WO2016189351A1 - A waterproof cooling device - Google Patents

A waterproof cooling device Download PDF

Info

Publication number
WO2016189351A1
WO2016189351A1 PCT/IB2015/053863 IB2015053863W WO2016189351A1 WO 2016189351 A1 WO2016189351 A1 WO 2016189351A1 IB 2015053863 W IB2015053863 W IB 2015053863W WO 2016189351 A1 WO2016189351 A1 WO 2016189351A1
Authority
WO
WIPO (PCT)
Prior art keywords
chassis
cooling device
plate
electronic
waterproof cooling
Prior art date
Application number
PCT/IB2015/053863
Other languages
French (fr)
Inventor
Ali Murtaza DALGIC
Original Assignee
Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi filed Critical Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
Priority to TR2017/17188T priority Critical patent/TR201717188T6/en
Priority to PCT/IB2015/053863 priority patent/WO2016189351A1/en
Publication of WO2016189351A1 publication Critical patent/WO2016189351A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

Definitions

  • the present invention relates to a waterproof cooling device capable of cooling all surfaces of electronic boards with combination of conduction and convection.
  • High power dissipating electronic assemblies require cooling air to be directed through a compact heat exchanger.
  • This usually consists of a pair of printed circuit boards which may be bonded, or more likely fastened together by means of a frame positioned between the two modules. It is necessary to provide a reliable seal at each end of these modules to prevent leakage of any cooling air between the electronics rack and the removable module. Such leakage can have drastic effect on the system's thermal performance and overall reliability.
  • an air seal between an electronics rack and the removable electronics module that also provides a means to ensure low deflections during vibration through use of a fixed boundary condition. It is also desirable to have a sealing system which is resistant to jamming and misalignment and conducive to maintenance and repair. It is further preferred to have a sliding air seal which is cost effective and resistant to corrosive environmental conditions.
  • Avionics electronic board chassis are cooled using a current of cool air circulating under the chassis.
  • Each chassis is allocated a portion of the total flow of this current of cool air, notably according to the power that it dissipates, in order to cool it.
  • This cool air is injected into the chassis and cooled electronic boards without leak tightness property.
  • Each board has to comply with constraints of head loss introduced on the current of cool air.
  • cooling designs consisted of only convection or conduction cooling method separately and these cooling techniques do not hove waterproof property.
  • a system may include a chassis having a pair of stationary rails mechanically coupled thereto. Each stationary rail may receive a corresponding telescoping sliding rail. Each stationary rail/sliding rail combination may be configured to convey a cooling fluid to or from a heat exchanger.
  • the system may include a first stationary rail configured mechanically couple to a chassis fluidically couple to a first external fluidic conduit such that the first stationary rail may receive a cooling fluid from the first external fluidic conduit and conduct the cooling liquid internally from the first external fluidic conduit through at least a portion of the first stationary rail.
  • EP2106205A2 discloses an electronics housing system adapted for electronic devices includes a main chassis unit and at least one removable module mountable with the base unit for supporting electronic circuitry components electro-optically coupled with the base unit. Furthermore, the module mounting assembly or wall of the electronics rack or main chassis housing includes a pair of guide rails extending from the module mounting assembly or wall forming a U-shaped channel between the pair of guide rails for receiving one of the mounting edges of the removable module assembly.
  • An objective of the present invention is to realize a waterproof cooling device which cools electronic boards with fluid by using conduction and convection method together.
  • a further objective of the present invention to realize a waterproof cooling device which has sealed and integrated chassis which reduces cost, tooling, and manufacturing complexity.
  • a further objective of the present invention is to realize a waterproof cooling device which can be low sound level.
  • Figure 1 shows a perspective view of the waterproof cooling device
  • Figure 2 shows a perspective view of the waterproof cooling device with fan
  • FIG 3 shows a perspective view of the waterproof cooling device with boards
  • Figure 4 shows a cross-sectional view of the waterproof cooling device
  • Electronic board waterproof cooling device (1) comprises
  • At least one wedge lock (3) which holds and guides the electronic board (B),
  • At least one blower fan (4) which is placed on a face of the chassis (2), at least one plate (5) which is placed near the electronic board (B) and extends from one end to the other end of the chassis (2),
  • At least one channel (6) which is placed inside the plate (5) and through which the fluid pass.
  • the waterproof cooling device (1) cools electronic boards (B) which are inside of sealed the chassis (2).
  • the waterproof cooling device (1) is made up of chassis (2), wedge lock (3), blower fan (4), plate (5) and fluid channel (6).
  • the chassis (2) which has a sealed property, is the form of a box shape and it made of aluminium optionally. Electrical electronic boards (B) are placed inside the chassis (2) by using wedge lock (3). Wedge locks (3) is placed edge of electronic boards and it is connected chassis (2) inside wall by using fastener or weld method optionally.
  • Blower fan (4) is placed on a face of chassis (2) and fan (4) is used to heat dissipation of the chassis (2).
  • a flat shape plate (5) is integrated into the chassis (2).
  • the plate (5) which extends from one end to the other end of the chassis (2), placed in front of the electronic board (B) and behind the electronic board (B).
  • the plate (5) and chassis (2) made of aluminum optionally, are produced together.
  • the channel (6) has a pipe shape optionally and the channel (6) placed inside the plate (5) extends from one end to the other end of the plate (5). Furthermore, air flow passes through the channel (6).
  • the waterproof cooling device (1) adapted to provide cooling electronic board (B) by using air flow which passes through the fluid channel (6).
  • the electronic boards (B) are placed into sealed chassis (2) with wedge lock (3).
  • the chassis (2) and plate (5) are produced together and they made of aluminium optionally.
  • the channel (6) is placed into the plate (5).
  • self heating electronic boards (B) which should be cooled for high performance so the electronic boards (B)'s heat is transferred to plate (5) which is positioned in front of the electronic board (B) and behind the electronic board (B).
  • Fan (4) is placed one side of chassis (2) and at the end of the channel (6).
  • the heat of plate (5) is transferred to air which is passed inside the channel (6). Heat fluid is ejected from chassis (2) thanks to fan (4) and cooling operation of electronic boards (B) is occurred.
  • wedge lock (3) which is used to lock and mount electronic boards (B) on chassis (2), absorb heat of the electronic boards (B) and wedge lock (3) is transferring to heat on chassis (2) side walls. As a result of that, cooling operation of electronic boards (B) is occurred.
  • thermal pad is placed on electronic boards (B) to improve heat transfer of the system.

