WO2017024429A1

WO2017024429A1 - Gas-filled led light bulb using smt

Info

Publication number: WO2017024429A1
Application number: PCT/CN2015/086316
Authority: WO
Inventors: 饶汉鑫; 李光
Original assignee: 深圳市裕富照明有限公司
Priority date: 2015-08-07
Filing date: 2015-08-07
Publication date: 2017-02-16

Abstract

Disclosed is a gas-filled LED light bulb (100) using the surface mount technology (SMT), comprising a bulb housing (110), a light holder (120), a support (130) and filament components (140). A cavity (112) is provided inside the bulb housing (110). The light holder (120) is mounted to the bulb housing (110) and outside the cavity (112). The support (130) is fixedly provided inside the cavity (112). Each of the filament components (140) comprises an LED (142) packaged by surface mounted devices (SMD) or chip scale package (CSP), and a foldable circuit board (144), wherein the LED (142) is mounted to the circuit board (144) by using the SMT. The circuit board (144) is in a long strip shape, and two ends of the circuit board (144) are fixed to the support (130). A plurality of the LEDs (142) are provided, and the plurality of the LEDs (142) are arranged in order on the circuit board (144).

Description

Inflatable LED bulb for SMT process

[Technical Field]

The invention relates to the technical field of luminaires, in particular to an inflatable LED bulb of an SMT process.

【Background technique】

A general LED bulb needs to be provided with a metal heat sink, and the LED is disposed on the metal heat sink to achieve efficient heat dissipation. However, the LED bulb is cumbersome and difficult to achieve full-angle illumination. In order to overcome the above problems, the LED filament can be used instead of the structure of the LED disposed on the metal heat sink, so that the LED bulb is light and can emit light at a full light angle.

However, the general LED filament is easily damaged, and it is impossible to achieve a large power, such as 8W or more. If the power of the LED filament is relatively high, the light decay is likely to occur.

[Summary of the Invention]

Based on this, it is necessary to provide an inflatable LED bulb of the SMT process for the problem that the LED filament is easily damaged and light decay.

An inflatable LED bulb for the SMT process, comprising:

a blister with a cavity inside;

a lamp cap mounted on the bulb and located outside the cavity;

a bracket fixedly disposed in the cavity; and

a filament assembly comprising an SMD or CSP packaged LED and a bendable circuit board, the LED being mounted on the circuit board using an SMT process; the circuit board being elongated, the circuit board being fixed at both ends On the support; the number of the LEDs is plural, and a plurality of the LEDs are sequentially arranged on the circuit board.

The above-mentioned SMT process of the inflated LED bulb, SMD or CSP package LED has high reliability and strong seismic resistance. Individually packaged LEDs are mounted on bendable boards using SMT technology for a more reliable structure that improves yield. Since the circuit board is long and bendable, it can be bent and shaped as needed, and is not easily damaged during the processing, which reduces the processing difficulty and improves the yield of the product. The LED is mounted on the surface of the circuit board using SMT technology, so that the filament assembly has good heat dissipation effect, can achieve greater power, and the filament assembly is not easily damaged and light decay.

[Description of the Drawings]

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and those skilled in the art can obtain drawings of other embodiments according to the drawings without any creative work.

1 is a front elevational view of an inflated LED bulb of an SMT process in an embodiment;

2 is a top plan view of the inflated LED bulb of the SMT process shown in FIG. 1;

Figure 3 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 1;

4 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 5 is a top plan view of the inflated LED bulb of the SMT process shown in Figure 4;

Figure 6 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 4;

7 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 8 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 9 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 8;

10 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 11 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 10;

12 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 13 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 12;

Figure 14 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment;

Figure 15 is a cross-sectional view of the inflated LED bulb of the SMT process of Figure 14.

