WO2016181439A1 - Dispositif de montage et procédé de montage - Google Patents

Dispositif de montage et procédé de montage Download PDF

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Publication number
WO2016181439A1
WO2016181439A1 PCT/JP2015/063343 JP2015063343W WO2016181439A1 WO 2016181439 A1 WO2016181439 A1 WO 2016181439A1 JP 2015063343 W JP2015063343 W JP 2015063343W WO 2016181439 A1 WO2016181439 A1 WO 2016181439A1
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WO
WIPO (PCT)
Prior art keywords
mounting
unit
component
cycle
recovery
Prior art date
Application number
PCT/JP2015/063343
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English (en)
Japanese (ja)
Inventor
茂人 大山
淳 飯阪
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2015/063343 priority Critical patent/WO2016181439A1/fr
Priority to JP2017517464A priority patent/JP6630726B2/ja
Publication of WO2016181439A1 publication Critical patent/WO2016181439A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a mounting apparatus and a mounting method.
  • a camera is installed around the push-up unit of the die supply device, and images are taken in a state where the push-up pin of the push-up unit is pushed up, and the volume and the position in the XY direction of the push-up pin are measured.
  • a device for measuring breakage or bending of a push-up pin has been proposed (see, for example, Patent Document 1).
  • the sub robot picks up the die pushed up by the push-up unit, reverses it by the reversing unit, and moves the die to the picking position by the shuttle mechanism.
  • the present invention has been made in view of such problems, and a main object of the present invention is to provide a mounting apparatus and a mounting method capable of performing mounting processing while suppressing generation of useless parts.
  • the present invention adopts the following means in order to achieve the main object described above.
  • the mounting apparatus of the present invention is A mounting unit that executes a mounting cycle in which components are sampled from a predetermined sampling position by a sampling member and mounted on a substrate; and A delivery unit that moves from an initial position to the sampling position without returning a plurality of parts to the initial position; When at least a part of the plurality of components to be sampled by the sampling member in one mounting cycle remains in the delivery unit, the component is next sampled from the delivery unit.
  • a control unit that causes the mounting unit to execute a recovery mounting process using the remaining components in the mounting cycle until the component is next collected from the delivery unit; It is equipped with.
  • this mounting apparatus when at least a part of a plurality of parts to be sampled by the sampling member in one mounting cycle remains in the delivery unit, the mounting is performed until the next part is sampled from the delivery unit. In the cycle, recovery mounting processing is executed using the remaining components.
  • a mounting error occurs, such as when parts are not properly collected, the recovery mounting process is performed collectively in a subsequent mounting cycle, so that a sampling member is left empty. In some cases, the mounting process can be performed efficiently. In this case, when other components are mounted in the next mounting cycle, the components remaining in the delivery unit may be discarded without being returned to the initial position.
  • the recovery mounting process is performed in the mounting cycle until the next part is picked up from the delivery unit using the remaining parts, so the mounting process is performed while suppressing the generation of wasted parts.
  • moving without returning to the initial position means that the part cannot be physically returned to the initial position and cannot be returned.
  • the part can be physically returned but the return process is complicated. Including the case where is not returned to the initial position.
  • “when at least some of the plurality of parts to be collected by the collection member remain in the delivery unit” means “when a mounting error occurs in a part collected from the delivery unit” Also good.
  • the control unit next receives the receiving unit when at least a part of the plurality of components to be sampled by the sampling member remains in the delivery unit in the one mounting cycle.
  • the mounting unit may be caused to execute a recovery mounting process using the remaining component until the final mounting cycle. Also in this mounting apparatus, since the mounting process for recovery is performed using the remaining components, the mounting process can be performed while suppressing the generation of wasted components.
  • the control unit next performs the delivery unit.
  • the recovery mounting process may be executed using the remaining components in the next mounting cycle or the most recent mounting cycle.
  • the component remaining in the delivery unit is used immediately, it is preferable that the component is not left in the delivery unit.
  • the delivery unit includes a flip unit that reverses and moves a component from the initial position to the sampling position, and a shuttle unit that moves by placing the component from the initial position to the sampling position. It may be either one.
  • the component in the mounting apparatus using the flip part or the shuttle part, it is possible to perform the mounting process while suppressing generation of useless parts.
  • the component may be a wafer component. Since wafer parts are expensive, there is a high demand for suppressing the generation of wasted parts.
  • control unit may cause the mounting unit to execute the recovery mounting process using only the components remaining in the delivery unit.