Abstract

The present invention relates to a waterproof cooling device (1), cooling the electronic boards (B), comprising at least one chassis (2), at least one wedge lock (3), which holds and guides the electronic board (B), at least one blower fan (4) which is placed on a face of the chassis (2), at least one plate (5) which is placed near the electronic board (B) and extends from one end to the other end of the chassis (2), at least one channel (6) which is placed inside the plate (5) and through which the fluid pass.

Description

DESCRIPTION
A WATERPROOF COOLING DEVICE
Field of the Invention
The present invention relates to a waterproof cooling device capable of cooling all surfaces of electronic boards with combination of conduction and convection.
Background of the Invention
High power dissipating electronic assemblies require cooling air to be directed through a compact heat exchanger. This usually consists of a pair of printed circuit boards which may be bonded, or more likely fastened together by means of a frame positioned between the two modules. It is necessary to provide a reliable seal at each end of these modules to prevent leakage of any cooling air between the electronics rack and the removable module. Such leakage can have drastic effect on the system's thermal performance and overall reliability.
It is desirable to have an air seal between an electronics rack and the removable electronics module that also provides a means to ensure low deflections during vibration through use of a fixed boundary condition. It is also desirable to have a sealing system which is resistant to jamming and misalignment and conducive to maintenance and repair. It is further preferred to have a sliding air seal which is cost effective and resistant to corrosive environmental conditions.
In the state of the art for air cooling of removable electronic units use an elastomeric seal which is vulcanized into a channel shaped guide. This has proven to be a difficult method to manufacture the seal.
In the state of the art for air cooling of removable electronic units also use silicone as the material for the seals which are damaged by exposure to solvents and petrochemical agents. In the state of the art for air cooling of removable electronic units utilize difficult to manufacture airseals that are difficult to field replace and are not resistant to chemical environments.
Avionics electronic board chassis are cooled using a current of cool air circulating under the chassis. Each chassis is allocated a portion of the total flow of this current of cool air, notably according to the power that it dissipates, in order to cool it. This cool air is injected into the chassis and cooled electronic boards without leak tightness property. Each board has to comply with constraints of head loss introduced on the current of cool air.
In the state of the art, cooling designs consisted of only convection or conduction cooling method separately and these cooling techniques do not hove waterproof property.
In the state of the art, most of the air cooling devices for avionics chassis have more than one fan with high pressure drop which causes loud noise. Furthermore, these cooling devices consist of many complicated parts which cause difficulty during assembly.
The United States patent document numbered US20150090425 A 1 discloses a system may include a chassis having a pair of stationary rails mechanically coupled thereto. Each stationary rail may receive a corresponding telescoping sliding rail. Each stationary rail/sliding rail combination may be configured to convey a cooling fluid to or from a heat exchanger. The system may include a first stationary rail configured mechanically couple to a chassis fluidically couple to a first external fluidic conduit such that the first stationary rail may receive a cooling fluid from the first external fluidic conduit and conduct the cooling liquid internally from the first external fluidic conduit through at least a portion of the first stationary rail. The European Patent document numbered EP2106205A2 discloses an electronics housing system adapted for electronic devices includes a main chassis unit and at least one removable module mountable with the base unit for supporting electronic circuitry components electro-optically coupled with the base unit. Furthermore, the module mounting assembly or wall of the electronics rack or main chassis housing includes a pair of guide rails extending from the module mounting assembly or wall forming a U-shaped channel between the pair of guide rails for receiving one of the mounting edges of the removable module assembly.
Summary of the Invention
