WO2016157594A1 - Matériau d'assemblage sous forme de feuille, composant électronique l'utilisant, procédé d'assemblage, et corps assemblé - Google Patents

Matériau d'assemblage sous forme de feuille, composant électronique l'utilisant, procédé d'assemblage, et corps assemblé Download PDF

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Publication number
WO2016157594A1
WO2016157594A1 PCT/JP2015/081364 JP2015081364W WO2016157594A1 WO 2016157594 A1 WO2016157594 A1 WO 2016157594A1 JP 2015081364 W JP2015081364 W JP 2015081364W WO 2016157594 A1 WO2016157594 A1 WO 2016157594A1
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resin
bonding material
joining
bonding
electronic component
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PCT/JP2015/081364
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English (en)
Japanese (ja)
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野村昭博
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株式会社村田製作所
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Publication of WO2016157594A1 publication Critical patent/WO2016157594A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to a sheet-like bonding material used when, for example, an electronic component including an electrode is mounted on a circuit board, and further, an electronic component including the same, a bonding method using the bonding material, and bonding About the body.
  • An anisotropic conductive bonding material is known as a bonding material used when an electronic component including an electrode is bonded to a conductor (for example, a land electrode) on a circuit board.
  • the anisotropically conductive bonding material has two members as described above (for example, a circuit board including an electronic component including an electrode and a conductor (electrode) to which the electrode included in the electronic component is to be electrically connected). It is a joining material used when joining.
  • anisotropic conductivity means that when two members as described above are bonded, the two electrodes to be connected to each other are bonded in such a manner that they are electrically connected.
  • the electrodes adjacent to each other in the direction parallel to the main surface of the circuit board hereinafter also referred to as “plane direction”) can be kept electrically insulated without being electrically connected. Refers to the nature.
  • the bonding material has a conductivity in the thickness direction, that is, between two electrodes facing each other.
  • anisotropic conductive bonding materials are roughly classified into paste-like and sheet-like materials, and sheet-like materials have advantages in terms of usability compared to paste-like materials.
  • a paste-like bonding material it is necessary to use a method such as printing or dispensing, and in any case, a jig such as a mask, squeegee, syringe, needle, or consumable material is required. It is necessary to accurately manage a small amount of coating, and there are problems that it is expensive and the manufacturing process is complicated.
  • Patent Documents 1 and 2 Such sheet-like bonding materials (anisotropic conductive bonding materials) are disclosed in Patent Documents 1 and 2 below.
  • Patent Document 1 in an anisotropic conductive adhesive or film containing an adhesive component and conductive particles, at least two or more types of particles having different hardness and substantially the same particle size are used as the conductive particles.
  • An anisotropic conductive bonding material (an anisotropic conductive adhesive) is disclosed.
  • Patent Document 2 resin particles made of an acrylic resin having a maximum compressive deformation rate of 60% or more and a load required for compressive deformation of 60% are 60 mN or less are used as a core material.
  • An anisotropic conductive bonding material anisotropic conductive adhesive
  • anisotropic conductive adhesive which contains conductive particles having a conductive material attached to the surface thereof, and the conductive particles are dispersed in the adhesive material.
  • the anisotropic conductive bonding materials of Patent Documents 1 and 2 are both related to an anisotropic conductive bonding material using a resin material and conductive particles, and are related to conductive particles to be blended in the bonding material. By appropriately adjusting the characteristics such as the sheath size, the ease of compressive deformation, and the like, a stable crimp-fixed state is obtained and high conduction reliability is obtained.
  • the conduction between the conductive particles and the object to be bonded is either the electrode and a part of the conductive particles are in contact, Alternatively, it is obtained by being close to the extent that current flows by the tunnel effect or the Schottky effect, and is not obtained by physical and strong bonding like metal bonding.
  • conductive particles may be caused by the expansion and contraction of the bonding target (for example, electronic components and circuit boards) and the bonding material itself due to repeated temperature changes, moisture absorption and condensation in a high humidity environment, etc.
