WO2017002398A1 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

Info

Publication number
WO2017002398A1
WO2017002398A1 PCT/JP2016/057179 JP2016057179W WO2017002398A1 WO 2017002398 A1 WO2017002398 A1 WO 2017002398A1 JP 2016057179 W JP2016057179 W JP 2016057179W WO 2017002398 A1 WO2017002398 A1 WO 2017002398A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
heat sink
conversion device
power conversion
semiconductor switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/057179
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真吾 長岡
大西　浩之
西川　武男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to CN201680022360.9A priority Critical patent/CN107534388A/zh
Priority to EP16817508.1A priority patent/EP3276806A4/en
Publication of WO2017002398A1 publication Critical patent/WO2017002398A1/ja
Priority to US15/784,326 priority patent/US10361628B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/12—Arrangements for reducing harmonics from AC input or output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
    • H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
    • H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
    • H02M3/325—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/33569—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
    • H02M3/33576—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
    • H02M3/33592—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer having a synchronous rectifier circuit or a synchronous freewheeling circuit at the secondary side of an isolation transformer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M5/00—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/02—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC
    • H02M5/04—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters
    • H02M5/22—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M5/275—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M5/293—Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
    • H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
    • H02M7/12—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/21—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/217—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0003—Details of control, feedback or regulation circuits
    • H02M1/0006—Arrangements for supplying an adequate voltage to the control circuit of converters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/12—Arrangements for reducing harmonics from AC input or output
    • H02M1/123—Suppression of common mode voltage or current
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
    • H02M1/4208—Arrangements for improving power factor of AC input
    • H02M1/4258—Arrangements for improving power factor of AC input using a single converter stage both for correction of AC input power factor and generation of a regulated and galvanically isolated DC output voltage
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/483—Converters with outputs that each can have more than two voltages levels
    • H02M7/4835—Converters with outputs that each can have more than two voltages levels comprising two or more cells, each including a switchable capacitor, the capacitors having a nominal charge voltage which corresponds to a given fraction of the input voltage, and the capacitors being selectively connected in series to determine the instantaneous output voltage

