WO2017023098A1

WO2017023098A1 - Method for manufacturing multilayer printed circuit board for bluetooth

Info

Publication number: WO2017023098A1
Application number: PCT/KR2016/008517
Authority: WO
Inventors: 정찬붕
Original assignee: 두두테크 주식회사
Priority date: 2015-08-06
Filing date: 2016-08-02
Publication date: 2017-02-09
Also published as: JP2018513568A; KR101645478B1

Abstract

A method for manufacturing a multilayer printed circuit board for Bluetooth, according to the present invention, comprises the steps of: performing an inner layer image process in a first copper foil (110) and a first copper plating layer (120) to form a predetermined circuit pattern; performing hole plugging with a plugging ink (230) in a through hole (A), and then performing an outer layer image process in an electroless copper plating layer (210) and an electrolytic copper plating layer (220) to form a predetermined circuit pattern; performing hole plugging with a plugging ink (330) in a through hole (B), and performing an outermost layer image process in an electroless copper plating layer (310) and an electrolytic copper plating layer (320) to form a predetermined circuit pattern; and printing an outermost layer with the plugging ink (330) and a solder resist ink (340) in the region other than the hole of the through hole (B).

Description

Manufacturing method of multilayer printed circuit board for Bluetooth

The present invention relates to a method for manufacturing a multilayered printed circuit board for Bluetooth, and more particularly, to a method for manufacturing a multilayered printed circuit board for Bluetooth having a high level of transmission and reception, sound quality and durability.

In general, Bluetooth is a standard for near field communication. Bluetooth devices are currently used primarily in wireless ad-hoc environments, such as wireless headsets, and can also connect to the Internet through Bluetooth access points.

In other words, Bluetooth is a standard that wirelessly connects portable devices such as portable PCs and smartphones at a low cost within a narrow range, and uses wireless frequencies to communicate with various digital devices without using physical cables. Allows you to send and receive data. For example, Bluetooth wireless technology can be implemented in smartphones and laptop computers to be connected and used without cables, and virtually all digital devices, including personal digital assistants (PDAs), desktops, FAX, keyboards and joysticks, can be part of a Bluetooth system. have.

Recently, in particular, the demand for diversification of mobile communication terminal functions due to the rapid increase in the use of mobile communication terminals such as smart phones, and the high functionality of the transmission and reception and sound quality so that the communication accessibility can be easily made during transportation by means of transportation such as automobiles, etc. Bluetooth with high quality and durability is demanded.

Accordingly, the present invention has been proposed to solve the above-described demands, and the object thereof is not only communication between various digital devices, but also a diversification request for a function of a mobile communication terminal due to the rapid use of a mobile communication terminal such as a smart phone, The present invention provides a method for manufacturing a multilayer printed circuit board for Bluetooth having high transmission / reception, sound quality functionality, and high quality durability so that communication accessibility can be easily performed while moving by a vehicle such as an automobile.

In order to solve the above problems, the method of manufacturing a multilayer printed circuit board for Bluetooth according to the present invention, the first copper plating layer 120 is laminated on the first copper foil 110 laminated on both sides of the epoxy layer 100 A first step (S100), a second step (S200) of forming a predetermined circuit pattern by performing an inner layer imaging process on the first copper foil 110 and the first copper plating layer 120, and a predetermined The first prepreg layer 200 in which the second copper foil 201 is formed on both surfaces of the epoxy layer 100 and the predetermined circuit pattern on which the circuit pattern is formed is laminated, respectively, and the first prepreg layer 200 is stacked. The third step (S300) to form the second copper foil 201 formed on one surface of the contact with the epoxy layer 100 and the predetermined circuit pattern, respectively, and a through hole (A) penetrating the upper and lower surfaces Fourth step (S400) to form a, the inner surface of the through hole (A) and the double mark of the first prepreg layer 200 Forming an electroless copper plating layer 210 on the second copper foil 201 formed therein, and forming an electrolytic copper plating layer 220 on the electroless copper plating layer 210, and the The sixth step S600 of performing hole plugging with plugging ink 230 in the through hole A, the second copper foil 201, the electroless copper plating layer 210, and A seventh step (S700) of forming a predetermined circuit pattern by performing an outer layer image process on the electrolytic copper plating layer 220, and the first prepreg layer 200 and a predetermined upper and lower parts in which predetermined circuit patterns are formed on both surfaces thereof. And a third copper foil formed on one surface of the second prepreg layer 300 by laminating a circuit pattern of the second prepreg layer 300 on which both surfaces of the third copper foil 301 are formed. An eighth step of forming 301 in contact with the first prepreg layer 200 and the predetermined circuit pattern on the S800 and through holes B penetrating the upper and lower surfaces, and the ninth blind via holes C are respectively formed in predetermined regions of the second prepreg layer 300 having the upper and lower third copper foils. In step S900, the inner surface of the through-hole B and the inner surface of the blind via hole C, and an electroless copper plating layer on the third copper foil 301 formed on the other surface of the second prepreg layer 300 Forming a 310 and forming an electrolytic copper plating layer 320 on the electroless copper plating layer 310 and hole plugging with plugging ink 330 in the through hole B; an eleventh step of performing hole plugging (S1100), and an outermost layer imaging process on the third copper foil 301, the electroless copper plating layer 310, and the electrolytic copper plating layer 320. A twelfth step (S1200) of forming a portion, and the solder resist ink 340 in a region other than the holland of the plugging ink 330 and the through hole B. A thirteenth step S1300 of printing the outermost layer, and a fourteenth step S1400 of sequentially forming the nickel plating layer 350 and the gold plating layer 360 on the holes of the through hole B. .

In addition, according to the present invention, a method for manufacturing a multilayer printed circuit board for Bluetooth, wherein the epoxy layer 100 is 0.2m / m (1oz) CCL (copper laminate) of CTE 45ppm / ℃, the glass transition temperature Is TG 150 ° C, pyrolysis temperature is TD 370 ° C, and includes 1/3 oz (12 μm) of first copper foil 110 on both sides.

In addition, according to the present invention, in the method for manufacturing a multilayer printed circuit board for Bluetooth, in the inner layer imaging process, a photoresist (PR) is laminated on the first copper foil 110 and 95 ° C to 120 ° C (± 5 ° C). Lamination for laminating a dry film having a circuit pattern having a predetermined shape on the photoresist by a roller having a roller temperature, a roller pressure of 0.2 to 0.4 MPa, and a roller speed of 0.9 to 1.2 m / min. The light irradiated with an amount of light of 20 to 55 mJ / cm 2 by an 8 평행 parallel light exposure machine to form a circuit pattern having a predetermined shape in the step (A1) and the photoresist is applied to the dry film having the circuit pattern having a predetermined shape. An exposure step (B1) to be irradiated and 0.5% to 1.0% (VOL) of sodium carbonate developer, which is a temperature of 25 ° C to 30 ° C, are sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to exclude a circuit pattern having a predetermined shape. Removing Photoresist in a Region 1,5 kgf / cm ^{2 of} copper metal etching solution having a loping process (C1), a temperature of 48 ° C. to 52 ° C., and a specific gravity (20 ° C.) of 1.19 ± 0.02. Etching process (D1) in which the first copper foil 110 in a region excluding a circuit pattern of a predetermined shape is removed by spraying at a pressure of (± 1.0), and a temperature of 48 ° C to 58 ° C is 2% to 4.2 % (VOL) of sodium hydroxide stripper was sprayed at a spray pressure of 0.14 MPa to 0.16 MPa to perform a stripping process (E1) to remove the photoresist remaining on a circuit pattern of a predetermined shape, respectively, to a predetermined inner layer. Form a circuit and a holland.

In addition, according to the present invention, the method for manufacturing a multi-layered printed circuit board for Bluetooth, the electroless copper plating layer 210 is 77g / l copper sulfate (copper sulfate), 145g / l ethylenediamine tetraacetic acid (EDTA), With a plating solution containing 28 g / l formaldehyde (HCHO), 39 g / l sodium hydroxide (NaOH), 0.12 g / l polyethylene glycol (PEG), and 78 mg / l bipyridyl It is formed to a thickness of 0.8 μm to 1.3 μm by performing at a temperature of 38 ° C. for 35 minutes.

