CN204962346U - Gas-filled LED bulb adopting SMT technology - Google Patents
Gas-filled LED bulb adopting SMT technology Download PDFInfo
- Publication number
- CN204962346U CN204962346U CN201520594778.XU CN201520594778U CN204962346U CN 204962346 U CN204962346 U CN 204962346U CN 201520594778 U CN201520594778 U CN 201520594778U CN 204962346 U CN204962346 U CN 204962346U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- led bulb
- led
- filament assembly
- inflation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005516 engineering process Methods 0.000 title abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 238000005452 bending Methods 0.000 abstract description 4
- 238000012797 qualification Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to an LED bulb aerifys of SMT technology. The gas-filled LED bulb adopting the SMT process comprises a bulb shell, a lamp holder, a support and a filament assembly. The bulb shell is internally provided with a cavity. The lamp holder is positioned outside the cavity body and is arranged on the bulb shell. The support sets up in the cavity, support and cell-shell fixed connection. The filament assembly comprises an SMD or CSP packaged LED and a bendable circuit board, and the LED is attached to the circuit board by using an SMT technology. The circuit board is in a strip shape, and two ends of the circuit board are fixed on the bracket. The number of the LEDs is multiple, and the LEDs are sequentially arranged on the circuit board. The LED of independent encapsulation pastes on the circuit board of can buckling, and the structure is more reliable, can improve the yields. Because the circuit board is rectangular form and can buckle, consequently can carry out the bending plastic as required, be difficult to damage in the course of working, reduced the processing degree of difficulty, improve the qualification rate of product. Can realize larger power, and the filament assembly is not easy to damage and light decay.
Description
Technical field
The utility model relates to the technical field of light fixture, particularly relates to a kind of inflation LED bulb of SMT technique.
Background technology
General LED bulb needs to be provided with metal heat sink, and LED is arranged in metal heat sink and realizes high efficiency and heat radiation, but this LED bulb is comparatively heavy, is difficult to accomplish that full optic angle is luminous.In order to overcome the problems referred to above, the structure in metal heat sink can be arranged on LED silk replacement LED, make LED bulb light and handy, and can optic angle luminescence entirely.
But general LED silk easily damages, and cannot relatively high power be realized, as more than 8W, if the temperature of power larger LED silk can be higher, be easy to occur light decay.
Utility model content
Based on this, be necessary easily to damage the problem with light decay for LED silk, a kind of inflation LED bulb of SMT technique is provided.
An inflation LED bulb for SMT technique, comprises cell-shell, lamp holder, support and filament assembly;
Described cell-shell inside offers cavity;
Described lamp holder is positioned at outside described cavity, and described lamp holder is arranged on described cell-shell;
Described Bracket setting is in described cavity, and described support is fixedly connected with described cell-shell;
Described filament assembly comprises the LED of SMD or CSP encapsulation and bent wiring board, and described LED uses SMT technology to be mounted on described wiring board; Described wiring board is strip, and the two ends of described wiring board are fixing on the bracket; The quantity of described LED is multiple, and multiple described LED is order arrangement on described wiring board.
Wherein in an embodiment, in described cell-shell, be filled with heat-conducting gas.
Wherein in an embodiment, described support comprises at least two fixed heads, and one end of described filament assembly is fixedly connected with fixed head described in one of them, and the other end of described filament assembly is fixedly connected with fixed head described in another.
Wherein in an embodiment, described fixed head offers multiple connecting hole, and the end of described filament assembly is fixedly connected with described fixed head by described connecting hole.
Wherein in an embodiment, the quantity of described wiring board is multiple, and multiple described wiring board is all bent to U-shaped, and multiple described wiring board mutually intersects and has gap between multiple described wiring board.
Wherein in an embodiment, described support is column, and described filament assembly is in the shape of a spiral around on the bracket.
Wherein in an embodiment, the width of described wiring board is 1 ~ 1.2 times of the width of described LED.
Wherein in an embodiment, multiple described LED on described wiring board closely or be spaced.
Wherein in an embodiment, also comprise power supply, described power supply is positioned at described lamp holder, and described power supply is electrically connected with described wiring board.
The inflation LED bulb of above-mentioned SMT technique, the LED reliability of SMD or CSP encapsulation is high, shock resistance is strong.The LED of independent encapsulation uses SMT technology to be mounted on bent wiring board, and structure is more reliable, can improve yields.Because wiring board is strip and bent, therefore can carry out bending shaping as required, be not easy in process to damage, reduce difficulty of processing, improve the qualification rate of product.LED uses SMT technology to be mounted on the surface of wiring board, makes filament assembly excellent in heat dissipation effect, can realize relatively high power, and filament assembly is not easy to damage and light decay.
