WO2016189199A1 - Module à radio fréquence et carte de circuit imprimé - Google Patents

Module à radio fréquence et carte de circuit imprimé Download PDF

Info

Publication number
WO2016189199A1
WO2016189199A1 PCT/FI2016/050351 FI2016050351W WO2016189199A1 WO 2016189199 A1 WO2016189199 A1 WO 2016189199A1 FI 2016050351 W FI2016050351 W FI 2016050351W WO 2016189199 A1 WO2016189199 A1 WO 2016189199A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
antenna
circuit board
ground plane
components
Prior art date
Application number
PCT/FI2016/050351
Other languages
English (en)
Inventor
Raimo MÄKELÄ
Petri JÄRVINEN
Tauno VÄHÄ-HEIKKILÄ
Mervi Hirvonen
Original Assignee
Mäkelä Raimo
Järvinen Petri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mäkelä Raimo, Järvinen Petri filed Critical Mäkelä Raimo
Priority to EP16799413.6A priority Critical patent/EP3304644A4/fr
Publication of WO2016189199A1 publication Critical patent/WO2016189199A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • the invention relates to a radio frequency (RF) module and to a circuit board comprising the radio frequency module.
  • RF radio frequency
  • Radio frequency modules are known in the prior art. Radio frequency (RF) modules are small electronic devices used to transmit and/or receive radio signals between two devices.
  • RF Radio frequency
  • Radio frequency (RF) modules are widely used in electronic design owing to the difficulty of designing radio circuitry.
  • Good electronic radio design is complex because of the sensitivity of radio circuits and the accuracy of components and layouts required to achieve operation on a specific frequency.
  • reliable RF communication circuit requires careful monitoring of the manufacturing process to ensure that the RF performance is not adversely affected. For these reasons, pre-made radio modules are often used rather using a discrete design.
  • RF modules may comply with a defined protocol for RF communications such as Zigbee, Bluetooth low energy, or Wi-Fi, or they may implement a Proprietary protocol.
  • the prior art RF-module solutions require strict and complex requirements for the underlying circuit board, e.g. requirements for big external ground plane area connected to the RF-module. If e.g. external ground plane areas are not used with prior art RF-modules, receiving and transmitting frequency range of the antenna can be shifted off from the designed frequency range when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). Summary of the invention
  • the solution of the present invention is a radio frequency module which is able to operate as a transceiver.
  • the RF-module according to the invention has a sandwich structure which comprises an antenna layer processed from organic substrate material, the antenna layer comprising an antenna element.
  • the RF-module further comprises a ground plane below the antenna layer and a component board below the ground plane, to which components can be attached e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna.
  • the RF-module further comprises connectors for coupling the RF-module to a circuit board.
  • only antenna matching and filter components are implemented in the IPD to ensure small size and competitive price.
  • the invention relates also to a circuit board which comprises the RF- module of the invention.
  • the circuit board comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the module when the RF-module is attached to its place on the circuit board.
  • frequency range of the selective receiver and transmitter of the antenna is not essentially shifted off from the designed range even when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). If the RF-module is very close to ground plane or tissue, the amplification of the antenna can slightly decrease but the selectivity is not essentially affected and the frequency range transmitted and received by the antenna is not tuned off from the designed range. This kind of performance can't be achieved with the prior art RF-modules without large external ground planes to which the prior art RF-modules are attached.
  • the RF-module of the invention can be attached to any kind of generic circuit board, only the RF module footprint just under the module is specified. This is a considerable advantage compared to prior art RF-modules, e.g. prior art BLE-modules which have much stricter and much more com- plex requirements for the underlying circuit board, e.g. requirements for big ground plane area.
  • Fig. 1 presents an example embodiment of the RF-module and different parts of the RF-module as well as an application board to which the RF-module can be connected.
  • the RF-module of the present invention has a sandwich structure.
  • the antenna is arranged on top of the structure on the antenna layer 102.
  • the antenna can be made of high performance RF material.
  • Other components such as Radio Frequency Integrated Circuit (RFIC), Integrated Passive Devices (IPD) 108 and all other needed RF-components 110 are arranged under the antenna.
  • RFIC and IPD blocks 108 as well as other needed RF- components 110 can be attached to a component board 106, on the opposite side of the antenna.
  • the component board can be e.g. a circuit board such as a FR-4 circuit board to which components are attached.
  • the IPD 108 of the RF-module comprises an antenna matching circuit as well as filter components.
  • the whole structure stands on connectors 112 e.g. BGA balls, leaving the RFIC, IPD 108 and RF-components 110 on the top side of the module.
  • the RF-module can be attached to any generic electric board or circuit board with the connectors 112.
  • the antenna of the RF-module according to the invention needs a matching network to drive the small and highly reactive antenna impedance to e.g. 50 ⁇ standard impedance.
  • This matching can be implemented e.g. by using series capacitor and parallel inductor topology.
  • the antenna matching circuit is implemented on the IPD platform.
  • RF-filter is integrated on the IPD.
  • the IPD in according to one embodiment of the invention can be based on thin film technologies over the quartz or silicon wafers. This solution is cost effective and the line widths and tolerances are excellent.
  • the IPD module integration can be done using flip-chip bonding which provides higher I/O density, RF properties and better mass market manufacturing potential than wire bonding.
  • the IPD block which includes the antenna matching e.g. to 50 ⁇ as well as filtering can be e.g. 1.5x1.2mm.
  • the total size of the RF-module can be e.g. 7.5x13.5x4.5mm.
  • the RF-module can be e.g. a Bluetooth low energy (BLE) RF-module, Bluetooth-, Zigbee-, RFID- or Wi-Fi-module, or it may implement a proprietary protocol .
  • BLE Bluetooth low energy
  • the RF-module can operate e.g. in the 2.4GHz ISM band, more specifically from 2.400 to 2.484 GHz or other ISM radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, 5 GHz, 5.8 GHz or other radio bands.
  • this antenna and RF-module can operate well on any kind of generic board structure; only the module footprint just under the module is specified. So with the RF-module of this invention there are no size specifications, no external ground plane or ground plane opening specifications for the generic board. This is an advantage, since the prior art RF-modules need a special opening area or a certain size of external ground plane on the generic board.
  • the RF-module is connected to a circuit board 114 which comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the RF-module.
  • the performance of the RF-module according to the invention can be even further be increased by having a ground plane in the circuit board to which the RF-module is connected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)