In addition, according to the present invention, in the method for manufacturing a multilayer printed circuit board for Bluetooth, the electrolytic copper plating layer 220 includes 178 g / l of semi-sulfuric acid (Surfuric Acid), 78 g / l of copper sulfate, and 19 mg. A plating liquid containing an additive of / l, a 48 mg / l leveling agent, and a 52 mg / l Brightner was transferred to 0.85 A / dm ² for 80 minutes at a temperature of 21 ° C. Plating is carried out under the conditions of forming a thickness of 18㎛ ~ 20㎛.

In addition, in the manufacturing method of the multilayered printed circuit board for Bluetooth according to the present invention, in the sixth step (S600), the hole plugging is an ink having a viscosity of 300P (25 ℃) ~ 500P (25 ℃) 150 ℃ ~ It is carried out under conditions of 40 CTE (coefficient of thermal expansion) and TG (glass transition temperature) of 150 ° C. for a curing time of 55 minutes at a box-oven of 155 ° C.

In addition, according to the present invention, a method for manufacturing a multilayer printed circuit board for Bluetooth, wherein the outer layer image process, the photoresist on the electroless copper plating layer 210, the electrolytic copper plating layer 220 and the plugging ink 230. (PR) was laminated on the photoresist by a roller having a roller temperature of 95 ° C to 120 ° C (± 5 ° C), a roller pressure of 0.2 to 0.4 MPa, and a roller speed of 0.9 to 2.2 m / min. A lamination process (a1) of laminating a dry film having a predetermined circuit pattern and a light quantity of 20 to 55 mJ / cm 2 by a 10 평행 parallel light exposure machine so as to form a circuit pattern of a predetermined shape in the photoresist. The exposure step (b1) of irradiating the light irradiated with the dry film on which the circuit pattern of a predetermined shape was formed, and 0.5% to 1.0% (VOL) of sodium carbonate developer, which is a temperature of 25 ° C to 30 ° C, is 0.10 MPa. Circuit of predetermined shape by spraying at spray pressure of ~ 0.18MPa 150 g / l to 210 g / l copper metal having a developing process (c1) for removing the photoresist except for the pattern (c1), a temperature of 48 ° C. to 52 ° C., and a specific gravity (20 ° C.) of 1.19 ± 0.02. Etching solution is sprayed at a pressure of 1,5 kgf / cm ² (± 1.0) to remove the electroless copper plating layer 210 and the electrolytic copper plating layer 220 in a region excluding a circuit pattern having a predetermined shape. ) Process (d1) and 2% to 4.0% (VOL) of sodium hydroxide stripping liquid at a temperature of 45 ° C to 58 ° C are sprayed at a spray pressure of 0.14 MPa to 0.17 MPa to remain on a circuit pattern of a predetermined shape. Each of the stripping processes e1 for removing the resist is performed to form a predetermined outer layer circuit and a holland.

In addition, the manufacturing method of the multilayered printed circuit board for Bluetooth according to the present invention, after the outer layer image process, in a conveyor moving at a speed of 1.3m / min ~ 1.8m / min, 90ml / l 95% sulfuric acid (H ₂ SO ₄ ), 58 ml / l of 35% hydrogen peroxide (H ₂ O ₂ ), and a micro semi-etching solution containing a predetermined ultra-pure water (DI water) is used, the micro semi-etching solution has a specific gravity of 1.031 ~ 1.041, 3.00 A first micro semi etching process is performed under conditions having a pH below, a temperature of 28 ° C. (± 5 ° C.), and an etching rate of 1.8 μm to 2.5 μm.

In addition, according to the present invention, the method for manufacturing a multi-layer printed circuit board for Bluetooth, the electroless copper plating layer 310 is 77g / l copper sulfate (copper sulfate), 145g / l ethylenediamine tetraacetic acid (EDTA), With a plating solution containing 28 g / l formaldehyde (HCHO), 39 g / l sodium hydroxide (NaOH), 0.12 g / l polyethylene glycol (PEG), and 78 mg / l bipyridyl It is formed to a thickness of 0.8 μm to 1.3 μm by performing at a temperature of 38 ° C. for 35 minutes.

In addition, according to the present invention, in the method for manufacturing a multilayer printed circuit board for Bluetooth, the electrolytic copper plating layer 320 includes 178 g / l of semi-sulfuric acid (Surfuric Acid), 78 g / l of copper sulfate, and 19 mg. A plating liquid containing an additive of / l, a 48 mg / l leveling agent, and a 52 mg / l Brightner was transferred to 0.85 A / dm ² for 80 minutes at a temperature of 21 ° C. Plating is carried out under the conditions of forming a thickness of 18㎛ ~ 20㎛.

In addition, in the manufacturing method of the multilayered printed circuit board for Bluetooth according to the present invention, in the eleventh step (S1100), the hole plugging the ink having a viscosity of 300P (25 ℃) ~ 500P (25 ℃) 150 ℃ ~ It is carried out under conditions of 40 CTE (coefficient of thermal expansion) and TG (glass transition temperature) of 150 ° C. for a curing time of 55 minutes at a box-oven of 155 ° C.

In addition, according to the present invention, in the method for manufacturing a multilayer printed circuit board for Bluetooth, the outermost layer image process may be performed on the third copper foil 301, the electroless copper plating layer 310, and the electrolytic copper plating layer 320. The photoresist (PR) was laminated, and the photoresist was formed by a roller having a roller temperature of 95 ° C to 120 ° C (± 5 ° C), a roller pressure of 0.2 to 0.4 MPa, and a roller speed of 0.9 to 2.2 m / min. 20 to 55 mJ / cm 2 by a lamination step (1) of laminating a dry film having a circuit pattern of a predetermined shape formed thereon and a 10 kW parallel light exposure machine to form a circuit pattern of a predetermined shape in the photoresist. An exposure step (2) of irradiating the light irradiated with the light quantity to the dry film having a circuit pattern having a predetermined shape, and a 0.5% to 1.0% (VOL) sodium carbonate developer having a temperature of 25 ° C to 30 ° C A circuit of a predetermined shape is injected at a spray pressure of 0.10 MPa to 0.18 MPa 150 g / l to 210 g / l copper metal having a developing process (3) for removing the photoresist except the turn, a temperature of 48 ° C. to 52 ° C., and a specific gravity (20 ° C.) of 1.19 ± 0.02. (copper metal) The etchant is sprayed at a pressure of 1,5 kgf / cm ² (± 1.0) so that the third copper foil 301, the electroless copper plating layer 310 and the electrolytic copper plating layer 320 in a region excluding a circuit pattern of a predetermined shape ) Etching process (4) and 2% to 4.0% (VOL) of sodium hydroxide stripping liquid, which is a temperature of 45 ° C to 58 ° C, are sprayed at a spray pressure of 0.14 MPa to 0.17 MPa, Each of the stripping processes 5 for removing the photoresist remaining on the circuit pattern is performed to form a predetermined outermost layer circuit and a hole.

In addition, the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention, after the outermost layer image process, in a conveyor moving at a speed of 1.3m / min ~ 1.8m / min, 90ml / l 95% sulfuric acid (H ₂ SO ₄ ), 58 ml / l of 35% hydrogen peroxide (H ₂ O ₂ ), and a micro semi-etching solution containing a predetermined amount of ultrapure water (DI water), wherein the micro semi-etching solution has a specific gravity of 1.031 to 1.041, The second micro semi-etch process is performed under conditions having a pH of 3.00 or less, a temperature of 28 ° C. (± 5 ° C.), and an etching rate of 1.8 μm to 2.5 μm.

In addition, according to the present invention, the method for manufacturing a multilayered printed circuit board for Bluetooth is characterized in that the process conditions for printing the outermost layer with the solder resist ink include a 270 ± 10 poise subject and a 30 ± 10 poise curing agent to achieve 150 ± 10 poise. Printed silk screens of 110 to 120 mesh with ink viscosity and specific gravity of 1.48 to 1.52 were subjected to primary pre-curing at 78 ° C. for 15-20 minutes and for 15-20 minutes at 78 ° C. After repeating the second pre-curing twice, drying to perform post-curing at 150 ° C. for 70 minutes to 75 minutes, and exposure irradiated with a light amount of 420 to 550 mJ / cm ² . And 1 wt% sodium carbonate developer at a temperature of 30 ° C. ± 1 ° C. is sprayed at a spray pressure of 1.8 to 2.5 kgf / cm ² for 50 to 65 minutes.

In addition, according to the present invention, a method for manufacturing a multilayered printed circuit board for Bluetooth according to the present invention includes an ink of 170 ± 10 poise by mixing 200 ± 10 poise with a 150 ± 10 poise curing agent after the process of printing the outermost layer with the solder resist ink. Printed silk screens of 110 to 120 mesh having a viscosity and specific gravity of 1.5 to 1.6 were subjected to primary pre-curing at 78 ° C. for 15-20 minutes and 2 at 15 ° C. for 15-20 minutes. After the second pre-curing was repeated twice, drying was carried out post-curing at 150 ° C. for 65 minutes to 75 minutes, and exposure to light of 650 to 820 mJ / cm ² . , 1 wt% sodium carbonate developer at a temperature of 30 ° C. ± 1 ° C., further comprising a marking printing process performed by a phenomenon of spraying at a spray pressure of 1.8 to 2.5 kgf / cm ² for 20 minutes.

In addition, the manufacturing method of the multilayer printed circuit board for Bluetooth according to the present invention further includes a reflow process for 4.3 minutes in a conveyor chamber at 260 ° C. after the marking printing process.

In addition, according to the present invention, a method for manufacturing a multilayer printed circuit board for Bluetooth further includes performing a JET scrubbing and an ultrasonic cleaning process on the surface formed by the marking printing process after the reflow process. However, the JET Scrubbing and Ultrasonic cleaning process includes 45 ml / l of H ₂ SO ₄ (95%) and DI water (ultra pure water) in a conveyor moving at a speed of 1.8 m / min to 2.3 m / min. JET Scrubbing spraying aluminum oxide (Al ₂ O ₃ (# 360)) at a pressure of 1.6 to 2.3 kgf / cm ^{2 at} an acid rinse and a conveyor speed of 1.8 to 2.3 m / min. And foreign matter on the surface formed by the marking printing process by washing with DI water (three stages rinse), performing Ultrasonic cleaning and drying at 80 ° C. to 95 ° C. after 5 stages of rinse at 1200 Watts × 4 zone / 4㎑. Remove and form roughness.

In addition, in the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention, the nickel plating layer 350 and the gold plating layer 360 may include 45 g / l nickel chloride and 100 g / l cyclopropyl. Aminotrimethylen phosphonic acid, 100 g / l nickel sulfate, 52 g / l ascorbic acid, 52 g / l boric acid, 0.12 g / l The nickel plating solution containing a polishing agent of electroplated at a temperature of 50 ℃ at a current density of 0.2 ~ 0.4 A / dm ² for 10 to 15 minutes to form a nickel plating layer with a thickness of 3 ㎛ ~ 4 ㎛, 16g / l Potassium gold cyanide, 116 g / l Tripotassium citrate monohydrate, 63 g / l Citric anhydride, and 0.53 g / l Hexamethylene tetramine And a soft gold plating solution containing 0.53 g / l 3-pyridine carboxylic acid at a temperature of 53 ° C. and 4.5 Electroplating for 9 to 12 minutes at a current density of 12 A / dm ² at pH to form a gold plated layer with a thickness of 0.2 ㎛ ~ 0.4 ㎛.

According to the present invention, as well as communication between various digital equipment, the demand for diversification of the function of the mobile communication terminal due to the rapid increase in the use of mobile communication terminals such as smart phones, and communication accessibility is easily made on the move by means of transportation such as automobiles. There is an effect of providing a method for manufacturing a multilayer printed circuit board for Bluetooth having a high level of transmission and reception, sound quality and high quality durability.

1 is a floor chart showing the overall flow of a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Figure 2 is a cross-sectional view showing a first step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Figure 3 is a cross-sectional view showing a second step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Figure 4 is a cross-sectional view showing a third step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

5 is a cross-sectional view showing a fourth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

6 is a cross-sectional view showing a fifth step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

7 is a cross-sectional view showing a sixth step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

8 is a cross-sectional view showing a seventh step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

9 is a sectional view showing an eighth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

10 is a cross-sectional view showing a ninth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

11 is a cross-sectional view showing a tenth step of a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

12 is a cross-sectional view showing an eleventh step of a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

13 is a cross-sectional view showing a twelfth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

14 is a cross-sectional view showing a thirteenth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

15 is a cross-sectional view showing a fourteenth step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

16 is a cross-sectional view showing a fifteenth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

[Revision 24.10.2016 under Rule 91]

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In addition, in describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, in the method of manufacturing a multilayered printed circuit board for Bluetooth according to the present invention, a first copper plating layer 120 is laminated on a first copper foil 110 laminated on both surfaces of an epoxy layer 100. The first step (S100), the second step (S200) of forming a predetermined circuit pattern by performing an inner layer image process on the first copper foil 110 and the first copper plating layer 120, and the predetermined circuit pattern on both surfaces A third step (S300) of respectively stacking the first prepreg layer 200 having the second copper foil on both surfaces of the formed epoxy layer 100, and the agent forming a through hole A penetrating the upper and lower surfaces. An electroless copper plating layer 210 is formed on the first prepreg layer 200 having the fourth step S400, the inner surface of the through hole A, and the second copper foil, and on the electroless copper plating layer 210. A fifth step (S500) of forming the electrolytic copper plating layer 220 and a sixth step of performing hole plugging with plugging ink 230 in the through hole A. FIG. (S600), a seventh step (S700) of forming a predetermined circuit pattern by performing an outer layer image process on the electroless copper plating layer 210 and the electrolytic copper plating layer 220, and upper and lower parts on which the predetermined circuit patterns are formed on both surfaces. Forming an eighth step S800 of stacking the second prepreg layer 300 having the third copper foil on the first prepreg layer 200, and a through hole B penetrating the upper and lower surfaces. And a ninth step S900 of forming blind via holes C in predetermined regions of the second prepreg layer 300 having upper and lower third copper foils, and inner surfaces of the through holes B and blind via holes C. A tenth to form an electroless copper plating layer 310 on the inner surface of the second prepreg layer 300 having the third copper foil and an electrolytic copper plating layer 320 on the electroless copper plating layer 310. Step S1000, an eleventh step S1100 of performing hole plugging with the plugging ink 330 in the through hole B, and electroless copper plating. A twelfth step (S1200) of forming a predetermined circuit pattern by performing an outermost layer image process on the 310 and the electrolytic copper plating layer 320, and the plugging ink 330 and the through hole B in regions other than Holland. The thirteenth step (S1300) of printing the outermost layer with the solder resist ink 340, and the fourteenth step (S1400) of sequentially forming the nickel plating layer 350 and the gold plating layer 360 on the hole of the through-hole B. ).

This will be described in more detail with reference to the drawings.

2 is a cross-sectional view showing a first step of a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 2, according to the present invention, a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention may first include a first copper plating layer 120 on a first copper foil 110 laminated on both surfaces of an epoxy layer 100. Laminated.

Here, the epoxy layer 100 is 0.2m / m (1oz) CCL (copper laminated sheet) has a thermal expansion coefficient of CTE 45ppm / ℃, glass transition temperature of TG 150 ℃, thermal decomposition temperature of TD 370 ℃, 1 / 3 oz (about 12 micrometers) of 1st copper foil 110 is included in both surfaces.

The raw materials having the above characteristics are ideal for heat resistance, optimum conditions for durability and anti-wetting function, and fine pattern implementation should be ensured. However, when the multilayered printed circuit board for Bluetooth according to the present invention is inserted about 4 to 5 times at a high temperature of about 260 ° C., delamination which is a fatal defect on the PCB may occur. Therefore, when applying the raw material of the printed circuit board according to the present invention, a separate special management is required to perform baking for the purpose of eliminating the shrinkage of the raw material, fear of expansion and wetness of the raw material. This baking is baked for 245 minutes at a temperature of 150 ℃ and cooled to room temperature, scrubbing and the Imaging process is performed.