  • the bonding target for example, electronic components and circuit boards
  • the bonding material itself due to repeated temperature changes, moisture absorption and condensation in a high humidity environment, etc.
  • the stable joint state of the contact between the electrode and the electrode is impaired, and good electrical conduction cannot be maintained.
  • Patent Document 3 proposes an anisotropic conductive bonding material using conductive particles whose surfaces are covered with solder so that the conductive particles and the electrode can be firmly bonded by metal bonding. ing.
  • solder layer exists outside the conductive layer in the conductive particles, the solder layer and the electrode can be metal-bonded by melting the solder layer by heating. It is said that high bonding reliability can be obtained.
  • the conductive particles used in Patent Document 3 have a configuration in which the core is formed of a resin material and a solder layer is formed as a surface layer, the core and the surface layer (solder layer) Since the thermal expansion coefficients differ greatly, there is a risk of destruction at the interface between the core and the surface layer (solder layer) due to temperature cycling.
  • the conductive particles in which the core is formed of a resin material and the solder layer is formed as a surface layer are melted only on the surface when heated, and only the conductive particles that have been in contact with the electrode have the surface layer (solder Layer) will be metal bonded to the electrode. Therefore, only the conductive particles that exist on the electrode (between two electrodes facing each other) contribute effectively to the electrical connection, and the conductive particles that do not exist on the electrode contribute to the electrical connection. In addition to this, there is a problem that, depending on the case, it may cause a short circuit between electrodes adjacent to each other in a direction (plane direction) parallel to the main surface of the circuit board.
  • the present invention solves the above-described problems, and is used when, for example, an electronic component including an electrode is mounted on a circuit board.
  • the present invention has excellent handleability and reliable mechanical joining and good electrical continuity. It is possible to reliably join electronic parts and joining objects that have excellent connection workability and high connection reliability after mounting, using this bonding material.
  • An object of the present invention is to provide a simple bonding method and a bonded body with high bonding reliability.
  • the bonding material of the present invention is: A sheet-like bonding material used for bonding between members having electrodes, A liquid cross-linkable resin at 15 ° C. or higher and 25 ° C. or lower; A cross-linked resin solid at 15 ° C. or higher and 25 ° C. or lower; It is characterized by containing solder.
  • the crosslinkable resin is preferably a thermosetting resin.
  • a thermosetting resin as the cross-linking resin, it is possible to realize highly reliable bonding only by heating, and the present invention can be more effectively realized.
  • thermosetting resin is an epoxy resin.
  • an epoxy resin By using an epoxy resin as the thermosetting resin, stable bonding reliability can be realized.
  • the content ratio of the liquid crosslinkable resin and the solid crosslinkable resin is preferably in the range of 5:95 to 95: 5 by weight. Stable handling, sufficient storage stability, and high bonding reliability are realized by setting the content ratio of liquid crosslinkable resin and solid crosslinkable resin in the range of 5:95 to 95: 5 by weight. It is possible to provide a bonding material that can be used.
  • solder is contained in a proportion of 2.5% by volume to 50% by volume.
  • a bonding material capable of realizing stable handling, sufficient storage stability, and high bonding reliability by containing solder in a proportion of 2.5% by volume or more and 50% by volume or less. it can.
  • solder is Sn-based solder having Sn as one of main components.
  • Sn-based solder with Sn as one of the main components, a bonding material capable of realizing high bonding reliability can be provided.
  • the Sn-based solder is SnAgCu-based solder or SnBi-based solder.
  • SnAgCu-based solder or SnBi-based solder As the Sn-based solder, a bonding material capable of realizing high bonding reliability can be provided.
  • the bonding material of the present invention preferably contains an activator. Since the activator functions to remove the solder and the oxide film on the electrode surface, the activator is included to improve the joint state between the electrode and the solder and realize a highly reliable joint. Can do.
  • the activator is adipic acid or sebacic acid.
  • the activator is adipic acid or sebacic acid, it is possible to provide a bonding material that can more reliably achieve a good bonding state.