Accompanying drawing explanation
Fig. 1 is the front view of the inflation LED bulb of SMT technique in an embodiment;
Fig. 2 is the top view of the inflation LED bulb of the technique of SMT shown in Fig. 1;
Fig. 3 is the profile of the inflation LED bulb of the technique of SMT shown in Fig. 1;
Fig. 4 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Fig. 5 is the top view of the inflation LED bulb of the technique of SMT shown in Fig. 4;
Fig. 6 is the profile of the inflation LED bulb of the technique of SMT shown in Fig. 4;
Fig. 7 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Fig. 8 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Fig. 9 is the profile of the inflation LED bulb of the technique of SMT shown in Fig. 8;
Figure 10 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Figure 11 is the profile of the inflation LED bulb of the technique of SMT shown in Figure 10;
Figure 12 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Figure 13 is the profile of the inflation LED bulb of the technique of SMT shown in Figure 12;
Figure 14 is the stereogram of the inflation LED bulb of SMT technique in another embodiment;
Figure 15 is the profile of the inflation LED bulb of the technique of SMT shown in Figure 14.
Detailed description of the invention
For the ease of understanding the utility model, be described more fully below with reference to the inflation LED bulb of relevant drawings to SMT technique.The first-selected embodiment of the inflation LED bulb of SMT technique is given in accompanying drawing.But the inflation LED bulb of SMT technique can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the disclosure of the inflation LED bulb of SMT technique more comprehensively thorough.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of term used herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As depicted in figs. 1 and 2, the inflation LED bulb 100 of the SMT technique of an embodiment comprises cell-shell 110, lamp holder 120, support 130 and filament assembly 140.Cell-shell 110 inside offers cavity 112.Lamp holder 120 is positioned at outside cavity 112, and lamp holder 120 is arranged on cell-shell 110.Support 130 is arranged in cavity 112, and support 130 is fixedly connected with cell-shell 110.Filament assembly 140 comprises the LED142 of SMD or CSP encapsulation and bent wiring board 144, LED142 uses SMT technology to be mounted on wiring board 144.Wherein SMT is the abbreviation of SurfaceMountTechnology, refers to surface mounting technology.SMD is the abbreviation of SurfaceMountedDevices, refers to surface mount device.CSP is the abbreviation of ChipScalePackage, refers to wafer-level package.Wiring board 144 is in strip, and the two ends of wiring board 144 are fixed on support 130.The quantity of LED142 is multiple, and multiple LED142 is order arrangement on wiring board 144.
The LED142 reliability of SMD or CSP encapsulation is high, shock resistance is strong.The LED142 of independent encapsulation uses SMT technology to be mounted on bent wiring board 144, and structure is more reliable, can improve yields.Because wiring board 144 is bent in strip, therefore can carries out bending shaping as required, be not easy in process to damage, reduce difficulty of processing, improve the qualification rate of product.In addition, by wiring board 144 is bent shaping, the effect of LED bulb 100 uniformly light-emitting can be realized.LED142 uses SMT technology to be mounted on the surface of wiring board 144, makes filament assembly 140 excellent in heat dissipation effect, can realize relatively high power, and filament assembly 140 is not easy to damage and light decay.
In one embodiment, can heat-conducting gas be filled in cell-shell 110, can dispel the heat to filament assembly 140 better, to improve the service life of LED bulb 100.Heat-conducting gas can comprise hydrogen, helium and neon, and heat-conducting gas can be the mist of above both or three, also can be the mists of above three kinds of mists with other gases.
Wherein in an embodiment, support 130 comprises at least two fixed heads 132, and one end of filament assembly 140 is fixedly connected with one of them fixed head 132, and the other end of filament assembly 140 is fixedly connected with another fixed head 132.In one embodiment, fixed head 132 can offer multiple connecting hole 134, and the end of filament assembly 140 is fixedly connected with fixed head 132 by connecting hole 134.Above-mentioned connected mode can improve the shock resistance of the filament assembly 140 of LED bulb 100, to extend the service life of bulb.In other embodiments, filament assembly 140 and the connected mode of fixed head 160 can also be other connected modes such as to bond, screw is connected.LED is mounted on wiring board 144, then see Fig. 2, Fig. 3, LED146 can be mounted on fixed head 160 as required.
Wherein in an embodiment, the width of wiring board 144 is 1 ~ 1.2 times of the width of LED142, and namely the width of wiring board 144 is equal with the width of LED142, or the width of wiring board 144 is slightly larger than the width of LED142, save the material of wiring board 144, reduce the cost of manufacture of LED bulb 100.In one embodiment, multiple LED142 on wiring board 144 closely or be spaced.Wherein, multiple LED142 is close-packed arrays on wiring board 144, can save the space of LED142 busy line plate 144, improves luminous efficiency.
Simultaneously see Fig. 3, wherein in an embodiment, the inflation LED bulb 100 of SMT technique also comprises power supply 150, and power supply 150 is positioned at lamp holder 120, and power supply 150 is electrically connected with multiple wiring board 144, and power supply 150 is connected with extraneous power electric.In one embodiment, the outer wall of lamp holder 120 can offer screw thread, and the Connection Block being connected LED bulb 100 is provided with hickey, and lamp holder 120 is connected with Connection Block by hickey.