3 is a cross-sectional view illustrating a second process of the method of manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 3, an inner layer image process is performed on the first copper foil 110 and the first copper plating layer 120 to form a predetermined circuit pattern.

That is, in the inner layer imaging process, in the inner layer imaging process, the photoresist PR is laminated on the first copper foil 110, and a roller temperature of 95 ° C to 120 ° C (± 5 ° C) and a roller pressure of 0.2 to 0.4 MPa. And a lamination step (A1) of laminating a dry film having a circuit pattern having a predetermined shape on the photoresist by a roller having a roller speed of 0.9 to 1.2 m / min, and a circuit having a predetermined shape on the photoresist. An exposure step (B1) of irradiating a dry film on which a circuit pattern of a predetermined shape is irradiated with light irradiated with an amount of light of 20 to 55 mJ / cm 2 by an 8 평행 parallel light exposure machine so that a pattern is formed; A development process (C1) in which a 0.5% to 1.0% (VOL) sodium carbonate developer at a temperature of 30 ° C. is sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove photoresist in a region except for a circuit pattern having a predetermined shape (C1). And 150 g / with a temperature of 48 ° C. to 52 ° C. and a specific gravity (20 ° C.) of 1.19 ± 0.02. Etching is performed in which a copper metal etching solution of 1 to 220 g / l is sprayed at a pressure of 1,5 kgf / cm ² (± 1.0) to remove the first copper foil 110 in a region excluding a circuit pattern having a predetermined shape. ) Process (D1) and a photoresist that is sprayed at a spray pressure of 0.14 MPa to 0.16 MPa by 2% to 4.2% (VOL) of sodium hydroxide stripping solution at a temperature of 48 ° C to 58 ° C to remain on a circuit pattern of a predetermined shape. Each of the stripping processes E1 for removing the resist is performed.

Then, AOI (reliability check) is performed.

In addition, an oxide process of oxidizing a copper surface of a predetermined inner layer circuit is further performed. This oxide process is carried out in a brown oxide process carried out by the oxide reaction structural formula of 2Cu + ClO ₂ → Cu ₂ O (copper oxide) + ClO.

In more detail, after the inner layer circuit is formed, an oxide layer is formed of Cu ₂ O and CuO by oxidizing the Cu surface, and a brown oxide process is performed to increase the adhesion between the copper foil of the inner layer and the glass fibe or epoxy resin. do. The oxide process is because the surface of Cu is oxidized after the circuit is formed, and the oxide layer is formed of CuO ₂ and CuO, so that the adhesion strength between the Cu foil and the prepreg of the inner layer and the Peel Strength value are superior.

Next, Figure 4 is a cross-sectional view showing a third process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 4, the epoxy layer 100 having a predetermined circuit pattern formed on both surfaces thereof and the first prepreg layer 200 having the second copper foil 201 formed on both surfaces thereof are respectively stacked on the predetermined circuit pattern. The second copper foil 201 formed on one surface of the first prepreg layer 200 is formed to contact the epoxy layer 100 and a predetermined circuit pattern, respectively.

Here, it is preferable that a 2nd copper foil is 1/3 oz (12 micrometers), and it is preferable that the 1st prepreg layer 200 is 0.11 m / m.

Next, Figure 5 is a cross-sectional view showing a fourth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 5, a through hole A penetrating the upper and lower surfaces is formed. This through hole A is a means for configuring a non-conductor hole as a conductor hole.

In addition, residues of epoxy resin or adhered substances due to frictional heat during drilling, etc., may be added to the interface between the Cu layer of the inner layer and the first prepreg layer 200 or the inner wall of the drilled through-hole A. KMnO ₄ It is preferable to perform a further desmear (Desmear) process to remove the drug.

Next, Figure 6 is a cross-sectional view showing a fifth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 6, an electroless copper plating layer 210 is formed on the second copper foil 201 formed on the inner surface of the through hole A and on both surfaces of the first prepreg layer 200, and an electroless copper plating layer. An electrolytic copper plating layer 220 is formed on the 210.

Between the inner layer and the outer layer of the drilled through hole (A) to form a layer consisting of a non-conductor with a chemical to form a hole of the conductor in the non-conductor hole, it is carried out under the following working conditions. .

The electroless copper plating layer 210 includes 77 g / l copper sulfate, 145 g / l ethylenediaminetetraacetic acid (EDTA), 28 g / l formaldehyde (HCHO), and 39 g / l sodium hydroxide ( NaOH), 0.12 g / l polyethylene glycol (PEG), and 78 mg / l bipyridyl (Bipyridyl) was carried out for 35 minutes at a temperature of 38 ℃ to a thickness of 0.8 ㎛ ~ 1.3 ㎛ Form. Thus, the reason for forming in thickness of 0.8 micrometer-1.3 micrometers is because it is an optimal condition for strengthening the adhesive force of chemical plating.

In addition, the electrolytic copper plating layer 220 includes 178 g / l of sulfuric acid, 78 g / l of copper sulfate, 19 mg / l of additive, and 48 mg / l of leveling agent ( A plating solution containing a leveling agent) and 52 mg / l Brightner was electroplated at 0.85 A / dm ² for 80 minutes at a temperature of 21 ° C. to form a thickness of 18 μm to 20 μm.

In the plating of the electroplated copper layer 220, the present invention is carried out by a low current plating method. This is a means for increasing the uniform thickness distribution and plating adhesion of the plating thickness, and performs a low current plating method to prevent delamination defects, which is a feature of the present invention.

Next, Figure 7 is a cross-sectional view showing a sixth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 7, hole plugging is performed with plugging ink 230 in the through hole A. FIG.

Hole plugging is a method of filling a special plugging ink inside a 0.25m / m hole, and connects signals between each layer and the circuit, between circuits and in each hole, and preserves the plating thickness in the hole. In this way, hole plugging is performed in the through hole (A).

Here, after hole plugging is completely hardened, ink protruding from the upper and lower sides of the hole point is removed by a belt sander. In this case, GREATE # 1,200 sand paper is ideal.

The hole plugging condition is as follows.

Hole plugging is applied to inks having a viscosity of 300P (25 ° C) to 500P (25 ° C) at 40 CTE (coefficient of thermal expansion) and 150 ° C for a curing time of 55 minutes at 150 ° C to 155 ° C box-oven. It is carried out under the conditions of TG (glass transition temperature).

Next, Figure 8 is a cross-sectional view showing a seventh process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 8, an outer layer image process is performed on the second copper foil 201, the electroless copper plating layer 210, and the electrolytic copper plating layer 220 to form a predetermined circuit pattern.

In the multilayer printed circuit board for Bluetooth according to the present invention, the distance between the circuits and the circuits and the hole lands is 100 µm or less, respectively, and the dry film is 20 µm thick to maintain the resolution. In addition, in consideration of the adhesion between the circuit and the hole land in addition to the resolution to minimize the variation of the respective circuit width of the bottom surface and the top surface of the circuit.

The outer layer imaging process is performed as follows.

The outer layer imaging process comprises laminating photoresist PR on the electroless copper plating layer 210, the electrolytic copper plating layer 220, and the plugging ink 230, and a roller temperature of 95 ° C to 120 ° C (± 5 ° C), Lamination process (a1) which laminates the dry film in which the circuit pattern of a predetermined shape was formed on the photoresist by the roller which has a roller pressure of 0.2-0.4MPa and a roller speed of 0.9-2.2m / min, An exposure process of irradiating a dry film having a predetermined circuit pattern with light irradiated with a light amount of 20 to 55 mJ / cm 2 by a 10 평행 parallel light exposure machine so that a circuit pattern having a predetermined shape is formed in the photoresist ( b1) and a phenomenon in which 0.5% to 1.0% (VOL) of sodium carbonate developer, which is a temperature of 25 ° C to 30 ° C, is sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove photoresist except for a circuit pattern having a predetermined shape. (Developing) step (c1), the temperature of 48 ℃ ~ 52 ℃, 1.19 ± 0.02 150 g / l to 210 g / l copper metal etching solution having a specific gravity (20 ° C.) was sprayed at a pressure of 1,5 kgf / cm ² (± 1.0) to prevent electroless copper in the region excluding a circuit pattern having a predetermined shape. An etching process (d1) in which the plating layer 210 and the electrolytic copper plating layer 220 are removed, and a sodium hydroxide stripping solution of 2% to 4.0% (VOL) at a temperature of 45 ° C to 58 ° C is 0.14 MPa to 0.17. A stripping process (e1) for spraying at a spray pressure of MPa to remove photoresist remaining on a circuit pattern of a predetermined shape is performed, respectively, to form a predetermined outer layer circuit and a Holland.

