FI127701B - Radio frequency module and circuit board - Google Patents

Radio frequency module and circuit board Download PDF

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Publication number
FI127701B
FI127701B FI20155386A FI20155386A FI127701B FI 127701 B FI127701 B FI 127701B FI 20155386 A FI20155386 A FI 20155386A FI 20155386 A FI20155386 A FI 20155386A FI 127701 B FI127701 B FI 127701B
Authority
FI
Finland
Prior art keywords
module
antenna
circuit board
ground plane
components
Prior art date
Application number
FI20155386A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20155386A (en
Inventor
Petri Järvinen
Raimo Mäkelä
Tauno Vähä-Heikkilä
Mervi Hirvonen
Original Assignee
Maekelae Raimo
Jaervinen Petri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maekelae Raimo, Jaervinen Petri filed Critical Maekelae Raimo
Priority to FI20155386A priority Critical patent/FI127701B/en
Priority to EP16799413.6A priority patent/EP3304644A4/en
Priority to PCT/FI2016/050351 priority patent/WO2016189199A1/en
Publication of FI20155386A publication Critical patent/FI20155386A/en
Application granted granted Critical
Publication of FI127701B publication Critical patent/FI127701B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)

Abstract

An RF-module and a circuit board comprising an RF-module, wherein the RF-module has a sandwich structure which comprises an antenna layer (102) processed from organic substrate material, the antenna layer comprising an antenna element, a ground plane (104) below the antenna layer, a component board (106) below the ground plane, to which components are attached, e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna (108), and connectors (112) for coupling the RF-module to a circuit board.

Description

The invention relates to a radio frequency (RF) module and to a circuit board comprising the radio frequency module.
Background of the invention
Radio frequency modules are known in the prior art. Radio frequency (RF) modules are small electronic devices used to transmit and/or receive radio signals between two devices.
Radio frequency (RF) modules are widely used in electronic design owing to the difficulty of designing radio circuitry. Good electronic radio design is complex because of the sensitivity of radio circuits and the accuracy of components and layouts required to achieve operation on a specific fre20 quency. In addition, reliable RF communication circuit requires careful monitoring of the manufacturing process to ensure that the RF performance is not adversely affected. For these reasons, pre-made radio modules are often used rather using a discrete design.
Several carrier frequencies are commonly used in commercially-available RF-modules, including those in the industrial, scientific and medical (ISM) radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, and 2400 MHz. RF modules may comply with a defined protocol for RF communications such as Zigbee, Bluetooth low energy, or Wi-Fi, or they may imple30 ment a Proprietary protocol.
Some prior art solutions are described in publications US2008036668 Al, US2002049042 AI, US2010060454 AI, US2015035718 Al and US2003176179 Al.
The prior art RF-module solutions require strict and complex requirements for the underlying circuit board, e.g. requirements for big external ground plane area connected to the RF-module. If e.g. external ground plane areas are not used with prior art RF-modules, receiving and transmitting fre2 quency range of the antenna can be shifted off from the designed frequency range when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect).
20155386 prh 21 -05- 2018
Summary of the invention
The solution of the present invention is a radio frequency module which is able to operate as a transceiver. The RF-module according to the inven10 tion has a sandwich structure which comprises an antenna layer processed from organic substrate material, the antenna layer comprising an antenna element. The RF-module further comprises a ground plane below the antenna layer and a component board below the ground plane, to which components can be attached e.g. by reflow soldering, the components comprising IPD-based matching and filtering circuit of the antenna. The RF-module further comprises connectors for coupling the RF-module to a circuit board.
In one embodiment of the invention, only antenna matching and filter components are implemented in the IPD to ensure small size and competitive price.
The invention relates also to a circuit board which comprises the RFmodule of the invention. In one embodiment of the invention the circuit board comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the module when the RF-module is attached to its place on the circuit board.
With the solution of the present invention frequency range of the selective receiver and transmitter of the antenna is not essentially shifted off from the designed range even when the module is attached close to a ground plane or close to living tissue such as skin (skin-effect). If the RF-module is very close to ground plane or tissue, the amplification of the antenna can slightly decrease but the selectivity is not essentially affected and the frequency range transmitted and received by the antenna is not tuned off from the designed range. This kind of performance can't be achieved with the prior art RF-modules without large external ground planes to which the prior art RF-modules are attached.
The RF-module of the invention can be attached to any kind of generic circuit board, only the RF module footprint just under the module is specified. This is a considerable advantage compared to prior art RF-modules, e.g. prior art BLE-modules which have much stricter and much more com5 plex requirements for the underlying circuit board, e.g. requirements for big ground plane area.
Brief description of the drawings
In the following, the invention will be described in more detail by means of an embodiment example with reference to the appended drawings, in which
Fig. 1 presents an example embodiment of the RF-module and different parts of the RF-module as well as an application board to which the RF-module can be connected.
20155386 prh 21 -05- 2018
Detailed description of the invention
One example embodiment of the RF-module is illustrated in Fig. 1. The RF-module of the present invention has a sandwich structure. The antenna is arranged on top of the structure on the antenna layer 102. The antenna can be made of high performance RF material. Other components such as Radio Frequency Integrated Circuit (RFIC), Integrated Passive Devices (IPD) 108 and all other needed RF-components 110 are arranged under the antenna. RFIC and IPD blocks 108 as well as other needed RFcomponents 110 can be attached to a component board 106, on the oppo30 site side of the antenna. The component board can be e.g. a circuit board such as a FR-4 circuit board to which components are attached. The IPD 108 of the RF-module comprises an antenna matching circuit as well as filter components. The whole structure stands on connectors 112 e.g. BGA balls, leaving the RFIC, IPD 108 and RF-components 110 on the top side of the module. The RF-module can be attached to any generic electric board or circuit board with the connectors 112.
The antenna can be a separate component made of high performance RF material like for example RT/Duroid 5870 or Neltec 4 (er=2.33,
20155386 prh 21 -05- 2018 tanö=0.001). When the antenna is arranged as a separate component, like in the embodiment of Figure 1, the advantage is that good antenna performance as well as competitive price can be reached.
The antenna of the RF-module according to the invention needs a match5 ing network to drive the small and highly reactive antenna impedance to e.g. 50Ω standard impedance. This matching can be implemented e.g. by using series capacitor and parallel inductor topology. The antenna matching circuit is implemented on the IPD platform. In addition to the antenna matching components, RF-filter is integrated on the IPD.
The IPD in according to one embodiment of the invention can be based on thin film technologies over the quartz or silicon wafers. This solution is cost effective and the line widths and tolerances are excellent. The IPD module integration can be done using flip-chip bonding which provides higher I/O density, RF properties and better mass market manufacturing potential than wire bonding.
In one embodiment of the invention, only antenna matching and filter components are implemented in the IPD to ensure small size and competi20 tive price. The size of the IPD block which includes the antenna matching e.g. to 50Ω as well as filtering can be e.g. 1.5x1.2mm. The total size of the RF-module can be e.g. 7.5x13.5x4.5mm.
The RF-module can be e.g. a Bluetooth low energy (BLE) RF-module,
Bluetooth-, Zigbee-, RFID- or Wi-Fi-module, or it may implement a proprietary protocol. The RF-module can operate e.g. in the 2.4GHz ISM band, more specifically from 2.400 to 2.484 GHz or other ISM radio bands such as 433.92 MHz, 315 MHz, 868 MHz, 915 MHz, 5 GHz, 5.8 GHz or other radio bands.
The special feature of this antenna and RF-module is that it can operate well on any kind of generic board structure; only the module footprint just under the module is specified. So with the RF-module of this invention there are no size specifications, no external ground plane or ground plane opening specifications for the generic board. This is an advantage, since the prior art RF-modules need a special opening area or a certain size of external ground plane on the generic board.
In one embodiment of the invention the RF-module is connected to a circuit board 114 which comprises a guard ring which is connected to the ground plane of the RF-module and essentially surrounds the RF-module.
In one embodiment the performance of the RF-module according to the invention can be even further be increased by having a ground plane in the circuit board to which the RF-module is connected.
Although exemplary embodiments of the present invention have been de10 scribed with reference to the attached drawings, the present invention is not limited to these embodiments, and it should be appreciated to those skilled in the art that a variety of modifications and changes can be made without departing from the spirit and scope of the present invention. Embodiments described in the description in combination with other embodi15 ments can be also used as separate embodiments.

Claims (5)

1. A circuit board (114) which (114) comprises an RF-module, which RF-module has a sandwich structure which comprises:
5 - an antenna layer (102) processed from organic substrate material, the antenna layer comprising an antenna element
- a ground plane (104) below the antenna layer,
- a component board (106) below the ground plane, to which components are attached, e.g. by reflow soldering, and
10 - connectors (112) for coupling the RF-module to a circuit board, characterized in that, the components comprise IPD-based matching and filtering circuit of the antenna (108), and the circuit board (114) further comprises a guard ring which is 15 connected to the ground plane of the RF-module and arranged essentially to surround the RF-module.
2. A circuit board according to claim 1, characterized in that the connectors (112) are flip chip soldering elements.
3. A circuit board according to claim 1 or 2 characterized in that the antenna element is a loop antenna or a monopole antenna.
4. A circuit board according to any preceding claim characterized 25 in that the antenna layer (102), the ground plane (104) and the component board (106) form an integrated structure.
5. A circuit board according to any preceding claim characterized in that RF-module is Bluetooth-, Bluetooth low energy, Zigbee-, RFID- or
30 Wi-Fi-module.
FI20155386A 2015-05-25 2015-05-25 Radio frequency module and circuit board FI127701B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board
EP16799413.6A EP3304644A4 (en) 2015-05-25 2016-05-24 Radio frequency module and circuit board
PCT/FI2016/050351 WO2016189199A1 (en) 2015-05-25 2016-05-24 Radio frequency module and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board

Publications (2)

Publication Number Publication Date
FI20155386A FI20155386A (en) 2016-11-26
FI127701B true FI127701B (en) 2018-12-31

Family

ID=57392924

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board

Country Status (3)

Country Link
EP (1) EP3304644A4 (en)
FI (1) FI127701B (en)
WO (1) WO2016189199A1 (en)

Families Citing this family (8)

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US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US10062670B2 (en) 2016-04-18 2018-08-28 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
KR102629723B1 (en) 2016-04-19 2024-01-30 스카이워크스 솔루션즈, 인코포레이티드 Selective shielding of radio frequency modules
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
TWI800014B (en) 2016-12-29 2023-04-21 美商天工方案公司 Front end systems and related devices, integrated circuits, modules, and methods
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
FR3092467B1 (en) * 2019-01-31 2021-07-16 Thales Sa Manufacturing process of a high density micromodule card
FI20205799A1 (en) 2020-08-14 2022-02-15 Teknologian Tutkimuskeskus Vtt Oy A cover structure and a module for a miniaturized wearable rf-device and a wearable rf-device

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GB0317305D0 (en) * 2003-07-24 2003-08-27 Koninkl Philips Electronics Nv Improvements in or relating to planar antennas
US7030815B2 (en) * 2004-09-08 2006-04-18 Motorola, Inc. Integrated patch antenna and electronics assembly and method for fabricating
JP2007116217A (en) * 2005-10-18 2007-05-10 Hitachi Ltd Millimeter-wave radar apparatus and millimeter radar system using it
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7477197B2 (en) * 2006-12-29 2009-01-13 Intel Corporation Package level integration of antenna and RF front-end module
US9680232B2 (en) * 2012-05-07 2017-06-13 Qualcomm Incorporated Graded-ground design in a millimeter-wave radio module
US9196958B2 (en) * 2012-07-26 2015-11-24 Apple Inc. Antenna structures and shield layers on packaged wireless circuits

Also Published As

Publication number Publication date
EP3304644A4 (en) 2019-01-02
WO2016189199A1 (en) 2016-12-01
EP3304644A1 (en) 2018-04-11
FI20155386A (en) 2016-11-26

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