JP2023018990A - Electronic apparatus assembly - Google Patents

Abstract

To provide an electronic apparatus assembly capable of cooling an inside and suppressing dust and dirt from accumulating on a substrate.SOLUTION: An electronic apparatus assembly includes: a housing having a first opening and a second opening; a fan provided in the second opening of the housing; and one or a plurality of electronic apparatus units. The electronic apparatus unit includes: a substrate; a heat-generation component that generates heat through energization; a closure panel; a cover; a radiator; and a ventilation unit. The closure panel is secured to other end at an opposite side of one end of the substrate. The cover covers all of a first surface of the substrate and all of an edge adjacent to the first surface of the substrate in collaboration with the closure panel. The radiator is provided on the cover. The ventilation unit is provided on the closure panel and formed on an outside of the cover in a position to apply air to the radiator on a path between the fans.SELECTED DRAWING: Figure 10

Description

Embodiments of the present invention relate to electronics assemblies.

For example, Patent Literature 1 discloses an electronic device assembly in which a radiator is installed on a substrate as one unit, and a plurality of units are housed in a housing. In one unit of this electronics assembly, air passes over the outside of the heatsink from bottom to top. An air intake is provided between the substrate and the radiator. An opening is formed at the upper end between the substrate and the radiator, and the air taken in from the air intake escapes from the opening above the air intake due to natural convection.

Japanese Patent Application Laid-Open No. 2001-339187

SUMMARY OF THE INVENTION The problem to be solved by the present invention is to provide an electronic device assembly that can be cooled internally and that prevents dust and dirt from accumulating on the substrate.

According to an embodiment, an electronics assembly includes a housing having a first opening and a second opening, and an electronics assembly provided in the second opening of the housing and extending from the outside of the first opening to the inside of the housing. It has a fan for inflowing air and discharging air inside the housing to the outside of the housing, and one or more electronic device units. The electronic device unit has a substrate, a heat-generating component that generates heat when energized, a closing panel, a cover, a radiator, and a first ventilation section. The board is proximate at one end toward the fan when it is attached to the housing through the first opening. A heat-generating component is mounted on the first surface of the substrate. A closure panel is fixed to the other end opposite to the one end of the substrate, and is supported in the first opening when the substrate is attached to the housing through the first opening. The cover cooperates with the closure panel to cover all of the first side of the substrate and all of the edge adjacent the first side of the substrate. The radiator is provided on the cover and radiates heat transferred from the heat-generating component. The first ventilation part is provided on the closure panel and is formed outside the cover at a position where air hits the radiator on the path between the fan.

1 is a schematic perspective view showing the front side of an electronic device assembly according to an embodiment; FIG. 1 is a schematic perspective view from above of an electronics assembly according to an embodiment; FIG. FIG. 3 is a schematic cross-sectional view along line III-III of the electronics assembly in FIG. 2; FIG. 2 is a schematic exploded perspective view of a part of the electronic device unit of the electronic device assembly according to the embodiment. 1 is a schematic perspective view of an electronics unit of an electronics assembly according to an embodiment; FIG. FIG. 6 is a schematic perspective view of the electronic device unit viewed from a direction different from that of FIG. 5; FIG. 6 is a schematic cross-sectional view along the VII-VII plane in FIG. 5; 6 is a schematic side view of an electronics unit of the electronics assembly viewed in the direction indicated by arrow VIII in FIG. 5; FIG. FIG. 9 is a schematic side view of the electronic device unit viewed from the direction indicated by arrow IX in FIGS. 5 and 8; FIG. 4 is a schematic perspective view of airflow inside and outside an electronics assembly according to an embodiment, viewed from above the electronics assembly. FIG. 4 is a schematic perspective view of airflow inside and outside an electronics assembly according to an embodiment, viewed from the side of the electronics assembly.

1-3 show an electronics assembly 10 according to the present embodiment. FIG. 1 is a schematic perspective view showing the front side of electronics assembly 10 . FIG. 2 is a view taken along line II-II in FIG. 3, and can also be said to be a schematic perspective view of the electronic device assembly 10 viewed from above. FIG. 3 is a schematic cross-sectional view of electronics assembly 10 in FIG. 2 along line III-III.

FIG. 4 is an exploded perspective view in which a part of the electronic device unit 20 is exploded. FIG. 5 is a schematic perspective view of the electronic equipment unit 20, looking at the cover 64 and radiator 66 side. FIG. 6 is a schematic perspective view of the electronic device unit 20, and is a view of the board mounting plate 52 side. FIG. 7 is a cross-sectional view along plane VII in FIG. FIG. 8 is a schematic diagram of the electronics unit 20 viewed from the direction indicated by arrow VIII in FIG. FIG. 9 is a schematic diagram of the electronic device unit 20 viewed from the direction indicated by the arrow IX in FIGS. 5 and 8. FIG.

FIG. 10 is a schematic perspective view of the airflow inside and outside the electronics assembly 10 shown in FIG. FIG. 11 is a schematic perspective view of airflow inside and outside the electronics assembly 10 shown in FIG.

One example of the electronics assembly 10 shown in FIGS. 1-11 is communication equipment, various control equipment, and the like. The electronic device assembly 10 includes a housing 12, a fan 14 provided in the housing 12, a motherboard board 16 fixed to the housing 12, a first connector 18 provided on the motherboard board 16, and a first and one or more electronic device units 20 that can be electrically connected to and disconnected from the connector 18 .

As shown in FIGS. 1 to 3, the housing 12 has a tubular shape, for example, a rectangular tubular shape. The housing 12 has, for example, an upper plate 12a, a lower plate 12b, and a pair of side plates 12c and 12d between the upper plate 12a and the lower plate 12b. The upper plate 12a and the lower plate 12b are formed, for example, in the form of plates having the same shape and size. The pair of side plates 12c and 12d are, for example, plate-shaped with the same shape and size. The housing 12 has an opening (first opening) 13a on the front side and an opening (second opening) on the back side by an upper plate 12a, a lower plate 12b, and a pair of side plates 12c and 12d. 13b. The opening 13a on the front side and the opening 13b on the back side are preferably aligned along one axis. In this embodiment, one axis is set so as not to pass through the top plate 12a, the bottom plate 12b, and the pair of side plates 12c and 12d. The one axis is preferably parallel to the inner surfaces of the top plate 12a, the bottom plate 12b, and the pair of side plates 12c and 12d, but misalignment is allowed.

In this embodiment, as shown in FIG. 2, an example in which the housing 12 has seven slots 30 in which seven electronic device units 20 can be arranged in parallel will be described. The number of slots 30 can be set appropriately. In this embodiment, the slot 30 has a rail 30a provided on at least one of the top plate 12a and the bottom plate 12b of the housing 12 . The rail 30a supports, for example, upper and lower edge portions (remaining end portions different from the one end portion 55a and the other end portion 55b) 55c and 55d of the board mounting plate 52, respectively. The outer surface of the board mounting plate 52 is supported in parallel with, for example, the pair of side plates 12c and 12d.

A fan 14 for forced air cooling is fixed to the opening 13b on the rear side of the housing 12 . When the fan 14 is driven, the air outside the housing 12 flows into the housing 12 and the air inside the housing 12 is discharged outside the housing 12 . In FIG. 2, two fans 14 are arranged. The number of fans 14 may be one, or three or more.

The motherboard board 16 is provided between the front side opening 13a and the rear side opening 13b of the housing 12 . The motherboard board 16 extends in the housing 12 so as to form a gap with the housing 12 at a position facing the fan 14 . The motherboard substrate 16 is supported by, for example, a pair of side plates 12c and 12d. In this embodiment, as an example, the motherboard board 16 is covered with a plate-like cover 17 made of, for example, an aluminum alloy material. The cover 17 covers the entire front and back surfaces of the motherboard substrate 16 . In this embodiment, the cover 17 forms gaps with the upper plate 12a of the housing 12 and between the lower plate 12b. The cover 17 is supported by, for example, the pair of side plates 12c and 12d.

A first connector 18 is provided on the motherboard substrate 16 . The first connector 18 is exposed to the outside through the cutout portion of the cover 17 . Although FIG. 2 shows an example in which the first connector 18 does not protrude outside the cover 17 , the first connector 18 may protrude outside the cover 17 .

As shown in FIG. 1 , the electronic device assembly 10 has a power supply section 42 , a wireless section 44 and a communication control section 46 as an example of the electronic device unit 20 . The power supply unit 42 , radio unit 44 , and communication control unit 46 are mounted by being inserted into the slot 30 of the housing 12 through the first opening 13 a on the front side of the housing 12 . In this embodiment, the communication control section 46 will be described as a representative example of the electronic device unit 20 .

As shown in FIGS. 4 to 9, the electronic device unit 20 includes, for example, a substantially rectangular board mounting plate 52, a substantially rectangular board 54, a second connector 56, and a heat generating component 58 that generates heat when energized. , a heat transfer member 60 , a closing panel 62 , a cover 64 , a radiator 66 , a first ventilation section 68 and a second ventilation section 70 .

The board mounting plate 52, the heat transfer member 60, the cover 64, and the radiator 66 are made of a material with high thermal conductivity such as an aluminum alloy. That is, the board mounting plate 52 , the heat transfer member 60 , the cover 64 and the radiator 66 are made of a material that dissipates the heat transferred from the heat generating component 58 .

The board mounting plate 52 and the board 54 are formed, for example, in a substantially rectangular shape. The short and long sides of the board mounting plate 52 are formed larger than the short and long sides of the board 54 . A substrate 54 is attached to the substrate mounting plate 52 . When looking at the board mounting plate 52 , the outer edge of the board 54 is arranged inside the outer edge of the board mounting plate 52 .

A second connector 56 is provided at one end 55 a of one of the four sides of the substrate 54 . The second connector 56 is detachable from the first connector 18 . The second connector 56 is electrically connected to the first connector 18 when the substrate 54 is attached to the housing 12 . The second connector 56 is electrically isolated from the first connector 18 when the electronics unit 20 is removed from the housing 12 . The second connector 56 electrically connects the heat-generating component 58 and electronic components 72 , 74 , 76 to be described later, and the motherboard substrate 16 .

The substrate 54 has a first surface 54a and a second surface 54b. A heat-generating component 58 that generates heat when energized is mounted on the first surface 54a. An example of the heat-generating component 58 is a power supply device such as an FPGA or CPU.

As shown in FIG. 4, other electronic components 72 and 74 different from the heat-generating component 58 are mounted on the first surface 54a. As shown in FIG. 7, another electronic component 76 different from the heat-generating component 58 is mounted on the second surface 54b. These electronic components 72, 74, 76 are formed as electronic devices necessary for appropriate communication when the electronic device assembly 10 is used as a communication device.

As shown in FIG. 4, the heat transfer member 60 is formed, for example, as a block-shaped member (heat transfer block) and fixed on the first surface 54a side of the substrate 54 . As shown in FIGS. 4 and 7, the heat transfer member 60 cooperates with the first surface 54a of the substrate 54 to sandwich the heat generating component 58 therebetween. Therefore, the heat-generating component 58 contacts the heat-transfer member 60 .

Note that the heat transfer member 60 may be fixed to the cover 64 or the radiator 66 .

As shown in FIG. 4, a closing panel 62 is fixed to the other end 55b of the substrate 54 opposite to the one end 55a. As shown in FIGS. 4 and 9, the closing panel 62 is provided with connection terminals 72a and 74a to which various cables are connected. The longitudinal length of the closure panel 62 is longer than the length of the other end portion 55b of the substrate 54 . When viewed from the front side of the electronic device assembly 10 , the closing panel 62 covers the entire other end 55 b of the substrate 54 .

For example, the end face 64a of the cover 64 contacts or approaches the back face 62a of the closing panel 62 . As shown in FIGS. 8 and 9, the end surface 64a of the cover 64 contacts or approaches the rear surface 62a of the closing panel 62 at three end surfaces 64a. It is preferable that the end surface 64a of the cover 64 is formed so that there is no or almost no gap with respect to the rear surface 62a of the closing panel 62. As shown in FIG.

In this embodiment, cover 64 cooperates with closure panel 62 to cover all of first surface 54a of substrate 54 . The cover 64 has an end face 64b formed by bending three sides of a plate made of an aluminum alloy. The cover 64 is formed with a notch portion 64c that is partially cut out so that the connection position with the first connector 18 of the second connector 56 is exposed.

In this embodiment, a substantially U-shaped notch 64d is formed in a portion of the cover 64 in order to accommodate a portion of the electronic components 72 while reducing the height of the cover 64 as much as possible. A lid member 65 is fixed to the notch portion 64d.

The cover 64 is provided on the board mounting plate 52 and fixed to a rod-like spacer 80 penetrating the board 54 with screws 80a, for example. At this time, the end face 64b of the cover 64 contacts the surface of the board mounting plate 52 on the side of the second surface 54b of the board 54 .

A radiator 66 is fixed to the cover 64 . The radiator 66 has a plurality of fins 66a so as to maximize the contact area with air. A heat-generating component 58 that requires cooling transfers heat to a radiator 66 . Therefore, the radiator 66 is provided on the cover 64 and radiates the heat transferred from the heat-generating component 58 to the outside of the electronic equipment unit 20 .

A first ventilation part 68 is provided in the closure panel 62 . The first ventilation part 68 is formed as a through hole, and is formed in a size and a shape that does not allow a cylindrical rod with a diameter of 12 mm, for example, to pass through. In the present embodiment, the first ventilation part 68 has rectangular holes of several millimeters square arranged in two rows, for example. The first ventilation part 68 is preferably divided into a plurality of parts in the longitudinal direction. The first ventilation part 68 causes air to flow into the inside of the housing 12 by driving the fan 14, and the outside of the cover 64 (the side opposite to the side facing the first surface 54a of the substrate 54), the fan 14 is formed at a position where air hits the radiator 66 on the path between . The fins 66a of the radiator 66 are formed at a position that can be seen behind the first ventilation section 68 through the first ventilation section 68, for example, when the electronic device assembly 10 is viewed from the front side.

A second ventilation part 70 is provided in the closure panel 62 . The second ventilation part 70 is formed as a through-hole, and is formed in a size and a shape that does not allow a cylindrical rod with a diameter of 12 mm to pass through, for example. In the present embodiment, the second ventilation part 70 has rectangular holes of several millimeters square formed in, for example, one row. It is preferable that the second ventilation part 70 is divided into a plurality of parts in the longitudinal direction. The second ventilation part 70 is driven by the fan 14 to allow air to flow into the inside of the housing 12, and the outside of the board mounting plate 52 (the side opposite to the side facing the second surface 54b of the board 54). It is formed at a position where air hits the path between it and the fan 14 .

By fitting the second connector 56 of the electronic device unit 20 to the first connector 18 of the motherboard substrate 16, the substrate 54 of the electronic device unit 20 and the motherboard substrate 16 are electrically connected. .

Note that the communication control unit 46 has a second connector 56 in this embodiment. The power supply unit 42 and the radio unit 44 do not have the second connector 56, and the power supply unit 42 and the radio unit 44 are electrically connected to the communication control unit 46 by wiring formed in the housing 12. There may be. In this case, even if the power supply unit 42 and the radio unit 44 do not have the second connector 56 connected to the motherboard substrate 16, the power supply unit 42 and the radio unit 44 can be connected to each other through the second connector 56 of the communication control unit 46. 44 electrically connects to the motherboard substrate 16 .

A substrate mounting plate 52 is arranged on the second surface 54b side of the substrate 54, and a closing panel 62 is arranged on the other end portion 55b of the substrate 54 on the front side. Therefore, the two surfaces of the substrate 54 (the second surface 54 b and the surface of the other end portion 55 b ) are closed by the substrate mounting plate 52 , the closing panel 62 and the cover 64 .

A cover 64 formed by bending three sides facing a first surface (front surface) 54a of the substrate 54 is adjacent to the entire first surface 54a of the substrate 54 and the first surface 54a with spacers 80 interposed therebetween. Cover all edges. Therefore, the remaining four surfaces of the substrate 54 (the surface facing the first surface 54 a of the cover 64 and the remaining three end surfaces) are covered with the cover 64 .

Therefore, in the electronic device unit 20, the substrate mounting plate 52, the closing panel 62, and the cover 64 are formed in a box shape that completely closes the substrate 54 as a whole.

The operation of the electronic device assembly 10 according to this embodiment will be described. Here, the effect of cooling the electronic device assembly 10 will be described.

The housing 12 of the electronic equipment assembly 10 according to this embodiment is placed indoors or outdoors, for example, in a place with a roof. Then, a plurality of electronic device units 20 assembled in advance, that is, a power supply unit 42, a radio unit 44, and a communication control unit 46 are inserted into the plurality of slots 30 of the housing 12 of the electronic device assembly 10. . Thus, one end of the board 54 approaches the fan 14 when the electronic device unit 20 is attached to the housing 12 through the first opening 13a. A second connector 56 provided at one end of the substrate 54 is electrically connected to the first connector 18 when the substrate 54 is attached to the housing 12 . The closure panel 62 is supported in the first opening 13a when the electronics unit 20 is mounted in the slot 30 of the housing 12 through the first opening 13a. Therefore, the electronic device assembly 10 can be maintained at the installation site of the housing 12 .

The slot 30 of the housing 12 may be empty. In this case, for example, a flat plate may be fixed around the empty slot 30 to close the empty slot 30 and prevent dust from entering the housing 12 .

It should be noted that the electronic device assembly 10 may be assembled before being placed in the appropriate position.

After the electronics assembly 10 is properly assembled, each electronics unit 20 of the electronics assembly 10 is energized and the fan 14 is rotated. When each electronics unit 20 of electronics assembly 10 is energized, fan 14 continues to rotate.

FIG. 10 shows an image diagram of the air flow in a horizontal section of the electronic device assembly 10, and FIG. 11 shows an image diagram of the air flow in a vertical section of the electronic device assembly 10. FIG. The fan 14 on the back of the electronic equipment assembly 10 allows outside air to enter through the ventilation portions 68 and 70 of the closure panel 62 and pass through the radiator 66 provided on the outside of the cover 64 covering the substrate 54 to cool the back of the electronic equipment assembly 10 . The air is exhausted from the fan 14 . The heat-generating components 58 on the substrate 54 are cooled by air passing through the radiator 66 .

In the electronic device assembly 10 , air enters the housing 12 through the first ventilation part 68 as a first flow path, and is exhausted from the fan 14 through the radiator 66 and the upper or lower side of the motherboard board 16 . At this time, the heat from the heat generating component 58 continues to be directly transferred to the heat transfer member 60 in contact with the heat generating component 58 and continues to be transferred to the radiator 66 in contact with the heat transfer member 60 . Therefore, the radiator 66 continues to be cooled by the air that continues to pass through the first flow path. Therefore, the heat generated from the heat-generating component 58 continues to be cooled by heat transfer.

The heat generated from the heat generating component 58 is not only transferred to the radiator 66 in contact with the heat transfer member 60 but also transferred to the cover 64 fixing the radiator 66 . Therefore, the cover 64 is cooled together with the radiator 66 by the air passing through the first flow path. Since the heat generated from the heat generating component 58 is transferred not only to the radiator 66 but also to the cover 64, the heat generated from the heat generating component 58 is cooled more efficiently by the heat transfer.

A lid member 65 fixed to the cover 64 is made of the same material as the cover 64 to increase the contact area with the air passing through the first flow path. Therefore, the lid member 65 fixed to the cover 64 cools the heat generated from the heat generating component 58 more efficiently.

The end surface 64 a of the cover 64 contacts or approaches the surface of the closing panel 62 at a position adjacent to the first ventilation portion 68 . Therefore, at a position adjacent to the first ventilation portion 68, the presence of a gap is minimized even if the surface of the closure panel 62 and the end surface 64a of the cover 64 are not airtightly formed. Even if the air that entered the housing 12 through the first ventilation part 68 is directed to the boundary between the closure panel 62 and the cover 64 , there is little or no gap between them, and the air flows outside the cover 64 . toward the radiator 66 provided in the . That is, the gap between the cover 64 and the closing panel 62 is formed so that the air that has flowed in from the first ventilation portion 68 passes through the outside of the cover 64 and then through the fan 14 . In this way, the electronic device unit 20 prevents the air passing through the first ventilation part 68 from entering the cover 64, and prevents dust from entering between the board 54 and the cover 64, for example. . Therefore, the electronic device unit 20 prevents dust from accumulating on the substrate 54, for example.

The cover 64 is formed in a shape that follows the insulating outer shell of the second connector 56 , and the notch 64 c of the cover 64 abuts or approaches the outer shell of the second connector 56 . Therefore, the existence of a gap between the cutout portion 64c of the cover 64 and the second connector 56 is minimized. Therefore, the air that has passed through the first ventilation portion 68 is prevented from entering the cover 64 , and dust and dirt are prevented from entering between the substrate 54 and the cover 64 , for example. Therefore, the electronic device unit 20 prevents dust from accumulating on the substrate 54, for example.

As mentioned above, the existence of a gap between the cutout 64c of the cover 64 and the outer shell of the second connector 56 is minimized. Therefore, even if the fan 14 stops or air flows from the fan 14 toward the first ventilation section 68 due to the influence of atmospheric pressure outside the electronic device assembly 10, the air does not pass through the fan 14. This suppresses the entry of air into the cover 64, and suppresses the entry of dust between the substrate 54 and the cover 64, for example. Therefore, the electronic device unit 20 prevents dust from accumulating on the substrate 54, for example.

The electronic equipment assembly 10 introduces air into the housing 12 through the second ventilation part 70 as a second flow path, and exhausts it from the fan 14 through the board mounting plate 52 and the upper side or the lower side of the motherboard board 16. . At this time, the outside of the board mounting plate 52 (the outside of the electronic device unit 20) is cooled by the air passing through the second flow path.

The end surface 64b of the cover 64 abuts or approaches the surface of the substrate mounting plate 52 that faces the second surface 54b of the substrate 54 . Therefore, the heat from the heat-generating component 58 is transferred to the substrate mounting plate 52 through the heat-transfer member 60 , radiator 66 and cover 64 . Therefore, the board mounting plate 52 is cooled by the air passing through the second flow path. Therefore, the heat generated from the heat-generating component 58 is transferred not only to the radiator 66 but also to the board mounting plate 52 through the cover 64, so that the heat generated from the heat-generating component 58 is cooled more efficiently.

In addition, the presence of a gap between the surface of the board mounting plate 52 and the end surface 64b of the cover 64 is minimized at the position adjacent to the second ventilation section 70. As shown in FIG. Therefore, the air passing through the second ventilation part 70 is prevented from entering between the board mounting plate 52 and the cover 64. Prevent dust and dirt from entering. Therefore, according to the electronic equipment assembly 10 according to the present embodiment, it is possible to prevent dust from accumulating on the substrate 54 of the electronic equipment unit 20, for example.

Thus, in the electronic device unit 20, the substrate mounting plate 52, the closing panel 62, and the cover 64 are formed in a box shape that completely closes the substrate 54 as a whole. On the other hand, heat from the heat generating component 58 is radiated through the heat transfer member 60, the cover 64, the radiator 66, and the board mounting plate 52. Moreover, since the cover 64 and the board mounting plate 52 are also in contact with the closing panel 62 , the heat from the heat-generating components 58 is also radiated from the closing panel 62 exposed to the outside of the electronic device assembly 10 . Therefore, the electronic device assembly 10 according to this embodiment is effectively cooled.

The electronic device assembly 10 according to the present embodiment includes a board mounting plate 52, a board 54, a heat-generating component 58, and electronic components 72 and 74, which are combined into a module to form one electronic device unit 20. It is mounted by inserting it through the first opening 13a, and is fitted with a connector to the motherboard substrate 16 constructed in the housing 12, and the heat generating component 58 and the electronic components 72, 74 and the motherboard substrate 16 are electrically connected. . In the housing 12 of the electronic device assembly 10 , the entire board 54 of each electronic device unit 20 is covered with a cover 64 . Air from forced air cooling by the fan 14 does not hit the board 54 of the electronic device unit 20 through the first ventilation section 68 and the second ventilation section 70 provided on the front closure panel 62 of the electronic device unit 20 .

With such a structure, the electronic device unit 20 prevents dirt, dust, and the like from entering the substrate 54 . Therefore, the electronic equipment assembly 10 according to the present embodiment does not have to consider dust entering the electronic equipment unit 20 . Therefore, the electronics assembly 10 can eliminate the need to mount filters on both the first ventilator 68 and the second ventilator 70 . As such, the use of the electronics assembly 10 eliminates the need for periodic cleaning of clogged filters. Therefore, the electronic equipment assembly 10 according to the present embodiment can reduce the frequency of maintenance. Since filters are not attached to both the first ventilation part 68 and the second ventilation part 70, clogging of the filters does not occur. can be suppressed. In addition, the electronic device assembly 10 according to the present embodiment does not reduce the amount of air inflow due to clogging of the filter and does not change the cooling efficiency. improvement can be achieved.

Therefore, according to the present embodiment, it is possible to provide the electronic device assembly 10 that can cool the inside and suppresses accumulation of dirt and dust on the substrate 54 .

The electronic device unit 20 mounted on the housing 12 is entirely covered with a plate-shaped cover (metal fitting) 64 made of, for example, aluminum, and the motherboard substrate 16 is entirely made of, for example, aluminum. It is covered with a cover (metal fitting) 64 . In the case of this embodiment, dust also enters the housing 12 together with the outside air through the ventilation portions 68 and 70 of the blocking panel 62 . However, in the electronic device assembly 10, even if dust or the like enters the housing 12, the electronic device unit 20 is covered with sheet metals (the board mounting plate 52, the closing panel 62, and the cover 64). It is possible to prevent dust from adhering to the substrate 54 and prevent tracking from occurring on the substrate 54 . In addition, since the motherboard board 16 is covered with the cover 17 , it is possible to prevent dust from adhering to the motherboard board 16 and tracking from occurring on the motherboard board 16 . Therefore, the electronic device assembly 10 according to this embodiment can improve the quality of the device.

In this embodiment, the communication control unit 46 has the second connector 56, and the power supply unit 42 and the wireless unit 44 do not have the second connector 56. FIG. In this case, in the power supply unit 42 and the wireless unit 44 as the electronic equipment unit 20, it is not necessary to form the notch 64c in the cover 64. FIG. That is, the power supply unit 42 and the wireless unit 44 can cover the first surface 54a side and end surfaces other than the closing panel 62 with the cover 64 having three sides bent.
On the other hand, as the electronic equipment unit 20 , it is also preferable that not only the communication control section 46 but also the power supply section 42 and the wireless section 44 each have a second connector 56 . In this case, the motherboard board 16 is provided with the first connectors 18 so as to be electrically connected to the respective second connectors 56 .

In this embodiment, the first surface 54a and the second surface 54b of the substrate 54 and the ends 55a, 55b, 55c and 55d are covered with the substrate mounting plate 52, the closing panel 62 and the cover 64. For example, the substrate mounting plate 52 is not necessarily required by forming the cover 64 into a cylindrical shape with a bottom and by abutting the open end of the cylindrical cover 64 with a bottom on the closing panel 62 . In this case, it is sufficient that the cover 64 and the substrate 54 are fixed.

1 to 3, an example in which the pair of side plates 12c and 12d and the board mounting plate 52 of the electronic device unit 20 are parallel has been described. It may be formed so as to be parallel to the mounting plate 52 . In this case, the slot 30 has a rail 30a provided on at least one of the pair of side plates 12c and 12d of the housing 12. As shown in FIG. The shapes of the closing panel 62 , the first ventilation part 68 and the second ventilation part 70 are also formed in accordance with the slot 30 .

According to at least one of the embodiments described above, it is possible to provide the electronic equipment assembly 10 that can cool the inside and suppresses accumulation of dirt and dust on the substrate 54 .

While several embodiments of the invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 10... Electronic equipment assembly, 12... Housing, 13a... First opening, 13b... Second opening, 14... Fan, 16... Motherboard board, 17... Cover, 18... First connector, 20... Electronic equipment unit , 42... power supply unit, 44... wireless unit, 46... communication control unit, 52... substrate mounting plate, 54... substrate, 54a... first surface, 54b... second surface, 55a... one end, 55b... other end Part 56 Second connector 58 Heat generating component 60 Heat transfer member 62 Closing panel 64 Cover 64a, 64b End face 66 Radiator 68 First ventilation part 70 Second ventilation part

Claims (8)

a housing having a first opening and a second opening;
provided in the second opening of the housing, and when driven, causes air to flow from the outside of the first opening into the inside of the housing, and moves the air inside the housing to the inside of the housing. A fan that discharges to the outside,
a substrate with one end proximate toward the fan when attached to the housing through the first opening;
a heat-generating component that is mounted on the first surface of the substrate and generates heat when energized;
a closure panel fixed to the other end opposite to the one end of the substrate and supported in the first opening when the substrate is attached to the housing through the first opening;
a cover that cooperates with the closure panel to cover all of the first surface of the substrate and all of an edge of the substrate adjacent the first surface;
a radiator provided on the cover for radiating heat transferred from the heat-generating component; and
provided on the closing panel, and driven by the fan to allow the air to flow into the inside of the housing, and outside the cover, at a position where the air hits the radiator on the path between the fan and the fan. one or more electronics units having a first vent formed;
an electronics assembly. The electronic device unit includes:
3. A substrate mounting plate to which said substrate is mounted, facing a second surface opposite said first surface, and having a substrate mounting plate that cooperates with said cover to cover said entirety of said second surface of said substrate. 2. The electronics assembly of claim 1. The electronic device unit includes:
one or more electronic components fixed to the second surface of the substrate;
The closing panel is provided at a position where the fan is driven to allow the air to flow into the inside of the housing and hit the outside of the substrate mounting plate on the path between the fan and the air. 3. The electronics assembly of claim 2, comprising: a second vent; 4. The electronics assembly of claim 3, wherein the board mounting plate, the closure panel, and the cover are generally formed into a box shape that closes all of the board. 5. The electronic device unit according to any one of claims 1 to 4, further comprising a heat transfer member that is in contact with the heat-generating component and the cover or the radiator and that transfers heat from the heat-generating component to the radiator. 2. The electronics assembly of claim 1. a motherboard board extending in a state facing the fan and forming a gap between the housing and the housing;
a first connector provided on the motherboard substrate;
The electronic device unit has a second connector provided at the one end of the substrate and electrically connected to the first connector when the substrate is attached to the housing,
1. The cover is formed in a shape that exposes connection terminals with the first connector of the second connector and that conforms to the outer shell of the second connector. 6. The electronics assembly of claim 5. 7. The electronic device assembly according to claim 6, wherein said cover has cutouts for exposing said connection terminals of said second connector to the outside. 8. The electronic device assembly according to claim 1, wherein said cover is made of a material that dissipates heat transferred from said heat-generating component.

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