WO2016192141A1 - Oled材料真空热蒸镀用掩膜板 - Google Patents

Oled材料真空热蒸镀用掩膜板 Download PDF

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Publication number
WO2016192141A1
WO2016192141A1 PCT/CN2015/082029 CN2015082029W WO2016192141A1 WO 2016192141 A1 WO2016192141 A1 WO 2016192141A1 CN 2015082029 W CN2015082029 W CN 2015082029W WO 2016192141 A1 WO2016192141 A1 WO 2016192141A1
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Prior art keywords
mask
insert
mask frame
groove
thermal evaporation
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PCT/CN2015/082029
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English (en)
French (fr)
Inventor
匡友元
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/770,088 priority Critical patent/US20160359145A1/en
Publication of WO2016192141A1 publication Critical patent/WO2016192141A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of fabrication of organic light emitting diode displays, and more particularly to a mask for vacuum thermal evaporation of OLED materials.
  • OLED Organic Light Emitting Diode
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the functional material layer and the cathode metal layer film of the OLED are prepared by a vacuum thermal evaporation process, that is, the organic small molecular material is heated in a vacuum chamber to be sublimated or melted into a material vapor, and opened through a metal mask (Mask).
  • the holes are deposited on a glass substrate.
  • the role of the mask is to evaporate the OLED material to the design location, so the location, shape and surface flatness of the mask are important.
  • the conventional mask includes a mask frame 100 and a mask 200 fixed to the mask frame 100 by laser welding, and the solder joints 300 are located on the mask frame 100.
  • the mask After the mask is used for a period of time, a certain thickness of the OLED material is deposited on the upper side, which is liable to cause the mask to sag under the action of gravity, and the OLED material may also block the opening or reduce the effective size of the opening. Therefore, after a certain period of time, the mask needs to be cleaned and even replaced with a new mask.
  • the original mask When a new mask needs to be replaced, the original mask needs to be separated from the mask frame, the mask is removed, and the surface of the mask frame is polished. Because the original spot weld position should be raised, the mask frame surface needs to be ground to a flat surface (with a flatness of 50 microns). At the same time, in the original spot welding position, the heat during welding is equal to the heat treatment of the solder joint position, resulting in the hardness of the spot welding position becoming larger, so this hard layer needs to be removed by grinding so as not to affect the next mask.
  • the spot welding effect each grinding of the welding surface of the mask frame, requires a certain thickness (0.1-1mm).
  • the mask frame 100 is subjected to After repeated polishing, the thickness will gradually become thinner and the middle part will droop, which not only affects the structural strength of the frame, but also has a certain gap between the substrate and the mask during use, which also affects the alignment position of the mask 200 in the evaporation device, resulting in The OLED light-emitting element exhibits poor quality such as color mixing.
  • the mask frame After the mask frame is polished and polished to a certain thickness, it needs to be scrapped, and the mask frame needs to be transported to a manufacturer with a large polishing grinder for polishing and polishing, which is time consuming, so it is necessary to make a plurality of mask frames for use, resulting in production cost. increase.
  • the object of the present invention is to provide a mask for vacuum thermal evaporation of OLED materials, which can repeatedly use the mask frame to reduce the amount of waste of the mask frame, improve the utilization rate of the mask frame, and reduce the mask.
  • the number of backups of the border saves materials and production costs.
  • the present invention provides a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame, a insert fixed to the mask frame, and a mask fixed on the insert;
  • the mask frame includes four sides, and the four sides surround an opening corresponding to the mask; the surface of the mask frame adjacent to the mask side is defined as an upper surface, and each side of the mask frame is disposed on the side Groove
  • the insert is fixed in the groove, the upper surface of the insert is on the same plane as the upper surface of the groove; the mask is fixed on the insert by spot welding, and the solder joint is located on the insert on;
  • the width of the upper surface of the insert is less than the width of the insert within the groove.
  • the trench is located in a middle portion of each side of the mask frame, and the groove is recessed on an upper surface of the mask frame.
  • At least two first through holes are disposed under each of the grooves, the inserts are provided with a first threaded hole corresponding to the first through holes; a first screw is locked to the first through the first through holes Threaded into the hole to secure the insert within the groove.
  • the trench is located on an outer circumference of each side of the mask frame, and the groove is formed between an upper surface and an outer side surface of the mask frame.
  • At least two first through holes are disposed under each of the grooves, and the inserts are provided with a first threaded hole corresponding to the first through holes; each of the inserts is provided with at least two second passes in a width direction thereof a second threaded hole corresponding to the second through hole of the groove; a first screw is locked in the first threaded hole through the first through hole, and a second screw passes through the hole The second through hole is locked in the second threaded hole to fix the insert in the groove.
  • the insert forms a tight fit with the groove in size.
  • the cross section of the insert is a polygon or a polygon with a circular arc.
  • the insert has a trapezoidal cross section.
  • the insert and the mask frame are both metal materials.
  • the invention also provides a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame, a insert fixed on the frame of the mask, and a mask fixed on the insert;
  • the mask frame includes four sides, and the four sides surround an opening corresponding to the mask; the surface of the mask frame adjacent to the mask side is defined as an upper surface, and each side of the mask frame is disposed on the side Groove
  • the insert is fixed in the groove, the upper surface of the insert is on the same plane as the upper surface of the groove; the mask is fixed on the insert by spot welding, and the solder joint is located on the insert on;
  • the width of the upper surface of the insert is smaller than the width of the insert within the groove
  • the trench is located in a middle portion of each side of the mask frame, and the groove is recessed on an upper surface of the mask frame;
  • the insert forms a close fit with the groove in size
  • the insert and the mask frame are both metal materials.
  • the invention provides a mask for vacuum thermal evaporation of an OLED material, wherein grooves are respectively arranged on four sides of the mask frame, the insert is fixed in the groove, and the mask is passed through the point. Soldering is fixed on the insert; when the mask is deformed and needs to be replaced, the insert only needs to be taken out and polished, without the need to transport the entire mask frame to a manufacturer with a large polishing grinder for polishing and polishing. It saves time and effort, avoids the thinning of the mask frame caused by polishing and the scrapping caused by multiple polishing of the mask frame; when the insert is polished many times and the thickness is unqualified, the insert can be replaced.
  • the insert can be used to save material and production cost; the width of the upper surface of the insert is smaller than the width of the insert, so that the tension of the mask is distributed to the mask frame to the maximum extent to ensure The insert is not deformed and the mask is evenly stressed.
  • FIG. 1 is a schematic structural view of a mask for vacuum thermal evaporation of a conventional OLED material
  • FIG. 2 is a schematic cross-sectional structural view of a conventional mask for vacuum thermal evaporation of an OLED material
  • FIG. 3 is a schematic cross-sectional structural view of a conventional mask for vacuum thermal evaporation of an OLED material after being polished for a plurality of times;
  • FIG. 4 is a top plan view showing a first embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention
  • FIG. 5 is a top plan view of a mask frame and a cutting insert of a first embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention
  • FIG. 6 is a schematic cross-sectional view showing a corresponding first through hole in a first embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention
  • FIG. 7 is a top plan view showing a mask frame and a cutting insert of a second embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention
  • FIG. 8 is a schematic cross-sectional view showing a first through hole and a second through hole in a second embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention.
  • the present invention provides a first embodiment of a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame 1 , an insert 3 fixed on the mask frame 1 , and a mask 5 fixed on the insert 3;
  • the mask frame 1 includes four sides, and the four sides surround an opening corresponding to the mask 5; the surface of the mask frame 1 near the side of the mask 5 is defined as an upper surface, and each of the mask frames 1 a groove 11 is provided on each side;
  • the insert 3 is fixed in the groove 11, and the upper surface of the insert 3 is on the same plane as the upper surface of the groove 11; the mask 5 is fixed to the insert 3 by spot welding. , the solder joint 7 is located on the insert 3;
  • the width of the upper surface of the insert 3 is smaller than the width of the insert 3 in the groove 11 to maximize the dispersion of the tension of the mask 5 welded to the insert 3 to
  • the mask frame 1 is placed to ensure that the insert 3 is not deformed and the mask 5 is uniformly stressed.
  • the shape of the insert 3 is adapted to the internal space of the groove 11, and the insert 3 and the groove 11 form a close fit in size.
  • the trench 11 is located in the middle of each side of the mask frame 1, and the trench 11 is recessed on the upper surface of the mask frame 1.
  • At least two first through holes 13 are disposed under each of the grooves 11.
  • the inserts 3 are provided with a first threaded hole 33 corresponding to the first through holes 13; a first screw 91 passes through the first through hole The hole 13 is fitted into the first threaded hole 33 to fix the insert 3 in the groove 11.
  • the cross section of the insert 3 is a polygon or a polygon with a circular arc.
  • the insert 3 has a trapezoidal cross section.
  • the insert 3 and the mask frame 1 are both metal materials.
  • FIG. 7 to FIG. 8 are schematic structural diagrams of a second embodiment of a mask for vacuum thermal evaporation of an OLED material according to the present invention, which is different from the first embodiment in that the trench 11 is located at The outer periphery of each side of the mask frame 1 is formed between the upper surface and the outer side of the mask frame 1; the insert 3 is located on the outer periphery of the mask frame 1 for convenient installation and removal. .
  • the outer side of the insert without the mask frame body is restricted, so that in addition to fixing from below, it is also necessary to fix from the side to strengthen the fixing. Therefore, at least two first through holes 13 are provided under each of the grooves 11, the inserts 3 are provided with first threaded holes 33 corresponding to the first through holes 13; and each insert 3 is in the width direction thereof The second through hole 35 is disposed on the side of the groove 11 corresponding to the second through hole 35. The first screw 91 is locked through the first through hole 13 In the first threaded hole 33, a second screw 92 is inserted into the second threaded hole 15 through the second through hole 35, thereby fixing the insert 3 in the groove 11.
  • the mask 5 when the mask 5 is deformed and needs to be replaced, it is only necessary to remove the insert 3 for polishing, without the need to transport the entire mask frame 1 to a manufacturer having a large polishing grinder for polishing and polishing.
  • the operation is simple, saves time and labor, and avoids thinning of the mask frame 1 caused by polishing and scrapping due to multiple polishing of the mask frame 1; when the insert 3 is polished a plurality of times and the thickness is unqualified, It is sufficient to replace the new insert 3 without scrapping the entire mask frame 1 so that the mask frame 1 can be repeatedly used multiple times, reducing the scrap amount of the mask frame 1 and prolonging the use period of the mask frame and improving the use period of the mask frame.
  • the utilization rate of the mask frame 1 saves material and production cost; and the width of the upper surface of the insert 3 is smaller than the width of the insert 3, and the tension of the mask 3 can be distributed to the mask frame 1 to the maximum extent, thereby ensuring The insert 3 is not deformed and the mask 5 is evenly stressed.
  • the mask for vacuum thermal evaporation of the above OLED material is applied to vapor deposition of an OLED organic material and an inorganic material such as lithium fluoride (LiF).
  • an inorganic material such as lithium fluoride (LiF).
  • the mask can also be applied to other fields of vacuum thermal evaporation.
  • the mask for vacuum thermal evaporation of the OLED material of the present invention is provided with grooves on the four sides of the mask frame, the insert is fixed in the groove, and the mask is fixed by spot welding. On the strip; when the mask deformation needs to be replaced, it is only necessary to take out the insert and polish it. It is not necessary to transport the entire mask frame to a manufacturer with a large polishing grinder for polishing and polishing, which is simple in operation, saves time and labor, and avoids thinning of the mask frame caused by polishing and due to multiple polishing of the mask frame.
  • the insert When the insert is polished several times and the thickness is unqualified, the insert can be replaced without scrapping the entire mask frame, so that the mask frame can be repeatedly used multiple times, reducing the scrap amount of the mask frame and improving
  • the utilization of the mask frame can reduce the number of backups of the mask frame, and only need to back up several sets of inserts, saving material and production cost; the width of the upper surface of the insert is smaller than the width of the groove. Therefore, the tension of the mask is dispersed to the mask frame to the maximum extent to ensure that the insert is not deformed and the mask is uniformly stressed.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框（1）、固定于所述掩膜边框（1）上的插条（3）及固定于所述插条（3）上的掩膜（5）；所述掩膜边框（1）包括四条边，该四条边围拢出一对应掩膜（5）的开口；将所述掩膜边框（1）靠近掩膜（5）一侧的表面定义为上表面，掩膜边框（1）的每条边上均设置一沟槽（11）；所述插条（3）固定于所述沟槽（11）内，所述插条（3）的上表面与所述沟槽（11）的上表面处于同一平面上；所述掩膜（5）通过点焊固定于插条（3）上，焊点（7）位于插条（3）上；所述插条（3）的上表面的宽度小于所述插条（3）位于所述沟槽（11）内的宽度；当掩膜变形需要更换时，仅需将插条取出进行抛光或更换插条即可，掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，节约材料及生产成本；掩膜张力可以最大程度传递到掩膜边框上，保证插条不形变及掩膜受力均匀。

Description

OLED材料真空热蒸镀用掩膜板 技术领域
本发明涉及有机发光二极管显示器的制作领域，尤其涉及一种OLED材料真空热蒸镀用掩膜板。
背景技术
有机发光二级管显示器(Organic Light Emitting Diode，OLED)是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。OLED各功能材料层与阴极金属层薄膜通过真空热蒸镀工艺制备，即在真空腔体内加热有机小分子材料，使其升华或者熔融气化成材料蒸汽，透过金属掩膜板(Mask)的开孔沉积在玻璃基板上。掩膜板的作用是使OLED材料蒸镀到设计的位置，因此掩膜板的开孔位置、形状以及表面平整度都相当重要。
如图1所示，现有掩膜板包括掩膜框架100和通过激光电焊固定在掩膜框架100上的掩膜200，焊点300位于掩膜框架100上。掩膜在使用一段时间后，上边会沉积一定厚度的OLED材料，在重力作用下容易导致掩膜下垂变形，而且OLED材料也可能堵塞开孔，或者使开孔有效尺寸变小。所以，掩膜在使用一定的时间后，就需要进行清洗，甚至要更换一张新的掩膜。
当需要更换一张新的掩膜时，需要把原来的掩膜与掩膜边框分离，去掉掩膜，并对掩膜边框表面进行研磨抛光。因为原来的点焊位置应该有凸起，需要将掩膜边框表面研磨成平面(平面度在50微米内)。同时，在原来的点焊位置，焊接时的热量也等于是给焊点位置进行了热处理，导致点焊位置硬度变大，所以这一层硬化层也需要研磨去掉，以便不影响下一片掩膜的点焊效果，每对掩膜边框的焊接面进行一次打磨，就要消耗一定厚度(0.1-1mm)。
这样的情况下，如图2、图3所示，多次更换掩膜后，掩膜边框100经 过多次抛光，厚度会逐渐变薄，中部下垂，不仅影响到边框的结构强度，使用时基板与掩膜存在一定空隙，也会影响到掩膜200在蒸镀设备里的对位位置，导致OLED发光元件出现混色等品质不良。所以，掩膜边框经过研磨抛光一定的厚度后就需要报废，并且掩膜边框需要运输到有大型抛光磨床的厂家进行研磨抛光，比较耗时，所以需要制作多块掩膜边框备用，导致生产成本增加。
发明内容
本发明的目的在于提供一种OLED材料真空热蒸镀用掩膜板，其掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，节约材料及生产成本。
为实现上述目的，本发明提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边上均设置一沟槽；
所述插条固定于所述沟槽内，所述插条的上表面与所述沟槽的上表处于同一平面上；所述掩膜通过点焊固定于插条上，焊点位于插条上；
所述插条的上表面的宽度小于所述插条位于所述沟槽内的宽度。
所述沟槽位于所述掩膜边框的每条边的中部，所述沟槽凹陷于所述掩膜边框的上表面。
每条沟槽下方设有至少两个第一通孔，所述插条对应所述第一通孔设有一第一螺纹孔；一第一螺钉穿过所述第一通孔锁合于第一螺纹孔内，从而将所述插条固定于所述沟槽内。
所述沟槽位于所述掩膜边框的每条边的外周，所述沟槽形成于所述掩膜边框的上表面与外侧面之间。
每条沟槽下方设有至少两个第一通孔，所述插条对应所述第一通孔设有一第一螺纹孔；每条插条在其宽度方向上设有至少两个第二通孔，所述沟槽侧方对应所述第二通孔设有第二螺纹孔；一第一螺钉穿过所述第一通孔锁合于第一螺纹孔内，一第二螺钉穿过所述第二通孔锁合于第二螺纹孔内，从而将所述插条固定于所述沟槽内。
所述插条与所述沟槽在尺寸上形成紧密配合。
所述插条的横截面为多边形或带有圆弧的多边形。
所述插条的横截面为梯形。
所述插条与所述掩膜边框均为金属材料。
本发明还提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边上均设置一沟槽；
所述插条固定于所述沟槽内，所述插条的上表面与所述沟槽的上表处于同一平面上；所述掩膜通过点焊固定于插条上，焊点位于插条上；
所述插条的上表面的宽度小于所述插条位于所述沟槽内的宽度；
其中，所述沟槽位于所述掩膜边框的每条边的中部，所述沟槽凹陷于所述掩膜边框的上表面；
其中，所述插条与所述沟槽在尺寸上形成紧密配合；
其中，所述插条与所述掩膜边框均为金属材料。
本发明的有益效果：本发明提供的一种OLED材料真空热蒸镀用掩膜板，在掩膜边框的四条边上分别设置沟槽，将插条固定于沟槽内，将掩膜通过点焊固定于插条上；当掩膜变形需要更换时，仅需要将插条取出并进行抛光处理即可，而不需要将整个掩膜边框运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框厚度变薄及由于对掩膜边框多次抛光导致的报废；当插条经多次抛光，厚度不合格时，更换插条即可，而不需要将整个掩膜边框报废，从而掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，只需多备份几套插条即可，节约材料及生产成本；插条的上表面的宽度小于其位于沟槽内的宽度，从而掩膜的张力最大程度分散传递至掩膜框架上，以保证插条不形变及掩膜受力均匀。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的OLED材料真空热蒸镀用掩膜板的结构示意图；
图2为现有的OLED材料真空热蒸镀用掩膜板正常情况下的剖面结构示意图；
图3为现有的OLED材料真空热蒸镀用掩膜板经过多次打磨后的剖面结构示意图；
图4为本发明OLED材料真空热蒸镀用掩膜板的第一实施例的俯视示意图；
图5为本发明OLED材料真空热蒸镀用掩膜板的第一实施例的掩膜边框与插条的俯视示意图；
图6为本发明OLED材料真空热蒸镀用掩膜板的第一实施例中对应第一通孔处的剖面示意图；
图7为本发明OLED材料真空热蒸镀用掩膜板的第二实施例的掩膜边框与插条的俯视示意图；
图8为本发明OLED材料真空热蒸镀用掩膜板的第二实施例中对应第一通孔及第二通孔处的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图4至图6，本发明提供一种OLED材料真空热蒸镀用掩膜板第一实施例，包括掩膜边框1、固定于所述掩膜边框1上的插条3、及固定于所述插条3上的掩膜5；
所述掩膜边框1包括四条边，该四条边围拢出一对应掩膜5的开口；将所述掩膜边框1靠近掩膜5一侧的表面定义为上表面，掩膜边框1的每条边上均设置一沟槽11；
所述插条3固定于所述沟槽11内，所述插条3的上表面与所述沟槽11的上表处于同一平面上；所述掩膜5通过点焊固定于插条3上，焊点7位于插条3上；
具体的，所述插条3的上表面的宽度小于所述插条3位于所述沟槽11内的宽度，以使焊接于所述插条3上的掩膜5的张力最大程度分散传递至掩膜框架1上，来保证插条3不形变及掩膜5受力均匀。
具体地，所述插条3的形状与所述沟槽11的内部空间相适应，所述插条3与所述沟槽11在尺寸上形成紧密配合。
具体地，所述沟槽11位于所述掩膜边框1的每条边的中部，所述沟槽11凹陷于所述掩膜边框1的上表面。
每条沟槽11下方设有至少两个第一通孔13，所述插条3对应所述第一通孔13设有一第一螺纹孔33；一第一螺钉91穿过所述第一通孔13锁合于第一螺纹孔33内，从而将所述插条3固定于所述沟槽11内。
具体地，所述插条3的横截面为多边形或带有圆弧的多边形。
优选地，在该第一实施例中，所述插条3的横截面为梯形。
具体地，所述插条3与所述掩膜边框1均为金属材料。
请同时参阅图7至图8，为本发明的OLED材料真空热蒸镀用掩膜板的第二实施例的结构示意图，与第一实施例的不同之处在于，所述沟槽11位于所述掩膜边框1的每条边的外周，所述沟槽11形成形成于所述掩膜边框1的上表面与外侧面之间；插条3位于掩膜边框1的外周，方便安装及拆除。
本实施例中，插条外侧无掩膜框本体进行限制，故除从下方进行固定外，还需从侧面进行固定，从而加强固定。因此，每条沟槽11下方设有至少两个第一通孔13，所述插条3对应所述第一通孔13设有第一螺纹孔33；且每条插条3在其宽度方向上设有至少两个第二通孔35，所述沟槽11侧方对应所述第二通孔35设有第二螺纹孔15；一第一螺钉91穿过所述第一通孔13锁合于第一螺纹孔33内，一第二螺钉92穿过所述第二通孔35锁合于第二螺纹孔15内，从而将所述插条3固定于所述沟槽11内。
采用上述结构，当所述掩膜5变形需要更换时，仅需将插条3取下进行抛光处理即可，而不需要将整个掩膜边框1运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框1厚度变薄及由于对掩膜边框1多次抛光导致的报废；当所述插条3经多次抛光，厚度不合格时，更换新的插条3即可，而不需要将整个掩膜边框1报废，从而使掩膜边框1能够重复多次使用，减少掩膜边框1的报废量，延长掩膜边框的使用周期，提高掩膜边框1的利用率，节约材料及生产成本；且插条3的上表面的宽度小于插条3的宽度，则掩膜3的张力最大程度可以分散传递至掩膜框架1上，从而保证了插条3不形变及掩膜5受力均匀。
上述OLED材料真空热蒸镀用掩膜板应用于OLED有机材料以及氟化锂(LiF)等无机材料的蒸镀。当然，该掩膜板也可应用于其它真空热蒸镀领域。
综上所述，本发明的OLED材料真空热蒸镀用掩膜板，在掩膜边框的四条边上分别设置沟槽，将插条固定于沟槽内，将掩膜通过点焊固定于插条上；当掩膜变形需要更换时，仅需要将插条取出并进行抛光处理即可， 而不需要将整个掩膜边框运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框厚度变薄及由于对掩膜边框多次抛光导致的报废；当插条经多次抛光，厚度不合格时，更换插条即可，而不需要将整个掩膜边框报废，从而掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，只需多备份几套插条即可，节约材料及生产成本；插条的上表面的宽度小于其位于沟槽内的宽度，从而掩膜的张力最大程度分散传递至掩膜框架上，以保证插条不形变及掩膜受力均匀。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
    所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边上均设置一沟槽；
    所述插条固定于所述沟槽内，所述插条的上表面与所述沟槽的上表处于同一平面上；所述掩膜通过点焊固定于插条上，焊点位于插条上；
    所述插条的上表面的宽度小于所述插条位于所述沟槽内的宽度。
  2. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述沟槽位于所述掩膜边框的每条边的中部，所述沟槽凹陷于所述掩膜边框的上表面。
  3. 如权利要求2所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方设有至少两个第一通孔，所述插条对应所述第一通孔设有一第一螺纹孔；一第一螺钉穿过所述第一通孔锁合于第一螺纹孔内，从而将所述插条固定于所述沟槽内。
  4. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述沟槽位于所述掩膜边框的每条边的外周，所述沟槽形成于所述掩膜边框的上表面与外侧面之间。
  5. 如权利要求4所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方设有至少两个第一通孔，所述插条对应所述第一通孔设有螺纹孔；每条插条在其宽度方向上设有至少两个第二通孔，所述沟槽侧方对应所述第二通孔设有第二螺纹孔；一第一螺钉穿过所述第一通孔锁合于第一螺纹孔内，一第二螺钉穿过所述第二通孔锁合于第二螺纹孔内，从而将所述插条固定于所述沟槽内。
  6. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条与所述沟槽在尺寸上形成紧密配合。
  7. 如权利要求6所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条的横截面为多边形或带有圆弧的多边形。
  8. 如权利要求7所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条的横截面为梯形。
  9. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述 插条与所述掩膜边框均为金属材料。
  10. 一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
    所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边上均设置一沟槽；
    所述插条固定于所述沟槽内，所述插条的上表面与所述沟槽的上表处于同一平面上；所述掩膜通过点焊固定于插条上，焊点位于插条上；
    所述插条的上表面的宽度小于所述插条位于所述沟槽内的宽度；
    其中，所述沟槽位于所述掩膜边框的每条边的中部，所述沟槽凹陷于所述掩膜边框的上表面；
    其中，所述插条与所述沟槽在尺寸上形成紧密配合；
    其中，所述插条与所述掩膜边框均为金属材料。
  11. 如权利要求10所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方设有至少两个第一通孔，所述插条对应所述第一通孔设有一第一螺纹孔；一第一螺钉穿过所述第一通孔锁合于第一螺纹孔内，从而将所述插条固定于所述沟槽内。
  12. 如权利要求10所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条的横截面为多边形或带有圆弧的多边形。
  13. 如权利要求12所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条的横截面为梯形。
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