WO2017012251A1 - 一种环境传感器 - Google Patents

一种环境传感器 Download PDF

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Publication number
WO2017012251A1
WO2017012251A1 PCT/CN2015/096921 CN2015096921W WO2017012251A1 WO 2017012251 A1 WO2017012251 A1 WO 2017012251A1 CN 2015096921 W CN2015096921 W CN 2015096921W WO 2017012251 A1 WO2017012251 A1 WO 2017012251A1
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Prior art keywords
chip
asic
circuit board
sensor
asic chip
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English (en)
French (fr)
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张俊德
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Goertek Inc
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Goertek Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to the field of measurement, and more particularly to a sensor, and more particularly to an environmental sensor.
  • Environmental sensors use the relevant physical effects of sensitive materials, such as piezoresistive effect, piezoelectric effect, etc. After the sensitive material is affected by environmental variables, its resistance or capacitance changes, and the measurement circuit can obtain proportional to environmental variables.
  • the electrical signal, environmental sensors are now widely used in the measurement and control of air pressure, altitude, temperature and humidity, gas and other fields.
  • the existing environmental sensor includes a package structure surrounded by a circuit board and a casing, and a sensor chip and an ASIC chip located in the package structure, wherein the sensor chip and the ASIC chip are fixed on the circuit board, the sensor chip and the ASIC chip. Between the ASIC chip and the circuit board, the ASIC chip and the circuit board are electrically connected together through a gold wire. Such a connection method not only increases the manufacturing process, but also contributes to the miniaturization of the environmental sensor.
  • an environmental sensor includes an external package and an ASIC chip, a sensor chip located inside the external package, the external package including a circuit board; wherein the ASIC chip is soldered by a solder ball On the circuit board, and the output end of the ASIC chip is electrically connected to the ASIC output terminal wire disposed on the circuit board; the sensor chip is soldered to the upper end of the ASIC chip by a solder ball, wherein the output end of the sensor chip With ASIC core
  • the input terminals of the chip are electrically connected together; the external package is also provided with a channel for exposing the sensor chip to an external environment.
  • the ASIC chip is mounted upside down, and the output end thereof is directly soldered to the ASIC output terminal wire disposed on the circuit board by a solder ball; and the first metallized through hole is further disposed inside the ASIC chip, A lower end of a metallized via is connected to an input end of the ASIC chip; an output end of the sensor chip is electrically connected to an upper end of the first metallized via.
  • the sensor chip is mounted upside down, and the output end thereof is directly soldered to the upper end of the first metallized through hole by a solder ball.
  • the sensor chip is internally provided with a second metallized through hole, the upper end of the second metallized through hole is connected to the output end of the sensor chip, and the lower end of the second metallized through hole on the sensor chip is used as a soldering position. And soldered directly to the upper end of the first metallized via on the ASIC chip by a solder ball.
  • the ASIC output terminal leads from the upper end surface of the circuit board to the lower end surface of the circuit board, and a pad is formed on the lower end surface of the circuit board.
  • the outer package further includes a housing disposed on the circuit board, the housing and the circuit board enclosing an outer package having a cavity.
  • the channel is a via hole formed on the housing to communicate the inner cavity with the outside.
  • the channel is a via hole formed on the circuit board to communicate the inner cavity with the outside.
  • the outer package comprises an injection molded body that is injection molded on a circuit board and wraps the ASIC chip and the sensor chip.
  • the channel is a notch formed on the molded body to expose a sensitive portion of the sensor chip to the outside.
  • the ASIC chip is soldered on the circuit board by means of a solder ball, and the output end of the ASIC chip is electrically connected to the ASIC output terminal wire; the sensor chip is soldered to the upper end of the ASIC chip by means of a solder ball, and The output of the sensor chip is electrically connected to the input of the ASIC.
  • the sensor chip and the ASIC chip are distributed in the vertical direction of the external package, which reduces the size of the entire environmental sensor in the lateral direction, thereby saving the space of the external package, so that the product can be made smaller to meet the small size of modern electronic products. Development; simplify the connection between the sensor chip and the ASIC chip, making it simple in manufacturing process, high in process efficiency, and low in production cost.
  • FIG. 1 is a schematic structural view of an environmental sensor of the present invention.
  • FIG. 2 is a schematic structural view of a second embodiment of the environmental sensor of the present invention.
  • FIG 3 is a schematic structural view of a third embodiment of the environmental sensor of the present invention.
  • the present invention provides an environmental sensor, which may be a pressure sensor, a temperature sensor, a humidity sensor, or the like for detecting a surrounding environment, including an external package and an ASIC chip 3, a sensor located inside the external package.
  • Chip 4 The external package includes a circuit board 1 , and the external package is further provided with a channel for exposing the sensor chip 4 to the external environment, so that the sensor chip 4 in the environmental sensor can change according to the external environment. The corresponding electrical signal is output.
  • the outer package comprises a housing 2 disposed on the circuit board 1, the housing 2 and the circuit board 1 enclosing an outer package having a cavity.
  • the housing 2 may also be in the form of a flat plate.
  • a separate side wall portion is also required to support the housing 2 on the circuit board 1 to jointly form an external package of the environmental sensor.
  • the above-mentioned channel may be a via hole 8 formed on the housing 2 or the circuit board 1 for connecting the inner cavity to the outside, with reference to FIGS. 1 and 2 .
  • the outer package comprises an injection molded body 11 which is injection molded on the circuit board 1 and encloses the ASIC chip 3 and the sensor chip 4, with reference to FIG.
  • the injection molded body 11 of resin or other material is potted on the circuit board 1, and the ASIC chip 3 and the sensor chip 4 are wrapped on the circuit board 1 through the molded body 11 to form External packaging for environmental sensors.
  • the channel is a notch 12 formed on the molded body 11, through which the sensitive portion on the sensor chip 4 can be exposed to the external environment, so that the sensor chip 4 can be outputted according to changes in the external environment. Corresponding electrical signals.
  • the ASIC chip 3 is soldered to the circuit board 1 by a solder ball 5, and the output end of the ASIC chip 3 is electrically connected to the ASIC output terminal 7 on the circuit board 1; the sensor chip 4 soldered to the upper end of the ASIC chip 3 by a solder ball 5, wherein the output of the sensor chip 4 is electrically connected to the input end of the ASIC chip 3.
  • the ASIC chip 3 is mounted in an inverted manner such that the input end and the output end of the ASIC chip 3 face the surface to be soldered of the circuit board 1, and the solder ball 5 is used.
  • the output of the ASIC chip 3 is soldered directly to the ASIC output terminal 7 of the circuit board 1.
  • a first metallized via hole 6 is disposed inside the ASIC chip 3, and the lower end of the first metallized via hole 6 is connected to the ASIC chip 3.
  • the electrical connection between the sensor chip 4 and the ASIC chip 3 can be in the form of a conventional gold wire.
  • the sensor chip 4 can also be mounted in an inverted manner. That is, the output end of the sensor chip 4 is directed toward the upper end surface of the ASIC chip 3, and the output end of the sensor chip 4 is directly soldered to the upper end of the first metallized through hole 6 by means of the solder ball 5
  • the electrical connection between the sensor chip 4 and the ASIC chip 3 is achieved, with reference to FIG.
  • a second metallized through hole 10 is disposed inside the sensor chip 4, and an upper end of the second metallized through hole 10 is connected to an output end of the sensor chip 4, and a lower end of the second metallized through hole 10 is further disposed. It is exposed on the lower end surface of the sensor chip 4 so that the lower end of the second metallized through hole 10 can serve as a soldering position. In this way, the sensor chip 4 is no longer required to be inverted, and the lower end position of the second metallized via 10 can be directly soldered to the upper end of the first metallized via 6 on the ASIC chip 3 by means of the solder ball 5. , refer to Figure 2, Figure 3.
  • a third metallized via hole (not shown) may be disposed inside the ASIC chip 3, and the upper end of the third metallized via hole is connected to the ASIC chip 3.
  • the lower end of the third metallized via is exposed on the lower end surface of the ASIC chip 3, in such a manner that the ASIC chip 3 is no longer required to be inverted, and the third metallized via hole can be passed through the solder ball 5.
  • the lower end is soldered directly to the ASIC output terminal 7 of the circuit board 1.
  • the input end of the ASIC chip 3 faces upward, thereby facilitating the connection with the sensor chip 4, and the output end of the sensor chip 4 can be directly soldered to the ASIC by means of the solder ball 5.
  • the solder ball 5 On the input of chip 3.
  • the ASIC chip is soldered on the circuit board by means of a solder ball, and the output end of the ASIC chip is electrically connected to the ASIC output terminal wire; the sensor chip is soldered to the upper end of the ASIC chip by means of a solder ball, and The output of the sensor chip is electrically connected to the input of the ASIC.
  • the sensor chip and the ASIC chip are distributed in the vertical direction of the external package, which reduces the size of the entire environmental sensor in the lateral direction, thereby saving the space of the external package, so that the product can be made smaller to meet the small size of modern electronic products. Development.
  • the connection mode between the sensor chip and the ASIC chip is simplified, the manufacturing process is simple, the process efficiency is high, and the production cost is low.
  • the ASIC output terminal 7 can penetrate both sides of the circuit board 1, that is, the ASIC output terminal 7 extends from the upper end surface of the circuit board 1 to the lower end surface of the circuit board 1, and is in the circuit.
  • the lower end surface of the board 1 forms a pad 9 through which the connection of the environmental sensor to the external user terminal can be achieved.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种环境传感器，包括外部封装以及位于外部封装内部的ASIC芯片（3）、传感器芯片（4），外部封装包括电路板（1）；ASIC芯片（3）通过植锡球（5）焊接在电路板（1）上，且ASIC芯片（3）的输出端与设置在电路板（1）上的ASIC输出端导线（7）电连接；传感器芯片（4）通过植锡球（5）焊接在ASIC芯片（3）的上端，其中，传感器芯片（4）的输出端与ASIC芯片（3）的输入端电连接在一起；外部封装上还设置有将传感器芯片（4）暴露在外界环境中的通道。通过将传感器芯片（4）、ASIC芯片（3）分布在外部封装的竖直方向上，节省了外部封装空间，使产品小型化。

Description

一种环境传感器 技术领域
本发明涉及测量领域，更具体地，涉及一种传感器，尤其涉及一种环境传感器。
背景技术
环境传感器利用的是敏感材料的相关物理效应,如压阻效应、压电效应等，敏感材料在受到环境变量的作用后，其电阻或者电容发生变化，通过测量电路就可以得到正比于环境变量变化的电信号，环境传感器现已广泛应用于气压、高度、温湿度、气体等领域的测量和控制中。
近年来，随着科学技术的发展，手机、笔记本电脑等电子产品的体积在不断减小，而且人们对这些便携电子产品的性能要求也越来越高，这就要求与之配套的电子零部件的体积也必须随着减小。
现有的环境传感器，包括由电路板、外壳围成的封装结构，以及位于该封装结构中的传感器芯片、ASIC芯片，其中，传感器芯片和ASIC芯片均固定在电路板上，传感器芯片和ASIC芯片之间通过金线电连接，ASIC芯片与电路板之间通过金线电连接在一起。这样的连接方式，不但增加了制作工序，而且也不利于环境传感器的小型化发展。
发明内容
本发明的一个目的是提供一种环境传感器。
根据本发明的一个方面，提供一种环境传感器，包括外部封装以及位于所述外部封装内部的ASIC芯片、传感器芯片，所述外部封装包括电路板；其中，所述ASIC芯片通过植锡球焊接在电路板上，且ASIC芯片的输出端与设置在电路板上的ASIC输出端导线电连接；所述传感器芯片通过植锡球焊接在所述ASIC芯片的上端，其中，所述传感器芯片的输出端与ASIC芯 片的输入端电连接在一起；所述外部封装上还设置有将传感器芯片暴露在外界环境中的通道。