Next, AOI check is performed.

Then, in a conveyor moving at a speed of 1.3 m / min to 1.8 m / min, 90 ml / l of 95% sulfuric acid (H ₂ SO ₄ ), 58 ml / l of 35% hydrogen peroxide (H ₂ O ₂ ), and A micro semi etching solution containing ultra pure water (DI water) is used. The micro semi etching solution has a specific gravity of 1.031 to 1.041, a pH of 3.00 or less, a temperature of 28 ° C. (± 5 ° C.), and a thickness of 1.8 μm to 2.5 μm. A first micro semi etching process is performed under conditions having an etching rate.

The reason for performing the micro semi-etching process is to remove impurities such as organic or inorganic materials in the outer layer imaging process, to remove Cu residues between the circuit and the circuits or around the holes, and the inner layer of the circuit and the upper part of the hole land. Roughness is formed uniformly on the copper foil surface, and the residue of a resist, such as the residue of a fine oxide film and the dry film used at the dry film process, is removed. In addition, in the present invention, the adhesion to each layer is important for the reliability and durability of the product, to improve the adhesion even during thermal shock or physical impact.

Next, Figure 9 is a cross-sectional view showing an eighth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 9, a first prepreg layer 200 and a predetermined circuit pattern of upper and lower portions having a predetermined circuit pattern formed on both surfaces thereof, and a second prepreg layer having third copper foil 301 formed on both surfaces of a holland. Stacking (300), respectively, so that the third copper foil 301 formed on one surface of the second prepreg layer 300 is in contact with the first prepreg layer 200 and the predetermined circuit pattern, respectively on the holland Form.

Here, it is preferable that a 3rd copper foil is 1/3 oz (12 micrometers), and it is preferable that the 2nd prepreg layer 300 is 0.06 m / m.

10 is a cross-sectional view showing a ninth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention, and FIG. 11 is a sectional view showing a tenth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

10 and 11, through holes B penetrating the upper and lower surfaces are formed, and blind via holes C are formed in predetermined regions of the second prepreg layer 300 having upper and lower third copper foils, respectively. Form.

By forming such a through hole B, the non-conductor hole can be converted into a conductor hole so as to enable a signal between each layer and the circuit of each layer.

On the other hand, the blind via hole (C) is processed to a hole of BVH / copper direct 0.11m / m using a laser drill M / C.

Thereafter, a desmear process is further performed to remove residues or adhered substances of epoxy resin due to frictional heat during drilling, etc. with KMnO ₄ chemicals.

Next, FIG. 12 is a cross-sectional view showing an eleventh process of manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 12, an electroless copper plating layer 310 is formed on the inner surface of the through hole B and the inner surface of the blind via hole C and the third copper foil 301 formed on the other surface of the second prepreg layer 300. ), And the electrolytic copper plating layer 320 is formed on the electroless copper plating layer 310.

In this way, the drilled hole is plated with a chemical to form a nonconductive constituent layer or the like between each layer of the inner layer and the outer layer, thereby forming the nonconductor hole as the conductor hole.

The execution conditions are as follows.

The electroless copper plating layer 310 comprises 77 g / l copper sulfate, 145 g / l ethylenediaminetetraacetic acid (EDTA), 28 g / l formaldehyde (HCHO), and 39 g / l sodium hydroxide ( NaOH), 0.12 g / l polyethylene glycol (PEG), and 78 mg / l bipyridyl (Bipyridyl) was carried out for 35 minutes at a temperature of 38 ℃ to a thickness of 0.8 ㎛ ~ 1.3 ㎛ Form. Herein, the thickness of the coating is preferably 0.8 μm to 1.3 μm, which is an optimal condition for enhancing the adhesion of chemical plating.

In addition, the electrolytic copper plating layer 320 includes 178 g / l of Sulfuric Acid, 78 g / l of copper sulfate, 19 mg / l of additive, and 48 mg / l of a leveling agent ( A plating solution containing a leveling agent) and 52 mg / l Brightner was electroplated at 0.85 A / dm ² for 80 minutes at a temperature of 21 ° C. to form a thickness of 18 μm to 20 μm.

In the plating of the electro-copper plating layer 320, the present invention is carried out by a low current plating method. This is a means for increasing the uniform thickness distribution and plating adhesion of the plating thickness, and performs a low current plating method to prevent delamination defects, which is a feature of the present invention.

Next, Figure 13 is a cross-sectional view showing a twelfth process of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 13, hole plugging is performed with the plugging ink 330 in the through hole B. FIG.

Hole plugging is a method of filling a special plugging ink inside the hole.It connects signals between each layer and circuit, between circuits and each hole, and preserves the plating thickness in the hole. Hole plugging in B).

The hole plugging condition is as follows.

Referring to FIG. 14, an outermost layer imaging process is performed on the third copper foil 301, the electroless copper plating layer 310, and the electrolytic copper plating layer 320 to form a predetermined circuit pattern.

The outermost image process is performed as follows.

The photoresist PR was laminated on the third copper foil 301, the electroless copper plating layer 310 and the electrolytic copper plating layer 320, and roller temperatures of 95 ° C to 120 ° C (± 5 ° C) and 0.2 to 0.4 MPa. The lamination process (1) which laminates the dry film in which the circuit pattern of the predetermined shape was formed on the photoresist by the roller which has a roller pressure and a roller speed of 0.9-2.2m / min, and predetermined | prescribed to a photoresist An exposure step (2) of irradiating a dry film on which a circuit pattern of a predetermined shape is irradiated with light irradiated with a light quantity of 20 to 55 mJ / cm 2 by a 10 kW parallel light exposure machine so that a circuit pattern of a shape is formed; A development process in which 0.5% to 1.0% (VOL) of sodium carbonate developer, which is a temperature of 25 ° C to 30 ° C, is sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove photoresist in an area except for a circuit pattern having a predetermined shape. (3) and 150 g / l to 2 having a temperature of 48 ° C. to 52 ° C. and a specific gravity (20 ° C.) of 1.19 ± 0.02. 10 g / l copper metal etching solution is sprayed at a pressure of 1,5 kgf / cm ² (± 1.0) to form a third copper foil 301 and an electroless copper plating layer 310 in a region excluding a circuit pattern having a predetermined shape. And an etching process (4) in which the electrolytic copper plating layer 320 is removed, and a sodium hydroxide peeling solution of 2% to 4.0% (VOL) having a temperature of 45 ° C to 58 ° C, and a spray pressure of 0.14 MPa to 0.17 MPa. Each of the stripping processes 5 for removing the photoresist remaining on the circuit pattern having a predetermined shape by spraying on each other is performed to form a predetermined outermost layer circuit and a holland.

Next, AOI check is performed.

Then, in a conveyor moving at a speed of 1.3 m / min to 1.8 m / min, 90 ml / l of 95% sulfuric acid (H ₂ SO ₄ ), 58 ml / l of 35% hydrogen peroxide (H ₂ O ₂ ), and A micro semi etching solution containing ultra pure water (DI water) is used. The micro semi etching solution has a specific gravity of 1.031 to 1.041, a pH of 3.00 or less, a temperature of 28 ° C. (± 5 ° C.), and a thickness of 1.8 μm to 2.5 μm. A second micro semi etch process is performed under conditions having an etch rate.

Next, FIG. 15 is a cross-sectional view showing a fourteenth step of a method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 15, the outermost layer is printed with the solder resist ink 340 in regions other than the holland of the plugging ink 330 and the through hole B. FIG.

That is, each of the circuits and the holes where the circuits are formed after etching, and the epoxy exposed portion and the Cu surface exposed portion are coated with a non-conductive optical ink such as solder resist ink to block the generation of noise between the circuit and the circuit and to print the printed circuit. This is to prevent short during cream soldering or soldering work of components mounted on the board.

