WO2016192543A1 - 一种cpu散热结构和终端 - Google Patents

一种cpu散热结构和终端 Download PDF

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Publication number
WO2016192543A1
WO2016192543A1 PCT/CN2016/082926 CN2016082926W WO2016192543A1 WO 2016192543 A1 WO2016192543 A1 WO 2016192543A1 CN 2016082926 W CN2016082926 W CN 2016082926W WO 2016192543 A1 WO2016192543 A1 WO 2016192543A1
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Prior art keywords
heat
heat dissipation
cpu
pcb
plate
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PCT/CN2016/082926
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English (en)
French (fr)
Inventor
周辉煌
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Publication of WO2016192543A1 publication Critical patent/WO2016192543A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to the field of communication devices, and mainly relates to a heat dissipation structure and a terminal, and more particularly to a CPU heat dissipation structure and a terminal.
  • the mobile phone is one of the most widely used communication terminals, and the mobile phone is favored and fully popularized by its features such as light weight, simple operation and comprehensive functions.
  • Mobile phones are mobile terminals, which are small in size, but people have high demands on the functions and processing capabilities of mobile phones. Therefore, the integration level of mobile phones is getting higher and higher, and the CPU core of mobile phones is also increasing, and the frequency of CPUs is also taller and taller. With such high frequency and performance, the operating temperature of the CPU is getting higher and higher, and the temperature rise of the CPU will seriously affect its working performance. Therefore, the effective heat dissipation of the CPU is very important.
  • the heat dissipation structure is in direct contact with the CPU.
  • Such a heat dissipation structure can only lower the operating temperature of the CPU, but cannot prevent the heat of the CPU from being transmitted from the side of the CPU away from the heat dissipation structure.
  • the PCB is delivered to other components on the PCB via the PCB, which affects the normal operation of other components. Based on the above situation, it is necessary to design a heat dissipation structure that can reduce the operating temperature of the CPU and prevent the heat of the CPU from affecting the operation of other components.
  • An object of the present invention is to provide a heat dissipation structure for a CPU, which is provided with a heat dissipation box having a large thermal conductivity, and a heat absorption material having a larger heat capacity is disposed inside the heat dissipation box, so that the heat of the CPU is quickly transferred outward and sucked.
  • the absorption of hot materials improves the heat dissipation efficiency of the CPU and ensures that the CPU is at a lower operating temperature.
  • Another object of the present invention is to provide a CPU heat dissipation structure.
  • the heat transferred from the CPU to the PCB is quickly absorbed by the heat dissipation box, and the heat of the CPU is prevented from being transmitted to other elements on the PCB.
  • the device ensures the normal operation of other components on the PCB.
  • Another object of the present invention is to provide a terminal having a CPU heat dissipation structure, which can speed up the heat dissipation of the terminal, ensure long-term stable operation of the terminal, and improve the service life of the terminal.
  • a CPU heat dissipation structure is provided, the heat dissipation structure being mounted on a side of the PCB provided with the CPU opposite to the CPU;
  • the heat dissipation structure includes a heat absorbing material, the heat absorbing material is defined in the heat dissipation box, the heat dissipation box includes at least one heat conduction plate, the heat conduction plate is connected to the PCB, and the heat absorbing material and the heat conduction The board is in direct contact.
  • a side of the CPU away from the heat dissipation box is provided with a heat sink.
  • mounting the heat dissipation box on a position corresponding to the CPU on the PCB can shorten a heat conduction distance between the CPU and the heat dissipation box, and improve heat conduction efficiency.
  • the heat conducting board is attached to the PCB, which can increase the heat conduction area of the heat dissipation box and the PCB, thereby improving heat conduction efficiency, and the heat transferred to the PCB by the CPU is quickly absorbed by the heat dissipation box. To avoid the heat transfer from the CPU to other components on the PCB to ensure the normal operation of other components on the PCB.
  • the heat absorbing material with a large specific heat capacity can absorb more heat, which is beneficial to lowering the CPU. Working temperature.
  • the heat conducting plate is spaced apart from the side of the PCB to be provided with a plurality of heat conducting protrusions.
  • the side of the heat conducting plate adjacent to the PCB is a flat surface.
  • one side of the heat conducting plate is flat to facilitate effective bonding with the PCB, and the other side of the heat conducting plate is provided with the heat conducting protrusion, which can increase the heat conducting plate and the heat absorption
  • the heat transfer area of the substance increases the heat transfer efficiency.
