JP2015133471A - Electronic device housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device housing which reduces heat resistance occurring from a heating part to cooling air and thereby efficiently cools boards.SOLUTION: An electronic device housing 1 according to one embodiment is an indirect air cooling type electronic device housing in which multiple boards 2 of an electronic circuit module are stored in a box shaped chassis 4. Communication walls 34, each of which has an air duct 35 formed in a wall, are disposed at positions facing the boards 2, and the communication walls 34 are placed in contact with the boards 2.

Description

  Embodiments described herein relate generally to an electronic device casing.

  In an electronic device that houses boards of multiple electronic circuit modules such as standard boards such as VME, and in cases that are used in places with poor environmental conditions such as onboard aircraft or in vehicles, it is indirectly so that outside air does not hit the board directly In many cases, a typical air cooling method is adopted. The indirect air-cooled case has a ventilation structure with fins built in the side wall of the case. Then, heat generated in the board is transferred to the board end by conduction, and moved to the housing side wall via the card holder at the board end, and heat is released from the housing side wall to the ventilation air. Therefore, the heat of the board is moved to the end of the board by the heat conduction plate and cooled by the side wall.

JP-A-7-212479

  The processing capacity of each calculation processing board such as a CPU board has been increasing year by year, and the amount of heat generated has been increasing. Furthermore, the processing capability required as equipment is required to be high with the integration processing. Along with this, there is a problem that the conventional indirect air cooling system does not satisfy the cooling. In other words, in the conventional indirect air cooling method, the cooling air flows only on both side walls of the casing. For this reason, the thermal resistance from the heat generating part at the center of the board to the cooling air flowing through the side wall of the housing is larger than the desired value, so the temperature rise of the board increases and the temperature of the components on the board exceeds the allowable temperature. There is a possibility that.

  In addition, it is possible to increase the density of fins on the side wall of the housing or increase the flow rate in order to improve the cooling capacity (reduce thermal resistance). However, in this case as well, the thermal resistance from the center of the board where the heat generating components are arranged to the end of the board cannot be reduced, and the effect is small only with fins and flow rate. In addition, improvement of fins and flow rate has been generally performed at an appropriate value in balance with pressure loss.

  The present embodiment has been made paying attention to the above circumstances, and can provide an electronic device casing capable of reducing the thermal resistance from the heat generating portion to the cooling air and enabling efficient cooling of the board. It is in.

  The electronic device housing of the embodiment is an indirect air-cooled electronic device housing that houses a plurality of electronic circuit module boards inside a box-shaped chassis. A housing wall having a ventilation duct formed in the wall is disposed at a position facing the board, and the housing wall and the board are brought into contact with each other.

1 is a perspective view illustrating a schematic configuration of an entire electronic device housing according to a first embodiment. II-II sectional view taken on the line of FIG. III-III sectional view taken on the line of FIG. The longitudinal cross-sectional view of the principal part which shows an example of the engaging part of the board of the electronic device housing | casing of 1st Embodiment. The perspective view which shows an example of the heat sink of the electronic device housing | casing of 1st Embodiment. The VI-VI sectional view taken on the line of FIG. The longitudinal cross-sectional view which shows the modification of the board of the electronic circuit module of the electronic device housing | casing of 1st Embodiment. The perspective view which shows schematic structure of the whole electronic device housing | casing of 2nd Embodiment. IX-IX sectional view taken on the line of FIG. The longitudinal cross-sectional view of the principal part which shows the modification of the heat sink of 1st Embodiment. XI-XI sectional view taken on the line of FIG. The disassembled perspective view which shows schematic structure of the whole electronic device housing | casing of 3rd Embodiment. The disassembled perspective view which shows the movable wall part of the floating structure of the electronic device housing | casing of 3rd Embodiment. The cross-sectional view of the electronic device housing of the third embodiment. The junction part of the movable wall part of the floating structure of the electronic device housing | casing of 3rd Embodiment and the board of an electronic circuit module is shown, (A) is an edge of an upper duct opening part, and a 2nd end plate. The cross-sectional view of the principal part which shows the sealing member arrange | positioned by the joining surface, (B) is the cross-sectional view of the principal part which shows the modification of a seal member. The cross-sectional view which shows the fixing tool of the movable wall part of the electronic device housing | casing of 3rd Embodiment.

[First Embodiment]
(Constitution)
1 to 6 show a first embodiment. 1 is a perspective view showing a state in which the top panel 10 (shown in FIG. 3) of the electronic device housing 1 of the indirect air cooling system according to the present embodiment is removed, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. The electronic device housing 1 of the present embodiment includes a box-type chassis 4 having a board housing chamber 3 that houses boards 2 of a plurality of electronic circuit modules such as standard boards such as VME. In the present embodiment, the plurality of boards 2 are vertically placed in the vertical direction, for example, and are housed in the board housing chamber 3 in a state of being juxtaposed in the horizontal direction.

  The chassis 4 is disposed at the lower part of the chassis 4, and is disposed on both sides of the chassis 4, a rectangular plate-shaped base frame 5 that forms a floor plate, two end plates 6 and 7 disposed at both ends of the chassis 4, and the chassis 4. The two side plates 8 and 9 and the upper panel 10 are formed. The base frame 5, the two end plates 6, 7, the two side plates 8, 9, and the top panel 10 form a main body 1 a of the box-shaped housing 1.

  As shown in FIG. 3, the mother board 11 is arranged in a horizontal state along the horizontal direction on the bottom surface of the board housing chamber 3. The motherboard 11 is provided with a plurality of connector receiving portions 12 for detachably connecting the board 2. Motherboard support legs 13 project from the base frame 5 upward. The motherboard 11 is screwed onto the motherboard support leg 13 of the base frame 5 from above the motherboard support leg 13.