Definitions

  • the present invention relates to a power conversion device including a switching element disposed on a line connecting an input side and an output side, and a radiator connected to a predetermined potential.
  • FIG. 1 is a schematic side view schematically showing the external appearance of a semiconductor switch and a heat sink attached to a power switch.
  • FIG. 1 shows a semiconductor switch SW provided in the power conversion device.
  • the semiconductor switch SW is fixed on the substrate B with a heat sink HS attached thereto.
  • the heat sink HS has a function of cooling by releasing the heat generated in the semiconductor switch SW to the outside.
  • FIG. 2 is an explanatory diagram schematically showing a heat sink in a circuit diagram relating to a semiconductor switch provided in the power conversion device.
  • FIG. 2 shows a circuit relating to a power conversion device in which a semiconductor switch SW for short-circuiting a pair of lines connecting the input side and the output side is shown, and a heat sink HS is shown on the right side of the semiconductor switch SW.
  • the heat sink HS is connected to the FG.
  • a parasitic capacitance Chp is generated between the semiconductor switch SW and the heat sink HS. Due to the generated parasitic capacitance Chp, the voltage fluctuation at the point P1 connected to the positive electrode of the semiconductor switch SW is transmitted to the FG, and the common mode current Icm flows as noise.
  • FIG. 3 is a graph showing a voltage change at the point P1 in the power conversion device.
  • FIG. 3 shows time-dependent changes in the voltage V1 at the point P1, with time on the horizontal axis and the voltage at the point P1 on the vertical axis. Since the change with time of the voltage V1 at the point P1 shown in FIG. 3 is transmitted to the FG via the parasitic capacitance Chp, it is output as noise to the input side of the power converter.
  • Icm Chp ⁇ dV / dt Formula (A) Where Icm: common mode current Chp: parasitic capacitance between the semiconductor switch SW and the heat sink HS V: voltage at the point P1 (V1) t: time
  • the parasitic capacitance Chp can be expressed by the following formula (B).
  • Chp ⁇ ⁇ S / dhp (B) Where ⁇ : dielectric constant between the semiconductor switch SW and the heat sink HS dhp: distance between the semiconductor switch SW and the heat sink HS S: electrode area
  • Patent Document 2 proposes a method in which a heat sink itself is connected to a stable potential and a current causing noise is confined in the circuit.
  • Patent Document 1 has a problem that the semiconductor switch cannot be sufficiently cooled due to the thermal resistance of the insulating material sandwiched between the semiconductor switch and the heat sink. Moreover, since the ceramic used as an insulating material is expensive, the problem that the cost of a power converter rises arises.
  • an object of the present invention is to provide a power conversion device capable of reducing noise without causing the problems described in Patent Document 1 and Patent Document 2.
  • a power conversion device includes a switching element arranged to short-circuit a pair of lines connecting an input side and an output side, and a radiator connected to a predetermined potential.
  • a power conversion device comprising: a conductor disposed between the switching element and the radiator; an insulator disposed between the conductor and the switching element; and between the conductor and the radiator. The conductor is electrically connected to one of the pair of lines.
  • the power conversion device is a power conversion device including a switching element arranged to short-circuit a pair of lines connecting the input side and the output side, and a radiator connected to a predetermined potential, A conductor disposed between the switching element and the radiator; and an insulator covering the conductor; and the conductor is electrically connected to one of the pair of lines. It is characterized by that.
  • the conductor and the insulator are in a thin film shape, the surface of the insulator facing the switching element is attached to the switching element, and the insulator facing the radiator The surface is attached to the radiator.
  • the power conversion device is characterized in that one line to which the conductor is connected is connected to a stable potential.
  • the power converter is characterized in that the predetermined potential connected to the radiator is a ground potential.
  • the power converter according to the present invention can confine noise caused by parasitic capacitance in the circuit.
  • a conductor is disposed between the switching element and the heat sink, an insulator is disposed between the conductor and the switching element, and between the conductor and the radiator, and the conductor is connected to the line.
  • FIG. 4 is a schematic side view schematically showing an example of the appearance of the power conversion device according to the embodiment of the present invention.
  • the power conversion device 10 according to the present invention is a device such as an inverter or a DC-DC conversion device that performs control related to conversion of an output voltage and / or output current using a semiconductor switch SW.
  • the semiconductor switch SW is composed of a semiconductor switching element such as a MOSFET (metal-oxide-semiconductor field-effect transistor) and an IGBT (Insulated Gate Bipolar Transistor).
  • the semiconductor switch SW is fixed on the substrate B by a source terminal, a drain terminal, and a gate terminal which are leg portions.
  • a heat sink (heat radiator) HS having a function of cooling by releasing the heat generated by the semiconductor switch SW to the outside is provided, and the heat sink HS is an FG (frame which will be described later). Is electrically connected to the ground.
  • a noise remover 11 for reducing noise current flowing from the parasitic capacitance generated between the semiconductor switch SW and the heat sink HS to the input side of the power converter 10 is provided between the semiconductor switch SW and the heat sink HS. Is intervened.
  • the noise eliminator 11 includes a conductor 11a in the form of a thin film such as a copper foil and an insulator 11b covering the conductor 11a.
  • the conductor 11a is described later via a source terminal of the semiconductor switch SW.
