WO2016192543A1

WO2016192543A1 - Cpu heat dissipation structure and terminal

Info

Publication number: WO2016192543A1
Application number: PCT/CN2016/082926
Authority: WO
Inventors: 周辉煌
Original assignee: 广东欧珀移动通信有限公司
Priority date: 2015-05-29
Filing date: 2016-05-20
Publication date: 2016-12-08
Also published as: CN104866047A

Abstract

A CPU heat dissipation structure. The heat dissipation structure is mounted on one side surface of a PCB (1) provided with a CPU (2) opposite to the side surface. The heat dissipation structure comprises a heat absorption substance (4, 5). The heat absorption substance (4, 5) is limited in a heat dissipation box (3). The heat dissipation box (3) at least comprises a heat conduction plate (31). The heat conduction plate (31) is connected to the PCB (1). The heat absorption substance (4, 5) is in direct contact with the heat conduction plate (31). A terminal having a CPU heat dissipation structure. By arranging the heat dissipation box (3) having a great heat conduction coefficient and arranging the heat absorption substance (4, 5) having a great specific heat capacity in the heat dissipation box (3), the heat of the CPU (2) is absorbed by the heat absorption substance (4, 5), and it is ensured that the CPU (2) is at a low working temperature; in addition, the heat dissipation box (3) is directly attached to the PCB (1), the heat transmitted from the CPU (2) to the PCB (1) is rapidly absorbed by the heat dissipation box (3), the heat is prevented from being transmitted to other members on the PCB (1), and normal operation of the other members on the PCB (1) is ensured.

Description

CPU heat dissipation structure and terminal

Technical field

The present invention relates to the field of communication devices, and mainly relates to a heat dissipation structure and a terminal, and more particularly to a CPU heat dissipation structure and a terminal.

Background technique

In modern society, the pace of life is getting faster and faster, and the communication between people is getting more and more close and frequent. People have strong dependence on communication equipment. Among them, the mobile phone is one of the most widely used communication terminals, and the mobile phone is favored and fully popularized by its features such as light weight, simple operation and comprehensive functions. Mobile phones are mobile terminals, which are small in size, but people have high demands on the functions and processing capabilities of mobile phones. Therefore, the integration level of mobile phones is getting higher and higher, and the CPU core of mobile phones is also increasing, and the frequency of CPUs is also taller and taller. With such high frequency and performance, the operating temperature of the CPU is getting higher and higher, and the temperature rise of the CPU will seriously affect its working performance. Therefore, the effective heat dissipation of the CPU is very important.

In addition to mobile phone terminals, most of the current electronic product terminals are equipped with highly integrated and high-performance CPUs. The CPUs on these electronic product terminals also need to solve the problem of heat dissipation during use.

At present, there are many structures for speeding up CPU cooling, but basically the heat dissipation structure is in direct contact with the CPU. Such a heat dissipation structure can only lower the operating temperature of the CPU, but cannot prevent the heat of the CPU from being transmitted from the side of the CPU away from the heat dissipation structure. The PCB is delivered to other components on the PCB via the PCB, which affects the normal operation of other components. Based on the above situation, it is necessary to design a heat dissipation structure that can reduce the operating temperature of the CPU and prevent the heat of the CPU from affecting the operation of other components.

Summary of the invention

An object of the present invention is to provide a heat dissipation structure for a CPU, which is provided with a heat dissipation box having a large thermal conductivity, and a heat absorption material having a larger heat capacity is disposed inside the heat dissipation box, so that the heat of the CPU is quickly transferred outward and sucked. The absorption of hot materials improves the heat dissipation efficiency of the CPU and ensures that the CPU is at a lower operating temperature.

Another object of the present invention is to provide a CPU heat dissipation structure. By directly bonding the heat dissipation box to the PCB, the heat transferred from the CPU to the PCB is quickly absorbed by the heat dissipation box, and the heat of the CPU is prevented from being transmitted to other elements on the PCB. The device ensures the normal operation of other components on the PCB.

Another object of the present invention is to provide a terminal having a CPU heat dissipation structure, which can speed up the heat dissipation of the terminal, ensure long-term stable operation of the terminal, and improve the service life of the terminal.

To this end, the present invention employs the following technical solutions:

In one aspect, a CPU heat dissipation structure is provided, the heat dissipation structure being mounted on a side of the PCB provided with the CPU opposite to the CPU;

The heat dissipation structure includes a heat absorbing material, the heat absorbing material is defined in the heat dissipation box, the heat dissipation box includes at least one heat conduction plate, the heat conduction plate is connected to the PCB, and the heat absorbing material and the heat conduction The board is in direct contact.

Preferably, a side of the CPU away from the heat dissipation box is provided with a heat sink.

Specifically, mounting the heat dissipation box on a position corresponding to the CPU on the PCB can shorten a heat conduction distance between the CPU and the heat dissipation box, and improve heat conduction efficiency.

Specifically, the heat conducting board is attached to the PCB, which can increase the heat conduction area of the heat dissipation box and the PCB, thereby improving heat conduction efficiency, and the heat transferred to the PCB by the CPU is quickly absorbed by the heat dissipation box. To avoid the heat transfer from the CPU to other components on the PCB to ensure the normal operation of other components on the PCB.

Specifically, the heat absorbing material with a large specific heat capacity can absorb more heat, which is beneficial to lowering the CPU. Working temperature.

As a preferred technical solution of the CPU heat dissipation structure, the heat conducting plate is spaced apart from the side of the PCB to be provided with a plurality of heat conducting protrusions.

Preferably, the side of the heat conducting plate adjacent to the PCB is a flat surface.

Specifically, one side of the heat conducting plate is flat to facilitate effective bonding with the PCB, and the other side of the heat conducting plate is provided with the heat conducting protrusion, which can increase the heat conducting plate and the heat absorption The heat transfer area of the substance increases the heat transfer efficiency.

As a preferred technical solution of the CPU heat dissipation structure, the heat dissipation box adopts a box structure, and includes a heat conduction plate, a heat dissipation plate disposed in parallel with the heat conduction plate, and a heat dissipation plate disposed between the heat conduction plate and the heat dissipation plate. a side plate for connecting the heat conducting plate and the heat radiating plate, wherein the heat conducting plate, the heat radiating plate, and the side plate are each made of a heat conductive material.

As a preferred technical solution of the CPU heat dissipation structure, the heat dissipation plate is disposed with a plurality of heat conduction protrusions adjacent to one side of the PCB;

And/or, the heat dissipation plate is spaced apart from a side of the PCB to be provided with a plurality of heat conducting protrusions.

Specifically, by providing the thermally conductive bumps, it is possible to increase the heat conduction area and improve the heat conduction efficiency.

As a preferred technical solution of the CPU heat dissipation structure, the heat conductive material adopts any one of silver, copper, gold, and aluminum, or a mixture of two or more of silver, copper, gold, and aluminum. The material, or an alloy material containing any one of silver, copper, gold, and aluminum.

Specifically, silver, copper, gold and aluminum are several common metals with high thermal conductivity in metal materials. These metal materials can effectively improve heat transfer efficiency.

As a preferred technical solution of the CPU heat dissipation structure, a contact area of the heat conduction plate with the PCB is not less than a contact area of the CPU and the PCB.

As a preferred technical solution of the CPU heat dissipation structure, the shape of the heat conduction plate is consistent with the shape of the CPU.

Preferably, the heat conducting plate and the CPU are both rectangular in shape.

As a preferred technical solution of the CPU heat dissipation structure, the heat dissipation box is fixed on the PCB by soldering.

As a preferred technical solution of the CPU heat dissipation structure, the heat absorbing material is helium gas or water having a large specific heat capacity.

Specifically, both helium and water are substances with high thermal stability, and have a larger specific heat capacity, which can absorb more heat and ensure that the performance does not change after heat absorption.

In another aspect, a terminal is provided, including a CPU and a PCB, the CPU is mounted on a side of the PCB, and further includes the CPU heat dissipation structure, wherein the CPU heat dissipation structure is mounted on the PCB opposite to the CPU. One side.

Preferably, a heat dissipation hole is defined in the outer casing of the terminal, and a heat dissipation box in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole.

Preferably, the terminal comprises a mobile phone, a notebook, a tablet computer, a desktop computer, a car computer, a POS machine and the like.

The beneficial effects of the present invention are as follows: on the one hand, a heat dissipation structure of a CPU is provided, and a heat dissipation box having a large thermal conductivity is disposed, and an endothermic substance having a larger heat capacity is disposed inside the heat dissipation box, so that heat in the CPU is quickly transmitted outward. It is absorbed by the heat absorbing material to improve the heat dissipation efficiency of the CPU and ensure that the CPU is at a lower operating temperature. By directly bonding the heat-dissipating box to the PCB, the heat transferred from the CPU to the PCB is quickly absorbed by the heat-dissipating box, and the heat of the CPU is prevented from being transmitted to other components on the PCB to ensure normal operation of other components on the PCB. On the other hand, a terminal having a CPU heat dissipation structure is provided to speed up the heat dissipation of the terminal, ensure the long-term stable operation of the terminal, and improve the service life of the terminal.

DRAWINGS

The invention will now be described in further detail with reference to the drawings and embodiments.

1 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 1;

2 is a cross-sectional view showing the heat dissipation box of the first embodiment;

3 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 2;

4 is a cross-sectional view showing the heat dissipation box of the second embodiment;

5 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 3;

6 is a cross-sectional view showing the heat dissipation box of the third embodiment;

7 is a schematic diagram of a heat dissipation structure of a CPU according to Embodiment 4;

8 is a cross-sectional view of the heat dissipation box of the fourth embodiment.

In Figures 1 to 8:

1, PCB; 2, CPU; 3, heat sink; 31, heat conduction plate; 32, heat sink; 33, side plates; 34, heat conduction bumps; 4, helium; 5, water.

detailed description

The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

Embodiment 1:

On the one hand, as shown in FIG. 1 and FIG. 2, the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2. The heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31. The heat dissipation box 3 is fixed to the PCB 1 by soldering. Setting the CPU 2 away from the side of the heat dissipation box 3 There are heat sinks. Mounting the heat dissipation box 3 on the PCB 1 at a position corresponding to the CPU 2 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve heat conduction efficiency. The heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction. The plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material. A side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 . One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1. The other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction. The heat transfer area of the hot substance improves the heat transfer efficiency. A side of the heat dissipation plate 32 away from the PCB 1 is a plane. The heat dissipation plate 32 is spaced apart from one side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34 to increase the heat conduction area and improve heat conduction efficiency.

The shape of the heat conducting plate 31 is the same as the shape of the CPU 2. In the embodiment, the heat conducting plate 31 and the CPU 2 are both rectangular in shape, and the contact area between the heat conducting plate 31 and the PCB 1 is equal to The contact area of the CPU 2 with the PCB 1.

In the embodiment, the heat conductive material is silver having a high thermal conductivity, and the heat dissipation box 3 made of silver can effectively improve the heat conduction efficiency of the heat dissipation box 3. The heat absorbing material is helium gas 4 having a large specific heat capacity. Specifically, helium gas 4 is a material having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that performance does not occur after heat absorption. change.

In another aspect, a terminal is provided, including a CPU 2 and a PCB 1. The CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure. The CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2 On one side of the terminal, a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole. In this embodiment, the terminal is a mobile phone.

Embodiment 2:

On the one hand, as shown in FIG. 3 and FIG. 4, the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2. The heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31. The heat dissipation box 3 is fixed to the PCB 1 by soldering. A heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 . Mounting the heat dissipation box 3 on the PCB 1 at a position corresponding to the CPU 2 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve heat conduction efficiency. The heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction. The plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material. A side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 . One side of the heat conducting plate 31 is flat to facilitate effective bonding with the PCB 1, and the other side of the heat conducting plate 31 is provided with the guiding The heat bump 34 can increase the heat conduction area of the heat conducting plate 31 and the heat absorbing material, and improve heat conduction efficiency. The heat dissipation plate 32 is spaced apart from the side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34. The heat dissipation plate 32 is spaced apart from the side of the PCB 1 and is provided with a plurality of heat conduction protrusions 34 to increase heat conduction area and improve heat conduction. effectiveness.

The shape of the heat conducting plate 31 is the same as the shape of the CPU 2. In the embodiment, the shape of the heat conducting plate 31 and the CPU 2 are both circular, and the contact area between the heat conducting plate 31 and the PCB 1 is greater than The contact area of the CPU 2 with the PCB 1, the diameter of the heat conducting plate 31 is larger than the diameter of the CPU 2 by 6 mm.

In the embodiment, the heat conductive material is an aluminum alloy having a high thermal conductivity, and the heat dissipation box 3 made of an aluminum alloy can effectively improve the heat conduction efficiency of the heat dissipation box 3. The heat absorbing material is helium gas 4 having a large specific heat capacity. Specifically, helium gas 4 is a material having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that performance does not occur after heat absorption. change.

In another aspect, a terminal is provided, including a CPU 2 and a PCB 1. The CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure. The CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2 On one side of the terminal, a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole. In this embodiment, the terminal is a notebook computer.

Embodiment 3:

On the one hand, as shown in FIG. 5 and FIG. 6, the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2. The heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31. The scattered The heat cartridge 3 is fixed to the PCB 1 by soldering. A heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 . Mounting the heat dissipation box 3 on the PCB 1 at a position corresponding to the CPU 2 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve heat conduction efficiency. The heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction. The plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material. A side of the heat conducting board 31 adjacent to the PCB 1 is a plane, and a side of the heat conducting board 31 away from the PCB 1 is spaced apart from a plurality of heat conducting protrusions 34 . One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1. The other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction. The heat transfer area of the hot substance improves the heat transfer efficiency. The side of the heat dissipation plate 32 adjacent to the PCB 1 is a plane, and the heat dissipation plate 32 is spaced apart from the side of the PCB 1 to be provided with a plurality of heat conduction protrusions 34 to increase the heat conduction area and improve the heat conduction efficiency.

The shape of the heat conducting plate 31 is the same as the shape of the CPU 2. In the embodiment, the shape of the heat conducting plate 31 and the CPU 2 are both triangular, and the contact area between the heat conducting plate 31 and the PCB 1 is larger than The contact area of the CPU 2 and the PCB 1 is longer than the side length of the CPU 2 by 3 mm.

In the embodiment, the heat conductive material is gold having a high thermal conductivity, and the heat dissipation box 3 made of gold can effectively improve the heat conduction efficiency of the heat dissipation box 3. The endothermic substance has a large specific heat capacity Water 5, specifically, water 5 is a substance having high thermal stability, and has a larger specific heat capacity, can absorb more heat, and can ensure that the performance does not change after heat absorption.

In another aspect, a terminal is provided, including a CPU 2 and a PCB 1. The CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure. The CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2 On one side of the terminal, a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole. In this embodiment, the terminal is an onboard computer.

Embodiment 4:

On the one hand, as shown in FIG. 7 and FIG. 8 , the embodiment provides a CPU heat dissipation structure, which is mounted on a side of the PCB 1 provided with the CPU 2 opposite to the CPU 2 . The heat dissipating structure includes a heat absorbing material, and the heat absorbing material is defined in the heat dissipating box 3, the heat dissipating box 3 includes at least one heat conducting plate 31, and the heat conducting board 31 is connected to the PCB1, the heat absorbing material Direct contact with the heat conducting plate 31. The heat dissipation box 3 is fixed to the PCB 1 by soldering. A heat sink is disposed on a side of the CPU 2 away from the heat dissipation box 3 . Mounting the heat dissipation box 3 on the PCB 1 at a position corresponding to the CPU 2 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve heat conduction efficiency. The heat conducting plate 31 is attached to the PCB 1 to increase the heat conduction area of the heat dissipation box 3 and the PCB 1 , thereby improving the heat conduction efficiency, so that the heat transferred from the CPU 2 to the PCB 1 is quickly absorbed by the heat dissipation box 3 . Avoid the heat transfer from CPU2 to other components on PCB1 to ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, and includes a heat conduction board 31, a heat dissipation board 32 disposed in parallel with the heat conduction board 31, and a heat dissipation board 31 disposed between the heat conduction board 31 and the heat dissipation board 32 for connecting the heat conduction. The plate 31 and the side plate 33 of the heat dissipation plate 32, the heat conduction plate 31, the heat dissipation plate 32, and the side plate 33 are each made of a heat conductive material. The side of the heat conducting plate 31 adjacent to the PCB 1 is a plane, and the heat conduction A plurality of thermally conductive bumps 34 are spaced apart from one side of the board 31 away from the PCB 1. One side of the heat conducting plate 31 is planar to facilitate effective bonding with the PCB 1. The other side of the heat conducting plate 31 is provided with the heat conducting protrusion 34, which can increase the heat conducting plate 31 and the suction. The heat transfer area of the hot substance improves the heat transfer efficiency. The side of the heat dissipation plate 32 away from the PCB 1 is a plane, and the side of the heat dissipation plate 32 close to the PCB 1 is also a plane.

The shape of the heat conducting plate 31 is the same as the shape of the CPU 2. In this embodiment, the shape of the heat conducting plate 31 and the CPU 2 are both square, and the contact area between the heat conducting plate 31 and the PCB 1 is larger than The contact area of the CPU 2 and the PCB 1 is longer than the side length of the CPU 2 by 2 mm.

In the embodiment, the heat conductive material is copper having a high thermal conductivity, and the heat dissipation box 3 made of copper can effectively improve the heat conduction efficiency of the heat dissipation box 3. The heat absorbing material is water 5 having a large specific heat capacity. Specifically, the water 5 is a material having high heat stability, and has a larger heat capacity, which can absorb more heat and ensure that the performance does not change after heat absorption.

In another aspect, a terminal is provided, including a CPU 2 and a PCB 1. The CPU 2 is mounted on a side of the PCB 1, and further includes the CPU heat dissipation structure. The CPU heat dissipation structure is mounted on the PCB 1 opposite to the CPU 2 On one side of the terminal, a heat dissipation hole is defined in the outer casing of the terminal, and the heat dissipation box 3 in the heat dissipation structure of the CPU is located at one side of the heat dissipation hole. In this embodiment, the terminal is a tablet computer.

It is to be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles of the invention, and any changes or substitutions that are readily apparent to those skilled in the art are within the scope of the presently disclosed technology. All should be covered by the scope of the present invention.

Claims

A CPU heat dissipation structure, wherein the heat dissipation structure is mounted on a side of the PCB provided with the CPU opposite to the CPU;

The heat dissipation structure includes a heat absorbing material, the heat absorbing material is defined in the heat dissipation box, the heat dissipation box includes at least one heat conduction plate, the heat conduction plate is connected to the PCB, and the heat absorbing material and the heat conduction The board is in direct contact.
The CPU heat dissipation structure according to claim 1, wherein a plurality of heat conducting protrusions are disposed apart from one side of the heat conducting board away from the PCB.
The heat dissipation structure of a CPU according to claim 1, wherein the heat dissipation box adopts a box structure, and comprises a heat conduction plate, a heat dissipation plate disposed in parallel with the heat conduction plate, and the heat dissipation plate and the heat dissipation plate. The side plates between the heat dissipation plates for connecting the heat conduction plate and the heat dissipation plate, the heat conduction plate, the heat dissipation plate and the side plates are all made of a heat conductive material.
The heat dissipation structure of a CPU according to claim 3, wherein a plurality of heat conducting protrusions are disposed on a side of the heat dissipation plate adjacent to the PCB;

And/or, the heat dissipation plate is spaced apart from a side of the PCB to be provided with a plurality of heat conducting protrusions.
The heat dissipation structure of a CPU according to claim 3, wherein the heat conductive material is made of any one of silver, copper, gold, and aluminum, or two of silver, copper, gold, and aluminum or Two or more kinds of mixed materials, or an alloy material containing any one of silver, copper, gold, and aluminum.
The CPU heat dissipation structure according to claim 1, wherein a contact area of the heat conducting plate with the PCB is not less than a contact area of the CPU and the PCB.
A CPU heat dissipation structure according to claim 1, wherein the shape of the heat conduction plate is identical to the shape of the CPU.
A CPU heat dissipation structure according to claim 1, wherein said heat dissipation box is fixed to said PCB by soldering.
A CPU heat dissipation structure according to any one of claims 1 to 8, wherein the heat absorbing material is helium gas or water having a large specific heat capacity.
A terminal, comprising a CPU and a PCB, the CPU being mounted on a side of the PCB, characterized by further comprising a CPU heat dissipation structure according to any one of claims 1 to 9, wherein the CPU heat dissipation structure is installed on a side of the PCB opposite the CPU.