Due to the characteristics of the multilayered printed circuit board for Bluetooth according to the present invention, the diameter of the outer layer hole is 0.1m / m, the BGA ball printing area is narrow, the PAD to be mounted on the outside of the product is very close to the outer area, Since the distance between the circuit and the circuit is also adjacent, the coating thickness of the ink is very important.

By this, the working conditions must also be strictly controlled. Ink thickness during printing application should be 30 ~ 35㎛ the thickness on Cu surface and 35 ~ 40㎛ the ink thickness on epoxy.

Therefore, the process conditions for printing the outermost layer with the solder resist ink 340 are 110 with the ink viscosity of 150 ± 10 poise by mixing the main material of 270 ± 10 poise and the curing agent of 30 ± 10 poise, and having a specific gravity of 1.48 to 1.52. Printed silk screens of ˜120 mesh were repeated twice pre-curing at 78 ° C. for 15-20 minutes and second pre-curing at 78 ° C. for 15-20 minutes. After drying at 150 ° C. for 70 minutes to 75 minutes, the exposure was irradiated with an amount of light of 420 to 550 mJ / cm ² , and the temperature of 30 ° C. ± 1 ° C. of 1wt% The sodium carbonate developer is carried out by spraying at a spray pressure of 1.8 to 2.5 kgf / cm ² for 50 to 65 minutes.

On the other hand, after the process of printing the outermost layer with the solder resist ink 340, the main material of 200 ± 10 poise and the curing agent of 150 ± 10 poise is mixed to have an ink viscosity of 170 ± 10 poise, 110 ~ having a specific gravity of 1.5 ~ 1.6 Printed silk screens of 120 mesh were subjected to two rounds of first precuring at 78 ° C. for 15-20 minutes and second precuring at 78 ° C. for 15-20 minutes. , Post-curing at 150 ° C. for 65-75 minutes, exposure to light quantity of 650-820 mJ / cm ² , exposure to 1650% sodium carbonate at a temperature of 30 ° C. ± 1 ° C. The marking printing process is further performed by the developer being sprayed at a spray pressure of 1.8 to 2.5 kgf / cm ² for 20 minutes.

The use of the multi-layered printed circuit board for Bluetooth according to the present invention is frequently used in a mobile communication terminal such as a smartphone or a vehicle, which is a means of transportation, and is particularly sensitive to communication disturbances that may occur between each other during wireless communication. . Therefore, it is sensitive to transmission and reception capability and sound quality that best match each communication accessibility. Thereby, it is preferable to apply a hole land with marking ink to a specific hole or via hole in marking printing.

In addition, after the marking printing process, a reflow process is further performed for 4.3 minutes in a conveyor chamber at 260 ° C.

Removed components such as moisture that may be condensed in the inner layer structure of the printed circuit board according to the present invention, in particular, because the moisture content of the OXID layer can be high because the moisture content is completely removed to verify the reliability and durability verification By passing through a high temperature conveyor chamber at 260 ° C., a reflow process for eliminating the cause of product defects may be further performed.

During the reflow process, there should be no defects such as delamination, blister, and separation on the inside and outside of the product.

After the reflow process, the JET Scrubbing and Ultrasonic cleaning processes are further performed on the surfaces formed by the marking printing process, respectively, but the JET Scrubbing and Ultrasonic cleaning processes are 1.8 m / min to 2.3 m /. At conveyors moving at min speed, Acid Rinse containing 45 ml / l H ₂ SO ₄ (95%) and DI water (ultra pure water), and at conveyor speeds of 1.8 to 2.3 m / min. After JET Scrubbing (JET polishing) spraying aluminum oxide (Al ₂ O ₃ (# 360)) at a pressure of 1.6 kgf / cm ² to 2.3 kgf / cm ² and 5 hours of rinse at 1200 Watt × 4 zone / 4㎑ After washing with DI water (three-stage rinse), performing an Ultrasonic cleaning, and drying at 80 ° C to 95 ° C to remove foreign substances and form roughness on the surface formed by the marking printing process.

That is, in the JET Scrubbing and Ultrasonic cleaning processes, surface oxidation is severely formed during printing, marking, and reflow processes, and the residues of the ink and the residues contained in the ink material are Al. ₂ O ₃ is removed and artificial roughness (roughness) is formed on the exposed parts of the copper surface during the next nickel plating and gold plating process, thereby improving surface area and increasing acid wash (Acid Rinse). In addition to cleaning the exposed copper surface in parallel, the edges of the exposed circuits are smoothly rounded.

Next, Figure 16 is a cross-sectional view showing a fifteenth step of the method for manufacturing a multilayer printed circuit board for Bluetooth according to the present invention.

Referring to FIG. 16, the nickel plating layer 350 and the gold plating layer 360 are sequentially formed on the holland of the through hole B. FIG.

Here, the nickel plating layer 350, 45g / l Nickel Chloride, 100g / l cyclopropylamine phosphonic acid, 100g / l Nickel sulfate, 52g A nickel plating solution containing / l ascorbic acid, 52 g / l boric acid, and 0.12 g / l brightener at a temperature of 0.2 to 0.4 A / dm ² at a temperature of 50 ° C. Electroplating for 10-15 minutes with a thickness of 3㎛ ~ 4㎛,

In addition, the gold plating layer 360 is 16 g / l Potassium gold cyanide, 116 g / l Tripotassium citrate monohydrate, 63 g / l Citric anhydride, and 0.53 A soft gold plating solution containing g / l hexamethylene tetramine and 0.53 g / l 3-pyridine carboxylic acid was prepared at a temperature of 53 ° C. and 4.5 pH. It is electroplated for 9 to 12 minutes at a current density of 12 A / dm ² to form a thickness of 0.2 μm to 0.4 μm.

Due to the characteristics of the multilayered printed circuit board for Bluetooth according to the present invention, as a communication means of wireless communication, the limitation of current density and frequency and accessibility with frequency are very important. Since communication disturbance may be caused due to the generation of fine noise, the plating quality and thickness excellent in reliability and functionality can be obtained by adopting a high purity raw material without the impurity content of nickel plating and gold plating raw materials.

After that, the external machining (CNC router M / C) is performed.

At this time, the external processing according to the specification should be carried out, and the maximum allowable tolerance should be ± 0.5m / m, which is enough to be installed in the AL case after inserting and chip bonding due to the characteristics of Bluetooth.

Next, run the Auto bare boad test.

The auto bare boad test is a bare board test for electronic reliability verification of circuit boards and can detect open, short, and open states inside and outside the circuit. However, due to the characteristics of the Bluetooth PCB, bare board test pins are used for BGA ball and PAD points, and the cream marks should not flow down due to the pin marks on the side of the bonding site.

The execution conditions of this auto bare boad test are as follows.

-Test voltage = 250volt

Contimuity Resistance = 50Ω

-Isolation Resitance = 20MΩ

After that, Baking is performed.

Baking is a process that is close to the final stage of the present invention, and repeated verification in the high temperature and reflow process of 250 ℃ during the intermediate process of the product, but the presence of moisture moisture inside the product Very sensitive. Therefore, when there is a moisture content inside the product, delamination occurs, so that the final baking is carried out so that the moisture content inside the product becomes zero point, and the occurrence of twist of the product can be corrected. have.

The working conditions of this baking are as follows.

-Box oven

Baking temp = 130 ℃

-Time = 5 hours or more

Stacke = 25kit (25pcs)

-Calibration weight on top of kit = 100kg / ㎡

Finally, the external dimensions, inspection and release are carried out.

In other words, inspection and shipment other than the external dimensions according to the specification are performed.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

Claims

A first step (S100) of laminating the first copper plating layer 120 on the first copper foil 110 laminated on both surfaces of the epoxy layer 100,

A second step (S200) of forming a predetermined circuit pattern by performing an inner layer imaging process on the first copper foil 110 and the first copper plating layer 120;

The first prepreg layer 200 in which the second copper foil 201 is formed on both surfaces of the epoxy layer 100 having a predetermined circuit pattern formed on both surfaces and the predetermined circuit pattern is laminated, respectively, and the first prepreg A third step (S300) of forming the second copper foil 201 formed on one surface of the layer 200 to be in contact with the epoxy layer 100 and a predetermined circuit pattern, respectively;

A fourth step S400 of forming a through hole A penetrating the upper and lower surfaces;

An electroless copper plating layer 210 is formed on the second copper foil 201 formed on the inner surface of the through hole A and both surfaces of the first prepreg layer 200, and the electroless copper plating layer 210 is formed. The fifth step (S500) of forming an electrolytic copper plating layer 220 on the),

A sixth step (S600) of performing hole plugging with plugging ink 230 in the through hole A;

A seventh step S700 of forming a predetermined circuit pattern by performing an outer layer imaging process on the second copper foil 201, the electroless copper plating layer 210, and the electrolytic copper plating layer 220;

The first prepreg layer 200 and the predetermined circuit pattern on the upper and lower portions, each having a predetermined circuit pattern formed on both surfaces thereof, and the second prepreg layer 300 having the third copper foil 301 formed on both surfaces thereof, respectively, in Holland. A third copper foil 301 formed on one surface of the second prepreg layer 300 so as to be in contact with the first prepreg layer 200 and a predetermined circuit pattern on the holland. With eight steps (S800),

A ninth step S900 of forming a through hole B penetrating the upper and lower surfaces, and forming a blind via hole C in a predetermined region of the second prepreg layer 300 having the upper and lower third copper foils. Wow,

The electroless copper plating layer 310 is formed on the inner surface of the through hole B and the inner surface of the blind via hole C and the third copper foil 301 formed on the other surface of the second prepreg layer 300. A tenth step (S1000) of forming an electrolytic copper plating layer 320 on the electroless copper plating layer 310;

An eleventh step (S1100) of performing hole plugging with the plugging ink 330 in the through hole B;

A twelfth step (S1200) of forming a predetermined circuit pattern by performing an outermost image process on the third copper foil 301, the electroless copper plating layer 310, and the electrolytic copper plating layer 320;

A thirteenth step (S1300) of printing the outermost layer with the solder resist ink 340 in regions other than the holing ink 330 and the through hole B;

Method for manufacturing a multilayer printed circuit board for Bluetooth comprising a fourteenth step (S1400) to sequentially form a nickel plating layer 350 and a gold plating layer 360 on the hole of the through hole (B).
The method of claim 1,

The epoxy layer 100 is 0.2m / m (1oz) CCL (copper laminate) of CTE thermal expansion coefficient of 45ppm / ℃, glass transition temperature of TG 150 ℃, thermal decomposition temperature of TD 370 ℃, 1 / 3oz The manufacturing method of the multilayer printed circuit board for Bluetooth which includes the (12 micrometers) 1st copper foil 110 on both surfaces.
The method of claim 1,

The inner layer imaging process,

The photoresist PR was laminated on the first copper foil 110, and the roller temperature was 95 ° C to 120 ° C (± 5 ° C), the roller pressure was 0.2 to 0.4 MPa, and the roller speed was 0.9 to 1.2 m / min. A lamination step (A1) of laminating a dry film having a circuit pattern having a predetermined shape on the photoresist by a roller having a film; and parallel light of 8 되도록 so that a circuit pattern having a predetermined shape is formed on the photoresist. An exposure step (B1) of irradiating light irradiated with an amount of light of 20 to 55 mJ / cm 2 to the dry film on which a circuit pattern of a predetermined shape is formed, and 0.5% to 25 ° C to 30 ° C temperature. 1.0% (VOL) of sodium carbonate developer is sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove the photoresist in the region excluding the circuit pattern of a predetermined shape (Developing) process (C1), and 48 ℃ to 52 ℃ 150 g / l to 220 g / l copper metal with temperature and specific gravity (20 ° C) of 1.19 ± 0.02 r metal) An etching process (D1) in which etching liquid is injected at a pressure of 1,5 kgf / cm 2 (± 1.0) to remove the first copper foil 110 in a region excluding a circuit pattern having a predetermined shape, and 48 2% to 4.2% (VOL) of sodium hydroxide stripping solution, which is a temperature of ℃ to 58 ° C, is sprayed at a spray pressure of 0.14 MPa to 0.16 MPa to remove photoresist remaining on a circuit pattern of a predetermined shape. A method for manufacturing a multilayer printed circuit board for Bluetooth, which performs step (E1) to form a predetermined inner layer circuit and a hole, respectively.
The method of claim 1,

The electroless copper plating layer 210 includes 77 g / l copper sulfate, 145 g / l ethylenediaminetetraacetic acid (EDTA), 28 g / l formaldehyde (HCHO), and 39 g / l sodium hydroxide. (NaOH), 0.12 g / l polyethylene glycol (PEG) and 78 mg / l bipyridyl (Bipyridyl) was carried out for 35 minutes at a temperature of 38 ℃ with a plating solution containing a thickness of 0.8 ㎛ ~ 1.3 ㎛ Method for manufacturing a multilayer printed circuit board for Bluetooth formed by.
The method of claim 1,

The electrolytic copper plating layer 220 is 178 g / l of semi-sulfuric acid (Surfuric Acid), 78 g / l copper sulfate (copper sulfate), 19 mg / l additive (additive), 48 mg / l leveling agent (leveling) agent) and a plating solution containing 52 mg / l of Brightner are electroplated at 0.85 A / dm 2 for 80 minutes at a temperature of 21 ° C. to form a thickness of 18 μm to 20 μm. Method of manufacturing a multilayer printed circuit board for use.
The method of claim 1,

In the sixth step (S600),

The hole plugging is carried out at 40 CTE (coefficient of thermal expansion) and 150 ° C. for 55 minutes of curing time at 150 ° C. to 155 ° C. (box-oven). Method of manufacturing a multilayer printed circuit board for Bluetooth is carried out under the conditions of TG (glass transition temperature).
The method of claim 1,

The outer layer imaging process,

The photoresist PR is laminated on the electroless copper plating layer 210, the electrolytic copper plating layer 220, and the plugging ink 230, and a roller temperature of 95 ° C. to 120 ° C. (± 5 ° C.), and 0.2 to Lamination process (a1) of laminating | stacking the dry film in which the circuit pattern of a predetermined shape was formed on the said photoresist by the roller which has a roller pressure of 0.4 MPa and a roller speed of 0.9-2.2 m / min, and the said An exposure process of irradiating the dry film having a predetermined circuit pattern with light irradiated with a light amount of 20 to 55 mJ / cm 2 by a 10 평행 parallel light exposure machine to form a circuit pattern having a predetermined shape in the photoresist. (b1) and 0.5% to 1.0% (VOL) of sodium carbonate developer at a temperature of 25 ° C to 30 ° C are sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove photoresist in an area excluding a circuit pattern of a predetermined shape. Developing process (c1), and the temperature of 48 ℃ ~ 52 ℃, 150g / l to 210g / l copper metal etching solution having a specific gravity (20 ° C) of 1.19 ± 0.02 is injected at a pressure of 1,5kgf / cm 2 (± 1.0) to exclude a circuit pattern having a predetermined shape Etching process (d1) in which the electroless copper plating layer 210 and the electrolytic copper plating layer 220 are removed, and 2% to 4.0% (VOL) of sodium hydroxide stripping liquid having a temperature of 45 ° C to 58 ° C Multilayer printing for Bluetooth, which is sprayed at a spray pressure of 0.14 MPa to 0.17 MPa to perform a stripping process (e1) for removing photoresist remaining on a circuit pattern of a predetermined shape to form a predetermined outer layer circuit and a hole, respectively. Method of manufacturing a circuit board.
The method of claim 7, wherein

90 ml / l of 95% sulfuric acid (H 2 SO 4 ) and 58 ml / l of 35% hydrogen peroxide (H 2 O 2 ) on a conveyor moving at a speed of 1.3 m / min to 1.8 m / min after the outer layer imaging process And a micro semi-etching solution containing a predetermined amount of ultrapure water (DI water), wherein the micro semi-etching solution has a specific gravity of 1.031 to 1.041, a pH of 3.00 or less, a temperature of 28 ° C (± 5 ° C), and 1.8 A method of manufacturing a multilayered printed circuit board for Bluetooth, which performs a first micro semi etching process under conditions having an etching rate of μm to 2.5 μm.
The method of claim 1,

The electroless copper plating layer 310 includes 77 g / l copper sulfate, 145 g / l ethylenediaminetetraacetic acid (EDTA), 28 g / l formaldehyde (HCHO), and 39 g / l sodium hydroxide (NaOH), 0.12 g / l polyethylene glycol (PEG) and 78 mg / l bipyridyl (Bipyridyl) was carried out for 35 minutes at a temperature of 38 ℃ with a plating solution containing a thickness of 0.8 ㎛ ~ 1.3 ㎛ Method for manufacturing a multilayer printed circuit board for Bluetooth formed by.
The method of claim 1,

The electrolytic copper plating layer 320 is 178 g / l of semi-sulfuric acid (Surfuric Acid), 78 g / l copper sulfate (copper sulfate), 19 mg / l additive (additive), 48 mg / l leveling agent (leveling) agent) and a plating solution containing 52 mg / l of Brightner are electroplated at 0.85 A / dm 2 for 80 minutes at a temperature of 21 ° C. to form a thickness of 18 μm to 20 μm. Method of manufacturing a multilayer printed circuit board for use.
The method of claim 1,

In the eleventh step (S1100),

The hole plugging is carried out at 40 CTE (coefficient of thermal expansion) and 150 ° C. for 55 minutes of curing time at 150 ° C. to 155 ° C. (box-oven). Method of manufacturing a multilayer printed circuit board for Bluetooth is carried out under the conditions of TG (glass transition temperature).
The method of claim 1,

The outermost image process,

Photoresist PR is laminated on the third copper foil 301, the electroless copper plating layer 310, and the electrolytic copper plating layer 320, and a roller temperature of 95 ° C. to 120 ° C. (± 5 ° C.), and 0.2 A lamination step (1) of laminating a dry film having a circuit pattern having a predetermined shape on the photoresist by a roller having a roller pressure of ˜0.4 MPa and a roller speed of 0.9 to 2.2 m / min, Exposure to irradiate the dry film on which the circuit pattern of a predetermined shape is irradiated with a light amount of 20 to 55 mJ / cm 2 by a 10 평행 parallel light exposure machine to form a circuit pattern of a predetermined shape to the photoresist. Process (2) and 0.5% to 1.0% (VOL) of sodium carbonate developer at a temperature of 25 ° C to 30 ° C are sprayed at a spray pressure of 0.10 MPa to 0.18 MPa to remove photoresist in the region excluding a circuit pattern of a predetermined shape. Developing process (3), temperature of 48 ° C to 52 ° C, 1.19 ± 150 g / l to 210 g / l copper metal etching solution having a specific gravity (20 ° C.) of 0.02 was sprayed at a pressure of 1,5 kgf / cm 2 (± 1.0) to remove the specific area of the circuit pattern. 3 The etching process (4) in which the copper foil 301, the electroless copper plating layer 310 and the electrolytic copper plating layer 320 are removed, and 2% to 4.0% (VOL) which is a temperature of 45 ° C to 58 ° C Sodium hydroxide stripping liquid is sprayed at a spray pressure of 0.14 MPa to 0.17 MPa to perform a stripping process (5) for removing photoresist remaining on a circuit pattern of a predetermined shape, respectively, to provide a predetermined outermost layer circuit and a holland. Method for manufacturing a multilayer printed circuit board for Bluetooth to be formed.
The method of claim 12,

90 ml / l of 95% sulfuric acid (H 2 SO 4 ) and 58 ml / l of 35% hydrogen peroxide (H 2 O) on a conveyor moving at a speed of 1.3 m / min to 1.8 m / min after the outermost layer imaging process 2 ) and a micro semi-etching solution containing a predetermined amount of ultra pure water (DI water), wherein the micro semi-etching solution has a specific gravity of 1.031 to 1.041, a pH of 3.00 or less, a temperature of 28 ° C. (± 5 ° C.), A method for manufacturing a multilayer printed circuit board for Bluetooth, which performs the second micro semi-etch process under conditions having an etching rate of 1.8 µm to 2.5 µm.
The method of claim 1,

Process conditions for printing the outermost layer with the solder resist ink,

270 ± 10 poise motifs and 30 ± 10 poise hardeners were mixed to produce a 110 to 120 mesh printed silk screen with an ink viscosity of 150 ± 10 poises and a specific gravity of 1.48 to 1.52 for 15 to 20 minutes at 78 ° C. First pre-curing and two second pre-curings at 78 ° C. for 15-20 minutes, post-curing at 150 ° C. for 70-75 minutes Exposure to irradiated with a light amount of 420 to 550 mJ / cm 2 , and 1 wt% sodium carbonate developer at a temperature of 30 ° C. ± 1 ° C., spray pressure of 1.8 to 2.5 kgf / cm 2 for 50 to 65 minutes. Method of manufacturing a multilayer printed circuit board for Bluetooth performed by the phenomenon of spraying.
The method of claim 14,

After the process of printing the outermost layer with the solder resist ink,

A 200 ± 10 poise motif and a 150 ± 10 poise curing agent were mixed to produce an ink viscosity of 170 ± 10 poise and 110 to 120 mesh printed silk screen with a specific gravity of 1.5 to 1.6 for 15 to 20 minutes at 78 ° C. 1st pre-curing and 2 times of pre-curing at 78 ° C for 15-20 minutes, post-curing at 150 ° C for 65-75 minutes Exposure to irradiate at a light quantity of 650 to 820 mJ / cm 2 , and 1 wt% sodium carbonate developer at a temperature of 30 ° C. ± 1 ° C., sprayed at a spray pressure of 1.8 to 2.5 kgf / cm 2 for 20 minutes. The manufacturing method of a multilayer printed circuit board for Bluetooth further comprising a marking printing process performed by the phenomenon.
The method of claim 15,

After the marking printing process,

A method for manufacturing a multilayer printed circuit board for Bluetooth further comprising a reflow process for 4.3 minutes in a conveyor chamber at 260 ° C.
The method of claim 16,

After the reflow process, the JET Scrubbing and Ultrasonic cleaning processes are further performed on the surface formed by the marking printing process, respectively.

The JET Scrubbing and Ultrasonic cleaning process includes a pickling solution containing 45 ml / l H 2 SO 4 (95%) and DI water (ultra pure water) in a conveyor moving at a speed of 1.8 m / min to 2.3 m / min. (Acid Rinse) and, 1.8 ~ jET for spraying 2.3m / min at a conveyor speed of 1.6㎏f / ㎝ 2 ~ aluminum oxide at a pressure of 2.3㎏f / ㎝ 2 (Al 2 O 3 (# 360)) Scrubbing ( Formed by the marking printing process by washing with DI water (three stages rinse), performing ultrasonic cleaning and drying at 80 ° C. to 95 ° C. after 5 steps of rinse at JW polishing) and 1200Watt × 4zone / 4㎑. Method of manufacturing a multilayer printed circuit board for Bluetooth to remove foreign substances on the surface and form roughness.
The method of claim 1,

The nickel plating layer 350 and the gold plating layer 360,

45 g / l Nickel Chloride, 100 g / l cyclotrimethylamine phosphonic acid, 100 g / l Nickel sulfate, 52 g / l Ascorbic acid ), A nickel plating solution containing 52 g / l of boric acid and 0.12 g / l of a brightener, electroplated for 10 to 15 minutes at a current density of 0.2 to 0.4 A / dm 2 at a temperature of 50 ° C. To form a nickel plated layer with a thickness of 3 μm to 4 μm,

16 g / l potassium gold cyanide, 116 g / l tripotassium citrate monohydrate, 63 g / l citric anhydride, and 0.53 g / l hexamethylenetetramine A soft gold plating solution containing hexamethylene tetramine and 0.53 g / l 3-pyridine carboxylic acid was used at a temperature of 53 ° C. and a current density of 12 A / dm 2 at 4.5 pH. Method of manufacturing a multilayer printed circuit board for Bluetooth to form a gold plated layer with a thickness of 0.2 ㎛ ~ 0.4 ㎛ by electroplating for minutes to 12 minutes.