  • control unit adds the component to the delivery unit when the mounting unit has an available sampling member that can collect the remaining component in the next mounting cycle. Then, the mounting process of the recovery may be executed by the mounting unit in the next mounting cycle.
  • the control unit performs mounting processing for recovery of the mounting error in a backward mounting cycle when no component remains in the delivery unit at the time of mounting error of the component collected from the delivery unit.
  • the mounting unit may be executed.
  • the “backward mounting cycle” is, for example, a cycle later than “the next mounting cycle for collecting parts from the delivery unit”. For example, the last mounting cycle of all the mounting cycles It is good.
  • the “backward mounting cycle” means that the mounting order may be changed in the recovery mounting process when the recovery mounting process is collectively performed in the last mounting cycle.
  • the control unit may cause the mounting unit to execute mounting processing for recovery of the mounting error in a backward mounting cycle when a component mounting error is not collected from the delivery unit.
  • this mounting device when a component is left in the delivery unit in the event of a mounting error, recovery is performed in the next mounting cycle using this component, while in a component not using the delivery unit, the components are collected in the rear mounting cycle. Recovery. For this reason, in this mounting apparatus, it is possible to perform the mounting process while further suppressing the generation of wasted components, while performing recovery collectively in the rear mounting cycle to prevent the sampling member from being vacant. Can be implemented efficiently.
  • the mounting method of the present invention is: A mounting unit that executes a mounting cycle in which a component is sampled from a predetermined sampling position by a sampling member and mounted on a substrate, and a plurality of components are moved from the initial position to the sampling position without returning to the initial position.
  • a mounting method using a mounting device including a delivery unit When at least a part of the plurality of components to be sampled by the sampling member in one mounting cycle remains in the delivery unit, the component is next sampled from the delivery unit. If there is a mounting cycle, the step of causing the mounting unit to perform a recovery mounting process using the remaining components in the mounting cycle until the component is next collected from the delivery unit; Is included.
  • the recovery mounting process is performed in the mounting cycle until the next part is picked up from the delivery unit using the remaining parts. It is possible to suppress the mounting process.
  • various aspects of the mounting device described above may be adopted, and steps for realizing each function of the mounting device described above may be added.
  • FIG. 4 is an explanatory diagram illustrating an example of a schematic configuration of a mounting apparatus 11 of the mounting system 10.
  • FIG. The block diagram showing the electrical connection relation of the mounting apparatus.
  • the flowchart showing an example of a mounting process routine. Explanatory drawing of the timing setting of the recovery process after a mounting error. Explanatory drawing of the timing setting of the recovery process after a mounting error.
  • FIG. 1 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11 of the mounting system 10.
  • FIG. 2 is a block diagram showing an electrical connection relationship of the mounting apparatus 11.
  • the mounting system 10 is a system that executes a mounting process related to a process of mounting the component P on the board S, for example.
  • the mounting system 10 includes a mounting device 11 and a management computer (PC) 60.
  • PC management computer
  • a plurality of mounting apparatuses 11 that perform a mounting process for mounting the component P on the substrate S are arranged from upstream to downstream.
  • FIG. 1 only one mounting apparatus 11 is shown for convenience of explanation.
  • the management PC 60 manages information related to processing in the mounting apparatus 11. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.
  • the mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, a parts camera 15, a mounting table 18, and a control device 50.
  • the substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position.
  • the substrate transport unit 12 has a pair of conveyor belts provided at intervals in the front-rear direction of FIG. 1 and spanned in the left-right direction. The board
  • substrate S is conveyed by this conveyor belt.
  • the mounting unit 13 collects the component P from the component supply unit 14 and arranges it on the substrate S fixed to the substrate transport unit 12.
  • the mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24.
  • the head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider.
  • the mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20.
  • One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22.
  • the suction nozzle 24 is a collection member that collects the component P using pressure, and is detachably attached to the mounting head 22.
  • the mounting head 22 incorporates a Z-axis motor, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor.
  • the mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown), and can adjust the angle of the component P sucked by the suction nozzle 24.
  • the mounting head 22 is equipped with a plurality of (for example, four or eight) suction nozzles 24.
  • the component supply unit 14 includes a multi-feeder (MF) unit 25 and a wafer supply unit 30.
  • the MF unit 25 has a plurality of feeders 27 each having a reel 26. A tape is wound around each reel 26, and a plurality of parts P are held on the tape along the longitudinal direction of the tape. The tape 26 is unwound from the reel 26 toward the rear, and is sent out to a sampling position where it is sucked by the suction nozzle 24 with the component P exposed.
  • the wafer supply unit 30 is a device that supplies wafer components to the sampling position of the mounting head 22, and includes a wafer pallet 31, a magazine unit 32, a sub robot 35, a flip unit 36, and a sub camera 39.
  • the wafer pallet 31 is a flat plate member in which a diced wafer W is fixed by an adhesive member, and a plurality of wafer pallets 31 are accommodated in the magazine portion 32.
  • the wafer pallet 31 is pulled out from the magazine portion 32 when mounting wafer components.
  • the sub robot 35 includes a suction nozzle (not shown), collects wafer parts on the wafer pallet 31, and places them on the reverse placement unit 37 of the flip unit 36.
  • the sub robot 35 moves along a guide 34 formed in the left-right direction (X-axis direction) of the apparatus.
  • the flip unit 36 is a device that inverts the wafer component and moves the wafer component from an initial position where the sub robot 35 can be placed to a sampling position where the mounting head 22 samples.
  • the flip unit 36 includes an inversion mounting unit 37 that mounts and inverts wafer components. One or more (for example, four) wafer parts can be placed on the inversion placement unit 37.
  • the reverse placement part 37 moves along a guide rail 38 formed in the front-rear direction of the apparatus.
  • the sub-robot 35 is provided with a sub-camera 39, and the position and orientation of the wafer part to be collected can be confirmed using the captured image of the sub-camera 39.
  • the parts camera 15 is disposed between the board transfer unit 12 and the component supply unit 14.
  • the imaging range of the parts camera 15 is above the parts camera 15.
  • the mounting table 18 is disposed between the substrate transport unit 12 and the component supply unit 14 and in the vicinity of the parts camera 15.
  • the mounting table 18 is supported so that the upper surface on which the component P is mounted is horizontal, and is used as a temporary mounting table for the component P.
  • control unit 50 is configured as a microprocessor centered on a CPU 51, and includes a ROM 52 that stores a processing program, an HDD 53 that stores various data, a RAM 54 that is used as a work area, an external device and an electrical device. An input / output interface 55 for exchanging signals is provided, and these are connected via a bus 56.
  • the control unit 50 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, and the parts camera 15, and inputs signals from the mounting unit 13, the component supply unit 14, and the parts camera 15.
  • FIG. 3 is a flowchart illustrating an example of a mounting process routine executed by the CPU 51 of the mounting apparatus 11. This routine is stored in the HDD 53 of the control unit 50, and is executed by a start instruction from the operator.
  • the wafer supply unit 30 mounts four wafer components on the reverse mounting portion 37 and mounts them with the mounting head 22 equipped with the four suction nozzles 24 will be described with reference to FIGS. To do.
  • FIGS. 4 and 5 are explanatory diagrams of timing settings for recovery processing after a mounting error.
  • 4A is a mounting condition
  • FIG. 4B is an explanatory diagram of recovery of a suction error of a feeder supply component
  • FIG. 4C is an explanatory diagram of recovery of a suction error of a flip supply component.
  • FIG. 5A is a mounting condition
  • FIG. 5B is an explanatory diagram of recovery of a suction error of the flip supply component.
  • the ellipse mark represents a component to be mounted
  • the vertical line represents the range of one mounting cycle
  • the number displayed in each ellipse mark represents the mounting order.
  • the flip supply components are shaded.
  • Four wafer parts are supplied to the inversion mounting portion 37, and the mounting head 22 is equipped with four suction nozzles 24. Therefore, in FIGS. 4 and 5, the basic mounting cycle is to pick, move, and arrange the four components.
  • the CPU 51 of the control unit 50 first acquires mounting condition information from the management PC 60 (step S100).
  • the mounting condition information includes information about the mounting order of the components P, the type of the component P to be mounted, the unit to be supplied, the suction nozzle that sucks the component P, and the like.
  • the CPU 51 carries the substrate S and fixes it (step S110), sets the component P to be picked up, and acquires the information from the mounting condition information (step S120).
  • the CPU 51 performs an adsorption and movement process for the component P (step S130).
  • the CPU 51 controls the mounting unit 13 so that the suction nozzle 24 corresponding to the component P to be collected is attached to the mounting head 22 as necessary, and the component P is collected from the component supply unit 14.
  • the component supply unit 14 drives the feeder 27 of the MF unit 25 to feed out the tape and move the component P to the sampling position. Further, the component supply unit 14 sends out the wafer pallet 31 from the magazine unit 32 for flip-fed wafer components, and the sub robot 35 collects the wafer components and places them on the reverse mounting unit 37.
  • the reverse mounting unit 37 moves the wafer part from the initial position to the sampling position while reversing the wafer part.
  • the mounting head 22 collects the component P from the sampling position of the feeder 27 or the reverse mounting portion 37 and passes it above the parts camera 15 and moves it to the arrangement position on the substrate S.
  • the mounting head 22 sucks the component P to all of the suction nozzles 24 mounted as much as possible.
  • the parts camera 15 takes an image of the component P sucked by the mounting head 22.
  • the CPU 51 determines whether or not there is a component P adsorption error (step S140).
  • processing for determining whether or not the suction position or shape of the component P is appropriate based on the imaging result is performed. This determination can be made based on, for example, whether or not the degree of matching between the image captured by the parts camera 15 and the appropriate image deviates from a predetermined value. This predetermined value can be obtained empirically.
  • the CPU 51 places the component P at the placement position (step S150), and determines whether or not the current board mounting process is completed (step S160).
  • the CPU 51 executes the processes after step S120. That is, the CPU 51 sets the next component P to be picked up, and performs a picking movement process for the component P.
  • step S140 determines whether or not the adsorption error has occurred in the flip supply (step S170).
  • the CPU 51 inserts the recovery mounting process of the component P in which the suction error has occurred at the end of the mounting cycle of the current substrate S (Step S180), and executes the processes after Step S120.
  • the CPU 51 may discard the component P with suction error among the components P sucked by the mounting head 22, and place the component P with no suction error on the substrate S.
  • the adsorption error includes a case where the adsorption itself is not performed. As shown in FIG.
  • the mounting apparatus 11 performs a recovery mounting process collectively in the rear mounting cycle including the last when a mounting error occurs such that the component P is not properly collected.
  • the CPU 51 determines whether or not the wafer part remains in the flip part 36 (step S190). For example, when the suction is stopped without securing a negative pressure, it can be determined that the part whose suction is stopped remains. If no wafer part is present in the suction nozzle 24 in the imaging result, it can be determined that the wafer part remains in the flip unit 36 without being picked up at the time of suction.
  • the CPU 51 executes the processes after step S180. That is, the current suction error recovery mounting process is inserted at the end of the mounting cycle of the current substrate S, and the mounting process is continued.
  • the CPU 51 When there is no wafer part remaining in the flip part 36 at the time of flip supply, there is no wafer part to be wasted, so the CPU 51 performs the rear mounting cycle including the last, as in the case of the feeder supply described above. By performing the recovery mounting process together, the mounting process is efficiently performed while the suction nozzle 24 is prevented from being vacant.
  • the CPU 51 sets the recovery mounting process using the wafer part remaining in the reverse mounting part 37 to the next mounting cycle (step S200).
  • the process after step S120 is performed.
  • the recovery mounting process is executed in the most recent mounting cycle using the wafer parts remaining on the reverse mounting portion 37.
  • the recovery mounting processing is performed by inserting the recovery mounting processing using only the wafer parts remaining in the reverse mounting portion 37 into the next mounting cycle. It is set (FIG. 4C).
  • the recovery mounting process for example, when there is an empty suction nozzle 24 capable of sucking the remaining wafer parts in the next mounting cycle (FIG.
  • the recovery processing is collectively performed at the end as in the case of the feeder supply described above. If this is performed, the part P to be picked up may change in the next mounting cycle, and the wafer part may have to be discarded.
  • the mounting apparatus 11 takes a sampling position when a mounting error occurs such that the uncollectable wafer parts are not properly collected. The recovery mounting process is performed in the next cycle using the remaining wafer parts. For this reason, in the mounting apparatus 11, it is possible to perform the mounting process while suppressing wasteful disposal of the wafer parts.
  • the CPU 51 repeatedly performs setting, suction, movement, and placement of the component P, and when there is a suction error, sets the recovery mounting process as appropriate.
  • the CPU 51 discharges the mounted board S (step S210), and determines whether the production is completed (step S210). S220).
  • the CPU 51 executes the processes after step S110. That is, the CPU 51 transports and fixes a new substrate S, and executes the processes after step S120.
  • the CPU 51 ends this routine as it is.
  • the mounting unit 13 of this embodiment corresponds to the mounting part of the present invention
  • the flip part 36 corresponds to the delivery part
  • the control part 50 corresponds to the control part
  • the suction nozzle 24 corresponds to the sampling member.
  • an example of the mounting method of the present invention is also clarified by describing the operation of the mounting apparatus 11.
  • the mounting apparatus 11 of the embodiment described above at least some of the components P to be collected by the suction nozzle 24 in one mounting cycle remain in the flip portion 36 (delivery unit).
  • the recovery mounting process is executed using the remaining components.
  • a mounting error occurs such as the component P being not properly collected
  • the sampling member is vacated by performing a recovery mounting process in a subsequent mounting cycle.
  • the mounting process is performed efficiently.
  • the wafer component remaining in the flip unit 36 may be discarded without being returned to the initial position.
  • the recovery mounting process is performed in the latest mounting cycle using the remaining wafer parts, so that the mounting process can be performed while suppressing the generation of wasted parts.
  • the recovery mounting process using the wafer components remaining in the flip part 36 is performed in the next mounting cycle, it is preferable not to leave the remaining parts caused by the suction error in the flip part 36.
  • the mounting apparatus 11 includes a flip unit that reverses and moves the wafer part from the initial position to the sampling position.
  • the flip unit 36 sets the recovery mounting process to the next mounting cycle. It is possible to perform the mounting process while suppressing generation of wasted wafer parts. Further, since it is a relatively expensive wafer part that is supplied to the flip part, there is a high demand for suppressing the generation of wasted parts.
  • the control unit 50 executes the recovery mounting process using only the wafer components remaining in the flip unit 36, the process can be further simplified. Further, when the mounting unit 13 has an empty suction nozzle 24 capable of collecting the remaining wafer parts in the next mounting cycle, the control unit 50 adds the wafer parts to the flip unit 36 and performs the recovery mounting process. Execute in the next mounting cycle. This process is more efficient because the new mounting cycle does not increase.
  • control unit 50 causes the mounting process of recovery to be executed in a subsequent mounting cycle when no wafer parts remain in the flip unit 36 at the time of a mounting error from the wafer supply unit 30.
  • this mounting apparatus 11 since the recovery is performed collectively in the subsequent mounting cycle, it is possible to efficiently perform the mounting process while preventing the suction nozzle 24 from becoming empty.
  • the control unit 50 causes a mounting error recovery mounting process to be executed in a subsequent mounting cycle when there is a mounting error of a component P not collected from the flip unit 36. In this mounting apparatus 11, since the recovery is performed collectively in the subsequent mounting cycle, it is possible to efficiently perform the mounting process while preventing the suction nozzle 24 from becoming empty.
  • the delivery unit has been described as the flip unit 36 that reverses and moves the wafer component.
  • the delivery unit may have the same configuration as the flip unit 36, and may be a shuttle unit that moves the component P without being reversed.
  • the delivery unit is the flip unit 36 that cannot be returned to the initial position.
  • the return unit may be physically returned, but the return process is complicated and the part P may not be returned to the initial position. It may be included.
  • the component P supplied from the tray or the feeder is once placed on the placement table 18, and then the placement table 18 when the component P is further collected from the placement table 18 and placed on the substrate S is used. It may be a delivery unit.
  • the recovery mounting process is not particularly limited to the next mounting cycle if the remaining wafer parts are used to perform the recovery mounting process.
  • the CPU 51 may execute the mounting process for recovery from the current mounting cycle in which the wafer part remains in the flip unit 36 at the time of a suction error until several cycles later.
  • the CPU 51 next transfers the wafer from the flip part 36 to the wafer. If there is a mounting cycle for collecting parts, the mounting process for recovery is executed by using the remaining wafer parts in the mounting cycle until “the next wafer part is collected from the flip part 36”. That's fine.
  • the wafer part generated based on the suction error is present in the flip part 36 for a while, but this remaining part is used before the wafer part is supplied from the flip part 36 next time. Therefore, it is possible to perform the mounting process while further suppressing the generation of wasted parts.
  • the wafer is next transferred from the flip part 36 to the wafer. If there is no mounting cycle for collecting components, the CPU 51 may execute the recovery mounting process using the components remaining until the final mounting cycle. Also in this mounting apparatus, since the mounting process for recovery is performed using the remaining components, the mounting process can be performed while suppressing the generation of wasted components.
  • the recovery mounting process is inserted in the last mounting cycle of the current board S in step S180.