【detailed description】

In order to facilitate an understanding of the present invention, an inflatable LED bulb of the SMT process will be described more fully hereinafter with reference to the associated drawings. A preferred embodiment of an inflatable LED bulb of the SMT process is shown in the drawings. However, the inflatable LED bulb of the SMT process can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to make the disclosure of the inflated LED bulb of the SMT process more thorough and comprehensive.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used herein is for the purpose of describing particular embodiments, and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

As shown in FIGS. 1 and 2, an inflatable LED bulb 100 of an SMT process of an embodiment includes a bulb 110, a base 120, a bracket 130, and a filament assembly 140. A cavity 112 is opened inside the bulb 110. The base 120 is located outside of the cavity 112 and the base 120 is mounted on the bulb 110. The bracket 130 is disposed within the cavity 112, and the bracket 130 is fixedly coupled to the bulb 110. Filament assembly 140 includes LEDs in SMD or CSP packages 142 and bendable circuit board 144, LED 142 is mounted on circuit board 144 using SMT technology. Where SMT is Surface Mount Abbreviation for Technology refers to surface mount technology. SMD is an abbreviation for Surface Mounted Devices, which refers to surface mount devices. CSP is Chip Scale The abbreviation of Package refers to the chip scale package. The circuit board 144 is elongated, and both ends of the circuit board 144 are fixed to the bracket 130. The number of LEDs 142 is multiple, multiple LEDs 142 are sequentially arranged on the circuit board 144.

LED 142 in SMD or CSP packages is highly reliable and shock resistant. Individually packaged LED 142 is mounted on the bendable circuit board 144 using SMT technology, and the structure is more reliable, which can improve the yield. Since the circuit board 144 is long and bendable, it can be bent and shaped as needed, and is not easily damaged during the processing, which reduces the processing difficulty and improves the yield of the product. In addition, by bending and shaping the wiring board 144, the LED light bulb 100 can be uniformly illuminated. led The 142 is mounted on the surface of the circuit board 144 by using the SMT technology, so that the filament assembly 140 has a good heat dissipation effect, and a large power can be realized, and the filament assembly 140 is not easily damaged and light decay.

In an embodiment, the bulb 110 may be filled with a heat conductive gas to better dissipate the filament assembly 140 to increase the service life of the LED bulb 100. The heat conductive gas may include hydrogen gas, helium gas, and helium gas, and the heat conductive gas may be a mixed gas of the above two or three, or may be a mixed gas of the above three mixed gases with other gases.

In one embodiment, the bracket 130 includes at least two fixing plates 132, one end of the filament assembly 140 is fixedly coupled to one of the fixing plates 132, and the other end of the filament assembly 140 is fixedly coupled to the other fixing plate 132. In an embodiment, the fixing plate 132 can be provided with a plurality of connecting holes 134, and the end of the filament assembly 140 is fixedly connected to the fixing plate 132 through the connecting hole 134. The above connection method can improve the shock resistance of the filament assembly 140 of the LED bulb 100 to extend the life of the bulb. In other embodiments, the connection of the filament assembly 140 to the fixing plate 160 may also be other connections such as bonding, screwing, and the like. The LED is not only mounted on the circuit board 144, but also see Figure 2, Figure 3, LED The 146 can be attached to the fixed plate 160 as needed.

In one embodiment, the width of the circuit board 144 is 1 to 1.2 times the width of the LED 142, that is, the width of the circuit board 144 and the LED. The width of the 142 is equal, or the width of the circuit board 144 is slightly larger than the width of the LED 142, which saves the material of the circuit board 144 and reduces the manufacturing cost of the LED light bulb 100. In an embodiment, a plurality of LEDs The 142 are arranged closely or spaced apart on the wiring board 144. The plurality of LEDs 142 are closely arranged on the circuit board 144, which can save the space occupied by the LED 142 of the circuit board 144 and improve the luminous efficiency.

Referring to FIG. 3, in one embodiment, the inflatable LED bulb 100 of the SMT process further includes a power source 150. The power source 150 is located in the lamp cap 120. The power source 150 is electrically connected to the plurality of circuit boards 144, and the power source 150 is electrically connected to the external power source. In an embodiment, the outer wall of the cap 120 may be threaded, and the connector connecting the LED bulb 100 is provided with a threaded interface, and the cap 120 is connected to the connector through a threaded interface.