  The board 2 of the electronic circuit module includes a substantially rectangular printed circuit board 15 on which a plurality of electronic circuit components 14 are mounted, a connector part 16 disposed at one end of the board 2, and an in-board heat sink 61 (see FIG. 6) and card holders (holders) 17 disposed on both sides of the board 2. The board 2 of the electronic circuit module is inserted into and removed from the board housing chamber 3 from above in FIGS. 1 and 3. The in-board heat sink 61 is formed of a heat transfer member such as a metal plate having high thermal conductivity. The in-board heat sink 61 is provided so as to cover the plurality of electronic circuit components 14 mounted on the printed circuit board 15.

  FIG. 4 shows an example of the card holder 17. The card holder 17 includes, for example, two bar-shaped members (a first bar-shaped member 18 and a second bar-shaped member 19) and an intermediate member 20 disposed between the two bar-shaped members 18 and 19. The first rod-shaped member 18 is formed with a through hole 18 a penetrating in the axial direction of the rod-shaped member 18. The second rod-shaped member 19 is formed with a screw hole 19 a penetrating in the axial direction of the rod-shaped member 19. The intermediate member 20 is formed with a through hole 20 a that penetrates the intermediate member 20 in the axial direction. The male screw member 21 inserted from the through hole 18 a of the first rod-shaped member 18 passes through the through hole 20 a of the intermediate member 20 and is screwed into the screw hole 19 a of the second rod-shaped member 19.

  In addition, inclined surfaces in opposite directions are formed on the contact surface between the first rod-shaped member 18 and the intermediate member 20 and the contact surface between the second rod-shaped member 19 and the intermediate member 20, respectively. Furthermore, the through hole 20a of the intermediate member 20 is formed by a long hole that is long in a direction orthogonal to the axial direction of the through hole 20a. Here, either one of the two rod-shaped members 18 and 19 or the intermediate member 20 is fixed to the heat sink 61 in the board (in this embodiment, the two rod-shaped members 18 and 19 are fixed to the heat sink 61 in the board. ing).

  When the connector portion 16 of the board 2 is connected to the connector receiving portion 12, the board 2 is detachably engaged with a communication wall 34 described later by a screwing operation by the rotation of the male screw member 21 of the card holder 17. It has become so. During the screwing operation of the male screw member 21, a wedge action occurs due to the sliding action between the inclined surfaces of the first rod-shaped member 18 and the intermediate member 20 and between the inclined surfaces of the second rod-shaped member 19 and the intermediate member 20, The intermediate member 20 moves in a direction orthogonal to the axial direction. Thus, a biasing means is provided that applies a biasing force that brings the board 2 into contact with the communication wall 34 in a pressed state when the board 2 and the communication wall 34 are engaged.

  As shown in FIG. 2, cooling air ventilation paths (first ventilation path 24 and second ventilation path 25) are formed on both sides of the board housing chamber 3 inside the housing body 1 a. Here, the lower first air passage 24 in FIG. 2 is a right air passage constituting member 26 disposed on the right side of the board housing chamber 3 in FIG. 8 is formed. One end (the left end in FIG. 2) side of the first ventilation path 24 communicates with a suction port 27 that is an opening for suctioning cooling air formed in one end plate 6. The other end (right end in FIG. 2) side of the first ventilation path 24 is closed by a closing plate 28 disposed on the right side of the board housing chamber 3 in FIG.

  The upper second air passage 25 in FIG. 2 is between the left air passage constituting member 29 arranged on the left side of the board housing chamber 3 in FIG. 3 and the left side plate 9 in FIG. 3 of the chassis 4. Is formed. One end (left end in FIG. 2) of the second ventilation path 25 is closed by a closing plate 30 disposed on the left side of the board housing chamber 3 in FIG. The other end (the right end in FIG. 2) side of the second ventilation path 25 communicates with a discharge port 31 that is an opening for discharging cooling air formed in the other end plate 7. A blower (blower) 32 is attached to the discharge port 31.

  In addition, a large number of plate-like straight fins 33 extending in a direction perpendicular to the insertion direction of the board 2 are arranged side by side in the first ventilation path 24 and the second ventilation path 25. The straight fins 33 are arranged in a horizontal state in a direction orthogonal to the insertion direction of the board 2, and are juxtaposed at a fine pitch in a vertical alignment state in the insertion direction of the board 2.

  In addition, a plurality of communication walls (casing walls) 34 that communicate between the first ventilation path 24 and the second ventilation path 25 are disposed inside the board housing chamber 3. Each communication wall 34 is formed with a ventilation duct 35 communicating between the first ventilation path 24 and the second ventilation path 25 in the wall. Each communication wall 34 is disposed at a position facing the board 2 of the electronic circuit module mounted in the board housing chamber 3.

  As a result, as shown in FIG. 1, a plurality of (the same number as the boards 2) opening / closing openings 3a for inserting / removing the boards 2 one by one between the communication walls 34 are provided on the upper surface of the board housing chamber 3. Is formed. The board opening / closing opening 3a is closed by the top panel 10 so as to be opened and closed.

  Each communication wall 34 is provided with a heat sink 36 at a contact portion with the board 2.

For example, as shown in FIG. 5, the heat sink 36 is formed by a large number of pin fins 37 protruding from the board holding portion of the wall surface panel of the communication wall 34 toward the ventilation duct 35. The heat sink 36 is not limited to the pin fins 37 and may be straight fins or offset fins.