Abstract

Module RF et carte de circuit imprimé comprenant un module RF, le module RF comportant une structure sandwich qui comprend une couche antenne (102) traitée à partir d'un matériau de substrat organique, la couche antenne comprenant un élément d'antenne, un plan de masse (104) sous la couche antenne, une carte (106) de composants sous le plan de masse, sur laquelle des composants sont fixés, par exemple par soudage par refusion, les composants comprenant un circuit de filtrage et d'appariement basé sur l'IPD de l'antenne (108), et des connecteurs (112) pour coupler le module RF à une carte de circuit imprimé.
PCT/FI2016/050351 2015-05-25 2016-05-24 Module à radio fréquence et carte de circuit imprimé WO2016189199A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16799413.6A EP3304644A4 (fr) 2015-05-25 2016-05-24 Module à radio fréquence et carte de circuit imprimé

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board
FI20155386 2015-05-25

Publications (1)

Publication Number Publication Date
WO2016189199A1 true WO2016189199A1 (fr) 2016-12-01

Family

ID=57392924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2016/050351 WO2016189199A1 (fr) 2015-05-25 2016-05-24 Module à radio fréquence et carte de circuit imprimé

Country Status (3)

Country Link
EP (1) EP3304644A4 (fr)
FI (1) FI127701B (fr)
WO (1) WO2016189199A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10276521B2 (en) 2016-12-29 2019-04-30 Skyworks Solutions, Inc. Front end systems and related devices, integrated circuits, modules, and methods
US10283859B2 (en) 2016-04-19 2019-05-07 Skyworks Solutions, Inc. Selective shielding of radio frequency modules
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
WO2020157315A1 (fr) * 2019-01-31 2020-08-06 Thales Procede de fabrication d'une carte micromodules haute densite
US11088112B2 (en) 2016-04-18 2021-08-10 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
WO2022034262A1 (fr) 2020-08-14 2022-02-17 Teknologian Tutkimuskeskus Vtt Oy Structure de couvercle et module pour dispositif rf portable miniaturisé et dispositif rf portable
US11984857B2 (en) 2015-12-30 2024-05-14 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier

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WO2005011055A1 (fr) * 2003-07-24 2005-02-03 Koninklijke Philips Electronics N.V. Perfectionnements apportes a l'accord des antennes planes en gamma
US20060049986A1 (en) * 2004-09-08 2006-03-09 Dunn Gregory J Integrated patch antenna and electronics assembly and method for fabricating
EP1777551A2 (fr) * 2005-10-18 2007-04-25 Hitachi, Ltd. Appareil radar à ondes millimétriques et système radar millimétrique
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20140253382A1 (en) * 2012-05-07 2014-09-11 Wilocity, Ltd. Graded-ground design in a millimeter-wave radio module

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US7477197B2 (en) * 2006-12-29 2009-01-13 Intel Corporation Package level integration of antenna and RF front-end module
US9196958B2 (en) * 2012-07-26 2015-11-24 Apple Inc. Antenna structures and shield layers on packaged wireless circuits

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WO2005011055A1 (fr) * 2003-07-24 2005-02-03 Koninklijke Philips Electronics N.V. Perfectionnements apportes a l'accord des antennes planes en gamma
US20060049986A1 (en) * 2004-09-08 2006-03-09 Dunn Gregory J Integrated patch antenna and electronics assembly and method for fabricating
EP1777551A2 (fr) * 2005-10-18 2007-04-25 Hitachi, Ltd. Appareil radar à ondes millimétriques et système radar millimétrique
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20140253382A1 (en) * 2012-05-07 2014-09-11 Wilocity, Ltd. Graded-ground design in a millimeter-wave radio module

Non-Patent Citations (1)

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See also references of EP3304644A4 *

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11984857B2 (en) 2015-12-30 2024-05-14 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US11088112B2 (en) 2016-04-18 2021-08-10 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
US10931009B2 (en) 2016-04-19 2021-02-23 Skyworks Solutions, Inc. Methods for selectively shielding radio frequency modules
US10283859B2 (en) 2016-04-19 2019-05-07 Skyworks Solutions, Inc. Selective shielding of radio frequency modules
US12003025B2 (en) 2016-04-19 2024-06-04 Skyworks Solutions, Inc. Selectively shielded radio frequency modules
US10320071B2 (en) 2016-04-19 2019-06-11 Skyworks Solutions, Inc. Methods for selectively shielding radio frequency modules
US10530050B2 (en) 2016-04-19 2020-01-07 Skyworks Solutions, Inc. Selectively shielding radio frequency module with multi-layer antenna
US11038266B2 (en) 2016-05-04 2021-06-15 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US11552393B2 (en) 2016-05-04 2023-01-10 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna and related methods
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
US10276521B2 (en) 2016-12-29 2019-04-30 Skyworks Solutions, Inc. Front end systems and related devices, integrated circuits, modules, and methods
US11037893B2 (en) 2016-12-29 2021-06-15 Skyworks Solutions, Inc. Selectively shielded radio frequency module with linearized low noise amplifier
US11864295B2 (en) 2016-12-29 2024-01-02 Skyworks Solutions, Inc. Selectively shielded radio frequency module with multi-mode stacked power amplifier stage
US10629553B2 (en) 2016-12-29 2020-04-21 Skyworks Solutions, Inc. Front end systems with linearized low noise amplifier and injection-locked oscillator power amplifier stage
US11576248B2 (en) 2016-12-29 2023-02-07 Skyworks Solutions, Inc. Front end systems with multi-mode power amplifier stage and overload protection of low noise amplifier
US11682649B2 (en) 2017-03-10 2023-06-20 Skyworks Solutions, Inc. Radio frequency modules
US11043466B2 (en) 2017-03-10 2021-06-22 Skyworks Solutions, Inc. Radio frequency modules
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
FR3092467A1 (fr) * 2019-01-31 2020-08-07 Thales Procédé de fabrication d’une carte micromodules haute densité
WO2020157315A1 (fr) * 2019-01-31 2020-08-06 Thales Procede de fabrication d'une carte micromodules haute densite
WO2022034262A1 (fr) 2020-08-14 2022-02-17 Teknologian Tutkimuskeskus Vtt Oy Structure de couvercle et module pour dispositif rf portable miniaturisé et dispositif rf portable

Also Published As

Publication number Publication date
EP3304644A4 (fr) 2019-01-02
FI127701B (en) 2018-12-31
EP3304644A1 (fr) 2018-04-11
FI20155386A (fi) 2016-11-26

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