  • the two lines 12b (see FIG. 5) are electrically connected.
  • the noise eliminator 11 has a thin film shape in which a thin film conductor 11a is covered with a thin film insulator (insulating film) 11b, and one surface on the side facing the semiconductor switch SW. Is attached to the semiconductor switch SW, and the other surface facing the heat sink HS is attached to the heat sink HS.
  • the conductor 11a is disposed between the semiconductor switch SW and the heat sink HS
  • the insulator 11b is disposed as an insulating film between the conductor 11a and the semiconductor switch SW and between the conductor 11a and the heat sink HS. It has become.
  • the semiconductor switch SW has a heat radiation surface that is attached to one surface of the noise remover 11.
  • the heat sink HS has a heat absorbing surface that is attached to the other surface of the noise remover 11.
  • FIG. 5 is an explanatory diagram schematically showing an example of a control system using the heat sink HS and the noise remover 11 in the circuit diagram related to the power conversion apparatus 10 according to the embodiment of the present invention.
  • a filter 20 connected to an AC power source (not shown), an AC-DC converter 30 such as a diode bridge that converts alternating current supplied from the AC power source into direct current, and voltage smoothing.
  • a power conversion device 10 that performs power conversion such as conversion and boosting, and an insulated DC-DC converter 40 such as a transformer that performs conversion to a standard voltage and current according to a power load (not shown) are used. .
  • the direct current converted from the alternating current by the AC-DC converter 30 is a pulsating flow obtained by inverting the direction of the negative voltage with respect to the alternating current output from the filter 20 side. Will change. And the DC voltage supplied as a pulsating current is smoothed by the power converter 10.
  • the power converter 10 is provided with a first line 12a and a second line 12b that connect an input side connected to the AC-DC converter 30 and an output side connected to the isolated DC-DC converter 40.
  • the first line 12a and the second line 12b are connected to the first potential and the second potential on the input side.
  • the first line 12a is connected to the positive side, for example, as the first potential.
  • the second line 12b is used as a second potential, for example, as a wiring connected to the negative side and connected to a stable potential lower than the first potential.
  • a first capacitor C1 that connects between the first line 12a and the second line 12b and performs smoothing is disposed.
  • a booster circuit (boost chopper) using the reactor L, the semiconductor switch SW, the rectifier element D, and the second capacitor C2 is disposed on the output side that outputs to the isolated DC-DC converter 40.
  • the reactor L and the rectifying element D arranged as a booster circuit are connected in series on the first line 12a.
  • the rectifying element D is arranged with the anode terminal facing the input side and the cathode terminal facing the output side, and the reactor L is connected in series to the anode side.
  • the second capacitor C2 is disposed on the cathode side of the rectifying element D so as to connect between the first line 12a and the second line 12b.
  • the semiconductor switch SW of the booster circuit is disposed so as to short-circuit between the first line 12a and the second line 12b.
  • a MOSFET incorporating an antiparallel diode is used as the semiconductor switch SW.
  • the drain terminal of the semiconductor switch SW is connected to the first point P1 of the first line 12a between the reactor L and the rectifier element D, and the source terminal is connected to the second point P2 of the second line 12b.
  • the second point P2 is located between a connection point where the first capacitor C1 is connected to the second line 12b and a connection point where the second capacitor C2 is connected to the second line 12b.
  • the heat sink HS disposed in the vicinity is shown on the right side of the semiconductor switch SW, and the noise remover 11 is disposed between the semiconductor switch SW and the heat sink HS.
  • the heat sink HS is connected to an FG (frame ground) that is a ground potential.
  • the conductor 11a of the noise remover 11 is connected to the second line 12b via the connection line 11c.
  • a first parasitic capacitance Chp1 is generated between the conductor 11a of the noise remover 11 and the semiconductor switch SW, and between the conductor 11a of the noise remover 11 and the heat sink HS.
  • the second parasitic capacitance Chp2 is generated.
  • the voltage fluctuation at the first point P1 is transferred from the conductor 11a to the second line 12b via the second point P2.
  • the noise current Ins flows.
  • the noise current Ins transmitted to the second line 12b flows and circulates through the second point P2, the first capacitor C1, the reactor L, and the first point P1, and is confined in a circuit constituted by these elements. It is not output as noise to the input side of the power conversion device 10.
  • the voltage fluctuation at the second point P2 is transmitted from the heat sink HS to the FG, and the common mode current Icm flows as noise.
  • the magnitude of the common mode current Icm flowing in this case can be expressed by the following formula (1).
  • Icm Chp2 ⁇ dV / dt (1)
  • Icm common mode current
  • Chp2 parasitic capacitance between the conductor 11a and the heat sink
  • V voltage at the second point P2 (V2) t: time
  • FIG. 6 is a graph illustrating an example of a change with time of the voltage of the power conversion device 10.
  • time is plotted on the horizontal axis and voltage is plotted on the vertical axis, and the change over time of the voltage V2 at the second point P2 is shown by a solid line.
  • the change with time of the voltage V1 at the first point P1 is indicated by a broken line. From FIG. 6, it is clear that the change with time of the voltage V2 at the second point P2 is smaller than the change with time of the voltage V1 at the first point P1.
  • the common mode current Icm becomes small. That is, as illustrated in FIG. 6, when there is almost no change in the second point P ⁇ b> 2 connected to the stable potential, even if the common mode current Icm is output as noise to the input side of the power converter 10. Small enough to be ignored.