  • the current board S It is not limited to the last cycle.
  • the CPU 51 may insert the recovery mounting process into the last mounting cycle in the mounting cycle group that is collectively performed under the unified condition (for example, the same sampling member).
  • the unified condition may be, for example, a condition using the same sampling member (suction nozzle 24).
  • the mounting apparatus 11 having a plurality of mounting heads and capable of automatically replacing the mounting heads, the conditions for using the same mounting head may be used. Also in this mounting apparatus, since the mounting process for recovery is performed using the remaining components, the mounting process can be performed while suppressing the generation of wasted components.
  • the component that performs recovery using the remaining component is the wafer component, but is not particularly limited thereto, and may be other than the wafer component. Even in this case, it is possible to perform the mounting process while suppressing the generation of wasted components. It is more preferable to apply the present invention to expensive parts.
  • the mounting head 22 includes the suction nozzle 24 as a sampling member.
  • the mounting head 22 is not particularly limited as long as the component P can be sampled, and may be a mechanical chuck that clamps and samples the component. .
  • the present invention has been described as the mounting apparatus 11.
  • a mounting method may be used, or a program that a computer executes the above-described processing may be used.
  • the present invention can be used for an apparatus for performing a mounting process in which components are arranged on a substrate.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Ce dispositif de montage (11) est pourvu : d'une unité de montage (13) qui exécute un cycle de montage de multiples fois impliquant la collecte d'un composant (P) à partir d'une position de collecte prescrite au moyen d'une buse d'aspiration (24) et le montage dudit composant (P) sur un substrat (S) ; d'une unité de bascule (36) qui déplace une pluralité de composants (P) d'une position initiale à une position de collecte sans retourner les composants vers la position initiale ; et d'une unité de commande dans laquelle, lorsque au moins certains des multiples composants (P) devant être collectés par la buse d'aspiration (24) (l'élément de collecte) dans un cycle de montage restent dans l'unité de bascule (36) (l'unité de transfert), dans le cas où il y a ensuite un cycle de montage destiné à collecter des composants (P) à partir de l'unité de bascule, alors, dans le cycle de montage jusqu'à la collecte subséquente de composants (P) à partir de l'unité de bascule (36), l'unité de montage (13) est amenée à effectuer un traitement de montage de récupération en utilisant lesdits composants (P) restants.
PCT/JP2015/063343 2015-05-08 2015-05-08 Dispositif de montage et procédé de montage WO2016181439A1 (fr)

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PCT/JP2015/063343 WO2016181439A1 (fr) 2015-05-08 2015-05-08 Dispositif de montage et procédé de montage
JP2017517464A JP6630726B2 (ja) 2015-05-08 2015-05-08 実装装置及び実装方法

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN111433898A (zh) * 2017-12-07 2020-07-17 株式会社富士 信息管理装置及信息管理方法
CN112425278A (zh) * 2018-07-19 2021-02-26 株式会社富士 元件安装系统
WO2023084647A1 (fr) * 2021-11-10 2023-05-19 株式会社Fuji Dispositif de montage de composants et système de montage de composants

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JP2011044501A (ja) * 2009-08-19 2011-03-03 Juki Corp 表面実装装置
JP2014060363A (ja) * 2012-09-19 2014-04-03 Yamaha Motor Co Ltd 電子部品装着装置

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JP5737953B2 (ja) * 2011-01-07 2015-06-17 富士機械製造株式会社 部品実装装置
JP5713441B2 (ja) * 2011-05-13 2015-05-07 富士機械製造株式会社 部品実装システム

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Publication number Priority date Publication date Assignee Title
JP2011044501A (ja) * 2009-08-19 2011-03-03 Juki Corp 表面実装装置
JP2014060363A (ja) * 2012-09-19 2014-04-03 Yamaha Motor Co Ltd 電子部品装着装置

Cited By (5)

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CN111433898A (zh) * 2017-12-07 2020-07-17 株式会社富士 信息管理装置及信息管理方法
CN111433898B (zh) * 2017-12-07 2023-06-23 株式会社富士 信息管理装置及信息管理方法
CN112425278A (zh) * 2018-07-19 2021-02-26 株式会社富士 元件安装系统
CN112425278B (zh) * 2018-07-19 2022-05-13 株式会社富士 元件安装系统
WO2023084647A1 (fr) * 2021-11-10 2023-05-19 株式会社Fuji Dispositif de montage de composants et système de montage de composants

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