An objective of the present invention is to realize a waterproof cooling device which cools electronic boards with fluid by using conduction and convection method together.
A further objective of the present invention to realize a waterproof cooling device which has sealed and integrated chassis which reduces cost, tooling, and manufacturing complexity.
A further objective of the present invention is to realize a waterproof cooling device which can be low sound level.
Detailed Description of the Invention
A realized to fulfil the objective of the present invention is illustrated in the accompanying figures, in which:
Figure 1 shows a perspective view of the waterproof cooling device
Figure 2 shows a perspective view of the waterproof cooling device with fan
Figure 3 shows a perspective view of the waterproof cooling device with boards Figure 4 shows a cross-sectional view of the waterproof cooling device
The parts illustrated in the figures are individually numbered where the numbers refer to the following:
1. Waterproof cooling device
2. Chassis
3. Wedge lock
4. Blower fan
5. Plate
6. Channel
B. Electronic board waterproof cooling device (1) comprises
at least one chassis (2),
at least one wedge lock (3), which holds and guides the electronic board (B),
at least one blower fan (4) which is placed on a face of the chassis (2), at least one plate (5) which is placed near the electronic board (B) and extends from one end to the other end of the chassis (2),
at least one channel (6) which is placed inside the plate (5) and through which the fluid pass.
The electronic boards (B), which is placed inside of the chassis (2), should be cooled to operate with a high efficiency. To realize cooling operation of electronic boards (B), heat dissipation of electronic boards (B) should be out of chassis (2). The waterproof cooling device (1) cools electronic boards (B) which are inside of sealed the chassis (2). The waterproof cooling device (1) is made up of chassis (2), wedge lock (3), blower fan (4), plate (5) and fluid channel (6). The chassis (2), which has a sealed property, is the form of a box shape and it made of aluminium optionally. Electrical electronic boards (B) are placed inside the chassis (2) by using wedge lock (3). Wedge locks (3) is placed edge of electronic boards and it is connected chassis (2) inside wall by using fastener or weld method optionally. Blower fan (4) is placed on a face of chassis (2) and fan (4) is used to heat dissipation of the chassis (2). A flat shape plate (5) is integrated into the chassis (2). The plate (5), which extends from one end to the other end of the chassis (2), placed in front of the electronic board (B) and behind the electronic board (B). In the preferred embodiment of the invention, the plate (5) and chassis (2), made of aluminum optionally, are produced together. The channel (6) has a pipe shape optionally and the channel (6) placed inside the plate (5) extends from one end to the other end of the plate (5). Furthermore, air flow passes through the channel (6). The waterproof cooling device (1) adapted to provide cooling electronic board (B) by using air flow which passes through the fluid channel (6).
The electronic boards (B) are placed into sealed chassis (2) with wedge lock (3). The chassis (2) and plate (5) are produced together and they made of aluminium optionally. The channel (6) is placed into the plate (5). During operation self heating electronic boards (B) which should be cooled for high performance so the electronic boards (B)'s heat is transferred to plate (5) which is positioned in front of the electronic board (B) and behind the electronic board (B). There is channel (6) inside of plate (5). Fan (4) is placed one side of chassis (2) and at the end of the channel (6). The heat of plate (5) is transferred to air which is passed inside the channel (6). Heat fluid is ejected from chassis (2) thanks to fan (4) and cooling operation of electronic boards (B) is occurred.
In the preferred embodiment of the invention, wedge lock (3), which is used to lock and mount electronic boards (B) on chassis (2), absorb heat of the electronic boards (B) and wedge lock (3) is transferring to heat on chassis (2) side walls. As a result of that, cooling operation of electronic boards (B) is occurred. In the preferred embodiment of the invention, thermal pad is placed on electronic boards (B) to improve heat transfer of the system. Within the scope of these basic concepts, it is possible to develop a wide variety of embodiments of the waterproof cooling device (1). The invention cannot be limited to the examples described herein; it is essentially according to the claims.

Claims

A waterproof cooling device (1) cooling an electronic board (B), comprising
at least one chassis (2),
at least one wedge lock (3), which holds and guides the electronic board (B),
at least one blower fan (4) which is placed on a face of the chassis (2)
and characterized by
at least one plate (5) which is placed near the electronic board (B) and extends from one end to the other end of the chassis (2), at least one channel (6) which is placed inside the plate (5) and through which the fluid pass.
A waterproof cooling device (1) according to Claim 1, characterized by the plate (5) which is integrated into the chassis (2).
A waterproof cooling device (1) according to Claim 1, characterized by the plate (5), which extends from one end to the other end of the chassis (2), placed in front of the electronic board (B) and behind the electronic board (B).
A waterproof cooling device (1) according to Claim 1, characterized by the channel (6) which extends inside from one end to the other end of the plate (5) to improve heat transfer of the system.
A waterproof cooling device (1) according to Claim 1, characterized by the wedge lock (3) which is used to lock and mount the electronic boards (B) on the chassis (2) to absorb and transfer heat of the electronic boards (B).
6. A waterproof cooling device (1) according to Claim 1, characterized by the chassis (2) which is made of aluminium.
PCT/IB2015/053863 2015-05-25 2015-05-25 A waterproof cooling device WO2016189351A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TR2017/17188T TR201717188T6 (en) 2015-05-25 2015-05-25 A cooling device
PCT/IB2015/053863 WO2016189351A1 (en) 2015-05-25 2015-05-25 A waterproof cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2015/053863 WO2016189351A1 (en) 2015-05-25 2015-05-25 A waterproof cooling device

Publications (1)

Publication Number Publication Date
WO2016189351A1 true WO2016189351A1 (en) 2016-12-01

Family

ID=53510932

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2015/053863 WO2016189351A1 (en) 2015-05-25 2015-05-25 A waterproof cooling device

Country Status (2)

Country Link
TR (1) TR201717188T6 (en)
WO (1) WO2016189351A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060133033A1 (en) * 2004-12-20 2006-06-22 Harris Corporation Heat exchanger system for circuit card assemblies
EP2071912A2 (en) * 2007-12-11 2009-06-17 Honeywell International Inc. Means to utilize conduction-cooled electronics modules in an air cooled system
EP2106205A2 (en) 2008-03-06 2009-09-30 Northrop Grumman Systems Corporation Ruggedized, self aligning, sliding air seal for removable electronic units
EP2804456A2 (en) * 2013-05-15 2014-11-19 DY 4 Systems Inc. Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module
US20150090425A1 (en) 2011-10-28 2015-04-02 Dell Products L.P. System and method for cooling information handling resources

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060133033A1 (en) * 2004-12-20 2006-06-22 Harris Corporation Heat exchanger system for circuit card assemblies
EP2071912A2 (en) * 2007-12-11 2009-06-17 Honeywell International Inc. Means to utilize conduction-cooled electronics modules in an air cooled system
EP2106205A2 (en) 2008-03-06 2009-09-30 Northrop Grumman Systems Corporation Ruggedized, self aligning, sliding air seal for removable electronic units
US20150090425A1 (en) 2011-10-28 2015-04-02 Dell Products L.P. System and method for cooling information handling resources
EP2804456A2 (en) * 2013-05-15 2014-11-19 DY 4 Systems Inc. Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module

Also Published As

Publication number Publication date
TR201717188T6 (en) 2017-12-21

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