As shown in Figures 4 to 6, in another embodiment, the quantity of wiring board 144 is multiple, and multiple wiring board 144 is all bent to U-shaped, and multiple wiring board 144 mutually intersects and has gap between multiple wiring board 144.Between multiple wiring board 144, there is gap, be beneficial to heat radiation.And multiple wiring board 144 intersects mutually, LED142 can be made to be evenly distributed, and then make evenly luminous.Wiring board 144 is the structure can shaped after bending, and the two ends of U-shaped wiring board 144 are fixed on support 130, and the structure of support 130 is simple, convenient processing.
In another embodiment, support 130 can be also column, and filament assembly 140 is looped around (not shown) on support 130 in the shape of a spiral.Filament assembly 140 being adjusted to helical form is arranged on support 130, saves taking up room of filament assembly 140, the Light distribation of LED bulb 100 can be made more even.
It should be noted that, lamp holder 120 and the connected mode of the Connection Block being connected LED bulb 100 are not limited by hickey and connect, also can be connected by the standard interface of engaging interface or other types, such as, as shown in Figure 7, can arrange two bayonet locks 122 on the outer wall of lamp holder 120, bayonet lock 122 is for being connected with the bayonet socket of Connection Block.
Cell-shell 110 can be arranged to arbitrary shape, and see Fig. 8 to Figure 15, the shape and size of lamp holder 120 are identical, are standard shape and size, and cell-shell 110 can be arranged as required flexibly.In embodiment shown in Fig. 8, Fig. 9, cell-shell 110 can roughly in larger spherical of volume, and in the embodiment shown in Figure 10, Figure 11, cell-shell 110 can spherical roughly in small volume, and filament assembly 140 can adjust shape and size as required.In embodiment shown in Figure 12, Figure 13, the candle that cell-shell 110 can be larger in volume, in the embodiment shown in Figure 14, Figure 15, cell-shell 110 can be the candle of small volume, and filament assembly 140 can adjust shape and size as required.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (9)
1. an inflation LED bulb for SMT technique, is characterized in that, comprises cell-shell, lamp holder, support and filament assembly;
Described cell-shell inside offers cavity;
Described lamp holder is positioned at outside described cavity, and described lamp holder is arranged on described cell-shell;
Described Bracket setting is in described cavity, and described support is fixedly connected with described cell-shell;
Described filament assembly comprises the LED of SMD or CSP encapsulation and bent wiring board, and described LED uses SMT technique to be mounted on described wiring board; Described wiring board is strip, and the two ends of described wiring board are fixing on the bracket; The quantity of described LED is multiple, and multiple described LED is order arrangement on described wiring board.
2. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, is filled with heat-conducting gas in described cell-shell.
3. the inflation LED bulb of SMT technique according to claim 1, it is characterized in that, described support comprises at least two fixed heads, and one end of described filament assembly is fixedly connected with fixed head described in one of them, and the other end of described filament assembly is fixedly connected with fixed head described in another.
4. the inflation LED bulb of SMT technique according to claim 3, is characterized in that, described fixed head offers multiple connecting hole, and the end of described filament assembly is fixedly connected with described fixed head by described connecting hole.
5. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, the quantity of described wiring board is multiple, and multiple described wiring board is all bent to U-shaped, and multiple described wiring board mutually intersects and has gap between multiple described wiring board.
6. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, described support is column, and described filament assembly is in the shape of a spiral around on the bracket.
7. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, the width of described wiring board is 1 ~ 1.2 times of the width of described LED.
8. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, multiple described LED on described wiring board closely or be spaced.
9. the inflation LED bulb of SMT technique according to claim 1, is characterized in that, also comprise power supply, and described power supply is positioned at described lamp holder, and described power supply is electrically connected with described wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594778.XU CN204962346U (en) | 2015-08-07 | 2015-08-07 | Gas-filled LED bulb adopting SMT technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594778.XU CN204962346U (en) | 2015-08-07 | 2015-08-07 | Gas-filled LED bulb adopting SMT technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204962346U true CN204962346U (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520594778.XU Expired - Fee Related CN204962346U (en) | 2015-08-07 | 2015-08-07 | Gas-filled LED bulb adopting SMT technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204962346U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287282A (en) * | 2016-11-08 | 2017-01-04 | 杭州泰格电子电器有限公司 | A kind of LED bulb |
| WO2017024429A1 (en) * | 2015-08-07 | 2017-02-16 | 深圳市裕富照明有限公司 | Gas-filled led light bulb using smt |
| CN106468402A (en) * | 2015-08-07 | 2017-03-01 | 深圳市裕富照明有限公司 | Gas-filled LED bulb adopting SMT technology |
-
2015
- 2015-08-07 CN CN201520594778.XU patent/CN204962346U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017024429A1 (en) * | 2015-08-07 | 2017-02-16 | 深圳市裕富照明有限公司 | Gas-filled led light bulb using smt |
| CN106468402A (en) * | 2015-08-07 | 2017-03-01 | 深圳市裕富照明有限公司 | Gas-filled LED bulb adopting SMT technology |
| CN106287282A (en) * | 2016-11-08 | 2017-01-04 | 杭州泰格电子电器有限公司 | A kind of LED bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |