WO2016166164A1 - Optoelektronische vorrichtung mit einer mischung aufweisend ein silikon und ein fluor-organisches additiv - Google Patents
Optoelektronische vorrichtung mit einer mischung aufweisend ein silikon und ein fluor-organisches additiv Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/05—Alcohols; Metal alcoholates
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- C08K5/02—Halogenated hydrocarbons
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
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- H—ELECTRICITY
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- H10F77/50—Encapsulations or containers
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Definitions
- Optoelectronic device with a mixture comprising a silicone and a fluoro-organic additive
- the present invention relates to an optoelectronic device and a method for its production.
- An object of the invention is to provide an optoelectronic device with improved stability, in particular improved moisture resistance and weather resistance.
- At least one radiation-emitting or radiation-detecting semiconductor and a mixture comprising a silicone and a fluoro-organic additive specified.
- Said mixture is part of at least one of the following elements:
- Semiconductor surrounds at least in places, radiation-conducting element in an optical path emitted by the semiconductor
- thermally conductive element one of the
- the optoelectronic device is thus a radiation-emitting or a radiation-detecting optoelectronic device which has at least one corresponding optoelectronic semiconductor. At the semiconductor detected or emitted
- Radiation may be electromagnetic radiation that may cover, for example, a range of infrared (IR) radiation to ultraviolet (UV) radiation. It may, for example, be visible light.
- the optoelectronic device can be an (inorganic) light-emitting diode (LED), an organic light-emitting diode (OLED), an optical sensor or a solar cell.
- the optoelectronic device may be a module that includes one or more LEDs, OLEDs, optical sensors, and solar cells, or combinations thereof.
- the mixture of the device according to the invention has
- the silicone example ⁇ form a matrix in which the fluoro-organic additive may be incorporated.
- the mixture may also consist of the at least one silicone and the at least one fluoro-organic additive. It can also comprise or consist of exactly one silicone and exactly one fluoro-organic additive.
- mixture means in particular that the fluoro-organic additive is present not only on a surface of the silicone, but is distributed in the silicone.
- Additive is evenly distributed in the silicone. Under a fluoro-organic additive organic compounds are to understand carbon-carbon bonds and carbon-fluorine bonds.
- C-F bonds have a particularly high stability.
- the bond strength is 441 kJ / mol (about 4.6 eV). This has a positive effect on the radiation and light resistance of the mixture.
- Si has a very high fluorine affinity. This leads to an improved moisture and media resistance of the mixture even under radiation exposure to silicones without fluorine-organic additive.
- media resistance means, for example, a resistance to trace gases from air pollutants such as H 2 S, SO 2 , NO x (nitrogen oxides) or NH 3 .
- media resistance includes the Be Pre ⁇ accuracy to mineral salts, especially in outdoor applications near the coast.
- media resistance also means high stability against solvents and cleaning agents as well as paint coatings (for example based on acrylate or polyurethane), for instance in installation situations in displays and displays
- the optoelectronic device has at least one of the following elements:
- the optoelectronic device can also have several or all of the elements mentioned.
- the one or more elements may each independently comprise said mixture or from
- the housing body element is also referred to below as housing or housing body. It surrounds the semiconductor at least partially.
- a radiation-conducting element can be understood as meaning both a radiolucent element and a radiation-reflecting element. Radiation ⁇ conductive elements may, for example, have or consist of a potting material. It is then possible, in particular, for the casting material to comprise or consist of the mixture.
- Typical examples of radiolucent elements are lenses and light conversion elements as well as the encapsulation of the optoelectronic semiconductor. With light conversion elements are to be understood elements that can at least partially convert a shorter wavy primary radiation into a longer-wave secondary radiation. In the case of the present invention, radiolucent elements are also to be understood as light conversion elements in which primary radiation is completely converted into secondary radiation. In this case we speak of full conversion.