  • the heat dissipation box adopts a box structure, and includes a heat conduction plate, a heat dissipation plate disposed in parallel with the heat conduction plate, and a heat dissipation plate disposed between the heat conduction plate and the heat dissipation plate.
  • the heat dissipation plate is disposed with a plurality of heat conduction protrusions adjacent to one side of the PCB;
  • the heat dissipation plate is spaced apart from a side of the PCB to be provided with a plurality of heat conducting protrusions.
  • thermally conductive bumps By providing the thermally conductive bumps, it is possible to increase the heat conduction area and improve the heat conduction efficiency.
  • the heat conductive material adopts any one of silver, copper, gold, and aluminum, or a mixture of two or more of silver, copper, gold, and aluminum.
  • silver, copper, gold and aluminum are several common metals with high thermal conductivity in metal materials. These metal materials can effectively improve heat transfer efficiency.
  • a contact area of the heat conduction plate with the PCB is not less than a contact area of the CPU and the PCB.
  • the shape of the heat conduction plate is consistent with the shape of the CPU.
  • the heat conducting plate and the CPU are both rectangular in shape.
  • the heat dissipation box is fixed on the PCB by soldering.
  • the heat absorbing material is helium gas or water having a large specific heat capacity.
  • both helium and water are substances with high thermal stability, and have a larger specific heat capacity, which can absorb more heat and ensure that the performance does not change after heat absorption.
  • a terminal including a CPU and a PCB, the CPU is mounted on a side of the PCB, and further includes the CPU heat dissipation structure, wherein the CPU heat dissipation structure is mounted on the PCB opposite to the CPU.
  • the CPU is mounted on a side of the PCB, and further includes the CPU heat dissipation structure, wherein the CPU heat dissipation structure is mounted on the PCB opposite to the CPU.
  • a heat dissipation hole is defined in the outer casing of the terminal, and a heat dissipation box in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.
  • the terminal comprises a mobile phone, a notebook, a tablet computer, a desktop computer, a car computer, a POS machine and the like.
  • a heat dissipation structure of a CPU is provided, and a heat dissipation box having a large thermal conductivity is disposed, and an endothermic substance having a larger heat capacity is disposed inside the heat dissipation box, so that heat in the CPU is quickly transmitted outward. It is absorbed by the heat absorbing material to improve the heat dissipation efficiency of the CPU and ensure that the CPU is at a lower operating temperature.
  • a terminal having a CPU heat dissipation structure is provided to speed up the heat dissipation of the terminal, ensure the long-term stable operation of the terminal, and improve the service life of the terminal.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 1;
  • FIG. 2 is a cross-sectional view showing the heat dissipation box of the first embodiment
  • FIG. 3 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 2;
  • FIG. 4 is a cross-sectional view showing the heat dissipation box of the second embodiment
  • FIG. 5 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 3;
  • FIG. 6 is a cross-sectional view showing the heat dissipation box of the third embodiment
  • FIG. 7 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 4.
  • FIG. 8 is a cross-sectional view of the heat dissipation box of the fourth embodiment.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2.
  • the heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31.
  • the heat dissipation box 3 is fixed to the PCB 1 by soldering. Setting the CPU 2 away from the side of the heat dissipation box 3 There are heat sinks.
  • the heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.
  • the heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction.
  • the plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material.
  • a side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 .
  • One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1.
  • the other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction.
  • the heat transfer area of the hot substance improves the heat transfer efficiency.
  • a side of the heat dissipation plate 32 away from the PCB 1 is a plane.
  • the heat dissipation plate 32 is spaced apart from one side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34 to increase the heat conduction area and improve heat conduction efficiency.
  • the shape of the heat conducting plate 31 is the same as the shape of the CPU 2.
  • the heat conducting plate 31 and the CPU 2 are both rectangular in shape, and the contact area between the heat conducting plate 31 and the PCB 1 is equal to The contact area of the CPU 2 with the PCB 1.
  • the heat conductive material is silver having a high thermal conductivity
  • the heat dissipation box 3 made of silver can effectively improve the heat conduction efficiency of the heat dissipation box 3.
  • the heat absorbing material is helium gas 4 having a large specific heat capacity.
  • helium gas 4 is a material having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that performance does not occur after heat absorption. change.
  • a terminal including a CPU 2 and a PCB 1.