  Further, the pin fins 37 of the heat sink 36 are, for example, a CPU that generates a large amount of heat among the plurality of electronic circuit components 14 mounted on the board 2 of the electronic circuit module as in the modifications shown in FIGS. Only the portion facing the main heat generating portion 14a is densely arranged. That is, as shown in FIG. 11, the vertical and horizontal intervals t1 and t2 between the pin fins 37 arranged in the portion facing the main heat generating portion 14a are the vertical and horizontal intervals between the pin fins 37 arranged in the portion other than the main heat generating portion 14a. It is smaller than t11 and t22 (t1 <t11, t2 <t22).

(Function)
Next, the operation of the above configuration will be described. In the electronic device casing 1 of the present embodiment, the board 2 inserted into the board housing chamber 3 through the board insertion / removal opening 3 a communicates between the first ventilation path 24 and the second ventilation path 25. In a state of being guided by the wall surfaces of the plurality of communication walls 34, the connector portion 16 is connected to the connector receiving portion 12. Thereafter, the board 2 is detachably engaged with the communication wall 34 by a screwing operation by the rotation of the male screw member 21 of the card holder 17. During the screwing operation of the male screw member 21, a wedge action occurs due to the sliding action between the inclined surfaces of the first rod-shaped member 18 and the intermediate member 20 and between the inclined surfaces of the second rod-shaped member 19 and the intermediate member 20, The intermediate member 20 moves in a direction orthogonal to the axial direction. Thereby, when the board 2 and the communication wall 34 are engaged, the in-board heat sink 61 of the board 2 is brought into contact with the communication wall 34 in a pressure contact state. Therefore, the heat generated from the electronic circuit components 14 on the board 2 of the electronic circuit module in the electronic device casing 1 is transferred to the communication wall 34 via the heat sink 61 in the board 2 of the board 2 as indicated by an arrow in FIG. Direct heat transfer.

  In addition, the blower 32 is driven when the electronic device casing 1 of the present embodiment is used. By driving the blower 32, the cooling air inside the second ventilation path 25 is discharged to the outside from the discharge port 31, as indicated by an arrow in FIG. At this time, a ventilation path is formed in which cooling air is drawn into the first ventilation path 24 from the suction port 27 formed in the one end plate 6 of the housing body 1a, and the first ventilation path 24 is formed. The ventilation path of the cooling air which flows to the 2nd ventilation path 25 side through the ventilation duct 35 in the some communicating wall 34 from is formed.

  The communication wall 34 is cooled by heat exchange with the cooling air flowing in the ventilation duct 35 in the plurality of communication walls 34. At this time, the heat generated from the electronic circuit component 14 on the board 2 is directly transferred to the communication wall 34 via the in-board heat sink 61 of the board 2 as indicated by an arrow in FIG. Further, the heat transferred to the communication wall 34 is radiated from the numerous pin fins 37 in the ventilation duct 35 of the communication wall 34 to the cooling air flowing in the ventilation duct 35.

  The cooling external air is sucked into the first ventilation path 24 from the suction port 27, passes through the ventilation duct 35 and the second ventilation path 25 in the plurality of communication walls 34, and is then discharged from the discharge port 31. Is discharged to the outside. Therefore, the external air does not flow directly into the board housing chamber 3 and the outside air does not hit the board 2 of the electronic circuit module inside the board housing chamber 3.

(effect)
In the electronic device casing 1 of the present embodiment, the casing wall of the communication wall 34 having a ventilation structure is brought into direct contact with the in-board heat sink 61 of the board 2. Thereby, (1) The thermal resistance from the heat generating part of the board 2 to the cooling air can be reduced, and the board 2 can be efficiently cooled.
(2) Since the heat conduction plate on the board 2 for transferring the heat generated from the electronic circuit component 14 on the board 2 to the card holder 17 side on both sides of the board 2 is not required, the board 2 is reduced in weight. Can do.

(3) By arranging the housing wall of the communication wall 34 in a pair with the board 2, the communication wall 34 also serves as a reinforcing member of the housing 1, and the highly rigid electronic device housing 1 can be provided.

  In the present embodiment, an indirect air-cooling type electronic apparatus is configured in which a blower 32 is provided in a discharge port 31 that is an opening for discharging cooling air, and the cooling air is forced to flow by driving the blower 32. Although the housing 1 is shown, the blower 32 is not necessarily required. For example, when cooling air can be supplied to the suction port 27 by an external duct, the blower 32 can be omitted by connecting the external duct to the suction port 27.

  In addition, the straight fins 33 inside the first ventilation path 24 may be configured to change the ease of flow of the cooling air according to the distance from the suction port 27. For example, on the upstream side of the first ventilation path 24 that is close to the suction port 27, the interval between the adjacent fins 33 is increased so that the cooling air can easily flow, and the downstream side of the first ventilation path 24 is directed. Accordingly, the interval between adjacent fins 33 is reduced so that the cooling air hardly flows. Thereby, by adjusting the flow of the cooling air between the upstream side and the downstream side of the first ventilation path 24, the ventilation duct 35 of each communication wall 34 from the upstream side to the downstream side of the first ventilation path 24 is adjusted. The distribution state of the cooling air can be adjusted so that the flow of the cooling air becomes uniform. In this case, it is possible to reduce a phenomenon in which the flow of the cooling air on the upstream side of the first ventilation path 24 becomes smaller than that on the downstream side.

  10 and FIG. 11, the pin fins 37 of the heat sink 36 are configured such that, for example, only a portion facing the main heat generating portion 14a such as a CPU is arranged more densely than the other portions. Thus, the cooling effect of the main heat generating portion 14a having a large heat generation amount can be further enhanced, and the board 2 can be cooled more efficiently.