优选地，所述ASIC芯片倒置安装，其输出端通过植锡球直接焊接在电路板上设置的ASIC输出端导线上；在所述ASIC芯片内部还设置有第一金属化通孔，所述第一金属化通孔的下端连接ASIC芯片的输入端；所述传感器芯片的输出端与第一金属化通孔的上端电连接在一起。
优选地，所述传感器芯片倒置安装，其输出端通过植锡球直接焊接在第一金属化通孔的上端。
优选地，所述传感器芯片内部设置有第二金属化通孔，所述第二金属化通孔的上端连接传感器芯片的输出端，所述传感器芯片上第二金属化通孔的下端作为焊接位置，并通过植锡球直接焊接在ASIC芯片上第一金属化通孔的上端。
优选地，所述ASIC输出端导线从电路板的上端面延伸至电路板的下端面，并在电路板的下端面形成焊盘。
优选地，所述外部封装还包括设置在电路板上的壳体，所述壳体与电路板围成了一具有内腔的外部封装。
优选地，所述通道为形成在壳体上连通内腔与外界的导通孔。
优选地，所述通道为形成在电路板上连通内腔与外界的导通孔。
优选地，所述外部封装包括注塑在电路板上并包裹所述ASIC芯片、传感器芯片的注塑体。
优选地，所述通道为形成在注塑体上将传感器芯片的敏感部位暴露在外界的缺口。
本发明的环境传感器，ASIC芯片通过植锡球的方式焊接在电路板上，且，ASIC芯片的输出端电连接ASIC输出端导线；传感器芯片通过植锡球的方式焊接在ASIC芯片的上端，且传感器芯片的输出端电连接ASIC的输入端。传感器芯片、ASIC芯片分布在外部封装的竖直方向上，降低了整个环境传感器的在横向上的尺寸，从而可以节省外部封装的空间，使得产品可以做的更小，以满足现代电子产品的小型化发展；简化了传感器芯片与ASIC芯片之间的连接方式，使其制造工艺简单，制程效率高，生产成本低。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是本发明环境传感器的结构示意图。
图2是本发明环境传感器第二实施例的结构示意图。
图3是本发明环境传感器第三实施例的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1，本发明提供了一种环境传感器，其可以是压力传感器、温度传感器、湿度传感器等用于检测周围环境的传感器，其包括外部封装以及位于所述外部封装内部的ASIC芯片3、传感器芯片4。其中，外部封装包括电路板1，所述外部封装上还设置有将传感器芯片4暴露在外界环境中的通道，以使环境传感器中的传感器芯片4可以随着外界环境的变化而 输出相应的电信号。
在本发明一个具体的实施例中，所述外部封装包括设置在电路板1上的壳体2，所述壳体2与电路板1围成了一具有内腔的外部封装。其中所述壳体2也可以呈平板状，此时，还需要设置一独立的侧壁部将壳体2支撑在电路板1上，以共同形成环境传感器的外部封装。其中，上述的通道可以为形成在壳体2或电路板1上用于连通内腔与外界的导通孔8，参考图1、图2。
在本发明另一具体的实施例中，所述外部封装包括注塑在电路板1上并包裹所述ASIC芯片3、传感器芯片4的注塑体11，参考图3。将ASIC芯片3、传感器芯片4固定好之后，在电路板1上灌封树脂或其它材料的注塑体11，通过该注塑体11将ASIC芯片3、传感器芯片4包裹在电路板1上，以形成环境传感器的外部封装。此时，所述通道为形成在注塑体11上的缺口12，通过该缺口12可以将传感器芯片4上的敏感部位暴露在外界的环境中，以便传感器芯片4可以随着外界环境的变化而输出相应的电信号。
本发明的环境传感器，所述ASIC芯片3通过植锡球5焊接在电路板1上，且ASIC芯片3的输出端与电路板1上的ASIC输出端导线7电连接在一起；所述传感器芯片4通过植锡球5焊接在所述ASIC芯片3的上端，其中，所述传感器芯片4的输出端与ASIC芯片3的输入端电连接在一起。
在本发明一个具体的实施方式中，所述ASIC芯片3以倒置的方式安装，以使ASIC芯片3上的输入端、输出端朝向电路板1的待焊接面，通过植锡球5的方式将ASIC芯片3的输出端直接焊接在电路板1的ASIC输出端导线7上。此时，由于ASIC芯片3的输入端也朝向电路板1，所以，在所述ASIC芯片3内部还设置有第一金属化通孔6，该第一金属化通孔6的下端连接ASIC芯片3的输入端，其上端暴露在ASIC芯片3的上端面；所述传感器芯片4的输出端与第一金属化通孔6的上端电连接在一起，从而实现了传感器芯片4与ASIC芯片3之间的电连接，参考图1。
传感器芯片4与ASIC芯片3之间的电连接可以采用传统的金线方式，在本发明一个优选的实施方式中，传感器芯片4也可以采用倒置安装的方 式，也就是说，使传感器芯片4上的输出端朝向ASIC芯片3的上端面，通过植锡球5的方式将传感器芯片4的输出端直接焊接在第一金属化通孔6的上端，以实现传感器芯片4与ASIC芯片3之间的电连接，参考图1。
进一步优选的是，在所述传感器芯片4内部设置有第二金属化通孔10，所述第二金属化通孔10的上端连接传感器芯片4的输出端，第二金属化通孔10的下端暴露在传感器芯片4的下端面上，以使第二金属化通孔10的下端可作为焊接位置。采用这种方式，使得不再需要将传感器芯片4倒置，可通过植锡球5的方式将第二金属化通孔10的下端位置直接焊接在ASIC芯片3上第一金属化通孔6的上端，参考图2、图3。
在本发明另一具体的实施方式中，基于同样的道理，可在ASIC芯片3的内部设置第三金属化通孔(视图未给出)，该第三金属化通孔的上端连接ASIC芯片3的输出端，第三金属化通孔的下端暴露在ASIC芯片3的下端面，采用这种方式，使得不再需要将ASIC芯片3倒置，可通过植锡球5将第三金属化通孔的下端直接焊接在电路板1的ASIC输出端导线7上。由于ASIC芯片3不需要倒置，此时，ASIC芯片3的输入端朝上，从而方便了其与传感器芯片4的连接，可以将传感器芯片4的输出端通过植锡球5的方式直接焊接在ASIC芯片3的输入端上。
本发明的环境传感器，ASIC芯片通过植锡球的方式焊接在电路板上，且，ASIC芯片的输出端电连接ASIC输出端导线；传感器芯片通过植锡球的方式焊接在ASIC芯片的上端，且传感器芯片的输出端电连接ASIC的输入端。传感器芯片、ASIC芯片分布在外部封装的竖直方向上，降低了整个环境传感器的在横向上的尺寸，从而可以节省外部封装的空间，使得产品可以做的更小，以满足现代电子产品的小型化发展。同时也简化了传感器芯片与ASIC芯片之间的连接方式，使其制造工艺简单，制程效率高，生产成本低。
本发明的环境传感器，所述ASIC输出端导线7可以贯穿电路板1的两侧，也就是说，ASIC输出端导线7从电路板1的上端面延伸至电路板1的下端面，并在电路板1的下端面形成焊盘9，通过该焊盘9可实现环境传感器与外部用户终端的连接。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种环境传感器，其特征在于：包括外部封装以及位于所述外部封装内部的ASIC芯片(3)、传感器芯片(4)，所述外部封装包括电路板(1)；其中，所述ASIC芯片(3)通过植锡球(5)焊接在电路板(1)上，且ASIC芯片(3)的输出端与设置在电路板(1)上的ASIC输出端导线(7)电连接；所述传感器芯片(4)通过植锡球(5)焊接在所述ASIC芯片(3)的上端，其中，所述传感器芯片(4)的输出端与ASIC芯片(3)的输入端电连接在一起；所述外部封装上还设置有将传感器芯片(4)暴露在外界环境中的通道。
  2. 根据权利要求1所述的环境传感器，其特征在于：所述ASIC芯片(3)倒置安装，其输出端通过植锡球(5)直接焊接在电路板(1)上设置的ASIC输出端导线(7)上；在所述ASIC芯片(3)内部还设置有第一金属化通孔(6)，所述第一金属化通孔(6)的下端连接ASIC芯片(3)的输入端；所述传感器芯片(4)的输出端与第一金属化通孔(6)的上端电连接在一起。
  3. 根据权利要求2所述的环境传感器，其特征在于：所述传感器芯片(4)倒置安装，其输出端通过植锡球(5)直接焊接在第一金属化通孔(6)的上端。
  4. 根据权利要求2所述的环境传感器，其特征在于：所述传感器芯片(4)内部设置有第二金属化通孔(10)，所述第二金属化通孔(10)的上端连接传感器芯片(4)的输出端，所述传感器芯片(4)上第二金属化通孔(10)的下端作为焊接位置，并通过植锡球(5)直接焊接在ASIC芯片(3)上第一金属化通孔(6)的上端。
  5. 根据权利要求1所述的环境传感器，其特征在于：所述ASIC输出端导线(7)从电路板(1)的上端面延伸至电路板(1)的下端面，并在电路板(1)的下端面形成焊盘(9)。
  6. 根据权利要求1所述的环境传感器，其特征在于：所述外部封装还包括设置在电路板(1)上的壳体(2)，所述壳体(2)与电路板(1) 围成了一具有内腔的所述外部封装。
  7. 根据权利要求6所述的环境传感器，其特征在于：所述通道为形成在壳体(2)上连通内腔与外界的导通孔(8)。
  8. 根据权利要求6所述的环境传感器，其特征在于：所述通道为形成在电路板(1)上连通内腔与外界的导通孔(8)。
  9. 根据权利要求1所述的环境传感器，其特征在于：所述外部封装还包括注塑在电路板(1)上并包裹所述ASIC芯片(3)、传感器芯片(4)的注塑体(11)。
  10. 根据权利要求9所述的环境传感器，其特征在于：所述通道为形成在注塑体(11)上将传感器芯片(4)的敏感部位暴露在外界的缺口(12)。
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