  • the CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure.
  • the CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2
  • a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.
  • the terminal is a mobile phone.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2.
  • the heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31.
  • the heat dissipation box 3 is fixed to the PCB 1 by soldering.
  • a heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 .
  • the heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.
  • the heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction.
  • the plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material.
  • a side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 .
  • the heat bump 34 can increase the heat conduction area of the heat conducting plate 31 and the heat absorbing material, and improve heat conduction efficiency.
  • the heat dissipation plate 32 is spaced apart from the side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34.
  • the heat dissipation plate 32 is spaced apart from the side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34 to increase heat conduction area and improve heat conduction. effectiveness.
  • the shape of the heat conducting plate 31 is the same as the shape of the CPU 2.
  • the shape of the heat conducting plate 31 and the CPU 2 are both circular, and the contact area between the heat conducting plate 31 and the PCB 1 is greater than The contact area of the CPU 2 with the PCB 1, the diameter of the heat conducting plate 31 is larger than the diameter of the CPU 2 by 6 mm.
  • the heat conductive material is an aluminum alloy having a high thermal conductivity
  • the heat dissipation box 3 made of an aluminum alloy can effectively improve the heat conduction efficiency of the heat dissipation box 3.
  • the heat absorbing material is helium gas 4 having a large specific heat capacity.
  • helium gas 4 is a material having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that performance does not occur after heat absorption. change.
  • a terminal including a CPU 2 and a PCB 1.
  • the CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure.
  • the CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2
  • a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.
  • the terminal is a notebook computer.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2.
  • the heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31.
  • the scattered The heat cartridge 3 is fixed to the PCB 1 by soldering.
  • a heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 .
  • the heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.
  • the heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction.
  • the plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material.
  • a side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 .
  • One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1.
  • the other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction.
  • the heat transfer area of the hot substance improves the heat transfer efficiency.
  • the side of the heat dissipation plate 32 adjacent to the PCB 1 is a plane, and the heat dissipation plate 32 is spaced apart from the side of the PCB 1 to be provided with a plurality of heat conduction protrusions 34 to increase the heat conduction area and improve the heat conduction efficiency.
  • the shape of the heat conducting plate 31 is the same as the shape of the CPU 2.
  • the shape of the heat conducting plate 31 and the CPU 2 are both triangular, and the contact area between the heat conducting plate 31 and the PCB 1 is larger than The contact area of the CPU 2 and the PCB 1 is longer than the side length of the CPU 2 by 3 mm.
  • the heat conductive material is gold having a high thermal conductivity
  • the heat dissipation box 3 made of gold can effectively improve the heat conduction efficiency of the heat dissipation box 3.
  • the endothermic substance has a large specific heat capacity Water 5, specifically, water 5 is a substance having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that the performance does not change after heat absorption.
  • a terminal including a CPU 2 and a PCB 1.
  • the CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure.
  • the CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2
  • a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.
  • the terminal is an onboard computer.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2 .
  • the heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31.
  • the heat dissipation box 3 is fixed to the PCB 1 by soldering.
  • a heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 .
  • the heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.
  • the heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction.
  • the plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material.
  • the side of the heat conducting plate 31 adjacent to the PCB 1 is a plane, and the heat conduction A plurality of thermally conductive bumps 34 are spaced apart from one side of the board 31 away from the PCB 1.
  • One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1.
  • the other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction.
  • the heat transfer area of the hot substance improves the heat transfer efficiency.
  • the side of the heat dissipation plate 32 away from the PCB 1 is a plane, and the side of the heat dissipation plate 32 close to the PCB 1 is also a plane.
  • the shape of the heat conducting plate 31 is the same as the shape of the CPU 2.
  • the shape of the heat conducting plate 31 and the CPU 2 are both square, and the contact area between the heat conducting plate 31 and the PCB 1 is larger than The contact area of the CPU 2 and the PCB 1 is longer than the side length of the CPU 2 by 2 mm.
  • the heat conductive material is copper having a high thermal conductivity
  • the heat dissipation box 3 made of copper can effectively improve the heat conduction efficiency of the heat dissipation box 3.
  • the heat absorbing material is water 5 having a large specific heat capacity.
  • the water 5 is a material having high heat stability, and has a larger heat capacity, which can absorb more heat and ensure that the performance does not change after heat absorption.
  • a terminal including a CPU 2 and a PCB 1.
  • the CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure.
  • the CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2
  • a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.
  • the terminal is a tablet computer.

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Abstract

一种CPU散热结构，该散热结构安装于设有CPU（2）的PCB（1）上与CPU（2）相对的一侧面；所述散热结构包括吸热物质（4,5），所述吸热物质（4,5）被限定于散热盒（3）内，所述散热盒（3）至少包括一导热板（31），所述导热板（31）与所述PCB（1）连接，所述吸热物质（4,5）与所述导热板（31）直接接触。一种具有CPU散热结构的终端，通过设置导热系数大的散热盒（3），并在散热盒（3）内部设置比热容大的吸热物质（4,5），使CPU（2）的热量被吸热物质（4,5）吸收，保证CPU（2）处于较低的工作温度，另外通过将散热盒（3）与PCB（1）直接贴合，使CPU（2）传递至PCB（1）上的热量迅速被散热盒（3）吸收，避免CPU（2）的热量传递至PCB（1）上的其它元器件，保证PCB（1）上的其它元器件的正常工作。

Description

一种CPU散热结构和终端 技术领域
本发明涉及通信设备技术领域，主要涉及一种散热结构和终端，尤其涉及一种CPU散热结构和终端。
背景技术
现代社会人们的生活节奏越来越快，人与人之间的通信也越来越紧密和频繁，人们对于通信设备的依赖很强。其中，手机是应用最广泛的通信终端之一，手机以其轻便、操作简单和功能全面等特点得到人们的青睐和全面普及。手机是移动终端，尺寸较小，但人们对手机的功能和处理能力的需求很高，因此，手机的集成程度越来越高，手机的CPU的内核也越来越多，同时CPU的频率也越来越高。如此高的频率和性能，使CPU的工作温度越来越高，而CPU的温度升高将严重影响其工作性能，因此，CPU的有效散热相当重要。
除手机终端外，目前大部分电子产品终端上均设置有高集成和高性能的CPU，这些电子产品终端上的CPU在使用过程中也需要解决散热的问题。
目前用于加快CPU散热的结构很多，但基本上是将散热结构与CPU直接接触，此类散热结构只能降低CPU的工作温度，但不能防止CPU的热量从CPU远离该散热结构的一侧传递给PCB，并经PCB传递至PCB上的其它元器件，影响其它元器件的正常工作。基于上述情况，我们有必要设计一种既能够降低CPU的工作温度，又能避免CPU的热量影响其它元器件工作的散热结构。
发明内容
本发明的一个目的在于：提供一种CPU散热结构，通过设置导热系数大的散热盒，并在散热盒内部设置比热容大的吸热物质，使CPU工作时的热量快速向外传递，并被吸热物质吸收，提高CPU的散热效率，保证CPU处于较低的工作温度。
本发明的另一个目的在于：提供一种CPU散热结构，通过将散热盒与PCB直接贴合，使CPU传递至PCB上的热量迅速被散热盒吸收，避免CPU的热量传递至PCB上的其它元器件，保证PCB上的其它元器件的正常工作。
本发明的又一个目的在于：提供一种具有CPU散热结构的终端，加快终端散热，保证终端长期稳定运行，提高终端使用寿命。
为达此目的，本发明采用以下技术方案：
一方面，提供一种CPU散热结构，该散热结构安装于设有CPU的PCB上与CPU相对的一侧面；
所述散热结构包括吸热物质，所述吸热物质被限定于散热盒内，所述散热盒至少包括一导热板，所述导热板与所述PCB连接，所述吸热物质与所述导热板直接接触。
优选的，所述CPU远离所述散热盒的一侧设置有散热片。
具体地，将所述散热盒安装在所述PCB上与所述CPU对应的位置，能够缩短所述CPU与所述散热盒之间的热量传导距离，提高热量传导效率。
具体地，所述导热板与所述PCB贴合，能够增大所述散热盒与所述PCB的热量传导面积，从而提高热量传导效率，同时使CPU传递至PCB上的热量迅速被散热盒吸收，避免CPU的热量传递至PCB上的其它元器件，保证PCB上的其它元器件的正常工作。
具体地，设置大比热容的吸热物质，能够吸热更多的热量，有利于降低CPU 的工作温度。
作为一种CPU散热结构的优选的技术方案，所述导热板远离所述PCB的一侧间隔设置有若干导热凸起。
优选的，所述导热板靠近所述PCB的一侧是平面。
具体地，所述导热板的一侧为平面，有利于与所述PCB的有效贴合，所述导热板的另一侧设置所述导热凸起，能够增加所述导热板与所述吸热物质的热量传导面积，提高热量传导效率。
作为一种CPU散热结构的优选的技术方案，所述散热盒采用盒体结构，包括导热板、与所述导热板平行设置的散热板，以及设置于所述导热板与所述散热板之间用于连接所述导热板与所述散热板的侧板，所述导热板、所述散热板、所述侧板均由导热材料制成。
作为一种CPU散热结构的优选的技术方案，所述散热板靠近所述PCB的一侧间隔设置有若干导热凸起；
和/或，所述散热板远离所述PCB的一侧间隔设置有若干导热凸起。
具体地，通过设置所述导热凸起，能够增加热量传导面积，提高热量传导效率。
作为一种CPU散热结构的优选的技术方案，所述导热材料采用银、铜、金、铝中的任意一种，或者，采用银、铜、金、铝中的两种或两种以上的混合材料，或者，采用包含银、铜、金、铝中的任意一种的合金材料。
具体地，银、铜、金和铝是金属材料中导热系数较高的几种常用金属，选用此几种金属材料能够有效提高热量传导效率。
作为一种CPU散热结构的优选的技术方案，所述导热板与所述PCB的接触面积不小于所述CPU与所述PCB的接触面积。
作为一种CPU散热结构的优选的技术方案，所述导热板的形状与所述CPU的形状一致。
优选的，所述导热板与所述CPU的形状均是矩形。
作为一种CPU散热结构的优选的技术方案，所述散热盒通过锡焊固定在所述PCB上。
作为一种CPU散热结构的优选的技术方案，所述吸热物质是具有大比热容的氦气或者水。
具体地，氦气和水均是热稳定性较高的物质，且比热容大，既能吸收较多的热量，又能保证吸热后性能不发生改变。
另一方面，提供一种终端，包括CPU和PCB，所述CPU安装于所述PCB的一侧面，还包括上述的CPU散热结构，所述CPU散热结构安装于所述PCB上与所述CPU相对的一侧面。
优选的，所述终端的外壳上开设有散热孔，所述CPU散热结构中的散热盒位于所述散热孔的一侧。
优选的，所述终端包括手机、笔记本、平板电脑、台式电脑、车载电脑、POS机等设备。
本发明的有益效果为：一方面，提供一种CPU散热结构，通过设置导热系数大的散热盒，并在散热盒内部设置比热容大的吸热物质，使CPU工作时的热量快速向外传递，并被吸热物质吸收，提高CPU的散热效率，保证CPU处于较低的工作温度。通过将散热盒与PCB直接贴合，使CPU传递至PCB上的热量迅速被散热盒吸收，避免CPU的热量传递至PCB上的其它元器件，保证PCB上的其它元器件的正常工作。另一方面，提供一种具有CPU散热结构的终端，加快终端散热，保证终端长期稳定运行，提高终端使用寿命。
附图说明
下面根据附图和实施例对本发明作进一步详细说明。
图1为实施例一所述的CPU散热结构的示意图；
图2为实施例一所述的散热盒的剖视示意图；
图3为实施例二所述的CPU散热结构的示意图；
图4为实施例二所述的散热盒的剖视示意图；
图5为实施例三所述的CPU散热结构的示意图；
图6为实施例三所述的散热盒的剖视示意图；
图7为实施例四所述的CPU散热结构的示意图；
图8为实施例四所述的散热盒的剖视示意图。
图1至图8中：
1、PCB；2、CPU；3、散热盒；31、导热板；32、散热板；33、侧板；34、导热凸起；4、氦气；5、水。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
实施例一：
一方面，如图1、2所示，本实施例提供一种CPU散热结构，该散热结构安装于设有CPU2的PCB1上与CPU2相对的一侧面。所述散热结构包括吸热物质，所述吸热物质被限定于散热盒3内，所述散热盒3至少包括一导热板31，所述导热板31与所述PCB1连接，所述吸热物质与所述导热板31直接接触。所述散热盒3通过锡焊固定在所述PCB1上。所述CPU2远离所述散热盒3的一侧设置 有散热片。将所述散热盒3安装在所述PCB1上与所述CPU2对应的位置，能够缩短所述CPU2与所述散热盒3之间的热量传导距离，提高热量传导效率。所述导热板31与所述PCB1贴合，能够增大所述散热盒3与所述PCB1的热量传导面积，从而提高热量传导效率，使CPU2传递至PCB1上的热量迅速被散热盒3吸收，避免CPU2的热量传递至PCB1上的其它元器件，保证PCB1上的其它元器件的正常工作。
所述散热盒3采用盒体结构，包括导热板31、与所述导热板31平行设置的散热板32，以及设置于所述导热板31与所述散热板32之间用于连接所述导热板31与所述散热板32的侧板33，所述导热板31、所述散热板32、所述侧板33均由导热材料制成。所述导热板31靠近所述PCB1的一侧是平面，所述导热板31远离所述PCB1的一侧间隔设置有若干导热凸起34。所述导热板31的一侧为平面，有利于与所述PCB1的有效贴合，所述导热板31的另一侧设置所述导热凸起34，能够增加所述导热板31与所述吸热物质的热量传导面积，提高热量传导效率。所述散热板32远离所述PCB1的一侧是平面，所述散热板32靠近所述PCB1的一侧间隔设置有若干导热凸起34，增加热量传导面积，提高热量传导效率。
所述导热板31的形状与所述CPU2的形状一致，于本实施例中，所述导热板31与所述CPU2的形状均是矩形，所述导热板31与所述PCB1的接触面积等于所述CPU2与所述PCB1的接触面积。
于本实施例中，所述导热材料是具有高导热系数的银，以银制成所述散热盒3能够有效提高散热盒3的热量传导效率。所述吸热物质是具有大比热容的氦气4，具体地，氦气4是热稳定性较高的物质，且比热容大，既能吸收较多的热量，又能保证吸热后性能不发生改变。
另一方面，提供一种终端，包括CPU2和PCB1，所述CPU2安装于所述PCB1的一侧面，还包括上述的CPU散热结构，所述CPU散热结构安装于所述PCB1上与所述CPU2相对的一侧面，所述终端的外壳上开设有散热孔，所述CPU散热结构中的散热盒3位于所述散热孔的一侧。于本实施例中，所述终端是手机。
实施例二：
一方面，如图3、4所示，本实施例提供一种CPU散热结构，该散热结构安装于设有CPU2的PCB1上与CPU2相对的一侧面。所述散热结构包括吸热物质，所述吸热物质被限定于散热盒3内，所述散热盒3至少包括一导热板31，所述导热板31与所述PCB1连接，所述吸热物质与所述导热板31直接接触。所述散热盒3通过锡焊固定在所述PCB1上。所述CPU2远离所述散热盒3的一侧设置有散热片。将所述散热盒3安装在所述PCB1上与所述CPU2对应的位置，能够缩短所述CPU2与所述散热盒3之间的热量传导距离，提高热量传导效率。所述导热板31与所述PCB1贴合，能够增大所述散热盒3与所述PCB1的热量传导面积，从而提高热量传导效率，使CPU2传递至PCB1上的热量迅速被散热盒3吸收，避免CPU2的热量传递至PCB1上的其它元器件，保证PCB1上的其它元器件的正常工作。
所述散热盒3采用盒体结构，包括导热板31、与所述导热板31平行设置的散热板32，以及设置于所述导热板31与所述散热板32之间用于连接所述导热板31与所述散热板32的侧板33，所述导热板31、所述散热板32、所述侧板33均由导热材料制成。所述导热板31靠近所述PCB1的一侧是平面，所述导热板31远离所述PCB1的一侧间隔设置有若干导热凸起34。所述导热板31的一侧为平面，有利于与所述PCB1的有效贴合，所述导热板31的另一侧设置所述导 热凸起34，能够增加所述导热板31与所述吸热物质的热量传导面积，提高热量传导效率。所述散热板32远离所述PCB1的一侧间隔设置有若干导热凸起34，所述散热板32靠近所述PCB1的一侧间隔设置有若干导热凸起34，增加热量传导面积，提高热量传导效率。
所述导热板31的形状与所述CPU2的形状一致，于本实施例中，所述导热板31与所述CPU2的形状均是圆形，所述导热板31与所述PCB1的接触面积大于所述CPU2与所述PCB1的接触面积，所述导热板31的直径比所述CPU2的直径大6mm。
于本实施例中，所述导热材料是具有高导热系数的铝合金，以铝合金制成所述散热盒3能够有效提高散热盒3的热量传导效率。所述吸热物质是具有大比热容的氦气4，具体地，氦气4是热稳定性较高的物质，且比热容大，既能吸收较多的热量，又能保证吸热后性能不发生改变。
另一方面，提供一种终端，包括CPU2和PCB1，所述CPU2安装于所述PCB1的一侧面，还包括上述的CPU散热结构，所述CPU散热结构安装于所述PCB1上与所述CPU2相对的一侧面，所述终端的外壳上开设有散热孔，所述CPU散热结构中的散热盒3位于所述散热孔的一侧。于本实施例中，所述终端是笔记本电脑。
实施例三：
一方面，如图5、6所示，本实施例提供一种CPU散热结构，该散热结构安装于设有CPU2的PCB1上与CPU2相对的一侧面。所述散热结构包括吸热物质，所述吸热物质被限定于散热盒3内，所述散热盒3至少包括一导热板31，所述导热板31与所述PCB1连接，所述吸热物质与所述导热板31直接接触。所述散 热盒3通过锡焊固定在所述PCB1上。所述CPU2远离所述散热盒3的一侧设置有散热片。将所述散热盒3安装在所述PCB1上与所述CPU2对应的位置，能够缩短所述CPU2与所述散热盒3之间的热量传导距离，提高热量传导效率。所述导热板31与所述PCB1贴合，能够增大所述散热盒3与所述PCB1的热量传导面积，从而提高热量传导效率，使CPU2传递至PCB1上的热量迅速被散热盒3吸收，避免CPU2的热量传递至PCB1上的其它元器件，保证PCB1上的其它元器件的正常工作。
所述散热盒3采用盒体结构，包括导热板31、与所述导热板31平行设置的散热板32，以及设置于所述导热板31与所述散热板32之间用于连接所述导热板31与所述散热板32的侧板33，所述导热板31、所述散热板32、所述侧板33均由导热材料制成。所述导热板31靠近所述PCB1的一侧是平面，所述导热板31远离所述PCB1的一侧间隔设置有若干导热凸起34。所述导热板31的一侧为平面，有利于与所述PCB1的有效贴合，所述导热板31的另一侧设置所述导热凸起34，能够增加所述导热板31与所述吸热物质的热量传导面积，提高热量传导效率。所述散热板32靠近所述PCB1的一侧是平面，所述散热板32远离所述PCB1的一侧间隔设置有若干导热凸起34，增加热量传导面积，提高热量传导效率。
所述导热板31的形状与所述CPU2的形状一致，于本实施例中，所述导热板31与所述CPU2的形状均是三角形，所述导热板31与所述PCB1的接触面积大于所述CPU2与所述PCB1的接触面积，所述导热板31的边长比所述CPU2的边长大3mm。
于本实施例中，所述导热材料是具有高导热系数的金，以金制成所述散热盒3能够有效提高散热盒3的热量传导效率。所述吸热物质是具有大比热容的 水5，具体地，水5是热稳定性较高的物质，且比热容大，既能吸收较多的热量，又能保证吸热后性能不发生改变。
另一方面，提供一种终端，包括CPU2和PCB1，所述CPU2安装于所述PCB1的一侧面，还包括上述的CPU散热结构，所述CPU散热结构安装于所述PCB1上与所述CPU2相对的一侧面，所述终端的外壳上开设有散热孔，所述CPU散热结构中的散热盒3位于所述散热孔的一侧。于本实施例中，所述终端是车载电脑。
实施例四：
一方面，如图7、8所示，本实施例提供一种CPU散热结构，该散热结构安装于设有CPU2的PCB1上与CPU2相对的一侧面。所述散热结构包括吸热物质，所述吸热物质被限定于散热盒3内，所述散热盒3至少包括一导热板31，所述导热板31与所述PCB1连接，所述吸热物质与所述导热板31直接接触。所述散热盒3通过锡焊固定在所述PCB1上。所述CPU2远离所述散热盒3的一侧设置有散热片。将所述散热盒3安装在所述PCB1上与所述CPU2对应的位置，能够缩短所述CPU2与所述散热盒3之间的热量传导距离，提高热量传导效率。所述导热板31与所述PCB1贴合，能够增大所述散热盒3与所述PCB1的热量传导面积，从而提高热量传导效率，使CPU2传递至PCB1上的热量迅速被散热盒3吸收，避免CPU2的热量传递至PCB1上的其它元器件，保证PCB1上的其它元器件的正常工作。
所述散热盒3采用盒体结构，包括导热板31、与所述导热板31平行设置的散热板32，以及设置于所述导热板31与所述散热板32之间用于连接所述导热板31与所述散热板32的侧板33，所述导热板31、所述散热板32、所述侧板33均由导热材料制成。所述导热板31靠近所述PCB1的一侧是平面，所述导热 板31远离所述PCB1的一侧间隔设置有若干导热凸起34。所述导热板31的一侧为平面，有利于与所述PCB1的有效贴合，所述导热板31的另一侧设置所述导热凸起34，能够增加所述导热板31与所述吸热物质的热量传导面积，提高热量传导效率。所述散热板32远离所述PCB1的一侧是平面，所述散热板32靠近所述PCB1的一侧也是平面。
所述导热板31的形状与所述CPU2的形状一致，于本实施例中，所述导热板31与所述CPU2的形状均是正方形，所述导热板31与所述PCB1的接触面积大于所述CPU2与所述PCB1的接触面积，所述导热板31的边长比所述CPU2的边长大2mm。
于本实施例中，所述导热材料是具有高导热系数的铜，以铜制成所述散热盒3能够有效提高散热盒3的热量传导效率。所述吸热物质是具有大比热容的水5，具体地，水5是热稳定性较高的物质，且比热容大，既能吸收较多的热量，又能保证吸热后性能不发生改变。
另一方面，提供一种终端，包括CPU2和PCB1，所述CPU2安装于所述PCB1的一侧面，还包括上述的CPU散热结构，所述CPU散热结构安装于所述PCB1上与所述CPU2相对的一侧面，所述终端的外壳上开设有散热孔，所述CPU散热结构中的散热盒3位于所述散热孔的一侧。于本实施例中，所述终端是平板电脑。
需要声明的是，上述具体实施方式仅仅为本发明的较佳实施例及所运用技术原理，在本发明所公开的技术范围内，任何熟悉本技术领域的技术人员所容易想到的变化或替换，都应涵盖在本发明的保护范围内。

Claims (10)

  1. 一种CPU散热结构，其特征在于，该散热结构安装于设有CPU的PCB上与CPU相对的一侧面；
    所述散热结构包括吸热物质，所述吸热物质被限定于散热盒内，所述散热盒至少包括一导热板，所述导热板与所述PCB连接，所述吸热物质与所述导热板直接接触。
  2. 根据权利要求1所述的一种CPU散热结构，其特征在于，所述导热板远离所述PCB的一侧间隔设置有若干导热凸起。
  3. 根据权利要求1所述的一种CPU散热结构，其特征在于，所述散热盒采用盒体结构，包括导热板、与所述导热板平行设置的散热板，以及设置于所述导热板与所述散热板之间用于连接所述导热板与所述散热板的侧板，所述导热板、所述散热板、所述侧板均由导热材料制成。
  4. 根据权利要求3所述的一种CPU散热结构，其特征在于，所述散热板靠近所述PCB的一侧间隔设置有若干导热凸起；
    和/或，所述散热板远离所述PCB的一侧间隔设置有若干导热凸起。
  5. 根据权利要求3所述的一种CPU散热结构，其特征在于，所述导热材料采用银、铜、金、铝中的任意一种，或者，采用银、铜、金、铝中的两种或两种以上的混合材料，或者，采用包含银、铜、金、铝中的任意一种的合金材料。
  6. 根据权利要求1所述的一种CPU散热结构，其特征在于，所述导热板与所述PCB的接触面积不小于所述CPU与所述PCB的接触面积。
  7. 根据权利要求1所述的一种CPU散热结构，其特征在于，所述导热板的形状与所述CPU的形状一致。
  8. 根据权利要求1所述的一种CPU散热结构，其特征在于，所述散热盒通过锡焊固定在所述PCB上。
  9. 根据权利要求1至8任一项所述的一种CPU散热结构，其特征在于，所述吸热物质是具有大比热容的氦气或者水。
  10. 一种终端，包括CPU和PCB，所述CPU安装于所述PCB的一侧面，其特征在于，还包括如权利要求1至9任一项所述的CPU散热结构，所述CPU散热结构安装于所述PCB上与所述CPU相对的一侧面。
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