  • the electronic component of the present invention is characterized by including the bonding material of the present invention.
  • the bonding method of the present invention is a bonding method for bonding members having electrodes, and the liquid material and the solid material in a state where the bonding material of the present invention is positioned between the members having the electrode. It is characterized by cross-linking the cross-linked resin.
  • the joined body of the present invention is characterized in that one joining object and the other joining object are joined by the joining method of the present invention.
  • the joining material of the present invention is a sheet-like joining material used for joining members having electrodes, and is a liquid crosslinkable resin (hereinafter simply referred to as “liquid resin”) at 15 ° C. or more and 25 ° C. or less. And a solid cross-linkable resin (hereinafter also simply referred to as “solid resin”) at 15 ° C. or higher and 25 ° C. or lower, and solder, and is in the form of a sheet. Compared to, it is easy to handle. That is, as in the case of supplying a paste-like bonding material, it is not necessary to use a method such as printing or dispensing, and an appropriate amount of bonding material can be easily supplied.
  • liquid resin liquid crosslinkable resin
  • solid resin solid cross-linkable resin
  • the ratio of the liquid resin and the solid resin is controlled, or the type of the liquid resin and the solid resin is appropriately selected. By doing so, it is possible to impart moderate flexibility, adhesiveness, and the like, and further improve the handleability.
  • the electronic component of the present invention includes the bonding material of the present invention, for example, when mounting on a circuit board, the electronic component and the circuit are not required to separately prepare the bonding material. Mounting electronic components on a circuit board in such a posture that the bonding material is positioned between the boards, heating them in a reflow furnace, and crosslinking the liquid resin and solid resin easily and with high reliability ( Joining) can be performed.
  • the bonding method of the present invention is a bonding method for bonding members having electrodes, wherein the bonding material of the present invention is placed between the members having the electrodes in a liquid and solid state. Since the cross-linking resin is cross-linked, it is possible to easily bond the two by simply performing a cross-linking process such as heating while the bonding material is positioned between the members (between the objects to be bonded). It becomes possible. Further, since the bonding material of the present invention is used, highly reliable bonding can be performed.
  • the joined body of the present invention is obtained by joining one member having an electrode and the other member having an electrode by the joining method of the present invention, and the joining material of the present invention is used as a joining material. Therefore, it is possible to easily obtain a bonded body with high bonding reliability.
  • the bonding material of the present invention is a sheet-shaped bonding material used for bonding members having electrodes, and is a liquid cross-linkable resin (liquid resin) at 15 ° C. or higher and 25 ° C. or lower, and 15 ° C. or higher, It contains a solid cross-linkable resin (solid resin) and solder at 25 ° C. or lower.
  • liquid resin liquid resin
  • solid resin solid cross-linkable resin
  • the bonding material of the present invention two types of resins, that is, a liquid crosslinkable resin and a solid crosslinkable resin at 15 ° C. or higher and 25 ° C. or lower are blended as the crosslinkable resin.
  • the determination of whether or not the cross-linked resin is “liquid at 15 ° C. or higher and 25 ° C. or lower” is performed by the following liquid confirmation test used for the dangerous goods determination of the Fire Service Act.
  • Constant temperature water tank A stirrer, a heater, a thermometer, and an automatic temperature controller (which can be controlled at ⁇ 0.1 ° C) are prepared with a depth of 150 mm or more.
  • Test tubes A flat bottom cylindrical transparent glass having an inner diameter of 30 mm and a height of 120 mm is prepared. Mark lines (hereinafter referred to as “A line” and “B line”) are attached to the test tubes at a height of 55 mm and 85 mm from the bottom of the tube.
  • Thermometer (1) Prepare a freezing point (SOP-58) (scale range 20 ° C.
  • test article (crosslinkable resin)
  • the test article (crosslinkable resin) used for the test shall be stored at a temperature of 20 ⁇ 5 ° C. for 24 hours or more.
  • thermometer is inserted so that the tip of the thermometer is 30 mm deep from the surface of the test article (crosslinked resin), and is upright with respect to the test tube.
  • the two test tubes are placed in a thermostat so as to stand upright so that the line B is immersed under the water surface.
  • the temperature of the test article (crosslinked resin) in the temperature measurement test tube reaches the liquid confirmation temperature ⁇ 0.1 ° C., the state is maintained for 10 minutes.
  • liquid crosslinkable resin liquid resin
  • solid crosslinkable resin solid that is solid at 15 ° C. or more and 25 ° C. or less, determined by the above-described method Resin
  • liquid crosslinkable resin liquid resin
  • an epoxy resin a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin, a urethane resin having an appropriate molecular weight
  • a polyimide resin, a silicone resin, an acrylic resin, or the like can be used as a liquid crosslinkable resin (liquid resin) at 15 ° C. or more and 25 ° C. or less.
  • a cross-linked resin (solid resin) solid at 15 ° C. or more and 25 ° C. or less a phenoxy resin, an epoxy resin, a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin having an appropriate molecular weight, Urethane resin, polyimide resin, silicone resin, acrylic resin, or the like can be used.
  • thermosetting resin it is usually desirable to use a thermosetting resin, but it is also possible to use a photocuring resin or a resin that crosslinks with a catalyst or the like.
  • solder constituting the bonding material of the present invention it is preferable to use Sn-based solder having a relatively low melting point and capable of heat treatment at a low temperature, and among them, SnAgCu-based solder and SnBi-based solder are used. Is preferred. However, solder materials having other compositions can be sufficiently used by applying processing conditions in accordance with their melting points.
  • the blending amount of the solder is preferably in the range of 2.5% by volume to 50% by volume.
  • a substantially spherical shape is preferable from the viewpoint of material acquisition and processing ease when processing into a sheet shape, but it is also possible to use a different shape such as a flake shape or a linear shape. is there.
  • a substantially spherical thing it is preferable to use a thing with an average particle diameter (D50) of 3 micrometers or more and 100 micrometers or less.
  • the optimum size and blending amount can be selected according to the form of the joining object, the area and arrangement of the electrodes, and the like. However, from the viewpoint of not causing poor bonding such as open or short, it is preferable to blend a powder having an average particle diameter (D50) of 3 ⁇ m or more and 100 ⁇ m or less in a range of 2.5 volume% or more and 50 volume% or less. .
  • D50 average particle diameter
  • the distribution (arrangement) of the solder in the sheet-like bonding material may be uniformly distributed, and the electrodes facing each other to be bonded in consideration of the relationship with the position of the electrode in the bonding object, for example. You may make it distribute unevenly so that many may exist in between.
  • an activator serves to remove solder (powder) and an oxide film on the electrode surface.
  • an organic acid or amine having a function of efficiently removing solder (powder) or an oxide film on the electrode surface is used.
  • organic acids are suitable from the viewpoint of activity and reliability, and adipic acid or sebacic acid is particularly preferred.
  • the sheet-like bonding material of the present invention uses a liquid cross-linked resin and a solid cross-linked resin in the vicinity of room temperature (15 to 25 ° C.).
  • a bonding material can be provided.
  • the joining material of the present invention when joining one member having an electrode (joining object) and the other member having the electrode (joining object) to each other, the joining material between one member and the other member The two can be easily joined simply by cross-linking (for example, heating) the cross-linkable resin in a state where is positioned.
  • the bonding material of the present invention configured as described above is used, highly reliable mounting (bonding) can be performed. That is, it is possible to firmly bond the electrode included in one object to be bonded and the electrode included in the other object to be bonded by solder, and the one object to be bonded and the other object to be bonded can be cross-linked. Since it can adhere
  • thermoplastic resin In order to keep the sheet material in a solid state around room temperature, it is possible to use a thermoplastic resin. However, when the thermoplastic resin is exposed to a temperature higher than the melting point, it melts again and exhibits fluidity. There is a problem that the joint cannot maintain a stable state.
  • thermosetting resin having fluidity at room temperature and stopping the curing reaction in the middle may be considered, but it is difficult to obtain a stable shelf life, which is not preferable.
