafer negative electrode contact 131 at the two ends, and the silicon wafer negative electrode copper film wire 13 is provided with the same amount of silicon corresponding to the silicon wafer positive electrode placement point 123 in one-to-one correspondence.
  • a heat dissipating point 132 wherein the silicon wafer heat dissipating point 132 in the middle of the silicon negative electrode copper film lead 13 is disposed away from the silicon wafer positive electrode fixing point 123 side and has the same number and one-to-one correspondence with the silicon wafer heat dissipating point 132.
  • the silicon negative electrode is disposed at a point 133, and the lamp body of each of the silicon wafers LED5 is fixed at the heat dissipation point of the silicon wafer
  • the upper surface of 132, the negative electrode of each of said silicon wafers LED5 is soldered to a silicon negative electrode placement point 133.
  • the lamp bead negative copper film wire 11 By providing the lamp bead negative copper film wire 11, the lamp bead positive copper film wire 12 and the silicon negative electrode copper film wire 13, it is convenient to separately control the lamp bead 4 or the silicon chip LED 5 to facilitate the realization of flood light and Switching of concentrated light.
  • the lamp bead negative electrode pad 112 and the bead positive electrode pad 122 soldered to the same bead 4 are aligned along the longitudinal direction of the aluminum substrate 1 and are adjacently spaced apart. In the above manner, it can be ensured that the lamp bead 4 is located in the middle of the aluminum substrate 1, thereby obtaining a relatively uniform concentrating effect.
  • the silicon wafer positive electrode placement point 123 is uniformly disposed on both sides of the lamp bead positive electrode pad 122 on the lamp bead positive copper film wire 12. In the above manner, it can be ensured that the silicon wafers LED5 are evenly distributed on both sides of the aluminum substrate 1, thereby obtaining a relatively uniform flooding effect.
  • the silicon wafer positive electrode placement point 123, the silicon wafer heat dissipation point 132, and the silicon wafer negative electrode placement point 133 are aligned along the width direction of the aluminum substrate 1.
  • the flooding effect of the silicon wafer LED 5 can be further enhanced by the above manner.
  • the lamp bead positive contact 121 is connected to the external power supply positive electrode, and the external power supply negative electrode is connected to the lamp bead negative contact 111 or the silicon negative contact 131 through a switch.
  • the lamp bead 4 or the silicon LED 5 is easily switched by an external switch, so that the switching of the concentrated light and the flood light can be conveniently performed.
  • the surfaces of the lamp bead negative copper film wire 11, the lamp bead positive copper film wire 12 and the silicon negative electrode copper film wire 13 are all coated with white oil having an electrical insulating function.
  • the electrical insulation property with the aluminum substrate 1 can be further enhanced, and the power supply can be improved. Stability, extending the life of this light source.
  • the lamp bead 4 is an XQ-E light source.
  • the aluminum substrate 1 is further provided with a plurality of lamp dam pads 14 , and the lower end of the lamp dam 2 is open
  • the lamp dam pad solder 14 is attached to the aluminum substrate 1.
  • the lamp dam 2 can be firmly fixed on the aluminum substrate 1 to extend the service life of the light source.
  • the invention also provides a light source system integrating floodlighting and concentrating, comprising a voltage regulator for adjusting the brightness of the lamp or silicon chip LED and the light source integrating the flooding and concentrating light
  • the voltage regulator is connected to the light source integrated with the light collecting and collecting light.
  • the light source and the system for integrating floodlight and concentrating in the invention can realize the combination of floodlighting and concentrating on the same substrate without adjusting the concentrating object, just by switching the gear position Switching, more convenient to achieve concentrating and flooding, has a better heat dissipation effect, effectively reducing the cost of lighting products in the design of adjustable floodlights and concentrating structures, at the same time, the cost of accessories outside the product can also be substantial reduce.

Abstract

一种集泛光、聚光于一体的光源及系统，包括铝基板（1）、灯坝（2）、至少一颗灯珠（4）和若干硅片LED（5），铝基板（1）上固定有灯珠负极铜膜导线（11）、灯珠正极铜膜导线（12）和硅片负极铜膜导线（13），每个硅片LED（5）的两端均跨接在灯珠正极铜膜导线（12）和硅片负极铜膜导线（13）之间，灯坝（2）的下端固定在铝基板（1）上，灯珠（4）固定在铝基板（1）上并跨接在灯珠负极铜膜导线（11）和灯珠正极铜膜导线（12）之间，灯珠（4）位于灯坝（2）内，灯坝（2）内设有硅胶模（3），且硅胶模（3）覆盖硅片LED（5），灯珠（4）的上端突出硅胶模（3）的上表面。上述光源及其系统，可实现泛光与聚光结合在同一个基板上，切换方便，有效的降低了照明产品在可调泛光与聚光结构设计上的成本，同时，产品外配件成本也能大幅度降低。

Description

一种集泛光、聚光于一体的光源及其系统 技术领域
本发明涉及照明领域，尤其涉及一种集泛光、聚光于一体的光源及其系统。
背景技术
COMMB-LED光源技术中文含义解释为LED芯片直接贴在高反光率的镜面金属基板上的高光效集成面光源技术，此技术剔除了支架概念，无电镀、无回流焊、无贴片工序，因此工序减少近三分之一，成本也节约了三分之一。因该光源为面光源，在泛光产品上的使用尤为便捷，但在户外照明行业的远射照明就显得美中不足，如夜骑。目前户外照明行业实现远射均采用单芯片LED，通过调节聚光物与LED之间的距离来实现泛光与聚光，或通过聚光反射器将光线汇聚，来实现聚光，但这种方式不能同时调节泛光。
发明内容
本发明所要解决的技术问题是针对上述现有技术的不足，提供一种集泛光、聚光于一体的光源。
本发明解决上述技术问题的技术方案如下：一种集泛光、聚光于一体的光源，包括铝基板、灯坝、至少一颗灯珠和若干硅片LED，所述铝基板为板状，所述铝基板上表面涂有白油，且所述铝基板上固定有灯珠负极铜膜导线、灯珠正极铜膜导线和硅片负极铜膜导线，每个所述硅片LED的两端均跨接在所述灯珠正极铜膜导线和硅片负极铜膜导线之间，所述灯坝为边界小于所述铝基板的框体结构，且所述灯坝的下端固定在所述铝基板上，所述灯珠固定 在所述铝基板上并跨接在所述灯珠负极铜膜导线和灯珠正极铜膜导线之间，所述灯珠位于所述灯坝的框体结构内，所述灯坝内设有成型的硅胶模，且所述硅胶模覆盖所述硅片LED，所述灯珠的上端突出所述硅胶模的上表面。
在上述技术方案的基础上，本发明还可以做如下改进：
进一步：所述铝基板上的灯珠负极铜膜导线、灯珠正极铜膜导线和硅片负极铜膜导线具体设置如下：
所述灯珠负极铜膜导线两端分别设有灯珠负极触点，所述灯珠负极铜膜导线中部设有至少一个灯珠负极焊盘，且每个所述灯珠的负极与一个所述灯珠负极焊盘焊接；
所述灯珠正极铜膜导线两端分别设有灯珠正极触点，所述灯珠正极铜膜导线中部设有至少一个灯珠正极焊盘，且每个所述灯珠的正极与一个所述灯珠正极焊盘焊接，所述灯珠正极铜膜导线上位于所述灯珠正极焊盘两侧分别设有若干个硅片正极安置点，每个所述硅片LED的正极与一个硅片正极安置点焊接；
所述硅片负极铜膜导线两端分别设有硅片负极触点，所述硅片负极铜膜导线中部设有数量与所述硅片正极安置点相同且一一对应的硅片散热点，所述硅片负极铜膜导线中部所述硅片散热点远离所述硅片正极安置点一侧设有数量与所述硅片散热点相同且一一对应的硅片负极安置点，每个所述硅片LED的灯体固定在所述硅片散热点上表面，每个所述硅片LED的负极与一个硅片负极安置点焊接。
上述进一步方案的有益效果是：通过设置所述灯珠负极铜膜导线、灯珠正极铜膜导线和硅片负极铜膜导线，可以方便单独控制所述灯珠或所述硅片LED，方便泛光灯和聚光灯的切换。
进一步：同一个所述灯珠焊接的所述灯珠负极焊盘和所述灯珠正极焊盘沿所述铝基板的长度方向对齐并相邻间隔设置
上述进一步方案的有益效果是：通过上述方式可以保证所述灯珠位于所述铝基板的中部，从而得到较为均匀的聚光效果。
进一步：所述硅片正极安置点均匀设置在所述灯珠正极铜膜导线上所述灯珠正极焊盘的两侧。
上述进一步方案的有益效果是：通过上述方式可以保证所述硅片LED均匀分布在所述铝基板的两侧，从而得到较为均匀的泛光效果。
进一步：所述硅片正极安置点、硅片散热点和硅片负极安置点三者沿所述铝基板的宽度方向对齐并间隔设置。
上述进一步方案的有益效果是：通过上述方式可以进一步增强所述硅片LED的泛光效果。
进一步：所述灯珠正极触点与外部电源正极连接，外部电源负极通过开关与所述灯珠负极触点或硅片负极触点连接。
上述进一步方案的有益效果是：通过外部开关即可非常方便的切换所述灯珠和所述硅片LED点亮，从而比较方便地实现聚光光线或泛光光线的切换。
进一步：所述灯珠负极铜膜导线、灯珠正极铜膜导线和硅片负极铜膜导线的表面均涂覆有具有电气绝缘功能的白油。
上述进一步方案的有益效果是：通过在所述灯珠负极铜膜导线、灯珠正极铜膜导线和硅片负极铜膜导线的表面涂覆白油，可以进一步增强其与铝基板的电气绝缘性能，提高供电的稳定性，延长光源的使用寿命。
进一步：所述灯珠为XQ-E光源。
进一步：所述铝基板上还设有多个灯坝焊盘，所述灯坝的下端通过所述灯坝焊盘焊接在所述铝基板上。
上述进一步方案的有益效果是：通过上述方式可以将所述灯坝牢固地固定在所述铝基板上，延长光源的使用寿命。
本发明还提供了一种集泛光、聚光于一体的光源系统，包括用于调节所 述灯珠或硅片LED亮度的电压调节器和所述的集泛光、聚光于一体的光源，所述电压调节器与所述集泛光、聚光于一体的光源连接。
本发明的有益效果是：本发明的一种集泛光、聚光于一体的光源及其系统，可以实现泛光与聚光结合在同一个基板上，而不通过调节聚光物来实现，只需通过开关档位来切换，更加方便的实现了聚光与泛光，具有较好的散热效果，有效的降低了照明产品在可调泛光与聚光结构设计上的成本，同时，产品外配件成本也能大幅度降低。
附图说明
图1为本发明的一种集泛光、聚光于一体的光源结构示意图；
图2为本发明的一种集泛光、聚光于一体的光源的铝基板正视图。
附图中，各标号所代表的部件列表如下：
1、铝基板，2、灯坝，3、硅胶模，4、灯珠，5、硅片LED；
11、灯珠负极铜膜导线，12、灯珠正极铜膜导线，13、硅片负极铜膜导线，14、灯坝焊盘；
111、灯珠负极触点，112、灯珠负极焊盘，121、灯珠正极触点，122、灯珠正极焊盘，123、硅片正极安置点，131、硅片负极触点，132、硅片散热点，133、硅片负极安置点。
具体实施方式
以下结合附图对本发明的原理和特征进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
如图1所示，一种集泛光、聚光于一体的光源结构示意图，包括铝基板1、灯坝2、至少一颗灯珠4和若干硅片LED5，所述铝基板1为板状，所述铝基板1上表面涂有白油，且所述铝基板1上固定有灯珠负极铜膜导线11、 灯珠正极铜膜导线12和硅片负极铜膜导线13，每个所述硅片LED5的两端均跨接在所述灯珠正极铜膜导线12和硅片负极铜膜导线13之间，所述灯坝2为边界小于所述铝基板1的框体结构，且所述灯坝2的下端密封固定在所述铝基板1上，所述灯珠4固定在所述铝基板1上并跨接在所述灯珠负极铜膜导线11和灯珠正极铜膜导线12之间，所述灯珠4位于所述灯坝2的框体结构内，所述灯坝2内设有成型的硅胶模3，且所述硅胶模3覆盖所述硅片LED5，所述灯珠4的上端突出所述硅胶模3的上表面。
从图1中可以看出，所述铝基板1为长方形板状结构，但是这里不仅限于长方形板状结构，其他形状(比如：圆形、菱形等)也可以，只要能实现本发明要解决的问题即可。
其中，如图2所示，所述铝基板1上的灯珠负极铜膜导线11、灯珠正极铜膜导线12和硅片负极铜膜导线13具体设置如下：