  • the noise remover 11 in which the conductor 11a is covered with the insulator 11b is disposed between the semiconductor switch SW and the heat sink HS, and the conductor 11a is connected to the line. Yes.
  • the noise current Ins due to the first parasitic capacitance Chp1 generated between the conductor 11a of the noise remover 11 and the semiconductor switch SW can be confined in the power converter 10.
  • the common mode current Icm due to the second parasitic capacitance Chp2 generated between the conductor 11a of the noise remover 11 and the heat sink HS is suppressed by connecting the conductor 11a to the second line 12b having a stable potential. It is possible.
  • the noise reduction effect can be obtained, so that an increase in temperature can be suppressed and production costs can be suppressed. There is. Furthermore, since there is no problem even if the heat sink HS is connected to the FG and the potential is the same as the potential of the power conversion device 10, the distance can be arbitrarily selected without being restricted by the standard regarding the insulation distance. There are advantages that the degree of freedom of arrangement of each element is high and miniaturization is possible.
  • FIG. 7 is a schematic diagram schematically showing an apparatus used in the experiment.
  • the apparatus used in the experiment includes a filter, an AC-DC converter (AC / DC), a power converter (DC / DC), and an isolated DC-DC converter (insulated DC / DC). It is configured by connecting to a power source (power source) and connecting the output side of the isolated DC-DC converter to the power load (load) side.
  • a noise measuring device (measuring device) is disposed between the AC 100V power source and the filter, and the noise measuring device is configured to measure noise leaking from the filter side.
  • Each circuit and device from the AC 100V power source to the isolated DC-DC converter are arranged in series on lines connected to live (L), neutral (N), and ground (FG), respectively.
  • L live
  • N neutral
  • FG ground
  • a conventional power converter for comparison and the power converter according to the present invention were used.
  • FIG. 8A and 8B are explanatory views schematically showing a part of the power conversion device used in the experiment.
  • FIG. 8A is a conventional power converter for comparison
  • FIG. 8B is a power converter according to the present invention.
  • an insulator I is interposed between a semiconductor switch SW using a MOSFET and a heat sink HS.
  • the insulator I is a heat conductive resin formed in a thin film shape having a thickness of 0.85 mm.
  • a noise remover 11 is interposed between a semiconductor switch SW using a MOSFET and a heat sink HS.
  • the noise remover 11 uses a copper foil formed as a thin film with a thickness of 18 ⁇ m as the conductor 11a, and an insulating sheet with a thickness of 0.1 mm is disposed as the insulator 11b on the semiconductor switch SW side, and on the heat sink HS side.
  • the insulator 11b is provided with a heat conductive resin having a thickness of 0.3 mm. Further, the copper foil used as the conductor 11a is connected to the source terminal of the semiconductor switch SW.
  • FIG. 9A and 9B are graphs showing the experimental results.
  • FIG. 9A shows the result of an experiment using a conventional power converter for comparison
  • FIG. 9B shows the result of an experiment using the power converter according to the present invention.
  • 9A and 9B show the relationship by taking the frequency [Hz] on the horizontal axis and taking the noise level [dBuV].
  • L1 is CISPR Pub. 11 (Classical Radio Interference Special Committee; Information Technology Equipment) class B average value
  • L2 is CISPR Pub. 11 shows a class B QP (quasi-peak detection) defined in FIG. 9A and 9B
  • VA indicates a noise measurement result between L and FG
  • VB indicates a noise measurement result between N and FG.
  • noise is reduced by using the power conversion device according to the present invention, and the effect is particularly remarkable in the frequency range of 200 k to 1 M [Hz].
  • a reduction effect of ⁇ 10 [dB] can be confirmed at 300 k [Hz].
  • the conductor 11a is disposed between the semiconductor switch SW and the heat sink HS
  • the insulator 11b is disposed as an insulating film between the conductor 11a and the semiconductor switch SW and between the conductor 11a and the heat sink HS.
  • the conductor 11a and the insulator 11b can be designed as appropriate.
  • the shape is not limited to a thin film shape, and may be a bulk shape with a thickness or a hard flat plate shape. In order to increase thermal conductivity, the surface shape is different from a flat surface such as a curved surface or unevenness. It may be formed.
  • the insulator 11b may be adhered as an insulating film on both surfaces of the conductor 11a.
  • the semiconductor switch SW, the insulator 11b, the conductor 11a, the insulator 11b, and the heat sink HS may not be in contact with each other as long as a sufficient heat dissipation effect is provided.
  • materials for the conductor 11a and the insulator 11b can be selected as appropriate. However, a material having high thermal conductivity is preferable.
  • the heat sink HS is connected to the FG.
  • a ground potential such as SG (signal ground), earth, or the like, or another potential having the same effect is connected. It is also possible to design.
  • the conductor 11a of the noise eliminator 11 can also be appropriately designed such that it is not connected to the second line 12b on the source terminal side but connected to the first line 12a on the drain terminal side.
  • the power conversion device 10 is not limited to the above-described embodiment, and in the technical field such as power electronics, various devices such as a DC-AC inverter using a semiconductor switch, a DC chopper, etc. It is possible to apply.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Dc-Dc Converters (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PCT/JP2016/057179 2015-06-30 2016-03-08 電力変換装置 Ceased WO2017002398A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680022360.9A CN107534388A (zh) 2015-06-30 2016-03-08 电力转换装置
EP16817508.1A EP3276806A4 (en) 2015-06-30 2016-03-08 Power conversion device
US15/784,326 US10361628B2 (en) 2015-06-30 2017-10-16 Power converter