  • thermosetting resin Bisphenol A liquid epoxy resin (weight average molecular weight mw380)
  • the solid phenoxy resin used what was melt
  • liquid and solid thermosetting resins were blended so as to have the ratios shown in Sample Nos. 1 to 30 in Table 1A and Table 1B.
  • the mixing ratio of the liquid thermosetting resin (liquid resin) and the solid thermosetting resin (solid resin) in the samples Nos. 1 to 30 in Table 1A and Table 1B is based on the solid resin excluding the solvent.
  • the ratio of liquid resin (liquid resin / solid resin (excluding solvent)) is shown.
  • solder As the solder, the following solders (c1) and (c2) were prepared. In addition, as a solder, the thing of an average particle diameter as shown to Table 1A and Table 1B is used, and the ratio as shown in Table 1A and Table 1B, ie, the ratio in a sheet-like joining material, is 2.5 volume. % To 50% by volume or less.
  • C1 Sn3Ag0.5Cu solder powder (average particle size 20 ⁇ m)
  • C2) Sn58Bi Average particle size 20 ⁇ m
  • Sn3Ag0.5Cu indicates that Ag is 3% by weight, Cu is 0.5% by weight, and the rest is Sn.
  • Sn58Bi indicates that Bi is 58% by weight and the rest is Sn. Show.
  • the following curing agents (d1) and (d2) were used.
  • Phenol resin (weight average molecular weight mw190)
  • the phenol resin was used by dissolving in propylene glycol monomethyl ether acetate so that the proportion of the phenol resin was 65% by weight.
  • the 2-phenyl-4,5-dihydroxymethylimidazole of (d1) is a constant ratio with respect to the total amount of the liquid resin and solid resin (not including the solvent component) constituting the sheet-like bonding material. (To 6 wt% with respect to the total amount of liquid resin and solid resin).
  • the phenol resin (d2) is used as a curing agent only for the sample of sample number 31 in Table 1B.
  • the blending ratio of the phenol resin as the curing agent in consideration of the molecular weight (weight average molecular weight) of the liquid resin and the solid resin and the number of reactive groups they have. Determined.
  • the phenol resin acts as a solid cross-linked resin (thermosetting resin) in the sheet before heating, in the sample of sample number 31 using a phenol resin as a curing agent, the solid resin (phenoxy of (b) above)
  • the ratio of the liquid resin (bisphenol A type liquid epoxy resin of (a) above) to the resin and the total of phenol resin as the curing agent of (d2) above, that is, the value of liquid resin: solid resin (total) is 55 : 45. This ratio is a ratio within the scope of the present invention.
  • the following curing agents (e1) and (e2) were used.
  • the adipic acid of (e1) and the sebacic acid of (e2) are both at a certain ratio to the amount of solder contained in the sheet-like bonding material ( 2% by weight).
  • the above raw materials were mixed with a mixer. It is also possible to use a crusher instead of a mixer.
  • a solvent propylene glycol monomethyl ether acetate was further added to the paste obtained by mixing the raw materials to adjust the viscosity so as not to hinder the formation of the coating film.
  • the paste whose viscosity was adjusted was thinly stretched using a doctor blade on the surface of the release film on the PET film which had been release-treated on one side. This was heat-treated in an oven at 90 ° C. for 30 minutes to volatilize the solvent, thereby obtaining a sheet-like bonding material.
  • the squeegee thickness was adjusted so that the thickness of the sheet-like bonding material was about 40 ⁇ m.
  • the sheet-like bonding material (sample) is cut into a dimension having a length of 0.6 mm and a width of 0.3 mm (a dimension corresponding to the dimension of the electronic component (chip resistor) 10) to obtain a chip resistor.
  • the cut sheet-like bonding material 3 was placed on the circuit board 1 (land electrodes 2a and 2b) on which the circuit board 10 is mounted (see FIG. 2).
  • a chip resistor 10 having a pair of electrodes 11a and 11b on both ends in the length direction and having a length of 0.6 mm and a width of 0.3 mm is mounted on the bonding material 3 and applied with a pressure of about 1 MPa. While applying pressure, it was heated to 250 ° C. and held for 1 minute.
  • the resistance between the land electrodes 2a and 2b of the chip resistor 10 was measured using a micro ohm meter, and the one having a resistance value in the range of 10 ⁇ 0.5 ⁇ was determined as a good product.
  • the test was performed on 10 test samples prepared for each sample in Table 1A and Table 1B, and the number of samples determined to be non-defective was counted.
  • the cut sheet-shaped bonding material 3 is placed on the circuit board 1 and the chip resistor 10 is mounted thereon.
  • a chip resistor may be mounted on the circuit board.
  • Bonding reliability Chip resistance determined to be good in the bonding property test of (2) above is put in a temperature cycle test bath of -40 ° C to 125 ° C for 30 minutes, and the resistance value after 1000 cycles is obtained. It was measured. Then, a non-defective product / defective product was determined by the same method as in the case of the bondability test (2), and the number of samples determined to be non-defective was counted. The results are also shown in Table 1A and Table 1B.
  • sample of sample number 31 is a sample using a phenol resin (weight average molecular weight 190) as the curing agent, this sample number 31 also has good characteristics in each test described above. It was confirmed.
  • the samples (sheet-like bonding material) of sample numbers 1 to 31 having the requirements of the present invention are excellent in handleability and reliable when used for mounting chip resistors. It was confirmed that it was possible to achieve a good joint and good electrical continuity.
  • each electronic component 10 can be easily and reliably mounted on each stage 20a, 20b.
  • the bonding material 3 for bonding a plurality of electronic components 10 may include the bonding material 3 as shown in FIG. 3. It is also possible to configure (two electronic components) 10 to be joined to each land electrode 2.
  • the sheet-shaped bonding material 3 of the present invention is used.
  • the electrode 11 of the electronic component 10 can be bonded to the land electrode 2 disposed on the bottom surface 31 of the recess 30 of the circuit board 1 so that highly reliable mounting can be performed.
  • the land electrode 2 on the bottom surface 31 of the recess 30 is formed.
  • it is necessary to supply a paste-like bonding material on the upper surface it is difficult to supply the paste-like bonding material to the bottom surface 31 of the recess 30, which may cause a decrease in productivity and poor mounting. is there.
  • the sheet-like bonding material 3 of the present invention the difficult operation of supplying the paste-like bonding material is unnecessary, and the electrode 11 of the electronic component 10 can be easily and reliably connected to the circuit board. It is possible to perform mounting with high reliability by bonding to the land electrode 2 disposed on the bottom surface of the one recess 30.
  • the single bonding material 3 is used to bond each electronic component (two electronic components) 10 to each land electrode 2.
  • each electronic component 10 so as to include the bonding material 3 as a separate body.
  • both the main surfaces 40 a and 40 b of the vertical wall 40 and the vertical wall 40 are provided. Even when the electronic component 10 is mounted on the land electrode 2 on the bottom surface 42 of the enclosed region 41, the electrode 11 of the electronic component 10 is attached to the vertical wall 40 by using the sheet-like bonding material 3 of the present invention. Highly reliable mounting can be achieved by efficiently and reliably joining the land electrode 2 disposed on both the main surfaces 40a and 40b and the land electrode 2 disposed on the bottom surface 42.
  • a temporary fixing adhesive or adhesive tape is used.
  • an adhesive member as a bonding material of the present invention, by using a sheet-like bonding material having tackiness, there is no need for a temporary fixing adhesive or an adhesive tape. It is possible to perform mounting and joining, which is particularly meaningful.
  • a plurality of electronic components (two of the inner surface 40 a of the vertical wall 40 and one of the bottom surface 42, a total of three electronic components) 10 are bonded to each land electrode 2 with one bonding material 3.