- thermally conductive element and / or a
- Adhesive element of the device comprise the mixture or consist of it. Thermally conductive or thermally conductive
- Adhesive elements may, for example, interconnect the semiconductor, the aforementioned other elements, or other components of the optoelectronic device, acting as an adhesive, and provide good adhesion
- silicones are used instead of the mixture according to the invention for the elements of optoelectronic devices described above.
- the silicone is therefore not admixed with fluorine-organic additive in conventional devices.
- the device according to the invention in which the silicone is admixed with a fluoro-organic additive, shows surprising property improvements with respect to moisture, composite and temperature resistance.
- Temperature can be experimentally, for example, by an increase in weight after exposure to moisture or a decrease in weight after exposure to temperature of the mixture
- the optoelectronic devices according to the invention are particularly well suited for outdoor applications.
- the mixtures have a good thermal stability and a good radiation or light resistance. They are preferably transparent and stable to yellowing.
- the writability, printability and wettability of mixtures of devices according to the invention can also be improved compared to silicones without a fluorine-organic additive.
- the present invention also provides a cheaper alternative to the also conceivable use of fluorine silicones. Fluorosilicones are considerably more expensive and also more expensive to process than mixtures according to the invention.
- the silicones and additives which form the mixture in the present case are each commercially available, readily available and inexpensive
- Devices can be surprisingly process without great technical effort with conventional methods, as they are used for silicones without additive application.
- the functional group is covalently attached to an at least partially fluorinated alkyl group.
- the inventors of the present invention have recognized that by means of said functional groups fluoro-organic additives can be obtained, which can be mixed well with silicones.
- fluoro-organic additives can be obtained, which can be mixed well with silicones.
- the named functional groups it is also possible with the named functional groups to achieve attachment of the organofluorine compound to the silicone to form a covalent bond.
- the at least partially fluorinated alkyl group may be linear, branched and cyclic alkyl groups. They are preferably linear alkyl groups.
- the chain length of the at least partially fluorinated alkyl group preferably has between two and twenty carbon atoms (C 2 -C 20).
- Chain length may be preferred to comprise not more than sixteen, more preferably not more than fourteen, more preferably not more than twelve carbon atoms. The shorter the chain length, the better is often the mixing ⁇ bility.
- the at least partially fluorinated alkyl group is not too short chain. It may thus be preferred that the fluorinated alkyl group has at least three, in particular at least five carbon atoms. Thus, the positive properties of the fluoroorganic additive can be fully utilized.
- the covalent attachment of the functional group to the at least partially fluorinated alkyl group can directly by a covalent bond between the functional group and the at least partially fluorinated alkyl group.
- the covalent attachment does not have to be direct, but can also be via a linker group that produces a covalent attachment between the functional group and the at least partially fluorinated group.
- Linker group is thus arranged between the functional group and the at least partially fluorinated alkyl group.
- the linker group then forms a covalent bond with both the functional group and the at least partially fluorinated alkyl group.
- the linker group may be a branched or linear, unsubstituted or substituted alkyl group.
- the alkyl group may be fluorine atoms or
- the latter in turn may be fluorinated.
- the backbone of the alkyl group of the linker group has less than twenty carbon atoms. This preferably has
- Backbone of the alkyl group of the linker group one to twelve carbon atoms on (C 1 to C 12 ). More preferably, the backbone of the alkyl group of the linker group has between one and six carbon atoms (C 1 -C 6). For example, between two and four carbon atoms. It is also preferred if the linker group is not substituted, so only
- the optoelectronic device according to the invention is in at least partially fluorinated alkyl group of the fluorine- ⁇ organic additive to a perfluorinated alkyl group.
- the inventors of the present invention have recognized that a high degree of fluorination of the alkyl group has a positive effect on the Moisture resistance, media resistance, as well as temperature and composite stability.
- the fluoro-organic additive has the following general formula:
- R 1 , R 2 and R 3 are independently a short chain alkyl (C 1 -C 3) or hydrogen, wherein Y 1 , Y 2 , Z 1 and Z 2 are independently selected from: fluoro, hydrogen, short chain alkyl (C 1 -C3), in particular at least partially fluorinated short-chain alkyl (C 1 -C 3), where m is an integer between 0 and 12, and q is an integer between 1 and 19, wherein at least one of the two substituents Z 1 or Z 2 is fluorine or an at least partially fluorinated short chain alkyl (C 1 -C 3) wherein m + q ⁇ 19.
- the chain length of the linker ⁇ group and the at least partially fluorinated alkyl group is a combined total of less than or equal to 20 carbon atoms.
- the backbone of the entire alkyl chain of linker group and at least partially fluorinated alkyl group thus includes less than or equal to 20 C atoms.
- Such fluoro-organic compounds are usually liquid. The described fluoro-organic compounds can therefore be mixed particularly well with silicones, and the resulting mixtures can be processed well.
- the hydroxyl group is preferred. It makes it possible to obtain fluoro-organic additives with particularly good miscibility with the silicone.
- the hydroxyl groups X are preferred. It makes it possible to obtain fluoro-organic additives with particularly good miscibility with the silicone.
- the hydroxyl groups X are preferred. It makes it possible to obtain fluoro-organic additives with particularly good miscibility with the silicone.
- the hydroxyl groups X for example, with hydroxyl groups
- Silicone can be achieved.
- the hydroxyl group may further improve interfacial stability to polar or hydroxyl containing substrate, filler, or phosphor pigment surfaces via dipole-dipole interactions or through the formation of hydrogen bonds, respectively.
- epoxide groups can also be used, for example, by ring opening
- radicals R 1 , R 2 and R 3 are here and below in particular methyl, ethyl, n-propyl and iso-propyl meant. These are suitable, for example, for the radicals R 1 , R 2 and R 3 . However, it is preferred if at least one, more preferably at least two of the radicals R 1 to R 3
- R 1 to R 3 are hydrogen. Most preferred is the case that all three R 1 to R 3 are hydrogen. The more of the radicals are hydrogen, the easier the double bond or the epoxide group is sterically accessible, which can facilitate covalent attachment.
- the group - (Y 1 Y 2 ) m - acts as a linker group. It can be present - ie m is then between 1 and 12 - but it does not have to be present - ie m is then equal to zero, m is
- m is more preferably between 1 and 10, more preferably between 1 and 6, for example between 2 and 4. It is preferred in each case that Y 1 and Y 2 are each hydrogen.
- the at least partially fluorinated group - (CZ 1 Z 2 ) q -CF 3 always has a q greater than zero. q is less than or equal to 19. For example, q is less than or equal to 13. Furthermore, it is possible, for example, for q to be less than or equal to nine or even less than or equal to five. For example, it is also possible for q to be greater than or equal to one or greater than or equal to two.
- the inventors have recognized that the moisture resistance and temperature resistance are promoted by a high degree of fluorination. It is particularly preferred if both Z 1 and Z 2 are fluorine or a perfluorinated short-chain alkyl (C 1 -C 3 ), for example
- both Z 1 and Z 2 have fluorine or are fluorine.
- the optoelectronic device according to the invention is the fluoro-organic additive is a compound of the following general
- n is an integer between 2 and 20, - and where m + n ⁇ 20.
- Such fluoro-organic additives are usually liquid. They can be produced and have a particularly good
- m is preferably between 1 and 6.
- m can also be zero, n is preferably between 2 and 14, more preferably between 2 and 10, for example between 2 and 6.
- the silicone and the fluorochemical additive in the mixture are at least partially reacted with one another.
- the reaction can take place when the silicone hardens, wherein, for example, incorporation of the additive into the silicone network can take place.
- incorporation of the additive into the silicone network can take place.
- Additive with the functional group is covalently bonded to the silicone. Such a combination leads to a permanently stable mixture and thus to consistent properties and good reliability of the
- the general structural formula represents a hydroxyl group which is part of the structure of the silicone of the present mixture.
- R x in the following represents the at least partially fluorinated alkyl group or the linker group and the at least partially fluorinated alkyl group.
- R x is, for example, according to the previously described
- a linkage by means of the hydroxyl group as a functional group to the silicone can be carried out, for example, by means of a condensation reaction in which e.g. a
- equation (2) is shown in equation (2) as an example of the reaction of an epoxide group with a hydroxyl group of the silicone: Even with a vinyl group as a functional group can be attached to the silicone. This is possible, for example, with the aid of a hydrosilation reaction according to equation (3):
- a connection via a vinyl group as a functional group to the silicone can also be carried out free-radically.
- a radical initiator can be added for the initiation.
- Suitable free-radical initiators are, for example, peroxide-based radical starters such as dibenzoyl peroxide or other comparable radical initiators.
- these radical starters can be readily thermally activated (eg at temperatures between 60 and 100 ° C) and can thus initiate the reactions that lead to a covalent attachment of the fluorine additive to the silicone.
- Peroxide-based radical starters form Warming eg Alkoxyradikale, which in turn can initiate a radical ⁇ addition.
- An illustrative example is shown in reaction (4):
- a structural unit of the silicone having an alkyl group (in this example a methyl group) which can be activated by addition of a radical initiator upon heating.
- the radical thus formed reacts with the vinyl group, whereby a covalent attachment of the fluor ⁇ organic additive is achieved in the silicone.
- the fluoro-organic additive is uniformly distributed in a matrix of the silicone and is covalently bonded to the silicone.
- the fluoro-organic additive is uniformly distributed in a matrix of the silicone and is covalently bonded to the silicone.
- the attachment of the fluoro-organic additive to the silicone takes place according to a statistical distribution.
- the fluoro-organic additive is at least partially not bound to the silicone. So it is not necessary that the fluoro-organic
- Molecules of the fluoro-organic additive are bonded to the silicone, while other molecules of the fluoro-organic additive are not bound to the silicone.
- Another development relates to an optoelectronic device according to the invention, wherein the proportion of fluorine ⁇ organic additive in the mixture between 0.2 and 10 weight percent, in particular between 0.5 and 5 weight ⁇ percent.
- a certain minimum amount of fluoro-organic additive is required which is at least 0.2% by weight of the additive in the mixture.
- the inventors have also solid-found that the effect is enhanced when at least 0.5 weight percent of the additive ⁇ on the total mixture are present.
- the proportion of additive in the mixture is less than 10 percent by weight, better less than or equal to 5
- Weight percent of the total mixture is. It may further be preferred if the proportion is less than or equal to 4 Weight percent or even less than or equal to 3 weight ⁇ percent.
- a particularly preferred range is the range between 0.5 and 5 weight percent, in particular between 1 and 3 weight percent. The best features will be for
- the moisture, media, temperature and composite stability is particularly positively influenced, which can be seen, for example, the small mass changes in thermal treatment and the low water vapor permeability.
- the silicone of the mixture of the optoelectronic device according to the invention is a two-component silicone, in particular a thermally curable, addition-crosslinking two-component silicone. It is preferably a silicone which itself is free of fluorine substituents and free of fluorinated substituents.
- the fluorochemical additives described above can be mixed well.
- the fluoro-organic additives can be incorporated directly into the silicone network as part of the curing of the silicones.
- the silicone may be a cast silicone. Mixtures of such silicones
- silicones with a hardness of Shore A 40 can be used as potting materials. Such silicones are characterized by good mechanical properties with good tear and elongation at break.
- Silicone around a hard silicone for example a hard one Lensensilikon act (for example, silicones with a hardness of Shore A 80). Such silicones have good
- interface may be one of
- Act device For example, it may be
- Interfaces between one of the following elements act: semiconductor, housing, radiation-conducting element, adhesive element, but also metal contacts and lines or other common components of the optoelectronic device.