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015131404A JP6511992B2 (ja) 2015-06-30 2015-06-30 電力変換装置
JP2015-131404 2015-06-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/784,326 Continuation US10361628B2 (en) 2015-06-30 2017-10-16 Power converter

Publications (1)

Publication Number Publication Date
WO2017002398A1 true WO2017002398A1 (ja) 2017-01-05

Family

ID=57608667

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/057179 Ceased WO2017002398A1 (ja) 2015-06-30 2016-03-08 電力変換装置

Country Status (5)

Country Link
US (1) US10361628B2 (enExample)
EP (1) EP3276806A4 (enExample)
JP (1) JP6511992B2 (enExample)
CN (1) CN107534388A (enExample)
WO (1) WO2017002398A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3376658A1 (en) * 2017-03-13 2018-09-19 Omron Corporation Power conversion device and power supply apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113452250B (zh) * 2021-06-30 2022-05-10 东南大学 一种单电源驱动的多电平双逆变器拓扑结构及其控制方法
CN114244076B (zh) * 2022-02-24 2022-05-27 浙江杭可仪器有限公司 一种平台直流电源
JP2023158552A (ja) * 2022-04-18 2023-10-30 キヤノン株式会社 スイッチング電源および画像形成装置
US12269350B2 (en) * 2023-04-28 2025-04-08 Bae Systems Controls Inc. Common-mode current sensing system and protection method for power converters