As shown in FIG. 4 to FIG. 6 , in another embodiment, the number of the circuit boards 144 is plural, and the plurality of circuit boards 144 are each bent into a U shape, and the plurality of circuit boards 144 cross each other and the plurality of circuit boards 144 are crossed. There is a gap between them. There is a gap between the plurality of circuit boards 144 to facilitate heat dissipation. And the plurality of circuit boards 144 cross each other to enable the LEDs The 142 is evenly distributed, thereby making the light uniform. The circuit board 144 is a structure that can be shaped after being bent. The two ends of the U-shaped circuit board 144 are fixed on the bracket 130. The structure of the bracket 130 is simple and convenient for processing.

In another embodiment, the bracket 130 may also be cylindrical, and the filament assembly 140 is spirally wound around the bracket 130 (not shown). Adjusting the filament assembly 140 in a spiral shape on the bracket 130 saves space occupied by the filament assembly 140, and can make the light distribution of the LED bulb 100 more uniform.

It should be noted that the connection manner between the lamp cap 120 and the connector connecting the LED bulb 100 is not limited to being connected through a screw interface, and may also be connected through a snap interface or other type of standard interface, for example, as shown in FIG. Two bayonet pins 122 are disposed on the outer wall of the 120, and the bayonet pins 122 are used for connecting with the bayonet of the connector.

The bulbs 110 may be provided in any shape. Referring to FIGS. 8 to 15, the caps 120 are identical in shape and size, and are all of a standard shape and size, and the bulbs 110 can be flexibly set as needed. In the embodiment shown in FIG. 8 and FIG. 9 , the bulb 110 can be substantially spherical in a large volume. In the embodiment shown in FIG. 10 and FIG. 11 , the bulb 110 can be substantially spherical in size, and the filament assembly can be arranged. 140 can be adjusted in shape and size as needed. In the embodiment shown in FIG. 12 and FIG. 13 , the bulb 110 may have a larger volume of a candle. In the embodiment shown in FIGS. 14 and 15 , the bulb 110 may have a smaller candle shape, and the filament assembly. 140 can be adjusted in shape and size as needed.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

An inflatable LED bulb for the SMT process, comprising:

a blister with a cavity inside;

a lamp cap mounted on the bulb and located outside the cavity;

a bracket fixedly disposed in the cavity; and

a filament assembly comprising an SMD or CSP packaged LED and a bendable circuit board, the LED being mounted on the circuit board using an SMT process; the circuit board being elongated, the circuit board being fixed at both ends On the support; the number of the LEDs is plural, and a plurality of the LEDs are sequentially arranged on the circuit board.
The gas-filled LED light bulb of the SMT process according to claim 1, wherein the bulb is filled with a heat conductive gas.
The inflatable LED bulb of the SMT process according to claim 1, wherein the bracket comprises at least two fixing plates, one end of the filament assembly is fixedly connected to one of the fixing plates, and the other end of the filament assembly is The other fixing plate is fixedly connected.
The inflatable LED bulb of the SMT process according to claim 3, wherein the fixing plate is provided with a plurality of connecting holes, and an end of the filament assembly is fixedly connected to the fixing plate through the connecting hole.
The inflated LED light bulb of the SMT process according to claim 1, wherein the number of the circuit boards is plural, and the plurality of the circuit boards are each bent into a U shape, and the plurality of the circuit boards cross each other and There is a gap between the plurality of circuit boards.
The gas-filled LED light bulb of the SMT process according to claim 1, wherein the holder has a columnar shape, and the filament assembly is spirally wound around the holder.
The inflatable LED bulb of the SMT process according to claim 1, wherein the width of the wiring board is 1 to 1.2 times the width of the LED.
The gas-filled LED light bulb of the SMT process of claim 1, wherein a plurality of said LEDs are closely or spacedly arranged on said wiring board.
The inflatable LED light bulb of the SMT process of claim 1 further comprising a power source, said power source being located within said base, said power source being electrically coupled to said circuit board.