所述灯珠负极铜膜导线11两端分别设有灯珠负极触点111，所述灯珠负极铜膜导线11中部设有至少一个灯珠负极焊盘112，且每个所述灯珠4的负极与一个所述灯珠负极焊盘112焊接；
所述灯珠正极铜膜导线12两端分别设有灯珠正极触点121，所述灯珠正极铜膜导线12中部设有至少一个灯珠正极焊盘122，且每个所述灯珠4的正极与一个所述灯珠正极焊盘122焊接，所述灯珠正极铜膜导线12上位于所述灯珠正极焊盘122两侧分别设有若干个硅片正极安置点123，每个所述硅片LED5的正极与一个硅片正极安置点123焊接；
所述硅片负极铜膜导线13两端分别设有硅片负极触点131，所述硅片负极铜膜导线13中部设有数量与所述硅片正极安置点123相同且一一对应的硅片散热点132，所述硅片负极铜膜导线13中部所述硅片散热点132远离所述硅片正极安置点123一侧设有数量与所述硅片散热点132相同且一一对应的硅片负极安置点133，每个所述硅片LED5的灯体固定在所述硅片散热点 132上表面，每个所述硅片LED5的负极与一个硅片负极安置点133焊接。
通过设置所述灯珠负极铜膜导线11、灯珠正极铜膜导线12和硅片负极铜膜导线13，可以方便单独控制所述灯珠4或所述硅片LED5，方便实现泛光光线和聚光光线的切换。
优选地，同一个所述灯珠4焊接的所述灯珠负极焊盘112和所述灯珠正极焊盘122沿所述铝基板1的长度方向对齐并相邻间隔设置。通过上述方式可以保证所述灯珠4位于所述铝基板1的中部，从而得到较为均匀的聚光效果。
优选地，所述硅片正极安置点123均匀设置在所述灯珠正极铜膜导线12上所述灯珠正极焊盘122的两侧。通过上述方式可以保证所述硅片LED5均匀分布在所述铝基板1的两侧，从而得到较为均匀的泛光效果。
优选地，所述硅片正极安置点123、硅片散热点132和硅片负极安置点133三者沿所述铝基板1的宽度方向对齐设置。通过上述方式可以进一步增强所述硅片LED5的泛光效果。
本实施例中，所述灯珠正极触点121与外部电源正极连接，外部电源负极通过开关与所述灯珠负极触点111或硅片负极触点131连接。通过外部开关即可非常方便的切换所述灯珠4或所述硅片LED5点亮，从而比较方便地实现聚光光线和泛光光线的切换。
优选地，所述灯珠负极铜膜导线11、灯珠正极铜膜导线12和硅片负极铜膜导线13的表面均涂覆有具有电气绝缘功能的白油。通过在所述灯珠负极铜膜导线11、灯珠正极铜膜导线12和硅片负极铜膜导线13的表面涂覆白油，可以进一步增强其与铝基板1的电气绝缘性能，提高供电的稳定性，延长这个光源的使用寿命。
本实施例中，所述灯珠4为XQ-E光源。
优选地，所述铝基板1上还设有多个灯坝焊盘14，所述灯坝2的下端通 过所述灯坝焊盘焊14接在所述铝基板1上。通过上述方式可以将所述灯坝2牢固地固定在所述铝基板1上，延长光源的使用寿命。
本发明还提供了一种集泛光、聚光于一体的光源系统，包括用于调节所述灯珠或硅片LED亮度的电压调节器和所述的集泛光、聚光于一体的光源，所述电压调节器与所述集泛光、聚光于一体的光源连接。
本发明的一种集泛光、聚光于一体的光源及其系统，可以实现泛光与聚光结合在同一个基板上，而不通过调节聚光物来实现，只需通过开关档位来切换，更加方便的实现了聚光与泛光，具有较好的散热效果，有效的降低了照明产品在可调泛光与聚光结构设计上的成本，同时，产品外配件成本也能大幅度降低。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种集泛光、聚光于一体的光源，其特征在于：包括铝基板(1)、灯坝(2)、至少一颗灯珠(4)和若干硅片LED(5)，所述铝基板(1)为板状，所述铝基板(1)上表面涂有白油，且所述铝基板(1)上固定有灯珠负极铜膜导线(11)、灯珠正极铜膜导线(12)和硅片负极铜膜导线(13)，每个所述硅片LED(5)的两端均跨接在所述灯珠正极铜膜导线(12)和硅片负极铜膜导线(13)之间，所述灯坝(2)为边界小于所述铝基板(1)的框体结构，且所述灯坝(2)的下端固定在所述铝基板(1)上，所述灯珠(4)固定在所述铝基板(1)上并跨接在所述灯珠负极铜膜导线(11)和灯珠正极铜膜导线(12)之间，所述灯珠(4)位于所述灯坝(2)的框体结构内，所述灯坝(2)内设有成型的硅胶模(3)，且所述硅胶模(3)覆盖所述硅片LED(5)，所述灯珠(4)的上端突出所述硅胶模(3)的上表面。