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001069764A (ja) * 1999-08-26 2001-03-16 Matsushita Electric Works Ltd 電源装置
JP2009299928A (ja) * 2008-06-10 2009-12-24 Daikin Ind Ltd 冷凍装置
JP2011082535A (ja) * 2010-11-15 2011-04-21 Renesas Electronics Corp 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138752A (en) * 1958-11-24 1964-06-23 Blasio Conrad G De Transistor-regulated direct current power supply with remote programming capabilities
FR1564641A (enExample) * 1968-02-07 1969-04-25
JPH064592Y2 (ja) * 1988-08-04 1994-02-02 富士電機株式会社 電力変換装置のノイズ防止回路
JP2839632B2 (ja) * 1990-03-30 1998-12-16 株式会社東芝 電子レンジ
US5990776A (en) * 1994-12-08 1999-11-23 Jitaru; Ionel Low noise full integrated multilayers magnetic for power converters
JP3649259B2 (ja) 1996-04-26 2005-05-18 株式会社安川電機 インバータ装置
JPH11356047A (ja) 1998-06-08 1999-12-24 Cosel Co Ltd スイッチングレギュレータ電源装置
JP3858834B2 (ja) * 2003-02-24 2006-12-20 オンキヨー株式会社 半導体素子の放熱器
US7782002B2 (en) * 2004-09-08 2010-08-24 Progressive Dynamics, Inc. Power converter
US7393432B2 (en) * 2004-09-29 2008-07-01 Lam Research Corporation RF ground switch for plasma processing system
KR100652959B1 (ko) * 2005-06-13 2006-12-01 삼성전자주식회사 스위칭모드 전원공급장치
US8138529B2 (en) * 2009-11-02 2012-03-20 Transphorm Inc. Package configurations for low EMI circuits
US20120061135A1 (en) * 2010-09-14 2012-03-15 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies having emi shielding properties
JP6243136B2 (ja) * 2012-05-02 2017-12-06 株式会社半導体エネルギー研究所 スイッチングコンバータ
US10268165B2 (en) * 2014-11-05 2019-04-23 The Trustees Of Princeton University Electrical detector for liquid metal leaks
JP6447391B2 (ja) * 2015-06-30 2019-01-09 オムロン株式会社 電力変換装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001069764A (ja) * 1999-08-26 2001-03-16 Matsushita Electric Works Ltd 電源装置
JP2009299928A (ja) * 2008-06-10 2009-12-24 Daikin Ind Ltd 冷凍装置
JP2011082535A (ja) * 2010-11-15 2011-04-21 Renesas Electronics Corp 半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3276806A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3376658A1 (en) * 2017-03-13 2018-09-19 Omron Corporation Power conversion device and power supply apparatus
CN108573941A (zh) * 2017-03-13 2018-09-25 欧姆龙株式会社 电力转换装置以及电源装置

Also Published As

Publication number Publication date
US10361628B2 (en) 2019-07-23
CN107534388A (zh) 2018-01-02
JP2017017840A (ja) 2017-01-19
JP6511992B2 (ja) 2019-05-15
EP3276806A4 (en) 2018-06-13
US20180048229A1 (en) 2018-02-15
EP3276806A1 (en) 2018-01-31

Similar Documents

Publication Publication Date Title
US10361628B2 (en) Power converter
CN203165891U (zh) 半导体模块
US9392714B2 (en) Power semiconductor module and method of manufacturing a power semiconductor
JP6230946B2 (ja) 電力変換装置、およびそれを搭載した鉄道車両
CN105304597A (zh) 功率半导体模块系统及其制造方法
JP6158051B2 (ja) 電力変換装置
KR20180050661A (ko) 유도 가열 전원 장치
US10600716B2 (en) Power converter
JP6447391B2 (ja) 電力変換装置
US8773832B2 (en) Power supply apparatus
JP2018143010A (ja) 電子回路装置
CN104518681A (zh) 电力变换装置
JP2019201187A (ja) 電子回路装置
JP2013034304A (ja) 電力変換装置
EP3376658B1 (en) Power conversion device and power supply apparatus
JP2016149912A (ja) 電力変換装置
KR20160139218A (ko) 디씨-디씨 컨버터
CN110506384A (zh) 低电感半桥功率模块
JP6265459B2 (ja) 電子部品の実装構造
WO2025210370A1 (ja) 電力変換装置
TWI789400B (zh) 充電器
JP2025023448A (ja) 電源装置
JP2023115513A (ja) 電力変換装置
JP2024003915A (ja) 電力変換器
JP2014179403A (ja) 電子部品の実装構造

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16817508

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE