WO2016189351A1 - Dispositif de refroidissement étanche à l'eau - Google Patents

Dispositif de refroidissement étanche à l'eau Download PDF

Info

Publication number
WO2016189351A1
WO2016189351A1 PCT/IB2015/053863 IB2015053863W WO2016189351A1 WO 2016189351 A1 WO2016189351 A1 WO 2016189351A1 IB 2015053863 W IB2015053863 W IB 2015053863W WO 2016189351 A1 WO2016189351 A1 WO 2016189351A1
Authority
WO
WIPO (PCT)
Prior art keywords
chassis
cooling device
plate
electronic
waterproof cooling
Prior art date
Application number
PCT/IB2015/053863
Other languages
English (en)
Inventor
Ali Murtaza DALGIC
Original Assignee
Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi filed Critical Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
Priority to PCT/IB2015/053863 priority Critical patent/WO2016189351A1/fr
Priority to TR2017/17188T priority patent/TR201717188T6/tr
Publication of WO2016189351A1 publication Critical patent/WO2016189351A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

Definitions

  • the present invention relates to a waterproof cooling device capable of cooling all surfaces of electronic boards with combination of conduction and convection.
  • High power dissipating electronic assemblies require cooling air to be directed through a compact heat exchanger.
  • This usually consists of a pair of printed circuit boards which may be bonded, or more likely fastened together by means of a frame positioned between the two modules. It is necessary to provide a reliable seal at each end of these modules to prevent leakage of any cooling air between the electronics rack and the removable module. Such leakage can have drastic effect on the system's thermal performance and overall reliability.
  • an air seal between an electronics rack and the removable electronics module that also provides a means to ensure low deflections during vibration through use of a fixed boundary condition. It is also desirable to have a sealing system which is resistant to jamming and misalignment and conducive to maintenance and repair. It is further preferred to have a sliding air seal which is cost effective and resistant to corrosive environmental conditions.
  • Avionics electronic board chassis are cooled using a current of cool air circulating under the chassis.
  • Each chassis is allocated a portion of the total flow of this current of cool air, notably according to the power that it dissipates, in order to cool it.
  • This cool air is injected into the chassis and cooled electronic boards without leak tightness property.
  • Each board has to comply with constraints of head loss introduced on the current of cool air.
  • cooling designs consisted of only convection or conduction cooling method separately and these cooling techniques do not hove waterproof property.
  • a system may include a chassis having a pair of stationary rails mechanically coupled thereto. Each stationary rail may receive a corresponding telescoping sliding rail. Each stationary rail/sliding rail combination may be configured to convey a cooling fluid to or from a heat exchanger.
  • the system may include a first stationary rail configured mechanically couple to a chassis fluidically couple to a first external fluidic conduit such that the first stationary rail may receive a cooling fluid from the first external fluidic conduit and conduct the cooling liquid internally from the first external fluidic conduit through at least a portion of the first stationary rail.
  • EP2106205A2 discloses an electronics housing system adapted for electronic devices includes a main chassis unit and at least one removable module mountable with the base unit for supporting electronic circuitry components electro-optically coupled with the base unit. Furthermore, the module mounting assembly or wall of the electronics rack or main chassis housing includes a pair of guide rails extending from the module mounting assembly or wall forming a U-shaped channel between the pair of guide rails for receiving one of the mounting edges of the removable module assembly.
  • An objective of the present invention is to realize a waterproof cooling device which cools electronic boards with fluid by using conduction and convection method together.
  • a further objective of the present invention to realize a waterproof cooling device which has sealed and integrated chassis which reduces cost, tooling, and manufacturing complexity.
  • a further objective of the present invention is to realize a waterproof cooling device which can be low sound level.
  • Figure 1 shows a perspective view of the waterproof cooling device
  • Figure 2 shows a perspective view of the waterproof cooling device with fan
  • FIG 3 shows a perspective view of the waterproof cooling device with boards
  • Figure 4 shows a cross-sectional view of the waterproof cooling device
  • Electronic board waterproof cooling device (1) comprises
  • At least one wedge lock (3) which holds and guides the electronic board (B),
  • At least one blower fan (4) which is placed on a face of the chassis (2), at least one plate (5) which is placed near the electronic board (B) and extends from one end to the other end of the chassis (2),
  • At least one channel (6) which is placed inside the plate (5) and through which the fluid pass.
  • the waterproof cooling device (1) cools electronic boards (B) which are inside of sealed the chassis (2).
  • the waterproof cooling device (1) is made up of chassis (2), wedge lock (3), blower fan (4), plate (5) and fluid channel (6).
  • the chassis (2) which has a sealed property, is the form of a box shape and it made of aluminium optionally. Electrical electronic boards (B) are placed inside the chassis (2) by using wedge lock (3). Wedge locks (3) is placed edge of electronic boards and it is connected chassis (2) inside wall by using fastener or weld method optionally.
  • Blower fan (4) is placed on a face of chassis (2) and fan (4) is used to heat dissipation of the chassis (2).
  • a flat shape plate (5) is integrated into the chassis (2).
  • the plate (5) which extends from one end to the other end of the chassis (2), placed in front of the electronic board (B) and behind the electronic board (B).
  • the plate (5) and chassis (2) made of aluminum optionally, are produced together.
  • the channel (6) has a pipe shape optionally and the channel (6) placed inside the plate (5) extends from one end to the other end of the plate (5). Furthermore, air flow passes through the channel (6).
  • the waterproof cooling device (1) adapted to provide cooling electronic board (B) by using air flow which passes through the fluid channel (6).
  • the electronic boards (B) are placed into sealed chassis (2) with wedge lock (3).
  • the chassis (2) and plate (5) are produced together and they made of aluminium optionally.
  • the channel (6) is placed into the plate (5).
  • self heating electronic boards (B) which should be cooled for high performance so the electronic boards (B)'s heat is transferred to plate (5) which is positioned in front of the electronic board (B) and behind the electronic board (B).
  • Fan (4) is placed one side of chassis (2) and at the end of the channel (6).
  • the heat of plate (5) is transferred to air which is passed inside the channel (6). Heat fluid is ejected from chassis (2) thanks to fan (4) and cooling operation of electronic boards (B) is occurred.
  • wedge lock (3) which is used to lock and mount electronic boards (B) on chassis (2), absorb heat of the electronic boards (B) and wedge lock (3) is transferring to heat on chassis (2) side walls. As a result of that, cooling operation of electronic boards (B) is occurred.
  • thermal pad is placed on electronic boards (B) to improve heat transfer of the system.

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement (1) étanche à l'eau, refroidissant les cartes électroniques (B), comprenant au moins un châssis (2), au moins un verrouillage (3) par clavette, qui supporte et guide la carte électronique (B), au moins un ventilateur soufflant (4) qui est placé sur une face du châssis (2), au moins une plaque (5) qui est placée à proximité de la carte électronique (B) et s'étend à partir d'une extrémité jusqu'à l'autre extrémité du châssis (2), au moins un canal (6) qui est placé à l'intérieur de la plaque (5) et traversé par le fluide.
PCT/IB2015/053863 2015-05-25 2015-05-25 Dispositif de refroidissement étanche à l'eau WO2016189351A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/IB2015/053863 WO2016189351A1 (fr) 2015-05-25 2015-05-25 Dispositif de refroidissement étanche à l'eau
TR2017/17188T TR201717188T6 (tr) 2015-05-25 2015-05-25 Su geçi̇rmez bi̇r soğutucu ci̇haz

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2015/053863 WO2016189351A1 (fr) 2015-05-25 2015-05-25 Dispositif de refroidissement étanche à l'eau

Publications (1)

Publication Number Publication Date
WO2016189351A1 true WO2016189351A1 (fr) 2016-12-01

Family

ID=53510932

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2015/053863 WO2016189351A1 (fr) 2015-05-25 2015-05-25 Dispositif de refroidissement étanche à l'eau

Country Status (2)

Country Link
TR (1) TR201717188T6 (fr)
WO (1) WO2016189351A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060133033A1 (en) * 2004-12-20 2006-06-22 Harris Corporation Heat exchanger system for circuit card assemblies
EP2071912A2 (fr) * 2007-12-11 2009-06-17 Honeywell International Inc. Supports pour utiliser les modules électroniques refroidis à conduction dans un système d'air refroidi
EP2106205A2 (fr) 2008-03-06 2009-09-30 Northrop Grumman Systems Corporation Joint d'étanchéité à l'air durci et à alignement automatique pour unités électroniques amovibles
EP2804456A2 (fr) * 2013-05-15 2014-11-19 DY 4 Systems Inc. Enceinte refroidie par un fluide pour appareil de module de circuit et procédés de refroidissement d'un module de circuit refroidi par conduction
US20150090425A1 (en) 2011-10-28 2015-04-02 Dell Products L.P. System and method for cooling information handling resources

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060133033A1 (en) * 2004-12-20 2006-06-22 Harris Corporation Heat exchanger system for circuit card assemblies
EP2071912A2 (fr) * 2007-12-11 2009-06-17 Honeywell International Inc. Supports pour utiliser les modules électroniques refroidis à conduction dans un système d'air refroidi
EP2106205A2 (fr) 2008-03-06 2009-09-30 Northrop Grumman Systems Corporation Joint d'étanchéité à l'air durci et à alignement automatique pour unités électroniques amovibles
US20150090425A1 (en) 2011-10-28 2015-04-02 Dell Products L.P. System and method for cooling information handling resources
EP2804456A2 (fr) * 2013-05-15 2014-11-19 DY 4 Systems Inc. Enceinte refroidie par un fluide pour appareil de module de circuit et procédés de refroidissement d'un module de circuit refroidi par conduction

Also Published As

Publication number Publication date
TR201717188T6 (tr) 2017-12-21

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