  • the electrode of the electronic component 10 is obtained by using the sheet-like bonding material 3 of the present invention. 11 can be efficiently and reliably bonded to the land electrodes 2 on both the main surfaces 1a and 1b of the circuit board 1 to achieve highly reliable mounting.
  • the bonding material 3 may be used by being attached to the mounting surface of the surface-mounted electronic component 10, or the circuit board 1 on which the surface-mounted electronic component 10 is mounted. You may make it stick and use.
  • the joining material of the present invention has a feature of excellent anisotropic connectivity, the number of terminals of electronic components to be joined and a circuit board that is an electronic component connection target (mounting target)
  • mounting target There are no restrictions on the number of electrodes provided, not only 2-terminal passive components, but also electronic components with more terminals are mounted on connection targets (mounting targets) such as circuit boards equipped with the corresponding electrodes. It can also be used for bonding. It can also be used for mounting and joining various electronic module components.
  • FIG. 3 shows a configuration for mounting a three-terminal electronic component 10a
  • FIG. 4 shows a configuration for mounting an electronic component 10b having a large number of terminals such as an IC chip. It is shown.
  • this invention is not limited to the said embodiment, It is possible to add various application and deformation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Cette invention concerne : un matériau d'assemblage sous forme de feuille qui est utilisé dans les cas où un composant électronique pourvu d'électrodes doit être monté sur une carte de circuit, présente d'excellentes propriétés de manipulation, et permet d'obtenir un assemblage mécanique fiable et une excellente conduction électrique ; un composant électronique qui utilise ledit matériau d'assemblage, et présente une excellente usinabilité lors du montage, et une fiabilité de conduction élevée après le montage ; un procédé d'assemblage permettant d'assembler de manière fiable des objets destinés à être assemblés ; et un corps assemblé ayant une fiabilité d'assemblage élevée. Le matériau d'assemblage sous forme de feuille utilisé pour assembler des éléments pourvus d'électrodes comprend : une résine réticulée qui est liquide entre 15 et 25 °C inclus ; une résine réticulée qui est solide entre 15 et 25 °C inclus ; et une brasure. Des résines thermodurcissables sont utilisées à titre de résines réticulées. Le rapport de teneurs de la résine réticulée liquide à la résine réticulée solide, exprimé en rapport en poids, est dans la plage de 5:95 à 95:5. La teneur en brasure est dans la plage de 2,5 à 50 % en volume, bornes incluses.
PCT/JP2015/081364 2015-03-27 2015-11-06 Matériau d'assemblage sous forme de feuille, composant électronique l'utilisant, procédé d'assemblage, et corps assemblé WO2016157594A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015066870 2015-03-27
JP2015-066870 2015-03-27
JP2015-106110 2015-05-26
JP2015106110 2015-05-26

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WO2016157594A1 true WO2016157594A1 (fr) 2016-10-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047590A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 導電フィルム及び接続構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235060A (ja) * 2001-11-05 2002-08-23 Sony Chem Corp 異方性導電膜
JP2006096896A (ja) * 2004-09-30 2006-04-13 Sumitomo Electric Ind Ltd 異方導電性接着剤の製造方法、異方導電性接着剤及び異方導電膜
WO2007125650A1 (fr) * 2006-04-27 2007-11-08 Sumitomo Bakelite Co., Ltd. Bande adhesive, paquet semiconducteur et dispositif electronique
WO2008023452A1 (fr) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Bande adhésive, structure de jonction, et ensemble semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235060A (ja) * 2001-11-05 2002-08-23 Sony Chem Corp 異方性導電膜
JP2006096896A (ja) * 2004-09-30 2006-04-13 Sumitomo Electric Ind Ltd 異方導電性接着剤の製造方法、異方導電性接着剤及び異方導電膜
WO2007125650A1 (fr) * 2006-04-27 2007-11-08 Sumitomo Bakelite Co., Ltd. Bande adhesive, paquet semiconducteur et dispositif electronique
WO2008023452A1 (fr) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Bande adhésive, structure de jonction, et ensemble semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047590A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 導電フィルム及び接続構造体

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