  2. 根据权利要求1所述一种集泛光、聚光于一体的光源，其特征在于：所述铝基板(1)上的灯珠负极铜膜导线(11)、灯珠正极铜膜导线(12)和硅片负极铜膜导线(13)具体设置如下：
    所述灯珠负极铜膜导线(11)两端分别设有灯珠负极触点(111)，所述灯珠负极铜膜导线(11)中部设有至少一个灯珠负极焊盘(112)，且每个所述灯珠(4)的负极与一个所述灯珠负极焊盘(112)焊接；
    所述灯珠正极铜膜导线(12)两端分别设有灯珠正极触点(121)，所述灯珠正极铜膜导线(12)中部设有至少一个灯珠正极焊盘(122)，且每个所述灯珠(4)的正极与一个所述灯珠正极焊盘(122)焊接，所述灯珠正极铜膜导线(12)上位于所述灯珠正极焊盘(122)两侧分别设有若干个硅片正极安置点(123)，每个所述硅片LED(5)的正极与一个硅片正极安置点(123)焊接；
    所述硅片负极铜膜导线(13)两端分别设有硅片负极触点(131)，所述硅片负极铜膜导线(13)中部设有数量与所述硅片正极安置点(123)相同且一一对应的硅片散热点(132)，所述硅片负极铜膜导线(13)中部所述硅片散热点(132)远离所述硅片正极安置点(123)一侧设有数量与所述硅片散热点(132)相同且一一对应的硅片负极安置点(133)，每个所述硅片LED(5)的灯体固定在所述硅片散热点(132)上表面，每个所述硅片LED(5)的负极与一个硅片负极安置点(133)焊接。
  3. 根据权利要求2所述一种集泛光、聚光于一体的光源，其特征在于：同一个所述灯珠(4)焊接的所述灯珠负极焊盘(112)和所述灯珠正极焊盘(122)沿所述铝基板(1)的长度方向对齐并相邻间隔设置。
  4. 根据权利要求2所述一种集泛光、聚光于一体的光源，其特征在于：所述硅片正极安置点(123)均匀设置在所述灯珠正极铜膜导线(12)上所述灯珠正极焊盘(122)的两侧。
  5. 根据权利要求4所述一种集泛光、聚光于一体的光源，其特征在于：所述硅片正极安置点(123)、硅片散热点(132)和硅片负极安置点(133)三者沿所述铝基板(1)的宽度方向对齐并间隔设置。
  6. 根据权利要求2所述一种集泛光、聚光于一体的光源，其特征在于：所述灯珠正极触点(121)与外部电源正极连接，外部电源负极通过开关与所述灯珠负极触点(111)或硅片负极触点(131)连接。
  7. 根据权利要求1至6任一项所述一种集泛光、聚光于一体的光源，其特征在于：所述灯珠负极铜膜导线(11)、灯珠正极铜膜导线(12)和硅片负极铜膜导线(13)的表面均涂覆有用于电气绝缘的白油。
  8. 根据权利要求1至6任一项所述一种集泛光、聚光于一体的光源，其特征在于：所述灯珠(4)为XQ-E光源。
  9. 根据权利要求1至6任一项所述一种集泛光、聚光于一体的光源， 其特征在于：所述铝基板(1)上还设有多个灯坝焊盘(14)，所述灯坝(2)的下端通过所述灯坝焊盘(14)焊接在所述铝基板(1)上。
  10. 一种集泛光、聚光于一体的光源系统，其特征在于：包括用于调节所述灯珠(4)或硅片LED(5)亮度的电压调节器和如权利要求1至9任一项所述的集泛光、聚光于一体的光源，所述电压调节器与所述集泛光、聚光于一体的光源连接。
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