- the inventors of the present invention have discovered that blends comprising silicone and the fluoro-organic additive allow good adhesion to virtually all materials conventionally included in optoelectronic devices. Optoelectronic devices according to the invention therefore show a very good composite stability. Also at
- a particularly preferred embodiment of the invention relates to the device according to the invention, wherein the mixture has an interface to a different material from the mixture and, wherein the mixture is a matrix material and in which of the mixture
- the particles may be evenly distributed in the matrix.
- Filler particles may for example be selected from the group comprising thermally conductive particles reflector ⁇ particles and colorant particles or particles of wave length conversion substances ⁇ .
- thermally conductive particles reflector ⁇ particles and colorant particles or particles of wave length conversion substances ⁇ may for example be selected from the group comprising thermally conductive particles reflector ⁇ particles and colorant particles or particles of wave length conversion substances ⁇ .
- the optoelectronic device may comprise, for example, a thermally conductive element which contains the mixture comprising silicone and fluoro-organic additive as matrix material or the matrix material consists thereof and contains as filler particles thermally conductive particles which are embedded in the matrix material.
- thermally conductive element which contains the mixture comprising silicone and fluoro-organic additive as matrix material or the matrix material consists thereof and contains as filler particles thermally conductive particles which are embedded in the matrix material.
- thermally conductive particles which are embedded in the matrix material.
- the opto-electro ⁇ African device comprises a radiation-conductive element, comprising the mixture as a matrix material and filler ⁇ particles, which are embedded in the matrix material.
- the device may comprise a radiation-reflecting element which contains the mixture as matrix material and
- Reflector particles as filler particles may be inorganic oxides such as S 1O 2 , T 1O 2 or Al 2 O 3 Particles act.
- suitable as reflector particles for example, CaF 2 , CaCO 3 or BaSC ⁇ in question.
- the device may comprise a radiolucent element containing the mixture as matrix material.
- the radiolucent element is a light conversion element, dye particles or wavelength conversion substances can be incorporated into the matrix as filler particles
- This can at least partly convert the primary ⁇ radiation into secondary radiation. This is radiation emitted by the semiconductor or by the
- the particles can be ceramic particles that can function as color or wavelength conversion substances.
- wave ⁇ length conversion materials are suitable, for example
- Garnets Garnets, aluminates, halogen phosphates, chloro-silicates and nitride-based phosphors.
- the mixture comprising silicone and the fluoro-organic additive is excellent as a matrix material for the various elements and various types of fillers. It also reduces susceptibility to media and moisture ingress, even at elevated temperature, so that delamination between the matrix and filler is reduced over conventional silicones without a fluoro-organic additive.
- the material other than the mixture e.g., a filler or other element or component of the optoelectronic device
- the material other than the mixture is a material
- thermally conductive carbon materials especially carbon black, graphite,
- Carbon nanotubes (CNTs),
- Dyes or wavelength conversion substances in particular garnets, aluminates,
- Halogen phosphates chloro-silicates, nitride ⁇ based phosphors.
- the materials can thus be reduced compared to conventional silicones without additives.
- the materials can be embedded, for example, as filler particles in the mixture, which acts as a matrix.
- the mixture may also be part of an element of the optoelectronic device, while the material other than the mixture may be part of another element or component in contact with the element containing the mixture.
- the element can be in direct connection with electrical conductors (wires, metallization, other electrical contacting) that have a metal (eg, Cu, Ag or Au).
- the element comprising the mixture may be in contact with another element comprising or consisting of glass, a polymer or a silicone without the fluoro-organic additive.
- said polymer may be polyphthalamide (PPA), polycyclohexylenedimethylene terephthalate (PCT), Polybutylene terephthalate (PBT) or polyetheretherketone (PEEK) or mixtures thereof.
- the fluoro-organic additive of the mixture may undergo a chemical reaction with the fluoro-organic additive of the mixture
- anchoring of the fluoro-organic additive to filler surfaces or other surfaces with the functional group of the fluoro-organic additive can be carried out to form a covalent bond.
- Optoelectronic device also a method for
- the method according to the invention comprises the steps:
- Housing body element surrounding the at least one semiconductor at least in places, Radiation-conducting element that in one
- Beam path of the semiconductor emitted or detected by the semiconductor radiation is arranged
- thermally conductive element one of the
- the mixture and the optoelectronic device can comprising elements comprising the mixture, easily and inexpensively manufacture ⁇ .
- the mixture can be processed with established processes such as those known for silicones without the fluoro-organic additive.
- additional process steps are often required, which can be dispensed with in the mixture according to the invention.
- processes such as low pressure or atmospheric plasma treatment can be used to improve the
- hardening of the mixture takes place in method step C).
- Typical temperatures for the curing are, for example, temperatures between 60 and 200 ° C, preferably between 100 and 180 ° C, for example 150 ° C.
- Another development of the method according to the invention relates to the method, wherein in the curing reaction of the fluoro-organic additive to form a
- a bond to the silicone may be due to a reaction of the Silicones with a hydroxyl, epoxy or vinyl group of the fluoro-organic additive done.
- the invention further relates to the use of
- the devices according to the invention are significantly more robust and durable in outdoor applications than conventional devices.
- FIG. 1 is a schematic sectional view of an exemplary optoelectronic device according to the present invention, wherein the mixture comprising a silicone and a fluoro-organic additive may be contained in one or more of the elements shown.
- Figure 2 is a schematic sectional view through another exemplary optoelectronic device according to the present invention, wherein the mixture may be contained in one or more of the elements shown.
- Figure 3 is a schematic sectional view through another exemplary optoelectronic device according to the present invention, wherein the mixture may be contained in one or more of the elements shown.
- the device (6) can comprise a housing body element (or a housing body) (2), which partially surrounds an optoelectronic radiation-emitting or radiation-detecting semiconductor (1) with a radiation-emitting or radiation-detecting main surface (5).
- the semiconductor (1) can be connected to the housing body (2), for example via an adhesion promoter element or a bonding agent (4). In the beam path respectively
- a radiation-conducting element (3) may be arranged. In the case of FIG. 1 shown by way of example, this is a casting (3a).
- the potting (3a) can also be used for radiation-emitting
- the radiation-conducting element can also be an additive, such as a color or phosphor, such as a
- the additive may be in the form of filler particles, for example, which may be embedded in the radiation-conducting element.
- the housing body (2), the radiation-conducting element (3) - here executed as encapsulation (3a) - and the adhesive element (4) may each independently comprise or consist of the mixture comprising the silicone and the fluoro-organic additive.
- FIG. 2 shows a further embodiment of the invented ⁇ modern optoelectronic device (6).
- the same elements as in FIG. 1 are included, wherein additionally a lens (3b) is formed separately from the encapsulation (3a).
- the lens (3b) as well as the potting (3a) may contain additives.
- There may also be other elements as shown in FIG. For example, in the beam path or detector window, the one emitted by the semiconductor (1) or The semiconductor (1) detected radiation, a light conversion element (3c) may be arranged.
- a light conversion element (3c) may be arranged in the beam path or detector window.
- a light conversion element (3c) may be arranged in the beam path or detector window.
- a light conversion element (3c) may be arranged in the beam path or detector window.
- a light conversion element (3c) may be arranged in the beam path or detector window.
- a light conversion element (3c) may be arranged in the beam path or detector window.
- a light conversion element (3c) may be
- Radiation-reflecting element (3d) partially laterally and with respect to the radiation-emitting or
- Light conversion element (3c) are each
- radiolucent elements Together with the radiation-reflecting element (3d) they form
- One or more of the elements (2), (3a), (3b), (3c), (3d) and (4) shown may each independently contain or consist of the mixture comprising the silicone and the fluorochemical additive consist. It is also possible that they comprise or consist of the mixture as a matrix and additionally at least one filler embedded in this matrix.
- thermally conductive element is present.
- the housing (2), the adhesive element (4) or the encapsulation (3a) additionally comprise thermally conductive particles.
- the housing (2), the adhesive element (4) and the potting (3a) are at the same time thermally conductive elements in the sense of the invention. But other elements of the
- Optoelectronic device can be thermally conductive
- compositions of the mixture according to the invention were investigated and compared with a silicone without an organofluorine additive.
- the silicones of the compositions studied were a conventional commercially available one
- the fluoro-organic additive used was 1,1,2,2-tetrahydroperfluorooctanol, which is known in
- Other compositions comprise from 0.2, 0.5, 2 and 5 weight percent of the 1,1,2,2, -tetrahydroperfluorooctanol.
- compositions were each cured at 150 ° C for one hour. Subsequently, the properties of the resulting mixtures were determined (see Table 1). Table 1: Properties of the mixtures after curing. The Shore A hardness was determined using a hardness tester according to DIN 53505, ASTM D676 at room temperature.
- the mixture according to the invention has a lower moisture absorption and a lower mass loss on exposure to temperature than the conventional silicone without fluorinated organic additive
- the mixture thus ensures improved moisture and weather resistance.
- Test sample separated two test rooms from each other, wherein in a test room, the relative humidity was set to 90% controlled and diffused through the sample
- Silicone 1 is a soft potting silicone (Shore A 40), while silicone 2 is a hard lens silicone (Shore A 80). Both silicones were each in a proportion of 2% by weight 1, 1, 2, 2, -tetrahydroperfluorooctanol and as a reference value without the addition of
- the water vapor permeability can thus be reduced by at least 10% and even by more than 25 ⁇ 6 for harder silicones.
- a reduced water vapor permeability is improved stability to moisture and ge ⁇ ensures a reduced tendency to delamination. It is also an indication of improved media resistance in general.
- Treatment of 6 weeks at 150 ° C) has a thermal expansion of only 402 ppm / K, while without the additive, the thermal expansion (measured after 6 weeks at 150 ° C) is 441 ppm / K.
- the heating rate in the measurement was 3 K / min under He; the values refer to the temperature range from -50 to 260 ° C.
- the lower thermal expansion of the mixture according to the invention affords advantages for the composite stability of the optoelectronic device.
- the yellowing behavior of the mixture at a level of 2 wt .-% of 1, 1, 2, 2, -Tetrahydroper- fluorooktanol was examined. Even after 6 weeks temperature ⁇ outsourcing with 85 ° C at 85% humidity no yellowing could be observed.
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Light Receiving Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017550705A JP6775519B2 (ja) | 2015-04-14 | 2016-04-13 | シリコーンおよびフッ素系有機添加剤を含有する混合物を含む光電子デバイス、並びに光電子デバイスの製造方法 |
| US15/565,116 US10597512B2 (en) | 2015-04-14 | 2016-04-13 | Optoelectronic device with a mixture having a silicone and a fluoro-organic additive |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015105661.5A DE102015105661B4 (de) | 2015-04-14 | 2015-04-14 | Optoelektronische Vorrichtung mit einer Mischung aufweisend ein Silikon und ein fluor-organisches Additiv |
| DE102015105661.5 | 2015-04-14 |
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| Publication Number | Publication Date |
|---|---|
| WO2016166164A1 true WO2016166164A1 (de) | 2016-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/EP2016/058129 Ceased WO2016166164A1 (de) | 2015-04-14 | 2016-04-13 | Optoelektronische vorrichtung mit einer mischung aufweisend ein silikon und ein fluor-organisches additiv |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10597512B2 (de) |
| JP (1) | JP6775519B2 (de) |
| DE (1) | DE102015105661B4 (de) |
| WO (1) | WO2016166164A1 (de) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017101729A1 (de) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
| DE102017117550A1 (de) * | 2017-08-02 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102017117548A1 (de) | 2017-08-02 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| CN112349790B (zh) * | 2020-11-27 | 2025-05-13 | 安徽省紫芯半导体技术有限公司 | 一种贴片式紫外传感器 |
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| JP2007009216A (ja) * | 2006-07-25 | 2007-01-18 | Shin Etsu Chem Co Ltd | 被膜形成用組成物用フロロオルガノポリシロキサン樹脂の製造方法 |
| WO2012073899A1 (ja) * | 2010-12-02 | 2012-06-07 | 富士フイルム株式会社 | 硬化物製造用キット及び硬化物製造用組成物、並びにその使用 |
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| US5733960A (en) * | 1996-04-04 | 1998-03-31 | Dow Corning Corporation | Enhanced longevity of surface drying oil on a sealant modified by incorporation of zinc oxide |
| JP4126521B2 (ja) * | 2000-08-04 | 2008-07-30 | 信越化学工業株式会社 | 被膜形成用組成物用フロロオルガノポリシロキサン樹脂の製造方法 |
| DE10361801A1 (de) | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| TWI275189B (en) | 2003-12-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component |
| US20080048199A1 (en) | 2006-08-24 | 2008-02-28 | Kee Yean Ng | Light emitting device and method of making the device |
| WO2008154414A2 (en) * | 2007-06-08 | 2008-12-18 | 3M Innovative Properties Company | Water- and oil-repellency imparting ester oligomers comprising perfluoroalkyl moieties |
| JP5194750B2 (ja) * | 2007-12-05 | 2013-05-08 | 日立化成株式会社 | プリプレグ、および積層板 |
| DE102008014927A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement |
| KR101601271B1 (ko) * | 2009-07-20 | 2016-03-08 | 주식회사 엘지화학 | 발광소자 봉지용 조성물, 발광 다이오드 및 액정표시장치 |
| WO2011021402A1 (ja) * | 2009-08-21 | 2011-02-24 | パナソニック株式会社 | 発光装置 |
| KR101077990B1 (ko) * | 2010-02-12 | 2011-10-31 | 삼성엘이디 주식회사 | 형광체, 발광장치, 면광원장치, 디스플레이 장치 및 조명장치 |
| JP6006554B2 (ja) * | 2012-07-11 | 2016-10-12 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、該組成物からなる光学素子封止材、該光学素子封止材で封止した光学素子、及び付加硬化型シリコーン組成物の製造方法 |
| JP5843016B2 (ja) * | 2012-07-27 | 2016-01-13 | コニカミノルタ株式会社 | Led装置及びその製造方法 |
| JP6227884B2 (ja) | 2013-04-17 | 2017-11-08 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| DE102013104195A1 (de) | 2013-04-25 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
-
2015
- 2015-04-14 DE DE102015105661.5A patent/DE102015105661B4/de active Active
-
2016
- 2016-04-13 JP JP2017550705A patent/JP6775519B2/ja active Active
- 2016-04-13 WO PCT/EP2016/058129 patent/WO2016166164A1/de not_active Ceased
- 2016-04-13 US US15/565,116 patent/US10597512B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007009216A (ja) * | 2006-07-25 | 2007-01-18 | Shin Etsu Chem Co Ltd | 被膜形成用組成物用フロロオルガノポリシロキサン樹脂の製造方法 |
| WO2012073899A1 (ja) * | 2010-12-02 | 2012-06-07 | 富士フイルム株式会社 | 硬化物製造用キット及び硬化物製造用組成物、並びにその使用 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180100054A1 (en) | 2018-04-12 |
| US10597512B2 (en) | 2020-03-24 |
| DE102015105661A1 (de) | 2016-10-20 |
| DE102015105661B4 (de) | 2022-04-28 |
| JP2018517277A (ja) | 2018-06-28 |
| JP6775519B2 (ja) | 2020-10-28 |
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