  Further, in the board 2 of the electronic circuit module, either one of the two rod-like members 18 and 19 of the card holder 17 or the intermediate member 20 is fixed to the printed circuit board 15 as in the modification shown in FIG. In the modification shown in FIG. 7, the two rod-shaped members 18 and 19 are fixed to the printed circuit board 15). Also in this modification, the in-board heat sink 62 is provided so as to cover the plurality of electronic circuit components 14 mounted on the printed circuit board 15. The heat generated from the electronic circuit component 14 on the board 2 is directly transferred to the communication wall 34 via the in-board heat sink 62 of the board 2 and radiated.

[Second Embodiment]
(Constitution)
8 and 9 show a second embodiment. The present embodiment is a modified example in which the configuration of the electronic device casing 1 of the first embodiment (see FIGS. 1 to 6) is changed as follows. FIG. 8 is a perspective view showing an overall schematic configuration of the electronic device casing 41 of the second embodiment, and FIG. 9 is a sectional view taken along line IX-IX in FIG. 8 and 9, the same parts as those in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 8, the electronic device casing 41 of the present embodiment has a plurality of openings 42a for inserting and removing boards on one end side of a box-shaped casing main body 41a. Each opening 42a is formed in an elongated shape in the vertical direction. A plurality of openings 42a are juxtaposed side by side in the horizontal direction.

  In the present embodiment, a motherboard (not shown) is arranged vertically in the vertical direction on the other end side of the casing body 41 a and is fixed in parallel with the end plate 7. As shown in FIG. 8, the board 2 of the plurality of electronic circuit modules has a connector portion 16 disposed on one side of a substantially rectangular plate-like printed circuit board 15, and card holders (holders) at the upper and lower portions of the board 2. ) 17 are provided. Further, as shown in FIG. 6, an in-board heat sink 61 is provided so as to cover a plurality of electronic circuit components 14 mounted on the printed circuit board 15.

  Further, as shown in FIG. 9, a first ventilation path 44 that is a ventilation path for cooling air is formed in the lower part of the board housing chamber 42 formed inside the box-shaped housing body 41 a, and a second ventilation path 45 is formed in the upper part. Are formed respectively. Here, the lower first ventilation path 44 in FIG. 9 is formed between the lower ventilation path constituting member 46 disposed below the board housing chamber 42 and the base frame 5 of the housing body 41a. Has been. One end (the left end in FIG. 9) side of the first ventilation path 44 communicates with a suction port 27 that is an opening for suctioning cooling air formed in one end plate 6. The other end (right end in FIG. 9) side of the first ventilation path 44 is closed by a closing plate 47 disposed on the right side of the board housing chamber 42 in FIG.

  In FIG. 9, the upper second ventilation path 45 is formed between the upper ventilation path constituting member 48 disposed on the upper side of the board housing chamber 42 and the upper surface panel 10 of the housing body 41a. One end (left end in FIG. 9) side of the second ventilation path 45 is closed by a closing plate 49 arranged on the left side of the board housing chamber 42 in FIG. The other end (the right end in FIG. 9) side of the second ventilation path 45 is communicated with a discharge port 31 that is an opening for discharging cooling air formed in the other end plate 7. A blower (blower) 32 is attached to the discharge port 31.

  In addition, a large number of plate-like straight fins 33 extending in the same direction as the insertion direction of the board 2 are juxtaposed side by side in the first ventilation path 44 and the second ventilation path 45. The straight fins 33 are arranged vertically in the vertical direction, and are arranged side by side at a fine pitch in a horizontal state.

  In addition, a plurality of communication walls (casing walls) 50 that communicate between the first ventilation path 44 and the second ventilation path 45 are disposed inside the board housing chamber 42. Each communication wall 50 is formed with a ventilation duct 51 communicating between the first ventilation path 44 and the second ventilation path 45 in the wall. Each communication wall 50 is disposed at a position facing the board 2 of the electronic circuit module mounted inside the board housing chamber 42.

  As a result, as shown in FIG. 8, at one end side of the board housing chamber 42, a plurality of (the same number as the boards 2) board opening / closing openings 42 a for inserting and removing the boards 2 individually between the communication walls 50 one by one. Is formed. The board opening / closing opening 42a is closed by one end plate 6 so as to be opened and closed.

  Each communication wall 50 is provided with a heat sink 52 at a contact portion with the board 2.

For example, as shown in FIG. 9, the heat sink 52 is formed by a finned panel in which a number of straight fins 53 projecting toward the ventilation duct 51 side are integrally formed on the board holding portion of the wall surface panel of the communication wall 50. ing. For example, the straight fins 53 are dense only (the fin pitch 0.35 to 0.7 mm, the fin thickness 0.05 to 0.2 mm, the portion facing the main heat generating portion 14a of the board 2 (see FIGS. 10 and 11), The height is 20 mm or less.

(Function)
Next, the operation of the above configuration will be described. In the electronic device casing 41 of the present embodiment, the cooling air inside the second ventilation path 45 is discharged to the outside through the discharge port 31 as shown by the arrow in FIG. At this time, a ventilation path through which cooling air is sucked into the first ventilation path 44 is formed from the suction port 27 formed in the one end plate 6 of the housing body 41a, and the first ventilation path 44 is formed. The ventilation path of the cooling air which flows to the 2nd ventilation path 45 side through the ventilation duct 51 in the some communication wall 50 is formed.

  Then, the communication wall 50 is cooled by heat exchange with the cooling air flowing through the ventilation ducts 51 in the plurality of communication walls 50. At this time, the heat generated from the electronic circuit component 14 on the board 2 is directly transferred to the communication wall 50 via the in-board heat sink 61 of the board 2 and radiated.

