WO2016170151A3 - Lumineszenzdiodenanordnung und verfahren zur herstellung einer lumineszenzdiodenanordnung - Google Patents
Lumineszenzdiodenanordnung und verfahren zur herstellung einer lumineszenzdiodenanordnung Download PDFInfo
- Publication number
- WO2016170151A3 WO2016170151A3 PCT/EP2016/059073 EP2016059073W WO2016170151A3 WO 2016170151 A3 WO2016170151 A3 WO 2016170151A3 EP 2016059073 W EP2016059073 W EP 2016059073W WO 2016170151 A3 WO2016170151 A3 WO 2016170151A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- diode assembly
- hybrid polymer
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 abstract 5
- 229920000642 polymer Polymers 0.000 abstract 4
- 238000010397 one-hybrid screening Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Die Erfindung betrifft eine Lumineszenzdiodenanordnung (1) aufweisend zumindest einen ersten Lumineszenzdiodenchip (2) mit einer ersten Strahlungsaustrittsfläche (3), der über die Strahlungsaustrittsfläche (3) zur Emission von Strahlung eingerichtet ist, zumindest ein Hybridpolymer (4), dass im Strahlengang des ersten Lumineszenzdiodenchips (2) angeordnet ist, wobei das Hybridpolymer (4) organische und anorganische Bereiche aufweist, die kovalent miteinander verbunden sind, wobei das Hybridpolymer (4) thermisch und/oder durch Strahlung vernetzt ist, wobei die erste Strahlungsaustrittsfläche (3) und das Hybridpolymer (4) in direktem mechanischem Kontakt stehen.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015106367.0A DE102015106367B4 (de) | 2015-04-24 | 2015-04-24 | Lumineszenzdiodenanordnung |
DE102015106367.0 | 2015-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2016170151A2 WO2016170151A2 (de) | 2016-10-27 |
WO2016170151A3 true WO2016170151A3 (de) | 2016-12-15 |
Family
ID=55806361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2016/059073 WO2016170151A2 (de) | 2015-04-24 | 2016-04-22 | Lumineszenzdiodenanordnung und verfahren zur herstellung einer lumineszenzdiodenanordnung |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102015106367B4 (de) |
WO (1) | WO2016170151A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018115342A1 (de) | 2018-06-26 | 2020-01-02 | Tdk Electronics Ag | Bauelement |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110297987A1 (en) * | 2010-06-07 | 2011-12-08 | Kabushiki Kaisha Toshiba | Optical semiconductor device and method for manufacturing same |
DE102010024864A1 (de) * | 2010-06-24 | 2011-12-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
DE102011085645A1 (de) * | 2011-11-03 | 2013-05-08 | Osram Gmbh | Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls |
WO2013118002A1 (en) * | 2012-02-10 | 2013-08-15 | Koninklijke Philips N.V. | Molded lens forming a chip scale led package and method of manufacturing the same |
WO2013150023A1 (de) * | 2012-04-02 | 2013-10-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement umfassend eine konverterträgerschicht, und verfahren zur herstellung eines optoelektronischen bauelements umfassend eine konverterträgerschicht |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005061828B4 (de) | 2005-06-23 | 2017-05-24 | Osram Opto Semiconductors Gmbh | Wellenlängenkonvertierendes Konvertermaterial, lichtabstrahlendes optisches Bauelement und Verfahren zu dessen Herstellung |
RU2503092C2 (ru) | 2008-09-25 | 2013-12-27 | Конинклейке Филипс Электроникс Н.В. | Светоизлучающее устройство с покрытием и способ нанесения покрытия на него |
DE102010024758A1 (de) | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Optikkörpers, Optikkörper und optoelektronisches Bauteil mit dem Optikkörper |
TWI476961B (zh) | 2010-10-12 | 2015-03-11 | 友達光電股份有限公司 | 發光二極體裝置 |
US8884508B2 (en) | 2011-11-09 | 2014-11-11 | Cree, Inc. | Solid state lighting device including multiple wavelength conversion materials |
JP6072472B2 (ja) | 2012-08-27 | 2017-02-01 | シチズン電子株式会社 | Led発光装置 |
-
2015
- 2015-04-24 DE DE102015106367.0A patent/DE102015106367B4/de active Active
-
2016
- 2016-04-22 WO PCT/EP2016/059073 patent/WO2016170151A2/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110297987A1 (en) * | 2010-06-07 | 2011-12-08 | Kabushiki Kaisha Toshiba | Optical semiconductor device and method for manufacturing same |
DE102010024864A1 (de) * | 2010-06-24 | 2011-12-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
DE102011085645A1 (de) * | 2011-11-03 | 2013-05-08 | Osram Gmbh | Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls |
WO2013118002A1 (en) * | 2012-02-10 | 2013-08-15 | Koninklijke Philips N.V. | Molded lens forming a chip scale led package and method of manufacturing the same |
WO2013150023A1 (de) * | 2012-04-02 | 2013-10-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement umfassend eine konverterträgerschicht, und verfahren zur herstellung eines optoelektronischen bauelements umfassend eine konverterträgerschicht |
Also Published As
Publication number | Publication date |
---|---|
DE102015106367A1 (de) | 2016-10-27 |
DE102015106367B4 (de) | 2021-08-05 |
WO2016170151A2 (de) | 2016-10-27 |
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