  The cooling external air is sucked into the first ventilation path 44 from the suction port 27, passes through the ventilation duct 51 and the second ventilation path 45 in the plurality of communication walls 50, and then is discharged to the discharge port 31. Is discharged to the outside. Therefore, the external air does not flow directly into the board housing chamber 42 and the outside air does not hit the board 2 of the electronic circuit module inside the board housing chamber 42.

(effect)
Also in the present embodiment, the housing wall of the communication wall 50 having the ventilation structure as in the first embodiment is in direct contact with the board 2, so that the cooling air from the heat generating portion is the same as in the first embodiment. It is possible to reduce the thermal resistance until the board 2 is efficiently cooled. Further, in the present embodiment, the direction in which the board 2 is inserted into the housing 41 is the same as the flow direction of the cooling air in the first ventilation path 44 that is the cooling air supply path. Therefore, the flow of the cooling air flowing from the first ventilation path 44 into the ventilation ducts 51 in the plurality of communication walls 50 is all outside air (temperature rise) in the ventilation ducts 51 in the plurality of communication walls 50. The cooling effect of the board 2 can be made equal by the ventilation ducts 51 in the plurality of communication walls 50. Therefore, in the present embodiment, in addition to the effects of the first embodiment, there is an effect that the distribution adjustment of the cooling air to the ventilation ducts 51 in the plurality of communication walls 50 can be easily performed.

[Third Embodiment]
(Constitution)
12 to 16 show a third embodiment. FIG. 12 is an exploded perspective view showing an overall schematic configuration of the indirect air-cooled electronic device casing 71 of the present embodiment. The electronic device casing 71 of the present embodiment has a box-shaped chassis 72. The chassis 72 is disposed at a lower portion of the chassis 72 and has a rectangular plate-like lower panel 73 that forms a floor plate, a front panel 74 disposed on the front surface of the chassis 72, a rear panel 75 disposed on the rear surface of the chassis 72, and a chassis. 72, two side panels 76 and 77 disposed on both side surfaces of the 72, and an upper panel 78 disposed on the upper surface of the chassis 72.

  On the lower panel 73, a mother board 79 is disposed horizontally along the horizontal direction. On the upper surface of the mother board 79, for example, a plurality of connector receiving portions 81 for detachably connecting a plurality of electronic circuit module boards 80 such as a standard board such as a VME are provided. The plurality of connector receiving portions 81 extend in parallel to the side panels 76 and 77, respectively, and are arranged in parallel in a direction orthogonal to the side panels 76 and 77. The electronic circuit module board 80 has the same configuration as the electronic circuit module board 2 of the first embodiment (see FIGS. 1 to 6). Therefore, the same parts as those in FIGS. 1 to 6 in the board 80 of the electronic circuit module are denoted by the same reference numerals, and the description thereof is omitted here.

  A discharge port 82 is formed in the upper portion of the front panel 74. A first air duct 83 is connected to the inner surface side of the front panel 74. One end side of the first air duct 83 is connected to the discharge port 82. Further, a second air duct 84 is connected to the rear panel 75 on the inner surface side. A plurality of blower fans 85 are disposed inside the second blower duct 84. Here, the rear panel 75 has an opening (not shown) in which the blower fan 85 is mounted. The opening of the rear panel 75 forms an intake port for sucking cooling air. A fan cover 86 is mounted on the outer surface side of the rear panel 75.

  Inside the electronic device casing 71, a board accommodating chamber 87 for accommodating a plurality of boards 80 of electronic circuit modules is disposed between the first air duct 83 and the second air duct 84. The board housing chamber 87 of the present embodiment includes a first end plate 88 disposed on the first air duct 83 side and a second end plate 89 disposed on the second air duct 84 side. A power source 90 is disposed on the inner surface side of one side panel 76. Then, as shown in FIG. 14, the board housing chamber 87 of the present embodiment is surrounded by the other side panel 77, the first end plate 88, the second end plate 89, and the power source 90. Is formed.

  Inside the board housing chamber 87, a plurality of separate plates 91 are vertically placed, for example, in the vertical direction, and are arranged in parallel with the side panels 76 and 77, respectively. Each separate plate 91 is formed by a fixed wall fixed to a fixed portion in the board housing chamber 87. In the board accommodating chamber 87, the electronic circuit module boards 80 are individually accommodated one by one in the space between the separate plates 91.

  Further, in the present embodiment, a casing wall 92 having a ventilation structure is disposed to face each separate plate 91. As shown in FIG. 13, the casing wall 92 having the ventilation structure includes a ventilation panel 95, a flat duct cover 96, and a heat dissipation sheet 97. The ventilation panel 95 has a corrugated fin 94 mounted on a flat base plate 93. The corrugated fins 94 are bent into a wave shape, and the bent portions of the wave shape are fixed on the base plate 93. The flat duct cover 96 is disposed on the side opposite to the base plate 93 and is mounted so as to cover the corrugated fins 94 of the ventilation panel 95. And the ventilation panel 98 and the duct cover 96 are assembled | attached, and the ventilation duct 98 is formed in the part of the corrugated fin 94 between the base plate 93 and the duct cover 96. FIG. As a result, a casing wall 92 having a ventilation structure that allows cooling air to flow in the horizontal direction along the corrugated fins 94 is configured.

  The heat radiating sheet 97 is fixed to the outer surface of the duct cover 96 by adhesion or the like. The heat radiating sheet 97 is for bringing the entire outer surface of the duct cover 96 into uniform contact with the board 80, and may be a heat transfer member such as a metal sheet. Further, the heat radiating sheet 97 is not always necessary, and there may be a case where the heat radiating sheet 97 is not necessary.

  L-shaped connecting end portions 92a and 92b are formed at both ends of the casing wall 92 of the ventilation structure. These connection end portions 92a and 92b are respectively formed with communication ducts 99a and 99b communicating with the ventilation duct 98 between the base plate 93 and the duct cover 96 (see FIG. 15A). 99a).

  In addition, the communication duct 99a of the connection end 92a on one end side of the ventilation structure housing wall 92 is divided into two upper and lower stages to form an upper duct opening 99a1 and a lower duct opening 99a2. Similarly, an upper duct opening 99b1 and a lower duct opening 99b2 are formed in the communication duct 99b of the connecting end 92b on the other end of the casing wall 92 of the ventilation structure.

  Furthermore, the casing wall 92 of the ventilation structure of the present embodiment is a movable wall that has a floating structure with respect to the separate plate 91 that is a fixed portion of the chassis 72, the first end plate 88, and the second end plate 89. It is formed by the part. As shown in FIG. 13, the separation plate 91 has three engaging convex portions (first engaging convex portion 100a, second engaging convex portion 100b, and third engaging convex portion 100c) at both ends. Projections are provided in the vertical direction at appropriate intervals. The first engagement convex portion 100a is the upper end portion of the separate plate 91, the second engagement convex portion 100b is the center portion of the separate plate 91, and the third engagement convex portion 100c is the lower end portion of the separate plate 91. Respectively.

  Further, as shown in FIG. 13, a rod-shaped duct holder 101 is disposed outside the casing wall 92 of the ventilation structure. The duct holder 101 has portions corresponding to the three engaging convex portions (the first engaging convex portion 100a, the second engaging convex portion 100b, and the third engaging convex portion 100c) of the separate plate 91, respectively. For example, three screw attachment portions (first screw attachment portion 101a, second screw attachment portion 101b, and third screw attachment portion 101c) for fixing screws are formed. And three engagement convex parts (the 1st engagement convex part 100a, the 2nd engagement convex part 100b, the 3rd engagement convex part 100c) of the separate plate 91, and the three screw attachment parts of the duct holder 101 Two attachment holes 102 are formed by screwing (first screw attachment portion 101a, second screw attachment portion 101b, and third screw attachment portion 101c) to each other. The connecting duct 99a, the upper duct opening 99a1 and the lower duct opening 99a2 of the communication duct 99a, and the upper duct opening 99b1 and the lower duct opening 99b2 of the communication duct 99b are respectively inserted into the mounting holes 102. 99b is assembled. Here, a gap S in which the communication ducts 99a and 99b can move is formed between the two attachment holes 102 and the communication ducts 99a and 99b, as shown in FIG.

  A plurality of air holes 111 and 112 are formed in the first end plate 88 and the second end plate 89 of the board housing chamber 87, respectively. Here, the plurality of air holes 111 of the first end plate 88 are communicated with the upper duct opening 99a1 and the lower duct opening 99a2 of the communication duct 99a, respectively. Similarly, the plurality of vent holes 112 of the second end plate 89 communicate with the upper duct opening 99b1 and the lower duct opening 99b2 of the communication duct 99b, respectively.

  Further, as shown in FIG. 15A, the second end plate 89 of the board housing chamber 87 has good sliding property of the contact surface with the metal plate around each vent hole 112 on the surface on the communication duct 99b side. An elastic member, for example, a sheet-like seal member 103 formed of a material having a good sliding property such as Teflon (registered trademark) is fixed. The seal member 103 may be a Teflon sponge (with skin), a silicon sponge (with skin), or the like. Then, the end edges of the upper duct opening 99b1 and the lower duct opening 99b2 of the communication duct 99b are pressed against the seal member 103 in a pressed state, so that the upper duct opening 99b1 and the lower side of the communication duct 99b are pressed. The space between the duct opening 99b2 and the second end plate 89 is hermetically sealed. At this time, the communication duct 99b is held so as to be movable in the vertical direction in FIG. 15A by sliding on the seal member 103.

  Similarly, a sheet-like sealing member formed of a material having a good sliding property such as Teflon (registered trademark) is also provided around each air hole 111 on the surface of the first end plate 88 of the board housing chamber 87 on the side of the communication duct 99a. 103 is fixed. Then, the end edges of the upper duct opening 99a1 and the lower duct opening 99a2 of the communication duct 99a are pressed against the seal member 103 in a pressure contact state, so that the upper duct opening 99a1 and the lower side of the communication duct 99a are pressed. The space between the duct opening 99a2 and the first end plate 88 is hermetically sealed. At this time, the communication duct 99a is similarly movably held by sliding on the seal member 103.

  As shown in the modification of FIG. 15B, L-shaped flange portions 121 are formed at the respective edge portions of the upper duct opening 99b1 and the lower duct opening 99b2 of the communication duct 99b. A seal member 122 having a good sliding property such as a Teflon (registered trademark) tube may be disposed between the first end plate 89 of the board accommodating chamber 87 and 121. FIG. 15B shows an example in which the seal member 122 is formed of a tube.

  As a result, the casing wall 92 of the ventilation structure forms a movable wall portion that has a floating structure with respect to the second end plate 89 that is a fixed portion of the chassis 72 due to the elastic deformation of the seal member 103.

  In addition, two card holders (fixing tools) 104 are fixed to the separate plate 91 on the side facing the casing wall 92 having a ventilation structure. In the card holder 104, a casing wall 92 having a ventilation structure as a movable wall portion is detachably fixed to a second end plate 89 as a fixing portion of the chassis, and the movable wall portion is fixed to the fixing portion of the chassis. An example of fixing means for bringing the movable wall portion and the heat dissipation surface of the board 80 into close contact with each other is shown. As shown in FIG. 16, the card holder 104 includes, for example, three rod-shaped members (first rod-shaped member 105, second rod-shaped member 106, and third rod-shaped member 107) and two intermediate members (first intermediate member). Member 108 and second intermediate member 109). The first intermediate member 108 is disposed between the first rod-shaped member 105 and the second rod-shaped member 106, and the second intermediate member 109 is composed of the second rod-shaped member 106, the third rod-shaped member 107, and the like. It is arranged between.

  The first and second rod-like members 105 and 106 are formed with through holes 105a and 106a penetrating in the axial direction, respectively. The third rod-shaped member 107 is formed with a screw hole 107a penetrating in the axial direction. The first intermediate member 108 and the second intermediate member 109 are formed with through holes 108a and 109a penetrating in the axial direction, respectively. The male screw member 110 inserted from the through hole 105a of the first rod-like member 105 is penetrated by the through-hole 108a of the first intermediate member 108, the through-hole 106a of the second rod-like member 106, and the second intermediate member 109. It passes through the holes 109a in order and is screwed into the screw holes 107a of the third rod-shaped member 107.

  In addition, inclined surfaces in opposite directions are formed on the contact surface between the first rod-shaped member 105 and the first intermediate member 108 and on the contact surface between the second rod-shaped member 106 and the first intermediate member 108, respectively. . Similarly, oppositely inclined surfaces are formed on the contact surface between the second rod-shaped member 106 and the second intermediate member 109 and the contact surface between the third rod-shaped member 107 and the second intermediate member 109, respectively. Yes.

  Further, the through hole 108a of the first intermediate member 108 and the through hole 109a of the second intermediate member 109 are formed by long holes that are long in the direction perpendicular to the axial direction of each of the through holes 108a and 109a. In the present embodiment, three rod-like members (first rod-like member 105, second rod-like member 106, and third rod-like member 107) are fixed to separate plate 91.

  During the screwing operation of the male screw member 110, a sliding action between the inclined surfaces of the first rod-shaped member 105 and the first intermediate member 108 and between the inclined surfaces of the second rod-shaped member 106 and the first intermediate member 108; Due to the sliding action between the inclined surfaces of the second rod-like member 106 and the second intermediate member 109 and between the inclined surfaces of the third rod-like member 107 and the second intermediate member 109, a wedge action occurs, The first intermediate member 108 and the second intermediate member 109 move in a direction orthogonal to the axial direction. Thereby, in this Embodiment, the urging | biasing force which contacts the housing | casing wall 92 of a ventilation structure to the board 80 in a press-contact state by the screwing operation by rotation of the external thread member 110 of the card holder 104 is provided. When the casing wall 92 of the ventilation structure, which is a movable wall section, is fixed to the fixing portion of the chassis 72, an urging means for bringing the casing wall 92 of the ventilation structure and the heat radiating surface of the board 80 into close contact by the card holder 104 is provided. Is formed.

(Function)
Next, the operation of the above configuration will be described. In the present embodiment, when the blower fan 85 is driven, the cooling air is sucked into the second blower duct 84 from the outer surface side of the rear panel 75 via the blower fan 85. This cooling air is ventilated from the upper duct opening 99b1 and the lower duct opening 99b2 of the communication duct 99b through the ventilation holes 112 of the second end plate 89 from the second air duct 84 as shown by arrows in FIG. Are introduced into the ventilation duct 98 of the casing wall 92 of the housing. Subsequently, the cooling air passes through the inside of the ventilation duct 98 of the casing wall 92 of the ventilation structure, and as shown by arrows in FIG. 14 from the upper duct opening 99a1 and the lower duct opening 99a2 of the communication duct 99a. The air passes through the vent hole 111 of the end plate 88, is introduced into the first air duct 83, and is discharged to the outside through the discharge port 82 of the front panel 74.

  Further, the heat generated from the electronic circuit component 14 on the board 80 is directly transferred to the ventilated casing wall 92 via the in-board heat sink 61 of the board 80 to be dissipated.

(effect)
In the indirect air-cooled electronic device casing 71 of the present embodiment, a ventilation structure casing wall 92 is provided, and the ventilation structure casing wall 92 can be moved to the second end plate 89 via the seal member 103. It is held. As a result, the casing wall 92 of the ventilation structure forms a movable wall portion that has a floating structure with respect to the second end plate 89 that is a fixed portion of the chassis 72 by elastic deformation of the seal member 103. Further, the separation plate 91 is provided with two card holders 104 on the side facing the ventilation structure casing wall 92, and a screwing operation by rotation of the male screw member 110 of the card holder 104 causes a ventilation structure casing wall. An urging force for bringing 92 into contact with the board 80 in a pressure contact state can be applied. Therefore, when the casing wall 92 of the ventilation structure, which is a movable wall section, is fixed to the fixing portion of the chassis 72, the casing wall 92 of the ventilation structure and the heat dissipation surface of the board 80 can be brought into close contact with each other by the card holder 104. Therefore, this embodiment has the following effects in addition to the effects of the first embodiment.

(1) The electronic device casing 71 can make the casing wall 92 having a ventilation structure in close contact with the main heating surface of the board 80 without mechanical stress. Therefore, the thermal resistance from the heat generating part to the cooling air can be reduced, and the board 80 can be efficiently cooled.

(2) The housing wall 92 of the ventilation structure is held in the chassis 72 by elastic deformation of the sealing member 103 by holding the housing wall 92 of the ventilation structure movably on the second end plate 89 via the sealing member 103. A movable wall portion having a floating structure is configured with respect to the second end plate 89 which is a fixed portion of the first end plate 89. Therefore, the assembly parts of the ventilation structure housing wall 92 and the board 80 do not require individual high dimensional accuracy, and can be realized at low cost.

(3) By using a gasket having a good sliding property as the seal member 103 on each joint surface between the second end plate 89 and each end edge of the upper duct opening 99a1 and the lower duct opening 99a2, A floating structure that is easy to adjust without leakage of cooling air can be realized.

  In general, the connector portion of the board 80 according to the VME or VPX standard is formed by a fixed structure. Therefore, the position of the board 80 is determined by the positional accuracy of the mother board 79 and the component accuracy of the fitting portion. For example, when the casing wall of the ventilation structure is also formed by a fixed structure, when the board 80 and the casing wall of the ventilation structure are assembled in a contact state, the casing wall of the ventilation structure It is difficult to make a dimensional contact between the contact portions with the board 80. In this case, there is a gap between the contact portion between the ventilation structure housing wall and the board 80 so that they do not adhere to each other, and the contact thermal resistance increases, or the board 80 or the ventilation structure housing wall is fixed by tightening. There is a possibility of excessive mechanical stress on the part. On the other hand, in the electronic device casing 71 of the present embodiment, the casing wall 92 of the ventilation structure is configured as a movable wall portion that has a floating structure with respect to the separate plate 91 that is a fixed portion of the chassis 72. There is an effect of preventing the above-described problems.

  In addition, in the indirect air-cooled electronic device casing 71 of the present embodiment, the cooling air sucked from the intake port of the opening of the rear panel 75 is the second air duct 84 and the air holes 112 of the second end plate 89. The exhaust duct 99b, the ventilation duct 98 of the casing wall 92 of the ventilation structure, the vent hole 111 of the first end plate 88, and the first air duct 83 are sequentially discharged to the outside from the discharge port 82 of the front panel 74. Although the configuration is shown, it is not limited to this. For example, the housing wall of the communication wall 34 having the ventilation structure of the first embodiment (see FIGS. 1 to 6) and the ventilation structure of the second embodiment (see FIGS. 8 and 9). The movable wall portion which becomes the floating structure of the third embodiment is formed in the structure of the casing wall of the communicating wall 50, and the casing wall 92 and the board 80 of the ventilation structure are configured as in the third embodiment. You may apply the structure which closely_contact | adheres to the thermal radiation surface.

  According to these embodiments, it is possible to provide an electronic device casing that can reduce the thermal resistance from the heat generating portion to the cooling air and can efficiently cool the board.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

    DESCRIPTION OF SYMBOLS 1, 41, 71 ... Electronic equipment housing, 2 ... Board, 3, 42, 87 ... Board accommodation room, 4, 72 ... Chassis, 35, 51, 98 ... Ventilation duct, 34 ... Communication wall (housing wall), 92: Housing wall.

Claims (11)

An indirect air-cooled electronic device housing that houses a plurality of electronic circuit module boards inside a box-shaped chassis,
An electronic device housing, wherein a housing wall having a ventilation duct formed in the wall is disposed at a position facing the board, and the housing wall and the board are brought into contact with each other.   A cooling air supply path for supplying cooling air to the ventilation duct of the housing wall is formed on one of the two opposing surfaces of the chassis, and the cooling air is discharged from the ventilation duct to the other two surfaces of the chassis facing each other. The electronic device casing according to claim 1, wherein a cooling air discharge path is formed.   The electronic device casing according to claim 1, wherein the casing wall includes a heat sink in which at least one of a straight fin, an offset fin, and a pin fin is built in the ventilation duct.   The electronic device housing according to claim 3, wherein the fin is formed with a dense portion where a portion facing the main heat generating portion mounted on the board is denser than other portions.   The electronic device according to claim 4, wherein the fin is a straight fin, and the dense portion has a fin pitch of 0.35 to 0.7 mm, a fin thickness of 0.05 to 0.2 mm, and a fin height of 20 mm or less. Enclosure.   The electronic device casing according to claim 2, wherein a direction in which the board is inserted into the casing and a flow direction of the cooling air in the cooling air supply path are orthogonal to each other.   6. The electronic device casing according to claim 2, wherein a direction in which the board is inserted into the casing and a flow direction of the cooling air in the cooling air supply path are the same direction. The housing has a wall surface having a guide surface for guiding the insertion and removal of the board,
A connector portion for connecting the boards disposed on the motherboard in the housing;
A holder provided on the board and detachably engaged with the wall surface of the guide surface when the board is connected to the connector portion;
The said holding | maintenance tool has a biasing means which provides the biasing force which makes the said board contact the said housing | casing wall in a press-contact state at the time of engagement with the wall surface of the said guide surface. An electronic device casing according to claim 1. An indirect air-cooled electronic device housing that houses a plurality of electronic circuit module boards inside a box-shaped chassis,
The housing wall of the ventilation structure in which a ventilation duct is formed in the wall is disposed at a position facing the heat radiation surface side of the board,
The casing wall of the ventilation structure has a movable wall portion that becomes a floating structure with respect to the fixed portion of the chassis,
Fixing means for fixing the movable wall portion to the fixing portion of the chassis in a detachable manner and bringing the movable wall portion into close contact with the heat radiation surface of the board when the movable wall portion is fixed to the fixing portion of the chassis. An electronic device housing characterized by comprising: In the fixing means, the board of the electronic circuit module is housed in a housing part for housing the board of the electronic circuit module, and the board is coupled to a connector part for connecting the board disposed on the motherboard in the housing. In a state of being, having a retainer that is detachably engaged with the fixed portion of the chassis,
The electronic device according to claim 9, wherein the holding device includes a biasing unit that applies a biasing force that brings the movable wall portion into contact with the board in a press-contact state when the holder is engaged with the fixed portion of the chassis. Equipment housing.   The casing wall of the ventilation structure is provided with a seal member having a good slip between joint portions of the fixed portion of the chassis and the movable wall portion. Electronics housing.

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